CN214503808U - Semiconductor integrated circuit wafer testing device - Google Patents
Semiconductor integrated circuit wafer testing device Download PDFInfo
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- CN214503808U CN214503808U CN202120085905.9U CN202120085905U CN214503808U CN 214503808 U CN214503808 U CN 214503808U CN 202120085905 U CN202120085905 U CN 202120085905U CN 214503808 U CN214503808 U CN 214503808U
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- 238000012360 testing method Methods 0.000 title claims abstract description 100
- 239000004065 semiconductor Substances 0.000 title claims abstract description 39
- 239000011248 coating agent Substances 0.000 claims abstract description 6
- 238000000576 coating method Methods 0.000 claims abstract description 6
- 239000011241 protective layer Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 239000011148 porous material Substances 0.000 claims 1
- 239000000523 sample Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model relates to a probe station technical field just discloses a semiconductor integrated circuit wafer testing arrangement, including the testing arrangement body, the top of testing arrangement body is provided with the roof, be provided with the montant between the bottom of roof and the top of testing arrangement body, the top of roof is fixed with first cylinder, the flexible end of first cylinder runs through the top of roof and is fixed with the apron. This semiconductor integrated circuit wafer testing arrangement, can be through the inoxidizing coating in the testing arrangement body outside, with the phenomenon of avoiding appearing hindering the staff, and, can lift up the testing arrangement body through second cylinder and bottom plate, can be through driving motor, the fixed plate, the bearing frame, the plate hole, the lead screw, spacing spout, the lifter plate, spacing slider, the riser, the connecting plate and the cooperation between the removal wheel, it is flexible to drive the removal wheel, so that the staff is to the removal of testing arrangement body, staff's intensity of labour has been reduced.
Description
Technical Field
The utility model relates to a probe station technical field specifically is a semiconductor integrated circuit wafer test device.
Background
A semiconductor integrated circuit, which is a semiconductor integrated circuit device having at least one circuit block on a semiconductor substrate, wherein the semiconductor integrated circuit is formed by interconnecting active elements such as transistors, diodes, etc. and passive elements such as resistors, capacitors, etc. on a semiconductor single chip according to a certain circuit, thereby completing specific circuit or system functions, the manufacturing process of the semiconductor integrated circuit can be roughly divided into wafer manufacturing, wafer testing, packaging and finished product testing, the wafer is a chip used for manufacturing the semiconductor integrated circuit, when testing the wafer, a probe station is usually used, the probe station is mainly used in the semiconductor industry, the optoelectronic industry, the quality testing of integrated circuits and components, the volume of the components is smaller and smaller along with the development of technology, a plurality of components are usually integrated on the wafer to form a to-be-tested component, the subsequent detection is convenient, and the detection mode is usually as follows: and conducting the positive electrode and the negative electrode of the component to be detected by using the electrified probe, and judging whether the detected component is qualified or not according to the working condition of the component.
Some semiconductor integrated circuit wafer test apparatuses currently on the market:
(1) in the using process, because the corners of the testing device are hard, when a worker collides with the testing device, the worker is easily injured;
(2) in the using process, because the bottom of the testing device is not provided with the moving structure, when the position of the testing device needs to be moved, the testing device needs to be manually moved, the labor intensity of workers is easily increased, and the use of the workers is inconvenient.
Therefore, an apparatus for testing a semiconductor integrated circuit wafer is proposed to solve the above-mentioned problems.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
To the not enough of prior art among the above-mentioned background, the utility model aims to provide a semiconductor integrated circuit wafer test device, with some semiconductor integrated circuit wafer test devices on the existing market who proposes in solving above-mentioned background, the existence is because test device's edge is comparatively hard, when appearing colliding between staff and the test device, the phenomenon of the staff that bumps appears easily, and, in the use, because test device's bottom does not set up removal structure, when needs move test device's position, need the manual work to move test device, increase staff's intensity of labour easily, the problem that the staff of being not convenient for used.
(II) technical scheme
In order to achieve the above purpose, the utility model discloses a following technical scheme realizes:
a semiconductor integrated circuit wafer testing device comprises a testing device body, wherein a top plate is arranged above the testing device body, a vertical rod is arranged between the bottom of the top plate and the top of the testing device body, a first air cylinder is fixed at the top of the top plate, the telescopic end of the first air cylinder penetrates through the top of the top plate and is fixed with a cover plate, one end of the vertical rod penetrates through the cover plate, supporting columns are fixed at four ends of the bottom of the testing device body, gaskets are arranged at the bottoms of the supporting columns, four grooves which are distributed in a rectangular arrangement are formed in the bottom of the testing device body, a second air cylinder is fixed on the inner top wall of each groove, a bottom plate is fixed at the telescopic end of each second air cylinder, two fixing boxes are arranged at the bottom ends of two sides of the testing device body, a driving motor is arranged at the top of each fixing box, and a fixing plate is fixed in each fixing box, the utility model discloses a testing device, including fixed plate, mounting plate, bearing frame, limiting slide way, mounting plate, the outside of testing device body is provided with the inoxidizing coating.
