CN105328344A - Laser glue removing device and method for printed circuit board (PCB) of ball grid display structure - Google Patents
Laser glue removing device and method for printed circuit board (PCB) of ball grid display structure Download PDFInfo
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- CN105328344A CN105328344A CN201510778274.8A CN201510778274A CN105328344A CN 105328344 A CN105328344 A CN 105328344A CN 201510778274 A CN201510778274 A CN 201510778274A CN 105328344 A CN105328344 A CN 105328344A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
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Abstract
The invention discloses a laser glue removing device and method for a printed circuit board (PCB) of a ball grid display structure. The laser glue removing device comprises a glue removing mechanism, a pulling mechanism and a storing mechanism. The glue removing mechanism comprises a laser module provided with an image measuring device, a thickness measuring sensing device and a laser device. Material discs positioned with PCBs are placed in the storing mechanism in a vertically-layered mode. The pulling mechanism is used for conveying a machining base plate onto a machining base plate of the glue removing mechanism. The image measuring device is used for measuring the size of the PCBs to conduct image positioning. The thickness measuring sensing device is used for detecting and measuring the coating thickness and the coating range of epoxy resin packaged through a ball grid array (BGA) on the PCBs. The laser device is used for completely removing the epoxy resin of different thicknesses. By means of the technical scheme, the PCBs to be machined can be loaded onto the machining base plate of the glue removing mechanism automatically, so that the laser glue removing efficiency of the PCB of the ball grid display structure is improved.
Description
Technical field:
The present invention relates to the processing technique field of ball bar array architecture PCB, in particular to a kind of laser for ball bar array architecture PCB except adhesive dispenser and method.
Background technology:
Owing to improving along with the epoch, the volume of mobile phone is often all more and more less, and function also variation, as present intelligent mobile phone, but the electronic instrument of precision usually uses down therefore barrier rate will be higher, and not resistance toly to fall, and hand-set host plate is all utilize BGA package technology now.
Ball form encapsulation (BallGridArray, BGA, also referred to as the encapsulation of tin ball array or tin pin packaging body), BGA package technology is often applied to the encapsulation field of the large scale integrated circuit such as internal memory, hand-set host board chip group of mobile computer, and the feature of BGA package technology has: although I/O number of lead wires increases, but wire pitch is not little, thus improve assembling yield; Although power increases, BGA can improve electric heating property; Concentration and weight encapsulation technology all than before reduces to some extent, and signal transmission delay is little, and frequency of utilization promotes greatly, and reliability is high, but BGA package still takies the larger problem of substrate area.
In prior art, often utilize epoxy resin to reach fixing effect in BGA package technology, and epoxy resin is thermosetting plastics, just can fast epoxy resin need be removed by high temperature, but temperature is too high can destroy Mobile phone PCB, so when mobile phone break down send repair time, often to manually the epoxy resin on BGA is struck off, this processing mode often causes tin ball to be scraped in abrading process, or around finding is struck off, cause electronic building brick to be damaged, and the spended time manually struck off also comparatively Chang Rongyi cause fatigue.
In order to solve the problems of the technologies described above, application number is that the patent of invention of CN201110437631.6 utilizes laser to be removed by the epoxy resin in the BGA package of pcb board, and utilize comparing in database, find out the heat resisting temperature that tin ball is relative, avoid laser damage tin ball, and utilize laser to be removed by epoxy resin faster, and the laser improving maintenance pcb board yield removes adhesive process.
Summary of the invention:
Technical problem solved by the invention: how automatically pcb board to be processed to be loaded on the processing platform of laser except adhesive dispenser.
