JP2000216321A - Lead molding device for semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead molding device for a semiconductor device, wherein defective bending of a lead which is mode with a bend roller punch, is reduced for improved manufacturing yield. SOLUTION: A pressing piece 23 and a bending die 38, which clamp and fix from the upper and lower a plurality of outer leads 15, arrayed in one direction, extend from a side surface 14 of an enclosure 13 of a semiconductor device 12, a bending roller punch 32 extending in the side surface 14 direction of the envelope 13 which bends the outer leads 15, while simultaneously rolling in the prescribed direction after hitting to the upper surface of a root part of the outer leads 15, and a back guide roller 36 provided in parallel so as to contact the outer side roller surface of the bending roller punch 32, are provided. Here, bending with the bending roller punch 32, and clamping and release of it with the semiconductor device 12 are performed in a series of actions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device lead forming apparatus used for bending an outer lead extending from an envelope.

[0002]

2. Description of the Related Art The prior art will be described with reference to FIGS. FIG. 2 is a perspective view of the semiconductor device after the outer leads are bent, and FIG. 3 is a longitudinal sectional view of a main part of a conventional example.

In FIGS. 2 and 3, reference numeral 1 denotes an upper die set constituting an upper die of a lead forming apparatus, 2 denotes an upper die holder attached to the upper die set 1, and 3 denotes an annular projection 3a. Are attached to the lower end of the suspension bolt 4 penetrating the upper die holder 2. The suspension bolt 4 is constantly urged downward by a spring 5. Reference numeral 6 denotes a bending roller punch holder fixed to the upper die holder 2 by a pressing plate 7, provided on both sides of the pressing piece 3. 8 is a bending roller punch holder 6
Is a bending roller punch provided at the lower end of the support shaft 9 so as to be freely rotatable.

[0004] Reference numeral 10 denotes a lower die holder attached to a lower die set (not shown) constituting a lower die opposed to the upper die, and 11 denotes an annular projection 11 a mounted to the lower die holder 10. The bending die is disposed immediately below the upper pressing piece 3.

[0005] On the other hand, reference numeral 12 denotes a semiconductor device to be processed.
, A plurality of outer leads 15 extend so as to be arranged in a line in the longitudinal direction. An outer lead 15 extending in a direction orthogonal to the side surface 14 of the envelope 13
Is bent downward in the vicinity of the root as shown in FIG. 2 by bending using a lead forming apparatus having the above upper and lower dies.

The bending of the outer lead 15 is performed as follows. That is, first, with the upper die and the lower die of the lead forming apparatus opened, the annular projection 1 of the bending die 11 is opened.
The outer lead 15 of the semiconductor device 12 is mounted on 1a so as to be supported near its root. As a result, the envelope 13 of the semiconductor device 12 is formed by the upper and lower annular projections 3a, 3a.
1a. Next, the upper die is lowered so that the annular projection 3a of the push block 3 comes into contact with the upper surface of the outer lead 15, and further lowered, so that the annular projection 3a is pressed against the outer lead 15 by the urging force of the spring 5. And the semiconductor device 12
Is clamped and fixed by the bending die 11 and the pressing piece 3.

Further, by lowering the upper die, the bending roller punch 8 simultaneously comes into contact with the upper surfaces of the root portions of the plurality of outer leads 15 arranged in a line. Then, by continuing the lowering of the upper die, the outer leads 15 arranged while the bending roller punch 8 idles around the support shaft 9.
Press down on the top of. As a result, the outer lead 15 is bent downward at an angle of about 90 degrees with the portion supported by the annular projection 11a of the bending die 11 as a bending point. Then, the upper die is raised and the pusher 3 is raised, so that the bending die 11 and the semiconductor device 12 by the pusher 3 are raised.
Is released, and the semiconductor device 12 having the outer lead 15 bent into a predetermined shape is taken out from the opened lead forming apparatus.

However, in the above prior art,
When bending, when a bending force is applied to the outer lead 15 by the bending roller punch 8, a reaction force is applied to the bending roller punch 8 so as to spread outward as a reaction to the bending force. When such a reaction force is applied, the bending roller punch 8 whose both ends are supported by the bending roller punch holder 6 is curved as a whole in such a manner that its central portion expands outward.

The outer lead 15 bent by the curved bending roller punch 8 has a different expanded size at the center even if the bending size is a predetermined size at both ends in the arrangement direction. For example, what the lead tips should be arranged on a straight line is bent and arranged, so that the semiconductor device 12 has defective lead bending. As a result, the manufacturing yield in the step of forming the outer leads 15 is reduced. When the arrangement of the outer leads 15 is bent, the interval between the opposed outer leads 15 of the semiconductor device 12 is large at the center, and
There is a possibility that the production efficiency in the mounting process may be reduced because the mounting cannot be performed as it is.

