CN219582028U - Semiconductor integrated circuit module welding jig - Google Patents
Semiconductor integrated circuit module welding jig Download PDFInfo
- Publication number
- CN219582028U CN219582028U CN202320155579.3U CN202320155579U CN219582028U CN 219582028 U CN219582028 U CN 219582028U CN 202320155579 U CN202320155579 U CN 202320155579U CN 219582028 U CN219582028 U CN 219582028U
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- welding
- fixedly installed
- dbc
- integrated circuit
- semiconductor integrated
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model belongs to the technical field of welding, in particular to a welding fixture for a semiconductor integrated circuit module, which aims at the problems that the accuracy of the welding stitch position of the traditional device is low, the production efficiency is greatly reduced, and the product process and the qualification rate are simultaneously reduced.
Description
Technical Field
The utility model relates to the technical field of welding, in particular to a welding fixture for a semiconductor integrated circuit module.
Background
With recent new energy automobiles and wind energy, solar energy, and energy storage development have increasingly demanded IGBT and IPM module products, and more kinds of products, semiconductor soldering techniques have been in a trend of using a system soldering manner such as mounting a plurality of semiconductor modules in a semiconductor package. Although such semiconductor bonding increases the number of stacked semiconductor chip dies for increased capacity.
However, when semiconductor chip bare chips are stacked singly, the number of stacked chips increases, and the overall solder positional requirements increase, so that the pin positional requirements of the product tend to be not satisfied. To solve this problem, a technique capable of increasing the yield of semiconductor bonding has been demanded.
Disclosure of Invention
The utility model aims to solve the defects that the welding stitch position accuracy of the traditional device is low, the production efficiency is greatly reduced, and the product process and the qualification rate are reduced.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the welding fixture comprises a welding base, welding locking devices, DBC positioning devices, positioning shafts and a connecting plate, wherein stitch positioning devices are fixedly installed on the welding base, guide devices are fixedly installed at the tops of the DBC positioning devices, a welding cover plate is fixedly installed on the welding base, a plurality of bolts are movably installed on the welding base, two side frames are symmetrically and fixedly installed on the welding base, a plurality of positioning shafts are movably installed on the welding base, bolt heads are fixedly installed on the welding cover plate, two welding locking devices are symmetrically and fixedly installed on the welding base, two fixing bolts are symmetrically and fixedly installed on the two welding locking devices, a plurality of pins are fixedly installed on the DBC positioning devices, stitch pressing devices are fixedly installed on the DBC positioning devices, a plurality of elastic devices are fixedly installed on the DBC positioning devices, connectors are fixedly installed on the elastic devices, connecting rings are fixedly installed on the connecting plate, a driving motor is fixedly installed on the connecting plate, and an adjusting device is fixedly installed on an output shaft of the driving motor.
Preferably, the mounting device comprises two mounting plates and two mounting holes, the two mounting plates are symmetrically and slidably mounted on the connecting plate, and the two mounting holes are respectively formed in the two mounting plates.
Preferably, the connecting plate is symmetrically and slidably provided with two sliding plates, and the two mounting plates are respectively and fixedly arranged on the two sliding plates.
Preferably, the connecting plate is fixedly provided with a mounting box, and the driving motor is fixedly arranged in the mounting box.
Preferably, the adjusting device comprises a screw, the screw is fixedly arranged on an output shaft of the driving motor, and the two sliding plates are in threaded connection with the screw.
