JP2687775B2 - TAB tape - Google Patents
TAB tapeInfo
- Publication number
- JP2687775B2 JP2687775B2 JP3239097A JP23909791A JP2687775B2 JP 2687775 B2 JP2687775 B2 JP 2687775B2 JP 3239097 A JP3239097 A JP 3239097A JP 23909791 A JP23909791 A JP 23909791A JP 2687775 B2 JP2687775 B2 JP 2687775B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- chip
- tab tape
- tab
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＩＣチップを装着して
ＴＡＢ−ＩＣを製造するために使用するＴＡＢテープに
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a TAB tape used for manufacturing a TAB-IC by mounting an IC chip.
【０００２】[0002]
【従来の技術】図５は、従来のＴＡＢテープの一例を用
いてＴＡＢ−ＩＣを製造する手順を工程順に示す断面図
である。2. Description of the Related Art FIG. 5 is a cross-sectional view showing a procedure of manufacturing a TAB-IC using an example of a conventional TAB tape in the order of steps.
【０００３】ＩＣチップを装着してＴＡＢ−ＩＣを製造
するために使用する従来のＴＡＢテープは、図５に示す
ように、平面状の銅製のリード１５を用いており、これ
にＩＣチップ１４を装着して接続するときは、（ａ）に
示すように、ＩＣチップ１４に接続用のバンプ１２を設
けておき、このバンプ１２を、（ｂ）に示すように、リ
ード１５と接触させてリード１５の側から加圧部材１６
によって加圧する。これにより、（ｃ）に示すように、
リード１５の先端部１５ａがＩＣチップ１４のバンプ１
２に接続されると同時に所定の形状に成形される。A conventional TAB tape used for manufacturing a TAB-IC by mounting an IC chip uses a planar copper lead 15 as shown in FIG. 5, to which an IC chip 14 is attached. When mounting and connecting, bumps 12 for connection are provided on the IC chip 14 as shown in (a), and the bumps 12 are brought into contact with the leads 15 as shown in (b) to lead the leads. The pressing member 16 from the side of 15
Pressurize with. Thereby, as shown in (c),
The tip portion 15a of the lead 15 is the bump 1 of the IC chip 14.
At the same time when it is connected to 2, it is molded into a predetermined shape.
【０００４】[0004]
【発明が解決しようとする課題】上述のような従来のＴ
ＡＢテープは、ＩＣチップの側にＴＡＢテープのリード
にボンディングするためのバンプを設けなければならた
いため、ＩＣチップの製造工程が複雑になるという欠点
がある。また、バンプを有しないＩＣチップは、ＴＡＢ
テープにボンディングできないという問題点も有してい
る。The conventional T as described above is used.
The AB tape has a drawback in that the IC chip manufacturing process is complicated because it is necessary to provide bumps for bonding to the leads of the TAB tape on the IC chip side. In addition, IC chips without bumps are TAB
It also has a problem that it cannot be bonded to a tape.
【０００５】[0005]
【課題を解決するための手段】本発明のＴＡＢテープ
は、複数の銅製のリードを有するＴＡＢテープにおい
て、前記リードのそれぞれの先端部に穴を設け、前記リ
ードの一方の面から所定の高さだけ突出した金製のバン
プを前記穴に形成したものである。The TAB tape of the present invention is a TAB tape having a plurality of copper leads, each of which has a hole at its tip, and has a predetermined height from one surface of the lead. The bumps made of gold, which only protrude, are formed in the holes.
【０００６】[0006]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Next, embodiments of the present invention will be described with reference to the drawings.
【０００７】図１は本発明の一実施例を示す図で、
（ａ）は平面図、（ｂ）はＡ−Ａ線断面図、図２は図１
の実施例のＢ部を拡大して示した図で、（ａ）は平面
図、（ｂ）はＣ−Ｃ線断面図、図３は図１の実施例の製
作方法を工程順に示す断面図、図４は図１の実施例を用
いてＴＡＢ−ＩＣを製造する手順を工程順に示す断面図
である。FIG. 1 shows an embodiment of the present invention.
1A is a plan view, FIG. 2B is a sectional view taken along the line AA, and FIG.
FIG. 3B is an enlarged view of a portion B of the embodiment of the present invention, in which FIG. 3A is a plan view, FIG. 3B is a sectional view taken along line CC, and FIG. 4A to 4D are cross-sectional views showing a procedure of manufacturing a TAB-IC using the embodiment of FIG.
