CN220288539U - Semiconductor wafer thickness detection mechanism - Google Patents
Semiconductor wafer thickness detection mechanism Download PDFInfo
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- CN220288539U CN220288539U CN202321415018.9U CN202321415018U CN220288539U CN 220288539 U CN220288539 U CN 220288539U CN 202321415018 U CN202321415018 U CN 202321415018U CN 220288539 U CN220288539 U CN 220288539U
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- 238000001514 detection method Methods 0.000 title claims abstract description 49
- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
- 238000013016 damping Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 abstract description 6
- 239000013078 crystal Substances 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 68
- 238000005259 measurement Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000007779 soft material Substances 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a semiconductor wafer thickness detection mechanism which comprises a bottom plate, wherein a side plate is fixedly arranged on one side of the top of the bottom plate, a placing table is arranged in the middle of the top of the bottom plate, a supporting plate is fixedly arranged in the middle of the top of the side plate, an air cylinder is arranged above the bottom plate, and a fixing plate is fixedly arranged at the bottom of the air cylinder. In the using process, the semiconductor wafer thickness detection mechanism can effectively position and fix the wafer, avoids the phenomenon that the position of the semiconductor crystal is manually adjusted on the detection table and detected, and the position error of manual positioning adjustment is large and is difficult to ensure the accuracy and effectiveness of the result of the measured position, and meanwhile, if the detection mechanism operates and vibrates in the measuring process, the position of the wafer is possibly deviated, and the position of the wafer needs to be readjusted by personnel, so that the detection efficiency and the practicability of the detection mechanism are reduced, and the detection efficiency and the practicability of the mechanism are improved.
Description
Technical Field
The utility model relates to the technical field of semiconductor detection equipment, in particular to a semiconductor wafer thickness detection mechanism.
Background
The semiconductor refers to a material with conductivity between a semiconductor and an insulator at normal temperature, and the semiconductor is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, and in the preparation process of a semiconductor wafer, a mechanical method is often adopted to cut the semiconductor, and rough grinding, fine grinding and chemical and mechanical polishing are carried out on the surface of the cut wafer, so that the epitaxial requirement is met, wherein one detection is that a detection mechanism is required to detect the thickness of the surface of the semiconductor wafer.
In the actual operation process of personnel operation detection mechanism, current semiconductor thickness detection mechanism is usually the manual work with semiconductor crystal place on the detection bench adjustment position and detect in the use, receive the mode influence of manual adjustment, the result that can exist manual positioning adjustment is great to be difficult to guarantee the measurement position is accurate effective probably, if detection mechanism moves and shakes in the measurement process simultaneously, can make the wafer position take place to skew, need personnel readjust the position to reduce detection mechanism's detection efficiency, initiated detection mechanism's practicality and reduced. For this purpose, we propose a semiconductor wafer thickness detection mechanism.
Disclosure of Invention
The utility model aims to solve the defects in the prior art and provides a semiconductor wafer thickness detection mechanism.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a semiconductor wafer thickness detection mechanism, includes the bottom plate, top one side fixed mounting of bottom plate has the curb plate, the top mid-mounting of bottom plate has the platform of placing, the top mid-mounting of curb plate has the backup pad, the bottom plate top is equipped with the cylinder, the bottom fixed mounting of cylinder has the fixed plate, the both sides of fixed plate are provided with a clamping assembly respectively, the bottom fixedly connected with support column of fixed plate, the bottom fixed mounting of support column has the mounting panel, the bottom mid-mounting of mounting panel has laser thickness gauge.
Preferably, the clamping assembly comprises connecting rods arranged on two sides of the fixing plate, the connecting rods are L-shaped, one end of each connecting rod, far away from the fixing plate, is fixedly provided with a first toothed plate, one side of each first toothed plate is connected with a gear through latch meshing, one side of each gear is fixedly provided with a mounting rod, the other end of each mounting rod is rotationally connected with one side of each side plate through a shaft sleeve, and one end of each connecting rod is fixedly connected with one side of each fixing plate.
