TW202130485A - Resin molding device and resin molding method capable of eliminating the issue of temperature drop of the molding mold when the resin is injected into the molding die or during the workpiece placement - Google Patents

Abstract

The invention realizes a resin molding device and a resin molding method, eliminating the issue of temperature drop of a molding mold when the resin is injected into the molding mold or during the workpiece placement and capable of reducing the occurrence of poor forming without increasing the cycle time. The resin molding device 100 of the invention comprises a molding mold 10 consisting of an upper mold 21 and a lower mold 20, and uses resin R to mold the workpiece W where a first component Wa is carried with a second component Wb into a molded product, and comprises a first loader 82 that transports the resin R to the molding mold 10, wherein the first loader 82 is equipped with a heating device 50 for heating the surface of a specified area of the molding mold 10 during the movement process.

Description

Resin molding device and resin molding method

The invention relates to a resin molding device and a resin molding method for molding a workpiece by using resin.

Regarding the manufacture of semiconductor devices and the like, resin molding apparatuses are widely used in which a workpiece on which an electronic component is mounted on a substrate is molded with resin to form a molded product. As examples of such resin molding apparatuses, transfer molding apparatuses and compression molding apparatuses are known.

Here, the transfer molding device is a device that uses an upper mold and a lower mold to close the workpiece, and uses a plunger to extrude the molten resin from the tank of the molding mold, and fill the mold cavity with the resin to perform resin molding. (Refer to Patent Document 1: Japanese Patent Laid-Open No. 9-155911).

In addition, the compression molding device supplies a predetermined amount of resin to a molding area (mold cavity) provided in a molding die composed of an upper mold and a lower mold, and arranges a workpiece in the molding area. A device for resin molding by clamping the mold and the lower mold. At this time, in the case of using a molding die provided with a cavity in the upper mold, generally a resin with a high viscosity is supplied in batches to the center of the workpiece for molding. On the other hand, in the case of using a molding die with a cavity provided in the lower mold, a film is generally used to cover the mold surface containing the cavity, and the molding resin is supplied with a uniform thickness, and the mold held in the upper mold The workpiece is immersed in molten molding resin to perform resin molding (see Patent Document 2: Japanese Patent Laid-Open No. 2004-148621). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 9-155911 [Patent Document 2] Japanese Patent Laid-Open No. 2004-148621

[The problem to be solved by the invention] In the resin molding apparatus exemplified above, in the case of a thermosetting resin, the temperature of the molding die is raised to about 180 degrees, and when the resin is put into the molding die, the heated self-heating molding die is The resin is absorbed, and the temperature of the input part and its surroundings is reduced. This phenomenon may occur not only when the resin is injected, but also when the base material is placed in the molding die.

When such a temperature drop occurs, the step of operating the heater of the molding die to return to a predetermined temperature is carried out. In order to prevent this as much as possible, there is also a method of preheating the base material and resin to about 80 degrees, but there is a temperature difference with the mold. It takes several tens of seconds to recover the temperature using this step, but since it is completed in the molding cycle, it has little influence on the next molding.

However, in recent years, in semiconductor devices exemplified by large-scale power devices for vehicles, etc., molding using large-capacity resins is increasing. In this case, the following problems may occur: the temperature recovery step cannot be completed in the molding cycle, and the next molding cycle is entered before the temperature is restored to the specified temperature, and molding defects caused by insufficient heat are likely to occur ( Unfilled, voids, etc.). Conversely, if you wait to return to a predetermined temperature and then enter the next molding cycle, the lack of heat can be eliminated, but the cycle time increases and productivity decreases.

[Technical means to solve the problem] The present invention is made in view of the above circumstances, and its object is to realize a resin molding device that eliminates the problem of a decrease in the temperature of the molding die when resin is injected into the molding die or when the workpiece is set. , Can reduce the occurrence of poor forming conditions without increasing the cycle time.

The present invention solves the above-mentioned problem by the solution described below as an embodiment.

The resin molding device of the present invention is a resin molding device that uses a molding mold including an upper mold and a lower mold, and uses resin to mold a workpiece with a second member mounted on a first member to form a molded product , The essentials are: a first loader that transports the resin into the molding die, and the first loader is equipped with a device that heats the surface of a predetermined area of the molding die during the movement process. heating equipment.

According to this, when the temperature of the molding die decreases after the resin is injected, the resin and the die can be heated during the movement of the first loader to increase the temperature. Therefore, the occurrence of forming defects can be reduced without increasing the cycle time.

In addition, it is preferable that in the first loader, the heating device is provided at a position on the front end side when entering the molding die than the resin holding portion that holds the resin. According to this, whenever the first loader heats the prescribed area when entering/exiting the molding die, the moving distance of the first loader can be minimized. Therefore, the effect of suppressing an increase in cycle time can be obtained.

In addition, it is preferable that the molding die has one or more tanks into which the small-piece resin is poured, and the heating device is configured to provide a predetermined area of the molding die including the position of the tank. The structure where the surface is heated. According to this, the resin put in the tank and the mold surface around the tank can be heated. Therefore, it is possible to effectively suppress the occurrence of molding defects caused by a decrease in the temperature of the resin.

In addition, the resin molding method of the present invention uses a molding mold including an upper mold and a lower mold, and uses resin to mold a workpiece on which the second member is mounted on the first member to form a molded product. The method includes the steps of: using a first loader to transfer the resin into the molding die; and heating the surface of a predetermined area of the molding die while the first loader moves A step of.

[Effects of the invention] According to the present invention, it is possible to eliminate the problem that the temperature of the molding die is lowered when the resin is poured into the molding die or when the workpiece is set. Therefore, it is possible to reduce molding defects that may occur due to a decrease in the temperature of the resin during resin molding without extending the cycle time.

(First Embodiment) Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic diagram (plan view) showing an example of a resin molding apparatus 100 according to an embodiment of the present invention. In addition, FIGS. 2 to 6 are schematic diagrams showing the details of each configuration of the resin molding apparatus 100. In addition, for convenience of description, arrows are sometimes used in the drawings to illustrate the front and rear, left and right, and up and down directions in the resin molding apparatus 100. In addition, in all the drawings for explaining the respective embodiments, members having the same function are denoted by the same reference numerals, and overlapping descriptions may be omitted in some cases.

The resin molding apparatus 100 of this embodiment is an apparatus that performs resin molding of a workpiece (a molded article) W. Here, the transfer molding apparatus is taken as an example for description.

