JP3226035B2 - Electronic component positioning lead bending device and bending method - Google Patents
Electronic component positioning lead bending device and bending methodInfo
- Publication number
- JP3226035B2 JP3226035B2 JP1651699A JP1651699A JP3226035B2 JP 3226035 B2 JP3226035 B2 JP 3226035B2 JP 1651699 A JP1651699 A JP 1651699A JP 1651699 A JP1651699 A JP 1651699A JP 3226035 B2 JP3226035 B2 JP 3226035B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- support
- positioning
- positioning lead
- support surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、リードの曲げ技
術、特に電子部品の位置決めリードを容易且つ確実に曲
げられる装置及び方法に属する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead bending technique, and more particularly to an apparatus and a method for easily and reliably bending a positioning lead of an electronic component.
【０００２】[0002]
【従来の技術】外部リードが導出された樹脂封止体を有
する半導体装置を製造する際に、例えば特公平７−３６
４３０号公報に示されるように、支持板と、支持板の一
方の端部に連結された外部リード（接続用外部端子）
と、支持板の他方の端部に連結された位置決めリード
と、支持板上に固着された半導体チップと、半導体チッ
プの電極と外部リードとを接続するリード細線とを備え
たリードフレームを準備する。位置決めリードには切欠
部による小断面部が脆弱部として予め形成され、位置決
めリードに引張力が加えられたときに、位置決めリード
は小断面部で破断する。外部リードと位置決めリードと
を金型の上型と下型で挟持した後、支持板、半導体チッ
プ、リード細線及び外部リードの支持板側を外囲体とし
ての樹脂封止体で完全に封止して樹脂モールドを行い、
支持板の全面を被覆することができる。外囲体の形成後
に、位置決めリードを導出方向に引張り、位置決めリー
ドを外囲体の内側に位置する小断面部で切断することが
でき、外囲体からの金属の露出部分が外部リード以外に
実質的に存在しない半導体装置を製造することができ
る。2. Description of the Related Art When manufacturing a semiconductor device having a resin sealing body from which external leads are led out, for example, Japanese Patent Publication No. 7-36
As shown in JP-A-430-430, a support plate and an external lead (connection external terminal) connected to one end of the support plate
Preparing a lead frame including: a positioning lead connected to the other end of the support plate; a semiconductor chip fixed on the support plate; and fine wires for connecting electrodes of the semiconductor chip to external leads. . The positioning lead is previously formed with a small cross-section formed by a notch as a fragile portion, and when a tensile force is applied to the positioning lead, the positioning lead breaks at the small cross-section. After sandwiching the external lead and the positioning lead between the upper and lower molds of the mold, the support plate, semiconductor chip, fine lead wires, and the support plate side of the external lead are completely sealed with a resin sealing body as an outer enclosure. And mold the resin,
The entire surface of the support plate can be covered. After forming the outer enclosure, the positioning lead can be pulled in the lead-out direction, and the positioning lead can be cut at a small cross-section located inside the outer enclosure. A semiconductor device that does not substantially exist can be manufactured.
【０００３】ところで、位置決めリードの切断の際に、
単に導出方向に引張っても外囲体に密着する位置決めリ
ードを外囲体の内側で容易に切断することはできない。
また、大きな力で引張ると、位置決めリードの周辺で外
囲体の一部が剥がれ落ちて外囲体に欠けが生じることが
あった。このため、位置決めリードを引張り切断すると
きは、位置決めリードを導出部分近傍で一度曲げて、密
着する外囲体から位置決めリードを剥がした後に、引張
り切断を行うことが必要となる。By the way, when cutting the positioning lead,
Even if the lead is simply pulled in the lead-out direction, the positioning lead that is in close contact with the envelope cannot be easily cut inside the envelope.
In addition, when the pull is applied with a large force, a part of the surrounding body is peeled off around the positioning lead, and the surrounding body may be chipped. For this reason, when the positioning lead is to be cut by tension, it is necessary to bend the positioning lead once in the vicinity of the lead-out portion and to peel off the positioning lead from the closely attached envelope, and then to perform the tension cutting.
