CN208706591U - A kind of full-automatic accurate semiconductor rushes hole machine - Google Patents
A kind of full-automatic accurate semiconductor rushes hole machine Download PDFInfo
- Publication number
- CN208706591U CN208706591U CN201821434156.0U CN201821434156U CN208706591U CN 208706591 U CN208706591 U CN 208706591U CN 201821434156 U CN201821434156 U CN 201821434156U CN 208706591 U CN208706591 U CN 208706591U
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- China
- Prior art keywords
- punching hole
- punching
- mould
- hole
- cylinder
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses a kind of full-automatic accurate semiconductors to rush hole machine, including the first mounting rack, the first punching hole cylinder is provided with above first mounting rack, the positive lower end of first punching hole cylinder is connected with lifting column, the lower end of the lifting column is connected with punching hole mould, the outside of punching hole mould is provided with installation mould bases, the upper end of the installation mould bases is provided with one layer of cover board, the lower end of punching hole mould is connected with bed die mounting plate, the second mounting rack is provided with below the bed die mounting plate, the lower end of second mounting rack is provided with the second punching hole cylinder, the utility model passes through the common punching press of upper die and lower die, punching hole caused by single punching press is avoided to be not thorough first, more importantly upper and lower mould punching press simultaneously reduces the adjustable height of cylinder ram compression leg itself, improve punching hole efficiency, simultaneously using semiconductor fixture to semiconductor product The automatic clamping of product, meets the fixation of the lesser semiconductor product of size, substantially increases punching hole precision.
Description
Technical field
The utility model relates to semiconductors to rush hole technical field, and specially a kind of full-automatic accurate semiconductor rushes hole machine.
Background technique
Semiconductor refers to material of the electric conductivity between conductor and insulator under room temperature.Semiconductor is in radio, TV
It has a wide range of applications on machine and thermometric.If diode is exactly the device using semiconductor fabrication.Semiconductor refers to that one kind is led
It can electrically be controlled, range can be from insulator to the material between conductor.No matter from the perspective of science and technology or economic development,
The importance of semiconductor is all very huge.Today most electronic product, as computer, mobile phone or number record
Core cell in sound machine all has extremely close connection with semiconductor.Common semiconductor material has silicon, germanium, GaAs
Deng, and silicon is even more most influential one kind in business application in various semiconductor materials.Semiconductor product rushes hole one
As be all to be cut using craft or semi-automatic tool to semiconductor, then using punching machine by the semiconductor cut progress
Punch forming is finally accurately formed to semiconductor after molding with sizing cutting die.In actual production, due to semi-automatic knife
Tool, punching machine, sizing cutting die are all some independent equipment, and the production efficiency that this will lead to semiconductor is low, and cost payout is high, into
And along with the waste of raw material, meanwhile, worker operation inefficiency influences whole progress, is also unfavorable for the development of enterprise.
For example, application No. is 201220003382.X, a kind of entitled plastic-aluminum film stretching rushes the utility model patent of hole machine:
The utility model can effectively improve automation level, convenient for operation, while also improve working efficiency, so that at
This reduction, waste material are reduced.
But existing semiconductor rushes hole machine and still has following defect:
Existing semiconductor rushes hole machine and carries out punching hole to semiconductor product in producing line, but due to the ruler of semiconductor product
It is very little small to be difficult to during being fixed on punching hole on the platform of punching hole that product is slightly mobile when causing punching hole precision low serious or even to be influenced to produce
The quality of product, it is difficult to meet the needs of people to hole machine is rushed in high precision.
Summary of the invention
In order to overcome the shortcomings of prior art, the utility model provides a kind of full-automatic accurate semiconductor punching hole
Machine can effectively solve the problem of background technique proposes.
The technical scheme adopted by the utility model to solve the technical problem is as follows:
A kind of full-automatic accurate semiconductor rushes hole machine, including the first mounting rack, the top setting of first mounting rack
There is the first punching to cheat cylinder, the positive lower end of first punching hole cylinder is connected with lifting column, and the lower end of the lifting column is connected with punching
Mould is cheated, the outside of punching hole mould is provided with installation mould bases, and the upper end of the installation mould bases is provided with one layer of cover board, the punching hole
The lower end of mould is connected with bed die mounting plate, and the second mounting rack, second mounting rack are provided with below the bed die mounting plate
Lower end be provided with the second punching hole cylinder；
Punching hole mould includes the upper die holder for being connected to lifting column lower end, and the lower surface of the upper die holder is provided with several punchings
Column is cheated, is provided with bed die seat immediately below the upper die holder, is connected between the upper die holder and bed die seat by mould set guide column, institute
The upper surface for stating bed die seat, which is provided with, rushes hole groove corresponding to punching hole column；
The semiconductor fixture of fixed product space is provided with above the bed die seat.