Preferably, the number of the vertical rods is four, the bottom ends of the four vertical rods are respectively fixed with the four ends of the top of the testing device body, and the top ends of the four vertical rods are respectively fixed with the four ends of the bottom of the top plate and can pass through the four vertical rods so as to achieve the purpose of supporting the top plate.
Preferably, the outer side of the fixing box is fixed with an ear plate, a bolt is arranged on the ear plate, the ear plate is fixed with one side of the testing device body through threads, and the fixing box can be detached from the testing device body through the bolt on the ear plate.
Preferably, a bolt is installed on a motor base of the driving motor, the driving motor is fixed to the top of the fixing box through the bolt, and the purpose that the driving motor can be detached from the top of the fixing box can be achieved through the bolt on the driving motor.
Furthermore, the bearing is arranged inside the bearing seat, the bottom end of the screw rod is connected with the inside of the bearing, and the screw rod can rotate on the fixing plate through the bearing seat.
Furthermore, a threaded hole is formed in the middle of the top surface of the lifting plate, the screw rod penetrates through the threaded hole in the middle of the top surface of the lifting plate, and the lifting plate is located above the fixed plate and can pass through the threaded hole in the middle of the top surface of the lifting plate so as to achieve the purpose that the screw rod drives the lifting plate to move up and down.
Furthermore, the limiting slide block is T-shaped, one end of the limiting slide block is connected with the inner portion of the limiting slide groove in a sliding mode, and the purpose of limiting the lifting plate can be achieved through the sliding connection between the limiting slide block and the limiting slide block.
Further, the inoxidizing coating is the yoga mat, the inboard of inoxidizing coating bonds through the outside of glue with the testing arrangement body, can pass through the inoxidizing coating in the testing arrangement body outside to avoid appearing hindering staff's phenomenon.
Furthermore, the gasket is made of rubber materials, the top of the gasket is fixedly bonded with the bottom of the supporting column through strong glue, and the bottom of the supporting column can be prevented from slipping through the gasket at the bottom of the supporting column.
(III) advantageous effects
Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor integrated circuit wafer test device comprises:
(1) in the process of using the semiconductor integrated circuit wafer testing device, the protective layer on the outer side of the testing device body can be used for avoiding the phenomenon of damaging workers.
(2) In the process of using the semiconductor integrated circuit wafer testing device, the testing device body can be lifted through the second cylinder and the bottom plate, and the movable wheel can be driven to stretch through the cooperation between the driving motor, the fixed plate, the bearing seat, the plate hole, the lead screw, the limiting sliding groove, the lifting plate, the limiting sliding block, the vertical plate, the connecting plate and the movable wheel, so that the labor intensity of workers is reduced when the workers move the testing device body.
Drawings
FIG. 1 is a schematic diagram of a cross-sectional front view of a semiconductor integrated circuit wafer test apparatus according to the present invention;
FIG. 2 is a schematic diagram of a front view of the semiconductor integrated circuit wafer test apparatus of the present invention;
FIG. 3 is a schematic view of the top view of the testing device body of the semiconductor integrated circuit wafer testing device according to the present invention;
FIG. 4 is a schematic cross-sectional view of a fixing box of the semiconductor integrated circuit wafer testing apparatus according to the present invention;
FIG. 5 is a schematic view of the top view of the limiting slider of the semiconductor integrated circuit wafer testing device according to the present invention;
FIG. 6 is a schematic perspective view of a fixing box of the semiconductor integrated circuit wafer testing apparatus according to the present invention;
fig. 7 is a schematic view of a top view of a mounting plate of the semiconductor integrated circuit wafer testing apparatus according to the present invention.
