CN116252087A - Welding positioning tool - Google Patents

Abstract

The application relates to the technical field of substrate packaging, and particularly provides a welding positioning tool which comprises a first positioning plate, a second positioning plate, a third positioning plate and a pressing block; a positioning groove is formed in the first positioning plate; the second positioning plate is positioned on the upper side of the first positioning plate, the first positioning hole is aligned with the positioning groove, the first positioning hole is used for accommodating and positioning the surrounding frame, and a first welding lug is arranged between the bottom of the surrounding frame and the substrate; the third positioning plate is provided with a second positioning hole, the third positioning plate is used for being assembled in the surrounding frame, the second positioning hole is used for accommodating the chip, and a second soldering lug is further arranged between the chip and the substrate; the briquetting is used for pressing simultaneously and encloses frame and chip. The technical problem that the chip eutectic sintering cannot be performed simultaneously with the substrate surrounding frame welding and influences the reliability of products due to the fact that a tooling capable of positioning the chip and the surrounding frame simultaneously does not exist in the prior art is solved.

Description

Welding positioning tooling

technical field

The present application relates to the technical field of substrate packaging, and more specifically, relates to a welding positioning tool.

Background technique

In recent years, with the continuous development of the electronic information field in the direction of systematization, miniaturization, high integration and high reliability, LTCC/HTCC has played a great role in promoting this development trend. On the one hand, LTCC/HTCC The internal systemization and integration of the product can be greatly improved through the embedded circuit and some functional electronic components (resistors, capacitors, inductors, interconnection lines, etc.); In terms of constant and thermal expansion rate, compared with traditional PCB substrates, the performance of various parameters is better, and the proportion in the field of high value-added and high reliability products has increased year by year. From the perspective of industry development trends, the LTCC/HTCC industry has relatively Great upside.

Packaging products based on LTCC/HTCC substrates, in the micro-assembly project, will involve chip eutectic welding, resistance-capacitance reflow soldering, gold wire bonding, frame welding, capping and other processes, among which chip eutectic welding and Frame welding is two important processes that determine product quality.

Chip eutectic welding and frame welding are two different processes of LTCC/HTCC component products. Chip eutectic welding uses alloy solder with a melting point lower than that of the base metal to heat the LTCC/HTCC substrate, chip welding surface and alloy solder to It is higher than the melting point of the alloy solder and lower than the melting temperature of the base material. The liquid alloy solder is used to wet the base material, fill the interface gap and diffuse with the base material to achieve connection. The size of the welding void will affect the electrical performance and reliability of the product. The principle of the frame welding process is the same as that of the chip eutectic process. The welding object becomes the connection surface between the substrate and the frame. The alloy solder is also used to infiltrate the substrate and the frame to complete the interconnection between the substrate and the frame. Whether the solder is fully infiltrated , has a decisive effect on the airtightness of the product.

In the existing process, since there is no tooling that can position the chip and the frame at the same time, the eutectic sintering of the chip (that is, the eutectic welding of the chip) cannot be carried out simultaneously with the welding of the frame substrate. Before the substrate soldering, the solder is the gold-tin alloy system solder sheet widely used in the industry. The frame substrate is welded after the chip eutectic process, and the product will be reheated to 30° above the melting point of the gold-tin solder sheet during frame welding. ~50°C, which means that the alloy solder formed in the chip eutectic process will melt again, and the solder alloy layer between the chip and the substrate after eutectic sintering will be destroyed, thereby affecting the reliability of the product.

Contents of the invention

The purpose of this application is to provide a welding positioning tool, which aims to solve the problem in the prior art that the eutectic sintering of the chip cannot be performed simultaneously with the welding of the frame substrate due to the absence of a tool that can position the chip and the frame at the same time. The solder alloy layer between the eutectic sintered chip and the substrate will be destroyed during the frame welding, which will affect the reliability of the product.

