JPS59165442A - Contact mechanism in socket of integrated circuit - Google Patents
Contact mechanism in socket of integrated circuitInfo
- Publication number
- JPS59165442A JPS59165442A JP3944383A JP3944383A JPS59165442A JP S59165442 A JPS59165442 A JP S59165442A JP 3944383 A JP3944383 A JP 3944383A JP 3944383 A JP3944383 A JP 3944383A JP S59165442 A JPS59165442 A JP S59165442A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- lead
- plate
- piece
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts
Abstract
Description
【発明の詳細な説明】
本発明は弾性を有する一枚の板状接触子をICリードの
−I11面側から弾性偏位させてIC’J−ドの対向す
る一側面に接触式せると共に他の二側面へも挟接するよ
うにしたICツク、トの接触機構に関し、ICI)−ト
接触部の薄小化(並設ピッチの縮小)、その加工、構造
の簡素化を果しながら、高信頼の接触をも確保し、併せ
てICIJ−ドの無負荷抜差目的を可能にしたものでら
る。DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method in which a plate-like contactor having elasticity is elastically deflected from the -I11 surface side of an IC lead, and is brought into contact with one opposite side surface of an IC'J-de. Regarding the contact mechanism of the IC connector, which is designed to sandwich the IC connector between the two sides of the It ensures reliable contact and also enables the purpose of no-load insertion/extraction of the ICIJ-board.
図面は上記趣旨に沿い具体化された一実施例を示す。The drawings show an embodiment according to the above-mentioned purpose.
図において、■はソケット形成プロ1.り、2は移動プ
ロ、7り、3はICバ、ケージ全搭載するカバーブロッ
クを示す。In the figure, ■ indicates socket formation professional 1. 2, 7 and 3 indicate the cover block on which the IC bar and cage are all mounted.
上記ソケット形成ブロック1はICリード接触用の板状
接触子4を有する。該板状接触子4はその基部をソケッ
ト形成プロ、りIに圧入固定され、該固定部を支点とし
て板面方向へ弾性偏位可に立上げられ、後述する如<I
CI)−1’7が接触待機状態に置かれた時、その板面
がICリード7の一側と対向する如く配置される。5は
板状接触子4の圧入固定部を示し、6は核圧入固定部5
からプロ、り下方へ突出された雄端子を示す。The socket forming block 1 has a plate-like contactor 4 for contacting an IC lead. The plate-shaped contact 4 has its base portion press-fitted into the socket forming member I, and is raised up so that it can be elastically deflected in the direction of the plate surface using the fixed portion as a fulcrum.
When CI)-1'7 is placed in a contact standby state, its plate surface is arranged to face one side of the IC lead 7. Reference numeral 5 indicates a press-fit fixing part of the plate-shaped contact 4, and 6 indicates a core press-fit fixing part 5.
From above, the male terminal is shown protruding downward.
上記ICリード7と対向する状態に置かれる板状接触子
4の板面にはI C’ IJ 7 ドアの長手方向に延
在するIC’J−ド受入用の溝孔8を開穿する。A slot 8 for receiving an IC'J-dead extending in the longitudinal direction of the IC'IJ7 door is bored in the plate surface of the plate-like contactor 4 placed in a state facing the IC lead 7.
該溝孔8の開穿により分割された該溝孔左右の板状接触
子部分9の溝孔形成壁から該溝孔の巾を狭めるICI)
−ド挟接用の第1接片10と第2接片iiとを突設する
。(ICI) that narrows the width of the slot from the slot forming walls of the plate-like contact portions 9 on the left and right sides of the slot divided by the opening of the slot 8)
- A first contact piece 10 and a second contact piece ii for clamping are provided in a protruding manner.
上記第1接片10と第2接片11とは好ましくは互いに
対向して配置する。The first contact piece 10 and the second contact piece 11 are preferably arranged facing each other.
