CN1916643A - Device for testing integrated electric apparatus - Google Patents
Device for testing integrated electric apparatus Download PDFInfo
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- CN1916643A CN1916643A CN 200510036732 CN200510036732A CN1916643A CN 1916643 A CN1916643 A CN 1916643A CN 200510036732 CN200510036732 CN 200510036732 CN 200510036732 A CN200510036732 A CN 200510036732A CN 1916643 A CN1916643 A CN 1916643A
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Abstract
A test device of integrated circuit is prepared as setting conductive conversion unit connected with test circuit under probe positioning plate, electric-connecting tail of each probe to conductive conversion unit by passing said tail through integrated circuit space plate and probe positioning plate as both being set with through holes on them for passing through said tail, setting center distance between said through holes to be as the same with foot distance between centers of lead pins on integrated circuit to be tested and setting said foot distance to be 0.4mm-0.95mm.
Description
Technical field the present invention relates to the electric performance test or the fault-location instrument of semiconductor devices, particularly relates to the device that is used for testing integrated circuits.
Background technology is along with SMT (Surface Mount Technology, surface mounting technology) development, (Ball Grid Array is called for short BGA to SIC (semiconductor integrated circuit) (being called for short IC) particularly to adopt ball grid array, the arrangement mode of i.e. Feng Zhuan I/O (I/O) pin is a grid array, the pin end is the tin ball) the BGA integrated circuit of encapsulation technology is towards high density, little spacing direction development, I/O (I/O) pin of encapsulation is from tens, be increased to the hundreds of root gradually, may reach 2,000 in the near future, the frequency that is suitable for is more and more higher, and is also more and more higher to the requirement of its test.Existing paster packaging and testing technology generally has two kinds: a kind of is to be electrically connected with test PCB printed circuit board pads with the probe of double end spring is direct, this form has the following disadvantages: the easy oxidation of soldering dish in use, poor electric conductivity, the double ended probes cost height of Cai Yonging in addition; Another kind is earlier to weld terminal on test PCB, then probe is inserted in the terminal, but this structure only is suitable between pin pin apart from the BGA IC test greater than 1.0mm.
The summary of the invention the technical problem to be solved in the present invention be to avoid above-mentioned the deficiencies in the prior art part and propose a kind of can testing conductive point between pin apart from proving installation at the integrated circuit of 0.4mm to 0.95mm, this device can be avoided testing circuit board that is test conductiving point oxidation on the PCB.
The present invention solve the technical problem can be by realizing by the following technical solutions:
Design, use a kind of arrangement for testing integrated circuit, comprise probe location-plate, to-be-measured integrated circuit limiting plate and probe, the conduction conversion equipment is arranged below the described probe location-plate, described conduction conversion equipment and testing circuit board are fixing to be electrically connected; The tail end of described each probe passes through described integrated circuit limiting plate and the probe location-plate is electrically connected with described conduction conversion equipment; Each through hole that passes through for described probe is arranged on described probe location-plate and the integrated circuit limiting plate, between described each through hole pin apart from each conductive pin of described to-be-measured integrated circuit between pin apart from identical, and described pin is apart between 0.4mm to 0.95mm.
Compare with prior art, technique effect of the present invention is: increased the conduction conversion equipment, probe directly and the testing circuit board electrical connection has not been avoided the pad oxidation on the testing circuit board during test, thus testing circuit board conduct electricity very well the measuring accuracy height; The testing requirement that can adapt to high density, closely spaced integrated circuit; The replacing probe is easy, and is easy to maintenance; Production cost is low, long service life.
Description of drawings
Fig. 1 is the structural representation of first embodiment of arrangement for testing integrated circuit of the present invention;
Fig. 2 is the structural representation of second embodiment of described proving installation;
Fig. 3 is the A portion enlarged diagram of Fig. 2;
Fig. 4 is the structural representation of the 3rd embodiment of described proving installation;
Fig. 5 is the structural representation of the 4th embodiment of described proving installation;
Fig. 6 is the structural representation of the 5th embodiment of described proving installation;
Fig. 7 is the structural representation of the 6th embodiment of described proving installation;
Fig. 8 is the structural representation of first kind of form of the terminal of described proving installation;
Fig. 9 is the structural representation of second kind of form of the terminal of described proving installation;
Figure 10 is the location structure synoptic diagram of the to-be-measured integrated circuit of described proving installation.
Embodiment is described in further detail below in conjunction with the most preferred embodiment shown in the accompanying drawing.