First, a general configuration example of the workpiece W to be formed will be described. The work W includes a structure in which a second member Wb as an electronic component is mainly mounted on a first member Wa as a base material. More specifically, as the first member Wa, for example, various enclosing members such as a resin substrate, a ceramic substrate, a metal substrate, a lead frame, a carrier, and a wafer formed in a thin strip shape can be cited. Furthermore, the shape is not limited to a thin strip shape, and may be a circular shape or a quadrangular shape. In addition, as the second member Wb, various members such as semiconductor wafers (sometimes simply referred to as “wafers”), electronic parts, heat sinks, lead frames for wiring and heat dissipation, and bumps for electrical connection can be cited as examples. That is, the workpiece W in the present invention refers to a workpiece in a state where the second member Wb is mounted on these first members Wa (die mounting, flip-chip mounting, wire bonding mounting, etc.) and superimposed on the second member Wb. Therefore, the workpiece W also includes: a workpiece with one or more layers of wafers mounted on a substrate, a workpiece with a semiconductor device mounted on the substrate; Into the workpiece and so on. Here, as a form of resin molding, it is assumed that a plurality of mounted parts mounted on a substrate are housed in a cavity to perform resin molding in batches. In addition, it can also be applied to the case where each mounted component is individually housed in a cavity for resin molding.

Next, the outline of the resin molding apparatus 100 will be described. As shown in FIG. 1, the resin molding apparatus 100 includes a supply unit 100A for supplying molding resin (sometimes simply referred to as "resin") R and a workpiece W, a pressing unit 100B for resin molding the workpiece W, and a housing resin mold The molded product storage unit 100C of the subsequent molded product Wp serves as a main structure.

First, the supply unit 100A includes a stocker 62 that houses a magazine (not shown) in which the workpiece W is stored. The workpieces W sent out from the respective magazines by push rods (not shown) are arranged to face the placement table 64 in groups of, for example, two pieces.

A small piece supply part 66 for supplying resin (resin small pieces as an example) R is provided on the side of the mounting table 64. The workpiece W on the placement table 64 is held by a first loader (in-loader) 82 of a transport mechanism described later and transported to the pressing unit 100B. In addition, the resin (resin small pieces) R of the small piece supply unit 66 is held by the first loader 82 and is transported to the pressing unit 100B.

In addition, the pressing device 70 may be configured to provide a preheating section (not shown) that preheats the workpiece W in the middle of the conveying step.

Next, the pressing unit 100B includes a pressing device 70 that drives the molding die 10 to be described later to open/close, and clamp the preheated work W to perform resin molding. The pressing device 70 includes a well-known mold clamping mechanism, which presses the molding mold 10 in the mold opening/closing direction; a transfer drive mechanism (described later), which fills the resin melted in the tank 40 of the molding mold 10 from the tank 40 to Mold cavity 30.

In addition, the pressing device 70 may also be configured to provide a film supply mechanism, and coat the mold surface (resin molding surface) of the molding mold 10 with a known release film to perform resin molding (not shown). Icon).

Next, the molded product storage unit 100C includes: a placement portion 74 for placing the molded product Wp after resin molding; a gate cutting portion 76 that removes unnecessary resin such as gates from the molded product Wp; and a stocker 78 that contains unnecessary resins removed from the molded product Wp. Resin molded product Wp. The molded product Wp is stored in a cassette 80 for storage, and the cassette 80 in which the molded product is stored is sequentially stored in a stocker 78.

Next, in the resin molding apparatus 100 of this embodiment, as a mechanism for conveying across the units, the resin (here, resin chips) R and the workpiece W are conveyed into the molding die 10 of the press unit 100B. A loader 82, and a second loader (off-loader) that unloads the molded product Wp and unnecessary resin (cull and runner after molding) from the molding die 10 of the pressing unit 100B ) 84. Here, the supply unit 100A, the pressing unit 100B, and the molded product storage unit 100C are connected to each other by a unitized stage, so that the resin molding apparatus 100 is assembled. Guide parts 86 are respectively provided inside the apparatus of each unit, and guide rails are formed by assembling the guide parts 86 to be linearly connected. The first loader 82 and the second loader 84 are respectively installed so as to be able to move forward and backward in a linear manner from a predetermined position on the guide portion 86 along the guide rail toward the supply unit 100A, the press unit 100B, and the molded product storage unit 100C.

Therefore, by changing the structure of each unit, the structure of the resin molding apparatus 100 can be changed while maintaining the state in which the guides 86 are connected to each other. For example, FIG. 1 is an example in which two pressing devices 70 are provided, but it is also possible to configure a resin molding device (not shown) in which the pressing device 70 is a singular or a plurality of pressing devices 70 connected with three or more. In addition, it is also possible to provide a resin molding apparatus in which a part of the mechanism does not exist with respect to each unit.

Next, the structure of the pressing device 70 provided in the pressing unit 100B of the resin molding device 100 will be described.

As shown in FIG. 2, the pressing device 70 includes a molding mold 10 having a first mold (here, a lower mold) 20 and a second mold (here, an upper mold) 21. In addition, a case where the lower mold 20 is a movable mold and the upper mold 21 is a fixed mold will be described as an example, but it is not limited to this structure.

First, the lower mold 20 has the following structure: including a first mold base (lower mold mold base) 34 and a first insert (lower mold insert) 36, the lower mold insert 36 passes through the lower mold mold base 34 and fixed to the movable platen 22.

The upper surface of the lower mold insert 36 is provided with a workpiece support portion 38 that supports the workpiece W (on the side of the first member Wa). In this embodiment, as a relatively large-sized workpiece W, a workpiece support portion 38 that supports one workpiece W is provided.

On the other hand, the upper mold 21 has a structure including a second molding base (upper mold molding base) 26 and a second insert (upper mold insert) 28, and the upper mold insert 28 is molded by the upper mold The base 26 is fixed to the fixed platen 24. In addition, the fixed platen 24 is fixed to the pillar 42.

The lower surface of the upper mold insert 28 is provided with a cavity 30 for accommodating a predetermined portion of the workpiece W (a portion where the second member Wb is mounted). In this embodiment, a cavity 30 is provided at a position corresponding to the workpiece support portion 38 of the lower mold insert 36. In addition, the upper mold insert 28 is provided with a resin flow path (ejection tank, flow path, etc.) 32 communicating with the mold cavity 30. In addition, as a modified example, a known structure including a movable cavity stopper at the bottom of the cavity 30 may also be adopted. The cavity may be provided only on the side of the lower mold, or may be further provided on the upper mold and the lower mold (both not shown). Show).

In the molding die 10 of this embodiment, the movable platen 22 is provided with a drive source (electric motor) and a transmission mechanism (a link mechanism such as a toggle link, a screw shaft, etc.) that transmits its drive force. A structure in which a mold clamping mechanism moves up and down (moves along the pillar 42) is known. Thus, the mold opening/closing of the lower mold 20 and the upper mold 21 is performed. In addition, the moving speed and pressure of the movable platen 22 based on the mold clamping mechanism can be appropriately set.

