JP2661152B2 - Manufacturing method of IC card module - Google Patents
Manufacturing method of IC card moduleInfo
- Publication number
- JP2661152B2 JP2661152B2 JP63161736A JP16173688A JP2661152B2 JP 2661152 B2 JP2661152 B2 JP 2661152B2 JP 63161736 A JP63161736 A JP 63161736A JP 16173688 A JP16173688 A JP 16173688A JP 2661152 B2 JP2661152 B2 JP 2661152B2
- Authority
- JP
- Japan
- Prior art keywords
- card module
- manufacturing
- lead frame
- contact terminal
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Description
【発明の詳細な説明】 産業上の利用分野 この発明はICカードに埋設されるICカード用モジュー
ルを製造する製造方法に関するものである。Description: TECHNICAL FIELD The present invention relates to a method for manufacturing an IC card module embedded in an IC card.
従来の技術 第４図、第５図、第６図、第７図に従来例を示す。第
４図は完成した従来例のICカード用モジュールの端子側
面の平面図、第５図はその断面図であり、第７図はその
拡大図であり、第６図はリードフレームの図を示すもの
である。2. Description of the Related Art FIGS. 4, 5, 6 and 7 show a conventional example. FIG. 4 is a plan view of a terminal side of the completed conventional IC card module, FIG. 5 is a sectional view thereof, FIG. 7 is an enlarged view thereof, and FIG. 6 is a view of a lead frame. Things.
当従来例によるICカード用モジュールは、金属の薄板
群（以降リードフレームと称す）１のダイパッド部1aに
ICチップ２を接着剤３により固着したのち、ICチップ２
の配線ランド2aと、接点端子1c部に相対向する接続ラン
ド1bとをリード線４で接続する。その後封止樹脂５にて
前記リードフレーム１の外部に露出する接点端子1c部を
残して樹脂封止する。前記リードフレーム１の外部に露
出する接点端子1cと、樹脂に埋設される部分1dの境界線
1eは曲げ加工で形成されており、樹脂封止後、リードフ
レーム１より所定の寸法で切断分離するという製造方法
があった。The IC card module according to this conventional example is provided on a die pad portion 1a of a metal thin plate group (hereinafter referred to as a lead frame) 1.
After fixing the IC chip 2 with the adhesive 3, the IC chip 2
Of the wiring land 2a and the connection land 1b facing the contact terminal 1c are connected by the lead wire 4. Thereafter, the sealing resin 5 is used to seal the resin except for the contact terminals 1c exposed outside the lead frame 1. The boundary between the contact terminal 1c exposed to the outside of the lead frame 1 and the portion 1d embedded in the resin
1e is formed by bending, and there is a manufacturing method of cutting and separating a predetermined size from the lead frame 1 after resin sealing.
発明が解決しようとする課題 以上のように従来例では金属のリードフレーム１の外
部に露出する接点端子1c部と封止樹脂５に埋設される部
分1dの境界線1eが曲げ加工で形成しているため、樹脂封
止する際、曲げ部の曲線部を封止樹脂５が登り、接点端
子1c部まで被覆するので、外部端子となる接点端子1cの
寸法が出にくく、例えばICカードのISO規格であるISO78
16の端子位置寸法の規格を満足することも困難であっ
た。As described above, in the conventional example, the boundary line 1e between the contact terminal 1c exposed to the outside of the metal lead frame 1 and the portion 1d embedded in the sealing resin 5 is formed by bending. Therefore, when the resin is sealed, the sealing resin 5 climbs the curved portion of the bent portion and covers the contact terminal 1c, so that the dimensions of the contact terminal 1c which is an external terminal are hard to come out. Is ISO78
It was also difficult to satisfy the 16 terminal location dimensions.
本発明は、量産性に富み、かつ、品質的にも安定なIC
カード用モジュールを製造する製造方法を提供すること
を目的とするものである。The present invention is an IC that is rich in mass production and stable in quality.
It is an object of the present invention to provide a manufacturing method for manufacturing a card module.
課題を解決するための手段 上記目的を達成するために本発明の製造方法は、リー
ドフレームの外部に露出する接点端子部と、これにつな
がり封止樹脂に埋設される部分の境界部にプレス金型に
よる剪断加工により略垂直形状の段差を設けるものであ
る。Means for Solving the Problems In order to achieve the above object, a manufacturing method of the present invention is directed to a method of manufacturing a semiconductor device, comprising the steps of: pressing a contact terminal portion exposed to the outside of a lead frame; A step having a substantially vertical shape is provided by shearing with a mold.
作用 以上の構成により、リードフレーム上にICチップを実
装したのち樹脂封止する際、外部との入出力端子として
露出させる接点端子部分の寸法が目標通りに確保できる
製造方法を提供できるものである。Operation According to the above configuration, it is possible to provide a manufacturing method in which dimensions of a contact terminal portion exposed as an input / output terminal with the outside can be secured as intended when an IC chip is mounted on a lead frame and then sealed with a resin. .
実施例 以下本発明の一実施例を図面を参照して説明する。An embodiment of the present invention will be described below with reference to the drawings.