In order to achieve the above purpose, the technical solution adopted by this application is to provide a welding positioning tool, including:

a first positioning plate, on which a positioning groove for accommodating and positioning the substrate is provided;

The second positioning plate is provided with a first positioning hole on the second positioning plate. The second positioning plate is located on the upper side of the first positioning plate and the first positioning hole is opposite to the positioning slot. The first positioning hole is used for accommodating the surrounding frame so that the surrounding frame is positioned on the substrate, and the first solder piece is also arranged between the bottom of the surrounding frame and the substrate;

A third positioning plate, a second positioning hole is opened on the third positioning plate, and the third positioning plate is used to be assembled in the surrounding frame so that the second positioning hole is aligned with the chip welding position on the substrate, The second positioning hole is used for accommodating a chip, and a second soldering piece is also arranged between the chip and the chip bonding position of the substrate; and

a pressing block, the pressing block is used to simultaneously press the surrounding frame and the chip.

In one of the embodiments, the positioning slot, the first positioning hole, and the second positioning hole are all rectangular in shape, and the ends of the positioning slot, the first positioning hole, and the second positioning hole are There are also arc-shaped relief gaps at the corners.

In one of the embodiments, there are multiple positioning grooves and are arranged in multiple rows and columns on the first positioning plate, and there are multiple first positioning holes on the second positioning plate and are aligned with the first positioning holes. The positioning slots are set in one-to-one correspondence.

In one embodiment, the third positioning plate includes a plate body and a protrusion connected to an edge of the plate body, and the protrusion is used to abut against the inner wall of the surrounding frame.

In one of the embodiments, the welding positioning tool further includes a fourth positioning plate, a third positioning hole is opened on the fourth positioning plate, the fourth positioning plate is arranged on the upper side of the second positioning plate and the The third positioning hole is aligned with the first positioning hole, and the pressing block is arranged in the third positioning hole.

In one embodiment, the pressing block includes a block body and a pressing protrusion disposed at the lower part of the block body, the block body is used to press the surrounding frame, and the pressing protrusion is used to press the chip.

In one of the embodiments, the first positioning plate, the second positioning plate and the fourth positioning plate are arranged in sequence in the vertical direction, between the first positioning plate and the second positioning plate, the second positioning plate The positioning pins and slots provided between the positioning plate and the fourth positioning plate are inserted to realize superposition positioning.

In one of the embodiments, clamping grooves are provided on the edges of the first positioning plate, the second positioning plate and the fourth positioning plate.

In one embodiment, the materials of the first positioning plate, the second positioning plate, the third positioning plate, the fourth positioning plate and the pressing block are graphite.

In one of the embodiments, the substrate is made of ceramics.

The beneficial effect of the welding positioning tooling provided by this application is that the tooling can realize the simultaneous positioning of the frame and the substrate, and the chip and the substrate, so that the eutectic sintering of the chip and the welding of the frame can be carried out at the same time, and the product quality is guaranteed. Specifically, The substrate is first positioned through the positioning groove on the first positioning plate, and then the surrounding frame is put into the first positioning hole. Since the first positioning hole and the positioning groove are aligned with each other, the position of the surrounding frame on the substrate is positioned. The device is also provided with a third positioning plate, which has a second positioning hole, and the third positioning plate is positioned in the surrounding frame, so that the second positioning hole is aligned with the chip welding position on the substrate, and the chip is placed in the second positioning hole At this time, the welding position is automatically aligned, and the surrounding frame and the chip are respectively pressed tightly by pressing blocks. At this time, the tooling is placed in the furnace hearth of the atmosphere furnace, so that the first soldering piece and the second welding piece are melted to realize welding connection.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the accompanying drawings that need to be used in the descriptions of the embodiments or the prior art will be briefly introduced below. Obviously, the accompanying drawings in the following description are only for the present application For some embodiments, those of ordinary skill in the art can also obtain other drawings based on these drawings without creative effort.

