CN212675096U

CN212675096U - Chip packaging quality testing device

Info

Publication number: CN212675096U
Application number: CN202021193054.1U
Authority: CN
Inventors: 姚继兴
Original assignee: Foshan Weipeng Electronic Technology Co ltd
Current assignee: Foshan Weipeng Electronic Technology Co ltd
Priority date: 2020-06-24
Filing date: 2020-06-24
Publication date: 2021-03-09
Anticipated expiration: 2030-06-24

Abstract

The utility model discloses a chip packaging quality testing arrangement, including base, loading board, mounting bracket and buffer gear, the shifting chute has been seted up on the surface of base, there is step motor through the bolt fastening on the left side outer wall of base, step motor's output welded fastening has the mobile screw rod, the mobile screw rod extends to the shifting chute on the base in, threaded connection has the guide block on the outer wall of mobile screw rod, the top of guide block has the loading board through the bolt fastening, there is the mounting bracket through the bolt fastening on the both sides outer wall around the base, the diaphragm bottom of mounting bracket is fixed with two sets of electric telescopic handle through the bolt symmetry, electric telescopic handle's bottom has the connecting plate through the bolt fastening, the bottom four corners of connecting plate has four group buffer gear through the bolt fastening. This chip package quality testing device not only can protect the chip, can also test the multiunit chip simultaneously, improves the efficiency of software testing of chip.

Description

Chip packaging quality testing device

Technical Field

The utility model belongs to the technical field of the chip detects, concretely relates to chip packaging quality testing arrangement.

Background

The electronic chip is a miniature electronic device or component, and is made up by adopting a certain technological process to make the components of transistor, resistor, capacitor and inductor, etc. required in a circuit and wiring interconnection together, and make them be made into a small piece or several small pieces of semiconductor wafer or medium substrate, then package them in a tube shell so as to obtain the miniature structure with required circuit function.

The semiconductor chip detection device is mainly applied to the test of semiconductor industry, photoelectric industry, integrated circuits and packaging. The method is widely applied to the research and development of precise electrical measurement of complex and high-speed devices, and aims to ensure the quality and reliability of the devices and reduce the research and development time and the cost of the device manufacturing process. In the chip detection device in the prior art, in the detection process, a chip is placed on the object placing plate, the probe is in contact with the chip, certain acting force is applied, and the chip is small in size and small in stress, so that the chip is easily damaged, the yield of products is reduced, and the cost is high.

Therefore, in view of the current situation, it is urgently needed to design and produce a chip packaging quality testing device to meet the requirements of practical use.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a chip package quality testing device to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a chip packaging quality testing device comprises a base, a bearing plate, a mounting rack and a buffer mechanism, four groups of supporting legs are fixed at four corners of the bottom of the base through bolts, a moving groove is arranged on the surface of the base, a stepping motor is fixed on the outer wall of the left side of the base through a bolt, a movable screw rod is fixed at the output end of the stepping motor in a welding way, the movable screw rod extends into a movable groove on the base, a guide block is connected with the outer wall of the movable screw rod in a threaded manner, the guide block moves in a moving groove on the base, a bearing plate is fixed at the top of the guide block through a bolt, the outer walls of the front side and the rear side of the base are fixed with a mounting rack through bolts, the bottom of a transverse plate of the mounting rack is symmetrically fixed with two groups of electric telescopic rods through bolts, the bottom of the electric telescopic rod is fixedly provided with a connecting plate through bolts, and four groups of buffer mechanisms are fixedly arranged at four corners of the bottom of the connecting plate through bolts.

Preferably, a fixing plate is fixed at the bottom of the buffer mechanism through a bolt, and a plurality of groups of probes are installed at the bottom of the fixing plate at equal intervals.

Preferably, buffer gear includes buffer sleeve and cushion column, sliding connection has the limiting plate in the buffer sleeve, and the bottom welded fastening of limiting plate has the cushion column, the cushion column extends to buffer sleeve's below, the outside cover of cushion column is equipped with buffer spring, buffer spring bonds through glue and is fixed with in buffer sleeve's bottom.

Preferably, step motor's outside cover is equipped with the protection casing, the protection casing passes through the bolt fastening on the left side outer wall of base, the radiating groove has been seted up on the protection casing, there is the dust screen through the bolt fastening in the radiating groove of protection casing.

