TW201936357A - Mold base, mold casing unit, compression-molding mold, and compression-molding device capable of performing compression molding with high precision - Google Patents

Abstract

Provided is a mold device for compression molding which is highly versatile, and can perform compression molding with high precision while absorbing a variation in thickness or a variation in the amount of resin when a plurality of workpieces are arranged side by side and compression-molded separately. The mold device for compression molding includes an upper mold 2 having a workpiece holding portion 2a that holds a plurality of workpieces W individually; and a lower mold 3 that forms a plurality of lower mold cavity recessed portions 3a by clampers 5e, which are disposed opposite to the workpiece holding portion 2a to clamp the workpiece W and independently arranged for each workpiece, and cavity member 5ds which move relatively in a state of being held and inserted into the clamper 5e to pressurize the resin. The upper mold 2 has adjustment mechanisms 8 for each workpiece W for performing height adjustments.

Description

Mold base, mold sleeve unit for mold, compression molding mold and compression molding device

The present disclosure relates to a mold holder, a mold sleeve unit, a mold for compression molding, and a compression molding apparatus using the same when a plurality of workpieces arranged in parallel are individually clamped and compression-molded at the same time.

The cavity of the lower mold cavity provided in the lower mold is covered with a release film, and the cavity of the lower mold cavity is supplied with molding resin (granular resin, liquid resin, powder resin, etc.), and is held in the upper mold to hold the workpiece. Various devices for compression molding of a mold have been developed and put into practical use (see Japanese Patent Application Laid-Open No. 2010-36542).

As for the molding die for the compression molding of the movable mold of the lower cavity, the mainstream is a device for resin molding of one workpiece with one mold, so from the viewpoint of reducing the installation area to improve productivity, it is also proposed to use it in the height direction. A compression molding apparatus for a compression molding die having two upper and lower layers (see Japanese Patent Application Laid-Open No. 2010-94931).

However, for example, in the case of compression-molding a strip-shaped strip substrate as a workpiece, in the case of a resin substrate, the thickness deviation is larger than that of a lead frame, and it is mounted on a single strip substrate. The number of semiconductor wafers is caused by defective semiconductor wafers. If there is a deviation in the number of vehicles. In addition, when the number of mounted semiconductor wafers on a single tape substrate is changed, when the supply amount of the molding resin does not change, the molding thickness of the final packaging portion (resin sealing portion) may be caused by the compression molding relationship. change. It is difficult to shorten the molding time and perform compression molding while making overall adjustments.

Therefore, there are several compression molding apparatuses that perform compression molding in which two strip substrates are arranged in parallel as a mold for transfer molding (see Japanese Patent Application Laid-Open No. 2011-143730 and Japanese Patent Application Laid-Open No. 2012-40843 Bulletin).

Prior art literature Patent literature

Patent Document 1 Japanese Patent Application Publication No. 2010-36542

Patent Document 2 Japanese Patent Application Publication No. 2010-94931

Patent Document 3 Japanese Patent Application Laid-Open No. 2011-143730

Patent Document 4 JP 2012-40843

The compression molding apparatus described in Japanese Patent Application Laid-Open No. 2011-143730 is equipped with a pair of compression molds for compression molding. The lower mold is supported on a movable plate, and two clamping cavities and two clamping members are formed on the lower mold. Sliding member. Mounting rods are provided on the back side (lower side) of the sliding members constituting the bottom of the cavity, and elastic members are wound around each of the mounting rods. Thereby, each sliding member is supported so that it can slide to the clamping member which surrounds it. In addition, an adjustment hand for mounting rods for each sliding member is prepared. The segment is capable of pressing the molten resin evenly by rotating in a scale-like shape with one shaft supported on the movable plate as a center. However, the adjustment means has a structure that absorbs the deviation of the left and right resin amounts supplied to the left and right mold cavities by rotating in a scale-like manner with only one axis provided on the movable plate as the center, so that the adjustment means has strength. problem. If the strength of the adjustment means is insufficient, there is a risk of breakage, and the variation in the amount of resin cannot be absorbed without the sliding member functioning. In addition, in the case of performing a maintenance operation of the mold or in the case of compression molding of different workpieces, it is necessary to remove the upper mold and the lower mold from the compression molding apparatus. In this case, the entire upper mold holding the pair of workpieces is removed from the fixed plate, and the entire lower mold having two cavities must be removed from the movable plate, so that the operation scale is large.

Furthermore, in the compression molding die of Japanese Patent Application Laid-Open No. 2012-40843, the two upper compression dies that adsorb and hold the strip substrate are suspension buffer springs respectively supported by the upper main die. Around the two upper compression molds, one upper frame mold is suspended and supported by the upper main mold by a spacer spring. The lower main mold disposed opposite to the upper main mold supports two lower compression molds constituting the cavity of the lower mold and a lower frame mold inserted therein. Relative to the lower main mold, the lower compression mold system is supported and fixed, and the lower frame mold system is supported by a floating spring. One release film is adsorbed and held on the surfaces of the two lower compression molds and the lower frame mold. The plate thickness errors of the strip substrates that are each held by the upper compression mold are absorbed by the deflection of the buffer spring. Although the plate thickness error can be absorbed by the upper compression mold, the lower frame mold existing between the two strips is common and will sandwich the strip. Therefore, the lower frame mold may be tilted due to the difference in the thickness of the strip. Yu. In addition, when the height of the left and right molds is changed due to the variation in the amount of resin supplied to the lower mold cavity, there may be unfilled or unfilled on one side. In the case of the target resin pressure, the entire press device (particularly, the lower die that is a movable die) may tilt. In addition, since the two strip substrates are compression-molded using a release film covering two lower mold cavities (two lower compression molds and lower frame molds), when the release films are adsorbed and held, It is difficult to attract the release film by pulling the release film. In addition, since the surfaces of the two lower mold cavities are to be covered with one release film, handling is difficult, and a useless area that is not helpful for compression molding is generated. In addition, in the case of maintenance of the mold or in the case of compression molding of different types of workpieces, it is necessary to exchange the buffer buffer spring suspended and supported by the two upper compression molds of the upper main mold as a whole. The two lower compression molds supported by the lower main mold and the lower frame mold inserted into these and floatingly supported are integrally removed for the replacement operation, so the mold exchange operation becomes labor-intensive.

The disclosure applied to several embodiments described below is made to solve the above problems.

A first object is to provide a highly versatile compression molding die and a highly versatile compression molding device that uses the same and maintains molding quality while using the same. It can absorb a plurality of workpieces arranged in parallel to compress them individually. Compression molding is performed with high accuracy while varying the thickness of the workpiece and the variation in the amount of resin during molding.

A second object is to provide a mold base for a compression molding mold, which can easily perform the exchange operation of a plurality of mold mold sleeve units and has high versatility. In addition, a compression molding die is provided, which can be adjusted at the same time as a plurality of die set units arranged side by side due to the above-mentioned die holders being arranged side by side. Deviations in mold height during mold clamping during compression molding are performed with high precision for compression molding.

A third object is to provide a mold sleeve unit, which facilitates the processing of the thin film and reduces the unnecessary use area during compression molding, and makes the thickness of the package portion to a certain extent to improve the molding quality by making the thin film less prone to wrinkles. In addition, the present invention provides a mold for compression molding. Even if a plurality of mold sleeve units are arranged side by side in a mold seat, it can absorb variations in the thickness of the workpiece and the amount of resin, improve the molding quality, and improve the mold sleeve exchange workability.

The following embodiments are disclosed at least as follows. That is, a mold for compression molding is a method in which a plurality of workpieces arranged side by side in a horizontal direction are individually clamped and compression-molded at the same time. The mold includes a first mold having a workpiece for individually holding the plurality of workpieces. A holding part; and a second die, which are arranged to face the work holding part, and hold the work piece independently arranged for each work, and hold the state of being inserted into the holder by holding them A plurality of cavity recesses are formed by moving and pressing the cavity member of the resin, and the first mold is provided with an adjusting mechanism for individually adjusting the height of each of the workpieces.

According to the above configuration, the molding resin is supplied to the plurality of cavity recessed portions formed in the second mold, and the mold can be closed and compressed for each workpiece while the workpieces are held in the plurality of workpiece holding portions of the first mold. At this time, even if there is a deviation or supply of plate thickness in a plurality of workpieces, The amount of resin in the plurality of cavity recesses varies, and the deviation in mold height when the mold is clamped by the adjustment mechanism provided in the first mold is adjusted individually for each workpiece. ) Is compression-molded with high accuracy.

In addition, when the mold is exchanged due to tooling change, the adjustment mechanism provided in the first mold can be used in common, which improves the versatility.

Preferably, the first mold is a first mold sleeve unit having the workpiece holding portion in the first mold base is arranged side by side in an individual lateral arrangement, and the adjustment mechanism is provided with the first mold base from the first mold base. The spring units offset from the sleeve units in a direction distant from the mold opening and closing direction individually adjust the deviation of the mold height of the first mold sleeve units arranged side by side in the first mold base when the mold is clamped.

Accordingly, since the spring units provided in the adjusting mechanism are individually aligned in parallel with each other in the first die set unit that is arranged side by side, the deviation of the die height during die clamping is individually adjusted, so that the workpiece plate can be adjusted according to the first die set unit Thickness variation, resin variation. In addition, even if the first mold sleeve unit is replaced, the adjustment mechanism provided on the first mold base can still be used as usual.

Alternatively, the second mold may be a second mold sleeve unit having the cavity recess in the second mold seat and arranged side by side in a horizontal direction. Each second mold sleeve unit is a mold that forms the bottom of the cavity recess. The cavity piece and the holder surrounding the cavity piece to form a side portion of the cavity concave portion are supported to be relatively movable to the second mold base.

Therefore, since the workpiece held by the workpiece holding portion of the first die set unit in which the plurality of laterally arranged and arranged side by side on the first die are opposed to each other, the holders of the second die set unit disposed oppositely face each other. It is pressed and clamped separately. Therefore, it is possible to perform compression molding for each workpiece individually without tilting the entirety of the first mold or the second mold due to the variation in the thickness of the workpiece and the variation in the amount of resin.

Preferably, the film covering the clamping surface of the lower mold containing the cavity recessed portion is sucked and held for each of the second mold sleeve units.

In this way, when the film covering the lower mold clamping surface is used for each second mold sleeve unit, the processing is easy when the mold clamping surface containing the lower mold cavity recessed portion is held by suction and can be avoided as much as possible. A wasteful use area that does not contribute to compression molding is generally generated.

It may also be: a mold for compression molding, comprising: an upper mold holder; an upper mold sleeve unit, a spacer adjusting mechanism is detachably assembled to the upper mold holder, and a workpiece holding portion is provided on the upper mold clamping surface; The lower mold holder is disposed opposite to the upper mold holder; and the lower mold sleeve unit is pluggably assembled in the lower mold holder, and the lower mold cavity is arranged opposite to the workpiece holding portion. And a holder which surrounds the lower mold cavity member and is supported relatively movably to form the lower mold cavity recess.

Since the deviation of the mold height when the mold is clamped by the adjustment mechanism provided on the upper mold base is individually adjusted for each workpiece, the thickness of the resin sealing portion (encapsulation portion) can be compression-formed with high accuracy.

It may also be that: a pair of the upper mold set units arranged laterally are supported by the upper mold base separately through the adjustment mechanism, and each of the upper mold set units is provided with an overlapping assembly with the adjustment mechanism. A pair of lower die set units having a first upper die plate and a second upper die plate having the aforementioned work holding portion, and being arranged in a horizontally opposite manner to the pair of the upper die set units are detachably provided on the lower die, respectively. The mold base and the lower mold sleeve unit are each provided with: the lower mold cavity piece disposed opposite to the first upper template; and a holder which is relatively movable by surrounding the lower mold cavity piece and supported A first lower mold cavity recess formed; a second formed by a holder disposed opposite to the second upper template and surrounding the lower mold cavity piece and the lower mold cavity piece and supported to be relatively movable The cavity of the lower mold cavity.

Thereby, even if a pair of upper die set units arranged horizontally are arranged on the upper die set, a pair of lower die sets arranged horizontally opposite to the pair of upper die set units are arranged on the lower die set. The sleeve unit can also absorb the deviation of the mold height of each mold mold sleeve unit arranged in parallel during mold clamping for adjustment. The upper die set unit or the lower die set unit can be replaced by the upper die set or the lower die set separately. Even if the die sets are exchanged, the adjustment mechanism provided on the upper die set can still be used as usual.