In the figure: 1. a testing device body; 2. a vertical rod; 3. a top plate; 4. a first cylinder; 5. a cover plate; 6. a support pillar; 7. a gasket; 8. a groove; 9. a second cylinder; 10. a base plate; 11. a fixing box; 12. a drive motor; 13. a fixing plate; 14. a bearing seat; 15. plate holes; 16. a screw rod; 17. a limiting chute; 18. a lifting plate; 19. a limiting slide block; 20. a vertical plate; 21. a connecting plate; 22. a moving wheel; 23. and (4) a protective layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-7, the present invention provides a semiconductor integrated circuit wafer testing apparatus; the testing device comprises a testing device body 1, a top plate 3 is arranged above the testing device body 1, a vertical rod 2 is arranged between the bottom of the top plate 3 and the top of the testing device body 1, a first air cylinder 4 is fixed at the top of the top plate 3, the telescopic end of the first air cylinder 4 penetrates through the top of the top plate 3 and is fixed with a cover plate 5, one end of the vertical rod 2 penetrates through the cover plate 5, supporting columns 6 are fixed at four ends of the bottom of the testing device body 1, a gasket 7 is arranged at the bottom of each supporting column 6, four grooves 8 which are distributed in a rectangular arrangement are formed in the bottom of the testing device body 1, a second air cylinder 9 is fixed at the inner top wall of each groove 8, a bottom plate 10 is fixed at the telescopic end of each second air cylinder 9, two fixing boxes 11 are arranged at the bottom ends of two sides of the testing device body 1, a driving motor 12 is arranged at the top of each fixing box 11, a fixing plate 13 is fixed inside each fixing box 11, and a bearing seat 14 is fixed at the middle part of the top surface of each fixing plate 13, both sides of the top of the fixed plate 13 are provided with plate holes 15, the output end of the driving motor 12 is connected with a screw rod 16 through a coupler, the bottom end of the screw rod 16 penetrates through the top of the fixed box 11 and is connected with a bearing seat 14, both sides of the inner wall of the fixed box 11 are provided with limiting sliding grooves 17, the outer side of the screw rod 16 is in threaded connection with a lifting plate 18, both sides of the lifting plate 18 are respectively fixed with a limiting sliding block 19, both ends of the bottom of the lifting plate 18 are respectively fixed with a vertical plate 20, the bottom ends of the two vertical plates 20 respectively penetrate through the two plate holes 15 at both ends of the top of the fixed plate 13, a connecting plate 21 is arranged below the fixed plate 13, the two vertical plates 20 are respectively fixed with both ends of the top of the connecting plate 21, the bottom of the connecting plate 21 is provided with a connecting plate 21, and the outer side of the testing device body 1 is provided with a protective layer 23;
as an optimal technical solution of the utility model: the number of the vertical rods 2 is four, the bottom ends of the four vertical rods 2 are respectively fixed with the four ends of the top of the testing device body 1, the top ends of the four vertical rods 2 are respectively fixed with the four ends of the bottom of the top plate 3, and the top plate 3 can be supported by the four vertical rods 2;
as an optimal technical solution of the utility model: an ear plate is fixed on the outer side of the fixing box 11, a bolt is arranged on the ear plate, the ear plate is fixed with one side of the testing device body 1 through threads, and the fixing box 11 can be detached from the testing device body 1 through the bolt on the ear plate;
as an optimal technical solution of the utility model: a bolt is arranged on a motor base of the driving motor 12, the driving motor 12 is fixed with the top of the fixing box 11 through the bolt, and the purpose that the driving motor 12 can be detached from the top of the fixing box 11 can be achieved through the bolt on the driving motor 12;
as an optimal technical solution of the utility model: a bearing is arranged in the bearing seat 14, the bottom end of the screw rod 16 is connected with the inside of the bearing, and the screw rod 16 can rotate on the fixing plate 13 through the bearing seat 14;
as an optimal technical solution of the utility model: a threaded hole is formed in the middle of the top surface of the lifting plate 18, the screw rod 16 penetrates through the threaded hole in the middle of the top surface of the lifting plate 18, the lifting plate 18 is located above the fixing plate 13, and the purpose that the screw rod 16 drives the lifting plate 18 to move up and down can be achieved through the threaded hole in the middle of the top surface of the lifting plate 18;
as an optimal technical solution of the utility model: the limiting slide block 19 is in a T shape, one end of the limiting slide block 19 is connected with the inside of the limiting slide groove 17 in a sliding mode, and the purpose of limiting the lifting plate 18 can be achieved through the sliding connection between the limiting slide block 19 and the limiting slide block 19;
as an optimal technical solution of the utility model: the protective layer 23 is a yoga mat, the inner side of the protective layer 23 is bonded with the outer side of the testing device body 1 through glue, and the protective layer 23 on the outer side of the testing device body 1 can be used for avoiding the phenomenon that workers are injured;
as an optimal technical solution of the utility model: the gasket 7 is made of rubber materials, the top of the gasket 7 is fixedly bonded with the bottom of the support column 6 through strong glue, and the purpose of preventing the bottom of the support column 6 from slipping can be achieved through the gasket 7 at the bottom of the support column 6.
