WO1997017745A1

WO1997017745A1 - Structure of ic socket

Info

Publication number: WO1997017745A1
Application number: PCT/JP1995/002278
Authority: WO
Inventors: Shigeru Matsumura
Original assignee: Advantest Corporation
Priority date: 1994-06-02
Filing date: 1995-11-08
Publication date: 1997-05-15

Abstract

A versatile IC socket having a split contact block structure such that a contact block including a defective pin can be changed. The IC socket is adapted to a wide variety of DUTs, and has a block housing (20) in which a plurality of block grooves (22) for mounting contact blocks (30) are made, and contact blocks with contact pins (32) at the same pitches as those of the device (50) to which the IC socket is pluged.

Description

Specification

IC socket structure Technical field

The present invention relates to a structure of an IC socket in which a multi-pin BGA (Ball grid array) package type device or the like is repeatedly attached and detached in a semiconductor test equipment. Background art

The BGA package is an IC package in which the lead wire of the device (DUT) 50 is a terminal of a hemispherical solder ball. The number of pins is from 100 to 300 pins, and the pin spacing is 1.27 mm, 1. Omm, etc.

In the IC test equipment, the DUT 50 is subjected to various electrical tests to perform a characteristic measurement pass / fail inspection. For this reason, the DUT 50 is mounted on an IC socket to perform an electrical test, and is removed from the IC socket after the test. In the IC test apparatus, in order to inspect a large number of DUTs 50, the IC socket is frequently attached and detached. For this reason, the contact between the DUT 50 and the terminal of the IC socket gradually causes poor contact and the contact pressure decreases, resulting in unstable contact.

An example of the structure of the contact part of the IC socket used for inspection of the BGA package type device of the prior art is described below with reference to FIGS. 3 and 4. FIG.

The configuration of the test head portion includes a device holding mechanism 68 shown in FIG. 3, an IC socket, and a contact board 70 shown in FIG. The IC socket includes a socket housing 62 and a plurality of contact bins 64. The IC socket is mounted on a contact port 70, and the DUT 50 is pressed from above by a pressing mechanism to provide electrical contact.

The contact pin 64 is a panel-shaped pin, and the upper terminal of this pin is electrically connected to the DUT pin 51 by pressure contact with the hemispherical surface of the solder bump.铳 is formed, and the lower terminal portion of the contact pin 64 forms a compressive connection with the terminal pattern 72 on the surface of the contact board 70 by pressurized contact. Alternatively, the terminal pattern 72 may be formed by a through hole, and the contact board 70 and the lower terminal of the contact pin 64 may be electrically connected by soldering.

The contact pin 64 as a whole has a central portion curved in a U-shape, and has a spring property for maintaining the upper and lower electrical contact pressures or the upper electrical contact pressure.

The contact pin 64 is formed integrally with the socket housing 62. Each of these pins is arranged in a grid at a position corresponding to each pin 51 of the DUT, and makes contact with the corresponding terminal pattern 72 immediately below each pin to form an electrical connection and form a contact board. Connected from the lower part of the device 70 to the device test equipment 80 side.

Alternatively, an electrical connection is formed by soldering with a through hole corresponding directly below each pin 64 and connected from the lower part of the contact board 70 to the device test apparatus 80 side.

The device holding mechanism 68 ensures that all contact bins 64 of the DUT mounted on the IC socket are in contact with each other, and has a holding mechanism by hand or air pressure from above the DUT. I have. This holding pressure is used to ensure that all pins of the hemispherical terminal of pin 51 are in contact with each other. Pressing with strong pressing force. As a result, the spring force of the IC socket is likely to be reduced. For this reason, pins that cause poor contact or contact instability appear in the connection bin 64. IC sockets in this state will be replaced immediately. It is also a consumable because it may be replaced a certain number of times or every time it is used.

As described above, the IC socket that electrically tests the DUT 50 with the IC test equipment is repeatedly attached and detached, so even a single contact pin 64 may cause poor contact or unstable contact. If there were any pins, the entire expensive IC socket had to be replaced.