[0010]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and an object of the present invention is to provide a semiconductor device in which an outer lead of a semiconductor device is bent by a bending roller punch. Bending dimensions at both end portions and the central portion can be set to predetermined dimensions, the occurrence of defective lead bending of the semiconductor device can be reduced, and the production yield of the semiconductor device can be improved in the outer lead molding process. It is to provide a device.

[0011]

A lead forming apparatus for a semiconductor device according to the present invention comprises: a holding member for holding and fixing a plurality of leads arranged in one direction extending from a surface of an envelope of the semiconductor device; A bending roller punch extending in the direction of the envelope surface that bends while making the lead idle in a predetermined direction at the same time after being brought into contact with one surface, and contacts the outer roller surface of the bending roller punch. And a back guide roller provided in parallel so as to be in contact with the back guide roller.
The bending roller is always in contact with the bending roller when bending, and the bending direction by the bending roller punch is the same as the holding direction of the holding member, and the bending by the bending roller punch and the holding member Characterized in that the pinching and the pinching release are performed in a series of operations, and further, the bending roller punch simultaneously leads the leads extending in opposite directions from the opposite envelope surfaces of the semiconductor device. It is characterized in that it is provided in a pair so that it can be bent.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIG. 1 which is a longitudinal sectional view of a main part and FIG. 2 which is a perspective view showing a semiconductor device after the above-mentioned bending process. .

In FIGS. 1 and 2, reference numeral 21 denotes an upper die set constituting the upper die of the lead forming apparatus, and reference numeral 22 denotes an upper die holder attached to the upper die set 21.
Reference numeral 23 denotes a pressing piece, which is provided with a concave portion 23b by forming a square annular projection 23a at a lower portion thereof. The push piece 23 is attached to a lower end of a suspension bolt 25 that is vertically movably inserted into a through hole 24 formed in the upper die holder 22. The suspension bolt 25 to which the pusher 23 is attached has a flange 25 a having a diameter larger than that of the through hole 24 at the upper end, and a spring housed at the upper end in a mounting hole 26 formed in the upper die set 21. It is constantly urged downward by being pressed by 27. The range of the vertical movement of the suspension bolt 25 is restricted by the flange 25 a serving as a stopper that abuts on the upper surface of the upper die holder 22, so that the downward movement is restricted. Movement is restricted.

Reference numeral 28 denotes a bending roller punch holder fixed by attaching a pressing plate 30 to the upper die holder 22 with screws 29, and is provided so as to be located on both sides of the pressing piece 23, and has the same configuration. And a bending roller punch holder (not shown). A support shaft 31 is provided between the lower end of the bending roller punch holder 28 and the lower end of the corresponding bending roller punch holder.
A column-shaped bending roller punch 32 is attached to the support shaft 31 supported by the shaft so as to freely rotate. In addition, the bending roller punch 32 is used for the envelope 13 of the semiconductor device 12.
Has a predetermined length that is longer than the arrangement length of the outer leads 15 extending from the side surface 14.

A back guide roller holder 34 is attached to each bending roller punch holder 28 by a screw 33.
Is fixed, and a support shaft 35 is provided between the lower end of the corresponding back guide roller holder 34 as in the case of the bending roller punch holder 28, and both ends are supported by the back guide roller holder 34. The bending roller punch 32 and a columnar back guide roller 36 having substantially the same length are attached to the supporting shaft 35 so as to freely rotate. The back guide roller 36 is in contact with the outer roller surface of the bending roller punch 32 while being attached between the back guide roller holders 34.

On the other hand, reference numeral 37 denotes a lower die holder attached to a lower die set (not shown) constituting a lower die opposed to the upper die. 38 is a lower die holder 37
And a bending die arranged just below the upper pressing piece 23. A concave portion 38b is provided on the upper portion of the bending die by forming a square annular projection 38a.

The bending of the outer leads 15 of the semiconductor device 12 by the lead forming apparatus configured as described above is performed as follows. That is, first, the upper and lower dies of the lead forming apparatus are opened and the bending die 38 is opened.
The base of the outer lead 15 is placed on the angular annular projection 38a so that the lower half of the envelope 13 is housed in the recess 38b. As a result, the semiconductor device 12 is supported on the angular annular protrusion 38 a by the vicinity of the root of the outer lead 15.