Preferably, the clamping assembly further comprises two limiting plates symmetrically arranged on one side of the top of the bottom plate, the bottom of the gear is connected with a second toothed plate through latch meshing, two sliding blocks are fixedly arranged on two sides of the second toothed plate, sliding grooves matched with the sliding blocks are formed in one sides, close to the placing table, of the second toothed plate, a connecting plate is fixedly arranged on one side, close to the placing table, of the second toothed plate, a first damping rod is fixedly arranged on one side, far away from the second toothed plate, of the connecting plate, a clamping plate is fixedly arranged on the other end of the first damping rod, a first spring is sleeved on the outer portion of the first damping rod, two ends of the first spring are fixedly connected with one sides, close to the clamping plate and the connecting plate, of the limiting plate and the top of the bottom plate respectively.
Preferably, the bottom four corners department of mounting panel is all fixed mounting has the second damping pole, and a plurality of the bottom of second damping pole is all fixed mounting has the backing plate, the outside cover of second damping pole is equipped with the second spring, the both ends of second spring respectively with mounting panel bottom and the top fixed connection of backing plate.
Preferably, the backup pad is the type of falling L, the one end lateral wall fixed mounting of backup pad has the scale, one side fixed mounting that the fixed plate is close to the scale has the pointer, cylinder top and backup pad one end lateral wall bottom fixed mounting.
Preferably, the four corners of the bottom plate are fixedly connected with supporting legs.
The utility model provides a semiconductor wafer thickness detection mechanism, which has the beneficial effects that:
1. the starting cylinder descends and drives the connecting rods on two sides of the fixed plate to descend, so that the connecting rods drive the first toothed plate to descend, the first toothed plate drives the gears to rotate through the clamping teeth on one side during descending movement, the second toothed plate at the bottom is driven to displace through rotation of the gears, the second toothed plate drives the connecting plates to displace, then the connecting plates drive the clamping plates to displace towards the placing table through the first damping rods and the first springs and clamp wafers, after the laser thickness gauge detection is completed, the starting cylinder ascends back, the connecting rods and the first toothed plate can be driven to move upwards through the fixed plates, the gears and the second toothed plate are driven to return through the clamping teeth, the clamping plates are driven to return to release the clamping state on the sides of the wafers, clamping limit is achieved on the sides of the semiconductor wafers, the wafers are prevented from being offset due to mechanical vibration during detection, and the detection efficiency and the practicality of the mechanism are improved.
2. The air cylinder can drive the mounting plate to descend when descending, the base plate is contacted with the semiconductor wafer and props against the top of the wafer, the base plate is made of soft materials, the flexibility of the base plate when propping against the wafer can be increased, meanwhile, the second damping rod and the second spring can absorb the impact force of descending and extruding the wafer, people can observe the distance that the air cylinder drives the fixing plate to vertically descend through the graduated scale and the pointer, the air cylinder is controlled to adjust the descending distance, the base plate is prevented from descending too much to extrude the semiconductor wafer to damage the semiconductor wafer, the clamping force of the clamping plate on the semiconductor wafer can be controlled, the semiconductor wafer is prevented from being damaged due to too strong clamping of the clamping plate, the top of the wafer is propped against and the wafer cannot be damaged, the wafer is prevented from being offset due to mechanical vibration during detection, the position of the wafer is also positioned, the position adjustment of people is not needed, and the detection accuracy is improved.
Drawings
FIG. 1 is a schematic diagram of a mechanism for detecting thickness of a semiconductor wafer according to the present utility model;
FIG. 2 is a schematic diagram showing a structure of a connecting rod of a semiconductor wafer thickness detecting mechanism according to the present utility model;
FIG. 3 is a schematic diagram of a laser thickness gauge of a semiconductor wafer thickness detection mechanism according to the present utility model;
fig. 4 is a schematic structural view of a slider of a semiconductor wafer thickness detecting mechanism according to the present utility model.
