TW202404777A - Resin sealing device - Google Patents

Abstract

The present invention realizes a resin sealing device that can reduce the temperature of a sealing mold in a short time. The resin sealing device 1 of the present invention is a resin sealing device that uses a sealing mold 202 including an upper mold 204 and a lower mold 206 to seal a workpiece W with resin and process it into a molded product Wp. The lower mold mold base 236 is fixed to the lower mold support plate 216 with a plurality of lower mold pillars 276 interposed therebetween. The lower mold cooling plate 286 is in contact with or close to the lower surface 236 a of the lower mold base 236 to cool the lower mold base 236 .

Description

Resin sealing device

The present invention relates to a resin sealing device.

As an example of a resin sealing device in which a workpiece with electronic components mounted on a base material is sealed with a sealing resin (hereinafter, sometimes simply referred to as "resin") and processed into a molded product, transfer molding or compression molding is known. Resin sealing device.

The transfer molding method is a technique in which a tank is provided to supply a predetermined amount of resin to the sealing areas (mold cavities) of two upper and lower molds provided in a sealing mold composed of an upper mold and a lower mold, and the resin is placed in the sealing areas corresponding to the respective sealing areas. The workpieces are arranged at respective positions, clamped by the upper mold and the lower mold, and resin is poured from the tank into the mold cavity for resin sealing (Patent Document 1: See Japanese Patent Application Laid-Open No. 6-031736). In addition, the compression molding method is a technology in which a predetermined amount of resin is supplied to a sealing area (cavity) provided in a sealing mold including an upper mold and a lower mold, and a workpiece is placed in the sealing area. Resin sealing is performed by clamping the lower mold (Patent document 2: refer to Japanese Patent Application Laid-Open No. 2019-145550). As an example, there is known a technique in which resin is collectively supplied to a central position on a workpiece to perform molding when a sealed mold having a cavity provided in an upper mold is used. On the other hand, when using a sealed mold having a cavity provided in a lower mold, there is known a technique of supplying a film and resin covering the mold surface including the cavity to perform molding. [Prior art documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 6-031736 [Patent Document 2] Japanese Patent Application Laid-Open No. 2019-145550

[Problem to be solved by the invention] Here, in the step of resin sealing the workpiece using the sealing mold, problems such as resin leakage or product breakage (especially breakage of the glass constituting the base material) may occasionally occur. When such a defect occurs, in order to perform repair work, the power supply to the heating mechanism (heater) that raises the temperature of the sealing mold must be cut off and the temperature of the sealing mold must be lowered. However, the sealing mold and the supporting members of the sealing mold (molding base, platen, etc.) have a large amount of stored heat, and it takes a long time to wait for the temperature to drop to a temperature that allows repair work.

Therefore, conventionally, air blasting was performed on the surface of the sealing mold to promote temperature reduction. However, if air is blown to the surface of the sealing mold, it will cause resin burrs, broken glass, etc. that are to be removed during the repair operation to be scattered, so that the temperature cannot be lowered efficiently. Especially in the case of large-size panel-level or wafer-level pressing devices and sealing molds, a longer wait time is required due to the large disk surface and thick wall. Although it also depends on the size, it may take 12 hours to 24 hours.

On the other hand, it is also conceivable to have a structure that promotes temperature reduction by circulating cooling water or cooling oil inside the sealed mold instead of the air blowing. However, when cooling water or cooling oil is used, leakage in the self-flow path may occur, causing contamination inside the device or the factory environment. [Means to solve the problem]

The present invention was made in view of the above situation, and an object thereof is to realize a resin sealing device that performs repair work when damage to a workpiece or molded product, leakage of resin, etc. occurs inside a sealing mold, or When the sealing mold is replaced to change the type, etc., the temperature of the sealing mold can be lowered in a short time, thereby shortening the waiting time until the start of the operation and preventing a decrease in the operation rate of the device.

The present invention solves the above-mentioned problems by means of solving the problems described below as embodiments.

A resin sealing device according to one embodiment uses a sealing mold including an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product. A necessary condition for the resin sealing device is to include a lower mold for fixing the lower mold. a mold base, the lower mold mold base is fixed to the lower mold support plate with a plurality of lower mold pillars interposed therebetween, and a lower mold cooling plate is provided in the lower mold space for disposing the lower mold pillars, The lower mold cooling plate is in contact with or close to the lower surface of the lower mold mold base to cool the lower mold mold base. In addition, a resin sealing device according to another embodiment uses a sealing mold including an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product. A necessary condition for the resin sealing device is that the resin sealing device includes a mold for fixing the upper mold. an upper mold molding base, the upper mold molding base is fixed to the upper mold support plate with a plurality of upper mold pillars interposed therebetween, and an upper mold is provided in an upper mold space for disposing the upper mold pillars. The upper mold cooling plate is in contact with or close to the upper surface of the upper mold mold base to cool the upper mold mold base.

