JPH09129803A - Hall element and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent generation of cracks or the like in a molded resin when lead wires and molded, by performing resin molding after a bent part is formed in each of the lead wires of a lead frame, and a semiconductor chip is mounted on the lead frame. SOLUTION: Lead wires 25 of a Hall element 20a after resin molded is mounted, on a lower die 32 in which recessed parts 30 corresponding nearly to the central parts of the lead wires 25 and a recessed part 31 on the bottom surface of the molded resin 24, and it is sandwiched between the lower die 32 and an upper die 34 provided with protruding parts 33 which engage with the recessed parts 30. Bent parts 25a are formed by bending the lead wires 25 toward the direction opposite to the semiconductor chip 22. Thereby generation of cracks or the like in the mold resin can be prevented when the lead wires 25 are molded.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a Hall element and a method for manufacturing the same.

[0002]

2. Description of the Related Art Hall elements used in magnetic sensors are
A semiconductor chip is die-bonded to a mount portion of a lead frame, wire bonding is performed between the semiconductor chip and a lead wire, which is then resin-sealed, and the lead wire is bent.

FIG. 4 is a diagram showing a conventional example of a hall element, and FIG. 5 is a diagram showing another conventional example of a hall element.

The Hall element 1 shown in FIG. 4 has a shape in which a lead wire 2 is bent from the root of the molding resin 3 into a V shape and then is bent parallel to the bottom surface of the molding resin 3. Further, in the Hall element 4 shown in FIG. 5, the lead wire 5 has a V shape from the root of the mold resin 6. Incidentally, 7 and 8 are semiconductor chips.

In order to attach these Hall elements 1 and 4 to a printed circuit board (not shown) or the like, it is common to fix the lead wires 2 and 5 to the printed circuit board with solder or the like.
Therefore, the lower end of each lead wire 2, 5 is molded resin 3,
It is formed to have a length that is substantially the same as the bottom surface of 6.

To process the lead wire 5 of the Hall element 4 shown in FIG. 5, as shown in FIG. 6, the Hall element 4 after resin sealing is placed on the lower die 10 and the upper die 11 is placed. The lead wire 5
It was done by pressing down on the root of a. The Hall element shown in FIG. 4 is also formed by a similar method. However, in this case, the lead wire is long, and it goes without saying that the upper mold is pushed down to the lower mold. FIG.
FIG. 6 is an explanatory diagram illustrating a method of manufacturing the Hall element shown in FIG. 5.

[0007]

However, in the conventional manufacturing method, since the mold resins 3 and 6 directly receive the bending load of the lead wires 2 and 5, cracks 12 and the like are generated in the mold resins 3 and 6. It was a cause of poor electrical characteristics.

SUMMARY OF THE INVENTION An object of the present invention is to solve the above problems and to provide a Hall element and a method of manufacturing the same in which no cracks or the like are generated in a molding resin when molding a lead wire.

[0009]

In order to achieve the above object, according to the present invention, after mounting a semiconductor chip on a lead frame, a curved portion is formed on each lead wire of the lead frame in a resin-sealed Hall element. It is a thing.

Further, according to the present invention, in a Hall element in which a semiconductor chip is mounted on a lead frame and then resin-sealed,
The tip of each lead wire is bent.

Further, according to the present invention, in a method of manufacturing a hall element in which a semiconductor chip is mounted on a lead frame and resin-encapsulated, the lead wire of the hall element after resin encapsulation is placed on a lower mold having a recess. A lead wire is sandwiched and deformed by an upper die provided with a convex portion that is placed and fitted into the concave portion.

With the above structure, since the load applied at the time of molding the lead wire is received by the lower die, the load at the time of molding is not applied to the molding resin, and the generation of cracks is prevented.

[0013]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.

FIG. 1 is a side view showing an embodiment of the Hall element of the present invention.