For solving the problems of the technologies described above, the invention provides following technical scheme:
Laser for ball bar array architecture PCB removes an adhesive dispenser, comprises except gluing mechanism, La Liao mechanism, accommodating mechanism;
Described frame plate is set except gluing mechanism comprises for about a pair, is arranged on processing base plate, the crossbeam across pair of frame plate, the laser module be arranged on crossbeam between pair of frame plate; Described pair of frame plate is provided with Y-direction slideway, and described crossbeam is provided with X to slideway, and the both ends of described crossbeam are slidably fitted on the Y-direction slideway of pair of frame plate, and described laser module is slidably fitted in the X of crossbeam on slideway; Described laser module comprises eikonometry device, Thickness Measurement by Microwave induction installation, laser aid;
Described accommodating mechanism comprises support, containing box, a pair elevating mechanism;
Described support is provided with a pair limiting plate, and limiting plate is angle bar shape, and limiting plate is vertically arranged on support, and a pair limiting plate is positioned at the left and right sides of support;
Described containing box is rectangular-shaped, and containing box comprises pair of side plates, connects the top board of pair of side plates; Pair of side plates is provided with multipair parting bead, is arbitraryly arranged in opposite directions in pair of side plates the parting bead of two in parting bead, arbitrary contour to the parting bead of two in parting bead, multipair parting bead with from bottom to up be set in sequence in pair of side plates; Arbitraryly be placed with charging tray on parting bead, the front side of charging tray be provided with cylindrically by draw piece, be positioned with pcb board in described charging tray;
Described a pair elevating mechanism is arranged on the both sides of support, each elevating mechanism comprises rack-mount bearing, be articulated on bearing and the threaded rod vertically arranged, the servomotor connected with threaded rod, and the lift block that is spirally connected of threaded rod; The gathering sill moved towards up and down offered by described bearing, and described lift block is slidably fastened in the gathering sill of elevating mechanism;
Described containing box is placed on a pair lift block, and a pair vertical seamed edge of the rear end face both sides of containing box is close on limiting plate;
Described La Liao mechanism is positioned at the front of accommodating mechanism; Described La Liao mechanism comprises draws material frame platform, is slidably fitted in and draws drawing material module, be arranged on and draw on material frame platform for driving the drive unit drawing material module level to move back and forth, a pair charging tray guide rail be arranged on the table top drawing material frame platform on the table top of material frame platform; Described material module of drawing is between a pair charging tray guide rail, draw material module to comprise to be slidably fitted in and draw drawing flitch, be arranged on and draw on flitch end face first to draw material cylinder, be arranged on the first plug-in unit that first draws material cylinder piston rod top on the table top of material frame platform, first plug-in unit is cylindric, and the external diameter of described first plug-in unit is less than by the internal diameter of draw piece;
In La Liao mechanism, the described material frame platform that draws offers lifting through hole and guide through hole, lifting through hole and guide through hole are close to the front end of drawing material frame platform, elevating lever is plugged in described lifting through hole, plug guide post in guide through hole, the top of described elevating lever is provided with lifting plate, and described guide post is connected to the bottom of lifting plate, the bottom of described elevating lever connects lift cylinder, and lift cylinder is fixed on the bottom of drawing material frame platform;
Except in gluing mechanism, described processing base plate is positioned at the top of lifting plate, and processing base plate being offered one can the square gap that passes through of supply disk, and processing base plate is provided with location telescopic cylinder, and location telescopic cylinder is distributed in four sides of square gap.
By technique scheme, the operation principle that the laser for ball bar array architecture PCB of the present invention removes adhesive dispenser is as follows:
The first, the charging tray being positioned with pcb board is successively placed on the parting bead of the containing box of accommodating mechanism; Drive unit in La Liao mechanism drives and draws flitch to move to the side of accommodating mechanism, and charging tray guide rail aligns with parting bead, that is, charging tray guide rail is connected with parting bead; Draw on flitch first to draw material cylinder to stretch, the first plug-in unit insert in accommodating mechanism on charging tray by draw piece; Afterwards, under the driving of drive unit, draw material module by charging tray from the front end of drawing the rear end of material frame platform to be pulled to material frame platform, now, charging tray is positioned at immediately below processing base plate; Afterwards, lift cylinder drives lifting plate to be supported to by charging tray in the square gap of processing base plate, multiple location telescopic cylinder clamping and positioning charging tray.
The second, utilize the volume of eikonometry measurement device pcb board to carry out image location; Afterwards, Thickness Measurement by Microwave induction installation is utilized to detect epoxy resin coating thickness and the epoxy resin coating scope of the BGA package on pcb board; By numeric ratio pair in the result of the epoxy resin coating thickness of BGA package on image location and detecting pcb board and epoxy resin coating scope and database, the result utilizing laser aid and detect, with energy be 1 ~ 100% or frequency to be 1 ~ 100KHZ or number of times be that the laser of 1 ~ 10 time goes out data by database comparison, the epoxy resin of different-thickness is removed completely; Can by pcb board blanking after removing is clean.
3rd, in accommodating mechanism, a pair elevating mechanism drives a pair lift block to rise, and containing box is upwards promoted certain height by a pair lift block, and a pair parting bead is flushed and tandem array with a pair charging tray guide rail; Afterwards, draw material module from a pair parting bead pull-up feeding dish described; So, along with the progressively rising of containing box, the charging tray be placed in containing box is successively taken away.
By technique scheme, pcb board to be processed can automatically be loaded on the processing base plate except gluing mechanism by the present invention, to improve the efficiency of laser except glue of ball bar array architecture PCB.
