CN209747454U - Flattening machine table for semiconductor packaging - Google Patents

Abstract

The utility model discloses a board that flattens for semiconductor package mainly relates to the semiconductor production field. The base is provided with a bearing table, the bearing table is provided with a base plate and a mold block, the base plate is as high as the mold block, the base plate is provided with solder balls, the bilateral symmetry of the base is provided with support columns, the support columns are provided with fixing plates, the bottom of the fixing plates is provided with a lifting table, the bottom of the lifting table is provided with a pressing plate, the bottom of the pressing plate is provided with a limiting block, and the limiting block is located right above the mold block. The beneficial effects of the utility model reside in that: the flattening device can effectively protect the integrity of the substrate when the solder balls are flattened, and improves the safety of the flattening device.

Description

Flattening machine table for semiconductor packaging

Technical Field

The utility model relates to a semiconductor production field specifically is a board that flattens for semiconductor package.

Background

The semiconductor generally uses the production technology by the face down chip joint now, the efficiency and the precision of semiconductor production have been improved greatly, in the production of semiconductor, need flatten the operation to its upper tin ball, in order to guarantee the requirement of production technology to circuit interval between the chip board, but current flattening device has the error on the suppression mode, also have to this improved device that proposes, but this kind of improved device can directly contact the base plate of high stop device with the chip, cause the damage to the base plate very easily like this, improper messenger probably is whole base plate crushing at the accuracy control, consequently need a flattening device, effectual protection base plate's safety when can improving the tin ball precision of flattening.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a board that flattens for semiconductor package, it can flatten effectual protection base plate's when operating the tin ball the completion, improves flattening device's security.

The utility model discloses a realize above-mentioned purpose, realize through following technical scheme:

The utility model provides a board flattens for semiconductor package, includes the base, be equipped with the plummer on the base, be equipped with base plate, mould piece on the plummer, the base plate is the same with the height of mould piece, be equipped with the tin ball on the base plate, the bilateral symmetry of base be equipped with the support column, be equipped with the fixed plate on the support column, the bottom of fixed plate is equipped with the elevating platform, the bottom of elevating platform is equipped with the pressure flat board, the bottom of pressure flat board is equipped with the stopper, the stopper is located the mould piece directly over.

Furthermore, the bottom of the pressing plate is provided with a fixed protection seat, the fixed protection seats are symmetrically arranged above two sides of the base plate, each fixed protection seat comprises a fixed block, a movable block, a sliding groove and a buffer spring, the fixed block is arranged at the bottom of the pressing plate, the sliding grooves are vertically arranged on the fixed block, the movable blocks are connected to the sliding grooves in a sliding mode, and the buffer springs are arranged between the movable blocks and the pressing plate.

Furthermore, a rubber pad is arranged at the bottom of the moving block.

Furthermore, be equipped with first recess, second recess on the plummer, the base plate is located first recess, the mould piece is located the second recess, sliding connection has the tight piece of clamp in the second recess, it is equipped with compression spring to press from both sides between the one end of tight piece and second recess.

Furthermore, the pressing plate is a stainless steel component, the top of the limiting block is provided with a magnetic block, and the limiting block is attracted to the bottom of the pressing plate through the magnetic block.

Contrast prior art, the beneficial effects of the utility model reside in that:

the utility model discloses set up the mould piece the same with the base plate height on the plummer, set up the stopper in the bottom of flattening board and the position that the mould piece corresponds, the height of stopper both is the height of the tin ball that needs to flatten, when flattening the operation, the stopper descends gradually, when stopper and mould piece contact, the distance between base plate and the flattening board bottom is the height of the tin ball that finally need flatten promptly, and this height is the same with the height of stopper, and the height that highly can control through the control stopper flattens, but the flattening board does not contact with the base plate, the effectual safety of protecting the base plate, guarantees to produce off-the-shelf yields, has reduced the destruction to raw and other materials.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic structural view of the fixing and protecting seat of the present invention.

fig. 3 is a top view of the carrier table of the present invention.

Fig. 4 is a partially enlarged view of a portion a of fig. 1 according to the present invention.

Reference numerals shown in the drawings:

1. A base; 2. a bearing table; 3. a substrate; 4. a mold block; 5. tin balls; 6. a support pillar; 7. a fixing plate; 8. a lifting platform; 9. pressing a flat plate; 10. a limiting block; 11. a fixed block; 12. a moving block; 13. a chute; 14. a buffer spring; 15. a first groove; 16. a second groove; 17. a clamping block; 18. compressing the spring.

Detailed Description

The present invention will be further described with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Furthermore, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teachings of the present invention, and these equivalents also fall within the scope defined in the present application.

The utility model relates to a flattening machine platform for semiconductor packaging, the main structure comprises a base 1, the base 1 is fixed on the ground through bolts, the base 1 is provided with a bearing platform 2, the bearing platform 2 is fixed on the top of the base 1 through welding or bolts, the bearing platform 2 is provided with a base plate 3 and a mould block 4, the base plate 3 is a carrier for semiconductor circuits and the like, the height of the base plate 3 is the same as that of the mould block 4, the height and the size of the base plate 3 which is generally used have certain standards, therefore, the mould block 4 with the same height can be manufactured for standby, the base plate 3 is provided with a tin ball 5, the tin ball 5 is the existing mediator for semiconductor circuit connection in the market, the bilateral symmetry of the base 1 is provided with support columns 6, the support columns 6 are fixed on the two sides of the base 1 through welding or bolts, the fixing device is characterized in that fixing plates 7 are arranged on the supporting columns 6, the fixing plates 7 are fixed on the two supporting columns 6 through bolts, a lifting platform 8 is arranged at the bottom of the fixing plates 7, the lifting platform 8 can be a hydraulic lifter or an electric lifter, the main body of the lifting platform is downwards fixed on the fixing plates 7, a pressing plate 9 is arranged at the bottom of the lifting platform 8, the pressing plate 9 is welded and fixed on the moving end of the lifting platform 8, a limiting block 10 is arranged at the bottom of the pressing plate 9, the limiting block 10 is positioned right above the mold block 4, when the lifting platform 8 is operated to downwards move for flattening operation, the pressing plate 9 gradually contacts the solder balls 5 and flattens the solder balls, the limiting block 10 is positioned right above the mold block 4 until the limiting block 10 contacts the mold block 4, the distance from the pressing plate 9 to the substrate 3 is the height of the flattened solder balls 5, meanwhile, the height is also the height of the limiting block 10, so that the flattened height of the solder ball 5 can be determined through the height of the limiting block 10, and the pressing plate 9 can not be directly pressed on the substrate 3 during height control, so that the safety of the substrate 3 is effectively protected.

Preferably, the bottom of the platen 9 is provided with fixed protection seats, the fixed protection seats are symmetrically located above two sides of the base plate 3, when the platen 9 gradually moves downwards, the fixed protection seats are just clamped on two sides of the base plate 3, the base plate 3 is protected from displacement in the pressing process, the stability of the device during the platen is ensured, the fixed protection seats comprise fixed blocks 11, moving blocks 12, sliding grooves 13 and buffer springs 14, the fixed blocks 11 are arranged at the bottom of the platen 9, the fixed blocks 11 are fixed at the bottom of the platen 9 through welding or bolts, the sliding grooves 13 are vertically arranged on the fixed blocks 11, the moving blocks 12 are slidably connected on the sliding grooves 13, the moving blocks 12 are located right above the base plate 3, when the platen 9 descends, the moving blocks 12 are in contact with the base plate 3, the fixed blocks 11 are not located outside the base plate 3 and are not in contact with the base plate, the buffer springs 14 are arranged between the moving block 12 and the flattening plate 9, when the device descends, the distance between the flattening plate 9 and the moving block 12 is smaller and smaller, the buffer springs 14 are gradually compressed, the fixed blocks 11 are located on two sides of the base plate 3, the base plate 3 is prevented from horizontally moving, the stability of the device is kept, meanwhile, the moving block 12 gradually compresses the base plate 3 under the pressure of the buffer springs 14, the compressing force is provided by the buffer springs 14, therefore, the force is moderate, the base plate 3 is not easily damaged, the stability of the base plate 3 in the pressing process is further improved, the moving block 12 is made of soft materials, such as rubber materials, or the soft materials are fixed on the surface of the moving block, which is in contact with the base plate 3, and the safety of the base plate 3 is effectively protected.

Preferably, a rubber pad is disposed at the bottom of the moving block 12, and the rubber pad is fixed to the bottom of the moving block 12 by adhesion, so as to prevent the substrate 3 from being damaged when the substrate 3 contacts.

Preferably, be equipped with first recess 15, second recess 16 on plummer 2, base plate 3 is located first recess 15, the degree of depth of first recess 15, second recess 16 is shallow, works as when base plate 3 is placed in first recess 15, the top of base plate 3 is higher than plummer 2's top to the operation of flattening of tin ball 5 on the base plate 3, mould piece 4 is located second recess 16, sliding connection has clamp block 17 in the second recess 16, be equipped with compression spring 18 between clamp block 17 and the one end of second recess 16, mould piece 4 and compression spring 18 are located the both sides that press from both sides tight block 17 respectively, can make through removing clamp block 17 and leave certain space between the lateral wall that presss from both sides tight block 17 and second recess 16, then unclamp clamp block 17 after putting into mould piece 4, make things convenient for the fixed of mould piece 4, first recess 15, second recess 16, The depth of the second groove 16 is the same, when the substrate 3 and the mold block 4 are respectively placed in the corresponding grooves, the tops of the substrate and the mold block are higher than the top of the bearing table 2 by a certain height, so that the height of the solder ball 5 during flattening is conveniently controlled.

Preferably, the pressing plate 9 is a stainless steel component, the top of the limiting block 10 is provided with a magnetic block, the limiting block 10 is attracted to the bottom of the pressing plate 9 through the magnetic block, the limiting block 10 is fixed to the bottom of the pressing plate 9 through the magnetic block in an attracting mode, the limiting block 10 is replaced when the tin balls 5 with different thicknesses are conveniently pressed, and the operation is more convenient and rapid.

The method comprises the following operation steps: set up the mould piece 4 with base plate 3 co-altitude on plummer 2 to set up stopper 10 in the position that the flattening board 9 is located directly over mould piece 4, when flattening board 9 flattens the operation to tin ball 5 on base plate 3 under the drive of elevating platform 8, the height that finally flattens is decided by stopper 10's height, when stopper 10 and mould piece 4 contact, the height after the tin ball 5 suppression equals the height of stopper 10, consequently can reach the control effect of control tin ball 5 height that flattens through the stopper 10 of change co-altitude to do not need flattening board 9 directly to contact with base plate 3, avoided damaging base plate 3 at ordinary times to base plate 3, guaranteed the yields when semiconductor product produces.

Claims (5)

1. the utility model provides a board that flattens for semiconductor package which characterized in that: including base (1), be equipped with plummer (2) on base (1), be equipped with base plate (3), mould piece (4) on plummer (2), base plate (3) is the same with the height of mould piece (4), be equipped with tin ball (5) on base plate (3), the bilateral symmetry of base (1) is equipped with support column (6), be equipped with fixed plate (7) on support column (6), the bottom of fixed plate (7) is equipped with elevating platform (8), the bottom of elevating platform (8) is equipped with flattening board (9), the bottom of flattening board (9) is equipped with stopper (10), stopper (10) are located mould piece (4) directly over.

2. The platen press for semiconductor packages as claimed in claim 1, wherein: the bottom of clamp plate (9) is equipped with fixed protection seat, the top that is located base plate (3) both sides of fixed protection seat symmetry, fixed protection seat includes fixed block (11), movable block (12), spout (13), buffer spring (14), fixed block (11) set up in the bottom of clamp plate (9), the vertical setting of spout (13) is on fixed block (11), movable block (12) sliding connection is on spout (13), buffer spring (14) set up between movable block (12) and clamp plate (9).

3. The platen press for semiconductor packages as claimed in claim 2, wherein: the bottom of the moving block (12) is provided with a rubber pad.

4. The platen press for semiconductor packages as claimed in claim 1, wherein: be equipped with first recess (15), second recess (16) on plummer (2), base plate (3) are located first recess (15), mould piece (4) are located second recess (16), sliding connection has tight piece (17) of clamp in second recess (16), be equipped with compression spring (18) between the one end of pressing from both sides tight piece (17) and second recess (16).

5. The platen press for semiconductor packages as claimed in claim 1, wherein: the pressing plate (9) is a stainless steel component, the top of the limiting block (10) is provided with a magnetic block, and the limiting block (10) is attracted to the bottom of the pressing plate (9) through the magnetic block.