Fig. 1 is a schematic diagram of the explosive structure of the welding positioning tool provided by the embodiment of the present application;

Fig. 2 is a schematic structural view of the first positioning plate in Fig. 1;

Fig. 3 is the structural representation of the second positioning plate in Fig. 1;

Fig. 4 is a schematic structural view of the third positioning plate in Fig. 1;

Fig. 5 is a schematic structural view of the fourth positioning plate in Fig. 1;

Fig. 6 is a schematic structural diagram of the compact in Fig. 1 .

In the figure, 1. The first positioning plate; 2. The positioning groove; 3. The second positioning plate; 4. The first positioning hole; Board; 9, second positioning hole; 10, chip; 11, second soldering piece; 12, pressing block; 13, block; 14, pressing protrusion; 15, give way gap; 16, board body; 17, protrusion 18, the fourth positioning plate; 19, the third positioning hole; 20, the positioning pin; 21, the clamping groove.

Detailed ways

In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application.

It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" and "second" may explicitly or implicitly include one or more of these features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined. "Several" means one or more than one, unless otherwise clearly and specifically defined.

“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。In the description of this application, it is to be understood that the terms "centre", "length", "width",

The orientations or positional relationships indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the application and simplifying the description, and It is not to indicate or imply that the device or element referred to must have a particular orientation, be constructed, or operate in a particular orientation, and thus should not be construed as limiting the application.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connection, or integral connection; can be mechanical connection or electrical connection; can be direct connection or indirect connection through an intermediary, and can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

Referring to FIGS. 1-4 and 5 , the present application provides a specific embodiment of a welding positioning tool, including a first positioning plate 1 , a second positioning plate 3 , a third positioning plate 8 , and a pressure block 12 .

A positioning slot 2 for accommodating and positioning the substrate 7 is provided on the first positioning plate 1 .

The second positioning plate 3 is provided with a first positioning hole 4, the second positioning plate 3 is located on the upper side of the first positioning plate 1 and the first positioning hole 4 is opposite to the positioning groove 2, and the first positioning hole 4 is used to accommodate the enclosure. The frame 5 is used to position the surrounding frame 5 on the substrate 7, and the first solder piece 6 is also arranged between the bottom of the surrounding frame 5 and the substrate 7;

The second positioning hole 9 is opened on the third positioning plate 8, and the third positioning plate 8 is used to be assembled in the surrounding frame 5 so that the second positioning hole 9 is aligned with the chip welding position on the substrate 7, and the second positioning hole 9 is used for The chip 10 is accommodated and the chip 10 is also used to arrange the second soldering piece 11 between the chip 10 soldering position of the substrate 7 ; the pressing block 12 is used to press the surrounding frame 5 and the chip 10 at the same time.

Specifically, the welding positioning tool in this embodiment is used in this way. First, the first positioning plate 1 is laid flat, and then the substrate 7 is placed in the positioning groove 2. When the substrate 7 is placed in the positioning groove 2, the substrate The edge of the plate 7 will abut against the groove wall of the positioning groove 2, so that the substrate 7 cannot move, and the positioning of the substrate 7 is realized. Then the second positioning plate 3 is placed on the upper side of the first positioning plate 1. Specifically, it can be arranged for bonding or a certain gap can be maintained. At this time, the first positioning hole 4 and the positioning groove 2 are aligned with each other. Then the surrounding frame 5 is placed in the first positioning hole 4 to realize the positioning of the surrounding frame 5 .

Specifically, it can be arranged that the shape of the positioning groove 2 is adapted to the shape of the base plate 7, and the shape of the first positioning hole 4 is adapted to the outer contour of the surrounding frame 5, so that when the surrounding frame 5 is placed in the first positioning hole 4 At this time, the bottom of the frame 5 is just aligned with the substrate 7 and the edge position of the frame 5 needs to be welded, so that the positioning between the frame 5 and the substrate 7 is realized. Of course, in order to achieve welding, a first soldering piece 6 is provided between the bottom of the surrounding frame 5 and the substrate 7 , and the shape of the first soldering piece 6 is the same as that of the bottom of the surrounding frame 5 .

