JP2012126074A - Resin mold machine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin mold machine in which the quality of a molding is improved by transporting a resin transported with a workpiece to a mold so that the curing of the resin does not advance by the heat from the mold clamping surface to secure the flowability of the mold resin in the clamping of the mold.SOLUTION: A workpiece supporting section 37 supporting a carrier plate K, to which the resin is supplied on a semiconductor chip adhesive surface side, to be separated from the mold clamping surface is provided in the mold provided in a press section C so as to retreat from the mold clamping surface into the mold in the mold clamping state.

Description

  The present invention relates to a resin molding apparatus in which a workpiece in which a semiconductor chip is held on a carrier plate is carried into a press portion together with a resin to perform resin molding.

Along with the downsizing and thinning of electronic devices, there has been proposed a method for manufacturing a semiconductor device in which a semiconductor chip is attached to a carrier plate, resin molded, and then cut into individual pieces in order to improve the production efficiency of the semiconductor device.
A semiconductor chip is affixed to the carrier plate using an adhesive tape and resin molded. Then, after peeling a carrier plate and an adhesive tape, an electrode shaping | molding and grinding | polishing are carried out and a semiconductor device is manufactured (refer patent document 1).

JP 2006-287235 A

In such a method of manufacturing a semiconductor device, when a heat-peelable heat release tape is used as an adhesive tape for attaching a semiconductor chip to a carrier plate, the carrier plate is carried into a heated mold and resin molded. In the process, when the heating has progressed more than necessary due to heat conduction from the mold surface, the adhesive force of the thermal peeling tape is reduced and the separated semiconductor wafer (semiconductor chip) is displaced due to the flow of resin ( (Flying die) may occur.
In addition, when a plurality of semiconductor chips are mounted on a semiconductor wafer or a circuit board and the resin is molded together, if the work is loaded into the mold, the work is placed on the mold that has been heated in advance. When the resin is placed or adsorbed, the viscosity of the resin rises and curing (crosslinking reaction) starts. Even when the mold is clamped, the fluidity of the resin is lowered, which may cause an unfilled region.
In particular, if a workpiece of a semiconductor wafer size such as 8 inches or 12 inches is resin-molded by transfer molding or compression molding, the flow area of the mold resin is wide while the resin thickness is reduced. Heating of the workpiece facilitates curing of the mold resin, resulting in a reduction in molding quality.

  The present invention solves the above-described problems of the prior art, prevents a decrease in adhesive force of an adhesive sheet that adheres a semiconductor chip by delaying heat conduction to a work carried into a mold, and is supplied to an adhesive surface. An object of the present invention is to provide a resin molding apparatus that can improve the molding quality by preventing the viscosity of the resin from increasing and ensuring the fluidity of the resin.

In order to achieve the above object, the present invention comprises the following arrangement.
A resin mold apparatus in which a semiconductor chip is carried on a carrier plate by a pressure sensitive adhesive sheet and is carried into a press part together with a resin, and a resin mold is performed. The mold mold provided in the press part includes the adhesive A work support portion for supporting the carrier plate supplied with resin on the semiconductor chip adhesive surface side of the sheet so as to be separated from the mold clamp surface is provided so as to be retractable from the mold clamp surface into the mold in the mold clamp state. It is characterized by being.

Thereby, since the carrier plate to which the resin is supplied to the semiconductor chip adhesive surface side of the adhesive sheet is supported by being separated from the mold clamping surface by the work support portion, even if the work is carried into the preheated mold die, It is difficult for heat to be transmitted from the mold clamping surface until just before the resin spreads on the adhesive sheet, and it is possible to prevent the semiconductor chip from flowing together with the misalignment of the semiconductor chip and the mold resin.
In addition, heat transfer from the mold clamping surface to the workpiece is difficult, so in a resin with a short gel time, the viscosity increases before the resin spreads, the fluidity decreases, and unfilled parts are prevented from being generated. Can be improved.
In addition, since the work support part is retracted from the mold clamping surface into the mold in the mold clamped state, it does not hinder the resin mold.

  Before the mold is clamped, the mold space formed by clamping the upper mold clamper and the lower mold clamper provided on the outer periphery of the cavity is evacuated to form a decompression space, and then the mold is formed. The mold is clamped and compression molded.

  Thereby, by forming the decompression space in the mold clamp state, the air mixed in the mold resin flowing on the workpiece having a large resin flow area can be reduced, and the molding quality can be improved.

The work support section includes a plurality of float pins that are floatingly supported by an elastic member on a lower mold cavity piece.
The float pin always protrudes from the mold clamping surface when the mold is not clamped, and is pushed back into the mold in the clamped state. Therefore, it is possible to delay the heat curing of the resin supplied to the work from the mold clamping surface without using a complicated mechanism. In addition, since the workpiece is supported by the float pin, the workpiece conveyance mechanism facilitates chucking when the workpiece is loaded and unloaded.

The work support portion is disposed outside a substrate mounting region of the semiconductor chip.
As a result, it is possible to prevent the adhesive force of the adhesive sheet immediately above contacting the workpiece support portion from being lowered by the heat transmitted from the mold clamping surface through the workpiece support portion, and the carrier plate between the mold and the workpiece support portion. The bending of the carrier plate when clamping is reduced.

  The workpiece support part is a lower mold clamper that is floatingly supported on a lower mold base part, and the lower mold clamper supports the work plate at a distance from the mold clamping surface by supporting the outer peripheral edge of the carrier plate. In the mold clamp state, the outer peripheral edge of the carrier plate is sandwiched together with the upper mold clamper.

  According to this, when the work is carried into the mold, the outer peripheral edge of the carrier plate is supported by the lower mold clamper, so that heat is transferred from the mold clamping surface to the adhesive sheet without providing a special work support. It is difficult to prevent the semiconductor chip from flowing together with the misalignment of the semiconductor chip and the mold resin. In addition, it is possible to improve the molding quality by preventing the viscosity from increasing before the mold resin spreads and the fluidity from being lowered to generate an unfilled portion. Furthermore, since the outer peripheral edge of the carrier plate is sandwiched between the upper mold clamper and the lower mold clamper in the mold clamped state, it is possible to prevent the workpiece from warping.

  A workpiece supply unit, resin supply unit, press unit, workpiece inspection unit, heat curing unit, cooling unit, workpiece storage unit and control unit are arranged around the range of movement of the multi-joint robot that holds and transports the workpiece on the robot hand. The workpiece supplied with the liquid resin in the resin supply unit is carried into a mold of the press unit and is compression-molded.