Illustrate the one except gluing mechanism as the present invention, described pair of frame plate comprises left frame plate and right frame plate, and described left frame plate is provided with the first Y-direction slideway, and right frame plate is provided with the second Y-direction slideway; Described first Y-direction slideway being offered cross section is the first trapezoidal Y-direction chute, and described second Y-direction slideway being offered cross section is the second trapezoidal Y-direction chute; It is the first trapezoidal slide block that the left part of described crossbeam is provided with cross section, and it is the second trapezoidal slide block that the right part of crossbeam is provided with cross section; Described first slide block coordinates with the first Y-direction chute, and the second slide block coordinates with the second Y-direction chute; The left part of described crossbeam is provided with the first Y-direction drive unit, and described first Y-direction drive unit comprises the first side plate being arranged on crossbeam left part, the first driven wheel be articulated on the first side plate, is arranged on the first side plate and the first drive motors connected with the first driven wheel; The sidewall of described left frame plate offers the first groove, and the roof of the first groove is provided with the first tooth bar, and described first driven wheel is positioned at the first groove, and the first driven wheel engages with the first tooth bar; The right part of described crossbeam is provided with the second Y-direction drive unit, and described second Y-direction drive unit comprises the second side plate being arranged on crossbeam right part, the second driven wheel be articulated on the second side plate, is arranged on the second side plate and the second drive motors connected with the second driven wheel; The sidewall of described right frame plate offers the second groove, and the roof of the second groove is provided with the second tooth bar, and described second driven wheel is positioned at the second groove, and the second driven wheel engages with the second tooth bar.
As described above, first drive motors drives the first driven wheel to rotate, because the first driven wheel engages with the first tooth bar, and the first tooth bar is arranged in the first groove of left frame plate, therefore, the left part of the first driving gear drives crossbeam rotated is moved along the first Y-direction slideway on left frame plate, and particularly, the first slide block on crossbeam moves in the first Y-direction chute of the first Y-direction slideway; In like manner, driven by the second drive motors and the right part of the second driving gear drives crossbeam of rotation is moved along the second Y-direction slideway on right frame plate, particularly, the second slide block on crossbeam moves in the second Y-direction chute of the second Y-direction slideway.So, while the first drive motors and the second drive motors, action can synchronously drive crossbeam to move as Y-direction on left frame plate and right frame plate.
As the present invention, the one except gluing mechanism is illustrated, described X offer on slideway cross section be trapezoidal X to chute, it is the 3rd trapezoidal slide block that described laser module is provided with cross section; Described 3rd slide block coordinates to chute with X; Described laser module is provided with X to drive unit, and described X comprises the 3rd side plate be arranged on the 3rd slide block, the 3rd driven wheel be articulated on the 3rd side plate to drive unit, is arranged on the 3rd side plate and the 3rd drive motors connected with the 3rd driven wheel; The sidewall of described crossbeam is offered the 3rd groove, the roof of the 3rd groove is provided with the 3rd tooth bar, and described 3rd driven wheel is positioned at the 3rd groove, and the 3rd driven wheel engages with the 3rd tooth bar.
As described above, 3rd drive motors drives the 3rd driven wheel to rotate, because the 3rd driven wheel engages with the 3rd tooth bar, and the 3rd tooth bar is arranged in the 3rd groove of crossbeam, therefore, the 3rd driving gear drives the 3rd slip (the 3rd slide block drives laser module) of rotation is moved along the X on crossbeam to slideway.
Illustrate the one except gluing mechanism as the present invention, described laser module comprises the rotating mechanism be arranged on the 3rd slide block, and described eikonometry device, Thickness Measurement by Microwave induction installation, laser aid are installed on rotating mechanism; Described eikonometry device is CCD scope interpretation locator; Described Thickness Measurement by Microwave induction installation is red laser sensor; Described laser aid is CO laser aid.Described rotating mechanism can be fixed on the motor on the 3rd slide block for rotating shaft, described eikonometry device, Thickness Measurement by Microwave induction installation, laser aid are arranged on the bottom of motor; Certainly, described rotating mechanism also can be the mechanism with spinfunction general in prior art.
As the present invention, the one of La Liao mechanism is illustrated, described in draw the table top of material frame platform to be provided with to draw material guide rail for a pair, described in draw the bottom surface of flitch be provided with draw expect that guide rail coordinates draw material slide block.Describedly draw flitch end face to be provided with second to draw material cylinder, second draws the piston rod top of material cylinder to be provided with the second plug-in unit, and the second plug-in unit is cylindric, and the external diameter of the second plug-in unit is less than by the internal diameter of draw piece; Described first plug-in unit and the second plug-in unit are arranged in opposite directions.As described above, when La Liao mechanism is for drawing charging tray, first plug-in unit and the second plug-in unit are positioned at charging tray by the both sides of draw piece, under drawing the driving of material cylinder first, first plug-in unit inserts by draw piece from by the left end of draw piece, under drawing the driving of material cylinder second, the second plug-in unit inserts by draw piece from by the right-hand member of draw piece.