又上記板状接触子4の先端、即ぢ溝孔8上端の連設片部
にて第3接片12を形成する。該連設片部はIC’J−
ドアから離れる方向に反り曲げ、該反り曲げによって該
連設片部の溝孔形成壁の工。Further, a third contact piece 12 is formed at the tip of the plate-shaped contactor 4, that is, the continuous piece at the upper end of the slot 8. The connecting piece is IC'J-
Bending it in a direction away from the door, and forming a groove in the connecting piece by bending it in a direction away from the door.
ジ13をIC’J−ドと略対向状態とする。The circuit board 13 is brought into a state substantially opposite to the IC'J-board.
更に上記板状接触子4をその腰部がIC’J−ドと反対
側へ向は凸曲となるように腰囲げする。図面は略くの字
形となるように腰囲げした場合全示す。即ち、板状接触
子4の上半身がICIJ−ドア側へ前傾状態となり、同
下半身がIC’J−ドアに対し後傾状態となるように腰
囲げした場合を示す。Further, the plate-shaped contactor 4 is surrounded at the waist so that its waist is curved convexly toward the side opposite to the IC'J-do. The drawing shows the entire structure when it is enclosed at the waist so that it forms a dogleg shape. That is, a case is shown in which the upper body of the plate-shaped contactor 4 is bent forward toward the ICIJ-door, and the lower body is bent backwards toward the IC'J-door.
同腰部げは板状接触子4が湾曲となるようにしても良い
。The waist part may be such that the plate-like contact 4 is curved.
上記第1接片10及び第2接片11は好ましくは該腰囲
げ部14付近に対向して配置する。The first contact piece 10 and the second contact piece 11 are preferably arranged near the waist surrounding portion 14 to face each other.
又前記移動プロ2り2を上記したソヶ・ト形成ブロック
lの上に重ね、これを板状接触子4の配列方向に往復横
移動可とする。15は該往復横移動を案内すべく上記移
動ブロック2から上記移動ブロック2の移動方向と平行
な二側面に添設させて立上げたガイド壁、I6t/″i
、移動ブロック2の一方向への移動を定位置で阻止すべ
く移動プロツク2の一端に移動路上に位置し立上げられ
た移動ブロック停止壁であり11図面は該停止壁16及
びガイド壁15を移動プロ1.り2と共に一体成形し、
停止壁16とガイド壁15で画成された空間を移動ブロ
ック収容室17とし、該収容室IJ内に上記板状接触子
4を立上げた場合を示す。Further, the mobile pro 2 2 is stacked on the above-mentioned solenoid forming block 1 so that it can be reciprocated and laterally moved in the direction in which the plate-like contacts 4 are arranged. Reference numeral 15 denotes guide walls I6t/''i that are attached to two sides of the moving block 2 parallel to the moving direction of the moving block 2 to guide the reciprocating lateral movement.
, is a moving block stopping wall that is positioned and erected at one end of the moving block 2 on the moving path in order to prevent the moving block 2 from moving in one direction at a fixed position. Mobile Pro 1. integrally molded with ri 2,
The space defined by the stop wall 16 and the guide wall 15 is defined as a moving block storage chamber 17, and the plate-shaped contactor 4 is set up in the storage chamber IJ.
上記の如く移動ブロック2をソケット形成ブロック1上
に往復横動可に重ねつつ、該移動プロ2り2に開穿した
接触子挿入孔18に上記板状接触子4と挿入する。板状
接触子4は該接触子挿入孔18へ貫挿されて、その路上
半身を移動ブロック上方へ突出する。As described above, the movable block 2 is stacked on the socket forming block 1 so as to be movable in a reciprocating and lateral manner, and the plate-shaped contact 4 is inserted into the contact insertion hole 18 drilled in the movable block 2. The plate-shaped contact 4 is inserted into the contact insertion hole 18, and its half body projects upward from the moving block.