  According to this, the work to which the liquid resin is supplied by the resin supply unit is held by the robot hand, conveyed to the press unit, transferred to the mold, and compression-molded. Therefore, the work from the resin supply to the resin mold is performed. In addition to being quick, it is possible to delay the progress of the heat curing of the liquid resin from the time it is carried into the mold until it is clamped.

  By using the above resin mold apparatus, the heat conduction to the work carried into the mold is delayed to prevent the adhesive sheet from adhering to the semiconductor chip from being reduced in adhesive force, and the viscosity of the mold resin supplied to the adhesive surface is increased. It is possible to improve the molding quality by suppressing the occurrence and ensuring the fluidity of the resin.

It is a plane layout figure which shows the example of whole structure of the resin mold apparatus. It is a side view of the liquid resin supply apparatus after receiving a syringe from a syringe supply part. It is sectional explanatory drawing which shows the compression molding operation | movement of a press part. It is an upper view which shows the arrangement configuration of a workpiece | work support part. It is sectional explanatory drawing which shows the compression molding operation | movement of the press part which concerns on another example. It is sectional explanatory drawing which shows the compression molding operation | movement of the press part which concerns on another example. It is sectional explanatory drawing which shows the compression molding operation | movement of the press part which concerns on another example. It is sectional explanatory drawing which shows the compression molding operation | movement of the press part which concerns on another example. It is sectional explanatory drawing which shows the compression molding operation | movement of the press part which concerns on another example. It is an upper view which shows the other example of arrangement | positioning structure of a workpiece | work support part.

  Hereinafter, a preferred embodiment of a resin mold device according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, a compression molding apparatus is used as an example of a press apparatus, a lower mold is described as a movable mold, and an upper mold is described as a fixed mold.

(Overall configuration of resin molding equipment)
FIG. 1 is a plan layout view showing an embodiment of a resin molding apparatus according to the present invention. The resin molding apparatus of the present embodiment surrounds the movement range of the articulated robot provided in the workpiece conveyance mechanism H, and includes a workpiece supply unit A, a resin supply unit B, a press unit C, a workpiece inspection unit D (cooling unit), and heat curing. A processing unit that performs each processing step, such as the unit E and the workpiece storage unit F, and a control unit G that controls the operation of these processing units are arranged. In the vicinity of the press part C, an information reading part I is provided. A display unit J and an operation unit M are provided in the vicinity of the resin supply unit B. Thus, by arranging each process so as to surround the movement range of the articulated robot, the movement distance is shortened, and efficient workpiece transfer can be realized between the processes. In particular, since the heat curing portion E is incorporated in the resin mold apparatus, the molded product after the resin mold can be quickly brought into a curing furnace and heat cured. The configuration of each part will be specifically described below.

  In FIG. 1, a work W in which a semiconductor chip is held on a carrier is used. The workpiece W is used for a resin sealing method called E-WLP (Embedded Wafer Level Package) or eWLB (Embedded Wafer Level BGA). Specifically, for example, a peripheral plate such as a wafer transfer jig is shared, so that it is the same size as a semiconductor wafer, and is peeled off on a round metal plate (SUS, etc.) having a diameter of 12 inches (about 30 cm). The adhesive sheet S (adhesive tape) which has the property is stuck, and the adhesive sheet S is used in which a plurality of semiconductor chips are adhered in a matrix.

  The pressure-sensitive adhesive sheet S is a heat-foamable film, can reduce the pressure-sensitive adhesiveness by heating, and can easily peel off the carrier plate K after molding. An information code (QR code, bar code, etc.) associated with information on the product is assigned to the edge of each workpiece W. The carrier plate K may be rectangular. In this case, when the semiconductor chips are arranged in a matrix of a plurality of rows, an area where the semiconductor chips cannot be arranged can be reduced, which is preferable in terms of molding efficiency.

(Display unit L and operation unit M)
As shown in FIG. 1, the display part L and the operation part M are integrally arranged. While checking the information displayed on the display unit L, the operator can operate the operation unit M as necessary to control the operation of each unit (for example, the articulated robot 2) in the apparatus. It is also possible to input or change various information described later. In addition, it is good also as a structure which provides a display part and an operation part in the position distant from the apparatus by using a communication line, and performs remote operation.

(Work transfer mechanism H)
In FIG. 1, a workpiece transfer mechanism H includes a multi-joint robot 2 that can rotate and linearly move by sucking and holding a workpiece W on a robot hand 1 and transferring between steps. The articulated robot 2 is configured by a combination of vertical movement by a foldable vertical link and a rotatable horizontal link. Each link is subjected to feedback control by detecting the amount of rotation by an encoder provided in a servo motor (not shown). The robot hand 1 is configured to place and hold the carrier plate K by suction. The robot hand 1 may be of a mechanical chucking method in addition to the work W being sucked and held. The robot hand 1 may be rotated (reversed) about the horizontal axis in addition to rotating about the vertical axis.

  In FIG. 1, the base portion 3 of the articulated robot 2 is provided so as to reciprocate along the linear motion guide rail 4. For example, a ball screw is connected to a nut provided in the base portion 3, and the articulated robot 2 reciprocates along the linear guide rail 4 by being driven forward and reverse by a servo motor (not shown). It has become.

(Work supply part A and work storage part F)
In FIG. 1, a workpiece supply unit A and a workpiece storage unit F are provided on the front side of the linear motion guide rail 4 on which the articulated robot 2 reciprocates. Specifically, two sets of supply magazines 9 storing workpieces W (molded products) and storage magazines 10 capable of storing workpieces W (molded products) are provided side by side. Since the supply magazine 9 and the storage magazine 10 have the same structure, the structure of the supply magazine 9 will be described below as a representative. Further, the two supply magazines 9 provided may store either the same type of workpieces W or different types of workpieces W. The same applies to the storage magazine 10. Further, the supply magazine 9 and the storage magazine 10 may be provided in one row, or each may be provided in three or more rows.