Accordingly, by arranging a cooling plate with a cooling function in contact with or close to the mold base having a built-in heating mechanism for heating the sealing mold, the mold base and the fixing can be efficiently performed. The cooling of the sealing mold on the mold base. Therefore, the temperature of the sealing mold can be lowered in a shorter period of time than before, thereby shortening the waiting time until the repair operation or replacement operation is started.

In addition, it is preferable that the lower mold cooling plate has a first groove portion on an upper surface through which gas used for cooling circulates. In addition, it is preferable that the upper mold cooling plate has a third groove portion on a lower surface through which gas used for cooling circulates. According to this, the heat sink effect of the cooling plate can be improved, so that the mold base and the sealing mold fixed to the mold base can be cooled more efficiently.

In addition, it is preferable that the thickness of the lower mold cooling plate in the vertical direction is set so that the lower surface of the lower mold cooling plate does not contact the upper surface of the lower mold support plate, and the lower mold cooling plate has a lower mold pillar insertion hole. The through hole has an inner diameter that does not come into contact with the lower mold pillar and is formed to penetrate up and down so that the lower mold pillar can be inserted therethrough. In addition, it is preferable that the thickness of the upper mold cooling plate in the vertical direction is set so that the upper surface of the upper mold cooling plate does not contact the lower surface of the upper mold support plate, and that the upper mold cooling plate has an upper mold column insertion hole. The through hole has an inner diameter that does not come into contact with the upper mold pillar and is formed to penetrate up and down so that the upper mold pillar can be inserted therethrough. According to this, the cooling plate can be arranged so as not to contact the column for adjusting the flatness of the sealed mold. Therefore, the flatness of the mold will not be affected and the total thickness of the molded product will not change (Total Thickness Variation (TTV) has adverse effects.

In addition, it is preferable that the lower mold base has a second groove portion on a lower surface for circulating gas used for cooling. In addition, it is preferable that the upper mold base has a fourth groove portion on an upper surface through which gas used for cooling circulates. According to this, the cooling of the mold base can be accelerated, and therefore the mold base and the mold fixed to the mold base can be cooled more efficiently. [Effects of the invention]

According to the present invention, when repair work is performed when a workpiece or molded product is damaged, resin leakage, etc. occurs inside the sealing mold, or when a sealing mold is replaced for a change of product, etc., the sealing mold can be repaired in a short time. Reduce the temperature of the sealing mold. Therefore, the waiting time until these operations can be started can be shortened, thereby preventing a decrease in the operation rate of the device.

(overall structure) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a plan view (schematic view) showing an example of the resin sealing device 1 according to this embodiment. In addition, for convenience of explanation, the left-right direction (X direction), the front-rear direction (Y direction), and the up-down direction (Z direction) of the resin sealing device 1 are represented by arrows in the figure. In addition, in all the drawings for describing each embodiment, members having the same functions are denoted by the same reference numerals, and repeated descriptions thereof may be omitted.

The resin sealing device 1 of this embodiment is a device that performs resin sealing on a workpiece (formed product) W using a sealing mold 202 including an upper mold 204 and a lower mold 206 . Hereinafter, as the resin sealing device 1, a compression molding device that holds the workpiece W using a workpiece holding portion provided in one of the upper mold 204 or the lower mold 206 and a release film ( Release film) (hereinafter sometimes referred to as "film") F covers the mold cavity (including a part of the mold surface) provided in the other, clamps the upper mold 204 and the lower mold 206, and performs the workpiece W with the resin. Resin sealed. However, it is not limited to this. A release film is also not required.

First, the workpiece W to be formed includes a structure in which a plurality of electronic components are mounted in a matrix on a base material as a representative example. More specifically, examples of the base material include resin substrates formed in rectangular shapes, circular shapes, etc., ceramic substrates, metal substrates, glass/metal carrier plates, lead frames, and wafers. Plate-like components. Examples of electronic components include semiconductor wafers, Micro Electro Mechanical System (MEMS) wafers, passive components, heat sinks, conductive members, spacers, and the like. However, it is not limited to this.

Examples of methods of mounting electronic components on a base material include mounting methods such as wire bonding mounting and flip chip mounting. Alternatively, in the case of a structure in which the base material (pallet) is peeled off from the molded product Wp after resin sealing, there is also the following method: using a thermally releasable adhesive tape or an ultraviolet curable resin that is cured by ultraviolet irradiation. Comes with electronic parts.

On the other hand, as an example of the resin, a liquid thermosetting resin (for example, an epoxy resin containing a filler, etc.) can be used. In addition, the resin is not limited to the state described above, and may be in other states (shapes) such as granular form (used as a general term for granular form, pulverized form, powder form, etc.), plate form, sheet form, solid form, tablet form, etc. , and may also be resins other than epoxy thermosetting resins.