Furthermore, the lower mold 20 is provided with one or more (here, multiple) cylindrical tanks 40 that contain resin (here, resin chips) R. The can 40 is formed as a continuous through hole in the lower mold base 34 and the lower mold insert 36. A plunger 16 pressed by a known transfer drive mechanism (not shown) is arranged in the tank 40. The plunger 16 is pressed to supply the resin R in the tank 40 into the cavity 30.

Next, the first loader 82 and the second loader 84 that are characteristic structures in this embodiment will be described in detail (refer to FIGS. 1 to 6 ).

In the first loader 82 of the present embodiment, during the movement (at least one of them) at the time of entry/exit (including the temporary stop of reversing from entry to exit), the mold 10 at least includes resin R The heating device 50 (50A) that heats the surface of the predetermined area of the placement position (here, the position of the tank 40) is arranged at a position capable of heating toward the heating target (here, the lower surface of the first loader 82 or Front end) (refer to Figure 5). According to this, in one or both of entering/exiting the molding die 10, the first loader 82 can heat the surface of the predetermined region in the die 10 in a plan view while moving. In addition, the first loader 82 is provided with a chuck claw 44 that holds the workpiece W.

As an operation example of this embodiment, the configuration is that the first loader 82 enters the molding die 10, puts the resin R into the tank and sets the workpiece W, and then the first loader 82 self-molds the die on its return path. When 10 is withdrawn, the surface of the predetermined area of the molding die 10 is heated while moving. However, it is not limited to this configuration, and the first loader 82 may be configured to heat the surface of a predetermined region of the molding die 10 while moving when entering the molding die 10. Alternatively, it may also be configured that the first loader 82 heats the surface of the predetermined area of the molding die 10 when entering the molding die 10 and when exiting from the molding die 10 on its return path. In addition, in either case, the state in which the first loader 82 is temporarily stopped may be included.

Here, the predetermined area to be heated is set as the area (the so-called central insertion portion and its periphery) of the resin R placement portion (here, the tank 40), so that the resin charged into the tank 40 can be R and the mold surface around the tank 40 are heated. Therefore, even in the case where the temperature of the molding die 10 after the resin R is injected is significantly reduced due to the relatively large amount of resin R injected into the molding die 10, the resin can be performed during the movement of the first loader 82. R and the heating of the mold increase the temperature. In this way, the heating can be performed in a normal cycle in which the first loader 82 conveys the resin R and the workpiece W, so the cycle time does not increase, and productivity is not reduced. On the contrary, the melting of the resin R can be promoted, so not only the molding defects can be improved, but also the cycle time during molding can be shortened.

However, even if the first loader 82 heats during the movement process of entering/exiting the molding die 10 due to a larger amount of resin R, etc., if the heat is still insufficient, although the cycle time will be prolonged, it can be set to The first loader 82 is reciprocated once again or reciprocated multiple times to be heated to a predetermined temperature.

Here, it is suitable to have a structure in which in the first loader 82, the heating device 50 is provided at a position on the front end side when entering the molding die 10 compared to the resin holding portion 52 that holds the resin R. According to this, whenever the first loader 82 heats a predetermined area when entering/exiting the molding die 10, the moving distance of the first loader 82 can be minimized. Therefore, the effect of shortening the cycle time can be obtained.

As an example of the heating device 50 of this embodiment, an infrared heater having a reflecting plate 50a is used. According to this, infrared rays can be condensed toward the heating portion, and therefore, for example, it is also possible to perform pinpoint heating or the like on the end of the resin R put into the tank 40. However, it is not limited to infrared heaters, and electric heating wire heaters, halogen heaters, sheath heaters, carbon heaters, laser heaters, high-frequency heating devices, etc. may also be used.

Instead of or together with the structure, the structure may be set as follows: the predetermined area to be heated becomes the placement area of the workpiece W (here, the workpiece support portion and the peripheral area), and the first load In the machine 82, the heating device 50 (50B) is arranged at a position capable of heating toward the heating target (here, the lower surface or the front end surface of the first loader 82) (the structure is not essential, so it is indicated by the dotted line in FIG. 3) ). As an example of operation in this case, the first loader 82 enters the molding die 10, and after placing the resin R in the molding die 10 (here, the lower mold 20), the first loader 82 can return When retreating from the molding die 10 on the path, the surface of the die in the area where the workpiece W is placed is heated while moving.

In addition, as a modified example, the following configuration may be adopted: instead of the first loader 82, the heating device 50 (50C) is arranged in the second loader 84 at a position capable of heating toward the heating target (here It is the lower surface or front end surface of the second loader 84 (refer to FIG. 4). As an operation example in this case, it can be configured that the second loader 84 enters the molding die 10, and after holding the molded product Wp, the second loader 84 self-molds the molding die 10 on its return path. At the time of withdrawal, the surface of the predetermined area of the molding die 10 is heated while moving. Although FIG. 4 does not describe the molded product Wp and the unnecessary resin (rejection tank, runner), they are the structure taken out from the molding die 10 by the lower surface of the second loader 84. Alternatively, the second loader 84 may be configured to heat the surface of a predetermined region of the molding die 10 while moving when entering the molding die 10. Alternatively, the second loader 84 may also be configured to heat the surface of a predetermined area of the molding die 10 when entering the molding die 10 and when exiting from the molding die 10 on its return path. In addition, in either case, the state in which the second loader 84 is temporarily stopped may be included. Here, when the heating device 50 is installed in the second loader 84, for the same reason as when installed in the first loader 82, it is also suitable to be installed on the front end side when entering the mold 10 The structure of the location.

In place of or together with the structure, the following structure may be used: the predetermined area to be heated becomes the placement area of the work W (here, the work support and the peripheral area), and the second loading In the machine 84, the heating device 50 (50D) is arranged at a position capable of heating toward the heating target (here, the lower surface or the front end surface of the second loader 84) (the structure is not essential, so it is indicated by the dotted line in FIG. 4) ). As an example of operation in this case, the second loader 84 enters the molding die 10, and after holding the molded product Wp, when the second loader 84 can exit from the molding die 10 on its return path, The surface of the mold in the area where the workpiece W is placed is heated while moving.

In addition, as another modified example, the heating device 50 may be provided in both the first loader 82 and the second loader 84. As an operation example in this case, the heating operation by the first loader 82 and the heating operation by the second loader 84 are appropriately combined. Furthermore, as shown in FIG. 7, a multilayer heating device 50 (50E) may be provided in the first loader 82, and a long heating device 50 (50F) may be provided in parallel with the workpiece W. Either configuration can be heated for a long time, so the temperature can be further increased. In this case, it can also be used to heat the entire mold.

(Second Embodiment) Next, as a resin molding apparatus 200 according to the second embodiment of the present invention, a compression molding apparatus will be taken as an example for description. Hereinafter, the present embodiment will be described centering on the differences from the above-mentioned first embodiment. FIG. 8 is a schematic view (plan view) showing an example of the resin molding apparatus 200 according to the embodiment of the present invention. In addition, FIGS. 9 to 15 are schematic diagrams showing the details of each configuration of the resin molding apparatus 200.