In the figure: 1. a bottom plate; 2. a support plate; 3. a side plate; 4. a graduated scale; 5. a cylinder; 6. a fixing plate; 7. a connecting rod; 8. a first toothed plate; 9. a limiting plate; 10. a gear; 11. a mounting rod; 12. a second toothed plate; 13. a connecting plate; 14. a clamping plate; 15. a first damping rod; 16. a first spring; 17. a support column; 18. a mounting plate; 19. a laser thickness gauge; 20. a second damping rod; 21. a second spring; 22. a backing plate; 23. a sliding block.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Referring to fig. 1-4, a semiconductor wafer thickness detection mechanism comprises a bottom plate 1, a side plate 3 is fixedly arranged on one side of the top of the bottom plate 1, a placing table is arranged in the middle of the top of the bottom plate 1, a supporting plate 2 is fixedly arranged in the middle of the top of the side plate 3, an air cylinder 5 is arranged above the bottom plate 1, a fixing plate 6 is fixedly arranged at the bottom of the air cylinder 5, clamping assemblies are respectively arranged on two sides of the fixing plate 6, a supporting column 17 is fixedly connected to the bottom of the fixing plate 6, a mounting plate 18 is fixedly arranged at the bottom of the supporting column 17, and a laser thickness gauge 19 is fixedly arranged in the middle of the bottom of the mounting plate 18.
The clamping assembly comprises connecting rods 7 arranged on two sides of a fixed plate 6, the connecting rods 7 are L-shaped, one ends of the connecting rods 7 far away from the fixed plate 6 are fixedly provided with first toothed plates 8, one sides of the first toothed plates 8 are connected with gears 10 through latch meshing, one sides of the gears 10 are fixedly provided with mounting rods 11, the other ends of the mounting rods 11 are rotatably connected with one sides of the side plates 3 through shaft sleeves, one ends of the connecting rods 7 are fixedly connected with one sides of the fixed plate 6, through the arrangement of the gears 10, the air cylinders 5 are then driven to descend by the fixed plates 6, the connecting rods 7 on two sides of the fixed plate 6 are also driven to descend, so that the connecting rods 7 drive the first toothed plates 8 to descend, the gears 10 are driven to rotate through latches on one side during the descending of the first toothed plates 8, the second toothed plates 12 are driven to move through the rotation of the gears 10, the second toothed plates 12 are driven to move by the second toothed plates 13, the connecting plates 13 are then driven to move towards the placing table through first damping rods 15 and first springs 16, the semiconductor wafer sides on the top of the placing table are clamped, the wafer is prevented from being mechanically deflected when the wafer is detected, the wafer is prevented from being detected to be subjected to mechanical deflection to be detected, and the wafer is then driven to lift the first toothed plates 6 to lift the first toothed plates and the wafer is driven to move through the first toothed plates 12 through the first toothed plates and the corresponding plates 12, and then the wafer is completely driven to be clamped by the wafer to be clamped by the clamping plates 6.
The clamping assembly further comprises two limiting plates 9 symmetrically arranged on one side of the top of the bottom plate 1, the bottom of the gear 10 is connected with a second toothed plate 12 through latch meshing, two sides of the second toothed plate 12 are fixedly provided with sliding blocks 23, one sides of the two limiting plates 9, which are close to each other, are provided with sliding grooves matched with the sliding blocks 23, one side of the second toothed plate 12, which is close to the placing table, is fixedly provided with a connecting plate 13, one side, which is far away from the second toothed plate 12, of the connecting plate 13 is fixedly provided with a first damping rod 15, the other end of the first damping rod 15 is fixedly provided with a clamping plate 14, the outer part of the first damping rod 15 is sleeved with a first spring 16, two ends of the first spring 16 are fixedly connected with one side, which is close to the clamping plate 14 and the connecting plate 13, of the limiting plates 9 are fixedly arranged on the top of the bottom plate 1, the clamping plate 14 is driven by the first spring 16 and the first damping rod 15, so that the clamping plates 14 can clamp the side of a wafer through the first spring 16 and the first damping rod 15 when the connecting plate 13 moves, the clamping plate 14 can be absorbed by the clamping plates, and the wafer can not be damaged at the same time.
The bottom four corners department of mounting panel 18 all fixed mounting has second damping pole 20, the bottom of a plurality of second damping poles 20 is all fixed mounting has backing plate 22, the outside cover of second damping pole 20 is equipped with second spring 21, the both ends of second spring 21 respectively with the top fixed connection of mounting panel 18 bottom and backing plate 22, through the setting of second damping pole 20, second spring 21 and backing plate 22, when making cylinder 5 drive fixed plate 6 decline and drive mounting panel 18 decline, backing plate 22 contacts with the semiconductor wafer and supports the wafer, because backing plate 22 is soft material can increase the flexibility when supporting the wafer, simultaneously second damping pole 20 and second spring 21 can absorb the impulsive force that descends the extrusion wafer, thereby reach the top to the wafer and support, prevent that the wafer from receiving mechanical vibration and taking place the skew when detecting.