【０００４】図４は、位置決めリードを引張り切断する
際に、位置決めリードに曲げ加工を施す従来の曲げ加工
装置を示す。この曲げ加工装置は、支持台(1)と、支持
台(1)の上部に配置された押さえ用治具(2)と、曲げ用治
具(3)とを備えている。支持台(1)には切欠部(4)が形成
され、切欠部(4)にリードフレーム(5)の樹脂封止体（外
囲体）(6)を配置し、外部リード(7)は支持台(1)上に延
び、位置決めリード(8)は外部リード(7)とは反対側で支
持台(1)から突出する。リードフレーム(5)の樹脂封止体
(6)を支持台(1)の切欠部(4)上に配置した後、押さえ用
治具(2)により樹脂封止体(6)を支持台(1)上に押圧して
リードフレーム(5)を支持台(1)上に固定する。この状態
で曲げ用治具(3)を上方に移動して位置決めリード(8)を
上方に曲げて塑性変形させる。FIG. 4 shows a conventional bending apparatus for bending a positioning lead when the positioning lead is pulled and cut. This bending apparatus includes a support table (1), a holding jig (2) disposed above the support table (1), and a bending jig (3). A notch (4) is formed in the support base (1), and a resin sealing body (enclosure) (6) of the lead frame (5) is arranged in the notch (4). The positioning lead (8) extends on the support (1), and protrudes from the support (1) on the side opposite to the external lead (7). Resin sealed body of lead frame (5)
After placing (6) on the notch (4) of the support base (1), the resin sealing body (6) is pressed onto the support base (1) by the holding jig (2), and the lead frame ( 5) is fixed on the support (1). In this state, the bending jig (3) is moved upward to bend the positioning lead (8) upward to plastically deform.
【０００５】[0005]
【発明が解決しようとする課題】このように、従来の曲
げ加工装置では、位置決めリード(8)を予め曲げて樹脂
封止体(6)から位置決めリード(8)を分離した後、位置決
めリード(8)を引張り切断できるので、樹脂封止体(6)の
欠けを防止して樹脂封止体(6)の内側で容易に切断でき
るが、複雑な構造を有する従来の曲げ加工装置を使用し
て良好な生産性で曲げ加工を行うことができなかった。
そこで、本発明は、位置決めリードを容易に且つ確実に
曲げられる電子部品の位置決めリード曲げ装置及び曲げ
法を提供することを目的とする。As described above, in the conventional bending apparatus, the positioning lead (8) is bent in advance to separate the positioning lead (8) from the resin sealing body (6), and then the positioning lead (8) is formed. Since 8) can be cut by pulling, the chipping of the resin sealing body (6) can be prevented and it can be cut easily inside the resin sealing body (6). Could not be bent with good productivity.
Accordingly, an object of the present invention is to provide a positioning lead bending apparatus and a bending method for an electronic component in which a positioning lead can be easily and reliably bent.