First, the outline of the resin molding apparatus 200 of this embodiment will be described. As shown in FIG. 8, the resin molding apparatus 200 includes the following units as the main structure: a workpiece processing unit 200A, which mainly performs the supply of the workpiece W and the storage of the molded product Wp after resin molding; the pressing unit 200B, which mainly performs the workpiece W Resin molding is processed into a molded product Wp; the distribution unit 200C mainly performs the supply of the film F and the molding resin (herein, pellet resin, etc.) R and the storage (disposal) of the used film Fd after resin molding. In addition, in this embodiment, the following resin molding apparatus is taken as an example for description. The resin molding apparatus is a compression molding method, and two mold cavities are provided in a lower mold and two workpieces W are arranged to form Resin molding is performed in batches, thereby obtaining two molded products Wp at the same time.

In this embodiment, units such as the workpiece processing unit 200A, the pressing unit 200B, and the distribution unit 200C are connected and assembled. As an example, the workpiece processing unit 200A, the pressing unit 200B, and the distribution unit 200C are arranged side by side from the left in the left-right direction. In addition, an arbitrary number of guide rails (not shown) are provided in a straight line across between the units.

First, the workpiece processing unit 200A includes a supply cassette 102 that stores a plurality of workpieces W, and a storage cassette 112 that stores a plurality of molded products Wp. Here, the supply box 102 and the storage box 112 can use well-known stack magazines, slit magazines, and the like. In this embodiment, the mounting surface of the second member Wb is used. The workpiece W and the molded product Wp are respectively housed in the downward state.

In addition, the workpiece processing unit 200A includes a supply rail 104 on which the supply cassette 102 and the workpiece W taken out from the supply cassette 102 are placed.

In addition, the workpiece processing unit 200A includes a workpiece measuring device 114 disposed below the supply rail 104 and configured to be movable in the front and rear and left and right directions, relative to the workpiece W on the supply rail 104 from the bottom surface The thickness of the workpiece W is measured on the side (the mounting surface side of the second member Wb).

In addition, the workpiece processing unit 200A includes a workpiece heater 116 that heats the workpiece W from the lower surface side. Here, as a structure for heating the workpiece W, a known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) (not shown) is arranged on the upper surface of the workpiece heater 116. Thus, by preheating the workpiece W before being carried into the molding die 202 and heated, the elongation of the workpiece W in the molding die 202 is suppressed. In addition, as a modified example, a structure that does not include the workpiece heater 116 may also be adopted.

In addition, the workpiece processing unit 200A includes a first storage pickup 122 that holds the molded product Wp placed on the second holding portion 210B and transports it to a predetermined position. Furthermore, the workpiece processing unit 200A includes a second storage picker 124 that places the molded product Wp held by the first storage picker 122 and transports it to a predetermined position in the unit. They all have a well-known holding mechanism (for example, a structure with holding claws for holding, a structure with a suction hole communicating with a suction device for suction, a mechanism for placing only, etc.) as the holding molded product Wp Organization (not shown). In this embodiment, the first storage picker 122 and the second storage picker 124 are combined to form a storage picker that conveys the molded product Wp from the second loader 210.

Then, the distributing unit 200C includes a preparation table 302 on which the conveying member 400 in the state where the film F and the molded resin R are not maintained is placed and appropriately cleaned. In addition, as shown in FIG. 11, the conveyer 400 of this embodiment has a substantially flat plate shape in which an upper surface and a lower surface are formed as parallel planes, and has two rows of loading film holding portions (in the figure) that hold the film F. 400A, 400B). In addition, in each of the carried-in film holding portion 400A and the carried-in film holding portion 400B, the positions corresponding to the respective films F (the positions where the respective films F are held) are arranged so that the respective films F are exposed when viewed from the upper surface. The resin injection hole 400a and the resin injection hole 400b of the through-hole. Furthermore, a plurality of first suction holes 400c that generate suction force to hold the film are arranged around the resin injection hole 400a and the resin injection hole 400b.

In addition, the distribution unit 200C includes a carrier picker 304 that transports it between a plurality of predetermined positions (workbenches). In addition, as a mechanism for holding the carrier 400, there are known holding mechanisms (for example, a structure having holding claws for holding, a structure having a suction hole communicating with a suction device for suction, etc.) (not shown) Show). For example, a structure may be adopted in which uneven portions are provided on the outer peripheral portion of the transporter 400, and the uneven portions are hooked to holding claws erected downward from the lower surface of the transporter picker 304 to hold and transport the structure.

In addition, the distributing unit 200C includes: a film roll 306, which is formed by rolling a long film F into a roll at a position behind the preparation workbench 302; and a film workbench (first workbench) 308, provided Above the film roll 306 (obliquely above in this embodiment), the film F drawn from the film roll 306 is cut into a thin strip of a predetermined length and held.

In addition, the distributing unit 200C includes a resin injection workbench (second workbench) 310, which is arranged laterally (as an example, on the right side) with respect to the film workbench 308 In addition, it is configured to be able to move in the front, back, left, and right directions, and to place the carrier 400 conveyed by the carrier picker 304 (with the two films F held on the lower surface).

In addition, the distributing unit 200C includes a dispenser on the side (as an example, the right side) with respect to the film table 308 with the arrangement of the resin injection table 310 interposed therebetween, and at a position higher than the resin injection table 310 312. The dispenser 312 injects the molded resin R into the resin injection hole 400a and the resin injection hole 400b of the conveyer 400 placed on the resin injection table 310, and loads (inserts) the molded resin R on the exposed On the film F (inside the resin injection hole 400a and the resin injection hole 400b).

In addition, the distributing unit 200C includes a resin heater 314 that heats the upper surface of the carrier 400 in a state where the film F on which the molded resin R is mounted is heated, thereby heating the molded resin R R is heated. In addition, as a structure for heating the carrier 400 (molded resin R), a well-known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) is arranged on the lower surface of the resin heater 314 (not shown) ). Therefore, the mold resin R held in the state of being mounted on the two films F can be heated by the conveying member 400 at the same time.

In addition, the dispensing unit 200C includes a film processor 316 that stores the used film Fd.

Next, in the resin molding apparatus 200 of this embodiment, as a mechanism for conveying across the units, the resin R (in the state mounted on the conveyer 400) is loaded into the molding die 202 of the pressing apparatus 201 as a first loading mechanism. A machine 212, and a second loader 210 that unloads the molded product Wp from the mold 202 of the pressing device 201. The first loader 212 and the second loader 210 are arranged to be able to move between predetermined units along the guide rail.