Arrangement for testing integrated circuit of the present invention, extremely shown in Figure 10 as Fig. 1, comprise probe location-plate 2 and probe 7, to-be-measured integrated circuit 10 is by the posting on the to-be-measured integrated circuit limiting plate 3 or each through hole location of passing through for probe 7 (the tin ball on the BGA IC falls in the hole of integrated circuit limiting plate and locatees automatically), conduction conversion equipment 5 is arranged below the described probe location-plate 2, and described conduction conversion equipment 5 and testing circuit board 9 are electrically connected; The tail end of described each probe 7 passes through described integrated circuit limiting plate 3 and probe location-plate 2 is electrically connected with described conduction conversion equipment 5; Each through hole that passes through for described probe 7 is arranged on described probe location-plate 2 and the integrated circuit limiting plate 3, and the pin between described each through hole between each conductive pin center of centre distance and described to-be-measured integrated circuit is apart from identical, and described pin is apart between 0.4mm to 0.95mm.
Arrangement for testing integrated circuit embodiment one of the present invention comprises probe location-plate 2 and probe 7 as shown in Figure 1, and to-be-measured integrated circuit 10 is by 31 location of the posting on the to-be-measured integrated circuit limiting plate 3.Conduction conversion equipment 5 is arranged below the described probe location-plate 2, and described conduction conversion equipment 5 comprises terminal position plate 51 and the terminal 52 adaptive with described each probe 7.Described terminal 52 afterbodys are solid, and head is hollow; Described each terminal 52 passes through described terminal position plate 51, and described each probe 7 inserts the head end of each terminal 52 respectively, and described each terminal 52 tail end and described testing circuit board 9 are fixing.
The described terminal 52 of present embodiment can have two kinds of structures, first kind of structure as shown in Figure 8, terminal 52 afterbodys are solid, and head is hollow, and are useful on snap ring that caves inward 521 or the described terminal 52 head inwalls of clamping probe 7 and are provided with the salient point (not shown) in the middle of the head.Second kind of structure as shown in Figure 9, same afterbody is solid, head is hollow, the endoporus 522 of this head is up big and down small taper hole, this taper hole is in order to hold and to clamp probe 7.The terminal of two kinds of forms of the present invention is compared with terminal of the prior art, and external diameter can be done enough for a short time of to adapt to pin between the conductiving point apart from the test less than the integrated circuit that is used for paster technique (10) of 0.95mm.
As shown in Figure 1, described probe location-plate 2 is by bolt and spring and 3 flexible connections of described to-be-measured integrated circuit limiting plate.Make described to-be-measured integrated circuit limiting plate 3 when being unkitted to-be-measured integrated circuit 10, probe can not given prominence to the upper surface of the locating slot 31 of this limiting plate 3, is convenient to taking and putting measured integrated circuit 10 like this.
Described to-be-measured integrated circuit 10 be positioned with dual mode, wherein as shown in Figure 1 a kind of, to-be-measured integrated circuit 10 is put into posting 31 location on the described to-be-measured integrated circuit limiting plate 3; Another kind embeds the tin sweat(ing) on the to-be-measured integrated circuit 10 in the through hole that passes through for probe 7 on described to-be-measured integrated circuit limiting plate 3 or the probe location-plate 2 and to locate as shown in figure 10.
During assembling, earlier terminal 52 is fixed on the terminal position plate 51, then terminal 52 is welded on the described testing circuit board 9 and (also can weld), will be set on the terminal position plate 51 with described to-be-measured integrated circuit limiting plate 3 these assemblies by the probe location-plate 2 that bolt is connected with spring again.Described to-be-measured integrated circuit 10 is put into described to-be-measured integrated circuit limiting plate 3, compress to-be-measured integrated circuit 10 by top hold-down mechanism (not shown), the conductive welding disk of these to-be-measured integrated circuit 10 bottoms connects one to one by the pad on probe 7 and terminal 52 and the described testing circuit board 9, just can test this integrated circuit 10.Because probe 7 is to insert in the endoporus of terminal 52, rather than is welded direct on the described testing circuit board 9, when probe need be changed, needn't sealing-off, need only transfer to needs the probe changed just passable.Probe 7 is changed easily, and is easy to maintenance, saved production time and cost, improved the serviceable life of proving installation.In addition, the used probe of the present invention is the single head probe, and promptly probe has only a headband spring, and its cost is 1/10 to 1/50 of a double ended probes, has reduced production cost to a great extent.
The pin of the to-be-measured integrated circuit 10 that present embodiment is tested is apart from accomplishing 0.65mm even littler at least.