As the present invention, the one of La Liao mechanism is illustrated, described drive unit comprises the second motor, be articulated in the table top drawing material frame platform on the 3rd Timing Belt wheel shaft, the 3rd synchronous pulley be arranged on the 3rd Timing Belt wheel shaft, be articulated in the 4th Timing Belt wheel shaft on the table top drawing material frame platform, the 4th synchronous pulley be arranged on the 4th Timing Belt wheel shaft, connect the second Timing Belt of the 3rd synchronous pulley and the 4th synchronous pulley; Described second motor connects with the 3rd Timing Belt wheel shaft or the 4th Timing Belt wheel shaft, described 3rd Timing Belt wheel shaft and the 4th Timing Belt wheel shaft be vertically arranged on draw material frame platform table top on; Described top of drawing flitch to be positioned at the second Timing Belt, draws the bottom of flitch to be fixedly connected with the second Timing Belt; Be arranged on before and after described 3rd synchronous pulley and the 4th synchronous pulley and draw on material frame platform, described lifting plate is between the 3rd synchronous pulley and the 4th synchronous pulley.The level of La Liao mechanism draws material to adopt synchronous pulley mechanism to complete, and structure is simple, reduces costs.
Accompanying drawing illustrates:
Below in conjunction with accompanying drawing, the present invention is described further:
Fig. 1 is the structural representation of a kind of laser for ball bar array architecture PCB of the present invention except adhesive dispenser;
Fig. 2 is the structural representation except gluing mechanism 10 in Fig. 1;
Fig. 3 is the structural representation removing gluing mechanism 10 gained in Fig. 2 from another view;
Fig. 4 is the structural representation of Tu1Zhong Laliao mechanism 20;
Fig. 5 is the structural representation from another view La Liao mechanism 20 gained in Fig. 4;
Fig. 6 is the structural representation of accommodating mechanism 80 in Fig. 1.
Symbol description in figure:
10, except gluing mechanism; 11, base plate is processed; 12, frame plate; 121, the first Y-direction slideway; 122, the first Y-direction chute; 123, the first groove; 124, the first tooth bar; 13, crossbeam; 131, the first slide block; 132, X is to chute; 133, the 3rd groove; 134, the 3rd tooth bar; 14, laser module; 141, the 3rd slide block; 143, Thickness Measurement by Microwave induction installation; 144, laser aid; 145, rotating mechanism;
16, the first Y-direction drive unit; 161, the first side plate; 162, the first driven wheel; 163, the first drive motors; 17, X is to drive unit; 171, the 3rd side plate; 172, the 3rd driven wheel; 173, the 3rd drive motors;
20, La Liao mechanism; 21, material frame platform is drawn; 212, material guide rail is drawn; 22, material module is drawn; 221, flitch is drawn; 223, first material cylinder is drawn; 225, the first plug-in unit; 226, second material cylinder is drawn; 23, drive unit; 231, the 3rd synchronous pulley; 232, the second Timing Belt; 24, charging tray guide rail; 251, elevating lever; 252, guide post; 253, plate is elevated; 254, lift cylinder; 110, square gap; 112, telescopic cylinder is located;
30, transfer mechanism; 31, column; 32, straight line lift cylinder; 33, straight line Rodless cylinder; 34, rod member; 35, the 5th sucker; 36, rectangular base; 37, the first threaded rod;
40, charging tray; 41, by draw piece;
80, accommodating mechanism; 81, support; 810, limiting plate; 82, containing box; 821, side plate; 822, top board; 823, parting bead; 84, elevating mechanism; 841, bearing; 842, threaded rod; 843, lift block; 844, gathering sill.
Detailed description of the invention:
As Fig. 1, a kind of laser for ball bar array architecture PCB, except adhesive dispenser, comprises except gluing mechanism 10, La Liao mechanism 20, accommodating mechanism 80.
Composition graphs 2, Fig. 3, describedly arrange frame plate 12 for about a pair except gluing mechanism 10 comprises, be arranged on processing base plate 11, the crossbeam 13 across pair of frame plate, the laser module 14 be arranged on crossbeam between pair of frame plate; Described pair of frame plate is provided with Y-direction slideway, and described crossbeam is provided with X to slideway, and the both ends of described crossbeam are slidably fitted on the Y-direction slideway of pair of frame plate, and described laser module is slidably fitted in the X of crossbeam on slideway; Described laser module comprises eikonometry device, Thickness Measurement by Microwave induction installation 143, laser aid 144.
Except in gluing mechanism 10, described processing base plate is positioned at the top of lifting plate, and processing base plate being offered one can the square gap 110 that passes through of supply disk, and processing base plate is provided with location telescopic cylinder 112, location telescopic cylinder is distributed in four sides of square gap.
