JP2009257910A - Double elastic mechanism probe card and its method for manufacturing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card which is used for the inspection of chip devices, which are integrated with high density and are provided with high performance in a situation in which semiconductor wafers are becoming large, and has a mechanism which, when micro-sized probes are used, prevents the probes from being damaged or destroyed even when appropriate overdrive is applied, and to provide its method for manufacturing. <P>SOLUTION: The double elastic mechanism probe card includes: a circuit board; a probe board on which a plurality of probe module boards formed with a plurality of cantilever probes at predetermined positions are arranged along a plurality of rows and a plurality of columns; and a plurality of relay connecting pins provided between the circuit board and the probe board. The probe module boards are supported by the probe board in a suspended fixed-point manner and are provided with an elastic connecting pin for establishing electric connection with the probe board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a structure of a probe card used for inspection of electrical characteristics of a chip device integrated at a high density on a semiconductor wafer, that is, a micro-dimension corresponding to high density and miniaturization of the electrode arrangement of the chip device. The present invention relates to a probe card having a mechanism that does not damage or break even when an overdrive is imposed, and a method of manufacturing the same.

  Usually, a test apparatus for performing an electrical function test on a chip device on a semiconductor wafer adjusts the contact position between the electrode of the chip device on the semiconductor wafer and the probe of the probe card, and then applies overdrive to chip the probe. A prober that moves the wafer mounting table up, down, left and right to press and contact the device electrodes, and electrical functions by inputting and outputting electrical measurement signals to the chip device via the probe, probe board, and circuit board And a tester for testing.

  As shown in FIG. 7, the probe card 21 used for the inspection of the electrical characteristics of the chip device includes a circuit board 24 to which a plurality of tester connection terminals 24a are connected and a probe board 23 to which a plurality of probes 22 are attached. A relay connection pin 25 group for electrically connecting the connection terminal 25a of the circuit board 24 corresponding to the tester connection terminal 24a and the connection terminal 23a of the probe board 23 corresponding to each probe 22; A reinforcing plate 26 that reinforces mechanical strength, a circuit board 24, a supporting body 27 that holds the reinforcing board 26 and the probe board 23 in a predetermined position, and a supporting bolt 28 are configured. The circuit board 24 and the probe board 23 are circular or rectangular flat plates having a certain rigidity and printed circuit inside. The relay connection pin 25 fixed to the circuit board 24 has elasticity and corresponds to the tip of the relay connection pin 25 of the circuit board 24 by the pressing force of the probe board 23 generated by adjusting the support 27 and the support bolt 28. The connection terminal 23a of the probe board 23 contacts and an electrical connection is obtained. Further, the wafer mounting table 31 on which the wafer 30 is placed is moved in order to apply an overdrive of several tens of microns to the probe 22, thereby ensuring electrical connection between the probe 22 and the electrode of the wafer 30.

  In recent years, with the increase in size of semiconductor wafers and the increase in density and functionality of chip devices, the electrode arrangement interval (electrode pitch) of chip devices has become increasingly smaller. For example, in the near future, 50 micron intervals will be realized for memory elements, 25 micron intervals for logic elements, and 10 micron intervals for semiconductor elements that drive liquid crystal displays in the logic elements. In testing these chip devices, a probe with a minute dimension is required, and this probe overdrives the electrode of the chip device, and the pressing force destroys the oxide film of the electrode, so that a reliable electrical connection is made. The test measurement is performed. The pressing force generated by overdrive at this time generates a stress in the probe, and the probe needs to withstand this stress. In this case, even if an overdrive of the same level as in the prior art is given, the stress generated inside becomes remarkably large because the probe size is reduced corresponding to the increase in density. This stress can be very close to or exceed the maximum allowable stress of the probe material, resulting in damage or damage to the probe. When the probe is damaged in this way, the test is not performed under normal conditions, and a non-defective product is determined to be a defective product, resulting in a large economic loss. In addition, if damage is found in the probe, the test is interrupted and the test apparatus needs to be repaired, which deteriorates productivity.

  In addition, the tip surface of the probe group of the probe card and the wafer placement surface often have a slight but constant inclination, and cannot be ignored compared to the overdrive during the probe measurement test. There may be a degree of inclination. If the test is performed in such a state, the risk of exceeding the allowable deformation limit of the probe is further increased. For example, if the vertical overdrive of the probe requires 20 microns to press-contact the chip device electrode on the wafer, the tip surface of the probe group and the plane of the wafer mounting table may be 10 microns apart. If there is a tilt, if you try to apply an appropriate 20 micron overdrive to the chip device, the tilt will affect and the maximum overdrive will reach 30 microns, leaving room for the maximum allowable stress of the probe. This increases the risk of damage or destruction of the probe.