A compression molding mold is equipped with a plurality of laterally arranged molds that hold a single workpiece and compressively mold the resin, and is opened and closed by a common mold opening and closing mechanism, which is characterized by: The first mold has a workpiece holding portion that holds the workpiece; and the second mold has a holder that holds the workpiece by being opposed to the workpiece holding portion and is relatively moved by being inserted into the holder to perform relative movement. A cavity member is pressed to form a cavity recess, and the mold of either the first mold or the second mold is provided with an adjustment mechanism for height adjustment.

In this case, for example, even a large-sized workpiece which cannot be arranged in a plurality of horizontal directions and arranged side by side, a first mold or a first mold having a height adjustment mechanism that is mounted in a plurality of horizontal alignments and opened and closed by a common mold opening and closing mechanism can be used. The structure of the two molds adjusts the deviation of the mold height corresponding to a large-sized workpiece during mold clamping to perform compression molding with high accuracy.

A compression molding die is configured to hold a plurality of workpieces arranged side by side in parallel and perform compression molding at the same time, and is characterized in that it includes a first mold, and a first base portion provided in a first mold base is to be held. The workpiece holding portion of the workpiece is supported in a horizontal arrangement; and the second mold is a second base portion provided in the second mold base, and a holder disposed opposite to the workpiece holding portion to clamp the workpiece is used. And the cavity recesses formed by the cavity pieces that are relatively moved to pressurize the resin while being inserted into the holder are supported in a lateral arrangement, the cavity pieces independently support and fix the mold plate, and the clip The holder is independently biased and supported on the mold plate for each workpiece, and an adjustment mechanism for independently adjusting the height of each workpiece is provided between the mold plate and the second base portion.

As a result, a plurality of second molds having cavity cavities arranged laterally and aligned on the second base portion and the workpiece holding portion facing each other will be provided in the first mold provided with the workpiece holding portions arranged horizontally on the first base portion and the workpiece holding portion. When individual workpieces are clamped individually, the clamper supported by the mold plate and the adjustment mechanism provided between the mold plate and the second base part are offset to support the deviation of the mold height for each workpiece. The mold is clamped without tilting.

In a compression molding apparatus provided with any of the compression molding dies described above, since a mold sleeve unit in which a plurality of strip substrates are arranged in parallel can be used to absorb the deviations in plate thickness and clamping position individually and perform compression molding simultaneously, Improved productivity and forming quality.

A mold base is a plurality of mold base units which are arranged side by side in a detachable manner to support the upper and lower pairs of mold bases. This adjustment mechanism is designed to absorb the mold at the time of mold clamping due to the total deviation of the plate thickness of the workpiece held by each mold mold unit, the amount of resin of the molding resin, and the total thickness of the film covering the clamping surface. Height deviation.

According to the above configuration, since the adjustment mechanism is provided integrally with the base portion on the upper and lower die holders, it can absorb the plate thickness and die caused by the workpiece held by the plurality of die sleeve units arranged side by side in parallel. Variations in the total amount of resin and the thickness of the film covering the clamping surface caused variations in mold height during mold clamping.

In addition, when the mold set unit is exchanged, there is no need to exchange the mold base, and the exchange operation is easy. Even if the mold set unit is exchanged, the adjustment mechanism can still be used as usual, so the versatility is high.

It may also be provided with: a first mold sleeve guide, which is adjacent to the mold opening and closing surface side of the first guide block suspended from the first base part; and a second mold sleeve guide, which is adjacent to the second base The mold opening and closing surface side of the second guide block that is erected is arranged adjacent to each other, and the step portions of the first mold set unit are inserted into and removed from the first guide block and the first mold set guide, respectively. On the side, step portions of the second mold sleeve unit are inserted and removed by the second guide block and the second mold sleeve guide, and are formed on both sides.

Thereby, the first mold sleeve unit can be inserted and removed from the near side by using the step formed by the first guide block and the first mold sleeve guide disposed on both sides as the guide. The second mold sleeve unit can be inserted and removed from the front side by using the stepped portion formed by the second guide block and the second mold sleeve guide disposed on both sides as the guide. Therefore, the number of replacement parts of the mold can be reduced and the exchange operation can be easily performed.

Alternatively, the frame-shaped first base-side portion hanging down from the first base portion and the frame-shaped second base-side portion standing upright from the second base portion are oppositely arranged to distinguish between the first base-side The first guide block of the first mold space portion surrounded by the part and the second guide block surrounded by the side portion of the second base to define the second mold space portion are oppositely disposed.

Thereby, the first base portion and the frame-shaped first base side portion, and the second base portion and the frame-shaped second base side portion are oppositely arranged, so that the mold can be closed in the clamping state to form a decompression space. . Also, because the first guide block that partitions the first mold space portion and the second guide that partitions the second mold space portion The lead blocks are oppositely arranged, so it is easy to align the first mold sleeve unit that is pluggably stored in the first mold space portion and the second mold sleeve unit that is pluggably stored in the second mold space portion. Bit.

It can also be: the first base side part is rotatably connected to the first base part through the hinge on the inner side of the first mold sleeve unit insertion direction, and the second base side part is through the hinge on the inner side of the second mold sleeve unit insertion direction. The second base portion is rotatably coupled.

Thereby, when the first base side portion is rotated by a predetermined amount with respect to the first base portion with the hinge provided on the inner side of the first mold sleeve unit insertion and removal direction as a center, the first mold sleeve unit held by the first base portion will be It is exposed near the front side in the plugging direction, so the first mold sleeve unit can be pulled out near the front side in the plugging direction for replacement.

In addition, when the second base portion is rotated relative to the second base portion by a predetermined amount with a hinge provided on the inner side of the second mold sleeve unit in the insertion and removal direction as a center, the second mold sleeve unit held at the second base portion will The front and rear sides of the plug-in direction are exposed, so the second mold sleeve unit can be pulled out in the front and back direction of the plug-in direction for exchange.

Alternatively, the aforementioned adjusting mechanism may include a spring unit that biases the first mold sleeve plate relative to the first mold base or the second mold sleeve plate relative to the second mold base in the mold opening and closing direction, or A sliding plate with the tapered surfaces overlapping each other is slidably provided between the mold base and the first mold sleeve plate or between the second mold base and the second mold sleeve plate.

With this, through the simple structure, it is possible to absorb and adjust the deviation of the mold height of each of the mold sleeve units arranged in parallel when the mold is clamped, and the adjustment mechanism can still be used as usual even if the mold sleeve units are exchanged.

A mold sleeve unit for a mold is used to compress a resin by clamping a workpiece with a first mold sleeve unit and a second mold sleeve unit, and is characterized in that any one of the first mold sleeve unit and the second mold sleeve unit is used for compression molding. One clamping surface is provided with a workpiece holding portion, and the other clamping surface is disposed by being opposed to the workpiece holding portion to clamp the workpiece and being inserted into the clamp through the holder The cavity cavity is formed by pressing a cavity member that is pressurized relative to each other. The clamping surface of the holder is provided with a film suction hole or a suction hole that adsorbs and holds the outer peripheral portion of the film covering the cavity cavity. In the suction groove, an annular groove is provided between the suction groove having the film suction hole or the suction hole and the cavity concave portion, and a plurality of suction holes are provided at the bottom of the groove of the annular groove.

If the above-mentioned mold sleeve unit is used, the outer peripheral edge portion of the film is adsorbed and held on the suction provided with the film suction hole or the suction hole through the clamping surface of the holder including the cavity concave portion provided in any of the mold unit. And the suction is provided by the suction hole provided at the bottom of the groove between the suction groove having the film suction hole or the suction groove and the cavity recess of the cavity, and the excess amount of the film can be accommodated in the ring groove and the film can be smoothly carried out. Absorbs and fixes wrinkles.

Therefore, when the mold sleeve units arranged side by side in the horizontal direction hold a plurality of workpieces individually and perform compression molding at the same time, it is possible to prevent a reduction in molding quality due to the occurrence of wrinkles in the film. Moreover, the handling of the film is easy and there is no wasteful use area of the film.

The annular groove system can also serve as a recessed portion of a film push pin that presses a film provided on a clamping surface of either of the first mold unit and the second mold unit. Therefore, when the workpiece and the film are clamped by a pair of mold sleeve units, the film push pin can be inserted into the annular groove, and the excess amount of the film can be surely induced into the annular groove and the wrinkles can be flattened.

The aforementioned annular groove can also be used as the chuck claw for the work holding portion to retreat.

Therefore, even if a chuck jaw for mechanically holding a workpiece is provided in the workpiece holding portion, the chuck jaw may enter the annular groove when clamping the workpiece and the film, so the second mold sleeve unit does not contact the clamping surface. put one's oar in. In addition, the workpiece holding portion not only performs air suction, but also holds the workpiece by the chuck jaws, so that the workpiece can be reliably received and received.

The utility model relates to a mold sleeve unit for a mold, which clamps a workpiece in a pair of mold sleeve units to compress a resin. The characteristics of the mold sleeve unit for a compression molding mold are: A first locking block is protruded at each edge portion of the rectangular clamping surface or the mold sleeve plate constituting a mold sleeve unit, and the clamping surface or the opposite surface of the mold sleeve plate of the opposite mold sleeve unit is opposite. A second locking block that is engaged with the first locking block is protrudingly provided.

Thereby, when the workpiece is clamped by a pair of die set units, the opposing clamping surfaces can be aligned by the concave-convex fitting of the first locking block and the second locking block. Therefore, it can contribute to the improvement of molding quality.

Alternatively, the first mold sleeve unit is provided with a first locking portion, which is pluggably locked to a first guide block formed by standing up to the first mold base, and the second mold sleeve unit is provided with a second locking portion. The second guide block is detachably locked to a second guide block formed by standing upright to the second mold base.

With this, the mold for compression molding is opened, and the first mold die set unit can be easily exchanged by inserting and removing the first mold sleeve unit by locking the first locking portion in a state where the first guide blocks are erected from both sides of the first mold base. operation.

In addition, the mold exchange operation can be easily performed by inserting and removing the second mold cover unit while the second locking portion is locked to the second guide blocks standing on both sides from the second mold base.

A leveling mechanism for correcting the inclination of the clamping surfaces to each other may be provided at the opposite positions of the first mold sleeve unit and the second mold sleeve unit.

Thereby, the parallelism between the clamping surfaces of the first mold sleeve unit and the second mold sleeve unit arranged opposite to each other can be maintained when the mold is closed.

A mold sleeve unit for a mold is provided with a first mold sleeve unit having a workpiece holding portion for holding a workpiece, and a second mold sleeve unit having a cavity concave portion to which molding resin is supplied, characterized in that the second mold sleeve is described above. The unit is that the cavity piece forming the bottom of the cavity recessed portion and the holder forming the side portion of the cavity recessed portion are configured to be relatively movable, and the opposite side of the clamping surface of the holder is provided with a prescribed Brake for the height position of the gripper.

As a result, the relative height position of the gripper to the cavity member is determined by the brake due to variations in the thickness of the workpiece and the amount of resin supplied to the cavity recess. Therefore, the thickness of the workpiece is absorbed and supplied to The variation in the amount of resin in the cavity recess can be compression-molded at a desired thickness.

A plurality of overflow mold cavities may also be provided along the outer peripheral edge portion of the cavity member.

Thereby, even if the amount of resin supplied to the cavity recess for each workpiece is not accurately measured, compression molding can be performed while keeping the thickness of the molded product constant by storing excess resin in the overflow cavity.

Preferably, any one of the above-mentioned mold die set units in the compression molding die is arranged side by side in a horizontal arrangement with respect to the die base, and the die die set unit can be inserted and removed independently from the die base.

Thereby, the necessary mold die set units of a plurality of mold die set units arranged side by side in a horizontal arrangement can be taken out of the die holder for maintenance or mold exchange, the number of exchange parts is small, and the mold exchange operation can be easily performed . In addition, the wrinkles of the film can be flattened and held on the clamping surface including the cavity concave portion for each mold set unit, and the processing is easy and there is no wasteful use area of the film.

It is possible to provide a compression molding die that is highly versatile and can absorb variations in the thickness of the workpiece or a variation caused by the amount of resin supplied when compressing and forming a plurality of workpieces in parallel and arranged side by side. High-precision compression molding is performed while causing deviations in mold height during mold clamping.

Further, the use of the compression molding die described above can provide a compression molding apparatus having high productivity and high versatility in maintaining molding quality.

