CN215581933U - Jig for improving warping of circuit board - Google Patents
Jig for improving warping of circuit board Download PDFInfo
- Publication number
- CN215581933U CN215581933U CN202121790874.3U CN202121790874U CN215581933U CN 215581933 U CN215581933 U CN 215581933U CN 202121790874 U CN202121790874 U CN 202121790874U CN 215581933 U CN215581933 U CN 215581933U
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- circuit board
- connecting cylinder
- jig
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Abstract
The utility model discloses a jig for improving the warping of a circuit board, which comprises a bottom plate, a support frame, a lifting hydraulic machine, a pressing block and a rotating assembly, wherein the support frame is arranged on the bottom plate and is of an L-shaped structure; the rotating assembly comprises a supporting column, a rotating plate, a placing plate, a clamping groove, a clamping plate, a fixing column, a spring, a sliding groove, a fixing side plate and a connecting cylinder, wherein the supporting column is arranged on the bottom plate, and the rotating plate is rotatably sleeved on the fixing column. The utility model belongs to the technical field of circuit boards, and particularly relates to a jig capable of effectively pressing and leveling different warping positions and improving the warping of a circuit board to protect the circuit board from being damaged.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a jig for improving warping of a circuit board.
Background
In the production process of the circuit board, due to factors such as the temperature of a processing environment or the pressure applied in the processing process, the circuit board is easy to warp, and according to the IPC standard in the production process of the circuit board, when the warp degree of the board is less than 0.75%, the board is a qualified product, otherwise, the board is an unqualified product. Moreover, if the circuit board is uneven, the problem of inaccurate positioning can be caused, components can not be inserted into holes of the PCB and surface mounting pads, and even the automatic inserting machine can be damaged by collision. Therefore, the warped circuit board needs to be leveled by a jig.
The existing jig for improving the warping of the circuit board can only press and level one warped position at a time, and has low speed and low efficiency; moreover, the warping positions with different sizes cannot be effectively leveled; meanwhile, when the warping position is pressed, the circuit board is not protected, and the circuit board is easily crushed.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems, the utility model provides a jig for improving the warping of a circuit board, which can effectively press and level different warping positions and protect the circuit board from being damaged.
In order to realize the functions, the technical scheme adopted by the utility model is as follows: a jig for improving warping of a circuit board comprises a bottom plate, a supporting frame, a lifting hydraulic machine, a pressing block and a rotating assembly, wherein the supporting frame is arranged on the bottom plate and is of an L-shaped structure, the lifting hydraulic machine is arranged below the top wall of the supporting frame, the pressing block is arranged below the lifting hydraulic machine and is used for pressurizing and leveling warped positions, and the rotating assembly is arranged on the bottom plate and is convenient for adjusting the positions of the placed circuit board and pressurizing and leveling different warped positions; the rotating assembly comprises a supporting column, a rotating plate, a placing plate, a clamping groove, a clamping plate, a fixing column, a spring, a sliding groove, a fixing side plate and a connecting cylinder, wherein the supporting column is arranged on the bottom plate, the rotating plate is rotatably sleeved on the fixing column, the placing plate is close to the rotating plate and rotatably sleeved on the supporting column, the clamping groove is uniformly arranged on the inner side wall of the placing plate, the connecting cylinder is arranged on the rotating plate, the fixing side plate is arranged in the connecting cylinder, the spring is arranged on the outer side wall of the fixing side plate, the clamping plate penetrates through the side wall of the connecting cylinder and is arranged on one end of the spring, the sliding groove is arranged on the inner side wall of the connecting cylinder, one end of the fixing column is arranged on the sliding groove, the other end of the fixing column is arranged on the clamping plate, and the stability of the clamping plate is improved.
Further, the placing groove is formed in the top wall of the placing plate, the protection pad is arranged on the bottom wall of the placing groove, and when the circuit board is pressed and leveled, the circuit board is protected, and the circuit board is prevented from being damaged by pressure.
