CN110126168A - Mould bases, mold chase unit, compression molding mold and compression molding apparatuss - Google Patents

Mould bases, mold chase unit, compression molding mold and compression molding apparatuss Download PDF

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Publication number
CN110126168A
CN110126168A CN201910101140.0A CN201910101140A CN110126168A CN 110126168 A CN110126168 A CN 110126168A CN 201910101140 A CN201910101140 A CN 201910101140A CN 110126168 A CN110126168 A CN 110126168A
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CN
China
Prior art keywords
mold
lower die
chase unit
workpiece
compression molding
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910101140.0A
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Chinese (zh)
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CN110126168B (en
Inventor
齐藤高志
野村祐大
西泽贤司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamada Most Advanced Science & Technology Co Ltd
Apic Yamada Corp
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Yamada Most Advanced Science & Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from JP2018022396A external-priority patent/JP7092514B2/en
Priority claimed from JP2018022371A external-priority patent/JP7060390B2/en
Priority claimed from JP2018022385A external-priority patent/JP7092513B2/en
Application filed by Yamada Most Advanced Science & Technology Co Ltd filed Critical Yamada Most Advanced Science & Technology Co Ltd
Publication of CN110126168A publication Critical patent/CN110126168A/en
Application granted granted Critical
Publication of CN110126168B publication Critical patent/CN110126168B/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

The present invention provides the deviation of thickness, the deviation of amount of resin and the higher compression molding die device of versatility for being accurately proceed compression molding that can absorb workpiece when carrying out compression molding respectively to the multiple workpiece configured side by side.The compression molding includes upper mold (2) with die device, has the work holding portion thereof (2a) for keeping multiple workpiece (W) respectively；And lower die (3), it forms multiple lower die cavity recess (3a) using fixture (5e) and chamber block (5d), the lower die cavity recess (3a) and work holding portion thereof (2a) are oppositely disposed, the fixture (5e) is for clamping workpiece (W) and being independently configured for each workpiece, the chamber block (5d) pressurizes to resin by making a relative move in the state that insertion fixture (5e) is interior, upper mold (2) respectively has adjustment mechanism (8), the adjustment mechanism (8) can respectively adjust height for each workpiece (W).

Description

Mould bases, mold chase unit, compression molding mold and compression molding apparatuss
Technical field
The present invention relates to when being individually clamped to the multiple workpiece configured side by side and carrying out compression molding simultaneously Mold mould bases, mold chase unit, compression molding mold and the compression molding apparatuss for using above-mentioned component used.
Background technique
For the lower die cavity recess for being set to lower die using mould release film covering, downward mold chamber recess portion supplies moulded resin Workpiece is held in the molding die of upper mold and carries out compression molding by (particulate resin, fluid resin, powdered resin etc.), clamping Device, exploitation have various devices and realize practical (referring to Japanese Unexamined Patent Publication 2010-36542 bulletin).
For lower chambers movable type compression molding molding die, due to carrying out resin mold to 1 workpiece using 1 mold The device of system is mainstream, and therefore, from the viewpoint of reducing setting area, improving productivity, also motion has following be compressed into Shape dress is set, that is, using the compression molding apparatuss of bilevel compression molding mold in the height direction (referring to Japanese Unexamined Patent Publication 2010-94931 bulletin).
But such as in the case where the bar shaped substrate to the strip as workpiece carries out compression molding, for resin In the case where substrate, and lead frame is larger compared to the deviation of thickness, and there are following situations: being equipped on 1 bar shaped substrate Semiconductor chip quantity and semiconductor chip unfavorable condition correspondingly carry quantity on generate deviation.Moreover, at 1 In the case that the carrying quantity of semiconductor chip on bar shaped substrate changes, if becoming the supply amount of moulded resin yet Change, then the forming thickness in final encapsulation portion (resin seal portion) can be made to change due to compression molding.It is difficult to comprehensive on one side Closing ground adjustment, they carry out compression molding with shortening curring time on one side.
Here, motion is such just like transmission molding die, bar shaped substrate-parallel configuration two is arranged and is compressed into Several compression molding apparatuss of shape are (referring to Japanese Unexamined Patent Publication 2011-143730 bulletin, Japanese Unexamined Patent Publication 2012-40843 public affairs Report).
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2010-36542 bulletin
Patent document 2: Japanese Unexamined Patent Publication 2010-94931 bulletin
Patent document 3: Japanese Unexamined Patent Publication 2011-143730 bulletin
Patent document 4: Japanese Unexamined Patent Publication 2012-40843 bulletin
Summary of the invention
Problems to be solved by the invention
The compression molding apparatuss of above-mentioned Japanese Unexamined Patent Publication 2011-143730 bulletin equipped with a pair of of compression molding at Shape mold, is supported with lower die on movable plate, is supported with the clamping component for foring two chambers in lower die and two are slided Component.It is equipped with mounting rod in the back side (downside) for constituting the sliding component of cavity bottom, is wrapped respectively in each mounting rod flexible Component.Each sliding component is supported on the clamping component for surrounding each sliding component in a manner of it can slide as a result,.Also, receive The adjustment component of the mounting rod of each sliding component by centered on an axis for being supported on movable plate be in day rotate flat-shapedly so as to It is enough to apply impartial pressing to molten resin.But due to adjustment component be configured to only be with axis for being set to movable plate Therefore the deviation that the heart rotates to absorb the amount of resin of the left and right of chamber supply to the left and right flat-shapedly in day adjusts component There are problems for intensity.A possibility that there are breakages if the intensity deficiency for adjusting component, causes sliding component that can not function And the deviation of amount of resin can not be absorbed.Moreover, carry out mold upkeep operation in the case where, or for different workpiece into In the case where row compression molding, needs to remove upper mold and lower die from compression molding apparatuss and carry out operation again.In this case, it needs The upper mold entirety self-retaining disk for keeping pair of workpieces is removed, the lower die entirety with two chambers is removed from movable plate, Therefore, become large-scale operation.