Since the position adjustment mechanism is integrally provided with the base part in either of the upper and lower mold bases, it can absorb plate thickness and molding resin caused by workpieces held by a plurality of mold sleeve units arranged side by side in parallel. Variations in the total amount of resin and the thickness of the film covering the clamping surface caused variations in mold height during mold clamping.

In addition, when the mold set unit is exchanged, there is no need to exchange the mold base, and the exchange operation is easy. Even if the mold set unit is exchanged, the adjustment mechanism can still be used as usual, so the versatility is high.

A mold sleeve unit can be provided, which is easy to perform thin film processing during compression molding to reduce useless areas, and absorbs variations in the thickness of the workpiece and the amount of resin, so that the thickness of the packaging portion can be improved to a certain extent.

1‧‧‧Compression Mold

2‧‧‧ Upper mold

2a‧‧‧Work holding section

2b‧‧‧ adsorption hole

3‧‧‧ lower mold

3a‧‧‧ Recess of lower cavity

4‧‧‧ Upper Die Set Unit

4a‧‧‧ Upper mold cover

4b‧‧‧ support block

4c‧‧‧up template

4d‧‧‧chuck

4d1‧‧‧Horizontal

4d2‧‧‧Vertical

4d3‧‧‧Locking section

4e‧‧‧ Fulcrum

4f, 4i, 5g, 8e, 10c‧‧‧ coil spring

4g‧‧‧ promote sales

4h‧‧‧ film push pin

4j‧‧‧Upper mold lock block

4k‧‧‧ Upper die adjustment pin

5‧‧‧ Lower mold cover unit

5a‧‧‧ Lower mold base plate

5b‧‧‧ support post

5c‧‧‧Support plate

5d‧‧‧Lower mold cavity parts

5d1‧‧‧step difference

5d2‧‧‧through hole

5e‧‧‧ Lower mold movable holder

5e1‧‧‧Tugudou

5e2‧‧‧Circular groove

5e3, 5e5 ‧‧‧ suction hole

5e4 ‧‧‧ film suction groove

5e6‧‧‧‧Attraction

5f‧‧‧ promote sales

5h‧‧‧Edge

5i‧‧‧brake

5j‧‧‧Lower mold sleeve

5k, 7b2‧‧‧sealing material

5m‧‧‧Step

5n‧‧‧Lower mold lock block

5p‧‧‧ Lower die adjustment pin

5r‧‧‧ down template

6‧‧‧ Upper mold base

6a‧‧‧ Upper mold base

6b‧‧‧ Side of upper die base

6c‧‧‧ Upper mold space department

6d‧‧‧ Upper mold guide block

6e‧‧‧ Upper mold cover guide

6f‧‧‧step difference

6g, 7g ‧‧‧ hinge

7‧‧‧ Lower mold base

7a‧‧‧ Lower mold base

7b‧‧‧ Side of lower die base

7b1‧‧‧ suction hole for decompression

7c‧‧‧Die space department

7d‧‧‧Lower mold guide block

7e‧‧‧Lower mold sleeve guide

7f‧‧‧step difference

W‧‧‧ Workpiece

8‧‧‧ adjustment agency

8a‧‧‧pin suspension board

8b‧‧‧ hanging pin

8c‧‧‧pin hole

8d‧‧‧Pressed against the board

9‧‧‧ sheet film

10‧‧‧ overflow cavity

10a‧‧‧Float

10b‧‧‧Link board

11, 13‧‧‧ drive mechanism

11a, 13a, 14f, 21a‧‧‧Servo motor

11b, 13b, 21b‧‧‧ Power Transmission Department

12‧‧‧ movable link plate

14‧‧‧ wedge mechanism

14a‧‧‧movable sliding plate

14b‧‧‧ wedge

14c‧‧‧conical surface

14d‧‧‧height adjustment plate

14e‧‧‧Screw shaft

15‧‧‧Stamping Department

16‧‧‧ Workpiece supply and storage section

17‧‧‧Workpiece transfer mechanism

18‧‧‧ Film Resin Supply Department

19‧‧‧Resin transfer mechanism

R‧‧‧ granular resin

20‧‧‧Press Machine Driving Mechanism

20a‧‧‧Stamp base

20b‧‧‧Guide Post

20c‧‧‧Fixed platform

20d‧‧‧mobile platform

20e‧‧‧Intermediate platform

FIG. 1 is a front cross-sectional explanatory view of a compression-molding mold for mold opening.

FIG. 2 is a partially cutaway explanatory view of the upper die of FIG. 1. FIG.

FIG. 3 is a side cross-sectional explanatory view of the upper mold of FIG. 2.

Fig. 4 is a plan view of the upper mold of Fig. 2 as viewed from the clamping surface side.

FIG. 5 is a cross-sectional explanatory view of the lower die of FIG. 1.

FIG. 6 is an explanatory side sectional view of the lower die of FIG. 5. FIG.

FIG. 7 is a plan view of the lower mold of FIG. 5 viewed from the clamping surface side, and is a partial cross-sectional view showing a state of the lower mold cavity member and the lower mold movable holder before and after the mold is closed.

FIG. 8 is a front cross-sectional explanatory view of a closed state of the compression molding die of FIG. 1. FIG.

FIG. 9 is a front sectional explanatory view of a mold base and a sectional explanatory view of a mold sleeve unit taken out from the mold base.

FIG. 10A is a front sectional explanatory view showing a state before and after the mold sleeve unit is removed from the mold base, and FIG. 10B is a side sectional explanatory view of the mold sleeve unit removed from the mold base.

FIG. 11A is a front cross-sectional view of a compression molding die of another example, and FIG. 11B is a plan view of a lower die viewed from a clamping surface side.

FIG. 12 is a front sectional explanatory view of a compression molding die in the case of compression-molding a large-sized workpiece.

FIG. 13 is a side cross-sectional explanatory view of a compression molding die in the case of compression-molding a large-sized workpiece in another example of FIG. 12.

FIG. 14A is a plan view viewed from the clamping surface side of an upper mold for molding a rectangular substrate, and FIG. 14B is a plan view viewed from the clamping surface side of a lower mold.

FIG. 15A is a plan view viewed from the clamping surface side of an upper mold for molding a circular substrate, and FIG. 14B is a plan view viewed from the clamping surface side of a lower mold.

FIG. 16 is a front cross-sectional explanatory view of a compression molding die of another example.

FIG. 17 is an explanatory front sectional view of a compression molding die according to another example.

FIG. 18 is a front cross-sectional explanatory view of a compression molding die in the case of performing compression molding on a strip substrate.

FIG. 19 is a front cross-sectional explanatory view of a compression-molding mold in a case where three strip substrates are compression-molded.

20A is a front sectional explanatory view showing another example of the adjustment mechanism provided in the upper mold, and FIG. 20B is a side sectional explanatory view of the adjustment mechanism.

21 is a plan layout diagram showing an example of a resin molding apparatus using a compression molding die.

FIG. 22 is an explanatory diagram showing another example of a compression molding apparatus.

FIG. 23 is an explanatory diagram showing another example of the compression molding apparatus subsequent to FIG. 22.

FIG. 24 is an explanatory diagram showing another example of a compression molding die.

FIG. 25 is an explanatory diagram showing another example of a compression molding die.

Hereinafter, an embodiment for implementing the invention will be described in detail with reference to the attached drawings. In addition, when it is called a mold holder unit, it refers to a person who integrally assembles the cavity recessed part or the mold member which comprises a workpiece | work holding part. In addition, when it is called a compression molding die, it means that the die set unit is integrally assembled in a die base, and the die opening and closing mechanism is removed.

[First embodiment]

FIG. 1 is a compression molding die 1 which compressively shapes a plurality of workpieces W, and has the following configuration. In addition, it is assumed that the workpiece W is a rectangular strip substrate (lead frame, metal substrate, ceramic substrate, resin substrate, etc.). It is assumed that the size of the workpiece W is approximately 100 mm × 300 mm (hereinafter referred to simply as "the workpiece W").

The compression molding die 1 includes an upper die 2 (first die) and a lower die 3 (second die). The upper die 2 includes an upper die set unit 4 (a first die set unit) having a workpiece holding portion 2a that holds a workpiece W, and a lower die having a lower cavity cavity 3a for supplying a lower mold resin to the lower die 3. The mold sleeve unit 5 (the second mold sleeve unit) is arranged in a plurality of opposite directions.

Further, the upper mold holder 6 (the first mold holder) has a plurality of positions (two positions in FIG. 1), and the upper mold cover units 4 are arranged side by side in a horizontal direction. A plurality of locations (two locations in FIG. 1) of the lower mold base 7 (second mold base) are provided with the lower mold sleeve units 5 arranged side by side in a horizontal direction. The upper die set unit 4 and the lower die set unit 5 are respectively arranged to face each other. Upper mold The seat 6 is provided to adjust the deviation of the plate thickness of the workpiece W held by the plurality of workpiece holding portions 2a (both the difference in the plate thickness of each workpiece W and the difference in the thickness and inclination of a part within the plane of one workpiece. The following It is collectively referred to as "deviation".) Or the deviation of the mold height of the plurality of upper mold set unit 4 and lower mold set unit 5 during clamping (in addition to the aforementioned "deviation", it also includes the cavity 3a supplied to the lower mold cavity. The difference in mold height caused by the difference in the amount of resin is only called "deviation." The adjustment mechanism 8 (a mechanism for making the total height of a plurality of molds the same, even for one mold can adjust the aforementioned deviation. Workpiece W, hereinafter referred to as "adjustment mechanism 8"). Regarding the result of the deviation adjustment of the mold height using the adjustment mechanism 8, the total mold height after compression molding by using a plurality of molds used for compression molding can also be aligned to avoid tilting of the stamping mechanism.

According to the above configuration, the molding resin is supplied to the lower mold cavity recesses 3 a provided on the plurality of lower mold holder units 5 provided side by side to the lower mold holder 7, and the workpiece W can be maintained in the upper mold while being maintained. The mold holder 6 is closed in a state of a plurality of workpiece holding portions 2a provided on the upper mold set unit 4 arranged side by side, and compression molding is performed for each workpiece W.

At this time, when there is a variation in the thickness of the plurality of workpieces W or a variation in the mold height when the mold is clamped due to the difference in the amount of resin supplied, it is because the The upper die set unit 4 and the lower die set unit 5 arranged oppositely are adjusted, so that the thickness of the resin sealing portion (encapsulation portion) can be compression-molded with high accuracy.

In addition, since the upper mold base 6 and the lower mold base 7 are provided with a plurality of mold sleeve units in a single layer, by ensuring the thickness of the mold base, the bending rigidity is high and the heat capacity is large, so the temperature during the molding cycle can be suppressed Variety.

Moreover, even if the upper die set unit 4 or the lower die set unit 5 is exchanged due to tool replacement, since the adjustment mechanism 8 provided in the upper die set 6 can be shared, the versatility is improved.

The adjusting mechanism 8 is arranged between the upper mold base 6 and the upper mold sleeve unit 4. Therefore, even if the upper mold set unit 4 is replaced, the adjustment mechanism 8 can still be used as usual. As an example of the adjustment mechanism 8, a spring unit is provided that biases the upper mold set unit 4 in the mold opening and closing direction with respect to the upper mold holder 6. Thereby, the deviation of the mold height of the mold sleeve unit of the mold set unit in which a plurality of horizontally arranged side by side (an arrangement form in which other workpieces are arranged next to each other so that the long sides of the workpieces become parallel) can be adjusted by a simple configuration.

Here, a configuration example of the upper mold 2 and the lower mold 3 constituting the compression molding mold 1 will be specifically described. A configuration example of the upper mold 2 will be described with reference to FIG. 2. The upper mold base 6 includes: a rectangular plate-shaped upper mold base portion 6a (first base portion); and a rectangular frame-shaped upper mold base side portion 6b (first Base side). An upper die guide block 6d (first guide block) is provided on the upper die base portion 6a to partition the upper die space portion 6c (first die space portion) surrounded by the upper die base side portion 6b. Each of the upper die space portions 6c (see FIG. 9) defined by the upper die guide block 6d is provided with an adjustment mechanism 8.

At the lower end portion of the upper die guide block 6d, upper die sleeve guides 6e (first die sleeve guides) are provided adjacent to each other. The stepped portions 6f of the upper die set unit 4 are inserted between the upper die guide block 6d and the upper die set guide 6e (between the continuous wall surfaces), and are formed on both sides. The pair of step portions 6f can be used as guide rails to insert and remove the upper die set unit 4 as described later.

