CN219005021U - Welding and cooling system of thermoelectric semiconductor device - Google Patents
Welding and cooling system of thermoelectric semiconductor device Download PDFInfo
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- CN219005021U CN219005021U CN202223007747.9U CN202223007747U CN219005021U CN 219005021 U CN219005021 U CN 219005021U CN 202223007747 U CN202223007747 U CN 202223007747U CN 219005021 U CN219005021 U CN 219005021U
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- 238000003466 welding Methods 0.000 title claims abstract description 98
- 238000001816 cooling Methods 0.000 title claims abstract description 91
- 239000004065 semiconductor Substances 0.000 title claims abstract description 60
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 78
- 238000003825 pressing Methods 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 35
- 238000001179 sorption measurement Methods 0.000 claims abstract description 7
- 238000005476 soldering Methods 0.000 claims description 16
- 239000000498 cooling water Substances 0.000 claims description 4
- 230000004308 accommodation Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 11
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000009471 action Effects 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 8
- 230000006872 improvement Effects 0.000 description 10
- 230000006835 compression Effects 0.000 description 8
- 238000007906 compression Methods 0.000 description 8
- 238000013461 design Methods 0.000 description 5
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
The utility model discloses a welding and cooling system of a thermoelectric semiconductor device, wherein an XYR mobile platform is arranged on a linear module; the XYR moving platform is provided with a jig tray, a welding jig, a jig pressing plate and a negative pressure water cooling block, wherein the welding jig is placed on the jig tray, and a thermoelectric semiconductor device is placed on the welding jig; the two sides of the jig tray are provided with jig pressing plates for pressing the welding jig, the lower part of the welding jig is provided with a negative pressure water cooling block capable of moving up and down, and when the negative pressure water cooling block moves upwards to be clung to the bottom surface of the welding jig, the negative pressure water cooling block realizes negative pressure adsorption and water cooling on the thermoelectric semiconductor device; a pressing upright post is arranged above the thermoelectric semiconductor device, and the heating head can horizontally extend into the lower part of the welding jig. The utility model can modularize the action flow, promote the production line of the welding process, and improve the production efficiency and the welding quality.
Description
Technical Field
The utility model relates to the technical field of thermoelectric semiconductor devices, in particular to a welding and cooling system of a thermoelectric semiconductor device.
Background
With the development of technology, semiconductor devices and components are widely used in engineering and commerce. The method has high requirements on the reliability of the chip in a large number of applications such as radar, remote control and remote measurement, aerospace and the like, wherein the welding (pasting) mode of the chip is also a link very important for the reliability of the chip. Chip-to-package bonding refers to a method of forming a strong, conductive or insulating connection between a semiconductor chip and a carrier (package housing or substrate). The solder layer, in addition to providing mechanical and electrical connection to the device, also needs to provide a good heat sink path for the device.
The existing production equipment of the thermoelectric semiconductor device has the defects of relatively rough design, low automation degree, large product size and low product size precision; the produced device is not suitable for application in narrow space and precise structure, and has low yield.
Disclosure of Invention
In view of the shortcomings of the prior art, the present utility model provides a soldering and cooling system for thermoelectric semiconductor devices.
The utility model discloses a welding and cooling system of a thermoelectric semiconductor device, which comprises: the device comprises a jig tray, a welding jig, a heating head, a jig pressing plate, a negative pressure water cooling block, a linear module, an XYR moving platform and a pressing upright post;
the XYR mobile platform is arranged on the linear module;
the XYR moving platform is provided with the jig tray, a welding jig, a jig pressing plate and a negative pressure water cooling block, wherein the welding jig is placed on the jig tray, and a thermoelectric semiconductor device is placed on the welding jig; the two sides of the jig tray are provided with the jig pressing plates for pressing the welding jig, the negative pressure water cooling block capable of moving up and down is arranged below the welding jig, and when the negative pressure water cooling block moves upwards to be clung to the bottom surface of the welding jig, the negative pressure water cooling block realizes negative pressure adsorption and water cooling of the thermoelectric semiconductor device;
the upper part of the thermoelectric semiconductor device is provided with the pressing upright post, and the heating head can horizontally extend into the lower part of the welding jig.