【０００６】[0006]
【課題を解決するための手段】本発明による電子部品の
位置決めリード曲げ装置は、支持台(10)と、支持台(10)
に対しリードフレーム(5)の外囲体(6)を押圧する押圧部
材(11)とを備えている。支持台(10)は、リードフレーム
(5)に設けられた外囲体(6)の外部リード(7)が導出され
た端面(6a)を当接させるストッパ面(13)と、ストッパ面
(13)から下方に向かって傾斜し且つ外囲体(6)を受ける
支持面(14)と、支持面(14)に対し逆方向に傾斜し且つ端
面(6a)とは反対側で外囲体(6)から導出された位置決め
リード(8)を支持する案内面(15)とを備えている。外囲
体(6)の端面(6a)をストッパ面(13)に当接させた状態で
位置決めリード(8)を案内面(15)に係止させて押圧部材
(11)により外囲体(6)を支持面(14)に押圧し、位置決め
リード(8)を案内面(15)によって所定の角度に曲げる。
このように、支持面(14)に対して所与の角度で形成され
た案内面(15)に位置決めリード(8)の先端部(8a)を係止
させて押圧部材(11)により外囲体(6)を支持面(14)に押
圧すると、位置決めリード(8)の外囲体(6)からの導出部
(8b)に最大曲げモーメントが加えられる。このため、外
囲体(6)を支持面(14)に押圧する簡便な操作により、位
置決めリード(8)の導出部(8b)を塑性変形させ所定の角
度に曲げることができる。位置決めリード(8)を曲げる
際に、位置決めリード(8)は外囲体(6)を押圧する力を生
ずるが、外囲体(6)の端面(6a)がストッパ面(13)に当接
するため、電子部品はストッパ面(13)に当接する状態に
保持され、位置決めリード(8)が確実に曲げられる。An electronic component positioning lead bending apparatus according to the present invention comprises a support (10) and a support (10).
And a pressing member (11) for pressing the outer body (6) of the lead frame (5). The support (10) is a lead frame
A stopper surface (13) for abutting an end surface (6a) from which an external lead (7) of an enclosure (6) provided in (5) is led out; and a stopper surface.
(13) a support surface (14) which is inclined downward and receives the enclosure (6); and an outer surface which is inclined in the opposite direction to the support surface (14) and is opposite to the end surface (6a). A guide surface (15) for supporting a positioning lead (8) derived from the body (6). With the end surface (6a) of the outer body (6) abutting against the stopper surface (13), the positioning lead (8) is locked to the guide surface (15) to press the pressing member.
The surrounding body (6) is pressed against the support surface (14) by (11), and the positioning lead (8) is bent to a predetermined angle by the guide surface (15).
As described above, the distal end portion (8a) of the positioning lead (8) is locked to the guide surface (15) formed at a given angle with respect to the support surface (14), and is surrounded by the pressing member (11). When the body (6) is pressed against the support surface (14), the positioning lead (8) is led out from the surrounding body (6).
The maximum bending moment is applied to (8b). For this reason, the lead-out portion (8b) of the positioning lead (8) can be plastically deformed and bent to a predetermined angle by a simple operation of pressing the envelope (6) against the support surface (14). When bending the positioning lead (8), the positioning lead (8) generates a force to press the envelope (6), but the end surface (6a) of the envelope (6) comes into contact with the stopper surface (13). Therefore, the electronic component is held in a state of contacting the stopper surface (13), and the positioning lead (8) is reliably bent.
【０００７】本発明の実施の形態では、リードフレーム
(5)の外部リード(7)を支持する平坦な上面(12)を備え、
支持面(14)に対し略直角なストッパ面(13)は平坦な上面
(12)に対して段差を形成する。押圧部材(11)は支持面(1
4)に対し直角方向に移動可能に設けられ、位置決めリー
ド(8)を曲げながら外囲体(6)の全面を支持面(14)に押圧
できる。支持面(14)と案内面(15)との角度は９０゜〜１
５０゜であり、支持面(14)と上面(12)との角度は１８５
゜〜２３０゜である。In an embodiment of the present invention, a lead frame
It has a flat top surface (12) that supports the external leads (7) of (5),
The stopper surface (13) substantially perpendicular to the support surface (14) is a flat upper surface
A step is formed with respect to (12). The pressing member (11) is
It is provided so as to be movable in a direction perpendicular to 4), and can press the entire surface of the envelope (6) against the support surface (14) while bending the positioning lead (8). The angle between the support surface (14) and the guide surface (15) is 90 ° to 1
50 ° and the angle between the support surface (14) and the upper surface (12) is 185.
゜ to 230 ゜.