Except in gluing mechanism 10, described pair of frame plate 12 comprises left frame plate and right frame plate, and described left frame plate is provided with the first Y-direction slideway 121, and right frame plate is provided with the second Y-direction slideway; Described first Y-direction slideway being offered cross section is the first trapezoidal Y-direction chute 122, and described second Y-direction slideway being offered cross section is the second trapezoidal Y-direction chute; It is the first trapezoidal slide block 131 that the left part of described crossbeam 13 is provided with cross section, and it is the second trapezoidal slide block that the right part of crossbeam is provided with cross section; Described first slide block coordinates with the first Y-direction chute, and the second slide block coordinates with the second Y-direction chute.The left part of described crossbeam is provided with the first Y-direction drive unit 16, and described first Y-direction drive unit comprises the first side plate 161 being arranged on crossbeam left part, the first driven wheel 162 be articulated on the first side plate, is arranged on the first side plate and the first drive motors 163 connected with the first driven wheel; The roof sidewall of described left frame plate being offered the first groove 123, first groove is provided with the first tooth bar 124, and described first driven wheel is positioned at the first groove, and the first driven wheel engages with the first tooth bar.The right part of described crossbeam is provided with the second Y-direction drive unit, and described second Y-direction drive unit comprises the second side plate being arranged on crossbeam right part, the second driven wheel be articulated on the second side plate, is arranged on the second side plate and the second drive motors connected with the second driven wheel; The sidewall of described right frame plate offers the second groove, and the roof of the second groove is provided with the second tooth bar, and described second driven wheel is positioned at the second groove, and the second driven wheel engages with the second tooth bar.
Except in gluing mechanism 10, described X offer on slideway cross section be trapezoidal X to chute 132, it is the 3rd trapezoidal slide block 141 that described laser module 14 is provided with cross section; Described 3rd slide block coordinates to chute with X; Described laser module is provided with X to drive unit 17, and described X comprises the 3rd side plate 171 be arranged on the 3rd slide block, the 3rd driven wheel 172 be articulated on the 3rd side plate to drive unit, is arranged on the 3rd side plate and the 3rd drive motors 173 connected with the 3rd driven wheel; The roof sidewall of described crossbeam 13 being offered the 3rd groove the 133, three groove is provided with the 3rd tooth bar 134, and described 3rd driven wheel is positioned at the 3rd groove, and the 3rd driven wheel engages with the 3rd tooth bar.
Except in gluing mechanism 10, described laser module 14 comprises the rotating mechanism 145 be arranged on the 3rd slide block 141, and described eikonometry device, Thickness Measurement by Microwave induction installation 143, laser aid 144 are installed on rotating mechanism; Described eikonometry device is CCD scope interpretation locator; Described Thickness Measurement by Microwave induction installation is red laser sensor; Described laser aid is CO2 laser aid.
As Fig. 6, described accommodating mechanism 80 comprises support 81, containing box 82, a pair elevating mechanism 84; Described support is provided with a pair limiting plate 810, and limiting plate is angle bar shape, and limiting plate is vertically arranged on support, and a pair limiting plate is positioned at the left and right sides of support; Described containing box is rectangular-shaped, and containing box comprises pair of side plates 821, connects the top board 822 of pair of side plates; Pair of side plates is provided with multipair parting bead 823, is arbitraryly arranged in opposite directions in pair of side plates the parting bead of two in parting bead, arbitrary contour to the parting bead of two in parting bead, multipair parting bead with from bottom to up be set in sequence in pair of side plates; Arbitrary to parting bead being placed with charging tray 40, the front side of charging tray be provided with cylindrically by draw piece 41, be positioned with pcb board in described charging tray.
In accommodating mechanism 80, described a pair elevating mechanism is arranged on the both sides of support, each elevating mechanism comprises rack-mount bearing 841, be articulated on bearing and the threaded rod 842 vertically arranged, the servomotor connected with threaded rod, and the lift block 843 that is spirally connected of threaded rod; The gathering sill 844 moved towards up and down offered by described bearing, and described lift block is slidably fastened in the gathering sill of elevating mechanism.Described containing box is placed on a pair lift block, and a pair vertical seamed edge of the rear end face both sides of containing box is close on limiting plate.
Composition graphs 4, Fig. 5, described La Liao mechanism 20 is positioned at the front of accommodating mechanism; Described La Liao mechanism comprises draws material frame platform 21, is slidably fitted in and draws drawing material module 22, be arranged on and draw on material frame platform for driving the drive unit 23 drawing material module level to move back and forth, a pair charging tray guide rail 24 be arranged on the table top drawing material frame platform on the table top of material frame platform; Described material module of drawing is between a pair charging tray guide rail, draw material module to comprise to be slidably fitted in and draw drawing flitch 221, be arranged on and draw on flitch end face first to draw material cylinder 223, be arranged on the first plug-in unit 225 that first draws material cylinder piston rod top on the table top of material frame platform, first plug-in unit is cylindric, and the external diameter of described first plug-in unit is less than by the internal diameter of draw piece.
In La Liao mechanism 20, the described material frame platform that draws offers lifting through hole and guide through hole, lifting through hole and guide through hole are close to the front end of drawing material frame platform, elevating lever 251 is plugged in described lifting through hole, plug guide post 252 in guide through hole, the top of described elevating lever is provided with lifting plate 253, and described guide post is connected to the bottom of lifting plate, the bottom of described elevating lever connects lift cylinder 254, and lift cylinder is fixed on the bottom of drawing material frame platform.