The working principle of the embodiment is as follows: when using the semiconductor integrated circuit wafer testing device, as shown in fig. 1-7, when the worker is about to collide with the outer side of the testing device body 1, the outer side of the testing device body 1 is isolated by the protection layer 23, so that the worker can collide with the protection layer 23, because the protection layer 23 is made of a yoga mat, the yoga mat is soft, the worker can not collide with the yoga mat, when the position of the testing device body 1 needs to be moved, the second cylinder 9 is started to drive the bottom plate 10 to move downwards, after the bottom of the bottom plate 10 contacts with the ground, the whole testing device body 1 is driven to move upwards, after the bottom of the bottom plate 10 moves to a proper position, the second cylinder 9 is stopped, the driving motor 12 is started, the lifting plate 18 is driven to move downwards through the rotation of the screw rod 16 on the bearing seat 14, the lifting plate 18 is driven to drive the vertical plate 20, The connecting plate 21 and the moving wheel 22 move downwards simultaneously, while the lifting plate 18 moves downwards, the limit slide blocks 19 on two sides of the lifting plate respectively slide downwards in the limit slide grooves 17 on two sides of the inner wall of the fixed box 11, after the bottom of the moving wheel 22 contacts with the ground, the driving motor 12 is closed, then the second air cylinder 9 is started to drive the bottom plate 10 to contract into the groove 8, finally the testing device body 1 is pushed to move under the action of the moving wheel 22, after the testing device body 1 is moved, the second air cylinder 9 is started to drive the bottom plate 10 to move downwards, after the bottom of the bottom plate 10 contacts with the ground, the second air cylinder 9 is closed, then the driving motor 12 is started to drive the screw rod 16 to reversely rotate on the bearing seat 14 to drive the lifting plate 18 to move upwards, the vertical plate 20, the connecting plate 21 and the moving wheel 22 are driven by the lifting plate 18 to simultaneously move upwards, while the lifting plate 18 moves upwards, the limiting sliding blocks 19 on the two sides of the testing device slide upwards in the limiting sliding grooves 17 on the two sides of the inner wall of the fixed box 11 respectively, after the moving wheels 22 are accommodated in the fixed box 11, the driving motor 12 is closed, then the second air cylinder 9 is started, the testing device body 1 is driven to move downwards slowly, after the gasket 7 on the supporting column 6 at the bottom of the testing device body 1 is contacted with the ground, the bottom plate 10 continues to contract upwards until the gasket contracts into the groove 8, and finally the second air cylinder 9 is closed.
The electrical components presented herein may be electrically connected to an onboard controller, and the controller may be electrically connected to the external 220V mains, and the controller may be a computer or other conventionally known device that performs the control.
Although the present invention has been described in detail with reference to the foregoing embodiments, it should be noted that, in the present invention, unless otherwise explicitly specified or limited, the terms "set", "mounted", "connected", "fixed", and the like are to be interpreted broadly, and may be, for example, either fixedly connected or detachably connected; or indirectly through an intermediary. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art; it will be appreciated by those skilled in the art that modifications may be made to the above-described embodiments, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and the like which fall within the spirit and scope of the present invention may be resorted to.