【０００８】本発明による電子部品の位置決めリード曲
げ法は、リードフレーム(5)に設けられた外囲体(6)の外
部リード(7)が導出された端面(6a)を当接させるストッ
パ面(13)と、ストッパ面(13)から下方に向かって傾斜し
且つ外囲体(6)を受ける支持面(14)と、支持面(14)に対
し逆方向に傾斜し且つ端面(6a)とは反対側で外囲体(6)
から導出された位置決めリード(8)を支持する案内面(1
5)とを備えた支持台(10)を準備する工程と、支持台(10)
の支持面(14)にリードフレーム(5)の外囲体(6)を対向さ
せると共に、リードフレーム(5)の位置決めリード(8)を
案内面(15)に係止させてリードフレーム(5)を支持台(1
0)上に配置する工程と、外囲体(6)の端面(6a)をストッ
パ面(13)に当接させた状態でリードフレーム(5)の外囲
体(6)を支持面(14)に対し押圧して案内面(15)により位
置決めリード(8)を所定の角度に曲げる工程とを含む。According to the method of bending a lead for positioning an electronic component according to the present invention, a stopper surface for abutting an end surface (6a) of an enclosure (6) provided on a lead frame (5) from which an external lead (7) is led out. (13), a support surface (14) inclined downward from the stopper surface (13) and receiving the envelope (6), and an end surface (6a) inclined in the opposite direction to the support surface (14). Enclosure on the opposite side (6)
Guide surface (1) supporting the positioning lead (8)
5) and a step of preparing a support (10) comprising:
The outer frame (6) of the lead frame (5) is opposed to the support surface (14) of the lead frame (5), and the positioning leads (8) of the lead frame (5) are locked to the guide surface (15) so that the ) To the support base (1
0), and the outer frame (6) of the lead frame (5) is supported on the supporting surface (14) with the end surface (6a) of the outer frame (6) abutting against the stopper surface (13). ) To bend the positioning lead (8) to a predetermined angle by the guide surface (15).
【０００９】本発明の実施の形態では、支持台(10)の支
持面(14)に対し直角に押圧部材(11)を移動させて外囲体
(6)を支持面(14)に押圧して位置決めリード(8)を曲げ
る。引張力を加えて曲げられた位置決めリード(8)を切
断する工程が行われる。According to the embodiment of the present invention, the pressing member (11) is moved at right angles to the support surface (14) of the support base (10) to move the outer enclosure (10).
(6) is pressed against the support surface (14) to bend the positioning lead (8). A step of cutting the bent positioning lead (8) by applying a tensile force is performed.
【００１０】[0010]
【発明の実施の形態】半導体装置に適用した本発明によ
る電子部品の位置決めリード曲げ装置及び曲げ法の一実
施の形態を図１〜図３について説明する。図１〜図３で
は図４に示す箇所と同一の部分には同一の符号を付し、
説明を省略する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an apparatus and a method for bending a lead for positioning electronic components according to the present invention applied to a semiconductor device will be described with reference to FIGS. 1 to 3, the same parts as those shown in FIG.
Description is omitted.
【００１１】図１及び図２に示すように、本発明による
電子部品の位置決めリード曲げ装置は、支持台(10)と、
支持台(10)に対しリードフレーム(5)の外囲体(6)を押圧
する押圧部材(11)とを備えている。図１に示すように、
リードフレーム(5)の外囲体(6)の端面(6a)から並行に導
出される複数の外部リード(7)は、外部リード(7)に対し
直角方向に延びる内側連結条(20)と外側連結条(21)によ
り互いに接続されている。また、端面(6a)とは反対側で
外囲体(6)から導出される隣合う位置決めリード(8)は、
位置決めリード(8)に対し直角方向に延びる位置決め連
結条(22)により互いに接続される。As shown in FIGS. 1 and 2, an electronic component positioning lead bending apparatus according to the present invention comprises a support (10),
A pressing member (11) for pressing the outer frame (6) of the lead frame (5) against the support (10) is provided. As shown in FIG.