In the utility model, the welding fixture for the semiconductor integrated circuit module has the beneficial effects that:
(1) According to the technical scheme, as the welding base, the DBC positioning device, the bolts, the welding cover plate, the guide device, the stitch positioning device, the pins, the stitch compacting device, the side frame, the positioning shaft, the connecting ring, the elastic device, the welding locking device, the fixing bolts, the connectors and the bolt heads are arranged on the jig, the stitch positioning and orientation device is arranged on the jig, the stitch is compacted on the DBC plate through the stitch compacting device, the whole product is locked by the welding locking device, and then the product and the jig are placed into the welding furnace for heating and welding, so that the design is reasonable, the stitch position accuracy rate of welding is greatly improved, and meanwhile, the product process and the qualification rate are improved;
(2) This scheme is owing to set up connecting plate, slide, mounting panel, mounting hole, mounting box, driving motor, screw rod, can drive the screw rod through driving motor as required and rotate, and the screw rod drives the slide and removes, and the slide drives the mounting panel and removes to can adjust the mounted position.
The utility model has reasonable design, the accuracy of the positions of the welding pins is greatly improved, the production efficiency is greatly improved, the product process and the qualification rate are improved, and the installation position can be adjusted according to the requirement.
Drawings
Fig. 1 is a schematic perspective view of a welding fixture for a semiconductor integrated circuit module according to the present utility model;
FIG. 2 is a schematic diagram of an exploded view of a bonding tool for semiconductor integrated circuit modules according to the present utility model;
fig. 3 is a schematic structural diagram of a connection board, a slide plate, etc. of the welding fixture for semiconductor integrated circuit modules according to the present utility model.
In the figure: 1. welding a base; 2. a DBC positioning device; 3. a bolt; 4. welding a cover plate; 5. a guide device; 6. stitch positioning means; 7. a pin; 8. a stitch compression device; 9. a side frame; 10. positioning a shaft; 11. a connecting ring; 12. an elastic device; 13. welding a locking device; 14. a fixing bolt; 15. a connector; 16. a bolt head; 17. a connecting plate; 18. a slide plate; 19. a mounting plate; 20. a mounting hole; 21. a mounting box; 22. a driving motor; 23. and (3) a screw.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
Referring to fig. 1, a welding jig for a semiconductor integrated circuit module comprises a welding base 1, a welding locking device 13, a DBC positioning device 2, positioning shafts 10 and a connecting plate 17, wherein a stitch positioning device 6 is fixedly installed on the welding base 1, a guide device 5 is fixedly installed at the top of the DBC positioning device 2, a welding cover plate 4 is fixedly installed on the welding base 1, a plurality of bolts 3 are movably installed on the welding base 1, two side frames 9 are symmetrically and fixedly installed on the welding base 1, a plurality of positioning shafts 10 are movably installed on the welding base 1, a bolt head 16 is fixedly installed on the welding cover plate 4, two fixing bolts 14 are symmetrically and fixedly installed on the welding base 1, a plurality of pins 7 are fixedly installed on the DBC positioning device 2, a stitch pressing device 8 is fixedly installed on the DBC positioning device 2, a plurality of elastic devices 12 are fixedly installed on the DBC positioning device 12, a connecting head 15 is fixedly installed on the elastic devices 12, a connecting ring 11 is fixedly installed on the elastic devices 12, two fixing bolts are fixedly installed on the connecting plate 17, a motor is fixedly installed on the motor 17, a driving device 22 is fixedly installed on the driving connecting plate 22.
Referring to fig. 2, the positional relationship of the structure is revealed by an exploded view.
Referring to fig. 3, the installation device includes two installation plates 19 and two installation holes 20, the two installation plates 19 are symmetrically and slidably installed on the connection plate 17, the two installation holes 20 are respectively formed on the two installation plates 19, the two sliding plates 18 are symmetrically and slidably installed on the connection plate 17, the two installation plates 19 are respectively and fixedly installed on the two sliding plates 18, the installation box 21 is fixedly installed on the connection plate 17, the driving motor 22 is fixedly installed in the installation box 21, the adjusting device includes a screw rod 23, the screw rod 23 is fixedly installed on an output shaft of the driving motor 22, the two sliding plates 18 are in threaded connection with the screw rod 23, and the installation position can be adjusted according to requirements.