Moreover, absorption keeps two of bar shaped substrate in Japanese Unexamined Patent Publication 2012-40843 compression molding mold Upper compression mould is respectively by buffer spring hanger bearing in upper master mold.Around two upper compression moulds, a upper ledge mould is borrowed Help spring hanger bearing in upper master mold.Moreover, being supported with composition lower mode cavity in the lower master mold being oppositely disposed with upper master mold Mould and the lower frame mould for the two lower compression mould insertions are compressed under two of room.Lower compression die support is fixed on lower master mold, Lower frame mould is by spring by floating support.It is thin to maintain a demoulding for the adsorption of compression mould and lower frame mould under two Film.The plate thickness error that absorption is maintained at the bar shaped substrate of compression mould respectively is absorbed by the flexure of buffer spring.Although Can be using upper compression mould absorption plate thickness error, but the lower frame mould common land due to being present between two strip pieces is by strip piece It sandwiches, when causing to clamp accordingly, there exist the difference due to strip piece thickness a possibility that the inclination of lower frame mould.Also, due to downward The deviation of the amount of resin of mold chamber supply and when the height of mold of left and right being caused to change, exist and be not filled by, not in unilateral side Reach that the example of target resin pressure, there are the whole possibility inclined (especially as the lower die of moveable die) of stamping device Property.Moreover, in order to carry out compression moldings to two bar shaped substrates, using two lower die chambers of covering (compressed under two mould and Lower frame mould) a mould release film, therefore, absorption keep mould release film when, pull mould release film each other and be difficult to appropriate Position adsorbed.Moreover, because the surface of two lower die chambers is covered using a mould release film, therefore, it is difficult to handle, Generation does not have helpful useless using area to compression molding.Moreover, in the case where carrying out the upkeep operation of mold, or For different types of workpiece carry out compression molding in the case where, need integrally to replace by buffer spring hanger bearing in Two of upper master mold are upper to compress mould, needs will bear upon and compresses mould under two of lower master mold and for compressing mould under the two It is inserted into and is integrally removed by the lower frame mould of floating support and carry out replacement operation, therefore, become large-scale die change and make Industry.
The solution to the problem
The invention that several embodiments as described below can be applicable in is worked it out in order to solve the above problems.
First purpose is, provides the workpiece that can be absorbed when the multiple workpiece configured side by side are carried out with compression molding respectively The deviation of thickness, the deviation of amount of resin and the higher compression molding mould of versatility for capableing of accurately compression molding Tool, and using compression molding mold, productivity is higher and the versatility of forming quality is maintained higher to be compressed into shape dress It sets.
Second purpose is, provides a kind of replacement operation and versatility that can easily be done multiple mold groove units The mould bases of higher compression molding die.It can be to above-mentioned using being configured at side by side with being arranged in the horizontal direction moreover, providing one kind The deviation of mold height when mold cramping when multiple mold groove units of mould bases carry out compression molding simultaneously is adjusted, To the compression molding mold of accurately compression molding.
Third purpose is, provides a kind of mold groove unit, can be easy to carry out thin when carrying out compression molding The processing of film simultaneously reduces useless using area, moreover, becoming constant with the thickness that film is difficult to generate fold and encapsulation part Mode makes to shape quality raising.Moreover, a kind of compression molding mold is provided, even if transversely by multiple mold groove units It is configured at mould bases side by side in a row, the deviation of the plate thickness, amount of resin that can also absorb workpiece makes mold to improve forming quality Groove replacement operation improves.
Invention relevant to several embodiments as described below is included at least with flowering structure.That is, a kind of compression molding is used Mold, the multiple workpiece by being arranged in the horizontal direction configured side by side clamp respectively and to multiple workpiece while carrying out compression molding, It is characterized in that, the compression molding includes the first mold with mold, there is the work kept respectively to the multiple workpiece Part maintaining part；And second mold, multiple cavity recess are formed using fixture and chamber block, the cavity recess and the work Part maintaining part relative configuration, for clamping the workpiece and being independently configured for each workpiece, which passes through the fixture It makes a relative move to pressurize to resin in the state of being inserted into the fixture, first mold has adjustment machine Structure, the adjustment mechanism can respectively adjust height for each workpiece.