The embodiment of the invention two as shown in Figure 2, structure is substantially identical with embodiment one, described conduction conversion equipment 5 comprises terminal position plate 51 and the terminal 52 adaptive with described each probe 7 equally, described each terminal 52 passes through described terminal position plate 51.Different with embodiment one is: described terminal 52 is for solid, and described each probe 7 withstands the head of each terminal 52 respectively, sees Fig. 3.Because described terminal 52 is solid, its external diameter can be made onesize with probe 7, so pin be apart from can accomplishing 0.4mm between each through hole on present embodiment middle probe location-plate 2 and the integrated circuit limiting plate 3, can testing conductive point between the pin distance be the integrated circuit that is used for paster technique 10 of 0.40mm.
The embodiment of the invention three comprises probe location-plate 2, probe 7 and conduction conversion equipment 5 as shown in Figure 4 equally, and to-be-measured integrated circuit 10 is located by the posting on the to-be-measured integrated circuit limiting plate 3 or for each through hole that probe 7 passes through.Described conduction conversion equipment 5 comprises the first terminal location-plate 53 and the second terminal position plate 54, each terminal 52 (2) tail end that passes through described the first terminal location-plate 53 are electrically connected with described testing circuit board 9, and head is electrically connected with terminal 52 (1) tail ends that pass through the described second terminal position plate 54; Described each probe 7 is pegged graft with described terminal 52 (1) head ends that pass through the second terminal position plate 54.Identical among the structure of described terminal 52 and the embodiment one.Probe location-plate 2, to-be-measured integrated circuit limiting plate 3 and the second terminal position plate 54 are connected to become a stand-alone assembly.After the first terminal location-plate 53 was fixed with described testing circuit board 9, described stand-alone assembly was done as a whole and described the first terminal location-plate 53 sockets.The present invention assembles easily, and described stand-alone assembly can be used as stand-alone product and sells, and is widely used.
Identical among terminal structure described in the present embodiment and the embodiment one, the pin of the to-be-measured integrated circuit 10 of being tested is apart from accomplishing 0.65mm even littler equally.
The embodiment of the invention four comprises probe location-plate 2, to-be-measured integrated circuit limiting plate 3 equally with embodiment one as shown in Figure 5
With probe 7, to-be-measured integrated circuit 10 is by 31 location of the posting on the to-be-measured integrated circuit limiting plate 3; Described conduction conversion equipment 5 comprises terminal position plate 51 and the terminal 52 adaptive with described each probe 7 equally.Different with embodiment one is, also comprises pressing plate 1, pressing plate fixation spring tab 6 and shell fragment fixed head 8, by bolt that described shell fragment fixed head 8 and described pressing plate fixation spring tab 6 is fixing with terminal position plate 51; There is pilot hole 61 described pressing plate fixation spring tab 6 both sides, and there is the register pin 11 adaptive with described pilot hole 61 described pressing plate 1 both sides.Terminal position plate 51 is welded on the described testing circuit board 9.Identical among described terminal structure and the embodiment one.
Load onto pressing plate fixation spring tab 6, tighting a bolt makes shell fragment fixed head 8 clamping platen fixation spring tabs 6, and probe 7 passes to-be-measured integrated circuit limiting plate 3, probe location-plate 2, inserts the endoporus of terminal 52 heads.Described to-be-measured integrated circuit limiting plate 3, probe location-plate 2 are connected with register pin by spring.Clamping platen 1, each conductiving point of to-be-measured integrated circuit 10 just can be electrically connected with pad on the described testing circuit board 9 by probe 7 and terminal 52, and then to integrated circuit 10 tests.
During use, the to-be-measured integrated circuit 10 of packing into is pressed pressing plate 1 with have gentle hands, and pressing plate fixation spring tab 6 opens, and the register pin 11 of pressing plate 1 both sides is inserted in the pilot hole 61 of pressing plate fixation spring tab 6, and pressing plate 1 is fixing.When taking off to-be-measured integrated circuit 10, need only break pressing plate fixation spring tab 6 gently into two with one's hands, just can take off pressing plate 1, take out the integrated circuit 10 that test finishes at last.
Compare with the foregoing description, the profile of present embodiment can be done forr a short time.