Also, if the connection is made by soldering, it is necessary to remove the soldering and replace it again in order to replace the IC socket, which is very costly.

Further, since the number, arrangement and pitch of pins of the DUT 50 are various, it is necessary to prepare an IC socket corresponding to this, and there is a disadvantage that there is no versatility.

The problem to be solved by the present invention is to provide a structure in which an IC socket is divided so that defective pins can be replaced in contact block units, and can be used for a wide variety of DUTs. The purpose is to have a versatile IC socket structure. Disclosure of the invention

FIG. 1 shows a first solution according to the present invention.

In order to solve the above-mentioned problem, in the configuration of the present invention, a contact block

A block housing 20 having a plurality of block grooves 22 for mounting 30 is provided, and a plurality of contact bins 3 2 corresponding to the pitch of the device 50 are provided. Are arranged in a row and a contact block 30 is provided. It is a means of implementation.

As a result, the contact block 30 is divided and has a removable structure, so that a structure in which only the defective contact block 30 can be easily replaced can be realized.

1 and 2 show a second solution according to the present invention.

In order to solve the above-mentioned problems, in the configuration of the present invention, a block housing 20 having a plurality of block grooves 22 for mounting a contact block 30b is provided, and a rubber-like elastic body is provided. A contact block 3 Ob is formed by winding a compress film 38 having a narrow pitch parallel conductor pattern formed on the surface of a core material 36 as a contact board 70. This is a means of electrical connection to the connection electronics pad formed above by pressurized contact.

As a result, the contact block 30b is divided and not easily soldered, so that it can be easily removed, so that only the defective contact block 30b can be removed. The structure is such that it can be easily replaced and the same contact block 3 Ob can be used regardless of the DUT 50 pin-to-pin pitch.

In addition, a package holder 10 is provided in the block housing 20 for positioning and guiding the pin 51 of the device 50 to a position directly below the contact bin 32 of the contact block 30. There are configuration means.

No ,. The package holder 10 and the block housing 20 are separated to provide a support structure to guide the DUT 50, so that only the package holder 10 side corresponds to the external dimensions of the DUT 50. In this case, the block housing 20 is shared.

The package holder 10 with the split structure has the same pin count and pin arrangement, but the device outline may differ depending on the product type and the manufacturer, even if the pin interval is the same. Other parts are common Has a role that can be used.

The block housing 20 having the divided structure has a role of being able to be replaced in units of the contact block 30 in the event of poor contact or unstable contact of the contact bin 32.

The contact block 30 having the divided structure has an effect that can be commonly used if the number of pins in a row is equal to or less than DUT 50.

By combining the package holder 10 divided into three, the block housing 20 and the connector block 30, various package outlines / pin counts of the DUT 50 Z pins Row pins It has a highly versatile IC socket structure that can easily handle intervals.

In the case of the contact block 30b using a conductive elastomer, the same contact block 30b can be used regardless of the pitch of the DUT 50, so that a highly versatile contact block is used. It can be made into a lock structure.

In addition, since the electrode pads on the contact board are pressurized, replacement work can be performed in a very short time compared to solder connection. BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 is a structural view of an IC socket according to the present invention, which is divided into three parts: a knock holder 10, a block housing 20, and a contact block 30.

FIG. 2 is a structural diagram of a contact block 3 Ob when the compressive elastomer of the present invention is used.

Figure 3 is an overview of the BGA package and the IC socket used for conventional device inspection.

FIG. 4 is an example of a conventional IC socket when a panel panel is used as a pin, and a cross-sectional structure diagram of a connector board 70. BEST MODE FOR CARRYING OUT THE INVENTION

A first embodiment of the present invention will be described with reference to the drawings.

The first embodiment according to the present invention is a structural example in which a leaf spring is used for a pin. This will be described with reference to FIG.

The configuration of the IC socket is: It is configured to be divided into a package holder 10, a block housing 20, and a contact block 30.