Furthermore, a cushion layer is arranged below the pressing block and made of rubber materials, so that the stability of the contact surface of the cushion layer and the circuit board is improved, and the cushion effect is improved to protect the circuit board when the circuit board is pressed and leveled.
Further, be equipped with the handle on the connecting cylinder lateral wall, be convenient for promote the rotation of connecting cylinder, and then drive and place the board and rotate, will place the board and rotate to suitable position department, adjust the position of placing the board according to warped position.
Further, the junction of connecting cylinder diapire and commentaries on classics board lateral wall is equipped with linking bridge, linking bridge is L type structure, increases the holding power to the connecting cylinder, increases the connection stability of connecting cylinder.
The utility model adopts the structure to obtain the following beneficial effects: according to the jig for improving the warping of the circuit board, the handle is held to push the connecting cylinder to move towards the vertical side direction of the clamping plate through the arrangement of the rotating assembly, the connecting cylinder drives the rotating plate to rotate, the rotating plate drives the placing plate to rotate, meanwhile, the clamping plate can also move in the arc side direction of the clamping plate, the clamping plate is pushed out of the clamping groove, the spring is compressed, the clamping plate moves along the arc surface of the placing plate at the moment until the clamping plate is clamped into the next clamping groove, the position of the placing plate is adjusted, therefore, the pressing and leveling of different warping positions are facilitated, and through the arrangement of the cushion layer and the protection pad, the circuit board is protected and is prevented from being damaged by pressing when the circuit board is pressed and leveled.
Drawings
FIG. 1 is a general structural diagram of a jig for improving warpage of a circuit board according to the present invention;
fig. 2 is a top view of a rotating assembly of a jig for improving warpage of a circuit board according to the present invention.
The hydraulic lifting device comprises a base plate 1, a bottom plate 2, a supporting frame 3, a lifting hydraulic machine 4, a pressing block 5, a rotating assembly 6, a supporting column 7, a rotating plate 8, a placing plate 9, a clamping groove 10, a clamping plate 11, a fixing column 12, a spring 13, a sliding groove 14, a fixing side plate 15, a connecting cylinder 16, a cushion layer 17, a connecting support 18, a protection pad 19, a placing groove 20 and a handle.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. The present invention will be described in further detail with reference to the accompanying drawings.
As shown in fig. 1-2, the jig for improving warpage of a circuit board of the present invention comprises a bottom plate 1, a support frame 2, a lifting hydraulic machine 3, a pressing block 4 and a rotating assembly 5, wherein the support frame 2 is arranged on the bottom plate 1, the support frame 2 is an L-shaped structure, the lifting hydraulic machine 3 is arranged under the top wall of the support frame 2, the pressing block 4 is arranged under the lifting hydraulic machine 3, and the rotating assembly 5 is arranged on the bottom plate 1; the rotating assembly 5 comprises a supporting column 6, a rotating plate 7, a placing plate 8, a clamping groove 9, a clamping plate 10, a fixing column 11, a spring 12, a sliding groove 13, a fixing side plate 14 and a connecting cylinder 15, the supporting column 6 is arranged on the bottom plate 1, the rotating plate 7 is rotatably sleeved on the fixing column 11, the placing plate 8 is close to the rotating plate 7 and rotatably sleeved on the supporting column 6, the clamping groove 9 is uniformly arranged on the inner side wall of the placing plate 8, the connecting cylinder 15 is arranged on the rotating plate 7, the fixing side plate 14 is arranged in the connecting cylinder 15, the spring 12 is arranged on the outer side wall of the fixing side plate 14, the clamping plate 10 penetrates through the side wall of the connecting cylinder 15 and is arranged at one end of the spring 12, the sliding groove 13 is arranged on the inner side wall of the connecting cylinder 15, one end of the fixing column 11 is arranged on the sliding groove 13, and the other end of the fixing column 11 is arranged on the clamping plate 10.
A placing groove 19 is formed below the top wall of the placing plate 8, and a protection pad 18 is arranged on the bottom wall of the placing groove 19.
A cushion layer 16 is arranged below the pressing block 4, and the cushion layer 16 is made of rubber.
The outer side wall of the connecting cylinder 15 is provided with a handle 20.
