CN216264706U

CN216264706U - Anti-deformation thin-wall part processing jig for semiconductor packaging equipment

Info

Publication number: CN216264706U
Application number: CN202122826986.6U
Authority: CN
Inventors: 张志科; 徐志丹; 曹天伟
Original assignee: Suzhou Jinzhihong Precision Machinery Co ltd
Current assignee: Suzhou Jinzhihong Precision Machinery Co ltd
Priority date: 2021-11-18
Filing date: 2021-11-18
Publication date: 2022-04-12
Anticipated expiration: 2031-11-18

Abstract

The utility model discloses an anti-deformation thin-wall part processing jig for semiconductor packaging equipment, which belongs to the technical field of semiconductor thin-wall parts, and is characterized in that due to the fact that the rigidity of the thin-wall part is insufficient, the workpiece is easy to deform in the processing process, and the surface quality and the dimensional precision are influenced; the device comprises an operation table, wherein a plurality of first supporting rods are fixedly arranged on the upper surface of the operation table, a fixing plate is fixedly arranged at the upper ends of the first supporting rods, and a second supporting rod is fixedly arranged on the upper surface of the operation table; one side of the semiconductor thin-wall part is attached to the moving column on the fixing block, the limiting frame is pushed to move through the air cylinder, the limiting frame moves along the moving groove through the connecting block at the lower end, the two ends of the limiting frame move along the limiting groove, the moving blocks on the two sides move, the moving block moves along the moving groove through the connecting block at the lower end, the moving columns on the limiting frame and the moving block move synchronously, the periphery of the semiconductor thin-wall part is fixed, and the moving columns are buffered through the springs.

Description

Anti-deformation thin-wall part processing jig for semiconductor packaging equipment

Technical Field

The utility model relates to the technical field of semiconductor thin-wall parts, in particular to a deformation-preventing thin-wall part processing jig for semiconductor packaging equipment.

Background

Semiconductors are used in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power conversion, etc., for example, diodes are devices made of semiconductors, and the importance of semiconductors is enormous from the viewpoint of technology or economic development. Most electronic products, such as computers, mobile phones or digital recorders, have core units closely related to semiconductors;

because the rigidity of the thin-wall part is insufficient, the workpiece is easy to deform in the machining process, and the surface quality and the dimensional precision are affected, so that the thin-wall part machining jig for the anti-deformation semiconductor packaging equipment is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a deformation-preventing thin-wall part processing jig for semiconductor packaging equipment, which is used for solving the problems in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme: the utility model provides a thin wall spare processing tool of semiconductor package equipment of preapring for an unfavorable turn of events shape, includes the operation panel, fixed surface is equipped with a plurality of first bracing pieces on the operation panel, the fixed plate that is equipped with in first bracing piece upper end, fixed surface is equipped with the second bracing piece on the operation panel, the fixed backup pad that is equipped with in second bracing piece upper end, backup pad one end is connected with the fixed plate, the spread groove has been seted up on the fixed plate, the spread groove is located fixed plate central point and puts, be equipped with fixture on the fixed plate.

As a preferred technical scheme of the present invention, the clamping mechanism includes a fixed block, a lower surface of the fixed block is fixedly connected to an upper surface of a fixed plate, a pair of moving blocks is slidably disposed on the fixed plate, a moving plate is slidably disposed on the fixed plate, a limiting frame is fixedly disposed on an upper surface of the moving plate, a limiting groove is disposed on an upper surface of the moving block, and two ends of the limiting frame are slidably connected to an inner wall of the limiting groove.

As a preferred technical scheme of the present invention, the fixed block, the moving block and the limiting frame are all fixedly provided with a fixed column, the fixed column is slidably provided with a moving column, one end of the moving column located in the fixed column is fixedly provided with a spring, and one end of the spring is connected with the inner wall of the fixed column.

As a preferable technical solution of the present invention, the upper surface of the fixed plate is provided with a plurality of moving grooves, the moving grooves are slidably provided with connecting blocks, the upper surface of each connecting block is connected to the moving block, and the upper surface of the other connecting block is connected to the moving plate.

According to a preferable technical scheme of the utility model, a rectangular block is fixedly arranged on the upper surface of the fixing plate, an air cylinder is fixedly arranged on one side of the rectangular block, a fixing frame is fixedly arranged at the output end of the air cylinder, and one end of the fixing frame is fixedly connected with a limiting frame.

According to a preferable technical scheme of the utility model, a supporting block is fixedly arranged on the upper surface of the fixing plate, an even lifting groove is formed in the supporting block, a screw rod is rotationally arranged in the lifting groove, a moving rod is slidably arranged in the lifting groove and is in threaded connection with the screw rod, a rubber block is fixedly arranged at the upper end of the moving rod, and a rotating ring is fixedly arranged at the lower end of the screw rod.

In a preferred embodiment of the present invention, a circular rod is fixedly disposed on an upper side of the rotating ring, an upper end of the circular rod passes through the support block, and an upper end of the circular rod is fixedly connected to the screw.

As a preferred technical scheme of the utility model, the fixed block, the moving block and the moving plate are positioned at different positions of the fixed plate, and the limiting frame is in a trapezoidal shape.