  The maximum allowable stress of this probe depends on the physical properties specific to the probe material. When the probe material and shape are determined, the allowable maximum stress of the probe, that is, the maximum allowable vertical displacement (overdrive) is determined. End up. This allowable maximum overdrive is the maximum allowable overdrive for operating the prober. What is controlled in the measurement test is the operational overdrive of the prober device. Therefore, as the probe dimensions become smaller for the measurement test corresponding to the higher density and miniaturization of the electrode arrangement of the chip device, the allowable maximum deformation limit of the probe becomes smaller. Is susceptible to destruction or damage, which can incur economic losses. In order to prevent this, there is a need for a solution to increase the maximum allowable overdrive seen from the prober device.

A prior art of a micro-shaped probe with an increased maximum allowable overdrive has been disclosed (Reference 1). This prior art is devised in the shape of a blade type, but is complicated in arrangement and manufacturing in comparison with a conventional cantilever type probe in increasing the integration degree of the probe.
JP 2006-189370 A [0030, 0037-38, 0043, FIG. 1]

The present invention was made in order to solve these problems in view of the above circumstances, and in a situation where the diameter of the semiconductor wafer is increased from 200 mm to 300 mm, it is integrated at a high density, In a probe card used for inspection of electrical functional characteristics of a highly functional chip device, when a probe with a small size is adopted, it has a mechanism for preventing the probe from being damaged or destroyed even if an appropriate overdrive is applied. A probe card and a manufacturing method thereof are provided.

  In order to achieve the above-mentioned object, the invention of the double elastic mechanism probe card according to claim 1 is provided with a circuit board and a plurality of cantilever probes arranged at a predetermined position on one surface side of the circuit board. A plurality of probe module substrates formed in a plurality of rows and columns on the surface, and a plurality of relay connection pins that are electrically connected to each other provided on a surface facing the circuit substrate and the probe substrate. And the probe module substrate is supported by a fixed fixed point from the probe substrate and is provided with an elastic connection pin electrically connected to the probe substrate.

  The invention of the double elastic mechanism probe card of claim 2 is arranged in a plurality of rows and a plurality of columns on one surface side of the circuit board and a plurality of cantilever probes at predetermined positions. And a reinforcing plate that is disposed on the other side of the circuit board and suppresses deformation of the entire probe card, and the probe module board is supported from the reinforcing plate by a suspension point and the circuit board. And an elastic connecting pin for electrical connection between the two.

  Further, the invention of the dual elastic mechanism probe card according to claim 3 is arranged in a plurality of rows and a plurality of columns on one surface side of the circuit board and the circuit board, and a plurality of cantilever probes at predetermined positions on the surface. A probe module substrate formed between the probe module substrate and the circuit board, and the elastic connection pins are fixedly connected to the probe module substrate and the circuit board. It is characterized by that.

The invention of the double elastic mechanism probe card according to claim 4 corresponds to the spring constant (K ₁ ) of the cantilever probe in the double elastic mechanism probe card according to any one of claims 1 to 3. The ratio (K ₁ / K ₂ ) of the spring constant (K ₂ ) of the elastic connecting pin is in the range of 0.5 to 1.5.

In the present invention, in order to increase the allowable maximum overdrive as viewed from a prober, an elastic body which is an elastic connection pin is interposed between the probe module board and the probe board or the circuit board, and the elastic body is measured during a measurement test. Is a probe card having a double elastic mechanism of a cantilever probe and an elastic body. When an elastic body is interposed between the probe module board and the probe board or the circuit board and it operates, this probe card as a whole is seen as a probe group from a prober or a wafer, and a spring group called an intervening elastic body. These “springs” can be regarded as elastic bodies coupled in series. The spring constant of _one probe is k ₁ , the total number of probes is N, the spring constant of one elastic body interposed between the probe module board and the probe board or circuit board is k ₂ , and the total number of elastic bodies is N total probes. Since the spring constant K _{1 of the} entire probe group is K ₁ = k ₁ × N, and the spring constant K _{2 of the} entire elastic body group is K ₂ = k ₂ × N. If the spring constant of the entire probe card viewed from the wafer is K, the spring constant of the entire probe card viewed from the wafer is K = (K ₁ × K ₂ ) / (K ₁ + K ₂ ). By interposing this elastic body group, the spring constant viewed from the prober or the wafer becomes small, and accordingly, an overdrive for obtaining a predetermined pressing force by the probe is required. That is, the allowable maximum overdrive as viewed from the prober until the allowable maximum stress of the probe alone is reached can be increased accordingly. This is an effect obtained by interposing an elastic body between the probe module substrate and the probe substrate or the circuit substrate.