In addition, as an example of the film F, a film material excellent in heat resistance, ease of peeling, flexibility, and stretchability, such as polytetrafluoroethylene (PTFE), ethylene-tetrafluoroethylene copolymer (ethylene- tetrafluoroethylene (ETFE) (polytetrafluoroethylene polymer), polyethylene terephthalate (PET), fluorinated ethylene propylene (FEP), fluorine-impregnated glass cloth, polypropylene, polyvinylidene Ethylene chloride, etc. In this embodiment, a roll-shaped film can be used as the film F. Furthermore, as another example, a structure using a short strip-shaped film may be used (not shown).

Next, the outline of the resin sealing device 1 of this embodiment will be described. As shown in FIG. 1 , the resin sealing device 1 includes the following parts as its main components: a transfer unit 100A, which mainly transfers workpieces W and molded products Wp; a workpiece supply unit 100B, which mainly supplies workpieces W; and a resin supply unit 100C, which mainly transfers workpieces W and molded products Wp. The resin is supplied; the pressing unit 100D seals the workpiece W with resin and mainly processes the molded product Wp; the post-curing unit 100E mainly performs post-curing of the resin-sealed molded product Wp; and the molded product storage unit 100F mainly processes the molded product Wp. The post-cured molded product Wp is stored; the control unit 100G mainly controls each mechanism and each step.

In this embodiment, the transport unit 100A is arranged in the center of the device, and each unit is arranged to surround the transport unit 100A. Specifically, the workpiece supply unit 100B, the resin supply unit 100C, and the molded product storage unit 100F are arranged on the front side of the transfer unit 100A. Moreover, the pressing unit 100D is arrange|positioned on the rear side of the conveyance unit 100A. In addition, the post-curing unit 100E is arranged on the right side and the right front side of the transport unit 100A. In addition, the control unit 100G is arranged on the right rear side of the transport unit 100A. However, it is not limited to this.

Furthermore, the overall configuration of the resin sealing device 1 can be changed by changing the structure of the unit. For example, the structure shown in FIG. 1 is an example in which two pressing units 100D are arranged, but it may also be a structure in which only one pressing unit 100D or three or more pressing units 100D are arranged. In addition, the structure of additionally arranging other units, etc. (both are not shown in the figure) can also be added.

(Transfer unit) First, the conveyance unit 100A included in the resin sealing device 1 will be described.

The transport unit 100A includes a transport device 102 that transports the workpiece W and the molded product Wp. As an example, the transport device 102 is configured to include the following parts: a guide rail 104; a base portion 106 that reciprocates along the guide rail 104 in a predetermined direction (for example, the left-right direction); and a holding and moving mechanism 108 (for example, a multi-jointed robot). ), is fixed to the base portion 106 and holds and moves the workpiece W and the molded product Wp. This makes it possible to hold the workpiece W or the molded product Wp and carry out transportation between units, loading/unloading into each mechanism, and the like.

(Workpiece supply unit) Next, the workpiece supply unit 100B included in the resin sealing device 1 will be described.

The workpiece supply unit 100B includes a workpiece storage 110 for accommodating workpieces W. As an example, a well-known stack magazine, a slit magazine, etc. can be used in the workpiece storage 110, and a plurality of workpieces W can be stored together. The plurality of workpieces W are carried out one by one by the holding and moving mechanism 108 .

(Resin supply unit) Next, the resin supply unit 100C included in the resin sealing device 1 will be described. In the resin supply unit 100C, resin is supplied (placed) to the workpiece W carried in from the workpiece supply unit 100B by the transport device 102 .

The resin supply unit 100C is composed of a pair of distributors 312 for ejecting the resin (liquid resin here) in the syringe 314 and supplying it to the workpiece W; and a revolver syringe supply part 316. A plurality of replacement syringes 314 are rotatably held between the pair of dispensers 312 . Each dispenser 312 is configured to eject resin while sequentially receiving a supply of replacement syringes 314 from a common syringe supply unit 316 .

(suppression unit) Next, the pressing unit 100D included in the resin sealing device 1 will be described. In the pressing unit 100D, the workpiece W (in a state where resin is placed) carried in from the resin supply unit 100C by the transport device 102 is resin-sealed.

The pressing unit 100D includes a sealing mold 202 having an opening and closing pair of molds (for example, a mold assembled from a plurality of mold blocks, mold plates, mold columns, etc., or other components including alloy tool steel). It also includes a pressing device 250 that drives the sealing mold 202 to open and close to seal the workpiece W with resin. It further includes a transfer loader 210 that carries the workpiece W and the molded product Wp into/out of the sealing mold 202 (in addition, the transfer loader 210 may not be provided and the holding and moving mechanism may be used). 108 direct move-in/move-out structure).

