WO2024018655A1

WO2024018655A1 - Resin sealing device

Info

Publication number: WO2024018655A1
Application number: PCT/JP2023/003147
Authority: WO
Inventors: 雅彦藤沢; 雅志岡本
Original assignee: アピックヤマダ株式会社
Priority date: 2022-07-22
Filing date: 2023-02-01
Publication date: 2024-01-25
Also published as: JP2024014193A

Abstract

The present invention addresses the problem of realizing a resin sealing device capable of reducing the temperature of a sealing mold in a short time. As a solution, the present invention provides a resin sealing device (1) that uses a sealing mold (202) including an upper mold (204) and a lower mold (206), to seal a workpiece (W) with resin, thus processing the workpiece into a molded product (Wp). The resin sealing device includes a lower-mold mold base (236) to which the lower mold (206) is fixed. The lower-mold mold base (236) is fixed to a lower-mold backup plate (216) with a plurality of lower-mold pillars (276) being interposed therebetween, and is provided with a lower-mold cooling plate (286) that cools the lower-mold mold base (236) by being made to abut against or by being made to come close to a lower surface (236a) of the lower-mold mold base (236) in a lower-mold space section (296) where the lower-mold pillars (276) are arranged.

Description

Resin sealing device

The present invention relates to a resin sealing device.

Examples of resin sealing equipment that seals a workpiece with electronic components mounted on a base material with sealing resin (hereinafter simply referred to as "resin") and processes it into a molded product include transfer molding and compression molding. A molding method is known.

In the transfer molding method, a pot is provided to supply a predetermined amount of resin into the sealing areas (cavities) of the two upper and lower molds provided in a sealing mold consisting of an upper mold and a lower mold. This is a technique in which workpieces are placed at positions corresponding to the sealing area, clamped by an upper mold and a lower mold, and resin-sealed by pouring resin from a pot into a cavity (Patent Document 1: Japanese Patent Laid-Open No. 6-031736 (see publication). In addition, in the compression molding method, a predetermined amount of resin is supplied to a sealing area (cavity) provided in a sealing mold that includes an upper mold and a lower mold, and a workpiece is placed in the sealing area. This is a technique in which resin sealing is performed by clamping an upper mold and a lower mold (see Patent Document 2: Japanese Unexamined Patent Publication No. 2019-145550). As an example, when using a sealing mold having a cavity in the upper mold, a technique is known in which resin is supplied all at once to a central position on a workpiece for molding. On the other hand, when using a sealing mold in which a cavity is provided in the lower mold, a technique is known in which a film and resin are supplied to cover the mold surface including the cavity for molding.

Japanese Patent Application Publication No. 6-031736 Japanese Patent Application Publication No. 2019-145550

Here, in the process of resin-sealing a workpiece using a sealing mold, problems such as resin leakage and product damage (particularly cracking of the glass constituting the base material) may occur on rare occasions. When such a malfunction occurs, in order to carry out recovery work, it is necessary to turn off the power to the heating mechanism (heater) that raises the temperature of the sealing mold and lower the temperature of the sealing mold. However, the sealing mold and its supporting members (mold base, platen, etc.) have a large amount of heat storage, and it was necessary to wait for a long time to lower the temperature to a point where restoration work is possible.

Therefore, in the past, air blowing was performed on the surface of the sealing mold to promote temperature reduction. However, if air blowing is performed on the surface of the sealing mold, the temperature could not be lowered efficiently because it would cause resin burrs and broken glass to be removed during restoration work to be scattered. . In particular, in the case of large panel-level or wafer-level press equipment and sealing molds, the board surface is large and thick, so it was necessary to wait for a longer time. Depending on the size, some took 12 to 24 hours.

On the other hand, instead of the above-mentioned air blow, it is also possible to adopt a configuration in which cooling water or cooling oil is passed through the inside of the sealing mold to promote temperature reduction. However, when cooling water or cooling oil is used, there is a concern that leakage from the flow path may occur and contaminate the inside of the device or the factory environment.

The present invention has been made in view of the above circumstances, and is useful when performing restoration work when a workpiece or molded product is damaged or resin leaks inside a sealing mold, or when a sealing mold is used for changing the product. Resin sealing equipment that can lower the temperature of the sealing mold in a short time when replacing the mold, shorten the waiting time before starting work, and prevent a drop in the operating rate of the equipment. The purpose is to realize the following.

The present invention solves the above-mentioned problem by a solving means as described below as an embodiment.