As shown in FIG. 10B, the upper mold base portion 6a and the upper mold base side portion 6b are rotatably connected through a hinge 6g on an adjacent side surface (the inner side of the upper mold sleeve unit insertion / removal direction). When the upper mold set unit 4 is exchanged, the front end portion of the upper mold base side portion 6b and the upper mold base portion 6a can be separated from the upper mold base portion 6a and centered on the hinge 6g in a predetermined direction (the counterclockwise direction of FIG. 10B ) Spin. Thereby, the upper die set unit 4 can be pulled out to the front side using the stepped portion 6f as a guide for replacement. In addition, since the upper die set units 4 arranged in parallel on the upper die set 6 can be inserted and removed from the upper die set 6 independently, the workability of maintenance is good. In addition, a link member (not shown) that restricts the opening angle of the upper mold base portion 6a is preferably connected between the upper mold base portion 6a and the upper mold base side portion 6b. The upper mold base side portion 6b, which is formed only in a rectangular frame, may be connected to the upper mold base portion 6a through a hinge (clockwise in FIG. 10B). In this case, the upper die set unit 4 is pulled out in the insertion / removal direction.

In addition, although the configuration in which the mold sleeve unit is inserted and removed laterally on the back side and the front side is exemplified, it is not necessarily limited to the horizontal slide insertion and removal, as long as the mold base and the mold sleeve unit can be attached and detached in a vertical direction.

In addition, the upper mold guide block 6d and the upper mold sleeve guide 6e that partition the middle portion (the middle portion in FIG. 2) of the upper mold space portion 6c can also be provided to be able to be attached to and detached from the upper mold base portion 6a. As a result, as shown in FIGS. 12 and 13 described later, even if the workpiece W is a large-sized substrate, only the upper die set unit 4 is replaced, and the upper die holder 6 and the adjustment mechanism 8 can still be shared.

In FIGS. 2 and 9, a configuration example of the adjustment mechanism 8 will be described. A pin suspension plate 8a is provided on the upper mold base portion 6a. On sale The suspension plate 8a and a plurality of suspension pins 8b are inserted into pin holes 8c provided at equal intervals in the left-right direction (see FIG. 2) and the front-rear direction (see FIG. 3) to lock the pin head portions 8b1 (upper end portions). A front end portion 8b2 (lower end portion) of each suspension pin 8b is connected to the pressing plate 8d. Coil spring (As long as it is an elastic body, the coil spring is not particularly limited.) 8e is compressed from a free length and inserted between each pin suspension plate 8a and the pressing plate 8d. Thereby, the pressing plate 8d and the suspension pin 8b are always offset vertically downward. The left and right end surfaces of the pressing plate 8d are guided by the upper die guide block 6d and maintain parallelism.

A configuration example of the upper die set unit 4 will be described with reference to FIGS. 2 to 4.

The upper die set unit 4 includes an upper die set plate 4a (first die set plate) at the upper end. This upper die set plate 4a is installed so as to overlap the lower surface of the pressing plate 8d of the adjustment mechanism 8. The outer dimensions of the upper mold sleeve plate 4a are the same as those of the pressing plate 8d, and the left and right end surfaces are raised and lowered while being guided by the upper mold guide block 6d while maintaining parallelism. An upper mold supporting block 4b larger than its outer dimension is provided on the lower surface of the upper mold cover plate 4a. The left and right end portions (first locking portions) of the upper mold support block 4b are maintained to be locked with the step portion 6f and are detachably assembled on the near side with respect to the upper mold guide block 6d (see FIG. 2). On the lower surface of the upper mold support block 4b, an upper mold plate 4c smaller than the outer dimension is superposed. As shown in FIG. 4, the suction holes 2 b serving as the workpiece holding portion 2 a in the central portion of the lower surface of the upper die plate 4 c are perforated at a plurality of locations along the outer peripheral edge portion of the workpiece. The chuck claws 4d are rotatably provided at a plurality of locations (for example, six locations in FIG. 4) around the workpiece holding portion 2a of the upper die plate 4c.

In FIG. 2, the chuck claw 4d is formed in an L shape in which the horizontal portion 4d1 and the vertical portion 4d2 are continuous. The middle portion of this horizontal portion 4d1 is assembled on the upper mold support block 4b so as to be rotatable about the fulcrum 4e. Near the end of the horizontal portion 4d1, a coil spring 4f is installed so as to be compressed from a free length between the coil spring 4f and the upper mold plate 4a. Moreover, the horizontal part 4d1 is integrally provided with the push pin 4g which penetrates the upper template 4c. Since the horizontal portion 4d1 is always biased downward by the coil spring 4f, the front end portion of the push pin 4g protrudes downward from the clamping surface of the upper template 4c. In addition, at the lower end of the vertical portion 4d2, the locking portion 4d3 is formed toward the inside of the outer peripheral edge portion of the workpiece. The chuck claw 4d is biased toward the outer peripheral edge portion of the workpiece W by the vertical portion 4d2 with the fulcrum 4e as the center by the rebound of the coil spring 4f. Therefore, each of the locking portions 4d3 is in a state where it can be held while each of the locking portions 4d3 enters below the outer peripheral edge portion of the workpiece W. In the case where the chuck claw 4d is released to remove the work W, the push pin 4g may be pushed in against the potential energy of the coil spring 4f. Further, a film push pin 4h is protruded on the outer peripheral side of the workpiece holding portion 2a of the upper die plate 4c. The film push pin 4h is provided with a coil spring 4i between the film push pin 4h and the upper mold sleeve 4a so as to be compressed from a free length. Thereby, the front-end | tip part of the film push pin 4h is protruded downward from the clamping surface of the upper template 4c. As described later, the film push pin 4h is provided to flatten the excess amount of the sheet-like film 9 that is sucked and held while covering the clamping surface of the lower mold 3.

Next, a configuration example of the lower mold 3 will be described.

The lower mold base 7 in FIG. 5 includes: a rectangular plate-shaped lower mold base portion 7a (second base portion); and a rectangular frame-shaped lower mold base side provided along the outer peripheral edge portion of the lower mold base portion 7a. 7b (second base side portion). in The lower mold base portion 7a is provided with a lower mold guide portion 7d (second guide block) erected to partition the lower mold space portion 7c (second mold space portion: see FIG. 9) surrounded by the lower mold base side portion 7b. The lower die set unit 5 is detachably assembled in the lower die space portion 7c (see FIG. 9) defined by the lower die guide block 7d.

In FIG. 5, lower die guides 7e (second die guides) are provided adjacent to the upper ends of the lower die guide blocks 7d, respectively. The stepped portions 7f of the lower die set unit 5 are inserted and removed between the lower die guide block 7d and the lower die set guide 7e (between the continuous wall surfaces) (see FIG. 9). The lower die set unit 5 can be inserted and removed by using the pair of step portions 7f as guide rails. A pressure-reducing suction hole 7b1 is provided in the side wall of the lower mold base side portion 7b, and is connected to an air suction mechanism (not shown). Further, a sealing material 7b2 (such as an O-ring) is provided on the mold opening and closing surface of the lower mold base side portion 7b to abut the opposing surface of the upper mold base side portion 6b to seal the mold space when the mold is closed.

As shown in FIG. 10B, the lower mold base portion 7a and the lower mold base side portion 7b are rotatably connected through a hinge 7g on an adjacent side surface (the lower side of the lower mold sleeve unit insertion direction). When the lower die set unit 5 is exchanged, the insertion and removal direction of the lower die base side portion 7b can be separated from the lower die base portion 7a to the predetermined direction with the center of the hinge 7g (the clockwise direction in FIG. 10B). Spin. Therefore, the lower die set unit 5 can be pulled out to the front side using the step portion 7f as a guide for replacement. In addition, since the lower die set units 5 arranged in parallel to the lower die set 7 can be inserted and removed from the lower die set 7 independently, maintenance workability is excellent. In addition, it is preferable that a link member (not shown) that restricts the opening angle of the lower mold base side portion 7b is connected between the lower mold base portion 7a and the lower mold base side portion 7b. Again, only formed The front-side side surface portion of the rectangular frame-shaped lower mold base side portion 7b is connected to the lower mold base portion 7a via a hinge (counterclockwise around the clockwise direction in FIG. 10B). In this case, the lower die set unit 5 is pulled out in the insertion / removal direction.

In addition, the lower die guide block 7d and the lower die sleeve guide 7e that partition the middle portion (the middle portion in FIG. 5) of the lower die space portion 7c may be provided to be able to be attached to and detached from the lower die base portion 7a. By this, as shown in FIGS. 12 and 13 described later, even if the workpiece W is a large (wide) size substrate, only the lower mold set unit 5 is replaced with the upper mold set unit 4 and the lower mold base 7 remains. Can be shared.

A configuration example of the lower die set unit 5 will be described with reference to FIGS. 5 to 7.

The lower die set unit 5 includes a lower die base plate 5a at a lower end portion. The lower mold base plate 5a is superposed on the upper surface of the lower mold base portion 7a. The lower die base plate 5a is guided by the lower die guide blocks 7d with the left and right end faces, and is installed in a pluggable manner from the near side in FIG. 5 while maintaining parallelism. A plurality of support pillars (pillars) 5b are formed on the upper surface of the lower mold base plate 5a and in the vertical downward projection plane of the lower mold cavity piece 5d. Thereby, warping of the lower mold cavity member 5d is prevented, and at the same time, the clamping pressure can be finely adjusted by changing the configuration of the supporting column 5b or changing the thickness of the configuration. Thereby, TTV (Total Thickness Variation) can be improved when compression-molding a large-sized (wide) workpiece W such as a panel exceeding 300 mm × 300 mm or a semiconductor wafer having a diameter of 300 mm. The large (wide) dimension refers to a substrate whose width is wider than a long strip substrate of about 100 mm × 300 mm, and is not necessarily rectangular.

A support plate 5c is supported on the support post 5b. The support plate 5c is provided in the same manner as the lower mold base plate 5a so that the left and right end surfaces are guided by the lower mold guide blocks 7d. The lower mold cavity member 5d is laminated and supported on the upper center portion of the support plate 5c. The lower mold cavity member 5d constitutes the bottom of the lower mold cavity recess 3a. Around the lower mold cavity member 5d, a lower mold movable holder 5e constituting a side portion of the lower mold cavity recessed portion 3a is supported so as to be movable in the mold opening and closing direction. Specifically, the push pin 5f penetrates the support plate 5c and is pressed against the lower surface of the lower mold movable holder 5e. The push pin 5f is compressed from a free length and inserted into the coil spring 5g between the lower die base plate 5a so that the edge portion 5h having a larger diameter than the push pin 5f is always pressed against the lower surface side of the support plate 5c. Therefore, the upper end of the push pin 5f protrudes from the support plate 5c and is in a state of always biasing the lower mold movable holder 5e upward. In addition, the lower mold cavity member 5d may be directly supported by the support post 5b without the support plate 5c interposed therebetween as described later.

Although the clamping in this embodiment exemplifies the case where the workpiece W is clamped by the workpiece holding portion 2a and the movable clamper 5e, the case of the full package mold is the suction hole 2b of the workpiece holding portion 2a. The case where the workpiece W is sucked and held, and the upper mold plate 4c is clamped by the lower mold movable holder 5e without directly clamping the workpiece W, that is, even when the entire outer side of the workpiece W is resin-molded in a plan view. This is called clamping.

A rectangular frame-shaped lower mold sleeve plate 5j (second mold sleeve plate) is provided so as to surround the outer peripheral side of the lower mold movable holder 5e. The lower mold cover plate 5j is laminated and supported on the support plate 5c. The gap between the lower mold movable holder 5e and the lower mold sleeve 5j is through a sealing material 5k (e.g., O-ring, etc.) seal. The lower mold movable holder 5e is provided to guide the inner peripheral side to the lower mold cavity member 5d and to raise and lower while guiding the outer peripheral side to the lower mold sleeve plate 5j.

A step portion 5m (a second locking portion) corresponding to the step portion 7f is formed on the outer peripheral surface side of the lower die set plate 5j. The step portion 7f is formed as shown in FIG. 9 described above, and the lower die guide block 7d having a narrow width is connected to the lower die cover guide 7e having a wider width. The stepped portion 5m is formed along the left and right side surfaces such that the clamping surface side becomes narrower along the stepped portion 7f. The lower die set unit 5 can be inserted into and removed from the lower die set 7 using the step portion 7f opposite to this stepped portion 5m as a guide. In addition, a clearance is provided between the upper die set unit 4 and the upper die set 6 and between the lower die set unit 5 and the lower die set 7 for inserting and removing each unit. Therefore, when the upper mold set unit 4 and the upper mold set 6 and the lower mold set unit 5 and the lower mold set 7 are provided with a locking mechanism for eliminating clearance in the height direction in the installed state, good.