The plurality of external leads (7) led out in parallel from the end surface (6a) of the outer enclosure (6) of the lead frame (5) have an inner connecting strip (20) extending in a direction perpendicular to the external lead (7). They are connected to each other by outer connecting strips (21). In addition, the adjacent positioning lead (8) led out of the envelope (6) on the opposite side to the end surface (6a) is
They are connected to each other by positioning connecting strips (22) extending at right angles to the positioning leads (8).
【００１２】図２に示すように、支持台(10)は、リード
フレーム(5)の外部リード(7)を支持する平坦な上面(12)
と、外囲体(6)の端面(6a)を当接させるストッパ面(13)
と、ストッパ面(13)から下方に向かって傾斜し且つ外囲
体(6)を受ける支持面(14)と、支持面(14)に対し逆方向
に傾斜し且つ位置決めリード(8)を支持する案内面(15)
とを備えている。上面(12)の端部には長さ方向に突起(1
2a)が形成され、案内面(15)の外側には上面(12)と平行
な縁面(16)が形成される。支持面(14)に対し略直角なス
トッパ面(13)は平坦な上面(12)に対して段差を形成す
る。この段差の高さは、電子部品の外部リード(7)の下
面と外囲体(6)の下面との間隔にほぼ等しい。支持面(1
4)と案内面(15)との角度θ1はθ1＝９０゜〜１５０゜、
例えば１２０゜であり、支持面(14)と上面(12)との角度
θ2はθ2＝１８５゜〜２３０゜、例えば１９５゜であ
る。押圧部材(11)は支持面(14)に対し直角方向に移動可
能に設けられる。As shown in FIG. 2, the support (10) has a flat upper surface (12) for supporting the external leads (7) of the lead frame (5).
And a stopper surface (13) for contacting the end surface (6a) of the enclosure (6).
And a support surface (14) inclined downward from the stopper surface (13) and receiving the enclosure (6), and inclined in the opposite direction to the support surface (14) to support the positioning lead (8). Guideway to do (15)
And The end of the upper surface (12) has a protrusion (1
2a) is formed, and an edge surface (16) parallel to the upper surface (12) is formed outside the guide surface (15). The stopper surface (13) substantially perpendicular to the support surface (14) forms a step with the flat upper surface (12). The height of this step is substantially equal to the distance between the lower surface of the external lead (7) of the electronic component and the lower surface of the outer enclosure (6). Support surface (1
The angle θ 1 between 4) and the guide surface (15) is θ 1 = 90 ° to 150 °,
For example, it is 120 °, and the angle θ 2 between the support surface (14) and the upper surface (12) is θ 2 = 185 ° to 230 °, for example, 195 °. The pressing member (11) is provided movably in a direction perpendicular to the support surface (14).
【００１３】位置決めリード(8)を所定の角度に曲げる
際に、まずリードフレーム(5)に設けられた外囲体(6)の
外部リード(7)が導出された端面(6a)を当接させるスト
ッパ面(13)と、ストッパ面(13)から下方に向かって傾斜
し且つ外囲体(6)を受ける支持面(14)と、支持面(14)に
対し逆方向に傾斜し且つ端面(6a)とは反対側で外囲体
(6)から導出された位置決めリード(8)を支持する案内面
(15)とを備えた支持台(10)を準備する。次に、支持台(1
0)の支持面(14)にリードフレーム(5)の外囲体(6)を対向
させると共に、リードフレーム(5)の位置決めリード(8)
を案内面(15)に係止させてリードフレーム(5)を支持台
(10)上に配置する。続いて、支持台(10)の支持面(14)に
対し直角に押圧部材(11)を移動させてリードフレーム
(5)の外囲体(6)を支持面(14)に対し押圧すると、図３に
示すように、支持面(14)に対して所与の角度で形成され
た案内面(15)に位置決めリード(8)の先端部(8a)を係止
させて押圧部材(11)により外囲体(6)を支持面(14)に押
圧すると、位置決めリード(8)の外囲体(6)からの導出部
(8b)に最大曲げモーメントが加えられる。このため、外
囲体(6)を支持面(14)に押圧する簡便な操作により、位
置決めリード(8)の導出部(8b)を塑性変形させ所定の角
度に曲げることができる。位置決めリード(8)を曲げる
際に、位置決めリード(8)は外囲体(6)を押圧する力を生
ずるが、外囲体(6)の端面(6a)がストッパ面(13)に当接
するため、電子部品はストッパ面(13)に当接する状態に
保持され、位置決めリード(8)が確実に曲げられる。位
置決めリード(8)が曲げられると、位置決めリード(8)は
外囲体(6)から分離するので、その後、引張力を加えて