A resin sealing device according to one embodiment is a resin sealing device that seals a workpiece with resin and processes it into a molded product using a sealing mold including an upper mold and a lower mold, the resin molding device including the lower mold. The lower mold base is fixed to a lower mold backup plate with a plurality of lower mold pillars interposed therebetween, and the lower mold base is fixed to a lower mold space in which the lower mold pillars are arranged. The lower mold base is provided with a lower mold cooling plate that cools the lower mold base by contacting with or in close proximity to the lower surface of the lower mold base. Further, a resin sealing apparatus according to another embodiment is a resin sealing apparatus that seals a workpiece with resin and processes it into a molded product using a sealing mold including an upper mold and a lower mold, The method includes an upper mold base to which the upper mold is fixed, and the upper mold base is fixed to an upper mold backup plate with a plurality of upper mold pillars interposed therebetween, and the upper mold pillars are arranged. The upper mold space is required to be provided with an upper mold cooling plate that cools the upper mold base by contacting or being brought close to the upper surface of the upper mold base.

According to this, a cooling plate with a cooling function is placed in contact with or in close proximity to a mold base that has a built-in heating mechanism for raising the temperature of the sealing mold. The sealing mold fixed to the mold base can be efficiently cooled. Therefore, the temperature of the sealing mold can be lowered in a shorter time than conventionally, and it is possible to shorten the waiting time until the start of restoration work or replacement work.

Further, it is preferable that the lower die cooling plate has a first groove on the upper surface thereof through which gas used for cooling flows. Further, it is preferable that the upper mold cooling plate has a third groove on the lower surface through which a gas used for cooling flows. According to this, the heat sink effect of the cooling plate can be enhanced, so that the mold base and the sealing mold fixed to the mold base can be cooled even more efficiently.

Further, the lower mold cooling plate has a thickness in the vertical direction so that the lower surface does not come into contact with the upper surface of the lower mold backup plate, and has an inner diameter that does not come into contact with the lower mold pillar. It is preferable to have a lower mold pillar insertion hole that is formed vertically and vertically and through which the lower mold pillar is inserted. Further, the upper mold cooling plate has a thickness in the vertical direction so that the upper surface does not come into contact with the lower surface of the upper mold backup plate, and has an inner diameter that does not come into contact with the upper mold pillar. It is preferable to have an upper mold pillar insertion hole that is formed vertically and penetrates through the upper mold pillar. According to this, the cooling plate can be arranged so as not to come into contact with the pillar for adjusting the flatness of the sealing mold, so it does not affect the mold flatness and the TTV (Total Thickness Variation) is not adversely affected.

Furthermore, it is preferable that the lower mold base has a second groove on the lower surface through which gas used for cooling flows. Further, it is preferable that the upper mold base has a fourth groove portion on the upper surface thereof through which a gas used for cooling flows. According to this, since cooling of the mold base can be promoted, the mold base and the mold fixed to the mold base can be cooled more efficiently.

According to the present invention, when performing restoration work when a workpiece or molded product is damaged or resin leaks inside the sealing mold, or when replacing the sealing mold to change the product type. In such cases, the temperature of the sealing mold can be lowered in a short time. Therefore, it is possible to shorten the waiting time until those tasks can be started, and it is possible to prevent a decrease in the operating rate of the device.

FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a front sectional view showing an example of a press device of the resin sealing device shown in FIG. 1. FIG. FIG. 3 is a plan view taken along line III--III in FIG. 2. FIG. 4 is a bottom view taken along line IV--IV in FIG. 2. FIG. 5 is a front sectional view showing another example of the press device of the resin sealing device shown in FIG. FIG. 6 is a front sectional view showing another example of the press device of the resin sealing device shown in FIG.

(overall structure)
Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic diagram) showing an example of a resin sealing device 1 according to the present embodiment. For convenience of explanation, arrows in the figure indicate the left-right direction (X direction), the front-back direction (Y direction), and the up-down direction (Z direction) in the resin sealing device 1. In addition, in all the drawings for explaining each embodiment, members having the same function are denoted by the same reference numerals, and repeated explanation thereof may be omitted.

The resin sealing device 1 according to the present embodiment is a device that seals a workpiece (molded product) W with a resin using a sealing mold 202 that includes an upper mold 204 and a lower mold 206. Hereinafter, as the resin sealing device 1, a workpiece W is held by a workpiece holding part provided in one of the upper mold 204 and the lower mold 206, and the cavity (including a part of the mold surface) provided in the other mold is covered with a release film. A compression molding apparatus will be described as an example in which a workpiece W is covered with a film (hereinafter sometimes simply referred to as a "film"), a clamping operation is performed between an upper die 204 and a lower die 206, and the workpiece W is sealed with resin. However, it is not limited to this. A release film is also not required.

