CN116252087A

CN116252087A - Welding positioning tool

Info

Publication number: CN116252087A
Application number: CN202211701425.6A
Authority: CN
Inventors: 陈跃; 肖倩; 刘季超; 王亮平; 胡志明; 黎燕林
Original assignee: Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd
Current assignee: Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-06-13

Abstract

The application relates to the technical field of substrate packaging, and particularly provides a welding positioning tool which comprises a first positioning plate, a second positioning plate, a third positioning plate and a pressing block; a positioning groove is formed in the first positioning plate; the second positioning plate is positioned on the upper side of the first positioning plate, the first positioning hole is aligned with the positioning groove, the first positioning hole is used for accommodating and positioning the surrounding frame, and a first welding lug is arranged between the bottom of the surrounding frame and the substrate; the third positioning plate is provided with a second positioning hole, the third positioning plate is used for being assembled in the surrounding frame, the second positioning hole is used for accommodating the chip, and a second soldering lug is further arranged between the chip and the substrate; the briquetting is used for pressing simultaneously and encloses frame and chip. The technical problem that the chip eutectic sintering cannot be performed simultaneously with the substrate surrounding frame welding and influences the reliability of products due to the fact that a tooling capable of positioning the chip and the surrounding frame simultaneously does not exist in the prior art is solved.

Description

Welding positioning tool

Technical Field

The application relates to the technical field of substrate packaging, in particular to a welding positioning tool.

Background

In recent years, along with the continuous development of the electronic information field in the direction of systemization, miniaturization, high integration and high reliability, LTCC/HTCC plays a great role in the process of pushing the development trend, on one hand, LTCC/HTCC can pass through embedded circuits and partial functional electronic elements (resistors, capacitors, inductors, interconnection lines and the like), and the internal systemization and integration degree of products are greatly improved; on the other hand, compared with the traditional PCB substrate, the LTCC/HTCC has more excellent performance of each parameter in terms of the limit temperature resistance, dielectric constant and thermal expansion rate, the proportion occupied in the product field with high added value and high reliability is improved year by year, and the LTCC/HTCC industry has a larger rising space from the aspect of industry development trend.

The packaging product based on the LTCC/HTCC substrate can relate to the processes of chip eutectic welding, resistance-capacitance reflow soldering, gold wire bonding, enclosure frame welding, sealing cover and the like in the micro-assembly engineering, wherein the chip eutectic welding and the enclosure frame welding are two important processes for determining the quality of the product.

The chip eutectic welding and the surrounding frame welding are two different procedures of an LTCC/HTCC component product, the chip eutectic welding is to heat an LTCC/HTCC substrate, a chip welding surface and the alloy welding flux to be higher than the melting point of the alloy welding flux and lower than the melting temperature of the base metal, the base metal is wetted by the liquid alloy welding flux, interface gaps are filled and the bonding is realized by interdiffusion with the base metal, and the size of a welding cavity can influence the electrical performance and the reliability of the product. The surrounding frame welding process and the chip eutectic process have the same utilization principle, a welded object is changed into a connecting surface of the substrate and the surrounding frame, alloy solder is adopted to infiltrate the substrate and the surrounding frame, so that interconnection of the substrate and the surrounding frame is completed, whether the solder is fully infiltrated or not, and the method has a decision effect on air tightness of a product.

In the prior art, as no tooling capable of positioning the chip and the surrounding frame simultaneously is provided, the chip eutectic sintering (namely the chip eutectic welding) cannot be performed simultaneously with the surrounding frame substrate welding, and the chip eutectic sintering is performed before the surrounding frame substrate welding, the welding flux is a gold-tin alloy system soldering lug widely used in the industry, after the surrounding frame substrate welding is performed in the chip eutectic process, the product is heated to 30-50 ℃ above the melting point of the gold-tin soldering lug again when the surrounding frame welding is performed, which means that the alloy welding flux formed in the chip eutectic process can be melted again, and the welding flux alloy layer between the chip and the substrate after the eutectic sintering is damaged, thereby influencing the reliability of the product.

Disclosure of Invention

The utility model aims at providing a welding positioning tool, aim at solving among the prior art existence owing to not having the frock that can be to chip and enclose the frame simultaneous localization, the chip eutectic sintering can not go on simultaneously with enclose the frame base plate welding, and the solder alloy layer between the chip of eutectic sintering and the base plate can be destroyed when enclosing the frame welding that causes to the technical problem who leads to the fact the influence to the reliability of product.