The backup pad 2 is the type of falling L, backup pad 2's one end lateral wall fixed mounting has scale 4, one side fixed mounting that fixed plate 6 is close to scale 4 has the pointer, cylinder 5 top and backup pad 2 one end lateral wall bottom fixed mounting, through the setting of scale 4 and pointer, make things convenient for personnel to observe the distance that cylinder 5 drove fixed plate 6 vertical drop, and control cylinder 5 adjusts the distance that descends, prevent backing plate 22 decline too many semiconductor wafer extrusion too hard and damage, also can control the clamping dynamics of grip block 14 to semiconductor wafer, prevent grip block 14 centre gripping too hard and damage semiconductor wafer, wherein cylinder 5 and laser thickness gauge 19 are all connected through external control ware and power, for prior art, unnecessary description here.
The bottom four corners department of bottom plate 1 all fixedly connected with supporting leg, through the setting of supporting leg, increase the holistic steadiness of detection mechanism.
The use principle and the advantages are that: in the use process of the scheme, when a person uses the detection mechanism, the person places a wafer on the placement table, the air cylinder 5 is started to descend, the air cylinder 5 drives the fixed plate 6 to descend, the connecting rods 7 at two sides of the fixed plate 6 are driven to descend, so that the connecting rods 7 drive the first toothed plate 8 to descend, the gear 10 is driven to rotate through the clamping teeth at one side when the first toothed plate 8 descends and moves, the second toothed plate 12 at the bottom is driven to displace through the rotation of the gear 10, the second toothed plate 12 drives the connecting plate 13 to displace, the connecting plate 13 drives the clamping plate 14 to displace towards the placement table through the first damping rod 15 and the first spring 16 and clamps the wafer, after the detection of the laser thickness gauge 19 is completed, the air cylinder 5 is started to ascend, the connecting rods 7 and the first toothed plate 8 are driven to move upwards through the fixed plate 6, the clamping state of the side edges of the wafer is further driven to be released through the clamping plate 14, the side edges of the wafer are limited, the wafer is prevented from being subjected to mechanical vibration during the detection, and the detection efficiency and the practicality of the mechanism is improved.
The air cylinder 5 descends and drives the mounting plate 18 to descend, the base plate 22 is contacted with the semiconductor wafer and props against the top of the wafer, the base plate 22 is made of soft materials, the flexibility of the supporting wafer can be improved, meanwhile, the second damping rod 20 and the second spring 21 can absorb the impact force of descending and extruding the wafer, personnel can observe the distance that the air cylinder 5 drives the fixing plate 6 to vertically descend through the graduated scale 4 and the pointer conveniently, the descending distance is controlled by the air cylinder 5, the base plate 22 is prevented from descending too much to extrude the semiconductor wafer too hard to damage, the clamping force of the clamping plate 14 on the semiconductor wafer can be controlled, the supporting of the top of the wafer is prevented from damaging the wafer, the wafer is prevented from being deviated due to mechanical vibration during detection, the position of the wafer is also positioned without personnel adjustment, and the detection accuracy is improved.
To sum up: this semiconductor wafer thickness detection mechanism can fix a position and fix the wafer effectively, has avoided the manual work to place the semiconductor crystal and has adjusted the position and detect on detecting the bench, and there is the great result that is difficult to guarantee the measurement position of manual positioning adjustment that probably exists, and simultaneously in the measurement process if detection mechanism moves and shakes, can make the wafer position take place to skew, needs personnel readjust the position, leads to reducing the phenomenon of detection efficiency and detection mechanism practicality to promote the practicality of detection efficiency and mechanism.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (6)
1. The utility model provides a semiconductor wafer thickness detection mechanism, includes bottom plate (1), its characterized in that, top one side fixed mounting of bottom plate (1) has curb plate (3), the top mid-mounting of bottom plate (1) has the platform of placing, the top mid-mounting of curb plate (3) has backup pad (2), bottom plate (1) top is equipped with cylinder (5), the bottom fixed mounting of cylinder (5) has fixed plate (6), the both sides of fixed plate (6) are provided with a clamping assembly respectively, the bottom fixedly connected with support column (17) of fixed plate (6), the bottom fixed mounting of support column (17) has mounting panel (18), the bottom mid-mounting of mounting panel (18) has laser thickness gauge (19).