Using the above structure, moulded resin is supplied to the multiple cavity recess for being formed in the second mold, is kept by workpiece Die closing is in the state of multiple work holding portion thereofs of the first mold to carry out compression molding for each workpiece.At this point, even if Multiple workpiece there are the deviation of plate thickness, to multiple cavity recess supply amount of resin there are deviations, also can using be set to first The adjustment mechanism of mold is directed to the deviation of mold height when each workpiece respectively adjusts mold cramping, therefore, Neng Gougao Precision compression molding go out the thickness of resin seal portion (encapsulation part).
Moreover, the adjustment mechanism set on the first mold, therefore energy can be shared when changing production adjustment and carrying out die change Enough improve versatility.
Preferably, first mold is arranged in parallel with the workpiece with being arranged in the horizontal direction respectively in the first mould bases First chase unit of maintaining part, the adjustment mechanism have to making first chase unit from first mould bases along opening and closing The spring unit that the direction that mould direction is left exerts a force respectively, the adjustment mechanism are respectively configured at first mould side by side The deviation adjusting of mold height when the mold cramping of first chase unit of frame.
As a result, for the first chase unit each of is configured side by side with being arranged in the horizontal direction respectively, had by adjustment mechanism The deviation adjusting of mold height of spring unit when respectively carrying out mold cramping therefore can be directed to each first groove Unit adjusts deviation, the deviation of amount of resin of the plate thickness of workpiece.Moreover, even if the first chase unit of replacement, can also make always With the adjustment mechanism for being set to the first mould bases.
It is also possible to second mold and is arranged in parallel with the second groove list with the cavity recess in the second mould bases Member, each second chase unit is to form the chamber block of the bottom of the cavity recess and be centered around the surrounding terrain of the chamber block Second mould bases is supported at the mode that the fixture of the side of the cavity recess can relatively move.
The fixture of the second chase unit of relative configuration is relatively depressed on one side relative to chamber block as a result, on one side will It is configured at the workpiece difference of the work holding portion thereof holding of the first chase unit of the first mold side by side by multiple ground that are arranged in the horizontal direction It clamps, therefore, the first mold or the second mold will not be caused integrally to incline due to the deviation of the plate thickness of workpiece, the deviation of amount of resin Tiltedly, compression molding can respectively be carried out for each workpiece.
Preferably, the film that covering clamps face comprising the lower die of the cavity recess can be by each second groove Unit absorption is kept.
Like this, it if clamping the film in face using covering lower die for each second chase unit, is held in absorption Lower die comprising lower die cavity recess is easily processed when clamping face, can avoid generating as strip film to compression as best one can Forming does not have helpful useless using area.
It is also possible to compression molding and includes upper mold mould bases with mold；Upper mold chase unit, across for adjusting mold The adjustment mechanism of height is assembled in the upper mold mould bases in a manner of assemble and unassemble, which clamps mask in upper mold There is work holding portion thereof；Lower die mould bases is oppositely disposed with the upper mold mould bases；And lower die chase unit, can insert The mode pulled out is assembled in the lower die mould bases, which utilizes the lower mode cavity being oppositely disposed with the work holding portion thereof Room block and the fixture supported in a manner of it can relatively move with surrounding the lower die chamber block, form lower die cavity recess.
Using the adjustment mechanism for being set to upper mold mould bases, mold height when adjusting separately mold cramping for each workpiece Therefore deviation accurately compression molding can go out the thickness of resin seal portion (encapsulation part).
Be also possible to a pair of upper mold chase unit be arranged in the horizontal direction respectively across the adjustment mechanism can fill The mode unloaded is supported on the upper mold mould bases, and the upper mold chase unit has respectively is overlappingly assembled in the adjustment mechanism simultaneously The first cope plate and the second cope plate with work holding portion thereof, a pair of of lower die chase unit and a pair of upper mold chase unit The lower die mould bases is set in a manner of assemble and unassemble respectively with being relatively arranged in the horizontal direction, the lower die chase unit has respectively There are the first lower die cavity recess and the second lower die cavity recess, the first lower die cavity recess is by opposite with first cope plate The lower die chamber block of configuration and the fixture supported in a manner of it can relatively move with surrounding the lower die chamber block are formed, should Second lower die cavity recess is by the lower die chamber block being oppositely disposed with second cope plate and the encirclement lower die chamber block The fixture supported in a manner of it can relatively move is formed.
Even if a pair of of upper mold chase unit is configured at upper mold mould bases, a pair of of lower die chase unit with being arranged in the horizontal direction as a result, It with a pair of of upper mold chase unit is configured at lower die mould bases with being relatively arranged in the horizontal direction, can also absorb and adjust and configure side by side The deviation of mold height when the mold cramping of each mold groove unit.Upper mold chase unit or lower die chase unit can Individually loads and unloads and replace from upper mold mould bases or lower die mould bases, it, also can be always using set on upper mold mould even if replacement groove The adjustment mechanism of frame.
A kind of compression molding mold, the compression molding with mold be arranged in the horizontal direction equipped with multiple molds, the mold It clamps single workpiece and compression molding is carried out to resin, which is opened with mold by common opening and closing mold mechanism It closes, which is characterized in that the compression molding includes the first mold with mold, has for keeping the workpiece of the workpiece to keep Portion；And second mold, cavity recess is formed using fixture and chamber block, the cavity recess and the work holding portion thereof phase To configuration, the fixture for clamping the workpiece, the chamber block be inserted into the fixture and by relatively move come to resin into Row pressurization has the adjustment mechanism for adjusting height in any mold in first mold and second mold.