First, the workpiece W to be molded has, as a typical example, a structure in which a plurality of electronic components are mounted in a matrix on a base material. More specifically, examples of base materials include plate-like members such as resin substrates, ceramic substrates, metal substrates, glass and metal carrier plates, lead frames, and wafers formed in rectangular or circular shapes. It will be done. Furthermore, examples of electronic components include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and the like. However, it is not limited to this.

Examples of methods for mounting electronic components on a base material include mounting methods such as wire bonding mounting and flip chip mounting. Alternatively, in the case of a configuration in which the base material (carrier plate) is peeled off from the molded product Wp after resin sealing, electronic components are pasted using an adhesive tape with thermal releasability or an ultraviolet curable resin that hardens by ultraviolet irradiation. There is a way.

On the other hand, as an example of the resin, a liquid thermosetting resin (for example, a filler-containing epoxy resin, etc.) is used. Note that the resin is not limited to the above-mentioned state, and may be in other states (such as granule, pulverized, powder, etc.), plate, sheet, solid, tablet, etc. shape), or may be a resin other than the epoxy thermosetting resin.

Examples of the film F include film materials with excellent heat resistance, easy peelability, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, Fluorine-impregnated glass cloth, polypropylene, polyvinylidine chloride, etc. are preferably used. In this embodiment, a roll-shaped film is used as the film F. In addition, as another example, a structure using a strip-shaped film may be used (not shown).

Next, an overview of the resin sealing device 1 according to the present embodiment will be explained. As shown in FIG. 1, the resin sealing apparatus 1 includes a transport unit 100A that mainly transports the work W and the molded product Wp, a work supply unit 100B that mainly supplies the work W, and a work supply unit 100B that mainly supplies the resin. A resin supply unit 100C, a press unit 100D that mainly processes the workpiece W into a molded product Wp by resin-sealing it, a post-cure unit 100E that mainly performs post-curing of the molded product Wp after resin-sealing, and a post-cure unit. The main components include a molded product storage unit 100F that mainly stores molded products Wp, and a control unit 100G that mainly controls each mechanism and each process.

In this embodiment, the transport unit 100A is arranged at the center of the apparatus, and each unit is arranged so as to surround the transport unit 100A. Specifically, a work supply unit 100B, a resin supply unit 100C, and a molded product storage unit 100F are arranged in front of the transport unit 100A. Further, a press unit 100D is arranged on the rear side of the transport unit 100A. Furthermore, post-cure units 100E are arranged on the right side and right front side of the transport unit 100A. Further, a control unit 100G is arranged on the right rear side of the transport unit 100A. However, it is not limited to this.

Note that the overall configuration of the resin sealing device 1 can be changed by changing the configuration of the unit. For example, the configuration shown in FIG. 1 is an example in which two press units 100D are arranged, but a configuration in which only one press unit 100D is arranged, or three or more press units 100D is also possible. Further, a configuration in which other units are additionally arranged is also possible (none of these are shown).

(transport unit)
First, the transport unit 100A included in the resin sealing device 1 will be described.

The transport unit 100A includes a transport device 102 that transports the workpiece W and the molded product Wp. As an example, the conveyance device 102 includes a guide rail 104, a base portion 106 that reciprocates in a predetermined direction (for example, the left-right direction) along the guide rail 104, and a workpiece W and a molded product Wp that are fixed to the base portion 106. and a holding and moving mechanism 108 (an articulated robot, for example) that holds and moves the robot. Thereby, the workpiece W and the molded product Wp can be held and transported between each unit and carried into and out of each mechanism.

(Work supply unit)
Next, the work supply unit 100B included in the resin sealing device 1 will be described.

The workpiece supply unit 100B includes a workpiece stocker 110 used to store the workpieces W. As an example, the work stocker 110 uses a known stack magazine, slit magazine, or the like, and can accommodate a plurality of works W at once. The plurality of works W are carried out one by one by the holding and moving mechanism 108.

(Resin supply unit)
Next, the resin supply unit 100C included in the resin sealing device 1 will be explained. In this resin supply unit 100C, resin is supplied (placed) to the workpiece W carried in from the workpiece supply unit 100B by the transport device 102.