Here, regarding each unit, the structure of the resin molding apparatus 200 can be changed by changing the structure. For example, the structure shown in FIG. 8 is an example in which three pressing devices 201 are provided, but it can also be configured as a resin molding device (not Icon). In addition, other units can also be provided. For example, it is also possible to provide a unit for supplying the mold resin R different from the distribution unit 200C, or a unit (not shown) for supplying a member to be assembled with the workpiece W in the mold. As an example, the member may be a plate-shaped member that functions as a heat dissipation plate or a shielding plate. In this case, after stacking the plate-shaped member on the film F, the mold resin R may be supplied on the plate-shaped member and then transported.

In addition, as a modified example of the resin molding apparatus 200, it may also be configured as a resin molding apparatus that uses a compression molding method and has a cavity provided in a lower mold and a workpiece is arranged W (for example, assume a case where a round wafer, a square, or a rectangular substrate is used as the first member Wa) is resin-molded to obtain a molded product (not shown). In this case, as the workpiece W, it can be configured to process a wide workpiece (large-size workpiece) having a wider width than the workpiece W as the thin strip-shaped workpiece. As the wide workpiece, a square, rectangular, or polygonal workpiece W with a wider width than an elongated workpiece; a circular wafer with a relatively wider diameter (width) than an elongated workpiece can be used; or as a carrier Workpiece W of the plate.

Next, the structure of the pressing device 201 provided on the pressing unit 200B of the resin molding device 200 will be described.

As shown in Figure 9, Figure 10, Figure 12, the pressing device 201 first includes a pair of molds that can be opened/closed (for example, multiple mold blocks containing alloy tool steel, mold plates, mold columns, etc., or assembled with other components The mold) of the molding mold 202. In this embodiment, among the pair of molds, the other mold on the lower side in the vertical direction is set as the first mold (here, the lower mold) 206, and the one mold on the upper side is set as the second mold ( Here is the upper die) 204. The mold 202 closes/opens the mold when the lower mold 206 and the upper mold 204 approach/depart from each other. That is, the vertical direction is the mold opening/closing direction.

In addition, the molding mold 202 performs mold opening/closing by a well-known mold opening/closing mechanism (not shown). For example, the mold opening/closing mechanism is configured to include a pair of platens, a plurality of linking mechanisms (tie bars or pillars) for erecting the pair of platens, and a drive source (for example, electric Motor) and drive transmission mechanism (for example, torque link), etc. (the drive mechanism is not shown).

Here, the molding die 202 is arranged between a pair of platens of the mold opening/closing mechanism. In this embodiment, the upper mold 204 as a fixed mold is assembled to a fixed platen (platen fixed to the coupling mechanism), and the lower mold 206 as a movable mold is assembled to the movable platen (a table that moves up and down along the coupling mechanism). plate). However, it is not limited to the above structure, and the upper mold 204 may be a movable mold, the lower mold 206 may be a fixed mold, or both the upper mold 204 and the lower mold 206 may be movable molds. Alternatively, a structure in which two movable platens are provided to provide two sets of upper mold 204 and lower mold 206 may also be provided.

Next, the lower mold 206 of the mold mold 202 will be specifically described. The lower mold 206 includes a lower plate 224, a cavity stopper 226, a clamp 228, and the like, which are assembled together (refer to FIG. 12).

Here, the cavity stopper 226 is fixedly assembled to the upper surface of the lower plate 224 (the surface on the upper mold 204 side). The jig 228 is formed in a ring shape to surround the cavity stopper 226, and is assembled to be adjacent to the cavity stopper 226 and separated (floating) with respect to the upper surface of the lower plate 224.

In this embodiment, the lower mold 206 has a cavity 208 recessed from the mold surface (parting surface) 206 a, the cavity stopper 226 constitutes the inside (bottom) of the cavity 208, and the clamp 228 constitutes the side portion of the cavity 208. In other words, the upper surface of the cavity stopper 226 and the inner peripheral wall surface of the jig 228 form a concave portion of the cavity 208 recessed in a predetermined shape.

In addition, the molding die 202 includes a film suction mechanism that sucks the film F from the die surface 206 a side of the lower die 206.

In this way, by providing the film F covering the inner surface of the cavity 208 and the mold surface 206a (part of) of the lower mold 206, the portion of the molded resin R on the lower surface of the molded product Wp can be easily peeled off, so that it can be easily peeled off. The molded product Wp is taken out from the molding die 202.

In addition, the molding die 202 includes a urging member (for example, a spring such as a coil spring) 232 between the lower plate 224 and the clamp 228. The clamp 228 is movably assembled to the lower plate 224 via the urging member 232.

In addition, the lower mold 206 includes a heater (for example, a heating wire heater), an auxiliary heater (for example, a heating wire heater), a temperature sensor, a control unit, a power source, etc. (all not shown) to perform heating and control. As an example, the heater of the lower mold 206 is built in the lower plate 224 or a mold base (not shown) that houses them, and heat is mainly applied to the entire lower mold 206 and the workpiece W. By the heater of the lower mold 206, the lower mold 206 is adjusted and heated to a predetermined temperature (for example, 80°C to 180°C).

Next, the upper mold 204 of the mold mold 202 will be specifically described. The upper mold 204 includes an upper plate 222, a cavity plate 236, etc., which are assembled together to form a structure. Here, the cavity plate 236 is fixed and assembled to the lower surface of the upper plate 222 (the surface on the lower mold 206 side).

In addition, the upper mold 204 includes a heater (for example, a heating wire heater), a temperature sensor, a control unit, a power supply, etc. (all not shown) to perform heating and control thereof. As an example, the heater of the upper mold 204 is built in the upper plate 222, and heat is mainly applied to the entire upper mold 204 and the mold resin R. By the heater of the upper mold 204, the upper mold 204 is adjusted and heated to a predetermined temperature (for example, 80°C to 180°C).

Furthermore, the upper mold 204 includes a workpiece holding mechanism 240 that holds the workpiece W at a predetermined position on the lower surface of the cavity plate 236. As an example, it is assumed that the suction device is driven to suck the workpiece W from the suction path, and the workpiece W is attracted to and held by the mold surface 204 a (here, the lower surface of the cavity plate 236 ). In addition, in parallel with the above-mentioned structure, a structure in which holding claws (not shown) that clamp the outer circumference of the workpiece W may be provided.

Next, the first loader 212 and the second loader 210 that are characteristic structures in this embodiment will be described in detail (refer to FIGS. 8 to 15 ).

Next, the second loader 210 cooperating with each mechanism of the workpiece processing unit 200A includes, on its upper surface, a first holding portion 210A that transports the workpiece W to a predetermined holding position of the upper mold 204. The workpiece W conveyed by the supply picker 120 is placed on the first holding portion 210A when it is moved to a position on the side (right side as an example) with respect to the supply rail 104. When the work W is to be transferred, the supply picker 120 further rises after the preheating step on the supply rail 104, and then moves to the right side, thereby moving to the first holding part located on the right side of the supply rail 104. The position where the 210A takes over. The first holding portion 210A has a well-known holding mechanism (for example, a structure having holding claws for holding, a structure having a suction hole communicating with a suction device for suction, etc.) as holding the placed workpiece W The workpiece holding part (referred to as symbols 210a and 210b in the figure).