In this case, even such as the workpiece of larger size that can not necessarily configure side by side with being arranged in the horizontal direction, Also the workpiece phase with larger size when mold cramping can be adjusted using the structure of following the first mold or the second mold The deviation of corresponding mold height, to be accurately proceed compression molding, that is, first mold or the second mold are transversely It in a row equipped with multiple, and can be opened and closed by common opening and closing mold mechanism, and there is height regulating mechanism.
A kind of compression molding mold, the multiple workpiece by being arranged in the horizontal direction configured side by side respectively clamp and to more A workpiece carries out compression molding simultaneously, which is characterized in that the compression molding includes the first mold with mold, in the first mould bases Possessed first base portion supports the work holding portion thereof for keeping the workpiece with being arranged in the horizontal direction；And second mold, Its second base portion possessed by the second mould bases supports cavity recess with being arranged in the horizontal direction, and the cavity recess and the workpiece are protected It holds portion's relative configuration and is formed by fixture and chamber block, for clamping the workpiece, which passes through in insertion institute the fixture It makes a relative move to pressurize to resin in the state of stating in fixture, the chamber block is directed to each workpiece independence twelve Earthly Branches Hold and be fixed on Die and mould plate, the fixture independently exert a force for each workpiece and is supported on the Die and mould plate, the Die and mould plate with The adjustment mechanism for adjusting height is independently equipped with for each workpiece between second base portion.
As a result, when being clamped respectively to multiple workpiece using the first mold and the second mold, force branch can be utilized It holds in the fixture of Die and mould plate and the adjustment mechanism between Die and mould plate and the second base portion, absorbs mold for each workpiece Therefore the deviation of height is clamped, wherein the first mold is transversely arranged in the first base portion in which can not make mold tilt It is provided with to column work holding portion thereof, the second mold has been oppositely disposed in the second base portion and work holding portion thereof and has been arranged in the horizontal direction ground The cavity recess of configuration.
In the compression molding apparatuss with any of the above-described compression molding mold, it is able to use and is arranged in parallel with multiple The mold groove unit of shape substrate is Tong Shied while respectively absorbing the deviation of plate thickness and clamped position and is compressed into Shape, therefore, productivity, forming quality improve.
It is assemble and unassemble that a kind of mould bases, which is that the multiple mold groove units by being arranged in the horizontal direction configured side by side support, A pair of mould bases up and down, which is characterized in that in either one mould bases, that is, base portion up and down integrally provided with adjustment mechanism, the adjustment machine Structure can be absorbed to be clamped by the plate thickness of the workpiece, the amount of resin of moulded resin and the covering clamped by each mold groove unit The deviation of mold height when mold cramping caused by total deviation of the film thickness in face.
Using the above structure, it therefore, can be inhaled in the mould bases of either one and base portion up and down integrally provided with adjustment mechanism Receive the plate thickness of the workpiece clamped by the multiple mold groove units by being arranged in the horizontal direction configured side by side, the amount of resin of moulded resin And the deviation of mold height when mold cramping caused by total deviation of the film thickness in covering clamping face.
Moreover, not needing replacement mould bases when replacing mold groove unit, it is easy to carry out replacement operation, even if more changing the mold Tool chase unit can also use always adjustment mechanism, and therefore, versatility is higher.
It is also possible to the mould bases and includes the first groove guide, is adjacently set to opening for the first guide block with the first guide block Die closing surface side, first guide block are arranged with hanging down from the first base portion；And second groove guide, it is adjacent with the second guide block Ground is set to the die opening and closing surface side of the second guide block, which is arranged with erecting from the second base portion, utilizes first guide block Two sides will be respectively formed in for the stage portion of first chase unit plug with first groove guide, utilize described the Two guide blocks and second groove guide will be respectively formed in two sides for the stage portion of second chase unit plug.
The first chase unit can be to be configured at the platforms formed by the first guide block and the first groove guide of two sides as a result, Rank portion is that guiding piece is plugged from front side.Second chase unit can be to be configured at being drawn by the second guide block and the second groove for two sides The stage portion that guiding element is formed is that guiding piece is plugged from front side.Therefore, the renewal part of mold can be made to reduce to easily Carry out replacement operation.
It is also possible to the first pedestal side of the frame-shaped being arranged with hanging down from the first base portion and is erected from the second base portion The second pedestal side relative configuration of the frame-shaped of ground setting, the first die space part that will be surrounded by first pedestal side The first guide block separated is opposite with the second guide block of the second die space spaced-apart that will be surrounded by second pedestal side Configuration.
The first base portion and the second base portion are oppositely disposed as a result, the first pedestal side of frame-shaped and the second base of frame-shaped Therefore mold inner sealing can be formed pressure reduction space with clamped condition by seat side relative configuration.Moreover, by the first mould The first guide block and be oppositely disposed the second guide block of the second die space spaced-apart that tool space segment separates, therefore, can It is easy to carry out the first chase unit that the first die space portion is accommodated in a manner of it can plug and the side can plug Formula is accommodated in the contraposition of second chase unit in the second die space portion.