No. The package holder 10 has a guide structure for correctly positioning the DUT directly above the corresponding contact bin 32, and the guide is formed by a square package guide 14. The external shape of the device may differ depending on the product type or manufacturer, even if the number of pins is the same, the number of pins is E, and the distance between pins is Z. For this reason, a split structure is adopted to accommodate these different external shapes.

The housing mounting hole 12 of this package holder 10 is inserted by inserting the block housing 20 from below, sandwiched by the contact board 70, and then screwed at the four corners. The structure is fixed by pressing.

The block housing 20 includes a plurality of block grooves 22, a boss 24, and a block retainer 26. The block groove 22 is a groove for mounting the contact block 30. The number of block grooves, the groove length, and the arrangement pitch of the plurality of block grooves 22 are N rows of blocks corresponding to the number of pins N in the X direction for each type of DUT 50. The number of grooves, the groove length corresponding to the number M of pins in the y direction, and the pitch P of the block groove 22 corresponding to the pin interval are formed.

The boss 24 is a protruding surface for positioning the height when the DUT is pressed from above, and functions as a DUT stopper. In the figure, there are four rectangular parallelepipeds, but in addition, a cylindrical or triangular prism may be provided at multiple places. As a result, excessive pressing force is applied to the contact pin 32 side. To prevent deformation. The block retainer 26 is a side for holding the package holder 10 when it is mounted and fixed.

The contact block 30 is a structure in which a plurality of contact pins 32 are arranged and accommodated in one row. Each contact pin 32 is a flat plate-like pin as in the past, and is integrated with the contact block 30 and has M or more pins corresponding to the number M of pins in the y direction. Contact bins 32 are installed with the corresponding pin spacing.

By adopting the three-segment structure as described above, a versatile combination of IC sockets as shown in the following example can be realized. As a first example, there is a DUT (A) with N = 15 rows and M = 8 pins with 120 pins, and a DUT with N = 15 rows and M = 12 pins with 180 pins. Suppose there is (B). The block housing 20 common to these two types of DUTs uses a block housing 22 with a block groove 22 corresponding to 12 pins with N = 15 rows and a contact block. For 30, use 15 pins with 12 pins. After that, it is sufficient to separately prepare package holders 10 corresponding to the two types of DUT outer shapes. That is, in this example, the block housing 20 and the contact block 30 can be used as completely common components.

As a second example, an example is shown in which both the N column and the M pin are different. For example, there is a DUT (A) of pin 120 with M = 8 pins in N = 15 rows, and a DUT (D) of pin 220 with M = 12 pins in N = 20 rows. The block housing 20 common to these two types of DUTs is an N-20 row, using the block housing 20 of the block groove 22 corresponding to the 12 pin, and For the block block 30, use 20 pins with 12 pins. After that, it is sufficient to separately prepare package holders 10 corresponding to the two types of DUTs. As described above, in most cases, if the DUT has the same pitch, the block housing 20 and the contact block 30 can be shared. It indicates that it is possible. A second embodiment of the present invention will be described with reference to the drawings.

The second embodiment according to the present invention is an example in which the structure of a contact pin used in the contact block 30 is a contact block 30b using a conductive elastomer (Elastomer). is there. This will be described with reference to FIG.

No ,. The structures of the package holder 10 and the block housing 20 are the same as in the first embodiment.

The contact block 30 b has a conductive elastomer structure, and is composed of a core material 36 and a conductive film 38.

The core material 36 is a columnar rubber-like elastic body. The Diao Xiao film 38 is a thin flexible polyimide film wound around the core material 36 so as to make one round, and a number of narrow pitch parallel films are wound on the surface of this film. The gold pattern treated copper pattern forms the core material 36 in an annular shape. This is installed in the block groove 22 of the block housing 20 shown in FIG. At this time, the block housing 20 uses a structure made of an insulating material such as resin so that the contact of the contact block 3 Ob does not short-circuit. Here, the contact is an annular conductive pattern that makes compressive contact.