(Information reading unit I)
In FIG. 1, the information reading unit I is provided with a code information reading device 16 and an aligner 16a, and the information code of the work W is rotated by rotating the aligner 16a that has received the work W conveyed from the supply magazine 9. Is moved directly below the code information reading device 16. At this time, the workpiece W is unified in a certain direction. The code information reading device 16 reads an information code (QR code, bar code, etc.) relating to a product given to the workpiece W. Corresponding to this information code, the storage unit 47 stores resin supply information (resin type, resin supply amount, supply time, etc.), mold conditions (press number, press temperature, press time, molding thickness, etc.), cure information ( Molding conditions such as cure temperature, cure time, and cooling information (cooling time) are stored. Based on the molding condition information corresponding to the information code read by the code information reading device 16, processing of each process described later is performed on the workpiece W being conveyed. The multi-joint robot 2 sequentially conveys the workpiece W for which the molding conditions have been read to the subsequent processing steps from the resin supply unit B to the workpiece storage unit F.

(Configuration of resin supply part B)
In FIG. 1, a resin supply unit B is provided adjacent to the workpiece supply unit A. The resin supply unit B is provided with a liquid resin supply device. The liquid resin supply device is provided with a pair of dispense units 18 on both sides of a revolver type syringe supply unit 17 holding a plurality of syringes 19 rotatably. In the resin supply part B, an air conditioner for cooling and dehumidifying the room is provided in order to maintain the quality of the liquid resin. Further, as will be described later, a door is provided on the side of the apparatus so that the operator can replace the syringe.

  A syringe supply unit 17 that holds a plurality of replacement syringes 19 is rotatably provided between a pair of dispense units 18 that discharge and supply liquid resin to the workpiece W. Each dispensing unit 18 shares the syringe supply unit 17 to receive the replacement syringe 19 and discharge and supply a predetermined amount of liquid resin to the workpiece W held at the liquid material discharge position.

  In FIG. 2, in the syringe supply unit 17, a rotation holder 17b is rotatably supported by a holding unit body 17a. The syringe 19 stores a predetermined amount of thermosetting resin such as silicone resin or epoxy resin, and is held in the recesses 17d provided at six locations in the circumferential direction on the flange portion 17c provided on the upper portion of the rotary holder 17b. . In addition, a resin receiving portion 17e is provided below the rotary holder 17b for receiving liquid resin that leaks out from the tube nozzle 19a provided at the tip of the syringe 19. A motor 20 is assembled to the upper part of the holding part main body 17a. The motor shaft 20a of the motor 20 is connected to the flange portion 17c. When the motor 20 is activated, the rotary holder 17b rotates 60 ° in a predetermined direction to rotate a new replacement syringe 19 to the syringe receiving position L. A pinch valve 19b is provided at a height at which the tube nozzle 19a is positioned at the lower end of the rotary holder 17b. The tube nozzle 19a of each syringe 19 is pressed and closed to prevent dripping. Moreover, since the syringe supply part 17 is shared by a pair of dispenser unit 18 as mentioned above, the syringe 19 supplied to both the dispenser units 18 can be replaced | exchanged simultaneously. Moreover, a pair of dispenser unit 18 may replace the syringe 19 individually.

  The configuration of one dispense unit 18 will be described. Since the other dispensing unit 18 has the same configuration in an arrangement that is reversed to the opposite side with the syringe supply unit 17 interposed therebetween, the description thereof is omitted. In the dispensing unit 18, a piston holding part 18 b is held so as to be movable up and down on a unit main body 18 a that can be moved toward and away from the syringe supply part 17 by a linear movement mechanism (not shown). A piston 18c is provided on the upper portion of the piston holding portion 18b so as to move up and down. The piston holding part 18b is provided with a chuck 18d that receives and holds the syringe 19 below the piston 18c. A guide portion 18e that holds the posture of the syringe 19 and the tube nozzle 19a is provided below the chuck 18d. A pinch valve 18f is provided at a position corresponding to the tube nozzle 19a of each syringe 19 held by the chuck 18d.

  When a drive source (not shown) (motor, cylinder, etc.) is activated, the unit body 18a approaches the syringe holder 17 from the standby position retracted from the liquid material discharge position and holds the syringe 19 on the chuck 18d. The unit main body 18a moves to the liquid material discharge position J while holding the syringe 19 to open the pinch valve 19b, and the piston 18c is moved downward by a driving source such as a cylinder or a motor (not shown) to press fit into the syringe 19. Then, the liquid resin is discharged from the tube nozzle 19a and supplied to the workpiece W. When a predetermined amount of liquid resin is supplied onto the workpiece W, the operation of the piston 18c is stopped, and the tube nozzle 19a is closed by the pinch valve 19b to prevent fluctuations in the amount of supplied resin and contamination in the apparatus due to dripping. ing.

  A throw-away cup 21 is rotatably provided near the unit body 18a. When the liquid resin 5 is discharged from the syringe 19, the throw-away cup 21 is provided to discharge the liquid resin 5 with relatively deteriorated quality at the distal end side of the tube nozzle 19 a. The discard cup 21 rotates and moves to the liquid material discharge position J before the liquid resin is discharged onto the workpiece W, and unnecessary resin is discarded.

  Further, at the liquid material discharge position J, there is provided a work placement unit 22 on which the work W received from the robot hand 1 is placed. By causing the robot hand 1 to enter the resin supply part B to a position where the support protrusion 22a is sandwiched (see FIG. 1), the workpiece W is held by the robot hand 1 and the carrier plate K is conveyed onto the support protrusion 22a. Is done. The workpiece W adsorbed and held by the robot hand 1 is released and placed on the workpiece placement unit 22, and the carrier W is supported by the support protrusion 22 a on the workpiece W. The workpiece placement unit 22 is provided with a weighing scale 23, and the weight of the workpiece W and the weight of the liquid resin discharged to the workpiece W are measured. The discharge amount of the liquid resin is stored as a molding condition according to the product, and is discharged with a predetermined accuracy (for example, about ± 0.3 g) with respect to the target value. In this case, supply information (resin supply unit number, syringe number, resin supply amount, supply end time to supply end time, etc.) of the resin actually supplied with resin is stored as operation information corresponding to the workpiece W.

  Further, the resin supply unit B automatically replaces the syringe 19 by monitoring the remaining amount of the liquid resin in the syringe 19 set in the dispense unit 18 according to the vertical position of the piston 18c. When it is determined that replacement is required, the used syringe 19 is returned to the syringe holding unit 17 and the pre-use syringe 19 filled with resin is automatically received. In this case, for example, when all of the syringes 19 held in the syringe holding unit 17 are used, the display unit J displays on the display unit J so as to replace the syringe 19 held in the syringe holding unit 17. Give instructions. As a result, the syringe 19 can be replaced while the resin supply from the syringe 19 loaded in the dispensing unit 18 is continued, so there is no need to stop the apparatus for replacing the syringe 19 and the throughput of the apparatus is improved. Can contribute.