Be also possible to the first pedestal side in the first chase unit plug orientation depth side by hinge can rotate Mode is linked to the first base portion, and the second pedestal side is in the second chase unit plug orientation depth side by hinge can turn Dynamic mode is linked to the second base portion.
It is opposite centered on the hinge for making the first pedestal side to be set to the first chase unit plug orientation depth side as a result, When the first base portion rotates predetermined amount, the first chase unit for being held in the first base portion is exposed in plug orientation front side, Therefore, the first chase unit can be pulled out to replace to plug orientation front side.
Moreover, opposite centered on the hinge for making the second pedestal side to be set to the second chase unit plug orientation depth side When the second base portion rotates predetermined amount, the second chase unit for being held in the second base portion is exposed in plug orientation front side, Therefore, the second chase unit can be pulled out to replace to plug orientation front side.
It is also possible to the adjustment mechanism with spring unit, the spring unit is along die opening and closing direction relative to the first mould Frame exerts a force to the first concave-board or exerts a force relative to the second mould bases to the second concave-board along die opening and closing direction, alternatively, the tune Complete machine structure is between the first mould bases and the first concave-board or between the second mould bases and the second concave-board in a manner of it can slide The sliding panel overlapped each other equipped with slope surface.
When thereby, it is possible to which the mold cramping of each mold groove unit configured side by side is absorbed and adjusted with easy structure Mold height deviation, adjustment mechanism can be used always replacing mold groove unit.
A kind of mold groove unit is to clamp workpiece using the first chase unit and the second chase unit to resin Carry out the mold groove unit of compression molding, which is characterized in that in first chase unit and second chase unit The clamping face of any one is equipped with work holding portion thereof, in the folder of the another one of first chase unit and second chase unit Tight face is formed with cavity recess, and the cavity recess and the work holding portion thereof are oppositely disposed, which utilizes for clamping It is formed in the fixture and the insertion fixture of the workpiece and by relatively moving the chamber block to pressurize to resin, The clamping face of the fixture is equipped with the film for carrying out absorption holding to the outer peripheral edge portion for the film for covering the cavity recess and attracts Hole or attraction slot with suction hole, between the film suction hole and the cavity recess or with suction hole Attract and be equipped with circumferential groove between slot and the cavity recess, is equipped with multiple suction holes in the trench bottom of the circumferential groove.
Using above-mentioned mold groove unit, the folder of the fixture including the cavity recess comprising being set to any one chase unit The outer peripheral edge portion of film is adsorbed and is held in film suction hole or the attraction slot with suction hole by tight face, and comfortable film The trench bottom for the circumferential groove being arranged between attraction slot and cavity recess between suction hole and cavity recess or with suction hole is set The suction hole set is attracted, so that the remainder of film is contained in circumferential groove, so as to swimmingly carry out the suction of film Attached fixation and fold are stretched flat.
Therefore, multiple workpiece are being clamped respectively using the mold groove unit that configures side by side with being arranged in the horizontal direction and together When Shi Jinhang compression molding, it can prevent from leading to the decline for shaping quality due to generating fold in film.Moreover, making film Processing is easy and eliminates the useless using area of film.
It is also possible to the circumferential groove to be also used as pressing the recess portion of pin entrance for film, which, which presses pin, will be set to first The film indentation in the clamping face of any one of chase unit and the second chase unit.Utilizing a pair of of mold groove unit as a result, When clamping workpiece and film, entered in circumferential groove by making film press pin, so as to reliably by the remainder of film In guidance to circumferential groove and then it is stretched flat fold.
It is also possible to the circumferential groove and is also used as the chuck jaw of work holding portion thereof to keep out of the way slot.
Even if workpiece is mechanically held in the chuck jaw of work holding portion thereof by setting as a result, can also workpiece be being clamped And chuck jaw is made to enter circumferential groove when film, therefore, it will not be interfered with the clamping face of the second mold groove unit.Moreover, not only It can be attracted using air, additionally it is possible to so that workpiece is held in work holding portion thereof using chuck jaw, therefore, can reliably carry out work The handover of part.
A kind of mold chase unit is by Workpiece clamping in a pair of of chase unit and to resin progress compression molding Compression molding die chase unit, which is characterized in that in each of the clamping face of the rectangular shape for the chase unit for constituting a side Perhaps concave-board has been provided projectingly clamping face or groove of first clamping block in the chase unit of opposite another party for edge part Plate opposite face is provided projectingly the second clamping block that can be engaged with first clamping block.
Workpiece clamping when a pair of of chase unit, can passed through into the recessed of the first clamping block and the second clamping block as a result, Tuck pointing, which is closed, carries out the opposite mutual contraposition in clamping face.Therefore, it can aid in raising forming quality.
It is also possible to the first chase unit with the first engaging portion, first engaging portion is locking in a manner of it can plug In erecting the first guide block to be formed relative to the first mould bases, the second chase unit has the second engaging portion, second engaging portion with The mode that can be plugged is engaging in erecting the second guide block to be formed relative to the second mould bases.
Be opened compression molding with mold as a result, by by the first engaging portion engaging in edge-on two from the first mould bases The first mold groove unit is plugged in the state of the first guide block risen, can easily be done die change operation.
Moreover, by by the second engaging portion engaging in from the second mould bases in the state of the second guide block that two sides erect insert The second mold groove unit is pulled out, can easily be done die change operation.