In this embodiment, the workpiece holding portion 210a and the workpiece holding portion 210b are configured to be arranged in two rows in the left-right direction at positions corresponding to the two workpieces W held by the supply picker 120. That is, the workpiece W can be aligned and held in parallel in the longitudinal direction of the workpiece W. As a result, the two workpieces W aligned and held in the left-right direction by the supply picker 120 can be placed in the same arrangement without rearranging them at the same time, and can be aligned and held in the left-right direction and transported.

In addition, the second loader 210 holding the workpiece W by the first holding portion 210A is configured to be movable in the front and rear, left and right, and up and down directions. By the movement in the left-right direction, the workpiece W can be transported from the workpiece processing unit 200A to the pressing unit 200B. On the other hand, by the movement in the front-rear direction, the workpiece W can be transported from the outside of the molding die 202 to the inside (that is, between the upper die 204 and the lower die 206 in the opened die state). Furthermore, by moving in the vertical direction, the workpiece W can be transported (transferred) inside the molding die 202 to a predetermined holding position of the upper die 204. In addition, as a modified example, instead of a configuration in which the first holding portion 210A moves left and right, a configuration in which the movement of the above-mentioned moving range is replaced by the supply picker 120 may be considered. In addition, instead of the structure in which the first holding portion 210A moves up and down, a structure in which the movement of the above-mentioned moving range is replaced by the mold opening/closing mechanism of the mold mold 202 (both not shown) may be considered.

Next, the second loader 210 includes a second holding portion 210B on the upper surface thereof, and the second holding portion 210B is removed from the molding die 202 (here, the upper die 204) and placed on the molded resin molded product. The molded product Wp is transported to a predetermined position outside the molding die 202. In addition, in the second holding portion 210B, as a molded product holding portion for holding the placed molded product Wp, there is a known holding mechanism (for example, a structure having holding claws for clamping, a suction device communicating with a suction device). The structure of suction holes for suction, etc.) (referred to as symbols 210c and 210d in the figure).

In addition, the second holding portion 210B of this embodiment is configured as two molded products Wp held by the mold 202 (upper mold 204) after the molded product holding portion 210c and the molded product holding portion 210d are molded with resin The corresponding positions are arranged side by side in two rows in the left-right direction. That is, the molded product Wp can be aligned and held in parallel in the longitudinal direction of the molded product Wp. As a result, the two molded products Wp aligned and held in the left-right direction by the molding die 202 (upper mold 204) can be placed as they are without rearranging them at the same time, and can be aligned and held in the left-right direction. And transported.

Here, in this embodiment, the second holding portion 210B and the first holding portion 210A are integrally configured as the second loader 210. As an example, the second loader 210 is provided with a first holding portion 210A having two left and right rows of workpiece holding portions 210a and 210b on the front side, and a second holding portion 210a having two left and right rows of molded product holding portions 210c and 210d on the rear side. Two holding part 210B. Therefore, the first holding portion 210A and the second holding portion 210B have a structure capable of integrally moving in the front and rear, left and right, and up and down directions as the second loader 210. As a result, not only can the device structure be simplified and reduced in size, but also a structure in which both the workpiece W and the molded product Wp can be simultaneously conveyed can be realized, so that the step time can also be shortened.

Next, the first loader 212 that cooperates with each mechanism of the distribution unit 200C includes a third holding portion 212A. The third holding portion 212A receives on its lower surface the conveying member 400 placed on the resin inserting table 310 and conveys it to a predetermined holding position of the lower mold 206, and releases the holding of the film F and the molded resin R The transport member 400 is transported to the preparation workbench 302. In addition, the heating device 250A may be heated before receiving the carrier 400 placed on the resin injection table 310 to heat the pellet resin put on the carrier 400 in advance. In addition, in the third holding portion 212A, as the conveying member holding portion 212a that holds the conveying member 400, there is a known holding mechanism (for example, a structure having holding claws for clamping, and a suction device communicating with a suction device). The structure of the hole to carry out the adsorption, etc.). It also has a second suction hole 212b, which is arranged at a position communicating with the first suction hole 400c of the carrier 400 held at a predetermined position, and is generated (transmitted) by the suction device (Not shown) The resulting suction force. As a result, while maintaining the state where the two films F (with the molded resin R mounted on each) are aligned and adsorbed in the left and right directions on the lower surface of the carrier 400, the predetermined holding position of the lower mold 206 (disposed with The position of the cavity 208) for transport. In addition, the third holding portion 212A may be provided with holding claws that sandwich and hold the outer peripheries of the two films F on the lower surface of the conveyor 400.

Here, the first loader 212 including the third holding portion 212A of the present embodiment is configured to be movable in the front and rear, left and right, and up and down directions. By moving in the left-right direction, it is possible to carry out an operation of transporting the transporter 400 (in a state where the two films F each having the mold resin R mounted thereon) from the distribution unit 200C to the pressing unit 200B. In addition, by moving in the front-rear direction, it is possible to carry the conveyer 400 (holding the two films F each loaded with the molded resin R) from the outside of the molding die 202 to the inside (that is, in the open state). Between the upper mold 204 and the lower mold 206).

Furthermore, by moving up and down (sometimes a combination of movement in the front and rear or left and right directions), it is possible to carry out the transfer of the conveyer 400 placed on the resin inserting table 310 (holding two pieces of the resin R respectively mounted on the The state of the film F) to maintain the action. In this case, it is also possible to perform the following actions: while holding the conveying member 400 at the predetermined holding position of the lower mold 206 (the position where the cavity 208 is arranged), the two films F on which the mold resin R is mounted are released. The cavities 208A and 208B (including a part of the mold surface 206a) are respectively (one-to-one) placed in the two mold cavities 208A and 208B. Furthermore, it is also possible to perform an operation of placing the conveying tool 400 in a state where the holding of the film F and the molded resin R is released on the preparation table 302. In addition, as a modified example, a configuration (not shown) in which a part of the movement range of the third holding portion 212A is replaced by the movement of other mechanisms (the resin injection table 310, the lower mold 206, etc.) can also be considered.

Next, the first loader 212 includes a fourth holding portion 212B, and the fourth holding portion 212B is used to remove the molded product Wp molded from the resin from the molding die 202 (here, the upper die 204). The film (used film) Fd remaining in the lower mold 206 is held and transported to a predetermined position (a film processor 316 described later). In addition, the fourth holding portion 212B has a well-known holding mechanism (for example, a structure that has a suction hole communicating with a suction device for suction, etc.) as a carry-out film holding portion that holds the used film Fd ( In the figure, symbols 212c and 212d).