【０００８】本実施例のＴＡＢテープ１は、図１および
図２に示すように、ＩＣチップの端子と接続するための
複数のリード５を有しており、各リード５の先端部には
穴が設けてある。この穴には、金製のバンプ２が形成さ
れており、その高さは、リード５の一方の面（ＩＣチッ
プを装着する方の面で、図では下面）の表面よりも所定
の高さだけ突出している。バンプ２を形成するためのリ
ード５の先端部の穴は、リード５をエッチングによって
形成するとき、同時に形成する。As shown in FIGS. 1 and 2, the TAB tape 1 of this embodiment has a plurality of leads 5 for connecting to the terminals of the IC chip, and each lead 5 has a hole at the tip thereof. Is provided. A bump 2 made of gold is formed in this hole, and its height is a predetermined height higher than the surface of one surface of the lead 5 (the surface on which the IC chip is mounted, the lower surface in the figure). Only protruding. The hole at the tip of the lead 5 for forming the bump 2 is formed at the same time when the lead 5 is formed by etching.
【０００９】バンプ２の形成方法は、図３（ａ）に示す
ように、リード５の穴と同じ直径の穴を有するダイ７の
上にＴＡＢテープ１を搭載し、リード５の穴とダイ７の
穴とを一致させ、ＴＡＢテープ１の上に金の薄板３を密
着させて載せる。次に、図３（ｂ）に示すように、リー
ド５の穴の直上の位置に設けてあるリード５の穴と同じ
直径のポンチ６を降下させ（矢印Ｄ）、薄板３を打抜
く。引続いてポンチ６を降下させると、図３（ｃ）に示
すように、薄板３から打抜かれた部分は、リード５の穴
の中に押入され、その下端面をリード５の下面から所定
の高さだけ突出させてバンプ２を形成する。As shown in FIG. 3A, the bump 2 is formed by mounting the TAB tape 1 on a die 7 having a hole having the same diameter as the hole of the lead 5, and then forming the hole of the lead 5 and the die 7. The gold thin plate 3 is placed in close contact with the TAB tape 1 by aligning the holes with the holes. Next, as shown in FIG. 3B, the punch 6 having the same diameter as the hole of the lead 5 provided directly above the hole of the lead 5 is lowered (arrow D), and the thin plate 3 is punched. When the punch 6 is subsequently lowered, the portion punched out from the thin plate 3 is pushed into the hole of the lead 5 as shown in FIG. The bumps 2 are formed by protruding by the height.
【００１０】バンプおよびリードの穴の形成手段は、上
述の手段のほか、リードにあらかじめ穴を形成しておか
ず、金の薄板を打抜いてバンプを形成するとき、リード
の穴も同時に打抜くようにすることもできる。また、Ｔ
ＡＢテープにリードを形成する前の銅板の状態のとき
に、上記の手段と同様の手段で金の薄板を打抜いてバン
プを形成しておき、その後銅板のエッチングを行ってリ
ードを形成するようにすることもできる。In addition to the above-mentioned means, the means for forming the holes for the bumps and leads do not have holes formed in the leads in advance. You can also Also, T
In the state of the copper plate before forming the leads on the AB tape, a thin gold plate is punched to form bumps by the same means as described above, and then the copper plate is etched to form the leads. You can also
【００１１】上述のＴＡＢテープ１にＩＣチップを装着
してＴＡＢ−ＩＣを製造するときは、図４に示すように
行う。すなわち、まず（ａ）に示すように、ＩＣチップ
４の端子とリード５のバンプ２との位置合わせを行って
それらを接触させ、次に（ｂ）に示すように、リード５
にの側から加圧部材８によって加圧して加熱する。これ
により、（ｃ）に示すように、リード５のバンプ２がＩ
Ｃチップ４の端子に接続されると同時に、先端部５ａが
所定の形状に成形される。When an IC chip is attached to the above-mentioned TAB tape 1 to manufacture a TAB-IC, it is carried out as shown in FIG. That is, first, as shown in (a), the terminals of the IC chip 4 and the bumps 2 of the leads 5 are aligned and brought into contact with each other, and then, as shown in (b), the leads 5
The pressure is applied by the pressure member 8 from the side to heat. As a result, the bump 2 of the lead 5 becomes I
At the same time as being connected to the terminal of the C chip 4, the tip portion 5a is molded into a predetermined shape.