The resin supply unit 100C includes a pair of dispensers 312 that discharge and supply resin (here, liquid resin) in a syringe 314 onto the workpiece W, and a plurality of replacement syringes 314 between the pair of dispensers 312. and a revolver-type syringe supply section 316 that rotatably holds the syringe. Each dispenser 312 is configured to discharge resin while being sequentially supplied with a replacement syringe 314 from a shared syringe supply unit 316.

(Press unit)
Next, the press unit 100D included in the resin sealing device 1 will be described. In this press unit 100D, resin sealing is performed on the workpiece W (on which resin is placed) carried in from the resin supply unit 100C by the transport device 102.

The press unit 100D is a sealed mold having a pair of molds that are opened and closed (for example, a mold in which a plurality of mold blocks made of alloy tool steel, mold plates, mold pillars, etc., and other members are assembled). 202. Further, a press device 250 is provided which opens and closes the sealing mold 202 to seal the workpiece W with resin. Furthermore, the sealing mold 202 is provided with a transport loader 210 that carries in and out the workpiece W and the molded product Wp. (It may also be configured to carry in and out).

Here, as shown in FIG. 2, the press device 250 includes a pair of

platens

254 and 256, a plurality of tie bars 252 on which the pair of

platens

254 and 256 are installed, a drive device that moves (raises and lowers) the platen 256, etc. It is configured with. Specifically, the drive device is configured to include a drive source (for example, an electric motor) 260, a drive transmission mechanism (for example, a ball screw or a toggle link mechanism) 262, etc. (However, the drive device is not limited to this). isn't it). In this embodiment, the platen 254 on the upper side in the vertical direction is a fixed platen (a platen fixed to the tie bar 252), and the platen 256 on the lower side is a movable platen (a platen that is slidably held by the tie bar 252 and moves up and down). It is set as . However, the present invention is not limited to this, and the platen may be set upside down, that is, the upper side may be set as a movable platen and the lower side may be set as a fixed platen, or both the upper side and the lower side may be set as movable platens. (None shown).

On the other hand, the sealing mold 202 is a pair of molds disposed between the pair of

platens

254 and 256 in the press device 250, and includes one mold on the upper side in the vertical direction (upper mold 204) and a lower mold on the upper side in the vertical direction. and the other mold (lower mold 206) on the side. That is, the upper mold 204 is assembled to the upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to the lower platen (in this embodiment, the movable platen 256). The upper mold 204 and the lower mold 206 approach and separate from each other to close and open the mold (the vertical direction (vertical direction) is the mold opening/closing direction).

Furthermore, in this embodiment, as an example, a film supply mechanism 213 is provided that conveys (supplies) the roll-shaped film F into the inside of the sealing mold 202.

Next, the assembly structure of the lower mold 206 in the sealing mold 202 will be described in detail. As shown in FIG. 2, the lower mold 206 is fixed to a lower mold base 236. This lower mold base 236 is provided with a lower mold heating mechanism 237 (eg, electric wire heater, etc.) that heats the lower mold 206 to a predetermined temperature (eg, 100° C. to 200° C.).

Further, the lower mold base 236 is fixed to the lower mold backup plate 216 with a plurality of lower mold pillars 276 interposed therebetween (that is, a plurality of lower mold pillars 276 are fixed on the lower mold backup plate 216). and a lower mold base 236 is fixed on top of a plurality of lower mold pillars 276). As an example, the lower pillar 276 is formed into a columnar shape (for example, several tens of mm in diameter and several tens of mm in height) using a ceramic material. A plurality of lower mold pillars 276 are arranged upright on the lower mold back-up plate 216, and the lower mold base 236 is supported on their upper surfaces. At this time, the mold closing force applied by the movable platen 256 and the fixed platen 254 can be reduced by adjusting the height of the upper surface of the plurality of lower mold pillars 276 with high precision so that it is within a predetermined tolerance (dimensional difference). It is possible to uniformly transmit the force to the mold base 236 and, by extension, to the lower mold 206 in the surface direction. That is, the flatness of the lower mold 206 can be maintained when the mold is closed. Therefore, it is possible to prevent molding defects from occurring due to the lower mold 206 being deformed (bending) due to non-uniform mold closing force in the surface direction.

Further, the lower mold backup plate 216 is fixed to a movable platen 256. Note that another support member, urging member, etc. may be interposed between the lower mold backup plate 216 and the movable platen 256 (not shown).