In La Liao mechanism 20, described in draw the table top of material frame platform 21 to be provided with to draw material guide rail 212 for a pair, described in draw the bottom surface of flitch 221 be provided with draw expect that guide rail coordinates draw material slide block; Described draw flitch 221 end face be provided with second draw material cylinder 226, the second draw material cylinder piston rod top the second plug-in unit is installed, the second plug-in unit is cylindric, and the external diameter of the second plug-in unit is less than by the internal diameter of draw piece 31; Described first plug-in unit 225 and the second plug-in unit are arranged in opposite directions.
In La Liao mechanism 20, described drive unit 23 comprises the second motor, be articulated in the table top drawing material frame platform 21 on the 3rd Timing Belt wheel shaft, the 3rd synchronous pulley 231 be arranged on the 3rd Timing Belt wheel shaft, be articulated in the 4th Timing Belt wheel shaft on the table top drawing material frame platform, the 4th synchronous pulley be arranged on the 4th Timing Belt wheel shaft, connect the second Timing Belt 232 of the 3rd synchronous pulley and the 4th synchronous pulley; Described second motor connects with the 3rd Timing Belt wheel shaft or the 4th Timing Belt wheel shaft, described 3rd Timing Belt wheel shaft and the 4th Timing Belt wheel shaft be vertically arranged on draw material frame platform table top on; Described top of drawing flitch 221 to be positioned at the second Timing Belt, draws the bottom of flitch to be fixedly connected with the second Timing Belt; Be arranged on before and after described 3rd synchronous pulley and the 4th synchronous pulley and draw on material frame platform, described lifting plate 253 is between the 3rd synchronous pulley and the 4th synchronous pulley.
Laser for ball bar array architecture PCB carries out the method for laser except glue except adhesive dispenser, comprises the steps:
The first, material loading: drive unit 23 in La Liao mechanism 20 drives and draws flitch 221 to move to the side of accommodating mechanism 80, draws on flitch first to draw material cylinder 223 to stretch, the first plug-in unit 225 insert in accommodating mechanism on charging tray 40 by draw piece 41; Afterwards, under the driving of drive unit, draw material module 22 by charging tray from the front end of drawing the rear end of material frame platform 21 to be pulled to material frame platform, now, charging tray is positioned at immediately below processing base plate 11; Afterwards, lift cylinder 254 drives lifting plate 253 to be supported to by charging tray in the square gap 110 of processing base plate, multiple location telescopic cylinder 112 clamping and positioning charging tray;
The second, image is located: the volume utilizing eikonometry measurement device pcb board;
3rd, Thickness Measurement by Microwave is responded to: utilize Thickness Measurement by Microwave induction installation 143 to detect epoxy resin coating thickness and the epoxy resin coating scope of the BGA package on pcb board;
4th, laser is except glue: by numeric ratio pair in second step and third step detecting result and database, the result utilizing laser aid 144 and detect, with energy be 1 ~ 100% or frequency to be 1 ~ 100KHZ or number of times be that the laser of 1 ~ 10 time goes out data by database comparison, the epoxy resin of different-thickness is removed completely;
5th, blanking: can by pcb board blanking after removing is clean.
Above content is only better embodiment of the present invention, and for those of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, this description should not be construed as limitation of the present invention.