As shown in FIG. 7A, the withdrawal grooves 5e1 are provided at a plurality of positions in the peripheral direction of the clamping surface of the lower mold movable holder 5e so as to avoid interference with the locking portion 4d3 of the chuck claw 4d from the inner peripheral side. Further, as shown in FIG. 7A, an annular groove 5e2 connected to the withdrawal groove 5e1 and provided with a slack amount of a sheet-like film (release sheet) 9 (see FIG. 7B) is provided around the periphery of the withdrawal groove 5e1. Suction holes 5e3 are provided at a plurality of locations in the peripheral direction of the bottom of the annular groove 5e2. The annular groove 5e2 does not necessarily need to be connected like a stroke, and the suction groove 5e3 may be sufficient, and it may be partially divided. In addition, a film suction groove 5e4 that adsorbs and holds the outer peripheral edge portion of the sheet-shaped film 9 is provided around the outer peripheral side of the annular groove 5e2. Multiple locations in the direction around the bottom of the film suction groove 5e4 A suction hole 5e5 is provided. Although only the suction holes 5e5 may be provided for achieving the film adsorption, the combination of the film suction grooves 5e4 and the suction holes 5e5 can be more reliably realized. The thin film suction groove 5e4 does not necessarily need to be connected in one stroke, and the suction hole 5e5 may be provided, or it may be partially divided. The suction holes 5e3 and 5e5 are connected to an air suction mechanism (not shown).

As shown in FIG. 7B, the sheet-like film 9 is supplied to the lower mold clamping surface covering the lower mold cavity recessed portion 3a and is attracted by the film suction groove 5e4 formed on the outermost periphery of the clamping surface of the lower mold movable holder 5e. The suction holes 5e5 are adsorbed and held. The sheet-like film 9 is sucked and held along the suction path 5e6 provided on the outer periphery of the bottom of the lower cavity cavity 3a (the outer periphery of the lower cavity member 5d). When the mold is closed in this state, the film pushing pin 4h protruding downward from the upper template 4c will enter the opposite annular groove 5e2. At this time, the film push pin 4h presses the slack of the sheet-like film 9 into the annular groove 5e2 by the potential energy of the coil spring 4i (refer to FIG. 2), and is attracted by the suction hole 5e3 to be accommodated. In addition, the locking portion 4d3 (see FIG. 2) that holds the chuck claws 4d of the outer peripheral edge portion of the workpiece W is prevented from being accommodated in the opposite withdrawal groove 5e1 (see FIG. 7A) and the lower mold movable holder. 5e interference. In addition, since the sheet-like film 9 is attracted to the suction hole 5e3 in the annular groove 5e2, the sheet-like film 9 attached to the molded product is attracted to the lower mold 3 when the mold is opened, and the mold is smoothly released. At this time, because the film push pin 4h presses the sheet film 9 toward the lower mold 3 by the deflection of the coil spring 4i, the sheet film 9 can be held until the film push pin 4h leaves the lower mold 3, making it more difficult to produce Poor peeling structure. Sheet film (release sheet) 9 is, for example, those having a thickness of about 50 μm and having heat resistance, which are easy to peel off from the mold surface and are flexible and stretchable. For example, PTFE, ETFE, PET, FEP film, fluorine-containing Single-layer or multiple-layer film with glass cloth, polypropylene film, polyvinylidene chloride as the main component.

In this way, when the sheet-like film 9 covering the lower mold clamping surface containing the lower mold cavity recessed portion 3a is pressed and held by the mold sleeve unit 5, the lower film clamping surface including the lower mold cavity recessed portion 3a is adsorbed and held. It is easy to handle during holding, and can also avoid the wasteful use area that is not related to compression molding, such as a long film.

In FIG. 4, the upper die lock blocks 4j (first lock blocks) are protruded at four locations on the clamping surfaces in the center of the four edge portions forming the rectangular upper template 4c. In FIG. 7A, a pair of lower die lock pieces 5n (second lock pieces) are formed on the clamping surface or the lower die sleeve plate 5j in the center of the four edge portions of the rectangular lower die movable holder 5e. It is projected in four pairs in two pairs. The upper mold lock block 4j and the opposing lower mold lock block 5n are arranged so as to be engaged with each other by concave-convex fitting. Thereby, the upper mold plate 4c on which the workpiece holding portion 2a is formed and the lower mold movable holder 5e or the lower mold sleeve plate 5j forming the lower mold cavity recess 3a can be aligned and closed for each mold mold unit. . In addition, the shapes of the upper mold lock block 4j and the lower mold lock block 5n can be swapped in pairs.

In FIG. 9, the upper mold adjustment pin 4k (see FIG. 2) and the lower mold are protruded at the opposite positions of the upper mold plate 4c of the upper mold sleeve unit 4 and the lower mold sleeve plate 5j of the lower mold sleeve unit 5, respectively. Adjustment pin 5p (refer to FIG. 5) (leveling mechanism). The upper die adjustment pin 4k is supported by the upper die set plate 4a, penetrates the support block 4b and the upper die plate 4c, and is protruded downward from the upper die clamping surface. In addition, the lower die adjustment pin 5p is supported by the lower die base plate 5a through the lower coil base plate 5a, penetrates the support plate 5c and the lower die sleeve plate 5j, and protrudes upward from the lower die clamping surface.

As shown in FIG. 4, a plurality of upper die adjustment pins 4k are provided along the edge portion of the long side of the upper die plate 4c at equal intervals (four each, eight on the left and right sides). Further, as shown in FIG. 7A, a plurality of lower die adjustment pins 5p are provided along the edge portion of the long side of the lower die sleeve plate 5j at equal intervals (four each, eight on the left and right sides). The number of the upper die adjustment pin 4k and the lower die adjustment pin 5p is arbitrary and may be provided on the short side. The upper and lower adjustment pins 4k and 5p are arranged at the same position in a plan view.

The upper die adjustment pin 4k protruded from the upper die plate 4c and the lower die adjustment pin 5p protruded from the lower die die plate 5j are disposed to face each other. Therefore, when the mold is closed, the upper mold adjustment pins 4k and the lower mold adjustment pins 5p facing each other collide before the mold surface, and the deflection of the pressing force is absorbed by the flexure of the coil spring 5q, so the alignment is corrected. The clamping surfaces of the upper mold set unit 4 and the lower mold set unit 5 are arranged parallel to each other, and then the mold surfaces can be brought into plane contact, so partial contact can be prevented.

Here, the operation of the adjustment mechanism 8 will be described with reference to FIG. 8. As an example, the left half of FIG. 8 shows the mold clamping state when the workpiece plate thickness is thinner than the normal workpiece W or the resin amount of the molding resin is small. In addition, the right half of FIG. 8 shows the mold clamping state when the workpiece plate thickness is thicker than the normal workpiece W or the resin amount of the molding resin is large.

In the case of the left half of FIG. 8, the thickness of the workpiece is thinner than that of a normal workpiece W or the amount of resin supplied relative to the target resin amount of the molding resin (the amount of resin that becomes the appropriate final package thickness after molding). Or both. In this case, the coil spring 8e between the insertion pin suspension plate 8a and the pressing plate 8d is in a rebound state. The deflection of the spring 8e absorbs variations in the plate thickness of the workpiece W. In addition, when the amount of the molding resin is small, the upper plate 4c that sucks and holds the work W resists the potential energy of the coil spring 5g and presses the lower mold movable holder 5e. Thereby, the relative height position of the lower mold movable holder 5e to the lower mold cavity member 5d is determined in accordance with the thickness of the workpiece W and the amount of resin supplied to the cavity recess 3a, so that the workpiece W can be absorbed. When the plate thickness t1 is thin or the deviation t2 of the amount of resin supplied to the cavity recessed portion 3a. Such an adjustment operation is performed by the upper mold set unit 4 and the lower mold set unit 5 provided in plural (two parts in this embodiment).

In the case of the right half of FIG. 8, the thickness of the workpiece is thicker than that of the workpiece W in the left half or the amount of resin supplied with respect to the target resin amount of the molding resin (the amount of resin that becomes the appropriate final package thickness after molding). many. Or, in cases where the difference between the right and left is large, there may be both cases. In this case, the height position of the pushing pin 4g biased by the coil spring 4f in the upper die set unit 4 causes an error t3. However, the coil spring 8e inserted between the pin suspension plate 8a and the pressing plate 8d is compressed, and the suspension pin 8b is pressed back, so that the head 8b1 is slightly separated from the pin suspension plate 8a by the gap t4. The deflection of 8e absorbs the variation in the thickness of the workpiece W.

Further, in the lower die set unit 5, the height position of the push pin 5f changes only t5 due to the potential energy of the coil spring 5g, and the lower die movable holder 5e is in a state where a plurality of detached gaps t6 are generated from the support plate 5c. In this way, the relative height position of the lower mold movable holder 5e to the lower mold cavity member 5d is determined uniformly in accordance with the amount of resin supplied to the cavity recessed portion 3a. Thereby, the deviation of the resin thickness t7 is absorbed.

As described above, the mold height during pinching (pin suspension in FIG. 8) caused by variations in the plate thickness of the workpiece W in the plurality of compression molding dies 1 or variations in the amount of resin supplied to the cavity recess 3a, etc. The deviation of the distance between the plate 8a and the lower mold base plate 5a can be absorbed by the offset mechanism or the adjustment mechanism 8 of the lower mold movable holder 5e. Such a deviation adjustment operation of the mold height is performed by the upper mold set unit 4 and the lower mold set unit 5 provided in a plurality of positions (two positions in this embodiment) in a horizontal arrangement.

In addition, since the adjusting mechanism 8 provided on the upper mold base 6 is provided as a mold sleeve unit, the left and right mold sleeve units are not only the left half of FIG. 8 (the thickness of the workpiece W is thin and the resin is supplied). The case where the amount is less than the target resin amount) and the right half of FIG. 8 (the case where the plate thickness of the workpiece W is thick and the supplied resin amount is more than the target resin amount) may be the opposite case, even in the case of The left side is when the plate thickness of the workpiece W is thick and the amount of resin supplied is small, and the right side is when the plate thickness of the workpiece W is thin and the amount of resin supplied is large. It can also be adjusted without the mold tilting. Thereby, since the total height of the plurality of dies can always be constant, the thickness of the resin sealing portion (package) can be compression-molded with high accuracy without the pressing surface being inclined.

As described above, even if there is a deviation in the heights of the mold opening and closing directions of the upper mold 2 and the lower mold 3 due to variations in the plate thickness of the plurality of workpieces W or variations in the amount of resin supplied to the lower mold cavity recesses 3 a, By the adjustment mechanism 8 provided by the upper mold die set unit 4 arranged side by side on the upper mold die holder 6, the deviation of the mold height between the upper mold 2 and the lower mold 3 when the mold is clamped is adjusted according to the workpiece W, so that it can Compression with high precision shape. In addition, in FIG. 8, the two upper mold set units 4 are arranged side by side on the upper mold base portion 6 a in parallel. Therefore, the adjustment mechanism 8 is also arranged in two lateral arrangements in cooperation with it. The upper mold base portion 6a and the upper mold sleeve unit 4 may be interposed therebetween. In this case, a spacer may be interposed in the other upper mold 2 instead of the adjustment mechanism 8. In the case where three or more upper die set units 4 are provided on the upper die set 6, it is preferable that the adjustment mechanism 8 is one less than the number of the die set units and independently mounted on the upper die base portion 6a. In this case, the height of the remaining upper die set unit 4 provided with the adjustment mechanism 8 is adjusted to match the height of the fixed upper die set unit 4. In addition, a fixed height support block or the like may be provided between the upper mold base portion 6a on the fixed side and the upper mold sleeve unit 4.

When the mold is exchanged in accordance with the type of the workpiece W, as shown in FIG. 10A and FIG. 10B, the compression molding mold 1 is opened, and the upper mold base portion of the upper mold base 6 6a is a hinge 6g on the back side as a center, and the upper mold base side portion 6b is pressed down and rotated by a predetermined amount. At this time, as shown in FIG. 10A, in the step portion 6f formed by the upper mold guide block 6d and the upper mold sleeve guide 6e hanging down from the upper mold base portion 6a, each upper mold sleeve unit 4 is The left and right end portions of the support plate 4b are each held in a state of being fitted with unevenness. In this state, as shown in FIG. 10B, the step portion 6 f can be pulled out as a guide to the front side by the upper die set unit 4 to be exchanged with other upper die set units 4. FIG. 9 shows the upper mold sleeve unit 4 taken out from the upper mold holder 6.