In order to achieve the above purpose, the technical scheme that this application adopted is to provide a welding positioning frock, include:

the first positioning plate is provided with a positioning groove for accommodating and positioning the substrate;

the second positioning plate is provided with a first positioning hole, the second positioning plate is positioned on the upper side of the first positioning plate, the first positioning hole is aligned to the positioning groove, the first positioning hole is used for accommodating the surrounding frame so as to position the surrounding frame on the substrate, and a first welding sheet is further arranged between the bottom of the surrounding frame and the substrate;

the third positioning plate is provided with a second positioning hole, the third positioning plate is used for being assembled in the surrounding frame so that the second positioning hole is aligned to a chip welding position on the substrate, the second positioning hole is used for accommodating a chip, and a second welding lug is arranged between the chip and the chip welding position of the substrate; and

and the pressing block is used for simultaneously pressing the surrounding frame and the chip.

In one embodiment, the positioning groove, the first positioning hole and the second positioning hole are rectangular, and arc-shaped abdication notches are further formed at the end corners of the positioning groove, the first positioning hole and the second positioning hole.

In one embodiment, the positioning grooves are multiple and are arranged on the first positioning plate in a mode of multiple rows and multiple columns, and the first positioning holes on the second positioning plate are multiple and are arranged in a one-to-one correspondence with the positioning grooves.

In one embodiment, the third positioning plate comprises a plate body and a protruding portion connected to the plate edge of the plate body, and the protruding portion is used for abutting against the inner wall of the surrounding frame.

In one embodiment, the welding positioning tool further comprises a fourth positioning plate, a third positioning hole is formed in the fourth positioning plate, the fourth positioning plate is arranged on the upper side of the second positioning plate, the third positioning hole and the first positioning hole are aligned with each other, and the pressing block is arranged in the third positioning hole.

In one embodiment, the pressing block comprises a block body and a pressing protrusion arranged at the lower part of the block body, wherein the block body is used for pressing the surrounding frame, and the pressing protrusion is used for pressing the chip.

In one embodiment, the first positioning plate, the second positioning plate and the fourth positioning plate are sequentially arranged in the vertical direction, and superposition positioning is realized between the first positioning plate and the second positioning plate and between the second positioning plate and the fourth positioning plate through positioning pins and slots which are arranged in a plugging manner.

In one embodiment, the first positioning plate, the second positioning plate and the fourth positioning plate are provided with clamping grooves at the edges.

In one embodiment, the first positioning plate, the second positioning plate, the third positioning plate, the fourth positioning plate and the pressing block are all made of graphite.

In one embodiment, the substrate is made of ceramic.

The beneficial effect of welding positioning frock that this application provided lies in, this frock can be realized enclosing frame and base plate, chip and the simultaneous location of base plate, so that chip eutectic sintering and enclose the frame welding and can go on simultaneously, product quality has been guaranteed, specifically, first location base plate through the constant head tank on the first locating plate, then will enclose the frame and put into first locating hole, because first locating hole and constant head tank align each other, so enclose the position of frame on the base plate and obtain the location, this device has still set up the third locating plate, it has the second locating hole, the third locating plate is fixed a position in enclosing the frame, with the chip welding position on the base plate is aimed at to the second locating hole in order to make the second locating hole, then automatic alignment welding position when the chip is placed in the second locating hole, and still compress tightly enclosing frame and chip respectively through the briquetting, put the frock in the atmosphere stove furnace this moment, so that first soldering lug and second soldering lug melt and realize welded connection.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following description will briefly introduce the drawings that are needed in the embodiments or the description of the prior art, it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is an exploded structure schematic diagram of a welding positioning tool provided in an embodiment of the present application;

FIG. 2 is a schematic view of the first positioning plate in FIG. 1;

FIG. 3 is a schematic view of the second positioning plate in FIG. 1;

FIG. 4 is a schematic view of the third positioning plate in FIG. 1;

FIG. 5 is a schematic view of the fourth positioning plate in FIG. 1;

fig. 6 is a schematic structural view of the compact of fig. 1.

In the figure, 1, a first positioning plate; 2. a positioning groove; 3. a second positioning plate; 4. a first positioning hole; 5. a surrounding frame; 6. a first lug; 7. a substrate; 8. a third positioning plate; 9. a second positioning hole; 10. a chip; 11. a second lug; 12. briquetting; 13. a block; 14. pressing the bulge; 15. a relief notch; 16. a plate body; 17. a protruding portion; 18. a fourth positioning plate; 19. a third positioning hole; 20. a positioning pin; 21. clamping grooves.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise. The meaning of "a number" is one or more than one unless specifically defined otherwise.