For example, consider a case of a plurality of probe module boards on which 2,000 probes are mounted that generate a pressing force of 0.5 gf with an overdrive of 25 microns and the maximum allowable stress is an internal stress corresponding to a load of 0.75 gf. , K ₁ = 1,000 gf / 25 microns, allowable maximum overdrive 37.5 microns. On the other hand, when an elastic body of K ₂ = 1,000 gf / 25 microns is interposed, and there is no elastic body (K ₂ = ∞), the elastic body is in contrast to the spring constant as seen from the wafer: K = 1,000 gf / 25 microns. If it is present, the spring constant as seen from the wafer is K = 500 gf / 25 microns, and the allowable maximum stress of the probe does not change, so the spring constant is halved. In other words, when there is no elastic body, 25 micron overdrive is required to obtain a pressure of 0.5 gf per probe, and the maximum allowable overdrive from the prober is 37.5 microns. The margin of overdrive in the prober operation is 12.5 microns. On the other hand, when an elastic body is interposed, an overdrive of 50 microns is necessary to obtain a pressing force to the electrode of 0.5 gf per probe, and the allowable overdrive from the viewpoint of the prober is 75 microns. The margin of overdrive in the prober operation is 25 microns. Overdrive margin in prober operation doubles from 12.5 microns to 25 microns. Therefore, according to the probe card of the double elastic structure of the present invention, there is a margin in the prober operation for overdrive during the measurement test, and the risk that the measurement test cannot be completed due to damage or destruction of the microprobe is reduced. can do.

  Further, in the probe card having a double elastic mechanism in which an elastic body is interposed between the probe module board of the present invention and the probe board or circuit board, the probe module board moves upward during the overdrive operation. Before and after the movement, in order to ensure the pressing contact between the electrode of the chip device and the probe tip, it is necessary to maintain the positional accuracy of the plane (XY) of the probe tip. For this reason, in the double elastic mechanism probe card according to the first and second aspects, the probe module substrate is supported from a probe substrate or a circuit substrate (reinforcing plate) at a fixed point. This suspension fixed point support has a guide mechanism in which the probe module board is suspended from the probe board or the circuit board (reinforcing plate) so as to be vertically movable, and at the same time, maintains a fixed position in the plane (X, Y axis) direction. Means that Further, in the double elastic mechanism probe card according to claim 3, by fixing the elastic connection pin that is deformable up and down and does not displace in a plane between the terminals of the probe module board and the circuit board, It can play the role of the above suspension fixed point support.

The ratio of the double elastic mechanism probe card according to claim 4 of the present invention, overall spring constant of the corresponding elastic connection pin group and overall spring constant of the cantilever probe groups _{(K 1) (K 2)} ( If K ₁ / K ₂ ) is in the range of 0.5 to 1.5, in the measurement test, the overdrive of the probe group and the overdrive of the probe module substrate accompanying the probe group are well balanced. The drive operation is easy, the allowance for the allowable maximum overdrive of the probe is sufficient, and the allowable maximum stress can be secured. Also, since the probe module board is divided and arranged over multiple rows and multiple columns with respect to the probe board or circuit board and supported by the suspension fixed point, the wafer surface and the probe surface are inclined with respect to each other However, it is possible to obtain an effect that the probe module substrate moves so as to follow the inclination, and overdrive is applied uniformly.

  A method of manufacturing a double elastic mechanism probe card according to claim 5 is the double elastic mechanism probe card according to any one of claims 1 to 4, wherein a plurality of cantilever beams are formed on the electrode of the probe module substrate. A probe module substrate is manufactured by a method in which a probe is formed by repeated execution of lithography and electroforming, and then a sacrificial layer is removed by etching. According to a sixth aspect of the present invention, there is provided a method of manufacturing a double elastic mechanism probe card according to any one of the first to fourth aspects, wherein a plurality of elastic layers are formed on the electrode of the probe substrate or the probe module substrate. It is characterized in that the connecting pin is formed by repeated execution of lithography and electroforming, and then the elastic connecting pin is manufactured by a method of removing the sacrificial layer by etching. According to a seventh aspect of the present invention, there is provided a method of manufacturing a double elastic mechanism probe card according to the fifth aspect of the present invention, wherein a plurality of cantilever beams are formed on the electrodes of the probe module substrate. A probe is formed with a sacrificial layer by repeated execution of lithography and electroforming, and then formed on the electrode on the other surface of the probe module substrate by the method of manufacturing a double elastic mechanism probe card according to claim 6. A plurality of crank-type elastic connection pins are provided and formed together with a sacrificial layer by repeated execution of lithography and electroforming, and then a plurality of the probe module substrates are fixed to the circuit board via the crank-type elastic connection pins, A double elastic mechanism probe card is manufactured by removing the sacrificial layer.

