JPH02284455A - Method of forming lead of semiconductor device - Google Patents
Method of forming lead of semiconductor deviceInfo
- Publication number
- JPH02284455A JPH02284455A JP1106208A JP10620889A JPH02284455A JP H02284455 A JPH02284455 A JP H02284455A JP 1106208 A JP1106208 A JP 1106208A JP 10620889 A JP10620889 A JP 10620889A JP H02284455 A JPH02284455 A JP H02284455A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- bending
- leads
- package
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000004065 semiconductor Substances 0.000 title claims description 11
- 238000005452 bending Methods 0.000 claims abstract description 31
- 238000000465 moulding Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 abstract description 6
- 238000007747 plating Methods 0.000 abstract description 5
- 239000002699 waste material Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 101100494773 Caenorhabditis elegans ctl-2 gene Proteins 0.000 description 1
- 101100112369 Fasciola hepatica Cat-1 gene Proteins 0.000 description 1
- 101100005271 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) cat-1 gene Proteins 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は表面実装用パッケージ型の半導体装置のリード
成型方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead molding method for a surface-mount package type semiconductor device.
従来の表面実装用パッケージ型の半導体装置は、第３図
（ａ）に示すように、樹脂封止した半導体パッケージ１
の樹脂体をはね１３により支持され且つ上下に動かせる
イジェクタ−ビン３の上に搭載し、半導体パッケージ１
のリード６を受ける成型ダイ１４とばね１５により支持
されたパッド４によりリード６の導出部近傍を押えて固
定する。次に、第３図（ｂ）に示すように、パット４の
外側部に位置しパッド４とは独立して上下に移動する成
型パンチ１６をり−Ｉ〜６の上面に接しながら下降させ
てリード６の」二面を下方にしごく様にこすりながら垂
直に下降し、成型ダイ１４と成型パンチ１６とでリード
先端部１８をクランプし、リード６を成型ダイ１４の形
状に合わせて成型する。A conventional surface-mount package type semiconductor device includes a resin-sealed semiconductor package 1, as shown in FIG. 3(a).
The semiconductor package 1 is mounted on the ejector bin 3 which is supported by the springs 13 and can be moved up and down.
The vicinity of the lead-out portion of the lead 6 is pressed and fixed by a molding die 14 that receives the lead 6 and a pad 4 supported by a spring 15. Next, as shown in FIG. 3(b), the molding punch 16, which is located on the outside of the pad 4 and moves up and down independently of the pad 4, is lowered while touching the top surface of the ri-I to 6. The two surfaces of the lead 6 are vertically lowered while being squeezed downward, the lead tip 18 is clamped by a molding die 14 and a molding punch 16, and the lead 6 is molded to match the shape of the molding die 14.
上述した従来の半導体装置のり一１〜成型方法は、リー
ド成型時に既にリード表面に施された半田めっきか成型
パンチによってこすられてはかれ、下地の金属表面か露
出し、リードか腐食したり、また、そのはがれた半田メ
ツキの屑が成型パンヂ］６の表面に付着し、次に加工す
るり−１〜の平坦性にも悪影響を与えたり、リ−１−と
り−１〜との間にイ」着して隣のり−１〜と短絡を生じ
てしまうという問題もあった。In the conventional semiconductor device bonding method described above, the solder plating already applied to the lead surface during lead molding is rubbed off by the molding punch, and the underlying metal surface is exposed, leading to corrosion. In addition, the peeled solder plating debris may adhere to the surface of the molded pange 6, which may adversely affect the flatness of the molded pange 6 during subsequent processing, or may cause damage to the surface of the molded pange 6. There was also a problem in that a short circuit would occur with the adjacent glue (-1).
また、樹脂封止されたパッケージはリードの反りか約４
０１１ｍあり、リーＩ〜の導出部近傍をクランプして反
りを矯正しなからリード成型を行うため、クランプを解
除すると、もとの反りの状態になり、リードの平坦性が
悪くなるという問題かあった。In addition, the resin-sealed package may have warped leads or approximately 4
011m, and since lead molding is performed without clamping the vicinity of the lead-out part of lead I~ to correct the warpage, when the clamp is released, the warp returns to the original state and the flatness of the lead deteriorates. there were.
本発明の半導体装置のリード成型方法は、ダイとパラ１
へにより、パッケージをクランプし、リードを曲げロー
ラーとダイではさみながら、曲げローラーか夕′イに沿
って回転移動し、リードを成型する。The lead molding method for a semiconductor device of the present invention includes a die and a
Then, the package is clamped, and while the leads are sandwiched between the bending roller and the die, the leads are rotated along the bending roller or the die to form the leads.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の第１の実施例を説明す
るノコめの動作順に示した断面模式図である。FIGS. 1(a) and 1(b) are schematic cross-sectional views illustrating a first embodiment of the present invention, showing the order of operation of a saw.