As a further improvement of the utility model, the jig tray is provided with a containing groove for containing the welding jig, the welding jig is provided with a vent hole, and the thermoelectric semiconductor device is placed at the position of the vent hole of the welding jig.
As a further improvement of the utility model, a through hole for the negative pressure water cooling block to move up and down is arranged below the accommodating groove, and a negative pressure channel and a water cooling channel are arranged on the negative pressure water cooling block; when the negative pressure water cooling block moves upwards to be clung to the bottom surface of the welding jig, one end of a negative pressure channel of the negative pressure water cooling block is aligned with the vent hole of the welding jig.
As a further improvement of the utility model, the other end of the negative pressure channel of the negative pressure water cooling block is connected with a negative pressure pump; the water cooling channel of the negative pressure water cooling block, an external water tank and a water pump form a cooling water circulation channel, and a refrigerating sheet is arranged in the water tank.
As a further improvement of the utility model, the inner side wall of the through hole of the jig tray is flush with the inner side edge of the jig pressing plate, and the upper surface of the negative pressure water cooling block has a finish of 0.4Ra or higher.
As a further improvement of the welding jig, a rotary compression cylinder is further arranged on the XYR moving platform and connected with the rotary compression cylinder, and the rotary compression cylinder drives the jig pressing plate to compress the welding jig downwards.
As a further improvement of the utility model, the XYR moving platform is also provided with a jacking air cylinder, the negative pressure water cooling block is connected with the jacking air cylinder, and the jacking air cylinder drives the negative pressure water cooling block to move up and down.
As a further improvement of the utility model, the jig tray is also provided with a heating groove below the accommodating groove, and the heating head horizontally extends into the lower part of the welding jig along the heating groove.
As a further improvement of the present utility model, there is also included: a telescopic cylinder;
the heating head is connected with the telescopic cylinder, the telescopic cylinder is installed on the support on one side of the linear module, and the telescopic cylinder drives the heating head to horizontally move.
As a further improvement of the present utility model, the heating head is a high-frequency heating head.
Compared with the prior art, the utility model has the beneficial effects that:
the utility model constructs the parts needed by each step in a modularized mode by decomposing the whole welding process of the thermoelectric semiconductor device; the system can modularize the action flow, promote the production line of the welding process, and improve the production efficiency and the welding quality; meanwhile, when a single welding step fails, new components can be directly replaced, and equipment maintenance is more convenient and rapid; meanwhile, after each action is split, the respective design can be simple and quick, and standardized and precise design can be realized more easily.
Drawings
Fig. 1 is a schematic diagram showing a structure of a soldering and cooling system for a thermoelectric semiconductor device according to an embodiment of the present utility model;
FIG. 2 is a schematic view of a portion of the structure of FIG. 1;
fig. 3 is a cross-sectional view of fig. 2.
In the figure:
1. a jig tray; 1-1, an accommodating groove; 1-2, through holes; 1-3, a heating tank; 2. a thermoelectric semiconductor device; 3. welding jig; 3-1, vent holes; 4. a high-frequency heating head; 5. a jig pressing plate; 6. a negative pressure water cooling block; 6-1, a negative pressure channel; 6-2, a water cooling channel; 7. a rotary compression cylinder; 8. jacking the air cylinder; 9. a telescopic cylinder; 10. a linear module; 11. an XYR mobile platform; 12. and pressing down the upright post.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The utility model is described in further detail below with reference to the attached drawing figures:
as shown in fig. 1 to 3, the present utility model provides a soldering and cooling system for a thermoelectric semiconductor device, comprising: the device comprises a jig tray 1, a thermoelectric semiconductor device 2, a welding jig 3, a high-frequency heating head 4, a jig pressing plate 5, a negative pressure water cooling block 6, a rotary compression cylinder 7, a jacking cylinder 8, a telescopic cylinder 9, a linear module 10, an XYR mobile platform 11 and a pressing upright post 12; wherein,,
the XYR mobile platform 11 is arranged on the linear module 10, so that the linear module 10 can drive the XYR mobile platform 11 to move linearly; the jig tray 1, the thermoelectric semiconductor device 2, the welding jig 3, the jig pressing plate 5, the negative pressure water cooling block 6, the rotary compression cylinder 7 and the jacking cylinder 8 are arranged on the XYR moving platform 11, namely the jig tray 1 is arranged on the top plate of the XYR moving platform 11 through a bracket or directly, the rotary compression cylinder 7 is arranged on the top plate of the XYR moving platform 11, the top end of the rotary compression cylinder is connected with the jig pressing plate 5, the jacking cylinder 8 is arranged on the top plate of the XYR moving platform 11, and the top end of the jacking cylinder is connected with the negative pressure water cooling block 6, so that the XYR moving platform 11 can drive the components to realize X, Y, R movement in three directions; the high-frequency heating head 4 is mounted on a telescopic cylinder 9, the telescopic cylinder 9 is mounted on a bracket on one side of the linear module 10, and a pressing upright 12 is arranged above the thermoelectric semiconductor device 2 and is used for applying pressure required by a welding process to the thermoelectric semiconductor device 2.