In the state in which the compression molding die 1 is opened, as shown in FIGS. 10A and 10B, the lower die base 7 is lower than the lower die base 7. The portion 7a is also pivoted on the back side by a hinge 7g, and the lower mold base side portion 7b is rotated upward by a predetermined amount from the front side. At this time, as shown in FIG. 10A, each of the lower mold set units 5 is respectively held in a state where the step portions 5m on the left and right ends of the lower mold set plate 5j are unevenly fitted to each other by being erected on the lower mold base. The step portion 7f formed by the lower die guide block 7d and the lower die sleeve guide 7e of the portion 7a. In this state, as shown in FIG. 10B, the die set unit 5 can be pushed down and the stepped portion 7f can be pulled out as a guide to the front side to exchange with other lower die set units 5. FIG. 9 shows the lower die set unit 5 taken out from the lower die set 7.

In this way, in the case of mold exchange, the upper mold base 6 and the adjustment mechanism 8 and the lower mold base 7 can be used without being exchanged, so the versatility is high, and tools can be quickly replaced or repaired. The upper mold base 6 and the lower mold base 7 are such that the upper mold base portion 6a and the upper mold base side portion 6b pass through the hinge 6g on the back side, and the lower mold base portion 7a and the lower mold base side portion 7b pass through the back hinge 7g. Since each is rotatably connected, the upper mold set unit 4 and the lower mold set unit 5 can be easily pulled out from the front side of the mold, and exchange operations can be easily performed.

[Second embodiment]

11A and 11B illustrate another configuration example of the compression molding die 1. The same components as those of the compression molding die 1 disclosed in the first embodiment are given the same reference numerals and the descriptions are referred to. The following description will focus on different configurations.

A plurality of semiconductor wafers are mounted on the workpiece W. However, for example, if a defect occurs in the wafer mounting portion, a semiconductor may occur on the workpiece W. The defective part of the wafer. In this case, although it is sufficient to accurately measure the number of defects of the semiconductor wafer for each workpiece W and change the amount of resin to be supplied, it takes time and labor, and it is necessary to supply the resin by precise measurement. Therefore, in this embodiment, an overflow cavity to be described later is provided, so that the mold resin can be adjusted even if the supply amount of the molding resin is not necessarily uniform.

As shown in FIG. 11A, a high-level step surface 5d1 at the bottom of the cavity is provided around the outer peripheral edge portion of the upper side of the lower mold cavity member 5d provided in each of the lower mold cavity units 5, and is provided on the step surface 5d1. A plurality of overflow mold cavities 10 are provided. The overflow cavity 10 stores (absorbs a variation in the amount of resin) the excess amount of the molding resin supplied to the lower mold cavity recess 3a. Therefore, the amount of resin supplied to the lower mold cavity recessed portion 3a needs to be supplied to the overflow mold cavity more than the amount of resin required for the thickness of the final package portion.

As shown in FIG. 11A, a plurality of through holes 5d2 are provided in the step portion 5d1 of the lower mold cavity member 5d. The floating member 10a is inserted into each of the through holes 5d2 so as to be vertically movable. Each of the floating members 10a is supported by being erected on the upper surface of the connection plate 10b arranged in a horizontal posture between the lower mold base plate 5a and the support plate 5c. Each floating member 10a is a through hole 5d2 that penetrates the support plate 5c and is inserted into the lower mold cavity member 5d. A coil spring 10c is provided between the connecting plate 10b and the lower mold base plate 5a, and each floating member 10a is biased and supported upward by the connecting plate 10b. As shown in FIG. 11B, the overflow mold cavity 10 is formed by the upper end surface of each floating member 10 a and the hole wall surface of the through hole 5 d 2. In addition, the floating member 10a may have a block shape or an elongated pin shape. The shape of the end surface (planar surface) above each of the overflow mold cavities 10 may be rectangular or other shapes such as a circle.

Under the connecting plate 10b, a push pin 10d is projected vertically downward. The push pin 10d may penetrate the lower mold base plate 5a and the lower mold base 7 (lower mold base portion 7a) and be supported by a mold opening and closing mechanism (for example, a movable platen), which is not shown. Further, a lower end portion of the push pin 10d may be provided with, for example, a pressure sensor (such as a load cell). Accordingly, the resin pressure of the molding resin can be controlled in real time by directly measuring the resin pressure flowing into the overflow cavity 10 when the mold is closed by using a pressure sensor in real time. In addition, it is not necessary to push the pin 10d.

Further, as shown in FIG. 11A, a stopper 5i may be provided below the edge portion 5h of the push pin 5f supporting the lower mold movable holder 5e. The stopper 5i prevents the lower end of the stopper 5i from abutting against the base plate 5a when the lower die movable holder 5e is pressed by the upper die 2. The brake 5i is provided to define the lower limit position of the lower die movable holder 5e. Thereby, since the height of the cavity recessed part 3a of a lower mold | die is determined, the thickness of each sealing part (resin sealing part) which is compression-molded in several places can be managed uniformly.

Here, the behavior of the floating member 10a during the compression molding operation will be described with reference to FIG. 11A. Although the semiconductor wafer should normally be fully mounted on the workpiece W, in the previous process, the semiconductor wafer itself was found to be defective, and a part of the semiconductor wafer may not be mounted on the workpiece. That is, a part of the semiconductor wafer may be lacking. In addition, a semiconductor wafer defect or a semiconductor wafer defect occurs in the workpiece W, a part of the resin is dropped during the resin transfer, or for some reason, the amount of the molding resin supplied to the lower mold cavity recess 3a is less than the target resin amount. In the case of closing the mold 1 for compression molding, The potential energy of the spring 10c penetrates the support plate 5c and is inserted into each floating member 10a of the through hole 5d2 of the lower die cavity member 5d. The floating members 10a enter the lower die cavity recess 3a from the stepped portion 5d1 and are compressed and formed. The difference between the volume of the cavity of the lower mold and the amount of resin supplied to the molding resin is absorbed.

When the amount of molding resin supplied to the lower cavity cavity 3a of the workpiece W is larger than the target resin amount, the floating member 10a is depressed by the resin pressure against the potential energy of the coil spring 10c, and the excess resin is maintained to be When it is accommodated in the through hole 5d2, compression molding is performed. The difference between the volume of the cavity of the lower mold and the resin amount of the molding resin is absorbed.

In addition, since the molding thickness of the final package may be thin when the amount of resin is too small, it is preferable to adjust the reduction amount of each floating member 10a with the goal of initially supplying more resin than the target resin amount.

Therefore, even if the supply amount of the molding resin is accurately measured for each work W, it is possible to perform compression molding while keeping the thickness of the molded product constant. Moreover, since the recessed part or convex part formed in a molded product is located in the outer peripheral edge part of the workpiece | work W which is not related to a final product, it does not affect molding quality. In addition, since the floating member 10a is always biased toward the molding resin in the cavity recessed portion 3a, the resin pressure is applied to the molding resin in the cavity recessed portion 3a, and the void can be crushed to improve the molding quality. In addition, although the overflow cavity 10 is provided in the lower mold cavity part 5d, it may be provided in the clamping surface of the lower mold movable holder 5e.

[Modification]

Next, a description will be given of a deformation usage example of the compression molding die 1 of FIG. 1 corresponding to the workpiece W with reference to FIGS. 12 to 15. Figure 1 for compression molding The mold 1 is an example of a case where a workpiece W, for example, two pieces of 300 mm × 100 mm rectangular strip substrates are simultaneously compression-molded, and a workpiece W having a larger size than the workpiece W may be compression-molded one by one.

FIG. 12 and FIG. 13 are explanatory sectional views and side sectional views of a compression molding die in the case of compression-molding a large-sized workpiece. 1 shows the configuration of the upper die 2 shown in FIG. 1, the upper die guide block 6 c and the upper die sleeve guide 6 e provided at the middle portion of the upper die holder 6 are removed, and the upper die sleeve unit 4 is replaced with An embodiment for a large-sized workpiece W. In addition, it is shown that the lower die guide block 7d and the lower die sleeve guide 7e provided in the middle portion of the lower die holder 7 are removed from the configuration of the lower die 3 shown in FIG. 1, and the lower die sleeve unit 5 is replaced with An embodiment for a large-sized workpiece W. In this case, the upper mold base 6 and the adjusting mechanism 8 and the lower mold base 7 can be shared.

In the case of FIG. 12, since the pressing plate 8 d is cut and there are two adjustment mechanisms 8, even if the thickness of the workpiece W itself is slightly different from the left or right side, or the amount of resin supplied to the lower cavity cavity 3 a is slightly left and right. Depending on the supply, the adjustment mechanism 8 can adjust the mold height individually, as compared with the case where the pressing plate 8d shown in FIG. 13 is integrated.

14A and 14B are plan views of an upper mold 2 and a lower mold 3 when a large rectangular panel of, for example, 300 mm × 300 mm is subjected to compression molding as a workpiece W. FIG. In the upper die 2 in FIG. 14A, the chuck claws 4d are provided with the same number (for example, three locations) on each of the four sides of the workpiece W adsorbed by the upper die 4c. The upper die guide block 6 d and the upper die set guide 6 e are provided only at the left and right ends of the upper die holder 6. At the outer periphery of the upper template 4c, the upper die adjustment pins 4k are in a plurality of locations (for example, 4 on each side). Parts) protruding. The suction holes 2b of the plurality of workpieces W formed in the workpiece holding portion 2a are not shown.

In FIG. 14B, in the lower mold movable holder 5e of the lower mold 3, the withdrawal groove 5e1 corresponding to the chuck claws 4d of the upper mold 2 are provided with the same number (for example, three locations) around the recess 3a of the lower mold cavity. The lower die guide block 7 d and the lower die sleeve guide 7 e are provided only at the left and right end portions of the lower die holder 7. A plurality of locations (for example, four locations on each side) are protruded from the outer peripheral edge portion of the lower mold movable holder 5e at positions facing the upper mold adjustment pin 4k. In addition, the plurality of suction holes 5e5, the annular grooves 5e2, and the suction holes 5e3 provided in the bottom of the groove of the film suction groove 5e4 provided around the movable mold movable holder 5e are omitted from illustration.

15A and 15B show, for example, the diameter of the workpiece W A plan view of the upper mold 2 and the lower mold 3 when a 300 mm semiconductor wafer, a circular carrier, and a substrate are compression-molded. In the upper mold 2 in FIG. 15A, the chuck claws 4d are provided at regular intervals (for example, four positions staggered from each 90-degree phase) around the workpiece W attracted by the upper template 4c. The upper die guide block 6 d and the upper die set guide 6 e are provided only at the left and right ends of the upper die holder 6. On the outer peripheral edge portion of the upper die plate 4c, upper die adjustment pins 4k are protruded at a plurality of locations (for example, four locations on each side). The suction holes 2b in which a plurality of workpieces W are formed in the workpiece holding portion 2a are not shown.

In FIG. 15B, in the lower mold movable holder 5e of the lower mold 3, the withdrawal groove 5e1 corresponds to the chuck claws 4d of the upper mold 2 at equal intervals around the recess 3a of the lower mold cavity (e.g., four shifted by 90 degrees each) Parts) settings. The lower die guide block 7c and the lower die sleeve guide 7e are provided only on the lower side. The left and right ends of the die holder 7. On the outer peripheral edge portion of the lower mold movable holder 5e, the opposing positions of the upper mold adjustment pins 4k are protruded at a plurality of locations (for example, four locations on each side). In addition, the plurality of suction holes 5e5, the annular grooves 5e2, and the suction holes 5e3 provided in the bottom of the groove of the film suction groove 5e4 provided around the movable mold movable holder 5e are omitted from illustration. In addition, as the workpiece W, in addition to a circular semiconductor wafer, a circular carrier or substrate such as eWLB having a plurality of semiconductor wafers T die-bonded may be used.