The positioning between the chip 10 and the substrate 7 is realized in this way, the third positioning plate 8 is used to be placed in the positioned surrounding frame 5, and the third positioning plate 8 is also realized when the third positioning plate 8 is placed in the surrounding frame 5 The positioning of the board 8, and at this time the second positioning hole 9 on the third positioning board 8 is just aligned with the welding position on the substrate 7 that needs to be welded with the chip 10, and then the chip 10 is placed in the second positioning hole 9 to realize chip 10 and the substrate 7 , and the second solder pad 11 is provided between the chip 10 and the substrate 7 to realize the welding of the chip 10 and the substrate 7 .

After positioning between the surrounding frame 5 and the substrate 7 and between the chip 10 and the substrate 7, the tooling is placed in the atmosphere furnace, and the temperature of the atmosphere furnace is set to melt the first welding piece 6 and the second welding piece 11 to realize welding connect. Chip eutectic sintering, also known as chip eutectic welding, is placed in an atmosphere furnace for heating just like enclosing frame welding, so as to realize the melting of the first solder piece 6 and the second solder piece 11 so that the chip and the substrate, the surrounding The frame is connected to the substrate. The first solder piece 6 has the same frame cross-sectional shape as the surrounding frame 5 and is arranged on the bottom of the surrounding frame 5 .

In order to strengthen the welding effect, the present embodiment is also provided with a pressing block 12, which presses the surrounding frame 5 and the chip 10 at the same time, so that the welding surface has a certain pressure during welding and avoids welding voids.

Therefore, the welding positioning tool provided in this embodiment can realize the simultaneous positioning of the surrounding frame 5 and the substrate 7, and the chip 10 and the substrate 7, so that the eutectic sintering of the chip and the surrounding frame welding can be performed simultaneously, thereby ensuring product quality.

As shown in Figures 1 to 4, in this embodiment, the general substrate 7 is rectangular, and the chip 10 and the surrounding frame 5 are also rectangular, so the positioning groove 2, the first positioning hole 4, and the second positioning hole 9 are correspondingly They are all rectangular in shape, and arc-shaped relief notches 15 are also provided at the end corners of the positioning groove 2 , the first positioning hole 4 and the second positioning hole 9 .

When the substrate 7 is placed in the positioning groove 2 , the surrounding frame 5 is placed in the first positioning hole 4 , and the chip 10 is placed in the second positioning hole 9 , none of them can move to realize positioning.

For the convenience of taking and placing, there is also a relief notch 15 at the end corners of the positioning groove 2, the first positioning hole 4 and the second positioning hole 9, and the relief notch 15 can also be used as an exhaust passage during welding, because A certain amount of exhaust gas is produced when the solder tab melts.

As shown in Fig. 2 and Fig. 3, as a further embodiment, there are multiple positioning grooves 2 and are arranged in multiple rows and columns on the first positioning plate 1, and the first positioning holes 4 on the second positioning plate 3 are multiple and set in one-to-one correspondence with the positioning groove 2.

In order to realize the welding of multiple groups of substrates 7, a plurality of positioning grooves 2 are provided to accommodate a plurality of substrates 7, and a plurality of first positioning holes 4 are respectively aligned with the positioning grooves 2 one by one, and each first positioning hole 4 are provided with surrounding frames 5, and the third positioning plate 8 and the corresponding chip 10 are arranged in each surrounding frame 5, which greatly improves the efficiency of welding.

As shown in FIG. 4 , in this embodiment, the third positioning plate 8 includes a plate body 16 and a protruding portion 17 connected to the edge of the plate body 16 , and the protruding portion 17 is used to abut against the inner wall of the surrounding frame 5 .