  According to these manufacturing methods, a plurality of cantilever probes to be mounted on the probe module substrate can be precisely formed in a fine shape by repetitive execution of lithography and electroforming. The probe can be manufactured in an area array with increased accuracy in shape and position. In addition, since a plurality of elastic connection pins to be mounted on the probe board or probe module board can be precisely formed in a fine shape by repeated execution of lithography and electroforming, a minute size cantilever shape corresponding to high density or A crank-shaped elastic connecting pin can be manufactured in an area array with increased accuracy in shape and position. In addition, a plurality of cantilevered probes mounted on both sides of the probe module substrate and crank-shaped elastic connection pins can be precisely formed in a fine shape through repeated execution of lithography and electroforming, thus supporting high density. It is possible to manufacture an area array in which the precision of the shape and position of the probe and the elastic connecting pin with respect to the probe module substrate is increased with respect to the minute dimensions. Then, after the plurality of probe module substrates are fixed to the circuit board through the elastic connection pins, the sacrificial layer is removed to manufacture an area arrayed double elastic mechanism probe card. As a result, a double elastic mechanism probe card having a probe having a fine shape is obtained, and it is possible to efficiently and surely cope with an electrical performance test of a high-density chip device having a minute electrode interval.

  According to the double elastic mechanism probe card having the configuration of claims 1 to 4 according to the present invention, in the inspection of the electrical characteristics of the chip device integrated on the semiconductor wafer with high density, the electrode spacing of the current or future chip device The probe's allowable maximum overdrive can be increased while the corresponding probe size is reduced and the allowable maximum stress is reduced. Or, it is easy to perform overdrive operation of the wafer, and electrical property inspection can be performed easily and reliably, and the loss of economic benefits due to extended inspection time and inaccuracy of inspection due to probe damage or destruction Can do. Moreover, the double elastic mechanism probe card of the present invention has a simple structure in which an elastic body is interposed between the probe module substrate and the probe substrate or the circuit substrate, and can cope with a high density of minute probes. And since it can also manufacture easily, it can contribute to the practical use of the test | inspection apparatus of the chip device with which the electrode space | interval was minimized. In addition, since the probe module substrate is provided divided into a plurality of rows and a plurality of columns, inspection can be performed following the plane of the wafer, so that it is possible to cope with variations in the flatness of the wafer.

According to the method for manufacturing a double elastic mechanism probe card having the structure of claims 5 to 7 according to the present invention, a probe card corresponding to an increase in size and density of a semiconductor wafer can be manufactured. The probe and the corresponding elastic connection pin can be manufactured with high precision by lithography and electroforming processes without being restricted by the shape, that is, by having an appropriate spring constant, etc. A probe card corresponding to the inspection of the chip device can be supplied. In addition, a double elastic mechanism probe card combining a cantilever probe and a crank-type elastic connection pin that allow a margin for allowable overdrive can be easily and accurately manufactured.

  Hereinafter, the best embodiment of the double elastic mechanism probe card according to the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of a double elastic mechanism probe card according to the present invention, wherein (a) is a schematic cross-sectional view of a probe card in which a probe module substrate is attached to a probe substrate via elastic connection pins. b) is a schematic enlarged view of part A of FIG. FIG. 2 is a schematic cross-sectional view of another embodiment of the double elastic mechanism probe card according to the present invention, in which a spring-like connection pin is interposed between the circuit board and the probe board. FIG. 3 is a schematic cross-sectional view of a probe card according to another embodiment of the dual elastic mechanism probe card of the present invention, in which a probe module board is attached to a circuit board via elastic connection pins. FIG. 4 is a schematic plan view of a probe board, which is an embodiment of a double elastic mechanism probe card according to the present invention, in which a probe module board is mounted on the probe board. FIG. 5 is an embodiment of a method for manufacturing a double elastic mechanism probe card according to the present invention, wherein (a) is a schematic explanatory view of a method of mounting a relay connection pin on a probe board, and (b) is a probe module board. It is a schematic explanatory drawing of the method of mounting a probe on. FIG. 6 relates to an embodiment of a method for manufacturing a double elastic mechanism probe card according to the present invention, and is a method for forming a probe card, wherein (a) is a schematic sectional view of the probe card according to the present method, and (b) It is a schematic explanatory drawing of the method of forming a probe card.