Be also possible to the relative position of the first chase unit and the second chase unit be equipped with for correct clamping face that This inclined leveling mechanism.
The clamping face of the first chase unit and the second chase unit that are oppositely disposed when thereby, it is possible to maintain die closing is each other The depth of parallelism.
A kind of mold chase unit is the mould of the compression molding with the first chase unit and the second chase unit Has chase unit, which has the work holding portion thereof for keeping workpiece, which has for mould The cavity recess of resin supply processed, which is characterized in that second chase unit is configured to make to be formed the bottom of the cavity recess The chamber block in portion and the fixture of side for forming the cavity recess can relatively move, the fixture with locating for clamping face The face of that opposite side of side is equipped with the retainer for limiting the height and position of the fixture.
As a result, and the plate thickness of workpiece, to cavity recess supply amount of resin deviation correspondingly, limited using retainer Therefore opposite height and position of the fixture relative to chamber block can absorb the deviation of the plate thickness of workpiece, supply to cavity recess Amount of resin deviation, thus with desired thickness carry out compression molding.
It is equipped with multiple spilling chambers with being also possible to the outer peripheral edge portion along the chamber block.
Even if as a result, for each workpiece accurately measure to cavity recess supply amount of resin, can also pass through by Residual resin is contained in spilling chamber and the thickness of formed products is carried out compression molding with keeping constant.
Preferably, in compression molding mold, any of the above-described mold groove unit is arranged in the horizontal direction relative to mould bases Ground configures side by side, and the mold is set as independently plugging relative to the mould bases with chase unit.
Thereby, it is possible to take out in the multiple mold groove units configured side by side with being arranged in the horizontal direction relative to mould bases from mould bases Necessary mold groove unit, thus carry out maintenance or die change, renewal part can be made less, be easy to carry out mould Has replacement operation.Moreover, the absorption of state that film is stretched flat with fold can be maintained at for each mold groove unit and include The clamping face of cavity recess is easy processing and eliminates the useless using area of film.
The effect of invention
It is capable of providing a kind of higher compression molding mold of versatility, which can absorb by edge Deviation, the amount of resin of supply of the thickness of the workpiece multiple workpiece configured side by side carry out compression molding respectively transversely arrangedly when Deviation caused by mold cramping when mold height deviation, and compression molding can be accurately proceed.
And it is capable of providing a kind of using above-mentioned compression molding mold and productivity is higher, maintains the logical of forming quality With the higher compression molding apparatuss of property.
It therefore, can be absorbed by by transversely in the mould bases of either one and base portion up and down integrally provided with adjustment mechanism The plate thickness of workpiece, the amount of resin of moulded resin and the covering that the multiple mold groove units configured side by side in a row clamp clamp The deviation of mold height when mold cramping caused by total deviation of the film thickness in face.
Moreover, not needing replacement mould bases when replacing mold groove unit, it is easy to carry out replacement operation, even if more changing the mold Tool chase unit can also use always adjustment mechanism, and therefore, versatility is higher.
It is capable of providing a kind of mold groove unit, the processing of film when carrying out compression molding can be made to be easy to carry out simultaneously Useless using area is reduced, moreover, can absorb the deviation of the deviation of the plate thickness of workpiece, amount of resin and make the thickness of encapsulation part Degree, which becomes constant mode, to be made to shape quality raising.
Detailed description of the invention
Fig. 1 is the obtained cross sectional illustration figure of compression molding mold after the observation die sinking of front.
Fig. 2 is the cross sectional illustration figure of the local cutting of the upper mold of Fig. 1.
Fig. 3 is the obtained cross sectional illustration figure of upper mold that Fig. 2 is observed in side.
Fig. 4 is the obtained top view of upper mold of Fig. 2 from clamping surface side.
Fig. 5 is the cross sectional illustration figure of the lower die of Fig. 1.
Fig. 6 is the obtained cross sectional illustration figure of lower die that Fig. 5 is observed in side.
Fig. 7 A is the obtained top view of lower die of Fig. 5 from clamping surface side, and Fig. 7 B is to indicate lower die chamber block under The partial cutaway view of state before and after the die closing of mould moveable jaw.
Fig. 8 is the obtained cross sectional illustration figure of closed mode state of the compression molding mold of front observation Fig. 1.
Fig. 9 is the section of the obtained cross sectional illustration figure of front observation mould bases and the mold groove unit taken out from mould bases Explanatory diagram.
Figure 10 A is the cross sectional illustration figure for indicating the front for removing the state before and after mold groove unit from mould bases and observing, Figure 10 B is that the obtained cross sectional illustration figure of mold groove unit taken out from mould bases is observed in side.
Figure 11 A is the obtained sectional view of compression molding die of front observation other examples, and Figure 11 B is from clamping surface side Observe the obtained top view of lower die.
Figure 12 is obtained by the compression molding die that front observation carries out the workpiece of larger size in the case where compression molding The cross sectional illustration figure arrived.
Figure 13 is in the case that side observation carries out compression molding to the workpiece of the larger size of the other examples of Figure 12 The obtained cross sectional illustration figure of compression molding die.
Figure 14 A is the obtained top view of upper mold that is moulded to rectangular substrate from clamping surface side, Figure 14 B be from It clamps surface side and observes the obtained top view of lower die.