The Hall element 20 shown in the figure has a lead frame 23 in which a semiconductor chip 22 is mounted on a mount portion 21.
Is sealed with a mold resin 24, and the central portion of each lead wire 25 is curved toward the side opposite to the semiconductor chip 22 to form a curved portion 25.
a is formed.

FIG. 2 is an explanatory view for explaining a method of manufacturing the Hall element shown in FIG.

The hole element 20a after the resin sealing and the concave portion 30 located substantially in the center of the lead wire 25 of the Hall element 20a and the Hall element 20a.
The lead wire 25 of the Hall element 20a after resin sealing is placed on the lower die 32 provided with the concave portion 31 located on the bottom surface of the mold resin 24, and the convex portion 33 that fits into the concave portion 30 is provided. By sandwiching the lead wire 25 with the upper mold 34, the lead wire 25 is located on the side opposite to the semiconductor chip 22 (lower side in the figure).
The curved portion 25a (see FIG. 1) can be formed by bending the curved portion 25a.

Since the load applied at the time of molding the lead wire 25 is applied to the lower mold 32, the load at the time of molding is not applied to the molding resin 24. Therefore, the molding resin 24
The occurrence of cracks is prevented. Since the Hall element 20 is soldered to a printed circuit board (not shown), it is desirable that the lower end of the curved portion 25a of the lead wire 25 slightly protrudes from the bottom surface of the mold resin 24.

Further, according to the present embodiment, the lead wire 2
Since the molding shape of No. 5 is simple, the mold is simple, and variations in the finished dimensions are small, and the occurrence of shape defects is small.

FIG. 3 is a side view showing another embodiment of the Hall element of the present invention.

The difference from the embodiment shown in FIG. 1 is that the tip of each lead wire 25 is bent to the side opposite to the semiconductor chip 22. The lead wire 25 of this Hall element 20b
Also, as shown in FIG. 2, the lead wire 25 of the Hall element 20a after resin sealing is placed on the lower mold 32 having the recesses 30 and 31, and the lead wire 25 is sandwiched by the upper mold 34. It is formed by cutting in the middle of the back curve portion 25a (FIG. 1). Alternatively, the lead wire 25 may be cut in advance to a short length, and then the lead wire 25 may be molded with the molds 32 and 34.

[0022]

In summary, according to the present invention, the following excellent effects are exhibited.

Since the lead wire of the Hall element after resin sealing is placed on the lower mold having the concave portion, the lead wire is sandwiched and deformed by the upper mold having the convex portion fitted into the concave portion. ,
No cracks or the like occur in the mold resin when molding the lead wire.

[Brief description of the drawings]

FIG. 1 is a side view showing an embodiment of a Hall element of the present invention.

FIG. 2 is an explanatory diagram illustrating a method of manufacturing the Hall element shown in FIG.

FIG. 3 is a side view showing another embodiment of the Hall element of the present invention.

FIG. 4 is a side view of a conventional example of a Hall element.

FIG. 5 is a side view of a conventional example of another Hall element.

6A and 6B are explanatory views illustrating a method for manufacturing the Hall element shown in FIG.

[Explanation of symbols]

 20, 20a, 20b Hall element 22 Semiconductor chip 23 Lead frame 24 Mold resin 25 Lead wire 25a Curved part 30, 31 Recessed part 32 Lower mold (mold) 33 Convex part 34 Upper mold (mold)

Claims (3)

[Claims] 1. A Hall element in which a semiconductor chip is mounted on a lead frame, and then, in a resin-sealed Hall element, a curved portion is formed in each lead wire of the lead frame. 2. A Hall element in which, after mounting a semiconductor chip on a lead frame, the tip of each lead wire is bent in the resin-sealed Hall element. 3. A method of manufacturing a hall element in which a semiconductor chip is mounted on a lead frame and resin-encapsulated, wherein the lead wire of the hall element after resin encapsulation is placed on a lower mold having a recess. A method of manufacturing a Hall element, comprising: deforming a lead wire by sandwiching it with an upper mold having a convex portion that fits into a concave portion.