Here, as shown in FIG. 2 , the pressing device 250 includes a pair of pressure plates 254 and 256 , a plurality of tie rods 252 on which the pair of pressure plates 254 and 256 are mounted, a driving device that moves (raises and lowers) the pressure plate 256 , and the like. . Specifically, the driving device includes a driving source (for example, an electric motor) 260 and a drive transmission mechanism (for example, a ball screw or a toggle mechanism) 262 (however, it is not limited thereto). In the present embodiment, the pressure plate 254 on the upper side in the vertical direction is set as a fixed pressure plate (a pressure plate fixed to the tie rod 252), and the pressure plate 256 on the lower side is set as a movable pressure plate (a slidable pressure plate). The pressure plate is lifted and lowered by the pull rod 252). However, it is not limited to this, and the upper and lower sides may be reversed, that is, the upper side may be set as the movable platen, and the lower side may be set as the fixed platen, or both the upper side and the lower side may be set as the movable platen ( None are shown).

On the other hand, the sealing mold 202 includes one mold on the upper side in the vertical direction (upper mold 204 ) and the other mold on the lower side (lower mold 206 ) as the one disposed in the pressing device 250 . A pair of molds between the pressure plates 254 and 256. That is, the upper mold 204 is assembled to the upper platen (the fixed platen 254 in this embodiment), and the lower mold 206 is assembled to the lower platen (the movable platen 256 in this embodiment). Mold closing/mold opening is performed by the upper mold 204 and the lower mold 206 approaching/moving away from each other (the vertical direction (up and down direction) becomes the mold opening and closing direction).

Moreover, in this embodiment, as an example, the film supply mechanism 213 which conveys (supplies) the roll-shaped film F to the inside of the sealing mold 202 is provided.

Next, the assembly structure of the lower mold 206 in the sealing mold 202 will be described in detail. As shown in FIG. 2 , the lower mold 206 is fixed to the lower mold base 236 . The lower mold molding base 236 is provided with a lower mold heating mechanism 237 (eg, electric heating wire heater, etc.) that heats the lower mold 206 to a predetermined temperature (eg, 100° C. to 200° C.).

In addition, the lower mold mold base 236 is fixed to the lower mold support plate 216 with a plurality of lower mold pillars 276 interposed therebetween (that is, a plurality of lower mold pillars 276 are fixed to the lower mold support plate 216, and the plurality of lower mold pillars 276 are fixed to the lower mold support plate 216. A lower molded base 236) is fixed on the upper part. As an example, the lower mold pillar 276 is formed into a cylindrical shape (for example, a diameter of several dozen mm and a height of several tens of mm) using a ceramic material. A plurality of the lower mold pillars 276 are erected on the lower mold support plate 216, and the lower mold mold base 236 is supported by their upper surfaces. At this time, by adjusting the upper surface heights of the plurality of lower mold columns 276 with high precision so that they fall within a predetermined tolerance (dimensional difference), the mold closing force exerted by the movable platen 256 and the fixed platen 254 can be adjusted. The force is evenly transmitted to the lower mold mold base 236 and then to the lower mold 206 in the surface direction. That is, the flatness of the lower mold 206 can be maintained when the mold is closed. Therefore, it is possible to prevent the occurrence of molding defects caused by the mold closing force becoming non-uniform in the surface direction and causing the lower mold 206 to deform (bend).

In addition, the lower mold support plate 216 is fixed to the movable platen 256 . Furthermore, a structure may be adopted in which other support members, urging members, etc. are interposed between the lower mold support plate 216 and the movable platen 256 (not shown).

Here, in the space 296 (hereinafter referred to as the "lower mold space") between the lower mold support plate 216 and the lower mold base 236 where the lower mold pillar 276 is arranged, there is a gap between the lower mold support plate 216 and the lower mold base 236 . A lower mold cooling plate 286 is provided in contact with the lower surface 236a of the lower mold 236 (the surface opposite to the fixed surface of the lower mold 206). As an example, the lower mold cooling plate 286 is formed using a metal material. Thereby, the lower mold cooling plate 286 functions as a heat sink and absorbs heat from the lower mold mold base 236 in the abutting state, thereby cooling the lower mold mold base 236 . Therefore, the lower mold cooling plate 286 can preferably use materials with particularly high thermal conductivity (stainless steel alloy, aluminum alloy, alloy tool steel).

In addition, the thickness of the lower mold cooling plate 286 in the vertical direction is set so that the lower surface 286b does not contact the upper surface 216a of the lower mold support plate 216. According to this, the lower mold space 296 in which the lower mold pillar 276 is disposed can be effectively used to install the lower mold cooling plate 286, so the size of the apparatus is not increased.

In addition, the lower mold cooling plate 286 is formed with lower mold pillar insertion holes 293 penetrating in the up-down direction through which the lower mold pillars 276 are inserted. At this time, the inner diameter of each lower mold pillar insertion hole 293 is formed to be sufficiently larger than the outer diameter of each lower mold pillar 276 (at an interval of several mm). Accordingly, even when the lower mold cooling plate 286 expands and contracts due to the influence of heat, contact with the lower mold pillar 276 can be prevented. That is, the flatness of the lower mold 206 will not be affected, and the TTV (Total Thickness Variation) of the molded product will not be adversely affected.