Figure 15 A is the top view of the upper mold moulded from clamping surface side to circular substrate, and Figure 15 B is from clamping face The top view of side observation lower die.
Figure 16 is the obtained cross sectional illustration figure of compression molding mold of front observation other examples.
Figure 17 is the obtained cross sectional illustration figure of compression molding mold of front observation other examples.
Figure 18 is obtained by the compression molding mold that front observation carries out a bar shaped substrate in the case where compression molding The cross sectional illustration figure arrived.
Figure 19 is obtained by the compression molding mold that front observation carries out three bar shaped substrates in the case where compression molding The cross sectional illustration figure arrived.
Cross sectional illustration figure when Figure 20 A is the front observation for the other examples for indicating the adjustment mechanism set on upper mold, Figure 20 B It is that the obtained cross sectional illustration figure of the adjustment mechanism is observed in side.
Figure 21 is the plane figure for indicating an example of the resin molding machine using compression molding mold.
Figure 22 is the explanatory diagram for indicating the other examples of compression molding apparatuss.
Figure 23 is the explanatory diagram for indicating the then other examples of the compression molding apparatuss of Figure 22.
Figure 24 is the explanatory diagram for indicating the other examples of compression molding die.
Figure 25 is the explanatory diagram for indicating the other examples of compression molding die.
Specific embodiment
Hereinafter, being described in detail based on attached drawing for an embodiment for carrying out an invention.In addition, being known as It is to indicate when mold groove unit, the list that the mold component of composition cavity recess or work holding portion thereof integrally assembles Member.Moreover, being to indicate in referred to as compression molding mold, mold groove unit is integrally assembled in component made of mould bases, It and is the component removed after opening and closing mold mechanism.
[first embodiment]
Fig. 1 is the compression molding mold 1 that multiple workpiece W are respectively carried out with compression molding, is had following structure.Separately Outside, it is contemplated that workpiece W is the bar shaped substrate (lead frame, metal substrate, ceramic substrate, resin substrate etc.) of the strip of rectangular shape. The size for imagining workpiece W is 100mm × 300mm or so (hereinafter referred to as " workpiece W ").
Compression molding has upper mold 2 (the first mold) and lower die 3 (the second mold) with mold 1.Compression molding mold 1 With upper mold chase unit 4 (the first chase unit), there is upper mold chase unit 4 workpiece that workpiece W is held in upper mold 2 to keep Portion 2a, multiple lower die chase units 5 (the second chase unit) are relatively configured, lower die chase unit 5 have for moulded resin to The lower die cavity recess 3a that lower die 3 supplies.
Moreover, many places (being at two in Fig. 1) in upper mold mould bases 6 (the first mould bases) are set side by side with being arranged in the horizontal direction Upper mold chase unit 4.It is set side by side with being arranged in the horizontal direction in many places (being at two in Fig. 1) of lower die mould bases 7 (the second mould bases) There is lower die chase unit 5.Upper mold chase unit 4 and lower die chase unit 5 respectively oppositely configure.Have in upper mold mould bases 6 and adjusts (as making the identical mechanism of summation height of multiple molds, even a mold, can also adjust has complete machine structure 8 The workpiece W of following deviations, therefore, hereinafter referred to as " adjustment mechanism 8 "), the adjustment mechanism 8 adjustment is held in multiple work holding portion thereofs The plate thickness of the workpiece W of 2a deviation (refer to the part in the difference and 1 workpiece planarization of the plate thickness of each workpiece W thickness and Different the two of gradient.Hereafter referred to collectively as " deviation ".), multiple upper mold chase units 4 and lower die chase unit 5 clamp When mold height deviation (other than " deviation ", comprising the amount of resin that is supplied due to downward mold chamber recess portion 3a Including the difference of mold height caused by difference, referred to as " deviation ".).As the mold height realized based on adjustment mechanism 8 Deviation adjusting as a result, making to carry out the mold summation height after compression moldings based on multiple molds used in the compression molding Unanimously, additionally it is possible to avoid the inclination of punching mechanism.
Using the above structure, to being respectively arranged under multiple lower die chase units 5 for being set side by side relative to lower die mould bases 7 Mold chamber recess portion 3a supplies moulded resin, is being respectively arranged on the multiple upper mold chase units 4 being set side by side relative to upper mold mould bases 6 Work holding portion thereof 2a keep workpiece W, carry out die closing in this state, can for each workpiece W carry out compression molding.
At this point, even if multiple workpiece W are there are the deviation of plate thickness or since the difference of the amount of resin of supply causes in mold There are the deviations of mold height when clamping, also can adjust separately relative configuration using the adjustment mechanism 8 set on upper mold mould bases 6 Therefore upper mold chase unit 4 and lower die chase unit 5 accurately compression molding can go out resin seal portion (encapsulation part) Thickness.
Moreover, 7 single layer of upper mold mould bases 6 and lower die mould bases multiple chase units are set, therefore, can be achieved by ensuring that base The thickness of seat improves flexural rigidity, and since thermal capacity is larger, the temperature change being able to suppress in forming cycle.
Moreover, even if upper mold chase unit 4, lower die chase unit 5 are replaced due to changing production adjustment, due to being set to upper mold mould The adjustment mechanism 8 of frame 6 can share, therefore can be improved versatility.
