JPH02280360A - Semiconductor package - Google Patents

Abstract

PURPOSE:To remove the nonconformity based on the chips and gaps of a package by setting the width dimension between both side faces at the upper half of a package narrower than the width dimension between both side faces at the lower half so that the lead hold may not abut on the margin of the semiconductor package. CONSTITUTION:In mold resin 5, the width dimension X1 between both side faces at the upper half 5 positioned on the side upper than the projected position of a lead terminal 4 may be narrower than the width direction X2 at the lower half 5b positioned on the lower side, that is, so that they may be X1<X2. And the outside ends of the lead terminals 4, which are projected from both sides of the resin mold 5 being formed this way, are curved by using a die 11 and a punch 12. Hereupon, since the width dimension X1 of the upper half is made narrower than the width dimension X2 of the lower half 5b, the lead holder 13 never abuts on the margin 5a of the upper half 5a of the resin 5 installed in the die 11, so such trouble, as that this margin 5c chips off, or that the interface between the margin 5c and the lead terminal 4 opens, ceases to occur.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a semiconductor puff cage, and more particularly, to the width dimension between both sides of the upper and lower half portions thereof.

[Conventional technology]

Traditionally, an example of this type of semiconductor package is:
A so-called plastic type device constructed as shown in the sectional view of FIG. 3 is known. This semiconductor package includes an IC chip 2 mounted on a die pad 1.
and a molded resin 5 that integrally accommodates the inner end of the lead terminal 4 connected to this via the wire 3, and the bent lead terminal 4 can be seen from both sides of the molded resin 5.
The outer end of is protruding. In this molded resin 5, the width dimension Xt between both sides of the upper part 5a located above the protruding position of the lead terminal 4, and the width dimension X2 of the lower half part 5b located below it. Generally, they are set to have the same dimensions.

When forming a semiconductor device equipped with such a semiconductor package, first, an IC chip 2 is mounted and wire bonded to each of the die pads 1 arranged on a series of lead frames. As shown in FIG. 4, a method is adopted in which the lead terminals 4 are placed in a mold 10 and molded with epoxy resin, silicone resin, etc., and then cut and separated individually to bend and mold the outer ends of the lead terminals 4. There is.

[Problem to be solved by the invention]

By the way, the mold die IO used when forming the semiconductor package, that is, the mold resin 5, is
Upper mold 10a and lower mold 10b separated via lead terminal 4
(See FIG. 4), so both of these types 10a.

If the resin molding operation is performed with the lead terminals 10b being misaligned with each other, the upper part 5a and the lower half part 5b of the formed molded resin 5 will be misaligned with each other along the protruding direction of the lead terminal 4. This will result in Note that during mass production, both dies 10a10b are generally misaligned by about 50 to 100 μm.

The outer ends of the lead terminals 4 protruding from both sides of the molded resin 5 thus formed are bent and formed using a die 11 and a bunch 12 in the next lead terminal forming process. However, at this time, if a positional shift occurs between the upper part 5a and the lower half part 5b of the molded resin 5 as described above, as shown in FIG. As a result, the lead presser 13 for press-supporting the lead terminal 4 comes into contact with the edge 5C of the upper part 5a of the lead terminal 4, resulting in chipping of the edge 5c or damage to the edge 5C and the lead terminal 4. In some cases, the interface opens and a gap 5d is formed. If such chips or gaps 5d occur, there is a risk that not only the appearance of the semiconductor puff cage will be poor, but also moisture in the outside air will easily enter, resulting in malfunction of the semiconductor puff cage.

An object of the present invention is to provide a semiconductor package that can prevent such inconveniences from occurring.

[Means to solve the problem]

In a semiconductor puff cage that houses an IC chip and has lead terminals protruding from both sides, the width dimension XI between the two sides at the upper part located above the protruding position of the lead terminals is It is characterized in that it is set narrower than the width dimension X2 between the two side surfaces in the lower half portion located on the side.