更に前記カバーブロック3は上記接触子挿入孔18及び
板状接触子41C対応したICI)−ド挿入孔19を有
し、これを上記移動ブロック2の上に重ね、該重ね合せ
下でその両端両側に垂設したロック片20をソケット形
成ブロックの両側面に形成した係合溝21に弾性的に係
入してその段部22にしっかりと係止し、ンケ、ト形成
ブロックlヘ一体に固装する。従って移動プロ、り2は
ブロック1,3間にあって横移動可に配置される。カバ
ーブロック3は上記重ね合せによって力・ム素子24の
軸25を上から押さえる軸浮上シ防止片31を有する。Further, the cover block 3 has an ICI) card insertion hole 19 corresponding to the contact insertion hole 18 and the plate-like contact 41C, and is stacked on the moving block 2, and both ends of the cover block 3 are stacked on the moving block 2 under the stack. A lock piece 20 provided vertically engages elastically into the engagement groove 21 formed on both sides of the socket forming block and securely locks into the stepped portion 22, thereby integrally fixing the lock piece 20 to the socket forming block l. to wear Therefore, the mobile processor RI2 is placed between blocks 1 and 3 so as to be movable laterally. The cover block 3 has a shaft floating prevention piece 31 that presses the shaft 25 of the force/muscle element 24 from above by the above-mentioned overlapping.
上記カバーブロック3の重合によって移動プロ、ツク2
を貫いた板状接触子4の上半身部分はカバープロ、り3
のIC’J−ド挿入孔19へ下から挿入され、他方カバ
ーブロック3上に搭載されたICパッケージ23のIC
リード7はIC・リード挿入孔I9へ上から挿入される
。Due to the polymerization of the cover block 3 mentioned above, the mobile phone, Tsuku 2
The upper body part of the plate-shaped contact 4 that penetrated the
The IC of the IC package 23 is inserted into the IC'J-card insertion hole 19 from below and mounted on the other cover block 3.
The lead 7 is inserted into the IC/lead insertion hole I9 from above.
ICリード7は上記によってICリード挿入孔19内で
第5図に示す如き対向状態、即ち接触待機状態におかれ
、移動ブa、り2の横移動によって第6図に示す如き接
触状態におかれる。As described above, the IC leads 7 are placed in the facing state as shown in FIG. 5 in the IC lead insertion hole 19, that is, in the contact standby state, and are brought into the contact state as shown in FIG. It will be destroyed.
図面は該移動ブロック2に移動力を付与する移動手段を
例示している。即ち、前記のようにソケット形成ブaワ
クIの一端に移動ブa7り2の一端と衝合してその一方
向への移動を定位置で阻止する停止壁16が配され、同
ブロックlの他端に移動プロ、7り2の他端を押圧又は
押圧解除するカム素子24が設けられる。このカム素子
24は偏心カムを利用したもので、これをソケット形成
ブロりクエの端部に上記移動ブa、り2の端面と対向す
る如く配し、その両端に突設した軸25をカイト壁15
に凹欠した軸受溝26へ為脱可に嵌め込んでカム素子2
4を回動可に支持し、更にカム素子24の路中周囲に穿
けたガイド溝27にソケット形成ブロック側から突成し
た位置決を兼ねる突壁29を滑入し、該ガイド溝27内
に沿う部分を含めたガイド素子周壁を上記偏心カム面と
し、第5図に示す接触待機状態から、カム素子24を工
具等を用いて突県29と移動プロ・、り2端面間で定軸
回動する(軸25を工具で回す)とその偏心量に応じ移
動プロ4.り2が第6図に示す如く一方向へ横移動する
に至る。この横移動によって上記l板状接触子4とIC
IJ−ドアとの接触が得られる。The drawings illustrate a moving means that applies a moving force to the moving block 2. That is, as mentioned above, a stop wall 16 is disposed at one end of the socket forming block I to abut against one end of the movable block A7 to prevent it from moving in one direction at a fixed position. A cam element 24 for pressing or releasing the pressure on the other end of the mobile device 2 is provided at the other end. This cam element 24 utilizes an eccentric cam, which is disposed at the end of the socket-forming bracket so as to face the end surface of the movable bracket 2, and a shaft 25 protruding from both ends of the shaft wall 15
The cam element 2 is removably fitted into the bearing groove 26 which is notched in the cam element 2.