In the embodiment, a welding product bottom plate is placed on a welding base 1, a DBC plate is placed on a DBC positioning device 2, pins are placed on a pin positioning device 6, then the welding base 1 and a welding cover plate 4 are locked and inverted through a locking device 13, and then the pins are pressed through the weight of a pin pressing device 8; the DBC is tightly propped against the welding bottom plate by the elastic device 12, the positioning is accurate, the production efficiency is greatly improved, the product technology is improved, meanwhile, the connecting plate 17 can be fixed on the device, the screw 23 is driven to rotate by the driving motor 22, and therefore the positions of the two mounting plates 19 can be adjusted as required, and the use is convenient.
Example two
The difference between this embodiment and the first embodiment is that: the installation holes 20 are internally provided with threads, the installation can be carried out through screws, and the connecting plates 17 are provided with connecting holes, so that the connecting plates 17 are convenient to fixedly install on the device.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (5)
1. The welding fixture for the semiconductor integrated circuit module comprises a welding base (1), a welding locking device (13), DBC positioning devices (2), positioning shafts (10) and a connecting plate (17), and is characterized in that pin positioning devices (6) are fixedly installed on the welding base (1), guide devices (5) are fixedly installed at the tops of the DBC positioning devices (2), a welding cover plate (4) is fixedly installed on the welding base (1), a plurality of bolts (3) are movably installed on the welding base (1), two side frames (9) are symmetrically and fixedly installed on the welding base (1), a plurality of positioning shafts (10) are movably installed on the welding base (1), bolt heads (16) are fixedly installed on the welding cover plate (4), two fixing bolts (14) are symmetrically and movably installed on the welding base (1), a plurality of pins (7) are fixedly installed on the DBC positioning devices (2), a pressing device (8) is fixedly installed on the DBC positioning devices (2), a plurality of pins (12) are fixedly installed on the DBC positioning devices (12), a plurality of elastic connectors (15) are fixedly installed on the DBC positioning devices, the connecting rings (11) are fixedly arranged on the elastic devices (12), the installation devices are slidably arranged on the connecting plates (17), the driving motors (22) are fixedly arranged on the connecting plates (17), and the adjusting devices are fixedly arranged on output shafts of the driving motors (22).
2. The semiconductor integrated circuit module bonding jig according to claim 1, wherein the mounting means comprises two mounting plates (19) and two mounting holes (20), the two mounting plates (19) are symmetrically slidably mounted on the connecting plate (17), and the two mounting holes (20) are respectively opened on the two mounting plates (19).
3. The semiconductor integrated circuit module bonding jig according to claim 2, wherein the connecting plate (17) is symmetrically slidably mounted with two slide plates (18), and the two mounting plates (19) are fixedly mounted on the two slide plates (18), respectively.
4. The semiconductor integrated circuit module bonding jig according to claim 1, wherein the connection plate (17) is fixedly mounted with a mounting box (21), and the driving motor (22) is fixedly mounted in the mounting box (21).
5. The semiconductor integrated circuit module bonding jig according to claim 1, wherein the adjusting means comprises a screw (23), the screw (23) is fixedly mounted on an output shaft of the driving motor (22), and both the slide plates (18) are screwed with the screw (23).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320155579.3U CN219582028U (en) | 2023-02-08 | 2023-02-08 | Semiconductor integrated circuit module welding jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202320155579.3U CN219582028U (en) | 2023-02-08 | 2023-02-08 | Semiconductor integrated circuit module welding jig |
Publications (1)
Publication Number | Publication Date |
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CN219582028U true CN219582028U (en) | 2023-08-25 |
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ID=87687072
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202320155579.3U Active CN219582028U (en) | 2023-02-08 | 2023-02-08 | Semiconductor integrated circuit module welding jig |
Country Status (1)
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CN (1) | CN219582028U (en) |
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2023
- 2023-02-08 CN CN202320155579.3U patent/CN219582028U/en active Active
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