As shown in FIG. 14 and FIG. 15, it may be a compression molding die 1 including an upper die 2 having a workpiece holding portion 2 a holding one piece of work W, and a lower die 3 which is opposed to the workpiece holding portion 2 a. The lower mold cavity recess 3a is formed by the holder 5e arranged and holding the workpiece W and the cavity member 5d inserted into the holder 5e and pressurizing the resin by relative movement, and the upper mold 2 is provided with an adjustment mold holder An adjustment mechanism 8 (not shown) for the deviation in the thickness direction at the time of holding. In this case, for example, even for large-sized workpieces W that cannot be aligned horizontally and arranged side by side, the upper mold 2 provided with the adjustment mechanism 8 can be used to adjust the deviation of the mold height corresponding to the large-sized workpiece W during mold clamping. On the other hand, compression molding is performed with high accuracy.

FIG. 16 shows a configuration in which the cavity member 5d and the support plate 5c of the lower die set unit 5 are changed in the compression molding die 1 shown in FIG. 1. That is, the support plate 5c is provided so as not to support the lower mold cavity member 5d and to support the lower mold movable holder 5e and the lower mold sleeve plate 5j. The lower mold cavity member 5d is directly supported on the lower mold base plate 5a to form a plurality of support columns 5b. In addition, the plurality of suction holes 5e5, the annular grooves 5e2, and the suction holes 5e3 provided in the bottom of the groove of the film suction groove 5e4 provided around the movable holder 5e of the lower die are not shown.

In this case, since the plate thickness of the lower mold cavity member 5d can be increased and the lower mold cavity member 5d is supported by the support post 5b, it becomes less susceptible to the effects of warpage and the like, and can be more highly accurate. The height adjustment using the support post 5b is performed.

The left half of FIG. 17 is a lower mold movable holder 5e which becomes the lower mold holder unit 5 in the compression molding mold 1 shown in FIG. 1. The lower mold holder 5e is fixedly supported by a support plate 5c. , The lower mold cavity part 5d is connected to the driving mechanism 11 and is set to be directly liftable. The driving mechanism 11 may be a servo motor 11a and a power transmission portion 11b, or may be a hydraulic actuator. In this case, the volume of the lower cavity cavity 3a can be controlled with high accuracy, and resin pressure can be easily applied to the molding resin supplied to the lower cavity cavity 3a.

In the right half of FIG. 17, the lower end portion of the push pin 5 f that supports the lower die movable holder 5 e at the upper end portion is supported by the movable link plate 12. The movable connection plate 12 is provided in a horizontal posture in a cutout formed in the lower mold base plate 5a. The movable linking plate 12 is connected to the driving mechanism 13 and is configured to be directly lifted. The driving mechanism 13 may be a servo motor 13a and a power transmission unit 13b, or may be a hydraulic actuator. In addition, the plurality of suction holes 5e5, the annular grooves 5e2, and the suction holes 5e3 provided in the bottom of the groove of the film suction groove 5e4 provided around the movable mold movable holder 5e are omitted from illustration.

Thereby, the transfer drive mechanism (plunger drive mechanism) of the two-piece transfer molding press used in the past can also be used as a drive mechanism of the lower die movable holder 5e.

FIG. 18 does not exemplify only the rectangular panel shown in FIGS. 14A and 14B or the circular semiconductor wafer shown in FIGS. 15A and 15B. The large-sized workpiece W is subjected to compression molding alone, and is exemplified in the case of a compression molding die 1 that can also be compression-molded on a single strip substrate.

FIG. 19 shows that instead of the two compression molding dies 1 for the strip substrate shown in FIG. 1, the compression molding dies 1 for three strip substrates are shown. The mold structure is the same as that shown in FIG. 1 and illustrates a mold holder unit (upper mold holder unit 4 and lower mold holder unit 5) for inserting and removing a common mold holder (upper mold holder 6 and lower mold holder 7). The number of cases is 3 groups. In addition, more than four sets of mold sleeve units can be provided.

20A and 20B show other configurations of the adjustment mechanism 8. Although the spring mechanism using the coil spring 8e is provided as the adjustment mechanism 8 in FIG. 1, the wedge mechanism 14 may be used. In FIGS. 20A and 20B, between the upper mold base portion 6a of the upper mold base 6 and the upper mold sleeve plate 4a of the upper mold sleeve unit 4, the movable sliding plate 14a and the wedge plate 14b have a tapered surface 14c. They overlap each other and are laminated. The wedge plate 14b is assembled so as to overlap the upper mold cover plate 4a through the height adjustment plate 14d.

As shown in FIG. 20B, a screw shaft 14e and a servo motor 14f are attached to a side portion on the far side of the upper frame base side portion 6b of the rectangular frame shape. The screw shaft 14e is engaged with a nut provided on the movable slide plate 14a. By rotating the servo motor 14f in a predetermined direction by a predetermined amount, the movable slide plate 14a moves in the horizontal direction along the upper mold base portion 6a. At this time, the height position of the upper die set unit 4 is adjusted through a wedge plate 14b laminated with a tapered surface 14c interposed therebetween. That is, as shown in FIG. 20A, the plate thickness difference of the workpiece W may be absorbed by using the clearance in the mold opening and closing direction of the step portion 6f for the support block 4b of the upper mold set unit 4 to be locked.

FIG. 21 is a plan view showing an example of a resin molding apparatus equipped with any of the compression molding dies 1 described above. The workpiece W is a rectangular strip substrate of 100mm × 300mm. Although the molding resin can be any of tablet resin (solid resin), sheet resin, granular resin, powder resin, and liquid resin, it is used as a molding resin. One example is the use of particulate resins. The press sections 15 on which the compression molding die 1 is mounted are provided at three locations. The average punching section 15 processes two pieces, and a single punching operation can perform compression molding on a total of six pieces of workpieces W. In addition, when considering the time of forming, storage, etc. based on supply, press, etc., in order to improve productivity, when the number of presses is large, each press may be sequentially formed.

On the left end side of the three side-by-side press parts 15, there is provided a work supply storage part 16 that supplies a workpiece W and is stored in a magazine after molding. The workpiece conveying mechanism 17 is reciprocated between the workpiece supply accommodating portion 16 and the punching portion 15 and takes out the workpiece W after forming and feeding the workpiece W before forming while moving forward and backward toward the opened compression molding die 1. . The workpiece loader 17 entering the press section 15 receives two pieces of the formed workpieces W (molded products), and delivers the two pieces of the workpiece W before forming to the compression molding die. 1 (work holding part 2a of the upper die 2: see FIG. 1).

A thin-film resin supply portion 18 is provided on the right end side of the punching portion 15. Each thin film is supplied to the thin film resin supply part 18 in accordance with each tape substrate, and is cut into a sheet-like thin film 9. On the sheet-like film 9, a target resin amount is calculated from the results detected in the workpiece supply and storage unit 16, and a granular resin is sprinkled in a shape having substantially the same size as that in the plan view of the cavity, for example. The resin and the sheet-like film 9 are made of resin. The transport mechanism 19 is transported from the film resin supply unit 18 to the punching unit 15, and only the sheet-like film 9 is recovered after molding.

In the above-mentioned resin molding apparatus, each of the punching sections 15 has a plurality of (for example, two sheets as a group) strip substrates and substrates, each of which has a sheet film 9 and a resin mold unit that are arranged in parallel to each other. The compression and forming are performed individually while feeding and absorbing variations in the thickness of the workpiece W and the amount of resin, so productivity and handling are improved. The number of the punching sections 15 is not limited to three, and may be more or less than that.

In addition, for the compression molding device, for example, any one of the upper mold 2 and the lower mold 3 can be a movable mold and the other can be a fixed mold, or both can be movable molds. As the mold opening and closing mechanism for opening and closing the compression molding die 1, various driving mechanisms such as those using a servo motor and a screw shaft, those using a servo motor and a toggle link, or those using a hydraulic drive mechanism can be used.

The compression molding die 1 has a cavity recessed portion 3 a formed in the lower mold 3 and a workpiece holding portion 2 a in the upper mold 2. However, a workpiece holding portion may be formed in the lower mold 3 and a cavity recessed portion may be formed in the upper mold 2. In this case, the adjustment mechanism 8 may be provided integrally with the lower mold base 7, and the sheet-like film 9 may also be sucked and held on the upper mold cover unit 4. In this case, the molding resin is not supplied to the sheet film 9 but is supplied to the workpiece W. In this embodiment, the sheet-shaped film 9 is used, but an elongated film may be used.

In addition, although this embodiment is an example using a thin film, it may be a case where a thin film is not used.

The above-mentioned compression molding die 1 is an example of a mold for processing one or two workpieces W, but it may be configured to mold three or more workpieces W.

The other structure of a compression molding apparatus is demonstrated.

As shown in FIG. 22, for example, a plurality of compression-molding dies 1 for processing one piece of work W may be horizontally arranged and opened and closed by a common press driving mechanism 20 (die opening and closing mechanism). In FIG. 22, a guide post 20b is erected on each corner of a rectangular press base 20a. An upper end of the guide post 20b is connected to a fixed platform 20c, and a movable platform 20d is slidably connected at a middle portion. The movable platform 20d is raised and lowered by a servo motor 21a and a power transmission unit 21b provided on the press base 20a. The upper die 2 is supported horizontally on the fixed platform 20c, and the lower die 3 is supported horizontally on the movable platform 20d. The upper die set unit constituting the upper die 2 is provided with an adjustment mechanism 8 (not shown) similar to that shown in FIG. 9.

FIG. 23 shows another configuration of the compression molding apparatus. The compression molding die 1 for processing one piece of work W may be mounted in a plurality of layers (two in this embodiment) in the height direction, and may be opened and closed by a common press driving mechanism 20 (die opening and closing mechanism). In FIG. 23, guide pillars 20b are erected on each corner of the rectangular press base 20a. The upper end of the guide pillar 20b is connected to the fixed platform 20c, and a movable platform 20d and an intermediate platform 20e are slidably connected to each other at the middle portion. The movable platform 20d is raised and lowered by a servo motor 21a and a power transmission unit 21b provided in the press base 20a. The intermediate platform 20e is linked by a rack and pinion mechanism (not shown) interlocking with the lifting operation of the movable platform 20d with different strokes (for example, the movement ratio of the movable platform 20d to the intermediate platform 20e is 2: 1). .

An upper die 2 is supported below the fixed platform 20c and the intermediate platform 20e, and a lower die 3 is supported above the movable platform 20d and the intermediate platform 20e. Each of the upper die set units constituting the upper die 2 is provided with an adjustment mechanism 8 (not shown) similar to that shown in FIG. 9.

Thereby, even if one piece of workpiece W is processed like a large-sized workpiece, productivity is improved by performing compression molding on a plurality of pieces at the same time, and each mold sleeve unit arranged in parallel or in multiple layers is held during mold clamping. The deviation of the mold height is absorbed by the adjustment mechanism 8 and compression molding is performed with high accuracy without mold inclination.

Here, another example of the compression molding die 1 will be described with reference to FIGS. 24 and 25. The compression molding die 1 is a person who simultaneously performs compression molding while sandwiching a plurality of workpieces W arranged side by side in parallel. The same reference numerals are given to the same components as those in the first embodiment, and the description is referred to.

The configuration of the upper mold 2 (first mold) will be described with reference to FIG. 24. This picture is a conceptual record with the smallest structure. On the upper mold base portion 6a constituting the bottom of the upper mold base 6 (first base portion), an adjustment mechanism 8 (coil spring 8e) is provided for each of a plurality of workpieces W. The adjustment mechanism 8 holds the work piece W on the template 4c horizontally and is suspended and supported through the adjustment mechanism 8. The upper die plate 4c is formed with a workpiece holding portion 2a for individually holding and holding the workpiece W. In addition, although the upper die base portion 6a is not shown, there is an upper die guide block 6d (the first die side portion) that distinguishes the upper die side portion 6b (first base side portion) or the upper die space portion 6c (first die space portion). Guide block), suction mechanism and decompression mechanism, but these may be provided.

The configuration of the lower mold 3 (second mold) will be described. The lower mold base portion 7a constituting the bottom of the lower mold base 7 (second base portion) The cavity member 5d is opposed to the workpiece holding portion 2a and is supported and fixed in a lateral arrangement. Further, around the lower mold cavity member 5d, the lower mold movable clamper 5e that clamps the workpiece W is independently floatingly supported for each workpiece through a coil spring 5g. The lower cavity part 3a is formed by the lower cavity part 5d and the lower mold movable holder 5e. The lower mold cavity member 5d presses the resin by relatively moving while maintaining the state inserted into the lower mold movable holder 5e. In addition, a lower die guide block 7d (the first die space portion) for distinguishing the lower die side portion 7b (the second base side portion) or the lower die space portion 7c (the second die space portion) may be erected on the lower die base portion 7a (the first Two guide blocks) and so on.

