CN108580744A - A kind of QFP device pins forming frock and its application method - Google Patents
A kind of QFP device pins forming frock and its application method Download PDFInfo
- Publication number
- CN108580744A CN108580744A CN201810642665.0A CN201810642665A CN108580744A CN 108580744 A CN108580744 A CN 108580744A CN 201810642665 A CN201810642665 A CN 201810642665A CN 108580744 A CN108580744 A CN 108580744A
- Authority
- CN
- China
- Prior art keywords
- qfp
- clamping opening
- pin
- head cover
- pedestal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 18
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000000465 moulding Methods 0.000 claims abstract description 18
- 238000009740 moulding (composite fabrication) Methods 0.000 claims description 46
- 238000007790 scraping Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F1/00—Bending wire other than coiling; Straightening wire
- B21F1/004—Bending wire other than coiling; Straightening wire by means of press-type tooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4885—Wire-like parts or pins
- H01L21/4896—Mechanical treatment, e.g. cutting, bending
Abstract
The invention discloses a kind of QFP device pins forming frock and its application method, which includes：Head cover；Pedestal is provided with several fixed columns on the pedestal, and head cover is mounted on above the pedestal by fixed column, can be moved up and down along fixed column；The first clamping opening in cap base is set, which is made of the two boards shape object being oppositely arranged perpendicular to head cover bottom surface；The second clamping opening in base top is set, which is made of the two boards shape object being oppositely arranged perpendicular to base top surface；Wherein, the first clamping opening is arranged with the second clamping opening alignment relative, constitutes the clamping part of QFP devices so that between the first clamping opening and the second clamping opening, the molding pin to be processed of QFP devices is exposed to outside clamping part QFP devices.Tool structure provided by the invention is simple, easy to operate, can clamp chip, prevents chip forming process chips from moving, carries out scraping molding then along forming surface, and the shape of one-time-reach-place, pin is consistent, and accuracy is high.
Description
Technical field
The invention belongs to circuit assembly technical fields, are related to a kind of pin forming tooling, and in particular to a kind of QFP devices draw
Foot forming frock and its application method.
Background technology
Quad Flat formula encapsulation technology（Plastic Quad Flat Package, abbreviation QFP）, the CPU of technology realization
Apart from very little between four side pin of chip, pin is very thin.
The existing main molding mode of chip forming frock is to use upper and lower two mating templates, and chip is placed on template
In, another template then, which is squeezed, by fixing a template is molded.This molding mode clamps and molding is complete together
At, that is, the shortcomings that chip pin is molded by the process for clamping chip while, this is also the molding of this kind of tooling.Chip is not complete
Formed chip pin easy tos produce the risk that forming process chips are slided in the case of full clamping, and chip is caused to be molded two
Edge lengths are inconsistent.
Invention content
Present invention aim to address the inconsistent problems of the pin of the quick pin forming of QFP devices, provide a kind of pin
The tooling of precise forming.
In order to achieve the above object, the present invention provides a kind of QFP device pins forming frock, which includes：
Head cover,
Pedestal is provided with several fixed columns on the pedestal, and head cover is mounted on above the pedestal by fixed column, can be along fixed column
It moves up and down；
The first clamping opening in cap base is set, and first clamping opening is by the two boards shape object structure that is oppositely arranged perpendicular to head cover bottom surface
At；
The second clamping opening in base top is set, and second clamping opening is by the two boards shape object structure that is oppositely arranged perpendicular to base top surface
At；
Wherein, the first clamping opening and the second clamping opening alignment relative are arranged, and constitute the clamping part of QFP devices so that QFP devices are located at the
Between one clamping opening and the second clamping opening, the molding pin to be processed of QFP devices is exposed to outside clamping part.
Preferably, being additionally provided with pin forming machined surface at the top of the pedestal.
Preferably, the tooling also includes to press molding scraper plate for pin.
Preferably, the fixed column is symmetrical arranged so that head cover is parallel with pedestal.
Preferably, the tooling includes 4 fixed columns, it is separately positioned on the quadrangle of pedestal.
Preferably, the fixed column is swing arm.
Preferably, being additionally provided with knob lid for fixing on the swing arm.