第１図（ａ）に示すように、パッケージ１は第１のステ
ージて第１の曲げダイ２内に設＋−＋たイジェクタ−ビ
ン３と、はね］５により支持されたバラ１へ４に挟まれ
て固定される。次に、第１の曲げローラー５が」１方よ
り下降してり−Ｆ ６の−４−面を押えつりなから下方
に回転移動し、リ−１へ６を垂直に第１次の曲げ成型を
行う。As shown in FIG. 1(a), the package 1 is inserted into the ejector bin 3 installed in the first bending die 2 at the first stage and into the package 1 supported by the spring 5. It is clamped and fixed. Next, the first bending roller 5 descends from the 1st direction and rotates downward from the 1st direction while holding down the 4th surface of the F 6, and performs the first bending of the 6 perpendicularly to the Lee 1. Perform molding.
次に、第１図（１））に示すように、パッケージ１を第
２のステージに送り、パッケージ］の両側より第２の曲
げダイ７によりり−１・６の両側より挟みつける。次に
、リ−１〜６の内側下部に位置している第２の曲（ナロ
ーラー８か外方に移動して第２の曲Ｇナダイ７に沿って
り−１へ６を押えイ」す、第２の曲げダイ７の型に合わ
せて第２次の曲げ成型を行う。Next, as shown in FIG. 1 (1), the package 1 is sent to the second stage, and the package is sandwiched from both sides of the package by the second bending die 7. Next, move the second track (narrow roller 8) located at the inner lower part of Lees 1 to 6 outward and press 6 to the second track G nadie 7. , second bending is performed in accordance with the shape of the second bending die 7.
第２図は本発明の第２の実施例を説明するだめの断面模
式図である。FIG. 2 is a schematic cross-sectional view for explaining a second embodiment of the present invention.
第１図（ａ、 ）に示す第１の実施例と同様にイジェク
タ−ビン３とパッド４により挟んでパッケージ１を固定
する。次に、曲げダイ９によりリード６の導出部近傍を
支持し、曲げローラー支持部１２にはねコ１を介して支
持された曲げローラー１０を下降させ、リ−１−〇の第
１次の曲げ成型を行い、次に、外方に曲げローラー］０
が曲げダイ９に沿ってリード６を押え付けながら曲げロ
ーラ支持部１２を移動し、リード６の第２次成型を行う
。この実施例では、１組の曲げローラーにてリード成型
が可能のなめ、設備費が安くなるという利点がある。The package 1 is fixed by being sandwiched between an ejector bin 3 and a pad 4 in the same way as in the first embodiment shown in FIG. 1(a,). Next, the vicinity of the lead-out part of the lead 6 is supported by the bending die 9, and the bending roller 10 supported by the bending roller support part 12 via the cat 1 is lowered, and the first order of the lead 1-0 is lowered. Perform bending and then bend outward with roller]0
moves the bending roller support part 12 along the bending die 9 while pressing the lead 6, and performs secondary shaping of the lead 6. This embodiment has the advantage that the lead can be formed using a single set of bending rollers, resulting in lower equipment costs.
以−１−説明しなように本発明は、曲げローラーがリー
ド表面を回転しなから、ダイの形状に沿って移動し、リ
−１・成型することにより、リード表面の半田めっきを
はかずことなくリード成型が可能となり、リード下地金
属の腐食や、半田めっきの屑によるり−ト間の短絡等を
防止して半導体装置の信頼性を向上させるという効果が
ある。As will not be explained below, in the present invention, the bending roller does not rotate the lead surface but moves along the shape of the die and forms the lead without solder plating on the lead surface. This has the effect of improving the reliability of the semiconductor device by preventing corrosion of the lead base metal and shorting between wires due to solder plating debris.
また、樹脂封止されたリードの反りに対しても、ソー１
〜導出部を押えることがをいノこめ、リードの平坦性か
向上する効果かある。In addition, the saw 1
~Pressing the lead-out part has the effect of improving the flatness of the lead.
第１図（ａ）、（ｂ）は本発明の第１の実施例を説明す
るための動作順に示した断面模式図、第２図は本発明の
第２の実施例を説明するだめの断面模式図、第３図（ａ
）、（ｂ）は従来の半導体装置のリード成型方法を説明
するための動作順に示した断面模式図である。
１・・・パッケージ、２・・・第１曲げダイ、３ ・イ
ジェクタ−ビン、４・パラ１〜．５・・第１曲げローラ
６・・・リード、７・・第２曲げダイ、８・第２曲げロ
ーラー、９・・夕゛イ、］０・・・曲げローラー１］・
・はね、１２・・曲げローラー支持部、１３ばね、１４
・・・成型ダイ、１５・ばね、１６・・・成型パンチ、
１８・・・リード先端部。FIGS. 1(a) and (b) are schematic cross-sectional views showing the order of operation for explaining the first embodiment of the present invention, and FIG. 2 is a cross-sectional diagram for explaining the second embodiment of the present invention. Schematic diagram, Figure 3 (a
) and (b) are schematic cross-sectional views shown in order of operation for explaining a conventional lead forming method for a semiconductor device. DESCRIPTION OF SYMBOLS 1... Package, 2... First bending die, 3. Ejector bin, 4. Paragraph 1~. 5..First bending roller 6..Lead, 7..Second bending die, 8..Second bending roller, 9..Die, ]0..Bending roller 1].