曲げられた位置決めリード(8)を切断する。When the positioning lead (8) is bent to a predetermined angle, first, the end face (6a) from which the external lead (7) of the enclosure (6) provided on the lead frame (5) is led out is brought into contact. A stopper surface (13), a support surface (14) inclined downwardly from the stopper surface (13) and receiving the enclosure (6), and an end surface inclined in the opposite direction to the support surface (14). Enclosure on the opposite side from (6a)
Guide surface supporting positioning lead (8) derived from (6)
A support (10) provided with (15) is prepared. Next, the support (1
The outer surface (6) of the lead frame (5) is opposed to the support surface (14) of the lead frame (0), and the positioning leads (8) of the lead frame (5) are provided.
To the guide surface (15) and mount the lead frame (5) on the support base.
(10) Place on top. Subsequently, the pressing member (11) is moved at right angles to the support surface (14) of the support base (10) to move the lead frame.
When the envelope (6) of (5) is pressed against the support surface (14), as shown in FIG. 3, the guide surface (15) formed at a given angle with respect to the support surface (14) is formed. When the distal end (8a) of the positioning lead (8) is locked and the outer member (6) is pressed against the support surface (14) by the pressing member (11), the outer member (6) of the positioning lead (8) is pressed. Derived from
The maximum bending moment is applied to (8b). For this reason, the lead-out portion (8b) of the positioning lead (8) can be plastically deformed and bent to a predetermined angle by a simple operation of pressing the envelope (6) against the support surface (14). When bending the positioning lead (8), the positioning lead (8) generates a force to press the envelope (6), but the end surface (6a) of the envelope (6) comes into contact with the stopper surface (13). Therefore, the electronic component is held in a state of contacting the stopper surface (13), and the positioning lead (8) is reliably bent. When the positioning lead (8) is bent, the positioning lead (8) is separated from the envelope (6), and thereafter, the bent positioning lead (8) is cut by applying a tensile force.
【００１４】本実施の形態は下記の作用効果を有する。 ［１］ 外囲体(6)を支持面(14)に押圧する簡便な操作
により位置決めリード(8)の導出部を曲げることができ
る。 ［２］ 位置決めリード(8)を所定の角度に容易に曲げ
ることができる。 ［３］ 電子部品の位置決めリード曲げ装置を少ない部
品数で構成できる。 ［４］ 電子部品の生産性を向上できる。 ［５］ 位置決めリード曲げ装置の製造コスト及び位置
決めリード(8)の操作コストを低減することができる。 ［６］ 従来の曲げ用治具(3)を使用せず、支持台(10)
と押圧部材(11)により位置決めリード(8)を曲げること
ができる。 本発明の前記実施の形態は変更が可能である。例えば、
半導体装置以外の樹脂封止型電子部品にも本発明を適用
することができる。This embodiment has the following functions and effects. [1] The lead-out portion of the positioning lead (8) can be bent by a simple operation of pressing the envelope (6) against the support surface (14). [2] The positioning lead (8) can be easily bent to a predetermined angle. [3] An electronic component positioning lead bending apparatus can be configured with a small number of components. [4] The productivity of electronic components can be improved. [5] The manufacturing cost of the positioning lead bending device and the operation cost of the positioning lead (8) can be reduced. [6] Without using the conventional bending jig (3), support table (10)
The positioning lead (8) can be bent by the pressing member (11). The embodiments of the present invention can be modified. For example,
The present invention can be applied to a resin-sealed electronic component other than a semiconductor device.