2. The semiconductor wafer thickness detection mechanism according to claim 1, wherein the clamping assembly comprises connecting rods (7) arranged on two sides of the fixed plate (6), the connecting rods (7) are L-shaped, one ends of the connecting rods (7) away from the fixed plate (6) are fixedly provided with first toothed plates (8), one sides of the first toothed plates (8) are connected with gears (10) through latch meshing, one sides of the gears (10) are fixedly provided with mounting rods (11), the other ends of the mounting rods (11) are rotatably connected with one sides of the side plates (3) through shaft sleeves, and one ends of the connecting rods (7) are fixedly connected with one sides of the fixed plate (6).
3. The semiconductor wafer thickness detection mechanism according to claim 2, wherein the clamping assembly further comprises two limiting plates (9) symmetrically arranged on one side of the top of the bottom plate (1), the bottom of the gear (10) is connected with a second toothed plate (12) through latch meshing, two sides of the second toothed plate (12) are fixedly provided with sliding blocks (23), two sides of the limiting plates (9) close to each other are provided with sliding grooves matched with the sliding blocks (23), one side of the second toothed plate (12) close to the placing table is fixedly provided with a connecting plate (13), one side of the connecting plate (13) away from the second toothed plate (12) is fixedly provided with a first damping rod (15), the other end of the first damping rod (15) is fixedly provided with a clamping plate (14), two ends of the first damping rod (16) are fixedly connected with one side of the clamping plate (14) and the connecting plate (13) close to each other respectively, and the other side of the limiting plates (9) close to each other is fixedly provided with a first spring (16).
4. The semiconductor wafer thickness detection mechanism according to claim 1, wherein second damping rods (20) are fixedly installed at four corners of the bottom of the mounting plate (18), backing plates (22) are fixedly installed at the bottoms of a plurality of the second damping rods (20), second springs (21) are sleeved outside the second damping rods (20), and two ends of each second spring (21) are fixedly connected with the bottoms of the mounting plate (18) and the tops of the backing plates (22) respectively.
5. The semiconductor wafer thickness detection mechanism according to claim 1, wherein the support plate (2) is of an inverted-L shape, a graduated scale (4) is fixedly arranged on one end side wall of the support plate (2), a pointer is fixedly arranged on one side, close to the graduated scale (4), of the fixed plate (6), and the top of the air cylinder (5) is fixedly arranged at the bottom of one end side wall of the support plate (2).
6. A semiconductor wafer thickness detection mechanism according to claim 1, wherein support legs are fixedly connected to four corners of the bottom of the base plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321415018.9U CN220288539U (en) | 2023-06-06 | 2023-06-06 | Semiconductor wafer thickness detection mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321415018.9U CN220288539U (en) | 2023-06-06 | 2023-06-06 | Semiconductor wafer thickness detection mechanism |
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| Publication Number | Publication Date |
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| CN220288539U true CN220288539U (en) | 2024-01-02 |
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| CN202321415018.9U Active CN220288539U (en) | 2023-06-06 | 2023-06-06 | Semiconductor wafer thickness detection mechanism |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117781988A (en) * | 2024-02-27 | 2024-03-29 | 中国科学院长春光学精密机械与物理研究所 | Detection device for detecting thickness of semiconductor wafer |
-
2023
- 2023-06-06 CN CN202321415018.9U patent/CN220288539U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117781988A (en) * | 2024-02-27 | 2024-03-29 | 中国科学院长春光学精密机械与物理研究所 | Detection device for detecting thickness of semiconductor wafer |
| CN117781988B (en) * | 2024-02-27 | 2024-05-14 | 中国科学院长春光学精密机械与物理研究所 | Detection device for detecting thickness of semiconductor wafer |
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