JP2550725Y2 - Molding equipment for semiconductor devices - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding device for semiconductor devices.

[0002]

2. Description of the Related Art In a semiconductor device, a semiconductor chip is mounted on a die pad of a lead frame having a large number of leads formed by press working or etching, and a bonding pad of the semiconductor chip and an inner lead of the lead frame are bonded with a bonding wire. After sealing, the inside of the inner lead is sealed with a sealing material such as resin or ceramic, and low-melting point metal such as solder is applied to the exposed part of the lead frame such as the outer lead. The outer lead is formed by cutting a portion to a predetermined length and forming the outer lead into a desired shape.

A semiconductor device is mounted by bringing one surface of an outer lead into contact with a mounting surface and reflowing a low-melting metal deposition film. The outer leads are disclosed in Japanese Patent Application Laid-Open No.
It is formed into a desired shape such as a J-shape or a gull-wing shape as described in JP-A-3-296359.

[0004]

[Problems to be Solved by the Invention] In recent years, semiconductor devices have been increasingly demanded for high-density integration and miniaturization and high functionality. In response to this, the number of pins has been increased, and lead frames have become thinner. I have. In such a semiconductor device, the outer leads have a small thickness and a small space between the leads,
When the outer leads are processed and formed into a desired shape, the outer leads may be twisted or deflected during the molding, causing the outer leads to come into contact with each other or deform, resulting in a defective product.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device forming apparatus capable of forming outer leads without problems even if the thickness of the outer leads is small and the interval between the outer leads is small.

[0006]

The gist of the present invention is to provide an apparatus for forming an outer lead projecting from a sealed type semiconductor device, wherein a guide portion for an outer lead to be processed is provided on the top of a forming curved surface provided on a forming punch. The semiconductor device forming and processing apparatus is provided.

[0007]

In the present invention, guide portions for guiding and guarding the outer leads are provided at intervals on the molding curved surface of the molding punch for processing the outer leads of the semiconductor device, and each of the outer leads is independently formed at the time of molding. Since the inner leads are guided inside, even if the outer leads are extremely thin, they are uniformly formed into a predetermined shape without twisting or, for example, deflecting laterally.

Further, since the outer leads are individually guided in the forming punch as described above, the outer leads are formed without contact even if the lead interval is small.

Hereinafter, the present invention will be described in detail based on one embodiment with reference to the drawings. In the drawings, reference numeral 1 denotes a semiconductor device, which is resin-sealed in this embodiment, and has outer leads 2 projecting in two directions. The tip portion of the outer lead 2 is formed into a desired shape, for example, a J-shape for convenience of mounting.

Referring to FIGS. 1 and 2, in this embodiment, J
A case where the present invention is applied to a letter-shaped forming process will be described. Reference numeral 3 denotes a pedestal for the semiconductor device, and reference numeral 4 denotes a molding die for forming the outer lead 2. Reference numeral 5 denotes a forming punch which is arranged to face the die 4,
The forming punch 5 is advanced to the die 4 side and the outer lead 2
And is connected to a driving device (not shown).

The forming punch 5 has a forming curved surface 6 for bending the outer lead 2 into a J-shape.
A guide 7 guides the outer leads 2 individually in the forming punch 5 and is provided along the top of the forming curved surface 6 as shown in FIG. In this embodiment, the guide portions 7 are provided for each of the outer leads 2, but the present invention is not limited to this, and the guide portions 7 may be provided for, for example, every two or three outer leads 2.

Reference numeral 8 denotes a stripper which is capable of moving back and forth with respect to the receiving table 2 and cooperates with the receiving table 2 to hold the sealing portion of the semiconductor device 1 when the outer lead 2 is formed. is there.

Next, the J-shaped bending of the outer lead 2 of the semiconductor device 1 using the apparatus of the present invention will be described. The semiconductor device 1 is placed on the pedestal 3, the stripper 8 is lowered, and the semiconductor device 1 is clamped in cooperation with the pedestal 3. On this occasion,
Outer lead 2 protruding from a side end of semiconductor device 1
The strength of the lead frame is reduced due to the increase in the number of pins and the thickness of the lead frame, and it is easy to cause deformation such as twisting and bias,
Also, since the outer leads 2 are likely to come into contact with each other due to the narrow lead interval, this bad phenomenon is likely to occur during molding.
Since the guide portions 7 for guiding and guarding the outer leads 2 are provided at intervals, the outer leads 2 are formed stably and uniformly without causing twisting or deviation.

In the embodiment, the case where the outer lead is formed into a J-shape has been described. However, the present invention is not limited to this case, and the present invention can be applied to a case where the outer lead is formed into a desired shape such as a gull-wing shape, and the same operation and effect can be obtained.

[0015]

According to the device of the present invention, when forming the outer lead 2 of the semiconductor device 1, the forming punch 5 has a function of guiding the outer lead 2 to be processed. Anything can be molded without problems.

[Brief description of the drawings]

FIG. 1 is a view showing a forming punch in one embodiment of the present invention.

FIG. 2 is a diagram showing a molding apparatus according to an embodiment of the present invention.

FIG. 3 is a diagram showing a semiconductor device according to one embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Outer lead 3 Cradle 4 Die 5 Molding punch 6 Molding curved surface 7 Guide part 8 Stripper

Claims (1)

(57) [Scope of request for utility model registration] 1. An apparatus for forming an outer lead protruding from a sealed semiconductor device, wherein a guide portion for an outer lead to be processed is provided on a top of a forming curved surface provided on a forming punch. Forming equipment.