Specific:
the jig tray 1 is provided with the accommodating groove 1-1 for accommodating the welding jig 3, four corners of the accommodating groove 1-1 are provided with the grabbing grooves which are convenient for the welding jig 3 to be taken down, the upper surface of the welding jig 3 arranged in the accommodating groove 1-1 is higher than the upper surface of the jig tray 1, and the upper surface of the welding jig 3 is parallel to the upper surface of the jig tray 1. The welding jig 3 is provided with vent holes 3-1, and thermoelectric semiconductor devices 2 are placed at the positions of the vent holes 3-1 on the upper surface of the welding jig 3, so that the thermoelectric semiconductor devices 2 on the upper surface of the welding jig 3 can be adsorbed by negative pressure from the bottom of the welding jig 3.
In order to realize the fixation of the welding jig 3, the two sides of the jig tray 3 are provided with jig pressing plates 5 for pressing the edges of the welding jig 3; and preferably the through-hole inner side wall of the jig pallet 1 is flush with the inner side edge of the jig pressing plate 5 as shown in fig. 3. Further, the jig pressing plate 5 is connected with the rotary pressing cylinder 7, and the welding jig 3 is pressed by downward movement or the welding jig 3 is released from being pressed by upward movement under the action of the rotary pressing cylinder 7.
In order to realize cooling of the thermoelectric semiconductor device 2 welded on the welding jig 3, a through hole 1-2 for the negative pressure water cooling block 6 to move up and down is arranged below the accommodating groove 1-1 in the jig tray 1, the through hole 1-2 and the accommodating groove 1-1 form a stepped hole with a large upper part and a small lower part, and the negative pressure water cooling block 6 can move upwards in the through hole 1-2 to be clung to the bottom surface of the welding jig 3; the negative pressure water cooling block 6 is provided with a negative pressure channel 6-1 and a water cooling channel 6-2, when the negative pressure water cooling block 6 moves upwards to be clung to the bottom surface of the welding jig 3, one end of the negative pressure channel 6-1 of the negative pressure water cooling block 6 is aligned with the vent hole 3-1 of the welding jig 3, the other end of the negative pressure channel 6-1 of the negative pressure water cooling block 6 can be connected with a negative pressure pump, the negative pressure pump works, negative pressure is generated below the thermoelectric semiconductor device 2 through the negative pressure channel 6-1 and the vent hole 3-1, and negative pressure adsorption of the thermoelectric semiconductor device 2 on the upper surface of the welding jig 3 is achieved on the lower surface of the welding jig 3; firstly, the movement of the thermoelectric semiconductor device 2 is prevented when the temperature is reduced, secondly, the gap between the thermoelectric semiconductor device 2 and the welding jig 3 is reduced, and the contact thermal resistance is reduced. Further, the negative pressure channel 6-1 may be a single negative pressure air channel or a plurality of negative pressure air channels. Further, the water cooling channel 6-2 of the negative pressure water cooling block 6 can form a cooling water circulating channel with an external water tank and a water pump, namely, a water inlet of the water tank is connected with one end of the water cooling channel 6-2, a water outlet of the water tank is connected with the other end of the water cooling channel 6-2, the cooling water circulating channel is provided with the water pump and a valve, and a refrigerating sheet is arranged in the water tank. Further, the negative pressure water cooling block 6 is connected with the jacking air cylinder 8, and the negative pressure water cooling block 6 is driven to move up and down under the action of the jacking air cylinder 8. Further, the upper surface of the negative pressure water-cooling block 6 in contact with the welding jig 3 has a finish of 0.4Ra or more.