  As shown in FIG. 1, the syringe supply unit 17 holds six syringes 19 at 60 ° rotation angles. The pair of dispensing units 18 can move between the syringe receiving position L and the liquid material supply position J of the syringe supply unit 17, and the angle connecting the syringe reception position and the rotation center of the syringe supply unit 17 is set. It arrange | positions so that it may become 120 degrees.

  Thereby, for example, the robot hand 1 can supply the workpiece W from the same position to the liquid material discharge position J (see FIG. 2) and supply the liquid material by the dispense unit 18, so that the liquid resin supply device is arranged in a compact manner. In addition, it is possible to simultaneously replace the syringes held in the syringe supply unit 17 by holding the syringe 19 in the syringe supply unit 17 at every rotation angle of 60 °. become.

  The workpiece W from which the liquid resin has been discharged is sucked and held by the robot hand 1 from the workpiece placement unit 22 and conveyed to the press unit C. In this case, for example, when the time required to move from the resin supply unit B to the press unit C becomes long, the supplied liquid resin seal absorbs moisture or is heated before being carried into the press unit C. Such problems may occur. However, since the work W can be moved in a short time using the multi-joint robot 2, it can be performed in a short time compared to a structure that operates on a predetermined transport path that can be moved by, for example, an air cylinder. It can move in a uniform time.

  By adopting a configuration in which the syringe supply unit 17 can be used together with the two dispensing units 18 configured as described above and the syringe 19 can be automatically replaced, the resin can be supplied without interruption, and the compactness can be achieved. With the configuration, it is possible to follow a continuous resin mold operation in the plurality of press portions C, and it is possible to contribute to an improvement in production efficiency.

  In addition, although the said embodiment demonstrated the apparatus structure which supplies liquid resin, according to the form of a workpiece | work, the supply apparatus of other resin (Tablet resin, powder-granular resin, or paste-form resin, sheet-form resin, etc.). Can be selected as appropriate. Further, in the case of powder / granular resin or the like, a configuration may be adopted in which the robot hand 1 is provided with a resin transporting configuration and the resin is not directly supplied onto the workpiece W in the resin supply unit B. In this case, since the robot hand 1 carries the workpiece W and the resin into the press portion C, and heat-melts the workpiece W and the resin in the press portion C, and then touches the workpiece W and performs resin molding, it contributes to improvement of molding quality. it can.

(Press part C)
Next, the structure of the press part C is demonstrated with reference to FIG.1 and FIG.3.
As shown in FIG. 1, in the present embodiment, a plurality of press portions C are provided at the back of the linear motion guide rail 4. As an example, two press sections C are provided, but there may be one or three or more. Moreover, the press part C may be provided with either a mold die for resin-molding the same product or a mold die for resin-molding different products. A partition wall 24 is provided on the side of the pressing unit C facing the conveyance area 11, and an opening (not shown) is provided in the partition wall 24. The opening is normally closed by a shutter 25 that can be opened and closed. The shutter 25 is provided so as to be opened and closed by a driving source such as a cylinder or a solenoid.

  Further, a loader 32 capable of reciprocating from the press device 26 to the transport area 11 is provided in the press section C. In addition, a work placement unit (not shown) is provided in the transport area 11 on the near side by the shutter 25. The workpiece W applied with the liquid resin adsorbed and held by the robot hand 1 is delivered to the workpiece placement unit, or the workpiece W taken out by the loader 32 from the press device 26 is delivered.

  In FIG. 1, each press device 26 is provided with a film supply device 35. As shown in FIG. 3A, the film supply device 35 is a device for feeding and winding a long release film 36 covering the clamp surface of the upper mold 28 between reels. The release film 36 is adsorbed and held on the upper mold surface by a known suction mechanism. The release film 36 has heat resistance that can withstand the heating temperature of the mold, and is easily peeled off from the mold surface, and is a film material having flexibility and extensibility, such as PTFE and ETFE. PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinyl chloride, etc. are preferably used. In addition, you may employ | adopt the structure using what was cut | disconnected in the strip shape of the magnitude | size which covers the clamp surface as the release film 36. FIG.

  The press operation of the workpiece W will be described. In FIG. 3A, the workpiece W is set in the lower mold 30 that has entered the workpiece W press device 26 and has been heated to, for example, about 180 ° C.

  The workpiece W is obtained by attaching an adhesive sheet S to a carrier plate K having a diameter of 300 mm, and adhering a semiconductor chip T to the adhesive sheet S. The pressure-sensitive adhesive sheet S is a thermally foamable film, and can reduce the adhesive force of the semiconductor chip T by heating, and the molded product can be removed from the carrier plate K after molding. For this reason, depending on the state of heating, there is a possibility that the adhesive force may decrease and move with the flow of the liquid resin 5. In addition, the workpiece W is a product having an extremely thin molding thickness despite a large bottom area. Therefore, when the workpiece W is carried into the lower mold 30 of the pressing device 26, the viscosity of the liquid resin 5 supplied to the adhesive surface side of the semiconductor chip T is increased due to heat conduction from the lower mold clamping surface from that point on. Curing may proceed before completion.

  Therefore, in FIG. 3A, the lower mold 30 is provided with a float pin 37 as a work supporting portion so that the work W does not directly touch the lower mold clamping surface. The float pin 37 is always urged by a coil spring 38 or the like built in from the lower die 30 so that the tip of the pin protrudes toward the upper die surface. The coil spring 38 preferably has a spring coefficient such that the float pin 37 is not completely retracted into the lower mold 30 (a clearance is generated between the work W and the lower mold surface) in a state where the workpiece W is placed. . If the workpiece W is float-supported from the lower die surface by the float pin 37, there is an advantage that the hand of the loader 32 and the lower die 30 are prevented from interfering with each other and the workpiece W is easily grasped.

As shown in FIG. 4, the float pins 37 are provided at four positions at 90 ° intervals from the center of the workpiece W by a central angle. The float pin 37 is disposed outside the substrate mounting region V of the semiconductor chip T indicated by a broken line in FIG. This prevents the adhesive force of the adhesive sheet S immediately above the float pin 37 from being lowered by the heat transmitted through the float pin 37, and when the carrier plate K is clamped by the clamper of the upper mold 28 and the float pin 37. This is to reduce the bending of the carrier plate K.
Further, the number and arrangement of the float pins 37 may be appropriately increased or decreased. For example, the float pins 37 may be provided at three positions at intervals of 120 ° at the central angle. Moreover, as long as heat conduction from the lower mold clamping surface can be suppressed, any shape such as a bar shape such as a circular cross section, a rectangle or a tube shape, a plate shape, or a frame shape can be employed.