Preferably, the right end face of the movable screw is rotatably connected with the base through a welded bearing, and a plurality of groups of placing grooves are formed in the surface of the bearing plate at equal intervals.

Preferably, the vertical plate of the mounting frame is provided with a sliding groove, sliding blocks are fixed on the outer walls of the front side and the rear side of the connecting plate through bolts, and the sliding blocks on the connecting plate slide in the sliding grooves in the vertical plate of the mounting frame.

The utility model discloses a technological effect and advantage: according to the chip packaging quality testing device, through the arrangement of the buffering device, when the probe tests the chip, the buffering column extrudes the buffering spring and is recycled into the buffering sleeve, so that the probe is buffered to a certain extent, and the damage to the chip caused by overlarge contact force between the probe and the chip is avoided; the movable screw rod is driven to rotate by the stepping motor, so that the bearing plate is driven to move on the surface of the base, after a group of chips are tested, the lower part of the other group of chips is tested, the multi-group chips can be tested at one time, the testing efficiency of the chips is improved, the chip packaging quality testing device can protect the chips, the multi-group chips can be tested simultaneously, and the testing efficiency of the chips is improved.

Drawings

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a cross-sectional view of the present invention;

fig. 3 is a sectional view of the buffer mechanism of the present invention.

In the figure: the device comprises a base 1, a stepping motor 2, a movable screw rod 3, a protective cover 4, a guide block 5, a bearing plate 6, an installation rack 7, an electric telescopic rod 8, a connecting plate 9, a buffer mechanism 10, a fixing plate 11, a probe 12, a buffer sleeve 13, a buffer column 14 and a buffer spring 15.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Unless the direction is defined separately, the directions of up, down, left, right, front, back, etc. referred to herein are the directions of up, down, left, right, front, back, etc. in the drawings of the present invention, and are herein incorporated by reference.

The utility model provides a chip package quality testing arrangement as shown in fig. 1-3, including base 1, loading board 6, mounting bracket 7 and buffer gear 10, there are four supporting legs in the bottom four corners of base 1 through the bolt fastening, the shifting chute has been seted up on base 1's surface, there is step motor 2 through the bolt fastening on base 1's the left side outer wall, step motor 2's model optional does: 86BYG double-phase step motor, step motor 2's output welded fastening has removal screw rod 3, remove in screw rod 3 extends to the shifting chute on the base 1, threaded connection has guide block 5 on the outer wall of removal screw rod 3, the removal inslot of guide block 5 on the base 1 removes, there is loading board 6 at the top of guide block 5 through the bolt fastening, there is mounting bracket 7 through the bolt fastening on the outer wall of both sides around the base 1, there are two sets of electric telescopic handle 8 diaphragm bottom of mounting bracket 7 through the bolt symmetry fastening, electric telescopic handle 8's model can select to be: the TGA-200, the bottom of electric telescopic handle 8 is fixed with connecting plate 9 through the bolt, four groups of buffer gear 10 are fixed with the bottom four corners of connecting plate 9 through the bolt.

Specifically, the bottom of the buffer mechanism 10 is fixed with a fixing plate 11 through a bolt, a plurality of groups of probes 12 are installed at the bottom of the fixing plate 11 at equal intervals, and the plurality of groups of probes 12 are electrically connected with an external display, so that a test result of the probes 12 is displayed.

Specifically, buffer gear 10 includes buffer sleeve 13 and buffering post 14, sliding connection has the limiting plate in the buffer sleeve 13, and the bottom welded fastening of limiting plate has buffering post 14, buffering post 14 extends to the below of buffer sleeve 13, the outside cover of buffering post 14 is equipped with buffer spring 15, buffer spring 15 bonds through glue and is fixed with the bottom at buffer sleeve 13.

Specifically, step motor 2's outside cover is equipped with protection casing 4, protection casing 4 passes through the bolt fastening on the left side outer wall of base 1, the radiating groove has been seted up on protection casing 4, there is the dust screen through the bolt fastening in the radiating groove of protection casing 4.