[Effect]

According to the above configuration, since the width dimension X1 between the two side surfaces in the upper part of the semiconductor puff cage is set narrower than the width dimension X2 between the two side surfaces in the lower half thereof, the leads protrude from both the side surfaces. When the outer end of the terminal is bent and formed, the lead terminal presser used to press and support the lead terminal does not come into contact with the edge of the semiconductor pancage, resulting in the edge being chipped or the gap between this and the lead terminal being bent. No gaps will be formed between the two.

〔Example〕

Embodiments of the present invention will be described below based on the drawings.

FIG. 1 is a cross-sectional view showing a semiconductor package according to the present invention. Since the configuration of this semiconductor package is basically the same as that of the conventional example described above, parts in FIG. 1 that are the same as or equivalent to those in FIG. , parts are given the same reference numerals.

This semiconductor pancage has 2 IC chips and 4 lead terminals.
It consists of a molded resin 5 that integrally accommodates the inner end of the lead terminal 4, which is bent and molded from both sides.
The outer end of is protruding.

In this molded resin 5, the lead terminal 4
The width dimension X1 between both sides of the upper part 5a located above the protruding position of the lower half part 5b located below it
narrower than the width dimension X2, that is, XI<X2
It is set so that

Note that such width dimension X1. In order to realize the difference of X2, the upper mold 1 constituting the mold die 10 shown in FIG.
The cavity opening size X1 in 0a may be made narrower than the cavity opening size X2 in the lower mold 10b. In addition, even if the upper part 5a and the lower half part 5b of the mold resin 5 are displaced from each other due to the positional displacement of both dies lOa and 10b constituting the mold die 10 during resin molding work, the upper part 5a Since the width dimension X1 is set in advance to be narrower than the width dimension 2 of the lower half part, the end u5c of the upper part 5a is shifted to the outer position along the protruding direction of the lead terminal 4 in the lower half part 5b. It never gets put away.

The outer ends of the lead terminals 4 protruding from both sides of the molded resin 5 thus formed are bent and formed using a die 11 and a punch 12, as shown in FIG. Become. However, at this time, the width dimension Xi at the upper part 5a of the molded resin 5 is
Since it is narrower than the width dimension X2 at b, the lead presser 13 for pressing and supporting the lead terminal 4 does not come into contact with the edge 5c of the upper part 5a of the molded resin 5 placed in the die 11. , this edge 5c is chipped,
The interface between the edge 5c and the lead terminal 4 will not open.

Incidentally, in the above description, it is assumed that the semiconductor package according to the present invention is a plastic type, but the present invention is not limited to this. It goes without saying that it is also possible to apply

〔Effect of the invention〕

As explained above, according to the present invention, the width between the two side surfaces in the upper part of the semiconductor package is set to be narrower than the width between the two sides in the lower half of the semiconductor package. When bending the outer end of the lead terminal protruding from the lead terminal, the lead terminal presser for pressing and supporting the lead terminal does not come into contact with the edge of the semiconductor package. Therefore, the edges of the semiconductor package are not chipped and gaps are not formed between them and the lead terminals, resulting in poor appearance due to chips and gaps in the semiconductor package and malfunctions due to moisture intrusion. You can get the strange effect of not having any blemishes.

[Brief explanation of drawings]

FIGS. 1 and 2 relate to the present invention; FIG. 1 is a sectional view showing the structure of a semiconductor package, and FIG. 2 is an explanatory view showing the lead terminal forming process thereof. In addition, FIGS. 3 to 5 relate to conventional examples, where FIG. 3 is a cross-sectional view showing the structure of a semiconductor package, FIG. 4 is an explanatory view showing the resin molding process, and FIG. 5 is a lead terminal thereof. It is an explanatory view showing a molding process. In the figure, 2 is an IC chip, 4 is a lead terminal, 5 is a molded resin (semiconductor package), 5a is an upper part, 5
b is the width of the lower half, Xl is the width of the upper part, and X2 is the width of the lower half. Note that the same reference numerals in the drawings indicate parts and portions that are the same or correspond to each other. Figure 5

Claims (1)

[Claims] (1) In a semiconductor package that houses an IC chip and has lead terminals protruding from both sides, the width dimension between the two sides at the upper part located above the protruding position of the lead terminal is defined as A semiconductor package characterized in that the width is set narrower than the width between the two side surfaces in the lower half of the semiconductor package.