4 is rotatably supported, and furthermore, a projecting wall 29 which also serves as a positioner and protrudes from the socket forming block side is slid into a guide groove 27 bored around the path of the cam element 24, and into the guide groove 27. The circumferential wall of the guide element, including the part along which it runs along, is used as the above-mentioned eccentric cam surface, and from the contact standby state shown in FIG. 4. When moving (turning the shaft 25 with a tool), the mobile pro moves according to the amount of eccentricity. As shown in FIG. 6, the wheel 2 moves laterally in one direction. Due to this lateral movement, the plate contact 4 and the IC
IJ-Contact with the door is obtained.
即ち、上記移動ブロック2の接触子挿入孔18の内壁が
上記移動ブロック2の一方向への横移動によって上記板
状接触子4のIC’J−ドと反対側の板面(背面)、好
ましくは腰曲げ部頂部と抑圧すべく配置され、該接触子
挿入孔内壁30が板状接触子4の背面を押圧することに
より、同接触子4ははじめその固定部14を支点とし弾
性偏位されて上記第3接片12.’に板状接触子4と対
向するICリード7の一側面に先行接触させると共に、
更に引続く上記押圧により第3接片12と固定部14を
支点としてこれを曲げを解消する方向に弾性偏位させて
同IC’J−ドアを上記第1接片10と第2接片11間
に介入させ(ICリード7が両接片10.11間を完全
に突き抜けるに至らない介入でも良い)、よって両接片
10,11kIcリード7の上記−側面と直交する二側
面に接触させる。That is, the inner wall of the contact insertion hole 18 of the movable block 2 is moved laterally in one direction of the movable block 2, so that the inner wall of the contact insertion hole 18 of the movable block 2 is moved to the plate surface (back surface) of the plate-shaped contact 4 opposite to the IC'J-do. is arranged to press against the top of the bending part, and when the inner wall 30 of the contact insertion hole presses the back surface of the plate-shaped contact 4, the contact 4 is initially elastically deflected about its fixed part 14 as a fulcrum. and the third contact piece 12. ' is brought into preliminary contact with one side of the IC lead 7 facing the plate-like contact 4, and
Furthermore, by the subsequent pressing, the third contact piece 12 and the fixing part 14 are elastically deflected in the direction to eliminate the bending, using the third contact piece 12 and the fixing part 14 as fulcrums, and the IC'J-door is fixed to the first contact piece 10 and the second contact piece 11. (Intervention may be such that the IC lead 7 does not completely penetrate between the contact pieces 10 and 11), and thus contacts the two side surfaces perpendicular to the above-mentioned side surfaces of the contact pieces 10 and 11kIc lead 7.
カム素子24を原位置へ回動し上記抑圧を解除すると、
移動ブa7り2の内壁30も押圧を解除し板状接触子4
の復元力で他方向へ移動し、前記ICIJ−ドアとの接
触待機状態を再形成する。When the cam element 24 is rotated to its original position and the above-mentioned suppression is released,
The inner wall 30 of the moving bar a7 also releases the pressure, and the plate contact 4
It moves in the other direction with the restoring force of , and re-establishes the state of waiting for contact with the ICIJ-door.
上記によってIC’J−ドアはその基部側−側面を第3
接片12によって、その先端側二側面を第1、第2接片
10,11によって接触されるに至り、三点接触によっ
て高信頼の接触が確保される。しかも上記三点接触はI
CIJ−ドアの一側に配置される一枚の板状接触子4に
よって達成することができる。As a result of the above, the IC'J-door has its base side-side
The contact piece 12 has its two front end side surfaces contacted by the first and second contact pieces 10 and 11, and highly reliable contact is ensured by the three-point contact. Moreover, the above three-point contact is I
This can be achieved by a single plate contact 4 placed on one side of the CIJ-door.