Claims (7)
1. the laser for ball bar array architecture PCB removes an adhesive dispenser, comprises except gluing mechanism (10), La Liao mechanism (20), accommodating mechanism (80);
Described frame plate (12) is set except gluing mechanism (10) comprises for about a pair, is arranged on processing base plate (11), the crossbeam (13) across pair of frame plate, the laser module (14) be arranged on crossbeam between pair of frame plate; Described pair of frame plate is provided with Y-direction slideway, and described crossbeam is provided with X to slideway, and the both ends of described crossbeam are slidably fitted on the Y-direction slideway of pair of frame plate, and described laser module is slidably fitted in the X of crossbeam on slideway; Described laser module comprises eikonometry device, Thickness Measurement by Microwave induction installation (143), laser aid (144); It is characterized in that:
Described accommodating mechanism comprises support (81), containing box (82), a pair elevating mechanism (84);
Described support is provided with a pair limiting plate (810), and limiting plate is angle bar shape, and limiting plate is vertically arranged on support, and a pair limiting plate is positioned at the left and right sides of support;
Described containing box is rectangular-shaped, and containing box comprises pair of side plates (821), connects the top board (822) of pair of side plates; Pair of side plates is provided with multipair parting bead (823), is arbitraryly arranged in opposite directions in pair of side plates the parting bead of two in parting bead, arbitrary contour to the parting bead of two in parting bead, multipair parting bead with from bottom to up be set in sequence in pair of side plates; Arbitrary to parting bead being placed with charging tray (40), the front side of charging tray be provided with cylindrically by draw piece (41), be positioned with pcb board in described charging tray;
Described a pair elevating mechanism is arranged on the both sides of support, each elevating mechanism comprises rack-mount bearing (841), be articulated on bearing and the threaded rod (842) vertically arranged, the servomotor connected with threaded rod, and the lift block (843) that is spirally connected of threaded rod; The gathering sill (844) moved towards up and down offered by described bearing, and described lift block is slidably fastened in the gathering sill of elevating mechanism;
Described containing box is placed on a pair lift block, and a pair vertical seamed edge of the rear end face both sides of containing box is close on limiting plate;
Described La Liao mechanism is positioned at the front of accommodating mechanism; Described La Liao mechanism comprises draws material frame platform (21), is slidably fitted in and draws drawing material module (22), be arranged on and draw on material frame platform for driving the drive unit (23) drawing material module level to move back and forth, a pair charging tray guide rail (24) be arranged on the table top drawing material frame platform on the table top of material frame platform; Described material module of drawing is between a pair charging tray guide rail, draw material module to comprise to be slidably fitted in and draw drawing flitch (221), be arranged on and draw on flitch end face first to draw material cylinder (223), be arranged on the first plug-in unit (225) that first draws material cylinder piston rod top on the table top of material frame platform, first plug-in unit is cylindric, and the external diameter of described first plug-in unit is less than by the internal diameter of draw piece;
In La Liao mechanism, the described material frame platform that draws offers lifting through hole and guide through hole, lifting through hole and guide through hole are close to the front end of drawing material frame platform, elevating lever (251) is plugged in described lifting through hole, guide post (252) is plugged in guide through hole, the top of described elevating lever is provided with lifting plate (253), described guide post is connected to the bottom of lifting plate, the bottom of described elevating lever connects lift cylinder (254), and lift cylinder is fixed on the bottom of drawing material frame platform;
Except in gluing mechanism, described processing base plate is positioned at the top of lifting plate, processing base plate being offered one can the square gap (110) that passes through of supply disk, and processing base plate is provided with location telescopic cylinder (112), and location telescopic cylinder is distributed in four sides of square gap.
2. a kind of laser for ball bar array architecture PCB removes adhesive dispenser as claimed in claim 1, it is characterized in that: except in gluing mechanism (10), described pair of frame plate (12) comprises left frame plate and right frame plate, described left frame plate is provided with the first Y-direction slideway (121), and right frame plate is provided with the second Y-direction slideway; Described first Y-direction slideway being offered cross section is the first trapezoidal Y-direction chute (122), and described second Y-direction slideway being offered cross section is the second trapezoidal Y-direction chute; It is trapezoidal the first slide block (131) that the left part of described crossbeam (13) is provided with cross section, and it is the second trapezoidal slide block that the right part of crossbeam is provided with cross section; Described first slide block coordinates with the first Y-direction chute, and the second slide block coordinates with the second Y-direction chute;
The left part of described crossbeam is provided with the first Y-direction drive unit (16), and described first Y-direction drive unit comprises the first side plate (161) being arranged on crossbeam left part, the first driven wheel (162) be articulated on the first side plate, is arranged on the first side plate and the first drive motors (163) connected with the first driven wheel; The sidewall of described left frame plate is offered the first groove (123), the roof of the first groove is provided with the first tooth bar (124), and described first driven wheel is positioned at the first groove, and the first driven wheel engages with the first tooth bar;
The right part of described crossbeam is provided with the second Y-direction drive unit, and described second Y-direction drive unit comprises the second side plate being arranged on crossbeam right part, the second driven wheel be articulated on the second side plate, is arranged on the second side plate and the second drive motors connected with the second driven wheel; The sidewall of described right frame plate offers the second groove, and the roof of the second groove is provided with the second tooth bar, and described second driven wheel is positioned at the second groove, and the second driven wheel engages with the second tooth bar.
3. a kind of laser for ball bar array architecture PCB, except adhesive dispenser, is characterized in that as claimed in claim 1:
Except in gluing mechanism (10), described X offer on slideway cross section be trapezoidal X to chute (132), it is the 3rd trapezoidal slide block (141) that described laser module (14) is provided with cross section; Described 3rd slide block coordinates to chute with X;
Described laser module is provided with X to drive unit (17), and described X comprises the 3rd side plate (171) be arranged on the 3rd slide block, the 3rd driven wheel (172) be articulated on the 3rd side plate to drive unit, is arranged on the 3rd side plate and the 3rd drive motors (173) connected with the 3rd driven wheel; The sidewall of described crossbeam (13) is offered the 3rd groove (133), the roof of the 3rd groove is provided with the 3rd tooth bar (134), and described 3rd driven wheel is positioned at the 3rd groove, and the 3rd driven wheel engages with the 3rd tooth bar.