In the description of the present application, it is to be understood that the terms "center", "length", "width", and "width" are used to describe,

The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is for convenience of description of the present application and for simplicity of description, and is not intended to indicate or imply that the device or element in question must have a particular orientationAnd are constructed and operated in a particular orientation and thus should not be construed as limiting the present application.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

Referring to fig. 1-4 and fig. 5, a specific embodiment of a welding positioning tool is provided, which includes a first positioning plate 1, a second positioning plate 3, a third positioning plate 8, and a pressing block 12.

A positioning groove 2 for accommodating and positioning a substrate 7 is provided on the first positioning plate 1.

The second positioning plate 3 is provided with a first positioning hole 4, the second positioning plate 3 is positioned on the upper side of the first positioning plate 1, the first positioning hole 4 is aligned with the positioning groove 2, the first positioning hole 4 is used for accommodating the surrounding frame 5 so that the surrounding frame 5 is positioned on the base plate 7, and a first welding lug 6 is arranged between the bottom of the surrounding frame 5 and the base plate 7;

the third positioning plate 8 is provided with a second positioning hole 9, the third positioning plate 8 is used for being assembled in the surrounding frame 5 so that the second positioning hole 9 is aligned with a chip welding position on the base plate 7, the second positioning hole 9 is used for accommodating a chip 10, and a second welding lug 11 is further arranged between the chip 10 and the chip 10 welding position of the base plate 7; the pressing block 12 is used for simultaneously pressing the peripheral frame 5 and the chip 10.

Specifically, the welding positioning tool in this embodiment is used by firstly placing the first positioning plate 1 flat, then placing the substrate 7 in the positioning groove 2, and when the substrate 7 is placed in the positioning groove 2, the edges of the substrate 7 will abut against the groove walls of the positioning groove 2, so that the substrate 7 cannot move, and positioning of the substrate 7 is achieved. Then the second locating plate 3 is placed on the upper side of the first locating plate 1, and a certain gap can be kept for the lamination setting, and the first locating holes 4 and the locating grooves 2 are aligned with each other. And then the surrounding frame 5 is placed in the first positioning hole 4, so that the positioning of the surrounding frame 5 is realized.

Specifically can set up like this, the shape of constant head tank 2 and the shape looks adaptation of base plate 7, and the shape of first locating hole 4 is with enclose the outline looks adaptation of frame 5, and when enclosing frame 5 put into first locating hole 4 like this, the bottom of enclosing frame 5 just in time aligns the edge position that base plate 7 needs the welding to enclose frame 5, has realized enclosing the location between frame 5 and the base plate 7 like this. Of course, in order to achieve the welding, a first soldering lug 6 is arranged between the bottom of the enclosure frame 5 and the substrate 7, and the shape of the first soldering lug 6 is the same as the shape of the bottom of the enclosure frame 5.

The positioning between the chip 10 and the substrate 7 is realized by that the third positioning plate 8 is used for being placed in the positioned surrounding frame 5, the positioning of the third positioning plate 8 is also realized when the third positioning plate 8 is placed in the surrounding frame 5, and at the moment, the second positioning hole 9 on the third positioning plate 8 is just aligned with the welding position of the chip 10 on the substrate 7, and then the chip 10 is placed in the second positioning hole 9, so that the positioning between the chip 10 and the substrate 7 is realized, and the second welding tab 11 is arranged between the chip 10 and the substrate 7, so that the welding between the chip 10 and the substrate 7 is realized.

After the positioning between the surrounding frame 5 and the substrate 7 and between the chip 10 and the substrate 7 is realized, the tool is placed in an atmosphere furnace, and the atmosphere furnace sets the temperature, so that the first soldering lug 6 and the second soldering lug 11 are melted to realize welding connection. The die eutectic sintering, that is, die eutectic welding, is carried out by placing the die eutectic sintering in an atmosphere furnace to heat as in the surrounding frame welding, so that the melting of the first soldering lug 6 and the second soldering lug 11 is realized, and the die is connected with the substrate and the surrounding frame is connected with the substrate. The first welding lug 6 is arranged at the bottom of the surrounding frame 5, and the cross section of the frame body of the surrounding frame 5 is the same as that of the first welding lug.

In order to enhance the welding effect, the embodiment further provides a pressing block 12, and the pressing block 12 presses the peripheral frame 5 and the chip 10 simultaneously, so that a welding surface has a certain pressure during welding, and welding cavities are avoided.