従来IC’J−ドアの高密度化、微小ピッチ化からその
ソケットの設計における対応がせまられているが、本接
触機構によれば従来の如く二枚の板バネを枝状とした接
触子間にICリードを介入する接触機構と異なって、一
枚の板状接触子による上記接触機構の提供によってフケ
2ト側接触子の薄手化、並設ピッチの狭小化を容易にし
ながら、なお且つ単板による接触子の接触信頼性の面で
の不安を上記した接触機構によって完全に解消し得た。The higher density and finer pitch of conventional IC'J-doors has required measures to be taken in the socket design, but with this contact mechanism, two leaf springs are used as branches between the contacts. Unlike the contact mechanism in which an IC lead is interposed between the contacts, the above contact mechanism is provided by a single plate-like contact, which makes it easy to make the contact on the 2nd hook side thinner and to narrow the pitch between them, while also making it simple. The above-mentioned contact mechanism completely eliminates concerns about the contact reliability of the contactor using the plate.
加えて単板形接触子によるICリード7の無負荷挿脱目
的も容易に達成できた。上記第1.第2接片io、ti
は互いに対向配置であれば、ICリード7に摺曲力を与
えずに上記挟接が可能で、設計も容易となる。又板状接
触子4の腰曲げ部14の頂部を押圧することにより、小
感な曲げ(接触で゛
子のピッチを大きくしない\固接触子4の所要の最大偏
位量が容易にとれ、第3接片12のICリード7に対す
る摺擦量も多くとれる。In addition, the purpose of inserting and removing the IC lead 7 without any load using the single-plate contactor was easily accomplished. Above 1. 2nd contact piece io, ti
If they are arranged facing each other, the above-mentioned clamping can be performed without applying any sliding force to the IC lead 7, and the design becomes easy. In addition, by pressing the top of the bending portion 14 of the plate-shaped contact 4, slight bending (without increasing the pitch of the contact due to contact and the required maximum deflection amount of the solid contact 4) can be easily achieved. The amount of sliding of the third contact piece 12 against the IC lead 7 can also be increased.
本発明はICリード7が板状である場合の他、丸ピンで
あっても実用可能であジ、又板状接触子4の配列が二列
以上であっても実施できる。In addition to the case where the IC lead 7 is plate-shaped, the present invention is also practical even when the IC lead 7 is a round pin, and it can be practiced even when the plate-shaped contacts 4 are arranged in two or more rows.
第1図は本発明゛の実施例を示すICソケットの分解斜
視図、第2図はソケット形成ブロックと移動ブロックの
組立斜視図、第3図は第1図における組立平面図、第4
図は同側面図、第5図、第6図は同拡大部分断面図で第
5図はICリードの接触待機状態、第6図は同リードの
接触状態を夫々示し、第7図は板状接触子の側面図、第
8図は同正面図、第9図は同背面図、第10図はIC!
J−ドと板状接触子の接触前の状態を拡大して示す正面
図、第11図は同縦断面図、第12図A図は同接触前の
状態を拡大して示す横断面図、同B図は同接触後の状態
を拡大して示す横断面図である。
l ・ソケット形成ブロック、2 移動プロ・、り、3
・・・カバーブロック、4 ・板状接触子、5・・・圧
入固定部、7・・IC’J−ド、8 溝孔、 10・・
第1接片、11 ・第2接片・、 12−第3接片、
14 ・腰曲げ部、 18・・接触子挿入孔。
第8図 第9図FIG. 1 is an exploded perspective view of an IC socket showing an embodiment of the present invention, FIG. 2 is an assembled perspective view of a socket forming block and a moving block, FIG. 3 is an assembled plan view of FIG. 1, and FIG.
5 and 6 are enlarged partial cross-sectional views of the same, FIG. 5 shows the IC lead in a contact standby state, FIG. 6 shows the IC lead in a contact state, and FIG. 7 shows a plate-shaped A side view of the contact, FIG. 8 is the front view, FIG. 9 is the rear view, and FIG. 10 is the IC!