Compared with the prior art, the utility model has the beneficial effects that:

1. one side of the semiconductor thin-wall part is attached to a moving column on a fixed block, a limiting frame is pushed to move through a cylinder, the limiting frame moves along a moving groove through a connecting block at the lower end, the two ends of the limiting frame move along the limiting groove, so that the moving blocks at the two sides move, a moving block moves along the moving groove through the connecting block at the lower end, the limiting frame and the moving block move synchronously, the periphery of the semiconductor thin-wall part is fixed, and the moving column is buffered through a spring;

2. the screw rod is driven to rotate by rotating the rotating ring, and the screw rod drives the moving rod to ascend along the lifting groove, so that the rubber block is in contact with the bottom of the semiconductor thin-wall part, and deformation caused during machining is avoided.

Drawings

FIG. 1 is a schematic structural view of the present invention,

FIG. 2 is a schematic view of the structure of the clamping mechanism of the present invention,

FIG. 3 is a schematic view of the support block structure of the present invention.

In the figure: 1. an operation table; 11. a first support bar; 12. a fixing plate; 13. a second support bar; 14. a support plate; 15. connecting grooves; 2. a clamping mechanism; 21. a fixed block; 22. a moving block; 23. moving the plate; 24. a limiting frame; 25. a limiting groove; 3. fixing a column; 31. moving the column; 32. a spring; 4. a moving groove; 41. connecting blocks; 5. a rectangular block; 51. a cylinder; 52. a fixed mount; 6. a support block; 61. a lifting groove; 62. a screw; 63. a travel bar; 64. a rubber block; 65. the ring is rotated.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b): as shown in fig. 1-3, the present invention provides an anti-deformation thin-wall part processing jig for semiconductor packaging equipment, which comprises an operation table 1, wherein a plurality of first support rods 11 are fixedly arranged on the upper surface of the operation table 1, a fixed plate 12 is fixedly arranged at the upper ends of the first support rods 11, a second support rod 13 is fixedly arranged on the upper surface of the operation table 1, a support plate 14 is fixedly arranged at the upper end of the second support rod 13, one end of the support plate 14 is connected with the fixed plate 12, a connection groove 15 is arranged on the fixed plate 12, the connection groove 15 is located at the central position of the fixed plate 12, a clamping mechanism 2 is arranged on the fixed plate 12, two pairs of the first support rods 11 are arranged to support the fixed plate 12, the second support rod 13 is used to support the support plate 14, the connection groove 15 is rectangular, a semiconductor thin-wall part is placed above the connection groove 15, and is fixed by the clamping mechanism 2.

The clamping mechanism 2 comprises a fixed block 21, the lower surface of the fixed block 21 is fixedly connected with the upper surface of a fixed plate 12, a pair of moving blocks 22 are arranged on the fixed plate 12 in a sliding manner, a moving plate 23 is arranged on the fixed plate 12 in a sliding manner, a limiting frame 24 is fixedly arranged on the upper surface of the moving plate 23, a limiting groove 25 is formed in the upper surface of the moving block 22, two ends of the limiting frame 24 are connected with the inner wall of the limiting groove 25 in a sliding manner, the fixed block 21, the moving block 22 and the moving plate 23 are positioned at different positions of the fixed plate 12, the limiting frame 24 is in a trapezoidal shape, fixed columns 3 are fixedly arranged on the fixed block 21, the moving block 22 and the limiting frame 24, moving columns 31 are arranged in the fixed columns 3 in a sliding manner, springs 32 are fixedly arranged at one ends of the moving columns 31 in the fixed columns 3, one ends of the springs 32 are connected with the inner wall of the fixed columns 3, a plurality of moving grooves 4 are arranged on the upper surface of the fixed plate 12, connecting blocks 41 are arranged in the moving grooves 4 in a sliding manner, and the upper surfaces of the connecting blocks 22 are connected with the moving blocks 22, the upper surface of the other connecting block 41 is connected with the moving plate 23, the upper surface of the fixed plate 12 is fixedly provided with a rectangular block 5, one side of the rectangular block 5 is fixedly provided with an air cylinder 51, the output end of the air cylinder 51 is fixedly provided with a fixed frame 52, one end of the fixed frame 52 is fixedly connected with a limiting frame 24, one side of the semiconductor thin-wall part is jointed with the moving column 31 on the fixed block 21, the air cylinder 51 pushes the limiting frame 24 to move, the limiting frame 24 moves along the moving groove 4 through the connecting block 41 at the lower end, the two ends of the limiting frame 24 move along the limiting grooves 25, thereby moving the moving blocks 22 at the two sides, moving the moving blocks 22 along the moving grooves 4 through the connecting blocks 41 at the lower ends, enabling the limiting frames 24 and the moving columns 31 on the moving blocks 22 to move synchronously, fixing the periphery of the semiconductor thin-wall part, the moving column 31 is buffered by the spring 32, and the semiconductor thin-wall part is prevented from being extruded and deformed.