Therefore, the welding positioning tool provided by the embodiment can realize simultaneous positioning of the surrounding frame 5 and the substrate 7 as well as simultaneous positioning of the chip 10 and the substrate 7, so that eutectic sintering of the chip and welding of the surrounding frame can be simultaneously carried out, and the product quality is ensured.

As shown in fig. 1 to 4, in this embodiment, the substrate 7 is generally rectangular, the chip 10 and the enclosure frame 5 are also rectangular, so that, correspondingly, the positioning slot 2, the first positioning hole 4 and the second positioning hole 9 are all rectangular, and the end corners of the positioning slot 2, the first positioning hole 4 and the second positioning hole 9 are also provided with arc-shaped abdication notches 15.

When the substrate 7 is placed in the positioning groove 2, the surrounding frame 5 is placed in the first positioning hole 4, and the chip 10 is placed in the second positioning hole 9, the substrate can not move, so that positioning is realized.

In order to facilitate taking and placing, a yielding gap 15 is further arranged at the corners of the positioning groove 2, the first positioning hole 4 and the second positioning hole 9, and meanwhile, the yielding gap 15 can be used as an exhaust channel in welding, and a certain amount of waste gas can be generated when the soldering lug melts.

As a further embodiment, as shown in fig. 2 and 3, the positioning slots 2 are plural and are arranged in a plurality of rows and columns on the first positioning plate 1, and the first positioning holes 4 on the second positioning plate 3 are plural and are arranged in a one-to-one correspondence with the positioning slots 2.

In order to realize the welding to multiunit base plate 7, so set up a plurality of constant head tanks 2 and be used for holding a plurality of base plates 7, set up a plurality of first locating holes 4 simultaneously respectively with constant head tank 2 one by one and right, all set up in every first locating hole 4 and enclose frame 5, all set up third locating plate 8 and corresponding chip 10 in every enclosing frame 5, improved welded efficiency like this greatly.

As shown in fig. 4, in the present embodiment, the third positioning plate 8 includes a plate body 16 and a protruding portion 17 connected at a plate edge of the plate body 16, and the protruding portion 17 is used for abutting against an inner wall of the enclosure frame 5.

The third positioning plate 8 in this embodiment includes a plate body 16 and a protruding portion 17, the plate body 16 is provided with a second positioning hole 9 for accommodating the chip 10, and the third positioning plate 8 is disposed in the peripheral frame 5 in such a manner that the protruding portion 17 of the plate edge abuts against the inner wall of the peripheral frame 5, so that positioning of the third positioning plate 8 is also achieved, and thus, material is saved. Specifically, when the third positioning plate 8 is rectangular, the projections 17 are provided at the intermediate positions of the four plate edges of the third positioning plate 8, respectively.

As can be appreciated from fig. 5 and fig. 1, the press block 12 is used for pressing the peripheral frame 5 and the chip 10 at the same time, in order to enable the press block 12 to accurately press the peripheral frame 5 and the chip 10, this embodiment further provides a fourth positioning plate 18 for positioning the press block 12, a third positioning hole 19 is formed in the fourth positioning plate 18, the fourth positioning plate 18 is disposed on the upper side of the second positioning plate 3, and the third positioning hole 19 is aligned with the first positioning hole 4, and the press block 12 is disposed in the third positioning hole 19.

Specifically, the fourth locating plate 18 is located on the upper side of the second locating plate 3, and can be attached to the second locating plate 3 or has a certain distance, at this time, the third locating hole 19 is aligned with the first locating hole 4 and the locating groove 2, and the pressing block 12 is arranged in the third locating hole 19 to achieve locating, and can be aligned with the enclosure frame 5 and the chip 10, so that the enclosure frame 5 and the chip 10 are pressed simultaneously. The third positioning hole 19 may be rectangular, and an arc-shaped yielding gap 15 may be provided at the end corner, so that the yielding gap 15 of the first positioning hole 4 and the positioning groove 2 are matched to be vertically penetrated to play a role of exhausting waste gas.

As shown in fig. 1 and 6, further, since the enclosure frame 5 and the chip 10 are not at the same height, in order to realize simultaneous pressing of the two by the press block 12, the press block 12 includes a block 13 and a pressing protrusion 14 provided at a lower portion of the block 13, the block 13 is used for pressing the enclosure frame 5, and the pressing protrusion 14 is used for pressing the chip 10.