The embodiment of the invention five as shown in Figure 6, basic structure is identical with embodiment four, comprises pressing plate 1, pressing plate fixation spring tab 6 and shell fragment fixed head 8 equally, by bolt described shell fragment fixed head 8 and described pressing plate fixation spring tab 6 and described conduction conversion equipment is fixed; There is pilot hole 61 described pressing plate fixation spring tab 6 both sides, and there is the register pin 11 adaptive with described pilot hole 61 described pressing plate 1 both sides.Different with embodiment four is that described conduction conversion equipment 5 comprises the first terminal location-plate 58 and the second terminal position plate 59.Each solid terminal 56 tail end that passes through described the first terminal location-plate 58 are electrically connected or weld with described testing circuit board 9, and head end is electrically connected with hollow terminal 52 tail ends that pass through the described second terminal position plate 59; Described each probe 7 is pegged graft with described hollow terminal 52 head ends that pass through the second terminal position plate 59.
During assembling, each solid terminal 56 is welded on the described testing circuit board 9, the stand-alone assembly that constitutes by screw etc. by probe limiting plate 2, to-be-measured integrated circuit limiting plate 3, the second terminal position plate 59, shell fragment fixed head 8 and pressing plate fixation spring tab 6, and the hollow terminal 52 of this stand-alone assembly is entangled the solid terminal 56 of described the first terminal location-plate 58.Described individual components can be used as an independent production and sale, and assembling is widely used easily.
The embodiment of the invention six comprises probe location-plate 2, to-be-measured integrated circuit limiting plate 3 and conduction conversion equipment 5 as shown in Figure 7 successively, and to-be-measured integrated circuit 10 is by 31 location of the posting on the to-be-measured integrated circuit limiting plate 3.Structure and the embodiment more than 5 is identical for described conduction conversion equipment.Different is that described conduction conversion equipment 5 is P.e.c. web joints of the two-sided pad of via hole conducting, this P.e.c. web joint and 9 welding of described testing circuit board.Probe 7 and this P.e.c. web joint be because of contact friction in order further to prevent to test, and cause the pad oxidation on the P.e.c. web joint, and the welding by both sides panel surface of described P.e.c. web joint can be gold-plated.
During test, the tail end of described each probe 7 is electrically connected with described testing circuit board 9 by each conductiving point on the described P.e.c. web joint 5.
Present embodiment has adopted the P.e.c. web joint 5 of two-sided pad via hole conducting, the pin distance can be accomplished 0.5mm even littler between the described probe location-plate 2 that the described probe 7 of confession passes through and each through hole on the integrated circuit limiting plate 3, thereby the pin distance that can test between each conductiving point center is 0.5mm even littler integrated circuit 10.Present embodiment is without terminal, and cost is lower than embodiment one cost; It is easy to change probe, easy to maintenance.Broken as a certain probe, only needed to change that bad probe, whole test structure need not be scrapped, and has improved serviceable life greatly; In addition, the used probe of the present invention is the single head probe, and promptly probe has only a headband spring, and its cost is 1/10 to 1/50 of a double ended probes, has reduced production cost to a great extent.
Claims (10)
1. arrangement for testing integrated circuit, comprise each through hole location on the integrated limiting plate described to be measured (3) that probe location-plate (2) and probe (7), to-be-measured integrated circuit (10) pass through by the posting on the to-be-measured integrated circuit limiting plate (3) or for probe (7), it is characterized in that:
Conduction conversion equipment (5) is arranged below the described probe location-plate (2), and described conduction conversion equipment (5) and testing circuit board (9) are electrically connected; The afterbody of described each probe (7) passes through described integrated circuit limiting plate (3) and probe location-plate (2) is electrically connected with described conduction conversion equipment (5); Each through hole that passes through for described probe (7) is arranged on described probe location-plate (2) and the integrated circuit limiting plate (3), pin between centre distance between described each through hole and each pin center of described to-be-measured integrated circuit (10) is apart from identical, and described pin is apart between 0.4mm to 0.95mm.
2. arrangement for testing integrated circuit as claimed in claim 1, it is characterized in that: described conduction conversion equipment (5) comprises terminal position plate (51) and this location-plate (51) is last and the adaptive terminal (52) of described each probe (7), described each terminal (52) afterbody is solid, and head is hollow; Described each terminal (52) passes through described terminal position plate (51), and the bottom of described each probe (7) is inserted the head of each terminal (52) respectively, and described each terminal (52) tail end and described testing circuit board (9) are fixing.
3. arrangement for testing integrated circuit as claimed in claim 2 is characterized in that: have the snap ring (521) or described terminal (52) the head inwall that cave inward to be provided with salient point in the middle of described terminal (52) head.
4. arrangement for testing integrated circuit as claimed in claim 2 is characterized in that: the head endoporus (522) of described each terminal (52) is up big and down small taper hole.