Examples of the dimensions of the contact 39, which is an individual annular pattern, are, for example, a conductor width of 0.08 mm, the pitch between the contacts is 0.18 mm, Form parallel E rows.

Since a large number of contacts 39 are formed with a narrow pitch in this way, it is possible to use the same contact block 30b regardless of the pitch between pins on the DUT 50 side. Become. In other words, even if the pitch of the pin 51 and the pitch of the contact 39 are different, there are a plurality of contacts 39 immediately below the pin 51, Any one or more of the contacts 39 will surely contact the pins of the DUT 50.

In the first and second embodiments, the DUT 50 has the pin shape of the pin 51 or the pin array in which the E row is arranged in a lattice shape. This can be applied in the same way.

By forming the narrow pitch contact 39 described above, the contact block 30b can be made common to DUTs of different pitches. For example, assuming that M = 20 pins for a DUT (E) with a device pitch of 1-27 mm and a DUT (F) of 1.0 mm, the DUT ( E) Use a contact block 3 Ob of 1.27 mm x 20 = 25.4 mm according to the side. On the DUT (F) side, the extra parts need not be used.

As can be seen from this example, the contact block 30b can be used for all DUTs 50 by preparing one type corresponding to the maximum number of pins of the DUT 50. It indicates that it can be shared. Industrial applicability

Since each embodiment according to the present invention is configured as described above, the following effects can be obtained.

By making the contact block 30 detachable, if a contact failure or instability of the contact bin 32 at one place occurs, one contact Only the contact block 30 needs to be replaced, which eliminates the need to replace the entire expensive IC socket, and has the advantage of reducing the cost of replacement parts.

In addition, by using an IC socket with a three-segment structure, each component can be combined to minimize the variety of DUT pins and external shapes. There is an advantage that the configuration can cope with. For example, if the pin spacing is the same, the pin number can be dealt with by exchanging only the package holder 10 corresponding to the knocker outer shape. In addition, even when the number M of pins in the y direction is different, the block housing 20 and the contact block 30 can be used as they are. In addition to this, even when the number of pins N in the X direction is different, it can be dealt with by replacing only the package holder 10. In this way, common use of components is possible, and a versatile IC socket structure can be used, and there is no need to prepare IC sockets individually for each product type, expanding the applicable range. There is a big advantage. At the same time, the number of varieties in the stock of IC sockets can be greatly reduced.

In the case of a contact block 3 Ob using a conductive elastomer, the contact structure in which the film is wound on one core material 36 has a uniform height without any variation. There is the advantage that a contact is formed. As a result, there is no step when the DUT 50 is contacted, and an advantage that a stable contact can be realized by applying the same contact pressure is obtained. Also, since many contacts are formed with narrow pitches, the same contact block 30b can be used regardless of the pitch between pins of the solder bump of the DUT 5 There is. In addition, since the structure is simple, it can be manufactured at low cost and the cost of parts can be reduced.

In addition, since it is pressurized and connected to the electrode pads on the contact board, replacement work costs can be greatly reduced.

Claims

The scope of the claims

1. In the structure of the IC socket for performing various electrical tests by repeatedly attaching and detaching the device under test (50),

A block housing (20) having a plurality of block grooves (22) for mounting a contact block (30) is provided.

A contact block (30) that accommodates a plurality of contact pins (32) arranged in a row in a pitch corresponding to the pitch of the device (50) is provided. IC socket structure characterized by being equipped.

2. In the structure of the IC socket for performing various electrical tests by repeatedly attaching and detaching the device under test (50),

A contact block (30b) in which a conductive film (38) in which a narrow-pitch parallel conductor pattern is formed on the surface of a rubber-like elastic core material (36) is wound. )

A block housing (20) having a plurality of block grooves (22) for mounting a contact block (30b) is provided.

An IC socket structure characterized by having the above.

3. In the IC socket structure described in claim 1 or claim 2,

A package holder (10) for positioning and guiding the pin (51) of the device (50) directly below the contact pin (32) in the contact block (30) is provided. IC socket structure characterized by