As described above, in this embodiment, by providing the structure of the lower mold pillar 276, the deformation (bending) of the lower mold 206 can be suppressed, thereby preventing the occurrence of molding defects. In addition, by providing the structure of the lower mold cooling plate 286, a mechanism for cooling the lower mold mold base 236 can be realized. Therefore, the lower mold mold base 236 incorporating the lower mold heating mechanism 237 for heating the lower mold 206 can be actively and efficiently cooled by the lower mold cooling plate 286 . As a result, the temperature of the lower mold 206 fixed (in contact) with the lower mold mold base 236 can be lowered in a shorter time than before, and the waiting time until the repair work or replacement work is started can be achieved. shortening of time. In addition, resin burrs, broken glass, etc. that are to be removed during repair work will not be scattered like air blasts.

Furthermore, in this embodiment, as shown in FIG. 3 , the upper surface 286 a of the lower mold cooling plate 286 has a groove portion 292 (first groove portion) that circulates gas used for cooling (for example, air at normal temperature or low temperature). ) is formed to connect the supply port 292a and the discharge port 292b along the surface direction (the direction parallel to the upper surface 286a). The first groove portion 292 is curved to avoid the lower mold pillar insertion hole 293, and is provided with a plurality of grooves. Each first groove portion 292 has a width dimension of several mm to tens of mm, and a depth dimension of several mm to several millimeters. About ten millimeters. However, the shape, size, and number of pieces (number of pieces) are not particularly limited. Accordingly, by causing the gas to flow from the supply port 292a toward the discharge port 292b in the first groove portion 292, the heat sink effect of the lower mold cooling plate 286 can be improved, so that the lower mold base can be molded more efficiently. 236, and then the lower mold 206 is cooled. Furthermore, it is preferable to provide a silent muffler (not shown) in the discharge port 292b. Accordingly, it is possible to reduce the sound volume generated when gas is discharged and to prevent dust and the like from scattering. In this embodiment, since it is easy to process, the curved groove portion 292 is processed on one side. However, it does not necessarily have to be a groove and may be a hole. In this case, holes and blind plugs can also be processed in the same manner.

Next, a modification of the lower mold cooling plate 286 will be described. Specifically, the lower surface 236a of the lower mold mold base 236 and the upper surface 286a of the lower mold cooling plate 286 may be "close" instead of the "abutting" structure (not shown). As an example, "proximity" is set to a spacing size of about several mm. Accordingly, a sealed space can be formed between the lower surface 236a of the lower mold base 236 and the upper surface 286a of the lower mold cooling plate 286, and this space can be used as a flow path for cooling gas. Therefore, the lower surface 236a of the lower mold mold base 236 can be completely cooled by the cooling gas, and the heat sink effect of the lower mold cooling plate 286 via the cooling gas can also be obtained. In this case, the flow rate of the gas can also be controlled by integrally surrounding the cooling plate 286 and the mold base 236, or the groove can be used as a heat sink to further increase the surface area.

Next, modifications of the lower mold base 236 will be described. Specifically, instead of (or in addition to) providing the groove portion 292 (first groove portion) for circulating cooling gas on the upper surface 286 a of the lower mold cooling plate 286 , the lower mold cooling plate 286 may be provided with a groove portion 292 (first groove portion) for flowing the cooling gas. The lower surface 236a of the mold base 236 has a structure (not shown) provided with a groove portion (second groove portion) through which cooling gas flows. Accordingly, by circulating the cooling gas in the second groove portion, the cooling of the lower mold base 236 can be accelerated, and therefore the lower mold base 236 can be cooled more efficiently. Cooling of lower mold 206. Furthermore, the shape, size, and number (number) of the second groove portions are not particularly limited.

Next, the assembly structure of the upper mold 204 in the sealing mold 202 will be described in detail. As shown in FIG. 2 , the upper mold 204 is fixed to the upper mold molding base 234 . The upper mold mold base 234 is provided with an upper mold heating mechanism 235 (eg, electric heating wire heater, etc.) that heats the upper mold 204 to a predetermined temperature (eg, 100° C. to 200° C.).

In addition, the upper mold mold base 234 is fixed to the upper mold support plate 214 with a plurality of upper mold pillars 274 interposed therebetween (that is, a plurality of upper mold pillars 274 are fixed under the upper mold support plate 214. An upper mold base 234 is fixed below the column 274). As an example, the upper mold pillar 274 is formed of a ceramic material into a cylindrical shape (for example, a diameter of several tens of mm and a height of several tens of mm). A plurality of the upper mold columns 274 are erected under the upper mold support plate 214 , and the upper mold mold base 234 is supported by their lower surfaces. At this time, by adjusting the lower surface heights of the plurality of upper mold columns 274 with high precision so that they fall within a predetermined tolerance (dimensional difference), the mold closing force exerted by the movable platen 256 and the fixed platen 254 can be adjusted. The force is evenly transmitted to the upper mold mold base 234 and then to the upper mold 204 in the surface direction. That is, the flatness of the upper mold 204 can be maintained during mold closing. Therefore, it is possible to prevent the occurrence of molding defects caused by the mold closing force becoming non-uniform in the surface direction and causing the upper mold 204 to deform (bend).