Preferably, the head cover is in I-shaped.
The present invention also provides a kind of application method according to above-mentioned QFP device pin forming frocks, this method includes
Following steps：
Step 1, head cover is released from fixed column；
Step 2, QFP devices are placed on base center, be placed in the second clamping opening；
Step 3, head cover is added by fixed column so that the first clamping opening is aligned with the second clamping opening, is clamped the pin of QFP devices, is made
Molding pin to be processed is exposed to outside clamping part；
Step 4, stationary gripping part, molded lead obtain the QFP devices of both sides pin forming；
Step 5, head cover is opened, the QFP devices of both sides pin forming are rotated horizontally into 90 ° of placements；
Step 6, step 3-4 is repeated, the QFP devices of four side pin formings are obtained.
Preferably, the technique of step 4 molded lead includes：Using scraper plate since pin clamped spot, along
The plate object of two clamping opening presses down on, and is pressed further along pin forming machined surface, makes pin close to forming face brake forming.
The tooling of the present invention is first with upper and lower two clamping opening by chip（QFP devices）Clamp, then utilize scraper plate along
The pin forming machined surface of pedestal carries out scraping molding, meets installation requirement after chip molding.
The present invention compared with prior art the advantages of：
1) simple in structure, easy to process and use.
2) easy to operate, chip can be clamped, prevent chip forming process chips from moving.
3）Chip is clamped by two clamping opening, then carries out scraping molding along forming surface using scraper.It is easy to use
Fast, the shape of one-time-reach-place, pin is consistent, and accuracy is high.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of QFP device pins forming frock of the present invention.
Fig. 2 is that the step 1 of the present invention opens the tooling schematic diagram after head cover.
Fig. 3 is that the step 2 of the present invention places the tooling schematic diagram of QFP devices.
Fig. 4 is the tooling schematic diagram of the pin for clamping QFP devices of the step 3 of the present invention.
Fig. 5 a, 5b are the tooling schematic diagram of step 4 molded lead of the present invention.
Specific implementation mode
Below in conjunction with drawings and examples, the following further describes the technical solution of the present invention.
As shown in Figure 1, for the present invention provides a kind of QFP device pins forming frock, which includes：
Head cover 10,
Pedestal 20 is provided with several fixed columns 21 on the pedestal 20, and head cover 10 is mounted on the pedestal 20 by fixed column 21
Top, head cover 10 can be moved up and down along fixed column 21（Perpendicular to the longitudinal movement of pedestal）；
The first clamping opening 11 in 10 bottom of head cover is set, and first clamping opening is by the two boards shape that is oppositely arranged perpendicular to head cover bottom surface
Object is constituted；
The second clamping opening 22 in base top is set, and second clamping opening is by the two boards shape object that is oppositely arranged perpendicular to base top surface
It constitutes；
Wherein, the first clamping opening is arranged with 11 second clamping opening, 22 alignment relative, constitutes the clamping part of QFP devices so that QFP devices
100 between the first clamping opening and the second clamping opening, and the molding pin 101 to be processed of QFP devices is exposed to outside clamping part.
Pin forming machined surface 23 is additionally provided at the top of the pedestal.
The tooling also includes to press molding scraper plate 30 for pin, sees Fig. 5 b.
The fixed column is symmetrical arranged so that head cover 10 is parallel with pedestal 20.
In preferred embodiment, the tooling includes 4 fixed columns, is separately positioned on the quadrangle of pedestal.
In some embodiments, the fixed column is swing arm.
In some embodiments, knob lid for fixing is additionally provided on the swing arm.
In preferred embodiment, the head cover is in I-shaped, and fixed column is corresponding with the I-shaped mounting hole 12 of four wings,
See Fig. 4.