5. arrangement for testing integrated circuit as claimed in claim 1, it is characterized in that: described conduction conversion equipment (5) comprises terminal position plate (51) and the terminal (52) adaptive with described each probe (7), described each terminal (52) passes through described terminal position plate (51), described terminal (52) is solid, described each probe (7) withstands the head of each terminal (52) respectively, and described each terminal (52) tail end is electrically connected with described testing circuit board (9).
6. arrangement for testing integrated circuit as claimed in claim 1, it is characterized in that: described conduction conversion equipment (5) comprises the first terminal location-plate (53) and the second terminal position plate (54), each terminal (52) tail end that passes through described the first terminal location-plate (53) is electrically connected with described testing circuit board (9), and head is electrically connected with terminal (52) tail end that passes through the described second terminal position plate (54); Described each probe (7) is pegged graft with described terminal (52) head that passes through the second terminal position plate (54).
7. as claim 2 or 5 described arrangement for testing integrated circuit, it is characterized in that: described probe location-plate (2) is by bolt and spring and described to-be-measured integrated circuit limiting plate (3) flexible connection.
8. arrangement for testing integrated circuit as claimed in claim 2, it is characterized in that: also comprise pressing plate (1), pressing plate fixation spring tab (6) and shell fragment fixed head (8), by bolt that described shell fragment fixed head (8) and described pressing plate fixation spring tab (6) is fixing with terminal position plate (51); There is pilot hole (61) described pressing plate fixation spring tab (6) both sides, and there is the register pin (11) adaptive with described pilot hole (61) described pressing plate (1) both sides.
9. arrangement for testing integrated circuit as claimed in claim 1, it is characterized in that: also comprise pressing plate (1), pressing plate fixation spring tab (6) and shell fragment fixed head (8), by bolt that described shell fragment fixed head (8) and described pressing plate fixation spring tab (6) is fixing with described conduction conversion equipment (5); There is pilot hole (61) described pressing plate fixation spring tab (6) both sides, and there is the register pin (11) adaptive with described pilot hole (61) described pressing plate (1) both sides;
Described conduction conversion equipment (5) comprises the first terminal location-plate (58) and the second terminal position plate (59), each solid terminal (56) tail end and the described testing circuit board (9) that pass through described the first terminal location-plate (58) are fixing, and head is electrically connected with hollow terminal (52) tail end that passes through the described second terminal position plate (59); Described each probe (7) is pegged graft with described hollow terminal (52) head that passes through the second terminal position plate (59).
10. arrangement for testing integrated circuit as claimed in claim 1 is characterized in that: described conduction conversion equipment (5) is the P.e.c. web joint, and described each probe (7) is electrically connected with each conductiving point on the described P.e.c. web joint (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510036732 CN1916643A (en) | 2005-08-17 | 2005-08-17 | Device for testing integrated electric apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510036732 CN1916643A (en) | 2005-08-17 | 2005-08-17 | Device for testing integrated electric apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1916643A true CN1916643A (en) | 2007-02-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510036732 Pending CN1916643A (en) | 2005-08-17 | 2005-08-17 | Device for testing integrated electric apparatus |
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|---|---|
| CN (1) | CN1916643A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106526449A (en) * | 2016-10-26 | 2017-03-22 | 华为技术有限公司 | Chip test board and chip test method |
| CN106841999A (en) * | 2017-03-24 | 2017-06-13 | 深圳市斯纳达科技有限公司 | Arrangement for testing integrated circuit and its test probe |
| WO2019075663A1 (en) * | 2017-10-18 | 2019-04-25 | 深圳市柔宇科技有限公司 | Electrical connection device and test machine |
| CN110865295A (en) * | 2019-10-30 | 2020-03-06 | 武汉光庭信息技术股份有限公司 | Onboard IC pin signal test fixture |
-
2005
- 2005-08-17 CN CN 200510036732 patent/CN1916643A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106526449A (en) * | 2016-10-26 | 2017-03-22 | 华为技术有限公司 | Chip test board and chip test method |
| CN106526449B (en) * | 2016-10-26 | 2019-02-12 | 华为技术有限公司 | Chip test board and chip test method |
| CN106841999A (en) * | 2017-03-24 | 2017-06-13 | 深圳市斯纳达科技有限公司 | Arrangement for testing integrated circuit and its test probe |
| WO2019075663A1 (en) * | 2017-10-18 | 2019-04-25 | 深圳市柔宇科技有限公司 | Electrical connection device and test machine |
| CN110865295A (en) * | 2019-10-30 | 2020-03-06 | 武汉光庭信息技术股份有限公司 | Onboard IC pin signal test fixture |
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Open date: 20070221 |