  The configuration of the double elastic mechanism probe card 1 according to the embodiment of the present invention will be described with reference to FIGS. 1A and 1B. The probe card 1 includes a circuit board 6 and one of the circuit boards 6. A probe board 4a arranged on the surface side, and a plurality of probe module boards 3 are arranged in a plurality of rows and columns with respect to the probe board 4a, and a plurality of cantilevered probes 2 are placed at predetermined positions on the probe module board 3. Forming. A plurality of cantilevered relay connection pins 8a are provided on the opposing surface between the circuit board 6 and the probe board 4a and electrically connected, and the probe board 4a and the probe module board 3 are connected to each other. A plurality of cantilevered elastic connection pins 5a that are electrically connected to the opposing surfaces are provided. The present invention is characterized in that it has a double elastic mechanism in which a plurality of sets of cantilevered probes 2 and corresponding elastic connection pins 5a are provided with the probe module substrate 3 interposed therebetween. In addition, each probe module substrate 3 is supported from the probe substrate 4a by a suspension fixed point, that is, the probe module substrate 3 is suspended in a vertically movable manner by a combination of the suspending tool 9 and a plurality of positioning pins 10. The feature is that the position can be fixed so that it does not move. FIG. 4 shows a state in which the probe module substrates 3 are arranged in a plurality of rows and a plurality of columns with respect to the probe substrate 4a. Since the probe module substrate 3 is provided in a divided manner, the inspection follows the plane of the wafer. Therefore, it is possible to cope with variations in wafer flatness and inclination. Further, a reinforcing plate 7 that reinforces the mechanical strength is provided on the back surface of the circuit board 6, and support bolts 17 are inserted into the reinforcing board 7 and the circuit board 6 to support the end 16 of the probe board 4a. Screwed. The cantilever-like relay connection pin 8a fixed to the connection terminal 8c of the circuit board 6 serves as a normal relay connection, and is connected to the connection terminal 8c of the probe board 4a by a reaction force generated in proportion to the pressing force. The main purpose is to ensure electrical connection, not the role of an elastic body as a double elastic mechanism.

  The probe module substrate 3, the probe substrate 4a, and the circuit substrate 6 are circular or square flat plates having a predetermined thickness. The substrates 3, 4a and 6 are printed boards made of synthetic resin or ceramic having a certain rigidity. In the probe module substrate 3, the connection terminals 5c and the corresponding terminals 2a of the probe 2 on the lower surface In the probe board 4a, each connection terminal 5c and the corresponding connection terminal 8c on the upper surface are connected by a printed internal wiring. On one circuit board 6, each tester connection terminal 4a and the corresponding connection terminal 8c on the lower surface are connected by printed internal wiring. Probes 2 corresponding to electrodes of a semiconductor chip device, which is an object to be measured, are arranged in an orderly manner on the entire lower surface of a circular or square probe module substrate 3. These probes 2 are fixed to the probe connection terminals 2a of the probe substrate 3 at their roots, hold the probe 2 in a cantilever shape, and have a function as an elastic body. No)) and a unitary structure having a needle tip that can be contacted. The wire diameter of the cantilever probe 2 is in the range of 20 to 100 μm, depending on the scale of the chip device, and the number of probes is several hundred to more than 1,000. As a material of the cantilever probe 2, one kind of alloy selected from palladium alloy, beryllium copper alloy, tungsten alloy, etc. is usually used, and the production is produced by die drawing or partially fine. Dimensional cantilevered probes are manufactured in a Riga process. The reinforcing plate 7 is used to reinforce the back surface for maintaining the flatness of the circuit board 4. In this case, the reinforcing plate 7 is made of a metal having high strength, and has heat resistance, weather resistance, contamination resistance, and workability. From the viewpoint of properties, it is desirable to use stainless steel.