The third positioning plate 8 in this embodiment includes a plate body 16 and a protruding portion 17. The second positioning hole 9 is opened on the plate body 16 for accommodating the chip 10, and the setting of the third positioning plate 8 in the surrounding frame 5 The form is that the protruding part 17 of the plate edge abuts against the inner wall of the surrounding frame 5, and the positioning of the third positioning plate 8 is also realized, which saves materials. Specifically, when the third positioning plate 8 is rectangular, the protrusions 17 are respectively arranged at the middle positions of the four sides of the third positioning plate 8 .

As shown in FIG. 5 and FIG. 1, it can be understood that the function of the pressing block 12 is to simultaneously press the surrounding frame 5 and the chip 10. In order to enable the pressing block 12 to accurately press the surrounding frame 5 and the chip 10, the present embodiment A fourth positioning plate 18 for positioning the briquetting block 12 is also provided, the third positioning hole 19 is offered on the fourth positioning plate 18, the fourth positioning plate 18 is located on the upper side of the second positioning plate 3 and the third positioning hole 19 is aligned with the first positioning hole 4 , and the pressing block 12 is arranged in the third positioning hole 19 .

Specifically, the fourth positioning plate 18 is located on the upper side of the second positioning plate 3, and can be attached to the second positioning plate 3 or have a certain distance. At this time, the third positioning hole 19 is connected to the first positioning hole 4 and the positioning groove 2 Alignment, the pressing block 12 is arranged in the third positioning hole 19 to achieve positioning, and can be aligned with the surrounding frame 5 and the chip 10, so as to press both of them at the same time. The third positioning hole 19 can also be rectangular, and an arc-shaped relief notch 15 can also be provided at the end corner, and cooperate with the positioning groove 2 and the relief notch 15 of the first positioning hole 4 to penetrate up and down to play the role of exhaust gas.

As shown in Fig. 1 and Fig. 6, further, since the surrounding frame 5 and the chip 10 are not at the same height, in order to realize the simultaneous pressing of the two by the pressing block 12, the pressing block 12 includes a block body 13 and a pressing block arranged at the bottom of the block body 13 The protrusion 14 and the block body 13 are used to press the surrounding frame 5 , and the pressing protrusion 14 is used to press the chip 10 .

Specifically, the outer contour shape of the block body 13 can be set to be adapted to the outer contour shape of the surrounding frame 5, and when the block body 13 is arranged in the third positioning hole 19, it is aligned with the surrounding frame 5 to align the surrounding frame 5 to press, and the shapes of the third positioning hole 19 and the first positioning hole 4 can be respectively set to a shape suitable for the outer contour of the pressing block 12 and the outer contour of the surrounding frame 5, so that the surrounding frame 5 is just assembled in the first positioning position. In the hole 4, the pressing block 12 is just assembled in the third positioning hole 19, and the outer contour of the pressing block 12 is just aligned with the outer contour of the surrounding frame 5, so as to realize alignment and pressing.

Because the chip 10 is arranged in the surrounding frame 5, and the height is relatively low, so the lower surface of the block body 13 is provided with a pressing protrusion 14, when the block body 13 is placed on the surrounding frame 5, the pressing protrusion 14 just stretches into the In the surrounding frame 5, the chip 10 is pressed.

Therefore, in this embodiment, the simultaneous alignment and pressing of the pressing block 12 on the surrounding frame 5 and the chip 10 is realized.

It should be noted that the pressing force on the surrounding frame 5 and the chip 10 should not be too large or too small, and the weight of the pressing block 12 can be adjusted to achieve adaptive pressing. Specifically, structures can be added to the upper surface of the block 13 to increase the weight or removed to reduce the weight.

As shown in Fig. 1, in this embodiment, the first positioning plate 1, the second positioning plate 3 and the fourth positioning plate 18 are arranged in sequence in the vertical direction, and the second positioning plate 3 is located between the first positioning plate 1 and the fourth positioning plate. Between the positioning plates 18 , between the first positioning plate 1 and the second positioning plate 3 , and between the second positioning plate 3 and the fourth positioning plate 18 , the positioning pins 20 and slots provided by plugging are all used to realize superposition positioning.