Here, in the space 296 (hereinafter referred to as "lower mold space") between the lower mold backup plate 216 and the lower mold base 236 where the lower mold pillar 276 is arranged, the lower surface of the lower mold base 236 is A lower mold cooling plate 286 is provided in contact with the lower mold 236a (a surface that is upside down from the fixed surface of the lower mold 206). As an example, the lower mold cooling plate 286 is formed using a metal material. Thereby, the lower mold cooling plate 286 can act as a heat sink, absorbing heat from the lower mold base 236 in the abutting state, and cooling the lower mold base 236. Therefore, the lower mold cooling plate 286 is preferably made of a material with particularly high thermal conductivity (stainless alloy, aluminum alloy, alloy tool steel).

Further, the thickness of the lower mold cooling plate 286 in the vertical direction is set so that the lower surface 286b does not come into contact with the upper surface 216a of the lower mold backup plate 216. According to this, the lower mold cooling plate 286 can be provided by utilizing the lower mold space 296 in which the lower mold pillar 276 is arranged, so that the apparatus does not become larger.

Further, the lower mold cooling plate 286 is formed with lower mold pillar insertion holes 293 extending in the vertical direction through which each of the aforementioned lower mold pillars 276 is inserted. At this time, the inner diameter of each lower mold pillar insertion hole 293 is formed to be sufficiently larger than the outer diameter of each lower mold pillar 276 (with a spacing of several mm). According to this, even if the lower mold cooling plate 286 expands or contracts due to the influence of heat, it is possible to prevent the lower mold cooling plate 286 from coming into contact with the lower mold pillar 276. That is, the flatness of the lower die 206 is not affected, and the TTV (Total Thickness Variation) of the molded product is not adversely affected.

As described above, in this embodiment, the configuration in which the lower mold pillar 276 is provided can suppress the deformation (bending) of the lower mold 206 and prevent the occurrence of molding defects. In addition, by providing the lower mold cooling plate 286, a mechanism for cooling the lower mold base 236 can be realized. Therefore, the lower mold base 236 in which the lower mold heating mechanism 237 for heating the lower mold 206 is incorporated can be actively and efficiently cooled by the lower mold cooling plate 286. As a result, the temperature of the lower mold 206 fixed to (in contact with) the lower mold base 236 can be lowered in a shorter time than in the past, reducing the waiting time before starting the aforementioned restoration or replacement work. This makes it possible to shorten the time. Further, unlike air blowing, there is no risk of scattering resin burrs, broken glass, etc. that are to be removed during restoration work.

Furthermore, in this embodiment, as shown in FIG. 3, in the upper surface 286a of the lower die cooling plate 286, a groove 292 (a first groove ) is formed so as to communicate the supply port 292a and the discharge port 292b along the surface direction (in a direction parallel to the upper surface 286a). This first groove portion 292 has a bent shape that avoids the lower mold pillar insertion hole 293, and is provided in plural pieces (multiple grooves), each having a width of several mm to more than ten mm and a depth. is formed to have a thickness of several mm to several dozen mm. However, the shape, dimensions, and number (number of pieces) are not particularly limited. According to this, the heat sink effect of the lower mold cooling plate 286 can be enhanced by causing gas to flow in the first groove portion 292 from the supply port 292a toward the discharge port 292b. The mold base 236 and, by extension, the lower mold 206 can be cooled. Note that a configuration in which a silent muffler (not shown) is provided at the discharge port 292b is suitable. According to this, it is possible to reduce the sound volume generated when gas is discharged and to prevent dust and the like from scattering. In this embodiment, since it is easy to process, the groove part 292 is formed into a meandering shape, one side of which is machined, but it does not necessarily have to be a groove, and may be a hole. In this case, it is also possible to perform similar processing using holes and blind plugs.

Next, a modification of the lower die cooling plate 286 will be described. Specifically, the lower surface 236a of the lower mold base 236 and the upper surface 286a of the lower mold cooling plate 286 may be configured to be brought "in close proximity" instead of in "abutting" as described above (not shown). As an example, "proximity" is set to a distance of about several mm. According to this, a sealed space can be formed between the lower surface 236a of the lower mold base 236 and the upper surface 286a of the lower mold cooling plate 286, and the space can be used as a flow path for cooling gas. It can be used as Therefore, the lower surface 236a of the lower mold base 236 can be entirely cooled by the cooling gas, and at the same time, a heat sink effect of the lower mold cooling plate 286 can be obtained via the cooling gas. In this case, it is possible to control the flow rate of gas by completely surrounding the space between the cooling plate 286 and the mold base 236, or the grooves may be used as fins to increase the surface area.