FIG. 3A shows a state in which the workpiece W is carried into the press device 26 that has been opened. The work W is supported in a floating manner in a state of being separated from the lower mold surface while the float pin 37 is pushed down. Thereby, even if the workpiece W is carried into the heated mold die, it is difficult for heat to be transmitted from the mold clamping surface until the liquid resin 5 spreads on the adhesive sheet S, together with the positional deviation of the semiconductor chip T and the liquid resin 5. It is possible to prevent the semiconductor chip T from flowing. Specifically, since the liquid resin 5 applied on the carrier plate K flows so as to expand from the outer edge toward the outside, the amount of resin flow is the largest at the outer edge during application, and a flying die is likely to occur. That is, the adhesive force of the pressure-sensitive adhesive sheet S is reduced by heating from the lower mold surface, and the liquid resin 5 whose viscosity is temporarily reduced by heating flows in the vicinity of the semiconductor chip T, so that a flying die is likely to occur. Therefore, by heating the liquid resin 5 in contact with the upper mold surface, the upper liquid resin 5 away from the semiconductor chip T is preferentially flowed and the heating of the pressure-sensitive adhesive sheet S is suppressed so that the adhesive force does not decrease. By doing so, the flying die is effectively prevented.
In addition, since it is difficult for the workpiece W to conduct heat from the lower mold clamping surface, in the case of a resin with a short gel time, the viscosity increases before the resin spreads, the fluidity decreases, and unfilled parts are prevented from being generated. Can be improved.

  FIG. 3B shows a state where the press device 26 is closed. The workpiece W is clamped by the upper die 28 and the lower die 30, and the float pin 37 is in a state where the tip end portion is retracted into the lower die 30 by compressing the coil spring 38.

  When the compression molding is completed, the press device 26 is opened. As shown in FIG. 3C, when the lower mold 30 moves downward, the workpiece W is released from the upper mold 28 whose mold surface is covered with the release film 36, and the tip side of the float pin 37 of the lower mold 30 is Since it protrudes by the elastic force of the coil spring 38, it is supported floating by the lower mold 30. When the shutter 25 is opened in this state, the loader 32 enters the press device 26 from the transfer area 11, grabs the workpiece W placed on the lower mold 30, takes it out to the transfer area 11, and receives it on the workpiece placement unit. (See FIG. 1).

(Work Inspection D)
Next, the configuration of the workpiece inspection unit D will be described with reference to FIG. The base portion 39 is provided with a linear motion rail 39a. A movable stage 40 is provided on the linear motion rail 39a so as to be capable of reciprocating in the rail longitudinal direction. The movable stage 40 has, for example, a known drive mechanism and a nut portion connected to a ball screw, and reciprocates on the linear motion rail 39a by driving the ball screw forward and reversely by a motor. The movable stage 40 also serves as a cooling unit for the workpiece W after heat curing.

The movable stage 40 stands by at a workpiece receiving position that is one end side of the linear motion rail 39. The workpiece W compression-molded by the press part C is placed on the movable stage 40 by the robot hand 1, the suction is released, and the workpiece W is delivered. A laser displacement meter 41 is provided as a pair of upper and lower workpieces W on the workpiece transfer mechanism H side of the movable stage 40 at the delivery position. Before the workpiece W is placed on the movable stage 40 by the robot hand 1, The thickness of the workpiece W is measured by irradiating the laser beam with the laser displacement meter 41. The control unit G stores the measured thickness in the storage unit 47 as operation information. In this case, the thickness of the molded product can be calculated by subtracting the thickness of the carrier plate K from the thickness of the workpiece W. The movable stage 40 moves from one end side of the linear motion rail 39 to the other end side. An appearance inspection unit 42 is provided above the other end of the linear motion rail 39. In the appearance inspection unit 42, the molded product is imaged in a lump or divided, and it is inspected by the appearance observation whether there is a molding defect such as unfilled, flow mark or flying die. When there are good and bad molding, the type of defect and the captured image are stored in the storage unit 47 as operation information. When the inspection is completed, the movable stage 40 on which the workpiece W is placed returns to the delivery position, is delivered to the robot hand 1, and is conveyed to the heat curing unit E.
In addition, when an abnormality (such as unfilling exceeding the expected value) is detected, the fact is notified to the display unit J, and the operation of the entire apparatus is stopped and maintenance is performed, thereby preventing defective products from being continuously produced. it can.

(Heat curing part E)
Next, the structure of the heat-hardening part E is demonstrated with reference to FIG. A curing furnace 43 is provided in the heat curing unit E, and the inspected work W is stored in the curing furnace 43 by the robot hand 1 and the mold resin is heated and cured (post-cured) at about 120 ° C. to 150 ° C. To complete the heat curing. In the curing furnace 43, opposed slits 43a are formed at a predetermined pitch in the height direction, and the workpiece W is held at this pitch. When the work W is stored in the curing furnace 43, the work W is inserted and held along the slit 43a formed in any one of them.

In FIG. 1, an inner door 44 having an opening is provided on the side surrounding the transfer area 11 of the curing furnace 43, and an outer door 45 is provided on the outer surface side of the apparatus so as to be opened and closed. An opening / closing door 46 is provided inside the inner door 44 so as to be individually openable and closable so as to always block each opening.
As a result, since the work can be carried into and out of the curing furnace simply by opening and closing the opening / closing door 46 with respect to the curing furnace 43, the temperature in the furnace is prevented from being lowered and the heat radiation to the transfer area 11 side is suppressed. can do.

  In addition, when the time from the resin molding at the press part C to the start of post-cure becomes long, the resin mold part may be warped. However, since the multi-joint robot 2 is used to smoothly move the workpiece W in the height direction, it can be moved in a short time with respect to the desired slits 43a having different heights. . As described above, in the molding apparatus in which the time required for conveyance affects the molding quality, the effect of shortening the conveyance time by the articulated robot 2 is particularly great.