Specifically, the right end face of the movable screw rod 3 is rotatably connected with the base 1 through a welded bearing, a plurality of groups of placing grooves are formed in the surface of the bearing plate 6 at equal intervals, and the placing grooves in the surface of the bearing plate 6 correspond to the probes 12 in position.

Specifically, the spout has been seted up on the riser of mounting bracket 7, there is the slider through the bolt fastening on the both sides outer wall around connecting plate 9, the slider on the connecting plate 9 slides in the spout on the riser of mounting bracket 7.

The testing device is controlled by an external controller, which can be a computer with control function.

The working principle of the device for testing the packaging quality of the chip is that when the device is used, a chip to be tested is placed in a placing groove on a bearing plate 6, an electric telescopic rod 8 is started through a controller, the electric telescopic rod 8 drives a probe 12 to descend, the probe 12 is enabled to be in contact with the chip in the bearing plate 6, the chip is tested, when the probe 12 is in contact with the chip, a fixing plate 11 extrudes a buffer column 14, the buffer column 14 extrudes a buffer spring 15, the buffer column 14 is recovered into a buffer sleeve 13, so that the probe 12 is buffered to a certain degree, the damage of the chip caused by overlarge contact force between the probe 12 and the chip is avoided, after the chip test is finished, the electric telescopic rod 8 drives the probe 12 to ascend, a stepping motor 2 is started, the stepping motor 2 drives a moving screw rod 3 to rotate, the bearing plate 6 is driven to move on the surface of a base 1, and, the previous testing steps are repeated to test another set of chips.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.

Claims

1. The utility model provides a chip package quality testing arrangement, includes base (1), loading board (6), mounting bracket (7) and buffer gear (10), its characterized in that: four groups of supporting legs are fixed at four corners of the bottom of the base (1) through bolts, a moving groove is formed in the surface of the base (1), a stepping motor (2) is fixed on the outer wall of the left side of the base (1) through bolts, a moving screw (3) is fixed at the output end of the stepping motor (2) in a welding mode, the moving screw (3) extends into the moving groove in the base (1), a guide block (5) is connected to the outer wall of the moving screw (3) in a threaded mode, the guide block (5) moves in the moving groove in the base (1), a bearing plate (6) is fixed at the top of the guide block (5) through bolts, mounting frames (7) are fixed on the outer walls of the front side and the rear side of the base (1) through bolts, two groups of electric telescopic rods (8) are symmetrically fixed at the bottoms of transverse plates of the mounting frames (7) through bolts, and a connecting plate (9) is fixed, four groups of buffer mechanisms (10) are fixed at four corners of the bottom of the connecting plate (9) through bolts.

2. The chip package quality testing device of claim 1, wherein: the bottom of the buffer mechanism (10) is fixed with a fixing plate (11) through a bolt, and a plurality of groups of probes (12) are arranged at the bottom of the fixing plate (11) at equal intervals.

3. The chip package quality testing device of claim 1, wherein: buffer gear (10) are including buffer sleeve (13) and cushion column (14), sliding connection has the limiting plate in buffer sleeve (13), and the bottom welded fastening of limiting plate has buffer column (14), buffer column (14) extend to the below of buffer sleeve (13), the outside cover of buffer column (14) is equipped with buffer spring (15), buffer spring (15) are fixed with the bottom at buffer sleeve (13) through glue bonding.

4. The chip package quality testing device of claim 1, wherein: the outside cover of step motor (2) is equipped with protection casing (4), protection casing (4) pass through the bolt fastening on the left side outer wall of base (1), the radiating groove has been seted up on protection casing (4), there is the dust screen through the bolt fastening in the radiating groove of protection casing (4).

5. The chip package quality testing device of claim 1, wherein: the right end face of the movable screw rod (3) is rotatably connected with the base (1) through a welded bearing, and a plurality of groups of placing grooves are formed in the surface of the bearing plate (6) at equal intervals.

6. The chip package quality testing device of claim 1, wherein: the improved mounting structure is characterized in that a vertical plate of the mounting frame (7) is provided with a sliding groove, sliding blocks are fixed on outer walls of the front side and the rear side of the connecting plate (9) through bolts, and the sliding blocks on the connecting plate (9) slide in the sliding grooves in the vertical plate of the mounting frame (7).