Next, a modification of the lower mold base 236 will be described. Specifically, instead of (or together with) the configuration in which the groove 292 (first groove) through which cooling gas flows is provided in the upper surface 286a of the lower mold base 286, the lower surface 236a of the lower mold base 236 is provided. A configuration may also be adopted in which a groove portion (second groove portion) through which cooling gas flows is provided (not shown). According to this, cooling of the lower mold base 236 can be promoted by causing the cooling gas to flow through the second groove, so that the lower mold base 236 and, by extension, the lower mold 206 can be cooled more efficiently. Cooling becomes possible. Note that the shape, dimensions, and number (number) of the second groove portions are not particularly limited.

Next, the assembly structure of the upper mold 204 in the sealing mold 202 will be described in detail. As shown in FIG. 2, the upper mold 204 is fixed to an upper mold base 234. The upper mold base 234 is provided with an upper mold heating mechanism 235 (eg, electric wire heater, etc.) that heats the upper mold 204 to a predetermined temperature (eg, 100° C. to 200° C.).

Further, the upper mold base 234 is fixed to the upper mold backup plate 214 with a plurality of upper mold pillars 274 interposed therebetween (that is, a plurality of upper mold pillars 274 are fixed under the upper mold backup plate 214). (The upper mold base 234 is fixed under the plurality of upper mold pillars 274.) As an example, the upper mold pillar 274 is formed into a cylindrical shape (for example, several tens of mm in diameter and several tens of mm in height) using a ceramic material. A plurality of upper mold pillars 274 are arranged upright below the upper mold backup plate 214, and the upper mold base 234 is supported on the lower surface thereof. At this time, by adjusting the height of the lower surface of the plurality of upper mold pillars 274 with high precision so that it is within a predetermined tolerance (dimensional difference), the mold closing force applied by the movable platen 256 and the fixed platen 254 is reduced. It is possible to uniformly transmit the force to the mold base 234 and, by extension, to the upper mold 204 in the surface direction. That is, the flatness of the upper mold 204 can be maintained when the mold is closed. Therefore, it is possible to prevent molding defects caused by the upper mold 204 being deformed (bending) due to uneven mold closing force in the surface direction.

Additionally, the upper mold backup plate 214 is fixed to a fixed platen 254. Note that another support member, urging member, etc. may be interposed between the upper mold backup plate 214 and the fixed platen 254 (not shown).

Here, in the space 294 (hereinafter referred to as "upper mold space") between the upper mold backup plate 214 and the upper mold base 234 where the upper mold pillar 274 is arranged, the upper surface of the upper mold base 234 is An upper mold cooling plate 284 is provided in contact with the upper mold 234a (a surface that is upside down from the fixed surface of the upper mold 204). As an example, the upper mold cooling plate 284 is formed using a metal material. Thereby, the upper mold cooling plate 284 can act as a heat sink, absorbing heat from the upper mold base 234 in the abutting state, and cooling the upper mold base 234. Therefore, the upper mold cooling plate 284 is preferably made of a material with particularly high thermal conductivity (stainless alloy, aluminum alloy, alloy tool steel).

Further, the thickness of the upper mold cooling plate 284 in the vertical direction is set so that the upper surface 284b does not come into contact with the lower surface 214a of the upper mold backup plate 214. According to this, the upper mold cooling plate 284 can be provided by utilizing the upper mold space 294 in which the upper mold pillar 274 is arranged, so that the apparatus does not become larger.

Further, the upper mold cooling plate 284 is formed with upper mold pillar insertion holes 291 extending in the vertical direction through which each of the aforementioned upper mold pillars 274 is inserted. At this time, the inner diameter of each upper mold pillar insertion hole 291 is formed to be sufficiently larger than the outer diameter of each upper mold pillar 274 (with a spacing of several mm). According to this, even if the upper mold cooling plate 284 expands or contracts due to the influence of heat, it is possible to prevent the upper mold cooling plate 284 from coming into contact with the upper mold pillar 274. That is, the flatness of the upper die 204 is not affected, and the TTV (Total Thickness Variation) of the molded product is not adversely affected.