  The workpiece W inspected by the workpiece inspection unit D is sucked and held by the robot hand 1 and is conveyed to the curing furnace 43. The curing furnace 43 is heated to a predetermined temperature with the open / close door 46 closed. When inserting the workpiece W, when the robot hand 1 approaches the inner door 44, the control unit G controls a drive mechanism (not shown) to open the opening / closing door 46 facing the slit 43a, and the robot hand 1 enters the furnace. Then, the workpiece W is inserted along the slit 43a. The robot hand 1 is retracted from the cure furnace 43 after the suction of the robot hand 1 is released and the workpiece W is transferred to the cure furnace 43. When the robot hand 1 is separated from the inner door 44, the open / close door 46 is closed. The above operation is repeated. When a predetermined time elapses after the work W is stored in the curing furnace 43, the robot hand 1 enters the curing furnace 43 again, and the work W is sucked and held from the curing furnace 43 to be transported to the cooling unit N. It has become.

(Cooling section)
The cooling unit N is provided with a cooling magazine (not shown) in a space above the workpiece inspection unit D. Oppositely arranged slits are formed at a predetermined pitch in the height direction on both side walls in the cooling magazine, and the workpiece W can be held at this pitch. In this case, the workpiece W can be delivered to a predetermined slit by the articulated robot 2 that can move the robot hand 1 to an arbitrary height. The workpiece W on which the heat-curing of the molded product is completed is conveyed to the slit (delivery position) of the cooling unit N while being sucked and held by the robot hand 1, and is sucked and released. The workpiece W is naturally cooled by leaving it in this state for a predetermined time. Although the cooling unit N can be provided separately from the workpiece inspection unit D, the apparatus can be configured compactly by using an empty area of the workpiece inspection unit D.

(Work storage part F)
The configuration of the workpiece storage unit D is the same as the configuration of the workpiece supply unit A as described above. The robot hand 1 receives the workpiece W cooled by the cooling unit from the movable stage 40, conveys it to the adjacent storage magazine 10, and stores it.

(Control part G)
In FIG. 1, the control unit G includes a storage unit 47 such as a CPU (Central Processing Unit), ROM, and RAM, and controls the operation of each unit described above. In addition to various control operation programs stored in the ROM, a workpiece transfer target candidate list, transfer order information, and code information attached to the workpiece W are stored. The CPU reads a necessary control operation program from the ROM into the RAM, executes it, stores the input information temporarily using the RAM, performs arithmetic processing according to the input information, and performs the processing based on the control program. Output the command.

In the control unit G, the operation information of the workpiece supply unit A (the supply magazine slit number that has been delivered), the operation information of the code information reading device 16 (recipe information; resin conditions, mold conditions, curing conditions, cooling conditions), resin supply Information of part B (syringe number; (type of resin, resin thawing time, total storage amount), usage fee (per supply / total amount, supply start / end time), operation information of press part C (mold temperature curve, Clamping pressure curve, forming thickness, film usage), operation information of curing furnace 43 (in-furnace temperature), operation information of workpiece inspection part D (flying die, forming thickness), information of work storage part F (reception of received slits) Information such as (position) is input at any time, and necessary commands are output to each part. The control unit G stores such operation information, the above-described molding conditions, etc. in association with the workpiece W. Thereby, the actual manufacturing conditions etc. about the workpiece | work W after shaping | molding can be confirmed. For example, by reading the information code on the carrier plate K of the workpiece W after molding, the molding conditions and operation information can be confirmed, and information related to the actual molded product can be easily viewed. It can be used to optimize conditions.
The control unit G is disposed so as to surround the workpiece transfer mechanism H, but may be a device that can be remotely operated by wire or wireless, such as a controller.

  The control unit G controls the timing of the workpiece supply operation and the workpiece removal operation by the articulated robot 2 in accordance with the repetition cycle of the most time-consuming process. Incidentally, the minimum cycle of each process is calculated by dividing the required time by the number of devices. In the present embodiment, since the minimum cycle of the resin molding process in the press device 26 is the maximum between the processes, the timing for loading and unloading the workpiece W is determined according to this.

Next, another example of the press device 26 will be described with reference to FIGS.
5 to 7 illustrate a resin molding apparatus that performs compression molding by forming a reduced pressure space in a mold and its operation.
In FIG. 5A, the upper die 28 is provided with a top die clamper 28b around the heated upper die cavity piece 28a at a position below the lower surface of the upper die cavity piece 28a. A recess formed by the upper mold cavity piece 28a and the upper mold clamper 28b becomes an upper mold cavity 28c. The upper mold clamper 28b is provided to be movable up and down with respect to the upper mold cavity piece 28a by being floatingly supported by an upper mold base (not shown) with a spring. Alternatively, a configuration may be adopted in which the upper mold cavity piece 28a is floatingly supported on an upper mold base (not shown) by a spring, and resin pressure is applied by the upper mold cavity piece 28a by this spring. The upper die cavity piece 28a can be provided so as to be moved downward by a movable mechanism using a wedge mechanism (not shown). A release film 36 is adsorbed and held on the upper mold clamping surface including the upper mold cavity 28c.

  The lower mold 30 has a lower mold cavity piece 30b mounted on a lower mold base 30a. A float pin 37 is always urged to the lower mold cavity piece 30b by a coil spring 38 so as to protrude from the lower mold clamping surface. A lower mold clamper 30c is floatingly supported on the lower mold base 30a via a spring 30d so as to surround the lower mold cavity piece 30b. A gap between the lower mold base 30a on which the lower mold clamper 30c slides and the lower mold cavity piece 30b is sealed by an O-ring 30e. The lower mold clamper 30c is formed with a suction hole 30f communicating with the lower mold work mounting portion. The suction hole 30f is connected to a vacuum suction device (not shown).

  As shown in FIG. 5A, in the workpiece W, the semiconductor chip T adheres to the adhesive sheet S adhered on the carrier plate K, and the liquid resin 5 is supplied to the adhesive surface side of the semiconductor chip T. What is supplied in the part B is placed on the lower clamp surface of the lower mold 30 that has been opened. At this time, since the float pin 37 protrudes from the lower mold clamping surface, the workpiece W is supported in a state of being separated from the lower mold clamping surface heated by a heater (not shown). The release film 36 is adsorbed and held on the upper mold clamping surface including the upper mold cavity 28c.

  Next, as shown in FIG. 5B, when the lower mold 30 is raised and the mold is closed, first, the upper mold clamper 28b and the lower mold clamper 30c abut against each other to form a mold space U. Operates a vacuum suction device (not shown) to evacuate the mold space U to form a decompressed space.