In addition, the upper mold support plate 214 is fixed to the fixed platen 254 . Furthermore, it may also be a structure in which other support members, urging members, etc. are interposed between the upper mold support plate 214 and the fixed platen 254 (not shown).

Here, in the space 294 (hereinafter referred to as the "upper mold space") between the upper mold support plate 214 where the upper mold pillar 274 is arranged, and the upper mold mold base 234, there is a gap between the upper mold support plate 214 and the upper mold mold base 234. An upper mold cooling plate 284 is provided in contact with the upper surface 234a of the upper mold 234 (the surface opposite to the fixed surface of the upper mold 204). As an example, the upper mold cooling plate 284 is formed using a metal material. Thereby, the upper mold cooling plate 284 functions as a heat sink and absorbs heat from the upper mold mold base 234 in the abutting state, thereby cooling the upper mold mold base 234 . Therefore, the upper mold cooling plate 284 can preferably use materials with particularly high thermal conductivity (stainless steel alloy, aluminum alloy, alloy tool steel).

In addition, the thickness of the upper mold cooling plate 284 in the vertical direction is set so that the upper surface 284b does not contact the lower surface 214a of the upper mold support plate 214. According to this, the upper mold space 294 in which the upper mold column 274 is disposed can be effectively used to install the upper mold cooling plate 284, so the size of the apparatus will not be increased.

In addition, upper mold cooling plate 284 is formed with upper mold pillar insertion holes 291 extending in the up-down direction through which upper mold pillars 274 are inserted. At this time, the inner diameter of each upper mold pillar insertion hole 291 is formed to be sufficiently larger than the outer diameter of each upper mold pillar 274 (at an interval of several mm). Accordingly, even when the upper mold cooling plate 284 expands and contracts due to the influence of heat, contact with the upper mold pillar 274 can be prevented. That is, the flatness of the upper mold 204 will not be affected, and the TTV (Total Thickness Variation) of the molded product will not be adversely affected.

As described above, in this embodiment, by providing the structure of the upper mold pillar 274, the deformation (bending) of the upper mold 204 can be suppressed, thereby preventing the occurrence of molding defects. In addition, by providing the structure of the upper mold cooling plate 284, a mechanism for cooling the upper mold mold base 234 can be realized. Therefore, the upper mold mold base 234 incorporating the upper mold heating mechanism 235 for heating the upper mold 204 can be actively and efficiently cooled by the upper mold cooling plate 284 . As a result, the temperature of the upper mold 204 fixed (contacted) to the upper mold mold base 234 can be lowered in a shorter time than before, and the waiting time until the repair work or replacement work is started can be achieved. shortening of time. In addition, resin burrs, broken glass, etc. that are to be removed during repair work will not be scattered like air blasts.

Furthermore, in this embodiment, as shown in FIG. 4 , in the lower surface 284 a of the upper mold cooling plate 284 , there is a groove portion 290 (third groove) through which gas used for cooling (for example, air at room temperature or low temperature, etc.) circulates. portion) is formed so as to communicate the supply port 290a and the discharge port 290b along the surface direction (the direction parallel to the lower surface 284a). The third groove portion 290 is curved to avoid the upper mold column insertion hole 291, and is provided with a plurality of third groove portions 290. Each of the third groove portions 290 has a width dimension of several mm to tens of mm, and a depth dimension of several mm to several millimeters. About ten millimeters. However, the shape, size, and number of pieces (number of pieces) are not particularly limited. Accordingly, by causing the gas to flow from the supply port 290a toward the discharge port 290b in the third groove portion 290, the heat sink effect of the upper mold cooling plate 284 can be improved, so that the upper mold base can be molded more efficiently. 234, and then the upper mold 204 is cooled. Furthermore, a structure in which a silent muffler (not shown) is provided at the discharge port 290b is preferred. Accordingly, it is possible to reduce the sound volume generated when gas is discharged and to prevent dust and the like from scattering.

Next, a modification of the upper mold cooling plate 284 will be described. Specifically, the upper surface 234a of the upper mold mold base 234 and the lower surface 284a of the upper mold cooling plate 284 may be "close" instead of the "abutting" structure (not shown). As an example, "proximity" is set to a spacing size of about several mm. Accordingly, a sealed space can be formed between the upper surface 234a of the upper mold mold base 234 and the lower surface 284a of the upper mold cooling plate 284, and this space can be used as a flow path for cooling gas. Therefore, the upper surface 234a of the upper mold mold base 234 can be completely cooled by the cooling gas, and the heat sink effect of the upper mold cooling plate 284 via the cooling gas can also be obtained.