Next, the upper mold is lowered so that the tip of the angular annular projection 23a of the pushing piece 23 first comes into contact with the upper surface of the outer lead 15, and the envelope 13 is placed in the recess 23b of the pushing piece 23. To accommodate the upper half. By further lowering the upper die, the spring 27 is compressed, and the urging force of the spring 27 causes the angular annular projection 23 a to press against the upper surface of the root of the outer lead 15. In this way, the semiconductor device 12 is clamped and fixed on the bending die 38 by the pressing pieces 23.

Further, by lowering the upper die, a plurality of outer leads 15 extending from the side surfaces 14 of the envelopes 13 arranged in a horizontal line by lowering the bending roller punch 32.
At the same time on the upper surface of the root portion of. By continuing the lowering of the upper die, the bending roller punch 32 keeps pushing the upper surface of the arranged outer leads 15 downward while rotating around the support shaft 31. As a result, the outer leads 15
Is bent downward at an angle of about 90 degrees using the outer lead 15 support portion at the tip of the angular annular projection 38a of the bending die 38 as a bending point.

During the bending process of the outer lead 15, the back roller 36 contacts the outer roller surface of the bending roller punch 32. For this reason, the bending roller punch 32 itself receives the reaction force applied to the bending roller punch 32 as a reaction at the time of bending, and the back guide roller 36 also receives the reaction force according to the position where the bending roller punch 32 is arranged. Thereby, the force applied to the bending roller punch 32 is reduced, and the bending of the bending roller punch 32 due to the reaction force of the bending is reduced. The position where the back guide roller 36 abuts on the bending roller punch 32 is a roller that is axially symmetric with respect to the support shaft 31 at the roller surface position where the outer lead 15 abuts on the bending roller punch 32 in a state where the maximum reaction force is generated. Plane position.

After the bending of the outer lead 15 is completed, the upper die is raised to retreat the bending roller punch 32 from the bending position, and then the upper die set 21 is raised and the pusher 23 is raised. The bending die 38
Then, the holding of the semiconductor device 12 by the push piece 23 is released. Thereafter, the semiconductor device 12 in which the outer leads 15 are bent into a predetermined shape is taken out from the opened lead forming apparatus.

As described above, according to the apparatus configured as described above, it is possible to minimize the outward bending of the bending roller punch 32 at the central portion due to the action of the bending force during the lead forming, and thus the bending is performed. The bent size of the outer lead 15 of the semiconductor device 12 thus formed is a predetermined size at both end portions and the center portion in the arrangement direction, and the front end portion is arranged on a substantially straight line. As a result, the outer lead 1
The lead bending failure in the semiconductor device 12 that has been subjected to the bending process 5 is reduced, and the manufacturing yield of the lead forming process is improved. Further, even when the semiconductor device 12 is mounted or the like, the interval between the opposing outer leads 15 has a required size, so that there is no possibility that the production efficiency in the mounting process is reduced.

[0023]

As is apparent from the above description, according to the present invention, when the outer lead of the semiconductor device is bent by the bending roller punch, the bending dimension is predetermined at both ends and the center in the arrangement direction. The dimensions of
This leads to effects such as a reduction in lead bending failure of the semiconductor device and an improvement in the production yield in the outer lead forming step.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of a main part showing an embodiment of the present invention.

FIG. 2 is a perspective view showing the semiconductor device after bending an outer lead.

FIG. 3 is a longitudinal sectional view of a main part of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 12 ... Semiconductor device 13 ... Envelope 14 ... Side surface 15 ... Outer lead 23 ... Push piece 23a, 38a ... Square annular protrusion 25 ... Hanging bolt 27 ... Spring 28 ... Bending roller punch holder 31, 35 ... Support shaft 32 ... Bending roller Punch 34 ... Back guide roller holder 36 ... Back guide roller 38 ... Bending die

Claims (4)

[Claims] 1. A holding member for holding and fixing a plurality of leads arranged in one direction and extending from a surface of an envelope of a semiconductor device, and a plurality of leads which are brought into contact with one surface of the leads and are simultaneously held at a predetermined position. Roller punch that extends along the direction of the envelope surface that bends while spinning in the direction, and a back guide roller that is provided in parallel so as to contact the outer roller surface of the bending roller punch. A lead forming apparatus for a semiconductor device, comprising: 2. The lead forming apparatus for a semiconductor device according to claim 1, wherein said back guide roller is always in contact with said bending roller when bending. 3. The bending direction of the bending roller punch is the same as the direction of holding of the holding member, and the bending by the bending roller punch and the holding and releasing of the holding by the holding member are performed in a series of operations. The lead forming apparatus for a semiconductor device according to claim 1, wherein: 4. The bending roller punches are provided in pairs so as to simultaneously bend leads extending in opposite directions from opposite envelope surfaces of the semiconductor device. A lead forming apparatus for a semiconductor device according to claim 1.