Further, aligning frame is provided on the outside of the shaft of the lifting column.
Further, fixed gear is provided at left and right sides of the first punching hole cylinder and second punching hole cylinder
Plate.
Further, the semiconductor fixture includes two parallel fixed frames, is connected between the two-end-point of the fixed frame
It is connected to smooth mobile cross bar, there are two Mobile base, corresponding two Mobile bases in the left and right sides for setting on the smooth mobile cross bar
Between be connected with sliding rail, be provided with the clamping piece that can move freely on the sliding rail, be provided with above the clamping piece
Micromotor.
Compared with prior art, the utility model has the beneficial effects that
The utility model avoids punching hole caused by single punching press from being not thorough, first by the common punching press of upper die and lower die
It is important that the adjustable height of upper and lower mould while punching press reduction cylinder ram compression leg itself, improves punching hole efficiency, while utilizing and partly leading
Automatic clamping of the body fixture to semiconductor product, meets the fixation of the lesser semiconductor product of size, substantially increases punching hole essence
Degree.
Detailed description of the invention
Fig. 1 is the utility model overall structure diagram；
Fig. 2 is the structural schematic diagram of the utility model semiconductor fixture.
Figure label:
The first mounting rack of 1-；The punching of 2- first hole cylinder；3- cover board；4- installs mould bases；5- punching hole mould；6- semiconductor fixture；
7- bed die mounting plate；The second mounting rack of 8-；The punching of 9- second hole cylinder；
101- fixed baffle；
201- aligns frame；202- lifting column；
501- upper die holder；502- punching hole column；503- mould set guide column；504- punching hole chamber；505- bed die seat；506- punching hole is recessed
Slot；
601- fixed frame；602- inserting column；The smooth mobile cross bar of 603-；604- Mobile base；605- slides rail；606- clamping
Part；607- micromotor.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
As shown in Figure 1, it includes the first mounting rack that the utility model, which provides a kind of full-automatic accurate semiconductor to rush hole machine,
1, the top of the first mounting rack 1 is provided with the first punching hole cylinder 2, and the positive lower end of the first punching hole cylinder 2 is connected with lifting column 202,
The lower end of lifting column 202 is connected with punching hole mould 5, and the outside of punching hole mould 5 is provided with installation mould bases 4, the upper end setting of installation mould bases 4
There is one layer of cover board 3, the lower end of punching hole mould 5 is connected with bed die mounting plate 7, and the lower section of bed die mounting plate 7 is provided with the second mounting rack
8, the lower end of the second mounting rack 8 is provided with the second punching hole cylinder 9.
As shown in Figure 1, the top of bed die seat 505 is provided with the semiconductor fixture 6 of fixed product space.
Specific embodiment of the present utility model is with working principle, when semiconductor product carries out the operation of punching hole
It waits, the semiconductor object in producing line is placed in the mould 5 of punching hole first, then semiconductor fixture 6 passes through the biography prepared on fixture
Sensor perception realizes clamping, the semiconductor object after clamping, in the first punching of PLC control after perceiving semiconductor product automatically
It liquidates under hole cylinder 2 and the second punching hole cylinder 9 and cheats product in mould 5 and carry out punching hole, upper die and lower die rush jointly during punching hole
Pressure avoids punching hole caused by single punching press from being not thorough first, it is often more important that upper and lower mould punching press simultaneously reduces cylinder ram compression leg sheet
The adjustable height of body improves punching hole efficiency.
As shown in Figure 1, punching hole mould 5 includes the upper die holder 501 for being connected to 202 lower end of lifting column, the lower surface of upper die holder 501
It is provided with several punching holes column 502, the underface of upper die holder 501 is provided with bed die seat 505, between upper die holder 501 and bed die seat 505
It is connected by mould set guide column 503, the upper surface of bed die seat 505, which is provided with, rushes hole groove 506 corresponding to punching hole column 502.
Specifically the operation of punching hole is punching hole mould 5, and the lifting column on lifting column 202 and the second punching hole cylinder 9 is respectively to upper mold
Seat 501 and 505 punching press of bed die seat, towards the punching hole punching of groove 506 hole, product is placed in the mold punching hole column 502 by punching press at this time
On bed die seat 505, it can tentatively guarantee the precision in punching hole.Mould set guide column 503 guarantees the accurate fixed of upper/lower die folding, avoids
The lateral shift of lower die.