【００１５】[0015]
【発明の効果】前記のように、本発明では、位置決めリ
ードを容易に且つ確実に曲げることができ、電子部品の
生産性を向上すると共に、コストを削減することが可能
となる。As described above, according to the present invention, the positioning leads can be easily and reliably bent, thereby improving the productivity of electronic components and reducing costs.
【図１】 本発明による電子部品の位置決めリード曲げ
装置にリードフレームを配置した状態を示す平面図FIG. 1 is a plan view showing a state in which a lead frame is arranged in an electronic component positioning lead bending apparatus according to the present invention.
【図２】 位置決めリードを曲げる前の状態を示す図１
の側面図FIG. 2 is a view showing a state before a positioning lead is bent.
Side view of
【図３】 位置決めリードを曲げた状態を示す図１の側
面図FIG. 3 is a side view of FIG. 1 showing a state in which a positioning lead is bent.
【図４】 従来の曲げ加工装置を示す側面図FIG. 4 is a side view showing a conventional bending apparatus.
(5)・・リードフレーム、 (6)・・外囲体、 (6a)・・
端面、 (7)・・外部リード、 (8)・・位置決めリー
ド、 (10)・・支持台、 (11)・・押圧部材、(12)・・
上面、 (13)・・ストッパ面、 (14)・・支持面、 (1
5)・・案内面、(5) ・ ・ Lead frame, (6) ・ ・ Enclosure, (6a) ・ ・
End face, (7) ... external lead, (8) ... positioning lead, (10) ... support base, (11) ... pressing member, (12) ...
Top surface, (13) Stopper surface, (14) Support surface, (1
5) ・ ・ Guidance surface,
Claims (9)
ムの外囲体を押圧する押圧部材とを備え、 前記支持台は、前記リードフレームに設けられた外囲体
の前記外部リードが導出された端面を当接させるストッ
パ面と、該ストッパ面から下方に向かって傾斜し且つ前
記外囲体を受ける支持面と、支持面に対し逆方向に傾斜
し且つ前記端面とは反対側で前記外囲体から導出された
位置決めリードを支持する案内面とを備え、 前記外囲体の端面をストッパ面に当接させた状態で前記
位置決めリードを前記案内面に係止させて前記押圧部材
により前記外囲体を前記支持面に押圧し、前記位置決め
リードを前記案内面によって所定の角度に曲げることを
特徴とする電子部品の位置決めリード曲げ装置。1. A supporting member, comprising: a supporting member; and a pressing member that presses the outer member of the lead frame against the supporting member, wherein the outer lead of the outer member provided on the lead frame is derived from the supporting member. A stopper surface that abuts the formed end surface, a support surface that is inclined downward from the stopper surface and receives the outer enclosure, and is inclined in a direction opposite to the support surface and opposite to the end surface. A guide surface for supporting a positioning lead led out of the outer enclosure, wherein the positioning lead is locked to the guide surface in a state where the end surface of the outer enclosure is in contact with a stopper surface, and the pressing member An electronic component positioning lead bending apparatus, wherein the outer casing is pressed against the support surface, and the positioning lead is bent at a predetermined angle by the guide surface.
する平坦な上面を備え、前記ストッパ面は前記平坦な上
面に対して段差を形成する請求項１に記載の電子部品の
位置決めリード曲げ装置。2. The apparatus according to claim 1, further comprising a flat upper surface for supporting external leads of the lead frame, wherein the stopper surface forms a step with respect to the flat upper surface.
゜〜２３０゜である請求項２に記載の電子部品の位置決
めリード曲げ装置。3. An angle between the support surface and the upper surface is 185.
The electronic component positioning lead bending apparatus according to claim 2, wherein the angle is in the range of {゜ 230}.