The application method of the QFP device pin forming frocks of the present invention comprises the steps of：
Step 1, head cover is released from fixed column, as shown in Figure 2；
Step 2, QFP devices are placed on base center, be placed in the second clamping opening, as shown in Figure 3；
Step 3, head cover is added by fixed column so that the first clamping opening is aligned with the second clamping opening, clamps the pin of QFP devices（It leans on
The pin of nearly chip）, so that molding pin to be processed is exposed to outside clamping part, as shown in Figure 4；It fixes to clamp（Using artificial pressure
It is fixed tightly or by knob lid）By shaping device pin so that the pin of device is steady by folder, will not move；Eyes when pressure
Watch device pin attentively, ensures to press to obtain the device not apparent movement of generation in the process；
Step 4, stationary gripping part, molded lead, as shown in Fig. 5 a, 5b：Using scraper plate 30 since pin clamped spot, along
The plate objects of two clamping opening presses down on, and is pressed further along pin forming machined surface, makes pin close to forming face brake forming,
Obtain the QFP devices of both sides pin forming.
Step 5, head cover is opened, the QFP devices of both sides pin forming are rotated horizontally into 90 ° of placements so that unformed two
Side pin is exposed to outside clamping part；
Step 6, step 3-4 is repeated, the QFP devices of four side pin formings are obtained.
Although present disclosure is discussed in detail by above preferred embodiment, but it should be appreciated that above-mentioned
Description is not considered as limitation of the present invention.After those skilled in the art have read the above, for the present invention's
A variety of modifications and substitutions all will be apparent.Therefore, protection scope of the present invention should be limited to the appended claims.
Claims (10)
1. a kind of QFP device pins forming frock, which is characterized in that the tooling includes：
Head cover,
Pedestal is provided with several fixed columns on the pedestal, and head cover is mounted on above the pedestal by fixed column, can be along fixed column
It moves up and down；
The first clamping opening in cap base is set, and first clamping opening is by the two boards shape object structure that is oppositely arranged perpendicular to head cover bottom surface
At；
The second clamping opening in base top is set, and second clamping opening is by the two boards shape object structure that is oppositely arranged perpendicular to base top surface
At；
Wherein, the first clamping opening and the second clamping opening alignment relative are arranged, and constitute the clamping part of QFP devices so that QFP devices are located at the
Between one clamping opening and the second clamping opening, the molding pin to be processed of QFP devices is exposed to outside clamping part.
2. QFP device pins forming frock as described in claim 1, which is characterized in that also set up at the top of the pedestal
There is pin forming machined surface.
3. QFP device pins forming frock as described in claim 1, which is characterized in that the tooling also includes for drawing
Foot presses molding scraper plate.
4. QFP device pins forming frock as described in claim 1, which is characterized in that the fixed column is symmetrical arranged, and is made
It is parallel with pedestal to obtain head cover.
5. QFP device pins forming frock as claimed in claim 4, which is characterized in that the tooling includes 4 fixations
Column is separately positioned on the quadrangle of pedestal.
6. QFP device pins forming frock as described in claim 1, which is characterized in that the fixed column is swing arm.
7. QFP device pins forming frock as claimed in claim 6, which is characterized in that be additionally provided with use on the swing arm
In fixed knob lid.
8. QFP device pins forming frock as described in claim 1, which is characterized in that the head cover is in I-shaped.
9. a kind of application method of QFP device pin forming frocks according to claim 1-8, which is characterized in that the party
Method comprises the steps of：
Step 1, head cover is released from fixed column；
Step 2, QFP devices are placed on base center, be placed in the second clamping opening；
Step 3, head cover is added by fixed column so that the first clamping opening is aligned with the second clamping opening, is clamped the pin of QFP devices, is made
Molding pin to be processed is exposed to outside clamping part；
Step 4, stationary gripping part, molded lead obtain the QFP devices of both sides pin forming；
Step 5, head cover is opened, the QFP devices of both sides pin forming are rotated horizontally into 90 ° of placements；
Step 6, step 3-4 is repeated, the QFP devices of four side pin formings are obtained.