  Next, as shown in FIG. 6A, when the lower mold 30 is further moved upward, the upper mold clamper 28b clamps the workpiece W (the adhesive sheet S and the carrier plate K), and the liquid resin 5 is placed in the upper mold cavity 28c. Complete the filling. At this time, by directly heating the liquid resin 5 by heating from the upper mold cavity piece 28a, direct heating to the pressure-sensitive adhesive sheet S is suppressed while facilitating the resin filling by facilitating the resin flow. can do.

  Next, as shown in FIG. 6 (B), the upper mold cavity piece 28a is slightly moved downward in the direction of the arrow by a movable mechanism (not shown) to apply the final resin pressure to perform compression molding. At this time, the pressure-sensitive adhesive sheet S is also heated by being heated from the lower mold cavity piece 30b, but the resin does not flow, so the chip T does not move with the flow of the liquid resin 5. At this time, the tip side of the float pin 37 is retracted to the lower mold cavity piece 30b, and the workpiece W is clamped by the upper mold cavity piece 28a and the lower mold cavity piece 30b. Thereby, the unfilling of mold resin can be eliminated and air removal mixed into the resin can be performed.

  When the compression molding is completed, the vacuum suction operation is stopped, the lower mold 30 is moved down, and the mold is opened. As shown in FIG. 7, the mold resin is released from the release film 36, and the workpiece W is supported by float pins 37 protruding from the lower mold clamping surface. The workpiece W is taken out by the loader 32 from the lower mold 30 to a workpiece placement unit provided in the transfer area 11. Thereafter, it is sucked and held by the robot hand 1 and conveyed to the workpiece inspection unit. Thus, by forming the decompression space in the mold clamp state, the air mixed into the mold resin flowing on the workpiece W having a large resin flow area can be reduced, and the molding quality can be improved.

  The carrier plate K is clamped by the upper mold clamper 28b and the lower mold cavity piece 30b, and the carrier plate K is clamped while being heated by the lower mold cavity piece 30b, so that the upper mold cavity piece 28a is relatively lowered. It can also be operated. Even in such a case, heating of the pressure-sensitive adhesive sheet S can be suppressed because it is not arranged directly on the lower mold cavity piece 30b. Thereby, if the flow of the liquid resin 5 can be completed before the adhesive force of the pressure-sensitive adhesive sheet S decreases, the movement of the chip due to the flow of the liquid resin 5 can be prevented.

Next, still another example of the compression molding apparatus will be described with reference to FIG. Note that the same members as those shown in FIGS.
The present embodiment is different in that the lower mold cavity piece 30b is not provided with the float pin 37, and the work support portion is replaced by a lower mold clamper 30c that is floatingly supported by the lower mold base portion 30a. . The lower mold clamper 30c supports the outer peripheral edge of the carrier plate K so that the work W is separated from the lower mold clamping surface.

  According to this, when the work W is carried into the mold, the outer peripheral edge of the carrier plate K is supported by the lower mold clamper 30c, so that the work W can be removed from the lower mold clamping surface without providing a special work support. There is no possibility that the adhesive force of the adhesive sheet S is reduced due to heat conduction and the semiconductor chip T is displaced or moved with the flow of the liquid resin 5. Further, when the workpiece W is carried into the lower mold 30 of the pressing device 26, the viscosity of the liquid resin 5 supplied to the adhesive surface side of the semiconductor chip T is increased due to heat conduction from the lower mold clamping surface from that time, and the press is performed. It is also possible to prevent the curing from proceeding before completion. Furthermore, since the outer peripheral edge of the carrier plate K is sandwiched between the upper mold clamper 28b and the lower mold clamper 30c in the mold clamped state, the workpiece W can be prevented from warping.

Next, another example of the compression molding apparatus will be described with reference to FIG.
In FIG. 8, the workpiece W is loaded into the lower mold 30. However, the workpiece W may be loaded into the upper mold 28. For example, the robot hand 1 may be configured to hold the workpiece W coated with a liquid resin by the chuck hand, turn it over, and supply it to the upper die 28. In this case, it is preferable to use an epoxy resin or the like that has a high degree of thixotropy and has a viscosity that does not drop the resin even if it is inverted before the resin mold.

  The upper die 28 in the present embodiment has a claw portion 28b that can be opened and closed at the edge of the carrier plate K and can support it, and is configured to be able to hold the workpiece W. FIG. 9A shows a state in which the workpiece W is carried into the press device 26 that has been opened. The workpiece W is suspended and held (floating supported) on the upper die 28 by the claw portion 28b in a state where the carrier plate K is separated from the clamp surface of the upper die 28. In this case, heating to the liquid resin is suppressed by holding the carrier plate K away from the clamping surface of the upper mold 28 until clamping. Thereby, the situation where the viscosity of liquid resin falls temporarily by heating and liquid resin falls to the lower mold | type 30 can be avoided effectively. Moreover, the heating of the adhesive sheet used for E-WLP can also be delayed, which is also effective for preventing flying dies. The lower mold 30 has a lower mold cavity 30g (concave portion) formed by a lower mold cavity piece 30b and a lower mold clamper 30c provided around the lower mold cavity piece 30b. The release film 36 is held by suction on the lower mold clamping surface including the lower mold cavity 30g.

FIG. 9B shows a state where the press device 26 is closed. The workpiece W is clamped by the upper die 28 and the lower die 30 and compression-molded. When the compression molding is completed, the press device 26 is opened. As shown in FIG. 9C, when the lower mold 30 moves downward, the workpiece W is released from the lower mold 30 whose mold surface is covered with the release film 36, and remains held by the upper mold 28 by suction. Become. In this state, the robot hand 1 of the articulated robot 2 waiting in the transfer area 11 is reversed and entered into the press device 26, and the suction to the upper die 28 surface is released while holding the workpiece W. It can be transferred to the robot hand 1 and carried out.
In this case, the loader 32 provided in the press part C is omitted, and the robot hand 1 is directly turned into the pressing device 26 that is opened with the robot hand 1 turned upside down, and the workpiece W is sucked and held on the upper die 28 to be molded. The subsequent workpiece W can be received from the upper die 28 and taken out from the press device 26.