With the above configuration, when the plurality of workpieces W are clamped by the upper mold 2 and the lower mold 3, the adjustment mechanism 8 and the coil spring 5g are used to absorb the workpiece holding portion 2a provided with the upper mold base portion 6a laterally arranged. The upper mold 4c (the first upper mold and the second upper mold) and the lower mold cavity recessed portion 3a (the first lower mold cavity recessed and the second lower mold cavity recessed) which are arranged to be opposite to each other are movable. The clamper 5e clamps the height of the mold for each workpiece W. Therefore, the clamper 5e can clamp the mold without tilting the mold.

FIG. 25 shows still another example of the compression molding die 1. The compression molding die 1 is a person who simultaneously performs compression molding while sandwiching a plurality of workpieces W arranged side by side in parallel. The same reference numerals are given to the same components as those in the first embodiment, and the description is referred to.

The configuration of the upper mold 2 (first mold) will be described with reference to FIG. 25. This picture is a conceptual record with the smallest structure. On the upper mold base portion 6a (first base portion) constituting the bottom of the upper mold base 6 (first mold base), a plurality of workpieces W are individually held on the upper mold plate 4c (the first upper mold plate and the second upper mold plate). The plate) is supported in a horizontal arrangement. The upper die plate 4c is formed with a workpiece holding portion 2a for individually holding and holding the workpiece W. In addition, although not shown in the upper die base portion 6a, the upper die guide block 6d (for the upper die base side portion 6b (first base side portion) or the upper die space portion 6c (first die space portion)) First guide block), suction mechanism, and pressure reducing mechanism, but these may also be provided.

The configuration of the lower mold 3 will be described. A lower die movable holder 5e that holds the workpiece W at a lower die base 7a (second base portion) constituting a bottom portion of the lower die holder 7 (second die holder) and faces the workpiece holding portion 2a, and The lower mold cavity recess 3a (the first lower mold cavity recess and the second lower mold) is formed by the lower mold cavity member 5d which presses the resin by keeping the state inserted in the lower mold movable holder 5e to move relatively. The cavity recesses) are supported laterally.

Specifically, the lower mold cavity member 5d is independently supported and fixed to the lower mold plate 5r (mold plate) for each workpiece W. The lower mold movable holder 5e is supported by the lower platen 5r independently of the workpiece W by the coil spring 5g. Between the lower die plate 5r and the lower die base portion 7a, an adjustment mechanism 8 (coil spring 8e) independent of the workpiece W is provided.

In addition, in the lower die base portion 7a, although not shown, the lower die guide block 7d (the second die side portion) or the lower die space portion 7c (the second die space portion) that distinguishes the lower die base side portion 7b (the second base side portion) Guide block), etc., but these can also be set.

Accordingly, when the plurality of workpieces W are individually clamped by the upper mold 2 and the lower mold 3, the coil spring 5g passing through the lower mold movable holder 5e and the adjustment provided between the lower mold plate 5r and the lower mold base portion 7a are adjusted. mechanism 8. The deviation of the mold height is absorbed for each workpiece W, so the mold can be clamped without tilting the mold. The upper mold 2 is arranged on the upper mold base portion 6a and an upper mold plate 4c having a workpiece holding portion 2a is arranged in a horizontal arrangement. The lower mold 3 is formed on the lower mold base portion 7a and is provided with a lower mold cavity recessed portion 3a which is arranged opposite to the workpiece holding portion 2a and is arranged in a horizontal direction.

Claims (24)

A compression molding die is used to individually clamp and simultaneously perform compression molding of a plurality of workpieces arranged side by side in a horizontal direction, and is characterized by comprising: a first mold having a workpiece holding portion for individually holding the plurality of workpieces; And the second mold, which are arranged opposite to the workpiece holding portion, and are added by holding the workpieces separately arranged for each workpiece, and by relatively moving while maintaining the state of being inserted into the holders. A plurality of cavity recesses are formed by pressing a resin cavity member, and the first mold is provided with an adjustment mechanism for individually adjusting the height of each of the workpieces. According to the mold for compression molding of claim 1, wherein the first mold is a first mold sleeve unit having the workpiece holding portion in a first mold base, the first mold sleeve units are arranged side by side in an individual horizontal arrangement, and the adjustment mechanism is provided from the first mold. A spring unit that biases each of the first mold sleeve units in a direction distant from the mold opening and closing direction, and individually performs a mold height of the first mold sleeve units arranged in parallel with the first mold holder when the mold is clamped. Deviation adjustment. According to the mold for compression molding of claim 1 or 2, wherein the second mold is a second mold sleeve unit having the cavity cavity in the second mold seat is arranged side by side in a horizontal arrangement, and each second mold sleeve unit is, The cavity member forming the bottom of the cavity recess and the holder surrounding the cavity member to form the side of the cavity recess are supported to be relatively movable to the second mold base. The compression molding mold according to claim 3, wherein the film covering the clamping surface of the lower mold containing the cavity recessed portion is sucked and held according to the second mold sleeve unit. A compression molding die includes: an upper die holder; an upper die holder unit; a spacer adjustment mechanism is detachably assembled to the upper die holder; and a workpiece holding portion is provided on an upper die clamping surface; and a lower die holder And the lower mold set unit is pluggably assembled to the lower mold set, and the lower mold cavity pieces and A holder that surrounds the aforementioned lower mold cavity piece and is movably supported to form the lower mold cavity recess. According to the compression molding mold of claim 5, the pair of the upper mold set units arranged laterally are supported by the upper mold base separately through the adjustment mechanism, and each of the upper mold set units is provided with The first upper mold plate and the second upper mold plate having the workpiece holding portion assembled and overlapped with the adjustment mechanism, and a pair of lower mold sleeve units which are opposite to and aligned with the pair of upper mold sleeve units are each possible. The lower mold holder is detachably provided, and the lower mold sleeve units are each provided with the lower mold cavity pieces disposed opposite to the first upper mold plate; the lower mold cavity pieces are surrounded and supported by the lower mold cavity pieces. The first lower mold cavity recess formed by the relatively movable holder; it is arranged opposite to the aforementioned second upper template and surrounds the lower mold The cavity member and the aforementioned lower mold cavity member are supported as a second lower mold cavity recess formed by a relatively movable holder. A compression molding die is equipped with a plurality of laterally arranged molds that hold a single workpiece and compressively mold the resin, and is opened and closed by a common mold opening and closing mechanism. The mold includes a first mold that holds the aforementioned mold. A workpiece holding portion of a workpiece; and a second die, which is configured to face the workpiece holding portion to hold the workpiece, and a cavity member which presses the resin by inserting the holder into the holder to perform relative movement. A cavity recess is formed, and an adjustment mechanism for adjusting the height is provided in a mold of either the first mold or the second mold. A compression molding die is configured to hold a plurality of workpieces arranged side by side in parallel and perform compression molding at the same time, and is characterized in that it includes a first mold, and a first base portion provided in a first mold base is to be held. The workpiece holding portion of the workpiece is supported in a horizontal arrangement; and the second mold is a second base portion provided in the second mold base, and a holder disposed opposite to the workpiece holding portion to clamp the workpiece is used. And the cavity recesses formed by the cavity pieces that are relatively moved to pressurize the resin while being inserted into the holder are supported in a lateral arrangement, the cavity pieces independently support and fix the mold plate, and the clip The holder is independently biased and supported on the mold plate for each workpiece, and an adjustment mechanism for independently adjusting the height of each workpiece is provided between the mold plate and the second base portion. A compression molding apparatus including the mold for compression molding according to any one of claims 1 to 8. The utility model relates to a mold base, which is a plurality of mold base units detachably supporting the upper and lower mold bases, which are arranged side by side in a horizontal direction. This adjustment mechanism absorbs the mold height at the time of mold clamping due to the total deviation of the plate thickness of the workpiece held by each mold mold set unit, the amount of resin of the molding resin, and the total thickness of the film covering the clamping surface. The deviation. For example, the mold base of claim 10 includes: a first mold sleeve guide provided adjacent to the mold opening and closing surface side of the first guide block suspended from the first base portion; and a second mold sleeve guide, Adjacent to the mold opening and closing surface side of the second guide block erected from the second base part, the step portion of the first mold set unit is inserted and removed by the first guide block and the first mold set guide. They are respectively formed on both sides, and the stepped portions of the second mold sleeve unit are inserted and pulled out by the second guide block and the second mold sleeve guide, respectively. For example, the mold base of claim 10, wherein the frame-shaped first base side portion hanging down from the first base portion and the frame-shaped second base side portion standing upright from the second base portion are oppositely arranged, and the area is divided into The first guide block of the first mold space portion surrounded by the first base side portion and the second guide block surrounded by the second base side portion to define the second mold space portion are opposed to each other. For example, the mold base of claim 10, wherein the first base side portion is rotatably connected to the first base portion through a hinge on the inner side of the first mold sleeve unit insertion direction, and the second base side portion is inserted in the second mold sleeve unit. The second base portion is rotatably connected to the back side through the hinge in the pulling direction. The mold base according to any one of claims 10 to 13, wherein the aforementioned adjustment mechanism is provided with a spring unit that positions the first mold sleeve plate relative to the first mold base or the second mold sleeve plate relative to the second mold base. Offset in the mold opening and closing direction. The mold base according to any one of claims 10 to 13, wherein the aforementioned adjusting mechanism is that a sliding plate with tapered surfaces overlapping each other is slidably disposed between the first mold base and the first mold sleeve plate or the second Between the mold base and the second mold sleeve plate. A mold sleeve unit for a mold is used to compress a resin by clamping a workpiece with a first mold sleeve unit and a second mold sleeve unit, and is characterized in that any one of the first mold sleeve unit and the second mold sleeve unit is used for compression molding. One clamping surface is provided with a workpiece holding portion, and the other clamping surface is disposed by being opposed to the workpiece holding portion to clamp the workpiece and being inserted into the clamp through the holder The cavity cavity is formed by pressing a cavity member that is pressurized relative to each other. The clamping surface of the holder is provided with a film suction hole or a suction hole that adsorbs and holds the outer peripheral portion of the film covering the cavity cavity. In the suction groove, an annular groove is provided between the suction groove having the film suction hole or the suction hole and the cavity concave portion, and a plurality of suction holes are provided at the bottom of the groove of the annular groove. For example, the mold sleeve unit for the mold of claim 16, wherein the aforementioned annular groove is also used as a recess for the film push pin, and the film provided on the clamping surface of either the first mold sleeve unit or the second mold sleeve unit is pressed in. . The mold sleeve unit for a mold according to claim 16, wherein the aforementioned annular groove system also serves as a chuck jaw for the workpiece holding portion to retreat. A mold sleeve unit for a mold is used to clamp a workpiece in a pair of mold sleeve units to compress a resin. The mold sleeve unit for a compression molding mold is characterized in that: a rectangular clamping surface forming a mold sleeve unit Each edge portion or the mold sleeve plate is provided with a first locking block, and a clamping surface or the opposite surface of the mold sleeve plate of the opposite mold cover unit is provided with a first locking block which is engaged with the first lock block. Second lock block. For example, the mold sleeve unit for a mold of claim 16 or 19, wherein the first mold sleeve unit is provided with a first locking portion, which is pluggably locked to a first guide block formed by standing up to the first mold base. The two-mold sleeve unit is provided with a second locking portion, which is detachably locked to a second guide block formed by standing up to the second mold base. The mold sleeve unit for a mold according to any one of claims 16 to 20, wherein a leveling mechanism is provided at an opposite position of the first mold sleeve unit and the second mold sleeve unit to correct the inclination of the clamping surfaces. A mold sleeve unit for a mold is a mold sleeve unit for a compression molding mold including a first mold sleeve unit having a workpiece holding portion that holds a workpiece, and a second mold sleeve unit having a cavity concave portion to which a molding resin is supplied. Features are: The second mold sleeve unit is configured such that a cavity piece forming a bottom portion of the cavity recessed portion and a holder forming a side portion of the cavity recessed portion are relatively movable, and are opposite to each other on a clamping surface of the holder. A brake is provided on the surface to define the height position of the gripper. The mold sleeve unit for a mold according to claim 22, wherein a plurality of overflow mold cavities are provided along the outer peripheral edge portion of the cavity member. A mold for compression molding, in which the mold sleeve unit according to any one of claims 16 to 23 is arranged side by side with respect to the mold base, and the mold sleeve unit for the mold is independently insertable to and removable from the mold base. Settings.