向に移動可能に設けられ、前記位置決めリードを曲げな
がら前記外囲体の全面を前記支持面に押圧できる請求項
１〜３のいずれか１項に記載の電子部品の位置決めリー
ド曲げ装置。4. The pressing member according to claim 1, wherein the pressing member is provided so as to be movable in a direction perpendicular to the support surface, and can press the entire surface of the outer enclosure against the support surface while bending the positioning lead. Item 2. An electronic component positioning lead bending device according to item 1.
角である請求項１〜４のいずれか１項に記載の電子部品
の位置決めリード曲げ装置。5. The device according to claim 1, wherein the stopper surface is substantially perpendicular to the support surface.
１５０゜である請求項１〜５のいずれか１項に記載の電
子部品の位置決めリード曲げ装置。6. The angle between the support surface and the guide surface is 90 ° or more.
The electronic component positioning lead bending apparatus according to any one of claims 1 to 5, wherein the angle is 150 °.
部リードが導出された端面を当接させるストッパ面と、
該ストッパ面から下方に向かって傾斜し且つ前記外囲体
を受ける支持面と、支持面に対し逆方向に傾斜し且つ前
記端面とは反対側で前記外囲体から導出された位置決め
リードを支持する案内面とを備えた支持台を準備する工
程と、 前記支持台の支持面に前記リードフレームの外囲体を対
向させると共に、前記リードフレームの位置決めリード
を前記案内面に係止させて前記リードフレームを前記支
持台上に配置する工程と、 前記外囲体の端面をストッパ面に当接させた状態で前記
リードフレームの外囲体を前記支持面に対し押圧して前
記案内面により前記位置決めリードを所定の角度に曲げ
る工程とを含むことを特徴とする電子部品の位置決めリ
ード曲げ法。7. A stopper surface for contacting an end surface of an outer enclosure provided on a lead frame from which an external lead is led out,
A support surface inclined downward from the stopper surface and receiving the outer body, and a positioning lead inclined from the support surface in a direction opposite to the support surface and led out of the outer body at a side opposite to the end surface. A step of preparing a support having a guide surface to be provided, and an outer enclosure of the lead frame facing the support surface of the support, and a positioning lead of the lead frame is locked to the guide surface. Arranging a lead frame on the support, and pressing the outer frame of the lead frame against the support surface in a state where the end surface of the outer frame is in contact with a stopper surface; Bending the positioning lead to a predetermined angle.
材を移動させて前記外囲体を前記支持面に押圧して前記
位置決めリードを曲げる請求項７に記載の電子部品の位
置決めリード曲げ法。8. The bending of the positioning lead of the electronic component according to claim 7, wherein a pressing member is moved at right angles to a supporting surface of the support table to press the outer enclosure against the supporting surface to bend the positioning lead. Law.
リードを切断する工程が行われる請求項７又は８に記載
の電子部品の位置決めリード曲げ法。9. The method according to claim 7, wherein the step of cutting the bent positioning lead by applying a tensile force is performed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1651699A JP3226035B2 (en) | 1999-01-26 | 1999-01-26 | Electronic component positioning lead bending device and bending method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1651699A JP3226035B2 (en) | 1999-01-26 | 1999-01-26 | Electronic component positioning lead bending device and bending method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000216319A JP2000216319A (en) | 2000-08-04 |
| JP3226035B2 true JP3226035B2 (en) | 2001-11-05 |
Family
ID=11918447
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1651699A Expired - Fee Related JP3226035B2 (en) | 1999-01-26 | 1999-01-26 | Electronic component positioning lead bending device and bending method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3226035B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103286241A (en) * | 2013-05-09 | 2013-09-11 | 苏州金牛精密机械有限公司 | Fixture for processing pins of electronic components |
| CN112719130B (en) * | 2020-12-11 | 2022-02-22 | 张健 | Angle shaping device |
| CN112845953B (en) * | 2020-12-22 | 2023-08-18 | 国网河南省电力公司获嘉县供电公司 | LED fluorescent tube participate in bending device based on electric power technique |
-
1999
- 1999-01-26 JP JP1651699A patent/JP3226035B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000216319A (en) | 2000-08-04 |
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