Next, modifications of the upper mold base 234 will be described. Specifically, instead of (or in addition to) providing the groove portion 290 (third groove portion) for circulating cooling gas on the lower surface 284a of the upper mold cooling plate 284, it may be provided on the upper mold cooling plate 284. The upper surface 234a of the mold base 234 has a structure (not shown) provided with a groove portion (fourth groove portion) through which cooling gas flows. Accordingly, by circulating the cooling gas in the fourth groove portion, the cooling of the upper mold base 234 can be accelerated, and therefore the upper mold base 234 can be cooled more efficiently. Cooling of upper mold 204. Furthermore, the shape, size, and number (number) of the fourth groove portions are not particularly limited.

Next, modifications of the pressing device 250 will be described. As shown in FIG. 5 , the assembly structure of the lower mold 206 is the same as that in the above embodiment. On the other hand, the assembly structure of the upper mold 204 is different from the above embodiment, as described below. Specifically, the upper mold 204 is fixed to the upper plate 218 . The upper plate 218 is provided with an upper mold heating mechanism 219 (eg, electric heating wire heater, etc.) that heats the upper mold 204 to a predetermined temperature (eg, 100° C. to 200° C.). In addition, the upper plate 218 is fixed to the fixed pressure plate 254 . Furthermore, it may also be a structure in which other supporting members or urging members are interposed between the upper plate 218 and the fixed pressure plate 254 (not shown).

Furthermore, another modification of the pressing device 250 will be described. As shown in FIG. 6 , the assembly structure of the upper mold 204 is the same as that in the above embodiment. On the other hand, the assembly structure of the lower mold 206 is different from the above embodiment, as described below. Specifically, the lower mold 206 is fixed to the lower plate 220 . The lower plate 220 is provided with a lower mold heating mechanism 221 (eg, electric heating wire heater, etc.) that heats the lower mold 206 to a predetermined temperature (eg, 100° C. to 200° C.). In addition, the lower plate 220 is fixed to the movable pressure plate 256 . Furthermore, a structure (not shown) in which other supporting members or urging members may be interposed between the lower plate 220 and the movable pressure plate 256 may be used.

(Post-curing unit) Next, the post-curing unit 100E included in the resin sealing device 1 will be described. In the post-curing unit 100E, the molded article Wp carried in from the pressing unit 100D by the conveying device 102 is post-cured.

The post-curing unit 100E includes one or more ovens (post-curing ovens) 400 having a plurality of heating chambers 402 that hold the molded product Wp carried by the transport device 102 inside and heat it at a set temperature. for post-curing. Furthermore, a structure not including the post-curing unit 100E may be used (not shown).

(Molded product storage unit) Next, the molded product storage unit 100F included in the resin sealing device 1 will be described. In the molded product storage unit 100F, the molded product Wp carried in from the post-curing unit 100E by the transfer device 102 is stored.

The molded product storage unit 100F includes a molded product storage 112 for storing molded products Wp. As an example, a well-known stack magazine, a slit magazine, etc. are used for the molded product storage 112, and a plurality of molded products Wp can be stored together. The plurality of molded products Wp are carried in one by one by the holding and moving mechanism 108 .

(control unit) Next, the control unit 100G included in the resin sealing device 1 will be described. The control unit 100G is composed of the following parts: an operation part 152 for the operator to input the working conditions of the resin sealing device 1; and a control part 150 for performing operation according to the working conditions input by the operator and the working conditions memorized in advance. Operation control of each mechanism in the resin sealing device 1. In addition, the operation part 152 is not limited to a structure arranged in the control unit 100G, and may be arranged in another unit or at an adjacent position thereof.

As explained above, with the resin sealing device of the present invention, repair work is performed when damage to a workpiece or molded product, resin leakage, etc. occurs inside the sealing mold, or the sealing mold is replaced for a change of product. In such cases, the temperature of the sealing mold can be reduced in a short period of time. Therefore, the waiting time until these operations can be started can be shortened, thereby preventing a decrease in the operation rate of the device.

In addition, the present invention is not limited to the above-described embodiment, and various changes can be made without departing from the scope of the present invention. In particular, the structure including a sealing mold for a resin sealing device based on a compression molding method has been described as an example. However, the structure is not limited to this, and a structure including a sealing mold for a resin sealing device based on a transfer molding method may also be used. The same applies.

In addition, in the embodiment, the pressure plate on the lower side in the vertical direction becomes the movable pressure plate as an example. However, the structure is not limited to this. The pressure plate on the upper side in the vertical direction The same can be applied to a structure in which the pressure plates on the lower side and the upper side become movable pressure plates, or in which the pressure plates on the lower side and the upper side become movable pressure plates.