The junction of connecting cylinder 15 diapire and commentaries on classics board 7 lateral wall is equipped with linking bridge 17, linking bridge 17 is L type structure.
When the clamping device is used specifically, a circuit board is placed on the protection pad 18 in the placing groove 19, the handle 20 is held to push the connecting cylinder 15 to move towards the vertical side direction of the clamping plate 10, the connecting cylinder 15 drives the rotating plate 7 to rotate, the rotating plate 7 drives the placing plate 8 to rotate, meanwhile, the clamping plate 10 can move towards the arc side direction of the clamping plate 10, the clamping plate 10 is pushed out of the clamping groove 9, the spring 12 is compressed, the clamping plate 10 moves along the arc face of the placing plate 8 at the moment until the clamping plate 10 is clamped into the next clamping groove 9, the position of the placing plate 8 is adjusted, the warping position needing to be subjected to pressing and leveling is rotated to the lower side of the pressing block 4, the lifting hydraulic machine 3 is started, the lifting hydraulic machine 3 drives the pressing block 4 to perform pressing and leveling on the warping position of the circuit board, and when the cushion layer 16 and the protection pad 18 perform pressing and leveling on the circuit board, the circuit board is protected, and the circuit board is prevented from being damaged by pressing.
The present invention and its embodiments have been described above, and the description is not intended to be limiting, and the drawings are only one embodiment of the present invention, and the actual structure is not limited thereto. In summary, those skilled in the art should appreciate that they can readily use the disclosed conception and specific embodiments as a basis for designing or modifying other structures for carrying out the same purposes of the present invention without departing from the spirit and scope of the utility model as defined by the appended claims.
Claims (5)
1. The utility model provides an improve tool of circuit board warpage which characterized in that: the lifting hydraulic press is arranged below the top wall of the supporting frame, the pressing block is arranged below the lifting hydraulic press, and the rotating assembly is arranged on the bottom plate; the rotating assembly comprises a supporting column, a rotating plate, a placing plate, a clamping groove, a clamping plate, a fixing column, a spring, a sliding groove, a fixing side plate and a connecting cylinder, wherein the supporting column is arranged on the bottom plate, the rotating plate is rotatably sleeved on the fixing column, the placing plate is close to the rotating plate and rotatably sleeved on the supporting column, the clamping groove is uniformly arranged on the inner side wall of the placing plate, the connecting cylinder is arranged on the rotating plate, the fixing side plate is arranged in the connecting cylinder, the spring is arranged on the outer side wall of the fixing side plate, the clamping plate penetrates through the side wall of the connecting cylinder and is arranged on one end of the spring, the sliding groove is arranged on the inner side wall of the connecting cylinder, one end of the fixing column is arranged on the sliding groove, and the other end of the fixing column is arranged on the clamping plate.
2. The jig for improving the warpage of the circuit board according to claim 1, wherein: the placing plate is characterized in that a placing groove is formed below the top wall of the placing plate, and a protection pad is arranged on the bottom wall of the placing groove.
3. The jig for improving the warpage of the circuit board according to claim 2, wherein: a cushion layer is arranged below the pressing block and made of rubber materials.
4. The jig for improving the warpage of the circuit board according to claim 3, wherein: and a handle is arranged on the outer side wall of the connecting cylinder.
5. The jig for improving the warpage of the circuit board according to claim 4, wherein: the joint of connecting cylinder diapire and commentaries on classics board lateral wall is equipped with linking bridge, linking bridge is L type structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121790874.3U CN215581933U (en) | 2021-08-03 | 2021-08-03 | Jig for improving warping of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121790874.3U CN215581933U (en) | 2021-08-03 | 2021-08-03 | Jig for improving warping of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215581933U true CN215581933U (en) | 2022-01-18 |
Family
ID=79831778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121790874.3U Active CN215581933U (en) | 2021-08-03 | 2021-08-03 | Jig for improving warping of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215581933U (en) |
-
2021
- 2021-08-03 CN CN202121790874.3U patent/CN215581933U/en active Active
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