In addition, the fourth holding portion 212B of the present embodiment is configured such that the unloaded film holding portion 212c and the unloaded film holding portion 212d are at positions corresponding to the two cavities 208A and 208B of the molding die 202 (lower mold 206). Two rows are arranged side by side in the left-right direction. That is, the film F can be aligned and held in parallel in the longitudinal direction of the film F. As a result, two used films Fd that are aligned and held in the left-right direction by the molding die 202 (lower mold 206) after the resin molding can be aligned and held in the left-right direction at the same time and conveyed.

Here, in this embodiment, the fourth holding portion 212B and the third holding portion 212A are integrally configured as the first loader 212. As an example, the first loader 212 is provided with a third holding portion 212A having a carrier holding portion 212a on the front side, and a fourth holding portion 212B having two left and right rows of unloading film holding portions 212c and 212d on the rear side. . Therefore, the third holding portion 212A and the fourth holding portion 212B are configured as the first loader 212 to be integrally movable in the front and rear, left and right, and up and down directions. As a result, not only the simplification and downsizing of the device structure can be achieved, but also a structure in which both the film F on which the mold resin R is mounted and the used film Fd are simultaneously transported can be achieved, so that the step time can also be shortened.

Furthermore, in the first loader 212 of the present embodiment, during the movement (at least one of them) at the time of entry/exit (including the temporary stop of reversing from entry to exit), the molding die 202 at least includes resin The heating device 250 (250A) that heats the surface of the predetermined area of the mounting position of R (here, the position of the mold cavity 208) is arranged at a position capable of heating toward the heating target (here, the first loader 212 Lower surface or front surface). According to this, in one or both of entering/exiting the molding die 202, the first loader 212 can heat the surface of the predetermined area in the molding die 202 when viewed from above while moving.

As an example of the operation of this embodiment, the configuration is as follows: the first loader 212 enters the molding die 202, and after the resin R is placed in the cavity 208, the first loader 212 self-molds the mold 202 on its return path. At the time of withdrawal, the surface of the predetermined area of the molding die 202 is heated while moving. However, it is not limited to this configuration, and the first loader 212 may be configured to heat the surface of the predetermined region of the molding die 202 while moving when entering the molding die 202. Alternatively, it may also be configured that the first loader 212 heats the surface of the predetermined area of the molding mold 202 when entering the molding mold 202 and when exiting from the molding mold 202 on its return path. In addition, in either case, the state in which the first loader 212 is temporarily stopped may be included.

Here, as the predetermined area to be heated, the area (including the periphery) of the placement portion of the resin R (here, the cavity 208) is set, so that the resin R placed in the cavity 208 and The surrounding mold surface is heated. Therefore, even in the case where the temperature of the molding die 202 after the resin R is injected decreases significantly due to the relatively large amount of resin R injected into the molding die 202, it is possible to perform the resin during the movement of the first loader 212. R and the heating of the mold increase the temperature. In this way, the heating can be performed in a normal cycle in which the resin R and the workpiece W are transported by the first loader 212. Therefore, the cycle time does not increase, and the productivity does not decrease. On the contrary, the melting of the resin R can be promoted, so not only the molding defects can be improved, but also the cycle time during molding can be shortened.

However, even if the first loader 212 is heated during the movement of entering/exiting the molding die 202 due to the larger amount of resin R, etc., the heat is still insufficient, although the cycle time will increase, but it can be set to The first loader 212 is reciprocated once again or reciprocated multiple times to be heated to a predetermined temperature.

Here, it is suitable to have a structure in which in the first loader 212, the heating device 250 is provided at a position on the front end side when entering the molding die 202 compared to the resin holding portion 252 that holds the resin R. According to this, whenever the first loader 212 heats a predetermined area when entering/exiting the molding die 202, the moving distance of the first loader 212 can be minimized. Therefore, the effect of shortening the cycle time can be obtained.

The specific example of the heating device 250 (heater) of this embodiment is the same as that of the above-mentioned first embodiment, so the repeated description is omitted.

Instead of or together with the structure, the structure may be set as follows: the predetermined area to be heated becomes the placement area of the workpiece W (here, the workpiece support portion and the peripheral area), and the first load In the machine 212, the heating device 250 (250B) is arranged at a position capable of heating toward the heating target (here, the upper surface or the front end surface of the first loader 212) (the structure is not essential, so it is indicated by the dotted line in FIG. 13) ). As an example of operation in this case, the first loader 212 enters the molding mold 202, and after placing the resin R in the molding mold 202 (here, the lower mold 206), the first loader 212 can return When retreating from the molding die 202 on the path, the surface of the die in the area where the workpiece W is placed is heated while moving.

In addition, as a modified example, it may be configured such that, instead of the first loader 212, the heating device 250 (250D) is arranged in the second loader 210 at a position capable of heating toward the heating target (here, the first loader). The upper surface or front end surface of the second loader 210) (refer to FIG. 14). As an operation example in this case, it can be configured that the second loader 210 enters the molding die 202, and after the workpiece W is set in the molding die 202 (here, the upper die 204) and the molded product Wp is held When the second loader 210 withdraws from the molding die 202 on its return path, it heats the surface of the predetermined area of the molding die 202 while moving. Alternatively, the second loader 210 may be configured to heat the surface of a predetermined area of the molding die 202 while moving when entering the molding die 202. Alternatively, it can also be configured that the second loader 210 heats the surface of the predetermined area of the molding die 202 when entering the molding die 202 and when exiting from the molding die 202 on its return path. In addition, in either case, the state in which the second loader 210 is temporarily stopped may be included. Here, when the heating device 250 is installed in the second loader 210, for the same reason as when installed in the first loader 212, it is also suitable to be installed in the front end side when entering the molding die 202. The structure of the location.

In addition, it is also possible to provide a heating device 250 (250C) that heats the resin placement position (mold cavity 208) before the resin R is placed in the molding die 202.

Furthermore, as another modified example, the heating device 250 may be provided in both the first loader 212 and the second loader 210. As an operation example in this case, the heating operation by the first loader 212 and the heating operation by the second loader 210 are appropriately combined.

In addition, the resin molding device (compression molding device) 200 has a structure having a cavity 208 in the lower mold 206. On the other hand, as shown in FIG. 15, a resin molding device (compression molding device) having a cavity 508 in the upper mold 504 may also be configured. The pressing device 501 in this case is configured to: during the movement of the second loader 510 (at least one of them) when the second loader 510 enters/exites (including the temporary stop of the reversal from entering to exiting), at least the molding die includes The heating device 550 for heating the surface of the predetermined area of the position of the lower mold 506 where the workpiece is placed (the resin R is placed on the workpiece W) is arranged at a position capable of heating toward the heating target (here, the first 2. The lower surface or front surface of the loader 510). According to this, in one or both of entering/exiting the molding die 502, the second loader 510 can heat the surface of the predetermined area in the molding die 502 in a plan view while moving. In addition, the basic structure of the heating device 550 is the same as that of the heating device 50 and the heating device 250, and therefore, repeated descriptions are omitted.