FIG. 11 is a longitudinal cross-sectional view of the same, and FIG. 12A is a cross-sectional view of the same before contact; Figure B is an enlarged cross-sectional view showing the state after contact. l ・Socket forming block, 2 Gopro・ri, 3
...Cover block, 4.Plate contact, 5.Press-fit fixing part, 7..IC'J-de, 8.Slot hole, 10..
1st contact piece, 11 - 2nd contact piece, 12-3rd contact piece,
14 - Waist bending part, 18... Contact insertion hole. Figure 8 Figure 9
Claims (4)
CIJ−ド接触用の板状接触子を備え、該板状接触子を
その固定部から接触待機状態におかれたICリードの長
手方向へ立上げてその板面を該ICリードの一側と対向
させ、該板状接触子を上記接触待機状態にあるICリー
ドへ向は弾性偏位させることにより同リードとの接触を
得るようになされたI’Cンケノトにおいて、ICリー
ドと対向する板状接触子の板面にICIJ−ドの長手方
向に延在するICIJ−ド受入用の溝孔を開穿し、該溝
孔の開穿により分割された該溝孔左右の板状接触子部分
の溝孔形成壁から該溝孔の巾を狭めるICリード挟接用
の第1接片と第2接片とを突設すると共に、上記板状接
触子の上記溝孔上端における連設片部にてICIIJ−
ド当接用の第3接片を形成し、更に上記板状接触子をそ
の腰部がICリードと反対側へ向は凸曲となるように腰
部げし、他方上記ソケット形成ブロックに移動プロ、り
を往復横移動可に重ね、該移動プロ、2りに開穿した上
記移動方向と垂直なる接触子挿入孔に上記板状接触子を
貫−挿し、該接触子挿入孔に板状接触子と反対方向から
上記ICl7−ドを抜差可に挿入して上記接触待機状態
が形成され、該移動プロ、りの接触子挿入孔内壁を移動
ブロックの上記往復横移動により上記板状接触子のIC
リードと反対側の板面を抑圧又は抑圧解除する如く配置
し、該接触子挿入孔内壁による抑圧により板状接触子を
その固定部を支点とし弾性偏位させ上記第3接片を板状
接触子と対向するIC’J−ドの一側面に先行接触させ
ると共に、更VC該第3接片と上記固定部とを支点とし
て曲げを解消する方向に弾性偏位さtて同ICリードを
上記第1接片と第2接片間に介入させ両接片をICリー
ドの上記−側面と直交する二側面に接触させる横暴とし
たことを特徴とするICソケットにおける接触機構。(1) I with the base press-fitted into the socket forming block
A plate-like contactor for contacting the CIJ is provided, and the plate-like contactor is raised from its fixed part in the longitudinal direction of the IC lead placed in a contact standby state, and its plate surface is connected to one side of the IC lead. In the I'C connector, the plate-shaped contactor is made to face the IC lead and is elastically deflected toward the IC lead in the contact standby state to obtain contact with the IC lead. A slot for receiving the ICIJ-board extending in the longitudinal direction of the ICIJ-board is drilled in the plate surface of the contact, and the plate-shaped contact parts on the left and right sides of the slot are divided by opening the slot. A first contact piece and a second contact piece for clamping an IC lead to narrow the width of the slot are provided protruding from the slot forming wall, and a connecting piece at the upper end of the slot of the plate-like contact is provided with ICIIJ-
Form a third contact piece for contacting the IC lead, and further bend the plate-shaped contact so that its waist is convex on the side opposite to the IC lead, and then attach the mobile pro to the socket forming block. Stack them so that they can move back and forth laterally, insert the plate-shaped contact into the contact insertion hole perpendicular to the movement direction, which is perpendicular to the movement direction, and insert the plate-shaped contact into the contact insertion hole. The contact standby state is formed by removably inserting the ICl7-board from the opposite direction, and the plate-shaped contact is moved through the inner wall of the contact insertion hole of the mobile unit by the reciprocating lateral movement of the movable block. IC
The plate surface on the opposite side of the lead is arranged so as to be suppressed or released from suppression, and the plate-shaped contact is elastically deflected using its fixing part as a fulcrum by the suppression by the inner wall of the contact insertion hole, and the third contact piece is brought into plate-shaped contact. The IC lead is first brought into contact with one side of the IC lead facing the lead, and the IC lead is further elastically deflected in a direction to eliminate the bending using the third contact piece of the VC and the above-mentioned fixing part as a fulcrum. A contact mechanism in an IC socket characterized by intervening between a first contact piece and a second contact piece so that both contact pieces come into contact with two side surfaces perpendicular to the above-mentioned side surface of an IC lead.