第１図のごとく金属のリードフレーム11は、外部に露
出する接点端子11a部と樹脂に埋設される部分11bの境界
部11cに、プレス金型の剪断加工によりリードフレーム1
1の上部の接点端子11aと樹脂に埋設させる部分11bが切
れない程度にハーフカットを行い、前記リードフレーム
11の板厚の1/4から3/4の略垂直形状の段差を設ける。次
に第２図のごとく前記リードフレーム11にICチップ12を
接着剤13で固着したのち、ICチップ12の配線パッド12a
と、外部端子となる接点端子11a部に相対向する接続ラ
ンド11dとをリード線14にて接続する。その後封止樹脂1
5にて外部との入出力端子として露出させる接点端子11a
部を除いて封止し、所定の寸法に接続し、第２図のごと
く分離されたICカード用モジュールを得る。なお16は樹
脂封止する際のリードフレーム11の押さえピン用の孔で
ある。As shown in FIG. 1, a metal lead frame 11 is formed on a boundary portion 11c between a contact terminal 11a exposed to the outside and a portion 11b buried in resin by shearing a press die.
Half cut so that the upper contact terminal 11a and the portion 11b embedded in the resin are not cut off, and the lead frame is cut.
An approximately vertical step of 1/4 to 3/4 of the plate thickness of 11 is provided. Next, as shown in FIG. 2, after the IC chip 12 is fixed to the lead frame 11 with an adhesive 13, the wiring pads 12a of the IC chip 12 are fixed.
And a connection land 11d opposed to a contact terminal 11a serving as an external terminal is connected by a lead wire 14. Then sealing resin 1
Contact terminal 11a exposed as an input / output terminal with the outside at 5
Sealing is performed except for the part, and the module is connected to a predetermined size to obtain a separated IC card module as shown in FIG. Reference numeral 16 denotes a hole for a holding pin of the lead frame 11 at the time of resin sealing.
また第８図のごとくこのようにして形成したICカード
用モジュール18はカード材17の凹部17a内に埋設され
る。As shown in FIG. 8, the IC card module 18 thus formed is embedded in the recess 17a of the card material 17.
発明の効果 本発明によれば、外部に露出する接点端子の位置寸法
を安定して確保でき、品質的に安定で、量産性に富み、
更に封止樹脂との境界が明瞭になるため外観上も好まし
いICカード用モジュールを提供することができる。According to the present invention, the position dimensions of the contact terminals exposed to the outside can be stably secured, the quality is stable, and the mass productivity is high.
Further, since the boundary with the sealing resin becomes clear, it is possible to provide an IC card module which is preferable in appearance.
第１図は本発明の一実施例によるリードフレームの要部
断面図、第２図は本発明によるリードフレームを使用し
たICカード用モジュールの断面図、第３図は第２図の要
部拡大断面図、第４図は従来のICカード用モジュールの
端子面側の平面図、第５図はICカード用モジュールの断
面図、第６図は従来のリードフレームの平面図、第７図
は第５図の要部拡大断面図、第８図はICカード用モジュ
ールが埋設されたICカードの平面図である。 11……リードフレーム（薄板群）、11a……接点端子、1
2……ICチップ、15……封止樹脂。1 is a cross-sectional view of a main part of a lead frame according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of an IC card module using the lead frame of the present invention, and FIG. 3 is an enlarged main part of FIG. FIG. 4 is a plan view of the terminal side of the conventional IC card module, FIG. 5 is a cross-sectional view of the IC card module, FIG. 6 is a plan view of the conventional lead frame, and FIG. FIG. 5 is an enlarged sectional view of a main part, and FIG. 8 is a plan view of an IC card in which an IC card module is embedded. 11: Lead frame (thin plate group), 11a: Contact terminal, 1
2 ... IC chip, 15 ... Encapsulation resin.
Claims (1)
用の接点端子とする金属の薄板群（リードフレーム）を
使用し、この薄板群の片側面、および他面の外周を樹脂
封止するICカード用モジュールの製造方法であり、前記
薄板群の他面の外部に露出する接点端子部と、これにつ
ながり、封止樹脂に埋設される部分の境界部にプレス金
型による剪断加工により略垂直形状の段差を設けること
を特徴とするICカード用モジュールの製造方法。An IC chip is mounted on one side and a group of thin metal plates (lead frames) are used on the other side as contact terminals for input / output, and one side of the group of thin plates and the outer periphery of the other side are used. A method for manufacturing a resin-sealed IC card module, wherein a contact terminal portion exposed to the outside of the other surface of the thin plate group and a boundary portion of a portion embedded in the sealing resin connected to the contact terminal portion are pressed by a press die. A method for manufacturing an IC card module, wherein a substantially vertical step is provided by shearing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161736A JP2661152B2 (en) | 1988-06-29 | 1988-06-29 | Manufacturing method of IC card module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161736A JP2661152B2 (en) | 1988-06-29 | 1988-06-29 | Manufacturing method of IC card module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH029692A JPH029692A (en) | 1990-01-12 |
| JP2661152B2 true JP2661152B2 (en) | 1997-10-08 |
Family
ID=15740909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161736A Expired - Lifetime JP2661152B2 (en) | 1988-06-29 | 1988-06-29 | Manufacturing method of IC card module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2661152B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19513797A1 (en) * | 1995-04-11 | 1996-10-24 | Siemens Ag | Method for producing a carrier element and device for carrying out the method |
| WO2002037563A2 (en) * | 2000-10-31 | 2002-05-10 | Motorola, Inc. | A leadframe and semiconductor package |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6015786A (en) * | 1983-07-06 | 1985-01-26 | Dainippon Printing Co Ltd | Ic card and its production |
-
1988
- 1988-06-29 JP JP63161736A patent/JP2661152B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH029692A (en) | 1990-01-12 |
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