As described above, in this embodiment, the configuration in which the upper mold pillar 274 is provided can suppress the deformation (bending) of the upper mold 204 and prevent the occurrence of molding defects. In addition, by providing the upper mold cooling plate 284, a mechanism for cooling the upper mold base 234 can be realized. Therefore, the upper mold base 234 in which the upper mold heating mechanism 235 for heating the upper mold 204 is incorporated can be actively and efficiently cooled by the upper mold cooling plate 284. As a result, the temperature of the upper mold 204 fixed to (in contact with) the upper mold base 234 can be lowered in a shorter time than in the past, reducing the waiting time before starting the above-mentioned restoration or replacement work. This makes it possible to shorten the time. Further, unlike air blowing, there is no risk of scattering resin burrs, broken glass, etc. that are to be removed during restoration work.

Furthermore, in this embodiment, as shown in FIG. 4, in the lower surface 284a of the upper cooling plate 284, a groove 290 (a third groove ) is formed so as to communicate the supply port 290a and the discharge port 290b along the surface direction (in a direction parallel to the lower surface 284a). This third groove part 290 has a bent shape that avoids the upper mold pillar insertion hole 291, and is provided in plural pieces (multiple grooves), each having a width of several mm to more than ten mm and a depth. is formed to have a thickness of several mm to several dozen mm. However, the shape, dimensions, and number (number of pieces) are not particularly limited. According to this, the heat sink effect of the upper mold cooling plate 284 can be enhanced by causing gas to flow in the third groove portion 290 from the supply port 290a toward the discharge port 290b. The mold base 234 and, by extension, the upper mold 204 can be cooled. Note that a configuration in which a silent muffler (not shown) is provided at the discharge port 290b is suitable. According to this, it is possible to reduce the sound volume generated when gas is discharged and to prevent dust and the like from scattering.

Next, a modification of the upper mold cooling plate 284 will be described. Specifically, the upper surface 234a of the upper mold base 234 and the lower surface 284a of the upper mold cooling plate 284 may be configured to be brought "close to each other" instead of "abutting" as described above (not shown). As an example, "proximity" is set to a distance of about several mm. According to this, a sealed space can be formed between the upper surface 234a of the upper mold base 234 and the lower surface 284a of the upper mold cooling plate 284, and the space can be used as a flow path for cooling gas. It can be used as Therefore, the upper surface 234a of the upper mold base 234 can be entirely cooled by the cooling gas, and at the same time, a heat sink effect of the upper mold cooling plate 284 can be obtained via the cooling gas.

Next, a modification of the upper mold base 234 will be described. Specifically, in place of (or together with) the configuration in which the groove 290 (third groove) through which the cooling gas flows is provided in the lower surface 284a of the upper mold base 284, the upper surface 234a of the upper mold base 234 is provided. A configuration may also be adopted in which a groove (fourth groove) through which cooling gas flows is provided (not shown). According to this, cooling of the upper mold base 234 can be promoted by passing the cooling gas through the fourth groove, so that the upper mold base 234 and, by extension, the upper mold 204 can be cooled more efficiently. Cooling becomes possible. Note that the shape, dimensions, and number (number) of the fourth groove are not particularly limited.

Next, a modification of the press device 250 will be described. As shown in FIG. 5, the assembly structure of the lower mold 206 is similar to that of the above embodiment. On the other hand, the assembly structure of the upper mold 204 is different from the above embodiment and is as follows. Specifically, the upper mold 204 is fixed to an upper plate 218. The upper plate 218 is provided with an upper mold heating mechanism 219 (eg, electric wire heater, etc.) that heats the upper mold 204 to a predetermined temperature (eg, 100° C. to 200° C.). Further, the upper plate 218 is fixed to a fixed platen 254. Note that another support member, urging member, etc. may be interposed between the upper plate 218 and the fixed platen 254 (not shown).

Further, other modifications of the press device 250 will be described. As shown in FIG. 6, the assembly structure of the upper die 204 is similar to that of the above embodiment. On the other hand, the assembly structure of the lower mold 206 is different from the above embodiment and is as follows. Specifically, the lower die 206 is fixed to the lower plate 220. This lower plate 220 is provided with a lower mold heating mechanism 221 (eg, electric wire heater, etc.) that heats the lower mold 206 to a predetermined temperature (eg, 100° C. to 200° C.). Further, the lower plate 220 is fixed to a movable platen 256. Note that another support member, urging member, etc. may be interposed between the lower plate 220 and the movable platen 256 (not shown).

(Post-cure unit) Next, the post-cure unit 100E included in the resin sealing device 1 will be described. In this post-cure unit 100E, post-curing is performed on the molded product Wp carried in from the press unit 100D by the transport device 102.