【００１２】[0012]
【発明の効果】以上説明したように、本発明のＴＡＢテ
ープは、各リードの先端に穴を設けてそこに金によって
バンプを形成しておき、このバンプとＩＣチップの端子
とを接続することによってＴＡＢ−ＩＣを製造すること
ができるようにすることにより、ＩＣチップの側にバン
プを設ける必要がなくたるため、ＩＣチップの製造工程
を簡単にすることができるという効果がある。また、バ
ンプを有しないワイヤボンディング用のＩＣチップもＴ
ＡＢテープにボンディングできるという効果もある。As described above, in the TAB tape of the present invention, a hole is provided at the tip of each lead, a bump is formed by gold there, and the bump and the terminal of the IC chip are connected. By making it possible to manufacture the TAB-IC by the method, there is no need to provide bumps on the side of the IC chip, so that the manufacturing process of the IC chip can be simplified. Also, an IC chip for wire bonding that does not have bumps
There is also an effect that it can be bonded to an AB tape.
【図１】本発明の一実施例を示す図で、（ａ）は平面
図、（ｂ）はＡ−Ａ線断面図である。FIGS. 1A and 1B are diagrams showing one embodiment of the present invention, wherein FIG. 1A is a plan view and FIG.
【図２】図１の実施例のＢ部を拡大して示した図で、
（ａ）は平面図、（ｂ）はＣ−Ｃ線断面図である。FIG. 2 is an enlarged view of part B of the embodiment of FIG.
(A) is a top view, (b) is CC sectional view taken on the line.
【図３】図１の実施例の製作方法を工程順に示す断面図
である。3A to 3D are cross-sectional views showing the manufacturing method of the embodiment in FIG. 1 in order of steps.
【図４】図１の実施例を用いてＴＡＢ−ＩＣを製造する
手順を工程順に示す断面図である。4A to 4D are cross-sectional views showing a procedure of manufacturing a TAB-IC using the embodiment of FIG.
【図５】従来のＴＡＢテープの一例を用いてＴＡＢ−Ｉ
Ｃを製造する手順を工程順に示す断面図である。FIG. 5: TAB-I using an example of a conventional TAB tape
It is sectional drawing which shows the procedure of manufacturing C in order of process.
１ ＴＡＢテープ ２ バンプ ３ 薄板 ４ ＩＣチップ ５ リード ５ａ 先端部 ６ ポンチ ７ ダイ ８ 加圧部材 １２ バンプ １４ ＩＣチップ １５ リード １５ａ 先端部 １６ 加圧部材 1 TAB Tape 2 Bump 3 Thin Plate 4 IC Chip 5 Lead 5a Tip Part 6 Punch 7 Die 8 Pressing Member 12 Bump 14 IC Chip 15 Lead 15a Tip Part 16 Pressing Member
Claims (1)
プにおいて、前記リードのそれぞれの先端に穴を設け、
前記リードの上に金の薄板を載せてポンチによって打抜
くことによって前記リードの一方の面から所定の高さだ
け突出したバンプを前記穴に形成したことを特徴とする
ＴＡＢテープ。1. A TAB tape having a plurality of copper leads, each of which has a hole at its tip,
Place a thin gold plate on the lead and punch it with a punch.
TAB tape, characterized in that the bus amplifier which protrudes a predetermined height from one surface of the lead is formed in the hole by Kukoto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3239097A JP2687775B2 (en) | 1991-09-19 | 1991-09-19 | TAB tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3239097A JP2687775B2 (en) | 1991-09-19 | 1991-09-19 | TAB tape |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0582592A JPH0582592A (en) | 1993-04-02 |
| JP2687775B2 true JP2687775B2 (en) | 1997-12-08 |
Family
ID=17039769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3239097A Expired - Lifetime JP2687775B2 (en) | 1991-09-19 | 1991-09-19 | TAB tape |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2687775B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02215145A (en) * | 1989-02-16 | 1990-08-28 | Furukawa Electric Co Ltd:The | Manufacture of tape carrier |
| JPH03177033A (en) * | 1989-12-05 | 1991-08-01 | Fujitsu Ltd | Semiconductor device and manufacture thereof |
-
1991
- 1991-09-19 JP JP3239097A patent/JP2687775B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0582592A (en) | 1993-04-02 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19970722 |