The fixed plate 12 upper surface is fixed and is equipped with supporting shoe 6, set up even lift groove 61 on the supporting shoe 6, the internal rotation of lift groove 61 is equipped with screw rod 62, the internal sliding of lift groove 61 is equipped with carriage release lever 63, carriage release lever 63 and screw rod 62 threaded connection, carriage release lever 63 upper end is fixed and is equipped with rubber block 64, the fixed rotatory ring 65 that is equipped with of screw rod 62 lower extreme, the fixed circular rod that is equipped with of rotatory ring 65 upside, supporting shoe 6 is passed to the circular rod upper end, circular rod upper end and screw rod 62 fixed connection, after the semiconductor thin wall spare is fixed, through rotating rotatory ring 65, drive screw rod 62 and rotate, screw rod 62 drives carriage release lever 63 and rises along lift groove 61, make rubber block 64 and semiconductor thin wall spare bottom contact, avoid causing the deformation during processing.

The working principle is as follows: firstly, one side of a semiconductor thin-wall part is attached to a moving column 31 on a fixed block 21, a limiting frame 24 is pushed to move through an air cylinder 51, the limiting frame 24 moves along a moving groove 4 through a connecting block 41 at the lower end, two ends of the limiting frame 24 move along a limiting groove 25, moving blocks 22 at two sides move, the moving blocks 22 move along the moving groove 4 through the connecting block 41 at the lower end, the limiting frame 24 and the moving columns 31 on the moving blocks 22 move synchronously, the periphery of the semiconductor thin-wall part is fixed, the moving column 31 is buffered through a spring 32, then a screw 62 is driven to rotate through rotating a rotating ring 65, the screw 62 drives a moving rod 63 to ascend along a lifting groove 61, a rubber block 64 is made to contact with the bottom of the semiconductor thin-wall part, and deformation caused during processing is avoided.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a thin wall spare processing tool of semiconductor package equipment of preapring for an unfavorable turn of events shape, includes operation panel (1), its characterized in that: fixed surface is equipped with a plurality of first bracing pieces (11) on operation panel (1), fixed plate (12) that is equipped with in first bracing piece (11) upper end, fixed surface is equipped with second bracing piece (13) on operation panel (1), fixed backup pad (14) that is equipped with in second bracing piece (13) upper end, backup pad (14) one end is connected with fixed plate (12), spread groove (15) have been seted up on fixed plate (12), spread groove (15) are located fixed plate (12) central point and put, be equipped with fixture (2) on fixed plate (12).

2. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 1, is characterized in that: the clamping mechanism (2) comprises a fixing block (21), the lower surface of the fixing block (21) is fixedly connected with the upper surface of a fixing plate (12), a pair of moving blocks (22) is arranged on the fixing plate (12) in a sliding mode, a moving plate (23) is arranged on the fixing plate (12) in a sliding mode, a limiting frame (24) is fixedly arranged on the upper surface of the moving plate (23), a limiting groove (25) is formed in the upper surface of the moving block (22), and two ends of the limiting frame (24) are connected with the inner wall of the limiting groove (25) in a sliding mode.

3. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 2, is characterized in that: fixed columns (3) are fixedly arranged on the fixed block (21), the moving block (22) and the limiting frame (24), moving columns (31) are arranged in the fixed columns (3) in a sliding mode, springs (32) are fixedly arranged at one ends, located in the fixed columns (3), of the moving columns (31), and one ends of the springs (32) are connected with the inner walls of the fixed columns (3).

4. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 1, is characterized in that: the upper surface of the fixed plate (12) is provided with a plurality of moving grooves (4), connecting blocks (41) are arranged in the moving grooves (4) in a sliding mode, the upper surfaces of the connecting blocks (41) are connected with moving blocks (22), and the upper surface of the other connecting block (41) is connected with a moving plate (23).

5. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 1, is characterized in that: fixed surface is equipped with rectangular block (5) on fixed plate (12), rectangular block (5) one side is fixed and is equipped with cylinder (51), cylinder (51) output end is fixed and is equipped with mount (52), mount (52) one end and spacing (24) fixed connection.

6. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 1, is characterized in that: the fixed plate is characterized in that a supporting block (6) is fixedly arranged on the upper surface of the fixed plate (12), a lifting groove (61) is formed in the supporting block (6), a screw rod (62) is arranged in the lifting groove (61) in a rotating mode, a moving rod (63) is arranged in the lifting groove (61) in a sliding mode, the moving rod (63) is in threaded connection with the screw rod (62), a rubber block (64) is fixedly arranged at the upper end of the moving rod (63), and a rotating ring (65) is fixedly arranged at the lower end of the screw rod (62).

7. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 6, is characterized in that: the upper side of the rotating ring (65) is fixedly provided with a circular rod, the upper end of the circular rod penetrates through the supporting block (6), and the upper end of the circular rod is fixedly connected with the screw rod (62).

8. The thin-wall part processing jig for the anti-deformation semiconductor packaging equipment, according to claim 2, is characterized in that: the fixed block (21), the moving block (22) and the moving plate (23) are located at different positions of the fixed plate (12), and the limiting frame (24) is in a trapezoidal shape.