接片とを対向して配置したことを特徴とするICソケッ
トにおける接触機構。(2) In the invention described in paragraph 1, the first contact piece and the second contact piece
A contact mechanism in an IC socket, characterized in that contact pieces are disposed facing each other.
接片とを板状接触子の腰囲げ部付近に配したことを特徴
とするICツク、トにおける接触機構。(3) In the invention described in paragraph 1, the first contact piece and the second contact piece are
A contact mechanism in an IC device, characterized in that a contact piece is arranged near a waist surrounding portion of a plate-like contact.
壁で板状接触子の腰囲げ部頂部を押圧する構成としたこ
とを特徴とするICソケットにおける接触機構。(4) In the invention described in item 1, the contact mechanism in the IC socket is characterized in that the inner wall of the contact insertion hole presses the top of the waist surrounding part of the plate-like contact.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3944383A JPS59165442A (en) | 1983-03-10 | 1983-03-10 | Contact mechanism in socket of integrated circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3944383A JPS59165442A (en) | 1983-03-10 | 1983-03-10 | Contact mechanism in socket of integrated circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59165442A true JPS59165442A (en) | 1984-09-18 |
JPH0226388B2 JPH0226388B2 (en) | 1990-06-08 |
Family
ID=12553154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3944383A Granted JPS59165442A (en) | 1983-03-10 | 1983-03-10 | Contact mechanism in socket of integrated circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59165442A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0613335A1 (en) * | 1993-02-24 | 1994-08-31 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
WO1997017745A1 (en) * | 1994-06-02 | 1997-05-15 | Advantest Corporation | Structure of ic socket |
US6012929A (en) * | 1995-11-08 | 2000-01-11 | Advantest Corp. | IC socket structure |
JP2000299150A (en) * | 1999-04-15 | 2000-10-24 | Mitsubishi Electric Corp | Connecting device |
KR100394336B1 (en) * | 1998-06-30 | 2003-08-06 | 가부시키가이샤 엔프라스 | Socket for electrical parts |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4944156U (en) * | 1972-07-20 | 1974-04-18 | ||
JPS5675486U (en) * | 1979-11-14 | 1981-06-19 |
-
1983
- 1983-03-10 JP JP3944383A patent/JPS59165442A/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4944156U (en) * | 1972-07-20 | 1974-04-18 | ||
JPS5675486U (en) * | 1979-11-14 | 1981-06-19 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0613335A1 (en) * | 1993-02-24 | 1994-08-31 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
US5482471A (en) * | 1993-02-24 | 1996-01-09 | Texas Instruments Incorporated | Socket apparatus for IC package testing |
WO1997017745A1 (en) * | 1994-06-02 | 1997-05-15 | Advantest Corporation | Structure of ic socket |
US6012929A (en) * | 1995-11-08 | 2000-01-11 | Advantest Corp. | IC socket structure |
KR100394336B1 (en) * | 1998-06-30 | 2003-08-06 | 가부시키가이샤 엔프라스 | Socket for electrical parts |
JP2000299150A (en) * | 1999-04-15 | 2000-10-24 | Mitsubishi Electric Corp | Connecting device |
Also Published As
Publication number | Publication date |
---|---|
JPH0226388B2 (en) | 1990-06-08 |
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