・Spring, 12...Bending roller support section, 13 Spring, 14
... Molding die, 15. Spring, 16... Molding punch,
18...Lead tip.
Claims (1)
を有する半導体装置のリード成型方法において、前記パ
ッケージを成型用のダイ上に搭載して前記リードを曲げ
ローラーと前記ダイではさみながら前記曲げローラーが
前記ダイに沿って回転移動し、前記リードを成型するこ
とを特徴とする半導体装置のリード成型方法。In a lead molding method for a semiconductor device in which the leads of a surface mount package have a gull-wing shape, the package is mounted on a molding die, and the bending roller is placed between the die and the bending roller while sandwiching the lead between the bending roller and the die. A method for molding a lead for a semiconductor device, characterized in that the lead is molded by rotationally moving along the lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1106208A JPH02284455A (en) | 1989-04-25 | 1989-04-25 | Method of forming lead of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1106208A JPH02284455A (en) | 1989-04-25 | 1989-04-25 | Method of forming lead of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02284455A true JPH02284455A (en) | 1990-11-21 |
Family
ID=14427742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1106208A Pending JPH02284455A (en) | 1989-04-25 | 1989-04-25 | Method of forming lead of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02284455A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730031A (en) * | 1993-07-09 | 1995-01-31 | Nec Corp | Lead formation |
| JPH07161892A (en) * | 1993-12-09 | 1995-06-23 | Nec Corp | Method and apparatus for lead forming |
| US5950687A (en) * | 1996-07-04 | 1999-09-14 | Mitsubishi Denki Kabushiki Kaisha | Lead forming apparatus and lead forming method |
| KR100411254B1 (en) * | 2001-06-04 | 2003-12-18 | 삼성전기주식회사 | Method of attaching a lid in smd package |
| CN104138945A (en) * | 2014-07-14 | 2014-11-12 | 中国电子科技集团公司第三十六研究所 | Axial lead component forming machine |
| CN106238621A (en) * | 2016-09-14 | 2016-12-21 | 合肥邦立电子股份有限公司 | A kind of tongue tube lead-in wire automatic bending equipment of uninterrupted feeding in continuous material |
| CN106363101A (en) * | 2016-09-14 | 2017-02-01 | 合肥邦立电子股份有限公司 | Reed switch lead bending device |
| CN110449535A (en) * | 2019-08-29 | 2019-11-15 | 上海威克鲍尔通信科技有限公司 | A kind of bulk cargo resistance alignment bending mechanism |
| CN111438294A (en) * | 2020-04-09 | 2020-07-24 | 向军 | Triode pin bending machine |
| CN112739051A (en) * | 2020-11-23 | 2021-04-30 | 王莹 | Full-automatic shaper of high performance medical science ray detection product K type pin |
-
1989
- 1989-04-25 JP JP1106208A patent/JPH02284455A/en active Pending
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0730031A (en) * | 1993-07-09 | 1995-01-31 | Nec Corp | Lead formation |
| JPH07161892A (en) * | 1993-12-09 | 1995-06-23 | Nec Corp | Method and apparatus for lead forming |
| US5950687A (en) * | 1996-07-04 | 1999-09-14 | Mitsubishi Denki Kabushiki Kaisha | Lead forming apparatus and lead forming method |
| KR100411254B1 (en) * | 2001-06-04 | 2003-12-18 | 삼성전기주식회사 | Method of attaching a lid in smd package |
| CN104138945A (en) * | 2014-07-14 | 2014-11-12 | 中国电子科技集团公司第三十六研究所 | Axial lead component forming machine |
| CN104138945B (en) * | 2014-07-14 | 2016-04-27 | 中国电子科技集团公司第三十六研究所 | A kind of axial lead element forming machine |
| CN106238621A (en) * | 2016-09-14 | 2016-12-21 | 合肥邦立电子股份有限公司 | A kind of tongue tube lead-in wire automatic bending equipment of uninterrupted feeding in continuous material |
| CN106363101A (en) * | 2016-09-14 | 2017-02-01 | 合肥邦立电子股份有限公司 | Reed switch lead bending device |
| CN106238621B (en) * | 2016-09-14 | 2018-04-06 | 合肥邦立电子股份有限公司 | A kind of tongue tube lead automatic bending equipment of uninterrupted feeding in continuous material |
| CN110449535A (en) * | 2019-08-29 | 2019-11-15 | 上海威克鲍尔通信科技有限公司 | A kind of bulk cargo resistance alignment bending mechanism |
| CN111438294A (en) * | 2020-04-09 | 2020-07-24 | 向军 | Triode pin bending machine |
| CN112739051A (en) * | 2020-11-23 | 2021-04-30 | 王莹 | Full-automatic shaper of high performance medical science ray detection product K type pin |
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