Specifically, the outer contour shape of the block 13 may be set to be matched with the outer contour shape of the surrounding frame 5, when the block 13 is set in the third positioning hole 19, the block is aligned with the surrounding frame 5 to press the surrounding frame 5, and the shapes of the third positioning hole 19 and the first positioning hole 4 may be respectively set to be matched with the outer contour of the pressing block 12 and the outer contour of the surrounding frame 5, so that the surrounding frame 5 is just assembled in the first positioning hole 4, the pressing block 12 is just assembled in the third positioning hole 19, and the outer contour of the pressing block 12 is just aligned with the outer contour of the surrounding frame 5, thereby realizing the positive pressing.

Since the chip 10 is disposed in the enclosure frame 5 and has a low height, the pressing protrusion 14 is disposed on the lower surface of the block 13, and when the block 13 is placed on the enclosure frame 5, the pressing protrusion 14 just extends into the enclosure frame 5, thereby pressing the chip 10.

The present embodiment realizes the simultaneous alignment pressing of the peripheral frame 5 and the chip 10 by the pressing block 12.

It should be noted that the pressing force on the peripheral frame 5 and the chip 10 should not be too large or too small, and the weight of the pressing block 12 may be adjusted to achieve the fit pressing. In particular, structures may be added to the upper surface of the block 13 to add weight or removed to reduce weight.

As shown in fig. 1, in the present embodiment, the first positioning plate 1, the second positioning plate 3 and the fourth positioning plate 18 are sequentially arranged in the vertical direction, the second positioning plate 3 is located between the first positioning plate 1 and the fourth positioning plate 18, and the overlapping positioning is realized between the first positioning plate 1 and the second positioning plate 3 and between the second positioning plate 3 and the fourth positioning plate 18 through positioning pins 20 and slots which are arranged in a plugging manner.

Specifically, in order to realize that the first positioning hole 4 is just aligned with the positioning slot 2 and the third positioning hole 19 is aligned with the first positioning hole 4 when the three are overlapped, a positioning pin 20 and a slot which are mutually inserted are arranged between the positioning plates, so that positioning when the three are overlapped is realized.

Specifically, the positioning pins 20 are arranged on the upper surface of the first positioning plate 1, the slots are arranged on the lower surface of the second positioning plate 3, the positioning pins 20 are inserted into the slots to realize positioning superposition between the first positioning plate 1 and the second positioning plate 3, the positioning pins 20 are arranged on the upper surface of the second positioning plate 3, the slots are arranged on the lower surface of the fourth positioning plate 18, and positioning superposition between the second positioning plate 3 and the fourth positioning plate 18 is realized after the same insertion.

In this embodiment, the first positioning plate 1, the second positioning plate 3, the fourth positioning plate 18 and the third positioning plate 8 form a set of tooling modules, specifically, a plurality of tooling modules can be arranged, and a plurality of tooling modules can be overlapped in the up-down direction.

Specifically, the positioning pin 20 can be further disposed on the upper surface of the fourth positioning plate 18, the slot can be further disposed on the lower surface of the first positioning plate 1, the first positioning plate 1 of the upper module can be stacked on the upper surface of the fourth positioning plate 18 of the lower module, specifically, the positioning stacking is achieved through inserting the positioning pin 20 and the slot.

Therefore, the tool provided by the embodiment can be used in a plurality of simultaneous overlapping modes, a modularized design is formed, and the plurality of tools are stacked and then are simultaneously placed into an atmosphere furnace for heating welding, so that the welding efficiency is improved.

In order to realize automatic operation, clamping grooves 21 are formed in the edges of the first positioning plate 1, the second positioning plate 3 and the fourth positioning plate 18. Clamping grooves 21 may be provided at two opposite edges of the plate body.

The clamping grooves 21 are used with the clamping ends of automatic equipment, such as a manipulator, which can be placed in the clamping grooves 21 at two sides to realize clamping so as to drive the plate body to move and realize automatic assembly and positioning,

in this embodiment, the materials of the first positioning plate 1, the second positioning plate 3, the third positioning plate 8, the fourth positioning plate 18 and the pressing block 12 are all graphite. Graphite has better high temperature resistance and better use effect, and the material of the substrate 7 can be ceramic. Compared with a common PCB substrate, the ceramic substrate can resist extreme temperature, has good dielectric constant and thermal expansion rate, and can adapt to the high-temperature environment of an atmosphere furnace.