FIG. 10 shows another example of the carrier plate K. The carrier plate K is not limited to a circle as shown in FIG. 4, but may be a rectangular (square) carrier plate K as shown by a broken line in FIG.
FIG. 10 is a plan view of the lower mold 30 on which the workpiece W and the carrier plate K are placed. A lower mold cavity piece 30c forming a lower mold cavity and a lower mold clamper 30c arranged around the lower mold cavity piece 30c are formed in a rectangular shape (square shape). Air vent grooves 30g are formed radially at the corners on the clamp surface of the lower clamper 30c. A float pin 37 is urged by a coil spring (not shown) and supported in a floating manner outside the substrate mounting area V of the semiconductor chip of the workpiece W near the corner portion of the lower mold cavity piece 30c.

  The liquid resin 5 is applied to the central portion of the workpiece W in a pile shape and is spread in the diameter-expanding direction as the mold is clamped. To reduce the flow amount of the liquid resin 5, a cavity is used by writing dispensing. You may make it apply | coat to a rectangular shape according to a shape. The carrier plate K, the lower mold cavity piece 30c, and the lower mold clamper 30c disposed around the carrier plate K are not limited to a rectangular shape, but may be other shapes such as a polygon other than a square or a deformed circle other than a perfect circle. good.

  Further, when it is necessary to provide the air vent groove 30g as in the case where the carrier plate K having the corner portion is used, the air vent pin 30h may be provided in order to prevent the resin burr in the air vent groove 30g. For example, the air vent pin 30h pressurized from one end surface side by a coil spring in the upper mold is movably disposed with respect to the clamper, and the other end surface of the air vent pin 30h protrudes from the end surface of the clamper according to the opening / closing amount of the mold. The air vent groove 30g can be closed. In this case, in order to prevent unfilling, when the mold is closed, the liquid resin 5 is spread and the air vent pin 30h closes the air vent groove 30g when the flow front reaches near the air vent groove 30g. It is preferable to adjust the tip position of 30h.

  Note that the air vent pin 30h may be provided in the lower mold according to the configuration of the mold, or may be provided in both the upper mold and the lower mold. Further, it is possible to adopt a configuration in which the opening degree is adjusted by using a drive mechanism such as an air cylinder or a servo motor instead of the coil spring. Further, the operation of each pin can be adjusted so that the float pin 37 is retracted into the lower mold cavity piece after the air vent groove 30g is closed by the air vent pin 30h.

  If the above-described resin molding apparatus is used, the mold resin supplied to the adhesive surface is prevented from decreasing the adhesive force of the adhesive sheet S that adheres the semiconductor chip T by delaying the heat conduction to the workpiece W carried into the mold. The molding quality can be improved by preventing the viscosity of the resin from rising and ensuring the fluidity of the resin.

In addition, although the resin mold apparatus demonstrated the example which provided the dispensing unit 18 in the resin supply part B, and the two press apparatuses 26 in the press part C, you may increase further. Further, the number of articulated robots provided in the workpiece transfer mechanism H is not limited to one, and a plurality of robots can be provided to transfer the workpiece W while sharing the transfer area.
The press device 26 is not limited to a compression molding device, and may be a transfer mold device.
Further, the workpiece transfer mechanism may be a resin molding apparatus using a normal loader and unloader, not depending on the articulated robot.

A Work supply part B Resin supply part C Press part D Work inspection part E Heat curing part F Work storage part G Control part H Work transport mechanism I Information reading part W Work K Carrier plate L Display part M Operation part N Cooling part S Adhesion Sheet T Semiconductor chip V Substrate mounting area 1 Robot hand 2 Articulated robot 3,39 Base part 4 Linear guide rail 5 Liquid resin 9 Supply magazine 10 Storage magazine 11 Transport area 16 Code information reader 16a Aligner 17 Syringe supply part 17a Holding Main part 17b Rotating holder 17c Flange part 17d Recessed part 17e Resin receiving part 17f, 18f Pinch valve 18 Dispense unit 18a Unit main body 18b Piston holding part 18c Piston 18d Chuck 18e Guide part 19 Syringe 19a Chu Nozzle 20 Motor 20a Motor shaft 21 Discarding cup 22 Work placement part 22a Support projection 23 Weigh scale 24 Partition wall 25 Shutter 26 Press device 28 Upper mold 28a Upper mold cavity piece 28b Upper mold clamper 28c Upper mold cavity 30 Lower mold 30a Lower Mold base 30b Lower mold cavity piece 30c Lower mold clamper 30d Coil spring 30e O-ring 30f Suction hole 30g Lower mold cavity 30h Air vent pin 32 Loader 35 Film supply device 36 Release film 37 Float pin 38 Coil spring 39a Linear motion rail 40 Movable stage 42 Appearance inspection unit 43 Cure furnace 43a Slit 44 Inner door 45 Outer door 46 Opening and closing door 47 Storage unit

Claims (6)

A resin mold apparatus in which a semiconductor chip is carried on a carrier plate and a resin mold is performed by carrying the work together with the resin into a press part,
The mold mold provided in the press section includes a mold clamping surface in a mold clamping state in which a work support section that supports a carrier plate supplied with resin on the semiconductor chip adhesive surface side is separated from the mold clamping surface. A resin molding apparatus, wherein the resin molding apparatus is provided so as to be retractable in the mold.   Before the mold is clamped, the mold space formed by clamping the upper mold clamper and the lower mold clamper provided on the outer periphery of the cavity is evacuated to form a decompression space, and then the mold is formed. The resin molding apparatus according to claim 1, wherein the mold is clamped and compression molded.   The resin mold apparatus according to claim 1, wherein the work support portion includes a plurality of float pins that are floatingly supported by an elastic member on the lower mold cavity piece.   The resin mold apparatus according to claim 3, wherein the work support portion is disposed outside a substrate mounting region of the semiconductor chip.   The workpiece support part is a lower mold clamper that is floatingly supported on a lower mold base part, and the lower mold clamper supports the work plate at a distance from the mold clamping surface by supporting the outer peripheral edge of the carrier plate. 3. The resin mold apparatus according to claim 1, wherein the outer peripheral edge of the carrier plate is sandwiched together with the upper mold clamper in the mold clamp state.   A workpiece supply unit, a resin supply unit, a press unit, and a workpiece storage unit are arranged around the movement range of an articulated robot that holds and conveys a workpiece on a robot hand, and a liquid resin is supplied by the resin supply unit. The resin mold apparatus of any one of Claim 1 thru | or 5 which is carried into the mold metal mold | die of the said press part, and is compression-molded.

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