The plurality of cantilevered elastic connection pins 5a interposed between the probe module substrate 3 and the probe substrate 4a are preferably made of a highly conductive metal, such as a Be-Cu alloy. The total spring constant of the cantilever-like elastic connection pin 5a (K ₂ = k ₂ × N, where k _{2 is} the spring constant of one cantilever-like elastic connection pin 5a and N is the total number of elastic connection pins 5a). In the range of 0.5 to 1.5 of the total spring constant (K ₁ = k ₁ × N, where k _{1 is} the spring constant of one probe 2 and N is the total number of probes) of the cantilever probe 2 group The overdrive loaded by the prober can be distributed to the probe 2 and the elastic connection pin 5a in a balanced manner. Since the cantilever-like elastic connecting pin 5a is required to have a shape that compresses and moves upward due to the pressing force and does not shift the horizontal positional relationship with the corresponding connecting terminal 5c, the cantilever has a cantilever shape. The mold may be easy to manufacture, and may be a coil spring type or a crank type spring. The material of the elastic connection pin 5a is preferably a material having elasticity and good electrical conductivity, and a copper-based phosphorus-based copper alloy, beryllium-based copper alloy, nickel alloy, or the like is used.

  As described above, the probe module substrate 3 is suspended from the probe substrate 4a by the wire rod-shaped suspending tool 9 so as to be vertically movable, and a plurality of cantilever-like elastic connection pins are interposed. The position in the vertical direction is determined by the balance with the reaction force 5a. When overdrive is applied from this state, the horizontal movement of the probe module substrate 3 is restricted by the rod-shaped positioning pins 10 extending in the vertical direction from the probe substrate 4a. Then, the intervening cantilever-like elastic connection pins 5a are pressed and accurately moved upward, and the cantilever-like probe 2 can be surely brought into press contact with the electrode of the chip device. When the overdrive is released, the position of the cantilever probe 2 in the XY plane at this time returns to the original position accurately because the probe module substrate 3 is supported by the suspension fixed point.

  Further, with respect to a probe card 1 which is another embodiment of the double elastic mechanism probe card according to the present invention, the points different from FIGS. 1A and 1B will be described with reference to FIG. The circuit board 6, the probe board 4a arranged on one surface side of the circuit board 6, and a plurality of probe module boards 3 are arranged in a plurality of rows and a plurality of columns with respect to the probe board 4a. A plurality of cantilever-like probes 2 are formed at predetermined positions in the same manner as in FIGS. 1A and 1B, except for the difference between the circuit board 6 and the probe board 4a. A plurality of helical spring-like connection pins 8b that are electrically connected to the opposing surface are provided, and the bases are individually fixed to the group of connection terminals 8c of the probe board 4a and the circuit board 6 to be electrically connected. As composition That. Also. When both ends of the helical spring-like connection pin 8b are in pressure contact without being fixed to the group of connection terminals 8c, a pin cover 15 that holds the helical spring-like connection pin 8b in that position may be provided.

  Further, with respect to the probe card 1 which is another embodiment of the double elastic mechanism probe card according to the present invention with reference to FIG. 3, points different from FIGS. 1A, 1 </ b> B, and 2 will be described. The probe card 1 includes a circuit board 6 and a plurality of probe module boards 3 arranged in a plurality of rows and a plurality of columns on one surface side of the circuit board 6, and a plurality of pieces are provided at predetermined positions on the probe module board 3. The cantilever probe 2 is formed, and a plurality of cantilever-like elastic connection pins 5 a that are electrically connected to the opposing surface between the circuit board 6 and the probe module board 3 are provided. The base is individually fixed to the connection terminal 5 c and electrically connected to the connection terminal 5 c of the probe module substrate 3. Also in this case, the probe module substrate 3 has a double elastic mechanism in which a plurality of sets of cantilevered probes 2 and corresponding elastic connection pins 5a are provided.

  Further, the probe module substrate 3 is suspended from the reinforcing plate 7 through the circuit substrate 6 so as to be vertically movable by a wire rod-shaped suspending tool 9, and has a plurality of interposed cantilever-like elastic connection pins 5a. The position in the vertical direction is determined by the balance with the reaction force. When overdrive is applied from this state, the horizontal movement of the probe module substrate 3 is restrained by the rod-shaped positioning pins 10 extending in the vertical direction from the reinforcing plate 7 in a plurality of 3 to 4 probe modules. Therefore, the intervening cantilever-like elastic connection pins 5a are pressed and accurately moved upward, and the cantilever-like probe 2 can be surely pressed and contacted with the electrode of the chip device. When the overdrive is released, the position of the cantilever probe 2 in the XY plane at this time returns to the original position accurately because the probe module substrate 3 is supported by the suspension fixed point.