Claims (9)
1. The semiconductor integrated circuit wafer testing device comprises a testing device body (1) and is characterized in that a top plate (3) is arranged above the testing device body (1), a vertical rod (2) is arranged between the bottom of the top plate (3) and the top of the testing device body (1), a first air cylinder (4) is fixed at the top of the top plate (3), a telescopic end of the first air cylinder (4) penetrates through the top of the top plate (3) and is fixedly provided with a cover plate (5), one end of the vertical rod (2) penetrates through the cover plate (5), supporting columns (6) are fixed at four ends of the bottom of the testing device body (1), gaskets (7) are arranged at the bottom of the supporting columns (6), four grooves (8) which are distributed in a rectangular arrangement are formed in the bottom of the testing device body (1), and a second air cylinder (9) is fixed at the inner top wall of each groove (8), a bottom plate (10) is fixed at the telescopic end of the second cylinder (9), two fixing boxes (11) are arranged at the bottom ends of two sides of the testing device body (1), a driving motor (12) is arranged at the top of each fixing box (11), a fixing plate (13) is fixed inside each fixing box (11), a bearing seat (14) is fixed in the middle of the top surface of each fixing plate (13), plate holes (15) are formed in two sides of the top of each fixing plate (13), the output end of each driving motor (12) is connected with a lead screw (16) through a coupler, the bottom end of each lead screw (16) penetrates through the top of each fixing box (11) and is connected with the corresponding bearing seat (14), limiting sliding grooves (17) are formed in two sides of the inner wall of each fixing box (11), a lifting plate (18) is connected with outer threads of each lead screw (16), and limiting sliding blocks (19) are fixed on two sides of each lifting plate (18), the bottom both ends of lifter plate (18) all are fixed with riser (20), two pore (15) at fixed plate (13) top both ends are run through respectively to the bottom of riser (20), the below of fixed plate (13) is provided with connecting plate (21), two riser (20) are fixed with the top both ends of connecting plate (21) respectively, connecting plate (21) are installed to the bottom of connecting plate (21), the outside of testing arrangement body (1) is provided with inoxidizing coating (23).
2. The semiconductor integrated circuit wafer testing device as claimed in claim 1, wherein the number of the vertical rods (2) is four, the bottom ends of four vertical rods (2) are respectively fixed with the top four ends of the testing device body (1), and the top ends of four vertical rods (2) are respectively fixed with the bottom four ends of the top plate (3).
3. The semiconductor integrated circuit wafer test device as claimed in claim 1, wherein an ear plate is fixed on the outer side of the fixing box (11), a bolt is arranged on the ear plate, and the ear plate is fixed with one side of the test device body (1) through a thread.
4. The semiconductor integrated circuit wafer testing device according to claim 1, wherein a bolt is mounted on a motor base of the driving motor (12), and the driving motor (12) is fixed to the top of the fixing box (11) through the bolt.
5. The semiconductor integrated circuit wafer test device as set forth in claim 1, wherein a bearing is installed inside the bearing housing (14), and a bottom end of the lead screw (16) is connected to an inside of the bearing.
6. The semiconductor integrated circuit wafer testing device as recited in claim 1, wherein a threaded hole is formed in a middle portion of a top surface of the lifting plate (18), the lead screw (16) penetrates through the threaded hole in the middle portion of the top surface of the lifting plate (18), and the lifting plate (18) is located above the fixing plate (13).
7. The semiconductor integrated circuit wafer test device as set forth in claim 1, wherein the position-limiting slide block (19) is T-shaped, and one end of the position-limiting slide block (19) is slidably connected to the inside of the position-limiting slide groove (17).
8. The semiconductor integrated circuit wafer test device according to claim 1, wherein the protective layer (23) is a yoga mat, and an inner side of the protective layer (23) is adhered to an outer side of the test device body (1) by glue.
9. The semiconductor integrated circuit wafer test device according to claim 1, wherein the gasket (7) is made of rubber material, and the top of the gasket (7) is adhered and fixed with the bottom of the supporting pillar (6) by strong glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120085905.9U CN214503808U (en) | 2021-01-13 | 2021-01-13 | Semiconductor integrated circuit wafer testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120085905.9U CN214503808U (en) | 2021-01-13 | 2021-01-13 | Semiconductor integrated circuit wafer testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214503808U true CN214503808U (en) | 2021-10-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120085905.9U Active CN214503808U (en) | 2021-01-13 | 2021-01-13 | Semiconductor integrated circuit wafer testing device |
Country Status (1)
| Country | Link |
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| CN (1) | CN214503808U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115453304A (en) * | 2022-09-06 | 2022-12-09 | 无锡卓海科技股份有限公司 | Over-360-degree rotating platform equipment for wafer detection and operation method thereof |
-
2021
- 2021-01-13 CN CN202120085905.9U patent/CN214503808U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115453304A (en) * | 2022-09-06 | 2022-12-09 | 无锡卓海科技股份有限公司 | Over-360-degree rotating platform equipment for wafer detection and operation method thereof |
| CN115453304B (en) * | 2022-09-06 | 2023-09-22 | 无锡卓海科技股份有限公司 | Super 360-degree rotating platform equipment for wafer detection and operation method thereof |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A semiconductor integrated circuit wafer testing device Effective date of registration: 20231022 Granted publication date: 20211026 Pledgee: China Merchants Bank Co.,Ltd. Jiaxing Branch Pledgor: Zhejiang Xinhui Equipment Technology Co.,Ltd. Registration number: Y2023330002404 |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |