CN217641251U

CN217641251U - Semiconductor product processing carrier

Info

Publication number: CN217641251U
Application number: CN202221355777.6U
Authority: CN
Inventors: 赵红武; 崔志刚; 范磊
Original assignee: Wuhan Xinzhi Semiconductor Co ltd
Current assignee: Wuhan Xinzhi Semiconductor Co ltd
Priority date: 2022-06-01
Filing date: 2022-06-01
Publication date: 2022-10-21
Anticipated expiration: 2032-06-01

Abstract

The utility model discloses a semiconductor product processing carrier, include: the carrying tool structure is internally provided with a placing groove, a second clamp is arranged on the left side of the carrying tool structure, and a first clamp is arranged on the right side of the carrying tool structure; and the flange on the second clamp is fixedly arranged on the upper left side of the surface of the carrier structure, a stress disc is arranged on the upper side of the flange, the bottom of the stress disc is fixedly connected with the stud, and one end, far away from the stress disc, of the stud is movably connected with the pressing column. According to the semiconductor product processing carrier, a semiconductor product is placed in the placing groove, and the semiconductor product is clamped and fixed through the second clamp and the first clamp, so that the stability of the semiconductor product when being processed is ensured, and the two sides of the product cannot be tilted; the both sides of semiconductor product carry out the centre gripping through the cushion, and the cushion is the rubber material, and the texture is soft, can not cause the damage to the semiconductor product.

Description

Semiconductor product processing carrier

Technical Field

The utility model relates to the field of semiconductor technology, specifically be a semiconductor product processing carrier.

Background

As semiconductor products are increasingly miniaturized, package substrates or lead frames used for packaging are also increasingly thinned; this means that the risk of warpage of the package substrate or the lead frame increases, and the warpage will inevitably increase the difficulty of the semiconductor packaging process, and the semiconductor processing or transferring needs to be performed by a carrier.

However, when the existing semiconductor product processing carrier is used, a semiconductor device is not firmly fixed, so that the stability in the transferring or processing process is insufficient, the tilting phenomenon of a semiconductor device substrate plate is easy to occur during processing, and the yield is low.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor product processing carrier to solve the defect that mentions in the above-mentioned background art.

To achieve the above object, there is provided a semiconductor product processing carrier comprising:

the carrying tool structure is internally provided with a placing groove, a second clamp is arranged on the left side of the carrying tool structure, and a first clamp is arranged on the right side of the carrying tool structure;

the second anchor clamps, the fixed upper left side that sets up in the surface of carrier structure of flange on the second anchor clamps, and the flange upside is provided with the atress dish, the bottom and the double-screw bolt fixed connection of atress dish simultaneously to the double-screw bolt is kept away from the one end of atress dish and is pressed a swing joint, presses the bottom setting of post in the inside of mounting groove, and the inside movable mounting of mounting groove has splint, the right-hand member and the cushion fixed connection of splint simultaneously.

Preferably, the first clamp and the second clamp are consistent in composition structure, and the semiconductor product is placed in the placing groove, and two sides of the semiconductor product are clamped and fixed through the first clamp and the second clamp respectively.

Preferably, the second clamp comprises a stress disc, a stud, a screw cylinder, a pressing column, an installation cavity, a cushion, a clamping plate, a guide plate, a stress cavity, a guide column, an installation groove and a flange, and the cushion is of a structure which is made of rubber and has a rectangular section.

Preferably, the bottom of the pressing column is provided with a pressing inclined plane, the stress cavity is formed in the clamping plate, the right side wall of the stress cavity is provided with a stress inclined plane, and the pressing inclined plane and the stress inclined plane are arranged in parallel contact.

Preferably, a screw cylinder is installed on the flange, a stud is installed inside the screw cylinder in a threaded mode, the stress disc is rotated at the same time, and the stress disc drives the pressing column to move downwards through the stud.

Preferably, the section of the stress cavity is a right trapezoid, and the clamping plate is of a transverse moving structure in the mounting groove.

Preferably, the deflector is all installed to the both sides of splint, and the guiding hole has been seted up to the inside of deflector, and the size looks adaptation of guide post and guiding hole simultaneously, the guide post plug-in is in the inside of guiding hole.

Preferably, the guide posts are arranged into two groups and fixedly arranged on the inner wall of the mounting groove, and the guide posts are provided with return springs.

Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor product is placed in the placing groove, and the semiconductor product is clamped and fixed through the second clamp and the first clamp, so that the stability of the semiconductor product when being processed is ensured, and the two sides of the product cannot be tilted; the both sides of semiconductor product carry out the centre gripping through the cushion, and the cushion is the rubber material, and the texture is soft, can not cause the damage to the semiconductor product.

Drawings

FIG. 1 is a front view of the structure of the present invention;

FIG. 2 is a top view of the structure of FIG. 1;

FIG. 3 is a schematic view of a second clamp of the present invention;

FIG. 4 isbase:Sub>A schematic sectional view taken along line A-A of FIG. 3;

fig. 5 is a top view of the structure pressing post mounting structure of the present invention;

fig. 6 is a diagram illustrating the rotation force plate in the structure diagram 3 of the present invention.

The reference numbers in the figures: 1. a carrier structure; 2. a placement groove; 3. a first clamp; 4. a second clamp; 41. a force-bearing disc; 42. a stud; 43. a screw cylinder; 44. pressing the column; 45. a mounting cavity; 46. a soft cushion; 47. a splint; 48. a guide plate; 49. a stress chamber; 50. a guide post; 51. mounting grooves; 52. a flange.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-6, the present invention provides a semiconductor product processing carrier, comprising: a carrier structure 1 and a second clamp 4;

a placing groove 2 is formed in the carrier structure 1, a second clamp 4 is installed on the left side of the carrier structure 1, and a first clamp 3 is installed on the right side of the carrier structure 1;

the flange 52 on the second clamp 4 is fixedly arranged on the upper left side of the surface of the carrier structure 1, the stress disc 41 is arranged on the upper side of the flange 52, the bottom of the stress disc 41 is fixedly connected with the stud 42, one end, far away from the stress disc 41, of the stud 42 is movably connected with the pressing column 44, the bottom of the pressing column 44 is arranged inside the mounting groove 51, the clamping plate 47 is movably mounted inside the mounting groove 51, and the right end of the clamping plate 47 is fixedly connected with the cushion 46.

When the semiconductor product processing fixture is used, a semiconductor product is placed in the placing groove 2, and the semiconductor product is clamped and fixed through the second clamp 4 and the first clamp 3, so that the stability of the semiconductor product in processing is ensured; the two sides of the semiconductor product are clamped through the soft pads 46, and the soft pads 46 are made of rubber materials and soft in texture, so that the semiconductor product cannot be damaged.

In a preferred embodiment, the first clamp 3 and the second clamp 4 have the same structure, and the semiconductor product is placed inside the placing slot 2, and the two sides of the semiconductor product are clamped and fixed by the first clamp 3 and the second clamp 4 respectively.

As shown in fig. 1-2: the semiconductor product is placed in the placing groove 2, the stress disc 41 is rotated, under the action of a series of transmission structures, the clamping plate 47 can transversely move through the soft pad 46 on the clamping plate, one side of the semiconductor product is clamped, the first clamp 3 works in the same mode, and the other side of the semiconductor product is clamped through the soft pad 46 on the first clamp.

In a preferred embodiment, the second fixture 4 includes a force-receiving plate 41, a stud 42, a screw 43, a pressing post 44, a mounting cavity 45, a cushion 46, a clamping plate 47, a guide plate 48, a force-receiving cavity 49, a guide post 50, a mounting groove 51 and a flange 52, wherein the cushion 46 is made of rubber and has a rectangular cross section.

As shown in fig. 1 and 3: the first gripper 3 operates in accordance with the second gripper 4, and only the operation of the second gripper 4 will be described here: the stress disc 41 is rotated, the stress disc 41 drives the stud 42 to rotate, the stud 42 is screwed in the screw cylinder 43 and drives the pressing column 44 to move downwards, so that the pressing column 44 drives the clamping plate 47 through the stress cavity 49, the clamping plate 47 moves from left to right, and the product is clamped.

In a preferred embodiment, the bottom of the pressing column 44 is formed with a downward-pressing inclined surface, the force-receiving cavity 49 is formed inside the clamping plate 47, and the right side wall of the force-receiving cavity 49 is formed with a force-receiving inclined surface, and the downward-pressing inclined surface and the force-receiving inclined surface are arranged in parallel contact.

As shown in fig. 3: the pressing inclined plane is arranged in parallel contact with the stressed inclined plane, the pressing column 44 moves downwards, and the clamping plate 47 is driven to work transversely under the action of the pressing inclined plane and the stressed inclined plane.

In a preferred embodiment, a screw cylinder 43 is mounted on the flange 52, a stud 42 is threadedly mounted inside the screw cylinder 43, and the force-receiving plate 41 is rotated, so that the force-receiving plate 41 drives the pressing column 44 to move downwards through the stud 42.

As shown in fig. 3: the stud 42 is installed in the screw cylinder 43 in a threaded manner, the stud 42 rotates, so that the stud 42 moves downwards and drives the pressing column 44 to move downwards, the pressing column 44 and the stud 42 are movably arranged, and when the stud 42 rotates, the pressing column 44 cannot rotate.

In a preferred embodiment, the cross-section of the force-bearing chamber 49 is a right trapezoid, and the clamping plate 47 has a laterally moving structure inside the mounting groove 51.

As shown in fig. 3-4: the clamping plate 47 is of a transverse moving structure in the mounting groove 51, the soft cushion 46 is mounted at the end part of the clamping plate 47, the soft cushion 46 is in contact with the semiconductor product, and the soft cushion 46 is soft in texture and cannot damage the semiconductor product.

As a preferred embodiment, the guide plates 48 are mounted on both sides of the clamping plate 47, guide holes are formed in the guide plates 48, the guide posts 50 are matched with the guide holes in size, and the guide posts 50 are inserted into the guide holes.

As shown in fig. 3-4: when the clamping plate 47 moves transversely, the guide posts 50 are inserted into the guide plates 48 on the two sides of the clamping plate 47, so that the clamping plate 47 can be limited and guided when moving transversely, and the clamping plate 47 is prevented from inclining when moving.

In a preferred embodiment, the guiding posts 50 are arranged in two sets and fixedly disposed on the inner wall of the mounting groove 51, and the guiding posts 50 are mounted with return springs.

As shown in fig. 3-4 and 6: when the clamping plate 47 moves rightwards, the return spring is compressed by the guide plates 48 on the two sides of the clamping plate 47, and when the pressing column 44 moves upwards, the clamping plate 47 is restored to the initial position under the action of the return spring.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A semiconductor product processing carrier, comprising:

the carrying tool comprises a carrying tool structure (1), wherein a placing groove (2) is formed in the carrying tool structure (1), a second clamp (4) is installed on the left side of the carrying tool structure (1), and a first clamp (3) is installed on the right side of the carrying tool structure (1);

second anchor clamps (4), fixed the setting in the upper left side of the surface of carrier structure (1) of flange (52) on second anchor clamps (4), and flange (52) upside is provided with atress dish (41), the bottom and double-screw bolt (42) fixed connection of atress dish (41) simultaneously, and double-screw bolt (42) keep away from the one end of atress dish (41) and press post (44) swing joint, the bottom setting of pressing post (44) is in the inside of mounting groove (51), and the inside movable mounting of mounting groove (51) has splint (47), the right-hand member and cushion (46) fixed connection of splint (47) simultaneously.

2. The semiconductor product processing carrier of claim 1, wherein: the first clamp (3) and the second clamp (4) are consistent in composition structure, and the semiconductor product is placed in the placing groove (2) and clamped and fixed on two sides of the placing groove through the first clamp (3) and the second clamp (4) respectively.

3. The semiconductor product processing carrier of claim 1, wherein: the second clamp (4) comprises a stress disc (41), a stud (42), a screw cylinder (43), a pressing column (44), an installation cavity (45), a cushion (46), a clamping plate (47), a guide plate (48), a stress cavity (49), a guide column (50), an installation groove (51) and a flange (52), wherein the cushion (46) is of a structure which is made of rubber materials and has a rectangular cross section.

4. A semiconductor product processing carrier as recited in claim 3, wherein: the bottom of the pressing column (44) is provided with a pressing inclined plane, the stress cavity (49) is arranged in the clamping plate (47), the right side wall of the stress cavity (49) is provided with a stress inclined plane, and the pressing inclined plane and the stress inclined plane are arranged in parallel contact.

5. A semiconductor product processing carrier according to claim 3, wherein: the flange (52) is provided with a screw cylinder (43), the screw bolt (42) is installed in the screw cylinder (43) in a threaded mode, the stress disc (41) rotates at the same time, and the stress disc (41) drives the pressing column (44) to move downwards through the screw bolt (42).

6. A semiconductor product processing carrier as recited in claim 3, wherein: the section of the stress cavity (49) is a right trapezoid, and the clamping plate (47) is of a transverse moving structure in the installation groove (51).

7. A semiconductor product processing carrier as recited in claim 6, wherein: deflector (48) are all installed to the both sides of splint (47), and the guiding hole has been seted up to the inside of deflector (48), and guide post (50) and the size looks adaptation of guiding hole simultaneously, and guide post (50) are pegged graft in the inside of guiding hole.

8. A semiconductor product processing carrier as recited in claim 7, wherein: the guide posts (50) are fixedly arranged on the inner wall of the mounting groove (51) in two groups, and the guide posts (50) are provided with return springs.