  FIG. 5 shows a method of manufacturing the probe board 4a and the probe module board 3 of the double elastic mechanism probe card 1. In the manufacturing method shown in FIG. 5, the cantilever-like probe 2 having a fine dimension and the corresponding cantilever-like elastic connection pin 5a are manufactured in an area array, and each connection terminal 2a of the probe module substrate 3 and the probe substrate 4a is manufactured. It is a method of adhering to 5c. FIG. 5a shows a method in which a plurality of cantilevered elastic connection pins 5a are made into an area array and fixed to the connection terminals 5c of the probe substrate 4a. First, a plurality of sets of cantilever-like elastic connection pins 5a are formed in the Cu sacrificial layer 12 as a mold by repeatedly performing lithography and electroforming. Next, the set of cantilevered elastic connection pins 5a are fixed to the connection terminals 5c of the probe substrate 4a by soldering or the like. Thereafter, the sacrificial layer 12 of Cu is removed by etching, and the cantilevered elastic connection pin 5a mounted on the connection terminal 5c of the probe substrate 4a can be manufactured. FIG. 5 b shows a method in which a plurality of cantilevered probes 2 are made into an area array and fixed to the connection terminals 2 a of the probe module substrate 3. First, a plurality of sets of cantilever-like probes 2 are formed in the Cu sacrificial layer 12 as a mold by repeatedly performing lithography and electroforming. Next, the set of cantilever probes 2 are fixed to the connection terminals 2a of the probe module substrate 3 by soldering or the like. Thereafter, the sacrificial layer 12 of Cu is removed by etching, and the cantilever probe 2 mounted on the connection terminal 2a of the probe module substrate 3 can be manufactured. Thereby, the double elastic mechanism probe card 1 having the cantilever-like probe 2 having a fine dimension and the corresponding cantilever-like elastic connecting pin 5a can be manufactured.

  The double elastic mechanism probe card 1 shown in FIG. 6a is arranged in a plurality of rows and a plurality of columns on one surface side of the circuit board 6 and the circuit board 6, and a plurality of cantilever-like probes 2 are arranged at predetermined positions on the surface. A probe module board 3 having an internal wiring 3 a and a plurality of crank-type elastic connection pins 5 b formed between the probe module board 3 and the circuit board 6, and the elastic connection pins 5 b are connected to the probe module board 3. It is fixedly connected to the circuit board 6. In this case, the plurality of cantilever probes 2 and the plurality of crank-type elastic connection pins 5b are formed in the mold of the sacrificial layer 12 by repeated execution of lithography and electroforming, and then the sacrificial layer 12 is removed by etching, The cantilever-like probe 2 and the crank-type elastic connection pin 5b having a fine dimension of the area array can be manufactured. Thereby, even if the electrode interval of a chip device is very small, it is possible to provide a double elastic mechanism probe card 1 that can perform performance test measurement correspondingly.

  Also, the double elastic mechanism probe card 1 is manufactured by repeatedly performing lithography and electroforming a plurality of cantilevered probes 2 on the electrode 11a of the probe module substrate 3 having the internal wiring 3a connecting the electrodes 11a and 11b. A plurality of crank-type elastic connection pins 5b corresponding to each cantilever probe 2 are repeatedly formed on the electrode 11b on the other surface of the probe module substrate 3 by lithography and electroforming. Then, the sacrificial layer 12 is removed by etching to form a plurality of cantilevered probes 2 on the probe module substrate 3 (FIG. 6b (1)). 2)) Next, the plurality of probe module boards 3 are fixed to the circuit board 6 with the bonding solder layer 13 via the crank-type elastic connection pins 5b. Then, the sacrificial layer 12 of the crank-type elastic connection pin 5b is removed by etching, whereby a plurality of cantilever probes 2 are connected to the circuit board 6 via the crank-type elastic connection pin 5b. A double elastic mechanism probe card 1 to which a plurality of probe module substrates 3 having the above are fixed can be manufactured (FIG. 6b (4)).

  In a semiconductor wafer, the present invention can be used particularly for a probe card used for electric characteristic inspection of a highly integrated chip device.

It is embodiment of the double elastic mechanism probe card concerning this invention, Comprising: (a) is typical sectional drawing of the probe card with which the probe module board was attached to the probe board via the elastic connection pin, (b) is ( It is a typical enlarged view of the A section of a). It is another embodiment of the double elastic mechanism probe card according to the present invention, and is a schematic cross-sectional view of a probe card in which spring-like connection pins are interposed between the circuit board and the probe board. It is another embodiment of the double elastic mechanism probe card according to the present invention, and is a schematic cross-sectional view of a probe card in which a probe module board is attached to a circuit board via elastic connection pins. FIG. 2 is a schematic plan view of a probe board in which a probe module board is mounted on a probe board, which is an embodiment of a double elastic mechanism probe card according to the present invention. It is embodiment of the manufacturing method of the double elastic mechanism probe card concerning this invention, Comprising: (a) is schematic explanatory drawing of the method of mounting a relay connection pin in a probe board, (b) mounts a probe on a probe module board It is a schematic explanatory drawing of the method to do. The embodiment of the method for manufacturing a double elastic mechanism probe card according to the present invention is a method for forming a probe card, wherein (a) is a schematic sectional view of the probe card according to the present method, and (b) is a probe card formed. It is a schematic explanatory drawing of the method to do. It is an example of the conventional probe card, Comprising: It is typical sectional drawing of a probe card.