In order to realize the welding of the welding jig 3, the jig tray 1 is also provided with a heating groove 1-3 below the accommodating groove 1-1, and the heating groove 1-3 and the through hole 1-2 share part of space; the high-frequency heating head 4 horizontally extends to the lower part of the welding jig 3 along the heating groove 1-3, so that the heating welding of the thermoelectric semiconductor device 2 on the welding jig 3 can be realized. Further, the high-frequency heating head 4 can be connected with the telescopic cylinder 9, and the high-frequency heating head 4 moves horizontally under the telescopic cylinder 9 to the lower part of the welding jig 3 or leaves the lower part of the welding jig 3. Further, when the high-frequency heating head 4 works, the negative pressure water cooling block 6 gives up an operation space; when the negative pressure water cooling block 6 works, the high-frequency heating head 4 leaves the working space.
The working method of the welding and cooling system of the thermoelectric semiconductor device comprises the following steps:
s1, placing a welding jig 3 carrying a thermoelectric semiconductor device 2 in a containing groove 1-1 of a jig tray 1, and driving a jig pressing plate 5 to press the welding jig 3 by rotating a pressing cylinder 7;
s2, transferring the welding jig 3 carrying the thermoelectric semiconductor device 2 to a welding station by the linear module 10, and adjusting the thermoelectric semiconductor device 2 to a welding posture by the XYR moving platform 11;
s3, the pressing upright post 12 moves downwards, and pressure required by a welding process is applied to the thermoelectric semiconductor device 2;
s4, the telescopic cylinder 9 drives the high-frequency heating head 4 to move to a welding position below the welding jig 3, and the high-frequency heating head 4 heats and welds the thermoelectric semiconductor device 2;
s5, the telescopic cylinder 9 drives the high-frequency heating head 4 to retract to a station to be welded;
s6, the jacking cylinder 8 drives the negative pressure water cooling block 6 to jack up to be closely attached to the lower surface of the welding jig 3, the negative pressure channel 6-1 is opened for vacuumizing (preventing the posture of the thermoelectric semiconductor device 2 from being influenced when the pressing upright post 12 retreats to a station to be welded), and meanwhile, the water cooling channel 6-2 is opened for cooling the welding jig 3;
s7, the downward-pressing upright post 12 moves upwards and retreats to-be-welded station;
s8, transferring the welded and cooled chip to a next station through the linear module 10;
s9, the jacking cylinder 8 drives the negative pressure water cooling block 6 to descend, and vacuumizing and water cooling are stopped at the same time.
The utility model has the advantages that:
the utility model constructs the parts needed by each step in a modularized mode by decomposing the whole welding process of the thermoelectric semiconductor device; the system can modularize the action flow, promote the production line of the welding process, and improve the production efficiency and the welding quality; for example, in the welding and cooling part, the equipment performs single welding action, so that the efficiency is remarkably improved; during cooling, the equipment can cool the tool jig in the movement process, so that the production efficiency is obviously improved; meanwhile, when a single welding step fails, new components can be directly replaced, and equipment maintenance is more convenient and rapid; meanwhile, after each action is split, the respective design can be simple and quick, and standardized and precise design can be realized more easily.
In addition, the utility model can carry out negative pressure adsorption on the thermoelectric semiconductor device from the lower part of the welding jig, does not occupy the upper space, and is convenient for carrying out common machine vision detection in the production process; the fixture pressing plate is used for fixing the welding fixture, the negative pressure water cooling block is used for fixing the thermoelectric semiconductor device in a negative pressure adsorption mode, the fixture pressing plate and the thermoelectric semiconductor device can be fixed at the same time, and the negative pressure adsorption force is easier to adjust and control; the deformation and damage of the device caused by the application of local pressure on the small-size thermoelectric semiconductor device in the traditional compaction mode are prevented; through the ascending thrust of negative pressure water cooling piece and the suction of negative pressure water cooling piece centre bore, can realize that the laminating of negative pressure water cooling piece, welding jig and thermoelectric semiconductor device three is inseparable, reduces contact thermal resistance, improves the cooling effect.