The post-cure unit 100E includes one oven (post-cure oven) 400 having a plurality of heating chambers 402 that hold the molded product Wp carried in by the transport device 102 inside and perform post-curing by heating it at a set temperature. Or have multiple units. Note that the configuration may not include the post-cure unit 100E (not shown).

(Molded product storage unit) Next, the molded product storage unit 100F included in the resin sealing device 1 will be described. In this molded product storage unit 100F, the molded product Wp carried in from the post-cure unit 100E by the transport device 102 is stored.

The molded product storage unit 100F includes a molded product stocker 112 used to store molded products Wp. As an example, the molded product stocker 112 uses a known stack magazine, slit magazine, or the like, and can accommodate a plurality of molded products Wp at once. The plurality of molded products Wp are configured to be carried in one by one by the holding and moving mechanism 108.

(Control Unit) Next, the control unit 100G included in the resin sealing device 1 will be described. The control unit 100G includes an operation section 152 through which an operator inputs operating conditions of the resin sealing device 1, and a control section 152 for inputting operating conditions of the resin sealing device 1, and various operations in the resin sealing device 1 according to operating conditions input by the operator and operating conditions stored in advance. The control unit 150 controls the operation of the mechanism. Note that the operation section 152 is not limited to a configuration disposed within the control unit 100G, but may be disposed within another unit or at a position adjacent thereto.

As explained above, the resin sealing device according to the present invention can be used when performing recovery work when workpieces or molded products are damaged or resin leaks inside the sealing mold, or when When replacing the sealing mold for replacement, etc., the temperature of the sealing mold can be lowered in a short time. Therefore, it is possible to shorten the waiting time until those tasks can be started, and it is possible to prevent a decrease in the operating rate of the device.

Note that the present invention is not limited to the above-described embodiments, and can be modified in various ways without departing from the scope of the present invention. In particular, the explanation has been given as an example of a configuration including a sealing mold for a resin sealing device using a compression molding method, but the present invention is not limited to this. The same can be applied to a configuration provided with a mold.

Further, in the above embodiment, the configuration in which the lower platen in the vertical direction is the movable platen has been described as an example, but the configuration is not limited to this, and the upper platen in the vertical direction is the movable platen. The present invention can be similarly applied to a configuration in which the present invention becomes a movable platen, or a configuration in which both the lower and upper platens are movable platens.

Claims

A resin sealing device for sealing a workpiece with resin and processing it into a molded product using a sealing mold including an upper mold and a lower mold,
comprising a lower mold base to which the lower mold is fixed;
The lower mold base is fixed to a lower mold backup plate with a plurality of lower mold pillars interposed therebetween,
In the lower mold space where the lower mold pillar is arranged, a lower mold cooling plate is provided which cools the lower mold base by contacting or being brought close to the lower surface of the lower mold base. Resin sealing equipment.
2. The resin sealing device according to claim 1, wherein the lower mold cooling plate has a first groove on an upper surface thereof through which a gas used for cooling flows.
The lower mold cooling plate is
The thickness in the vertical direction is set so that the lower surface does not come into contact with the upper surface of the lower mold backup plate,
and,
2. The resin sealing device according to claim 1, further comprising a lower mold pillar insertion hole that is vertically formed and has an inner diameter that does not come into contact with the lower mold pillar, and through which the lower mold pillar is inserted.
2. The resin sealing device according to claim 1, wherein the lower mold base has a second groove on a lower surface thereof through which a gas used for cooling flows.
A resin sealing device for sealing a workpiece with resin and processing it into a molded product using a sealing mold including an upper mold and a lower mold,
comprising an upper mold base to which the upper mold is fixed;
The upper mold base is fixed to an upper mold backup plate with a plurality of upper mold pillars interposed therebetween,
In the upper mold space where the upper mold pillar is arranged, an upper mold cooling plate is provided which cools the upper mold base by contacting or being brought close to the upper surface of the upper mold base. Resin sealing equipment.
6. The resin sealing device according to claim 5, wherein the upper mold cooling plate has a third groove on a lower surface thereof through which a gas used for cooling flows.
The upper mold cooling plate is
The thickness in the vertical direction is set so that the upper surface does not come into contact with the lower surface of the upper mold backup plate,
and,
6. The resin sealing device according to claim 5, further comprising an upper mold pillar insertion hole that is vertically formed and has an inner diameter that does not come into contact with the upper mold pillar, and through which the upper mold pillar is inserted.
6. The resin sealing device according to claim 5, wherein the upper mold base has a fourth groove on the upper surface through which a gas used for cooling flows.