As described above, according to the resin molding apparatus and resin molding method of the present invention, it is possible to eliminate the problem that the temperature of the molding die is lowered when resin is injected into the molding die or when the workpiece is set. That is, it is possible to reduce molding defects that may occur due to a decrease in the temperature of the resin or the like, and further, it is possible to reduce the cycle time at the time of resin molding.

In addition, the present invention is not limited to the above-described embodiments, and various changes can be made without departing from the scope of the present invention.

10, 202, 502: molding die 16: plunger 20, 206: Lower mold/first mold 21, 204: Upper mold/Second mold 22: movable table 24: fixed platen 26: Second molding base / upper mold molding base 28: The second insert/upper mold insert 30, 208, 208A, 208B, 508: mold cavity 32: Resin flow path 34: The first molded base / lower mold molded base 36: The first insert / lower mold insert 38: Workpiece support 40: can 42: Pillar 44: Chuck Claw 50, 50A, 50B, 50C, 50D, 50E, 50F, 250, 250A, 250B, 250C, 250D, 550: heating device 50a: reflector 52, 252: Resin holding part 62, 78: stocker 64: Placement table 66: small piece supply department 70, 201, 501: suppression device 74: Placement Department 76: Gate cutting part 80: material box 82, 212: the first loader 84, 210, 510: second loader 86: Guidance 100, 200: Resin molding device 100A: Supply unit 100B, 200B: pressing unit 100C: Molded product storage unit 102: supply box 104: supply rail 112: Storage box 114: Workpiece measuring device 116: Workpiece heater 120: Supply Picker 122: The first storage picker 124: Second Storage Pickup 200A: Workpiece processing unit 200C: Distribution unit 204a, 206a: mold surface 210A: The first holding part 210B: second holding part 210a, 210b: Workpiece holding part 210c, 210d: Molded product holding part 212A: The third holding part 212B: The fourth holding part 212a: Conveyor holding part 212b: second suction hole 212c, 212d: Take out the film holding part 222: upper plate 224: lower board 226: Mould Cavity Stop 228: Fixture 232: force component 236: Mold Cavity Board 240: Workpiece holding mechanism 302: Preparing the Workbench 304: Conveyor picker 306: Film Roll 308: Membrane Workbench 310: Resin Putting Workbench 312: Distributor 314: Resin heater 316: Membrane Processor 400: Conveyed items 400A, 400B: Move into the membrane holding part 400a, 400b: Resin input hole 400c: the first suction hole 504: upper die 506: die F: Membrane Fd: used membrane R: Molded resin/resin W: Workpiece Wa: the first component Wb: second member Wp: molded product

Fig. 1 is a plan view showing an example of a resin molding apparatus according to a first embodiment of the present invention. Fig. 2 is a left side view of the II-II position of the resin molding apparatus of Fig. 1. Fig. 3 is a front view (partial sectional view) showing an example of a pressing device and a first loader of the resin molding apparatus of Fig. 1. Fig. 4 is a front view (partial cross-sectional view) showing a modification of the resin molding apparatus of Fig. 1. Fig. 5 is a perspective view showing an example of a heating device of a first loader of the resin molding apparatus of Fig. 1. Fig. 6 is a side sectional view showing an example of a pressing device and a heating device of the resin molding device of Fig. 1. Fig. 7 is a plan view showing another example of the heating device of the first loader of the resin molding apparatus of Fig. 1. Fig. 8 is a plan view showing an example of a resin molding apparatus according to a second embodiment of the present invention. Fig. 9 is a left side view of the position IX-IX of the resin molding apparatus of Fig. 8. Fig. 10 is a left side view of the X-X position of the resin molding apparatus in Fig. 8. Fig. 11 is a plan view showing an example of a conveyer of the resin molding apparatus of Fig. 8. Fig. 12 is a front cross-sectional view showing an example of a molding die of the resin molding apparatus of Fig. 8. 13 is a front view (partial cross-sectional view) showing an example of the pressing device and the first loader of the resin molding device of FIG. 8. Fig. 14 is a front view (partial cross-sectional view) showing a modification of the resin molding apparatus of Fig. 8. 15 is a front view (partial cross-sectional view) showing an example of a pressing device of a resin molding apparatus and a second loader according to another example of the second embodiment of the present invention.

10: Molding mold

20: Lower mold/first mold

21: Upper mold/second mold

22: movable table

24: fixed platen

38: Workpiece support

42: Pillar

44: Chuck Claw

50, 50A: heating device

70: Suppressing device

82: The first loader

R: Molded resin/resin

W: Workpiece

Claims (8)

A resin molding device uses a molding mold including an upper mold and a lower mold, and uses resin to mold a workpiece with a second member on a first member to be processed into a molded product. The characteristic is that Including a first loader that transports the resin into the molding die, The first loader is equipped with a heating device that heats the surface of the predetermined area of the molding die during the movement. The resin molding apparatus according to claim 1, wherein, in the first loader, the heating device is provided when entering the molding mold compared to a resin holding portion that holds the resin It is the position on the tip side. The resin molding apparatus according to claim 1, wherein the first loader is provided with a heating device that heats the surface of a predetermined area when the workpiece is placed in the molding die during the movement. The resin molding apparatus according to any one of claims 1 to 3, wherein The molding die has one or more tanks into which the resin of the small piece type is poured, The heating device is a structure for heating the surface of a predetermined area of the molding die including the position of the can. The resin molding apparatus according to claim 1, wherein It further includes a second loader that transports the molded product from the molding die, The heating device is provided in the second loader instead of the first loader or together with the first loader. A resin molding method uses a molding mold including an upper mold and a lower mold, and uses resin to mold a workpiece with a second member mounted on a first member to form a molded product. The resin molding method Features include: The step of using a first loader to transport the resin into the molding die; and The step of heating the surface of the predetermined area of the molding die while the first loader moves. The resin molding method according to claim 6, wherein The step of heating the surface of the predetermined area of the molding die includes the following steps: the first loader enters the molding die, and the small piece of resin held by the first loader is poured into the molding die. After the molding mold is placed in the tank, the first loader withdraws from the molding mold while using the heating device provided in the first loader to treat the molding mold including the The surface of the predetermined area including the position of the tank is heated to heat the resin put in the tank. The resin molding method according to claim 6 or 7, wherein It further includes the step of transporting the molded product from the molding die using a second loader, The step of heating the surface of the predetermined area of the molding die includes the following steps: the second loader replaces the first loader or moves together with the first loader, and simultaneously performs the molding process. The surface of the prescribed area of the mold is heated.

Images