Specifically, in order to realize that the first positioning hole 4 is just aligned with the positioning groove 2 and the third positioning hole 19 is aligned with the first positioning hole 4 when the three are stacked and arranged, mutual insertion is provided between the positioning plates. The positioning pin 20 and the slot are used to realize the positioning when the three are superimposed.

Concretely can be arranged like this, setting pin 20 is set on the upper surface of the first positioning plate 1, slot is set on the lower surface of the second positioning plate 3, and positioning pin 20 is inserted into the slot to realize the connection between the first positioning plate 1 and the second positioning plate 3. For positioning and superposition between the second positioning plate 3, positioning pins 20 are set on the upper surface of the second positioning plate 3, and slots are provided on the lower surface of the fourth positioning plate 18. After the same insertion, the positioning and superposition of the second positioning plate 3 and the fourth positioning plate 18 are realized.

In this embodiment, the first positioning plate 1, the second positioning plate 3, the fourth positioning plate 18 and the third positioning plate 8 form a set of tooling modules. The settings can be superimposed in the up and down direction.

Specifically, it can be arranged in such a way that positioning pins 20 can also be set on the upper surface of the fourth positioning plate 18, slots can also be set on the lower surface of the first positioning plate 1, and the first positioning plate 1 of the upper side module can be superimposed on the lower side. The upper surface of the fourth positioning plate 18 of the module is specifically inserted into the slot through the positioning pin 20 to realize positioning and stacking.

Therefore, multiple tooling provided in this embodiment can be stacked and used at the same time, forming a modular design. After multiple tooling is stacked, they are put into the atmosphere furnace at the same time for heating and welding, and the welding efficiency is improved.

In order to realize automatic operation, clamping grooves 21 are provided at the edges of the first positioning plate 1 , the second positioning plate 3 and the fourth positioning plate 18 . Clamping grooves 21 may be provided at two opposite edges of the board body.

The clamping groove 21 is used in conjunction with the clamping end of automatic equipment, such as a manipulator, which can be placed in the clamping groove 21 on both sides to achieve clamping, so as to drive the board to move and realize automatic assembly and positioning.

In this embodiment, the materials of the first positioning plate 1 , the second positioning plate 3 , the third positioning plate 8 , the fourth positioning plate 18 and the pressing block 12 are all graphite. Graphite has better high temperature resistance, and the use effect is better, and the material of the substrate 7 can be ceramics. Compared with ordinary PCB substrates, ceramic substrates are more resistant to extreme temperatures, have better dielectric constants and thermal expansion rates, and can adapt to the high-temperature environment of atmosphere furnaces.

It should be noted that chip eutectic soldering and frame soldering belong to a process in the micro-assembly project of LTCC/HTCC substrate packaging products. The whole process includes substrate 7 cleaning, chip eutectic/frame soldering, and resistance-capacitance sense reflow. Welding, Welding Defect Inspection, Gold Wire Bonding, Appearance Inspection, Capping.

Specifically, cleaning the substrate 7: performing plasma cleaning on the LTCC/HTCC substrate 7 to be assembled.

Chip eutectic/frame welding: use this tool to position the substrate 7, chip 10 and frame 5 and select a vacuum atmosphere furnace or a box-type atmosphere furnace (without vacuum function), set the temperature according to the process requirements, and place the tool Put into the furnace for eutectic welding.

Resistance, capacitance, and sense reflow soldering: use Sn63Pb37 solder paste, use dispensing equipment to apply solder paste on the specified position of the substrate pad, use semi-automatic equipment to place resistance, capacitance, and sense on the pad position, and place it in the reflow soldering machine for welding .

Welding defect inspection: place the welded product in the X-Ray device to check welding defects and voids.