4. a kind of laser for ball bar array architecture PCB removes adhesive dispenser as claimed in claim 3, it is characterized in that: described laser module (14) comprises the rotating mechanism (145) be arranged on the 3rd slide block (141), described eikonometry device, Thickness Measurement by Microwave induction installation (143), laser aid (144) are installed on rotating mechanism; Described eikonometry device is CCD scope interpretation locator; Described Thickness Measurement by Microwave induction installation is red laser sensor; Described laser aid is CO2 laser aid.
5. a kind of laser for ball bar array architecture PCB removes adhesive dispenser as claimed in claim 1, it is characterized in that: in La Liao mechanism (20), describedly draw the table top of material frame platform (21) to be provided with to draw material guide rail (212) for a pair, described in draw the bottom surface of flitch (221) be provided with draw expect that guide rail coordinates draw material slide block;
Described draw flitch (221) end face be provided with second draw material cylinder (226), second draws the piston rod top of material cylinder to be provided with the second plug-in unit, second plug-in unit is cylindric, and the external diameter of the second plug-in unit is less than by the internal diameter of draw piece (31); Described first plug-in unit (225) and the second plug-in unit are arranged in opposite directions.
6. a kind of laser for ball bar array architecture PCB, except adhesive dispenser, is characterized in that as claimed in claim 1:
In La Liao mechanism (20), described drive unit (23) comprises the second motor, be articulated in the table top drawing material frame platform (21) on the 3rd Timing Belt wheel shaft, the 3rd synchronous pulley (231) be arranged on the 3rd Timing Belt wheel shaft, be articulated in the 4th Timing Belt wheel shaft on the table top drawing material frame platform, the 4th synchronous pulley be arranged on the 4th Timing Belt wheel shaft, connect second Timing Belt (232) of the 3rd synchronous pulley and the 4th synchronous pulley; Described second motor connects with the 3rd Timing Belt wheel shaft or the 4th Timing Belt wheel shaft, described 3rd Timing Belt wheel shaft and the 4th Timing Belt wheel shaft be vertically arranged on draw material frame platform table top on; Described top of drawing flitch (221) to be positioned at the second Timing Belt, draws the bottom of flitch to be fixedly connected with the second Timing Belt;
Be arranged on before and after described 3rd synchronous pulley and the 4th synchronous pulley and draw on material frame platform, described lifting plate (253) is between the 3rd synchronous pulley and the 4th synchronous pulley.
7. use a kind of laser for ball bar array architecture PCB according to any one of claim 1 to claim 6 to carry out the method for laser except glue except adhesive dispenser, it is characterized in that: described method comprises the steps:
First, material loading: the drive unit (23) in La Liao mechanism (20) drives and draws flitch (221) to move to the side of accommodating mechanism (80), draw on flitch first to draw material cylinder (223) to stretch, the first plug-in unit (225) insert in accommodating mechanism on charging tray (40) by draw piece (41); Afterwards, under the driving of drive unit, draw material module (22) by charging tray from the front end of drawing the rear end of material frame platform (21) to be pulled to material frame platform, now, charging tray is positioned at immediately below processing base plate (11); Afterwards, lift cylinder (254) drives lifting plate (253) to be supported to by charging tray in the square gap (110) of processing base plate, multiple location telescopic cylinder (112) clamping and positioning charging tray;
The second, image is located: the volume utilizing eikonometry measurement device pcb board;
3rd, Thickness Measurement by Microwave is responded to: utilize Thickness Measurement by Microwave induction installation (143) to detect epoxy resin coating thickness and the epoxy resin coating scope of the BGA package on pcb board;
4th, laser is except glue: by numeric ratio pair in second step and third step detecting result and database, the result utilizing laser aid (144) and detect, with energy be 1 ~ 100% or frequency to be 1 ~ 100KHZ or number of times be that the laser of 1 ~ 10 time goes out data by database comparison, the epoxy resin of different-thickness is removed completely;
5th, blanking: can by pcb board blanking after removing is clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510778274.8A CN105328344B (en) | 2015-11-14 | 2015-11-14 | A kind of laser removing glue device and method for ball bar array architecture PCB |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510778274.8A CN105328344B (en) | 2015-11-14 | 2015-11-14 | A kind of laser removing glue device and method for ball bar array architecture PCB |
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| CN105328344A true CN105328344A (en) | 2016-02-17 |
| CN105328344B CN105328344B (en) | 2017-07-04 |
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| CN115007564A (en) * | 2022-06-16 | 2022-09-06 | 深圳泰德半导体装备有限公司 | Glue removing equipment |
| CN117444489A (en) * | 2023-12-20 | 2024-01-26 | 甘肃三阳仓储设备制造有限公司 | Welding device for shelf laminate molding |
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