10. the application method of QFP device pins forming frock as claimed in claim 9, which is characterized in that the step 4
The technique of molded lead includes：Using scraper plate since pin clamped spot, pressed down on along the plate object of the second clamping opening, then edge
The pressing of pin forming machined surface, makes pin close to forming face brake forming.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810642665.0A CN108580744B (en) | 2018-06-21 | 2018-06-21 | QFP device pin forming tool and application method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810642665.0A CN108580744B (en) | 2018-06-21 | 2018-06-21 | QFP device pin forming tool and application method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108580744A true CN108580744A (en) | 2018-09-28 |
| CN108580744B CN108580744B (en) | 2024-01-02 |
Family
ID=63628523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810642665.0A Active CN108580744B (en) | 2018-06-21 | 2018-06-21 | QFP device pin forming tool and application method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108580744B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560760A (en) * | 2021-08-06 | 2021-10-29 | 甫洛照明有限公司 | LED chip pin welding device for lighting lamp |
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|---|---|---|---|---|
| JPH08195156A (en) * | 1995-01-18 | 1996-07-30 | Asahi Denki Seisakusho:Kk | Kink section forming device for electronic part with lead wire |
| US5950687A (en) * | 1996-07-04 | 1999-09-14 | Mitsubishi Denki Kabushiki Kaisha | Lead forming apparatus and lead forming method |
| JP2000216321A (en) * | 1999-01-26 | 2000-08-04 | Toshiba Corp | Lead molding device for semiconductor device |
| CN102856237A (en) * | 2012-09-05 | 2013-01-02 | 合肥工业大学 | Pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip |
| CN104138945A (en) * | 2014-07-14 | 2014-11-12 | 中国电子科技集团公司第三十六研究所 | Axial lead component forming machine |
| CN104511552A (en) * | 2013-10-08 | 2015-04-15 | 安费诺（常州）电子有限公司 | Pin header cutting fixture |
| CN205436892U (en) * | 2016-04-12 | 2016-08-10 | 成都长迪传感技术有限公司 | Crooked rupture device of sensor pin or contact pin |
| CN206550258U (en) * | 2017-03-09 | 2017-10-13 | 长兴华超电子科技有限公司 | A kind of transistor pin bending cutting device |
| CN207057528U (en) * | 2017-06-16 | 2018-03-02 | 昆山康伟达电子科技有限公司 | A kind of transistor legs bending foot cut device |
| CN208495641U (en) * | 2018-06-21 | 2019-02-15 | 上海空间电源研究所 | A kind of QFP device pin forming frock |
-
2018
- 2018-06-21 CN CN201810642665.0A patent/CN108580744B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08195156A (en) * | 1995-01-18 | 1996-07-30 | Asahi Denki Seisakusho:Kk | Kink section forming device for electronic part with lead wire |
| US5950687A (en) * | 1996-07-04 | 1999-09-14 | Mitsubishi Denki Kabushiki Kaisha | Lead forming apparatus and lead forming method |
| JP2000216321A (en) * | 1999-01-26 | 2000-08-04 | Toshiba Corp | Lead molding device for semiconductor device |
| CN102856237A (en) * | 2012-09-05 | 2013-01-02 | 合肥工业大学 | Pin trimming device based on recycled DIP (dual in-line package) type IC (integrated circuit) chip |
| CN104511552A (en) * | 2013-10-08 | 2015-04-15 | 安费诺（常州）电子有限公司 | Pin header cutting fixture |
| CN104138945A (en) * | 2014-07-14 | 2014-11-12 | 中国电子科技集团公司第三十六研究所 | Axial lead component forming machine |
| CN205436892U (en) * | 2016-04-12 | 2016-08-10 | 成都长迪传感技术有限公司 | Crooked rupture device of sensor pin or contact pin |
| CN206550258U (en) * | 2017-03-09 | 2017-10-13 | 长兴华超电子科技有限公司 | A kind of transistor pin bending cutting device |
| CN207057528U (en) * | 2017-06-16 | 2018-03-02 | 昆山康伟达电子科技有限公司 | A kind of transistor legs bending foot cut device |
| CN208495641U (en) * | 2018-06-21 | 2019-02-15 | 上海空间电源研究所 | A kind of QFP device pin forming frock |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113560760A (en) * | 2021-08-06 | 2021-10-29 | 甫洛照明有限公司 | LED chip pin welding device for lighting lamp |
| CN113560760B (en) * | 2021-08-06 | 2022-09-16 | 甫洛照明有限公司 | LED chip pin welding device for lighting lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108580744B (en) | 2024-01-02 |
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