As shown in Figure 1, being provided with aligning frame 201 on the outside of the shaft of lifting column 202.Aligning frame 201 can be to lifting column 202
Punching course effectively corrected, guarantee the vertical punching press of lifting column 202, avoid lifting column 202 tilt punching press, cause punching cheat
Failure.
As shown in Figure 1, the left and right sides of the first punching hole cylinder 2 and the second punching hole cylinder 9 is provided with fixed baffle 101.
Fixed baffle 101 can guarantee the stability of the first punching hole cylinder 2 and the second punching hole cylinder 9 at work.
As shown in Fig. 2, semiconductor fixture 6 includes two parallel fixed frames 601, connect between the two-end-point of fixed frame 601
It is connected to smooth mobile cross bar 603, there are two Mobile base 604, corresponding two shiftings in the left and right sides for setting on smooth mobile cross bar 603
It is connected with sliding rail 605 between dynamic seat 604, slides and is provided with the clamping piece 606 that can move freely on rail 605, clamping piece 606
Top is provided with micromotor 607.
The specific implementation process and working principle of semiconductor fixture 6 be, first with inserting column 602 by entire semiconductor
Fixture 6 is fixed on the upper surface of bed die mounting plate 7, and secondly semiconductor product is placed between two parallel sliding rails 605, this
When micromotor 607 drive clamping piece 606, meet clamping piece 606 sliding rail 605 on linear slide, adjusting lead suitable position
It postpones, four clamping pieces 606 clamp half conductor clamps, meet the fixation of the lesser semiconductor product of size, mention significantly
High punching hole precision.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (4)
1. a kind of full-automatic accurate semiconductor rushes hole machine, it is characterised in that: including the first mounting rack (1), first installation
The first punching hole cylinder (2) is provided with above frame (1), the positive lower end in first punching hole cylinder (2) is connected with lifting column
(202), the lower end of the lifting column (202) is connected with punching hole mould (5), and the outside of punching hole mould (5) is provided with installation mould bases
(4), the upper end of installation mould bases (4) is provided with one layer of cover board (3), and the lower end of punching hole mould (5) is connected with bed die installation
Plate (7) is provided with the second mounting rack (8) below the bed die mounting plate (7), the lower end setting of second mounting rack (8)
There is the second punching to cheat cylinder (9)；
Punching hole mould (5) includes the upper die holder (501) for being connected to lifting column (202) lower end, the following table of the upper die holder (501)
Face is provided with several punching holes column (502), is provided with bed die seat (505), the upper die holder immediately below the upper die holder (501)
(501) it is connect between bed die seat (505) by mould set guide column (503), the upper surface of the bed die seat (505) is provided with correspondence
Hole groove (506) is rushed in punching hole column (502)；
The semiconductor fixture (6) of fixed product space is provided with above the bed die seat (505).
2. a kind of full-automatic accurate semiconductor according to claim 1 rushes hole machine, it is characterised in that: the lifting column
(202) aligning frame (201) is provided on the outside of shaft.
3. a kind of full-automatic accurate semiconductor according to claim 1 rushes hole machine, it is characterised in that: first punching hole
Fixed baffle (101) are provided at left and right sides of cylinder (2) and second punching hole cylinder (9).
4. a kind of full-automatic accurate semiconductor according to claim 1 rushes hole machine, it is characterised in that: the semiconductor folder
Having (6) includes two parallel fixed frames (601), is connected with smooth mobile cross bar between the two-end-point of the fixed frame (601)
(603), there are two Mobile base (604), corresponding two Mobile bases in the left and right sides for setting on the smooth mobile cross bar (603)
(604) it is connected with sliding rail (605) between, is provided with the clamping piece (606) that can move freely, institute on sliding rail (605)
It states and is provided with micromotor (607) above clamping piece (606).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821434156.0U CN208706591U (en) | 2018-09-03 | 2018-09-03 | A kind of full-automatic accurate semiconductor rushes hole machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821434156.0U CN208706591U (en) | 2018-09-03 | 2018-09-03 | A kind of full-automatic accurate semiconductor rushes hole machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208706591U true CN208706591U (en) | 2019-04-05 |
Family
ID=65945857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821434156.0U Expired - Fee Related CN208706591U (en) | 2018-09-03 | 2018-09-03 | A kind of full-automatic accurate semiconductor rushes hole machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208706591U (en) |
-
2018
- 2018-09-03 CN CN201821434156.0U patent/CN208706591U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190405 Termination date: 20190903 |