1: Resin sealing device 100A:Transfer unit 100B: Workpiece supply unit 100C: Resin supply unit 100D: Pressing unit 100E: Post-curing unit 100F: Molded product storage unit 100G: Control unit 102:Conveying device 104: Guide rail 106: Base part 108:Keep moving mechanism 110: Workpiece storage 112: Molded product storage 150:Control Department 152:Operation Department 202:Sealing mold 204: Upper mold 206:Lower mold 210:Transport loader 213: Film supply mechanism 214: Upper mold support plate 214a, 236a, 284a, 286b: lower surface 216: Lower mold support plate 216a, 234a, 284b, 286a: upper surface 218:On the board 219, 235: Upper mold heating mechanism 220: Lower board 221, 237: Lower mold heating mechanism 234: Upper mold molded base 236: Lower mold molded base (molded base) 250:Suppression device 252:Tie rod 254, 256: pressure plate 260:Drive source 262: Drive transmission mechanism 274: Upper mold column 276:Lower mold column 284: Upper mold cooling plate 286: Lower mold cooling plate (cooling plate) 290, 292: Groove 290a, 292a: Supply port 290b, 292b: discharge port 291: Upper mold column insertion hole 293: Lower mold column insertion hole 294:Space Department 296: Lower mold space part (space part) 312:Distributor 314:Syringe 316:Syringe supply department 400: Oven (post-curing oven) 402:Heating chamber F: Film (release film) W: workpiece Wp: Molded product X, Y, Z: direction

FIG. 1 is a plan view showing an example of a resin sealing device according to an embodiment of the present invention. FIG. 2 is a front cross-sectional view showing an example of the pressing device of the resin sealing device of FIG. 1 . FIG. 3 is a plan view at the III-III line of FIG. 2 . FIG. 4 is a bottom view at the position of line IV-IV in FIG. 2 . FIG. 5 is a front cross-sectional view showing another example of the pressing device of the resin sealing device of FIG. 1 . FIG. 6 is a front cross-sectional view showing another example of the pressing device of the resin sealing device of FIG. 1 .

202:Sealing mold

204: Upper mold

206:Lower mold

214: Upper mold support plate

214a, 236a, 286b: lower surface

216: Lower mold support plate

216a, 234a, 284b: upper surface

234: Upper mold molded base

235: Upper mold heating mechanism

236: Lower mold molded base (molded base)

237: Lower mold heating mechanism

250:Suppression device

252:Tie rod

254, 256: pressure plate

260:Drive source

262: Drive transmission mechanism

274: Upper mold column

276:Lower mold column

284: Upper mold cooling plate

286: Lower mold cooling plate (cooling plate)

294:Space Department

296: Lower mold space part (space part)

X, Y, Z: direction

Claims (8)

A resin sealing device that uses a sealing mold including an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product. The resin sealing device is characterized by: including a lower mold molding base for fixing the lower mold, The lower mold molding base is fixed to the lower mold support plate with a plurality of lower mold pillars spaced apart, A lower mold cooling plate is provided in the lower mold space in which the lower mold column is arranged. The lower mold cooling plate is in contact with or close to the lower surface of the lower mold mold base to perform the lower mold molding process. Cooling of the molded base. The resin sealing device according to claim 1, wherein, The lower mold cooling plate has a first groove portion on an upper surface through which gas used for cooling circulates. The resin sealing device according to claim 1, wherein, The thickness of the lower mold cooling plate in the vertical direction is set so that the lower surface does not contact the upper surface of the lower mold support plate, and The lower mold cooling plate has a lower mold column insertion hole through which the lower mold column is inserted. The lower mold column insertion hole has an inner diameter that does not come into contact with the lower mold column and is formed to penetrate up and down. The resin sealing device according to claim 1, wherein, The lower mold base has a second groove portion on a lower surface through which gas used for cooling circulates. A resin sealing device that uses a sealing mold including an upper mold and a lower mold to seal a workpiece with resin and process it into a molded product. The resin sealing device is characterized by: including an upper mold molding base for fixing the upper mold, The upper mold molding base is fixed to the upper mold support plate with a plurality of upper mold columns interposed therebetween, An upper mold cooling plate is provided in the upper mold space where the upper mold column is arranged. The upper mold cooling plate is in contact with or close to the upper surface of the upper mold molding base to perform the upper mold processing. Cooling of the molded base. The resin sealing device according to claim 5, wherein, The upper mold cooling plate has a third groove portion on a lower surface through which gas used for cooling circulates. The resin sealing device according to claim 5, wherein, The thickness of the upper mold cooling plate in the vertical direction is set so that the upper surface does not contact the lower surface of the upper mold support plate, and The upper mold cooling plate has an upper mold column insertion hole through which the upper mold column is inserted. The upper mold column insertion hole has an inner diameter that does not come into contact with the upper mold column and is formed vertically through the upper mold column. The resin sealing device according to claim 5, wherein, The upper mold base has a fourth groove portion on an upper surface through which gas used for cooling circulates.