The method is characterized in that the chip eutectic welding and the surrounding frame welding belong to one process of packaging products of LTCC/HTCC substrates in the micro-assembly engineering, and the whole process sequentially comprises the steps of cleaning the substrate 7, chip eutectic/surrounding frame welding, resistance-capacitance reflow soldering, welding defect inspection, gold wire bonding, appearance inspection and sealing.

Specifically, the substrate 7 is cleaned: the LTCC/HTCC substrate 7 to be assembled is plasma cleaned.

Chip eutectic/enclosure welding: the substrate 7, the chip 10 and the surrounding frame 5 are positioned by the fixture, a vacuum atmosphere furnace or a box-type atmosphere furnace (without vacuumizing function) is selected, the temperature is set according to the process requirement, and the fixture is placed into a hearth for eutectic welding.

Resistance, capacitance, sense reflow soldering: and (3) adopting Sn63Pb37 solder paste, dispensing solder paste at a set position of a substrate bonding pad by using dispensing equipment, placing resistance, capacitance and inductance at the bonding pad position by using semi-automatic equipment, and welding in a reflow welding machine.

Welding defect inspection: and placing the welded product in X-Ray equipment to check welding defects and cavities.

Gold wire bonding: and (3) carrying out wire bonding (adopting gold wires) on the product with the steps according to the connection positions in the design drawing, and setting the parameters of a bonding machine according to the normal technological parameters.

Appearance inspection: and placing the product under optical inspection equipment, and observing the appearance of the product.

The welding position of the substrate 7 and the chip 10 and the welding position of the substrate 7 and the surrounding frame 5 by using the tool are good, when a vacuum atmosphere furnace is adopted, the cavity rate is less than or equal to 10 percent, when a box-type atmosphere furnace is adopted, the cavity rate is less than or equal to 20 percent, and the welding quality meets the design requirement of products.

When the fixture is used for welding and positioning, two different sintering furnaces are adopted, and the substrate 7, the chip 10 and the surrounding frame 5 can finish welding work in one step and reach the quality standard, so the fixture is universal in applicability; when the vacuum atmosphere furnace is adopted, the welding quality and air tightness of each product meet the design requirements of the product; when the box-type atmosphere furnace is adopted, the welding cavity of the product is bigger but still meets the welding quality requirement, and the air tightness also meets the requirement.

The foregoing description of the preferred embodiments of the present application is not intended to be limiting, but is intended to cover any and all modifications, equivalents, and alternatives falling within the spirit and principles of the present application.

Claims

1. Welding positioning frock, its characterized in that includes:

2. The welding positioning tool according to claim 1, wherein the positioning groove, the first positioning hole and the second positioning hole are rectangular, and arc-shaped yielding notches are further formed at end corners of the positioning groove, the first positioning hole and the second positioning hole.

3. The welding positioning tool according to claim 1, wherein the positioning grooves are multiple and are arranged on the first positioning plate in a mode of multiple rows and multiple columns, and the first positioning holes on the second positioning plate are multiple and are arranged in a one-to-one correspondence with the positioning grooves.

4. The welding positioning tool according to claim 1, wherein the third positioning plate comprises a plate body and a protruding portion connected to a plate edge of the plate body, and the protruding portion is used for abutting against an inner wall of the surrounding frame.

5. The welding positioning tool according to any one of claims 1-4, further comprising a fourth positioning plate, wherein a third positioning hole is formed in the fourth positioning plate, the fourth positioning plate is disposed on the upper side of the second positioning plate, the third positioning hole is aligned with the first positioning hole, and the pressing block is disposed in the third positioning hole.

6. The welding positioning tool according to claim 5, wherein the pressing block comprises a block body and a pressing protrusion arranged at the lower part of the block body, the block body is used for pressing the enclosure frame, and the pressing protrusion is used for pressing the chip.

7. The welding positioning tool according to claim 5, wherein the first positioning plate, the second positioning plate and the fourth positioning plate are sequentially arranged in a vertical direction, and superposition positioning is achieved between the first positioning plate and the second positioning plate and between the second positioning plate and the fourth positioning plate through positioning pins and slots which are arranged in a plugging manner.

8. The welding positioning tool of claim 5, wherein clamping grooves are formed in plate edges of the first positioning plate, the second positioning plate and the fourth positioning plate.

9. The welding positioning tool of claim 5, wherein the first positioning plate, the second positioning plate, the third positioning plate, the fourth positioning plate and the pressing block are all made of graphite.

10. The welding positioning fixture of claim 1 wherein the substrate is ceramic.