Gold wire bonding: The products that have completed the above steps are wire bonded (using gold wire) according to the connection position in the design drawing, and the parameters of the bonding machine are set according to the normal process parameters.

Appearance inspection: Place the product under the optical inspection equipment to observe the appearance of the product.

The welding position between the substrate 7 and the chip 10 and the welding position between the substrate 7 and the frame 5 performed by this tooling are in good condition. When a vacuum atmosphere furnace is used, the void rate is ≤10%. When a box-type atmosphere furnace is used, the void rate is ≤20%. %, the welding quality meets the product design requirements.

Therefore, when using this tool for welding positioning, two different sintering furnaces are used, and the substrate 7, chip 10, and frame 5 can all complete the welding work in one step and the quality is up to standard, so this tool is universal in applicability; When a vacuum atmosphere furnace is used, the welding quality and airtightness of the product meet the product design requirements; when a box-type atmosphere furnace is used, although the welding cavity of the product is too large, it still meets the welding quality requirements, and the airtightness also meets the requirements.

The above descriptions are only preferred embodiments of the application, and are not intended to limit the application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the application should be included in the protection of the application. within range.

Claims (10)

1. Welding positioning frock, its characterized in that includes:

the first positioning plate is provided with a positioning groove for accommodating and positioning the substrate;

the second positioning plate is provided with a first positioning hole, the second positioning plate is positioned on the upper side of the first positioning plate, the first positioning hole is aligned to the positioning groove, the first positioning hole is used for accommodating the surrounding frame so as to position the surrounding frame on the substrate, and a first welding sheet is further arranged between the bottom of the surrounding frame and the substrate;

the third positioning plate is provided with a second positioning hole, the third positioning plate is used for being assembled in the surrounding frame so that the second positioning hole is aligned to a chip welding position on the substrate, the second positioning hole is used for accommodating a chip, and a second welding lug is arranged between the chip and the chip welding position of the substrate; and

and the pressing block is used for simultaneously pressing the surrounding frame and the chip.

2. The welding positioning tool according to claim 1, wherein the positioning groove, the first positioning hole and the second positioning hole are rectangular, and arc-shaped yielding notches are further formed at end corners of the positioning groove, the first positioning hole and the second positioning hole.

3. The welding positioning tool according to claim 1, wherein the positioning grooves are multiple and are arranged on the first positioning plate in a mode of multiple rows and multiple columns, and the first positioning holes on the second positioning plate are multiple and are arranged in a one-to-one correspondence with the positioning grooves.

4. The welding positioning tool according to claim 1, wherein the third positioning plate comprises a plate body and a protruding portion connected to a plate edge of the plate body, and the protruding portion is used for abutting against an inner wall of the surrounding frame.

5. The welding positioning tool according to any one of claims 1-4, further comprising a fourth positioning plate, wherein a third positioning hole is formed in the fourth positioning plate, the fourth positioning plate is disposed on the upper side of the second positioning plate, the third positioning hole is aligned with the first positioning hole, and the pressing block is disposed in the third positioning hole.

6. The welding positioning tool according to claim 5, wherein the pressing block comprises a block body and a pressing protrusion arranged at the lower part of the block body, the block body is used for pressing the enclosure frame, and the pressing protrusion is used for pressing the chip.

7. The welding positioning tool according to claim 5, wherein the first positioning plate, the second positioning plate and the fourth positioning plate are sequentially arranged in a vertical direction, and superposition positioning is achieved between the first positioning plate and the second positioning plate and between the second positioning plate and the fourth positioning plate through positioning pins and slots which are arranged in a plugging manner.

8. The welding positioning tool of claim 5, wherein clamping grooves are formed in plate edges of the first positioning plate, the second positioning plate and the fourth positioning plate.

9. The welding positioning tool of claim 5, wherein the first positioning plate, the second positioning plate, the third positioning plate, the fourth positioning plate and the pressing block are all made of graphite.

10. The welding positioning fixture of claim 1 wherein the substrate is ceramic.

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