Explanation of symbols

1: Probe card 2: Probe 2a: Probe terminal 3: Probe module substrate 3a: Internal wiring 3b: Internal wiring 4: Probe unit 4a: Probe substrate 4b: Internal wiring 5: Connection pin 5a: Cantilevered elastic connection pin 5b : Crank-type elastic connection pin 5c: Connection pin terminal 6: Circuit board 6a: Tester connection terminal 7: Reinforcing plate
8: Relay connection pin 8a: Cantilever connection pin 8b: Spring connection pin 8c: Connection pin terminal
9: Hanging tool 10: Positioning pin 11a, b: Electrode 12: Sacrificial layer 13: Solder layer for bonding
15: Pin cover 16: Support body 17: Support bolt 21: Probe card 22: Probe 23: Probe board 23a: Connection terminal 24: Circuit board 24a: Tester connection terminal 25: Relay connection pin 25a: Connection terminal 26: Reinforcement plate 27 : Support 28: Support bolt 30: Semiconductor wafer 31: Wafer mounting table

Claims (7)

A circuit board and a probe board arranged on one surface side of the circuit board and having a plurality of probe module boards formed with a plurality of cantilever probes at predetermined positions arranged in a plurality of rows and columns on the surface, the circuit A plurality of relay connection pins electrically connected to each other between the substrate and the probe substrate, wherein the probe module substrate is supported from the probe substrate by a suspension point and between the probe substrate and the probe substrate. A double elastic mechanism probe card, characterized in that an elastic connection pin for electrical connection is provided. A circuit board and a plurality of rows and columns arranged on one side of the circuit board, a probe module board having a plurality of cantilever probes formed at predetermined positions, and arranged on the other side of the circuit board; A reinforcing plate that suppresses the entire deformation of the probe card, and the probe module substrate is supported by a suspension point from the reinforcing plate and is provided with an elastic connection pin that is electrically connected to the circuit board. Features a double elastic probe card. A circuit board; a probe module board arranged in a plurality of rows and a plurality of columns on one surface side of the circuit board; and a plurality of cantilever probes formed at predetermined positions on the surface; the probe module board and the circuit board; A double elastic mechanism probe card, wherein the elastic connection pin is fixedly connected to the probe module substrate and the circuit board. The ratio (K ₁ / K ₂ ) of the spring constant (K ₂ ) of the elastic connecting pin corresponding to the cantilever probe spring constant (K ₁ ) is in the range of 0.5 to 1.5. The double elastic mechanism probe card according to claim 1, 2 or 3. 5. The double elastic mechanism probe card according to claim 1, wherein the plurality of cantilever probes are formed on the electrodes of the probe module substrate by repeated execution of lithography and electroforming, and then sacrificed. A method of manufacturing a double elastic mechanism probe card, wherein a cantilever probe is manufactured on a probe module substrate by a method of removing a layer by etching. The double elastic mechanism probe card according to any one of claims 1 to 4, wherein the plurality of elastic connection pins are formed on the electrodes of the probe substrate or the probe module substrate by repeated execution of lithography and electroforming, Next, a method for manufacturing a double elastic mechanism probe card, wherein the elastic connection pin is manufactured on the probe substrate or the probe module substrate by a method of removing the sacrificial layer by etching. 6. The method of manufacturing a double elastic mechanism probe card according to claim 5, wherein the plurality of cantilever probes are provided on the electrodes of the probe module substrate together with a sacrificial layer by repeated execution of lithography and electroforming. Then, according to the method for manufacturing a double elastic mechanism probe card according to claim 6, a plurality of crank type elastic connection pins are sacrificed on the electrodes on the other surface of the probe module substrate by repeated execution of lithography and electroforming. A double elastic mechanism probe card is formed by removing the sacrificial layer after fixing the plurality of probe module substrates to the circuit board via the crank-type elastic connection pins. A method of manufacturing a double elastic mechanism probe card.

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