The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (10)
1. A soldering and cooling system for a thermoelectric semiconductor device, comprising: the device comprises a jig tray, a welding jig, a heating head, a jig pressing plate, a negative pressure water cooling block, a linear module, an XYR moving platform and a pressing upright post;
the XYR mobile platform is arranged on the linear module;
the XYR moving platform is provided with the jig tray, a welding jig, a jig pressing plate and a negative pressure water cooling block, wherein the welding jig is placed on the jig tray, and a thermoelectric semiconductor device is placed on the welding jig; the two sides of the jig tray are provided with the jig pressing plates for pressing the welding jig, the negative pressure water cooling block capable of moving up and down is arranged below the welding jig, and when the negative pressure water cooling block moves upwards to be clung to the bottom surface of the welding jig, the negative pressure water cooling block realizes negative pressure adsorption and water cooling of the thermoelectric semiconductor device;
the upper part of the thermoelectric semiconductor device is provided with the pressing upright post, and the heating head can horizontally extend into the lower part of the welding jig.
2. The soldering and cooling system for a thermoelectric semiconductor device according to claim 1, wherein the jig tray is provided with a receiving groove for receiving a soldering jig, the soldering jig is provided with a vent hole, and the thermoelectric semiconductor device is placed at the vent hole position of the soldering jig.
3. The welding and cooling system of thermoelectric semiconductor device as set forth in claim 2, wherein said jig tray is provided with a through hole for up-and-down movement of a negative pressure water cooling block provided with a negative pressure passage and a water cooling passage below said accommodation groove; when the negative pressure water cooling block moves upwards to be clung to the bottom surface of the welding jig, one end of a negative pressure channel of the negative pressure water cooling block is aligned with the vent hole of the welding jig.
4. The welding and cooling system for a thermoelectric semiconductor device as set forth in claim 3, wherein the negative pressure pump is connected to the other end of the negative pressure passage of the negative pressure water-cooling block; the water cooling channel of the negative pressure water cooling block, an external water tank and a water pump form a cooling water circulation channel, and a refrigerating sheet is arranged in the water tank.
5. The soldering and cooling system for a thermoelectric semiconductor device as set forth in claim 3, wherein the through-hole inner side wall of said jig tray is flush with the inner side edge of said jig platen, and the negative pressure water-cooling block upper surface has a finish of 0.4Ra or more.
6. The soldering and cooling system for a thermoelectric semiconductor device as set forth in claim 1, wherein a rotary hold-down cylinder is further mounted on said XYR moving platform, said rotary hold-down cylinder being connected to said rotary hold-down cylinder, said rotary hold-down cylinder driving said jig platen to hold down said soldering jig.
7. The soldering and cooling system for a thermoelectric semiconductor device according to claim 1, wherein a jacking cylinder is further installed on the XYR moving platform, the negative pressure water cooling block is connected to the jacking cylinder, and the jacking cylinder drives the negative pressure water cooling block to move up and down.
8. The soldering and cooling system for a thermoelectric semiconductor device as set forth in claim 3, wherein said jig tray is further provided with a heating groove below said receiving groove, said heating head extending horizontally along said heating groove to below said soldering jig.
9. The soldering and cooling system for a thermoelectric semiconductor device as set forth in claim 8, further comprising: a telescopic cylinder;
the heating head is connected with the telescopic cylinder, the telescopic cylinder is installed on the support on one side of the linear module, and the telescopic cylinder drives the heating head to horizontally move.
10. The soldering and cooling system for a thermoelectric semiconductor device as set forth in claim 8, wherein said heating tip is a high-frequency heating tip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223007747.9U CN219005021U (en) | 2022-11-11 | 2022-11-11 | Welding and cooling system of thermoelectric semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223007747.9U CN219005021U (en) | 2022-11-11 | 2022-11-11 | Welding and cooling system of thermoelectric semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219005021U true CN219005021U (en) | 2023-05-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223007747.9U Active CN219005021U (en) | 2022-11-11 | 2022-11-11 | Welding and cooling system of thermoelectric semiconductor device |
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| Country | Link |
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| CN (1) | CN219005021U (en) |
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- 2022-11-11 CN CN202223007747.9U patent/CN219005021U/en active Active
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