Adjustment mechanism 8 is configured between upper mold mould bases 6 and upper mold chase unit 4.Even if replacing upper mold chase unit as a result, 4, adjustment mechanism 8 can be also used always.As an example of adjustment mechanism 8, have relative to upper mold mould bases 6 to die opening and closing direction The spring unit to exert a force to upper mold chase unit 4.Thereby, it is possible to adjusted using easy structure it is multiple be arranged in the horizontal direction simultaneously The mold of column configuration (in the mode for keeping the long side of workpiece parallel, configuring the configuration mode of other workpiece in adjacent horizontal side) is recessed The deviation of the mold height of slot unit.
Here, being specifically explained for the configuration example of the upper mold 2 and lower die 3 that constitute compression molding mold 1.Reference Fig. 2 illustrates the configuration example of upper mold 2.Upper mold mould bases 6 has upper die base portion 6a (the first base portion), the Yi Jiyan of rectangular plate-like The rectangular box-like upper die base side 6b (the first pedestal side) that is arranged with hanging down of outer peripheral edge portion of upper die base portion 6a.? Upper die base portion 6a is equipped with upper mold spatial portion 6c (the first die space portion) points will surrounded by upper die base side 6b with hanging down The upper mold guide block 6d (the first guide block) separated.It is set respectively in the upper mold spatial portion 6c (referring to Fig. 9) separated by upper mold guide block 6d There is adjustment mechanism 8.
Upper mold groove guide 6e (the first groove guide) is adjacently set to upper mold guide block 6d with upper mold guide block 6d respectively Lower end.Between upper mold guide block 6d and upper mold groove guide 6e (between continuous wall surface) and be respectively formed in two sides There is the stage portion 6f plugged for upper mold chase unit 4.It can as guide rail be plugged as aftermentioned using a pair of stage portion 6f Mould chase unit 4.
As shown in Figure 10 B, upper die base portion 6a and upper die base side 6b is in adjacent side surface side (upper mold chase unit Plug orientation depth side) it is connected in a manner of it can be rotated by hinge 6g.It, can be with when replacing upper mold chase unit 4 The mode for leaving side end in front of the plug orientation of upper die base side 6b from upper die base portion 6a centered on hinge 6g to Predetermined direction (around the counter clockwise direction of Figure 10 B) rotation.Thereby, it is possible to by upper mold chase unit 4 using stage portion 6f as guide rail to Front side pulls out to be replaced.Moreover, the upper mold chase unit 4 for being configured at upper mold mould bases 6 side by side can be separately It is plugged relative to upper mold mould bases 6, therefore, the workability of maintenance is good.It is further preferred, that in upper die base portion 6a and upper mold The link component (not shown) of the open angle for limiting upper die base portion 6a is linked between the 6b of pedestal side.Moreover, It can be, side of the front side side surface part of the upper die base side 6b only formed in rectangular box shape can be rotated by hinge Formula is linked to upper die base portion 6a (around the clockwise direction of Figure 10 B).In this case, it can be extracted in plug orientation depth side Upper mold chase unit 4.
Moreover, instantiating the structure for plugging chase unit laterally slidably in depth side, front side, but need not It is limited to the plug for sliding it laterally, as long as mould bases and chase unit is enable discretely to load and unload along the vertical direction.
Alternatively, it is also possible to be, the upper mold guide block 6d of the middle part (middle part of Fig. 2) that upper mold spatial portion 6c is separated with And upper mold groove guide 6e is set to upper die base portion 6a in a manner of assemble and unassemble.Figure 12 and Figure 13 as be described hereinafter as a result, It is shown, though workpiece W be a larger size substrate, also can only replace upper mold chase unit 4, and make upper mold mould bases 6 with And adjustment mechanism 8 remains able to share.
In Fig. 2 and Fig. 9, it is illustrated for the configuration example of adjustment mechanism 8.In upper die base portion, 6a is overlappingly arranged Sell suspension plate 8a.Multiple suspention pin 8b are inserted on pin suspension plate 8a (reference Fig. 2) and front-rear direction (ginseng in left and right directions According to Fig. 3) on the pin hole 8c that is equally spaced, and pin head part 8b1 (upper end) is respectively engaging in pin hole 8c.Each suspention pin 8b's Top end part 8b2 (lower end) is linked to pressing plate 8d.Helical spring is (as long as elastomer, is not particularly limited to spiral Spring.) 8e is from the compressed state of natural length to be inserted between each pin suspension plate 8a and pressing plate 8d.Pressing plate as a result, 8d and suspention pin 8b towards vertical lower are exerted a force always.It the left and right sides end face of pressing plate 8d can be by upper mold guide block 6d Guidance ground is to maintain the state of the depth of parallelism to be gone up and down.
Illustrate the configuration example of upper mold chase unit 4 referring to Fig. 2~Fig. 4.
Upper mold chase unit 4 has upper mold concave-board 4a (the first concave-board) in upper end.The upper mold concave-board 4a and tune The lower surface of the pressing plate 8d of complete machine structure 8 is superimposedly installed on pressing plate 8d.The outer dimension and pressing plate of upper mold concave-board 4a 8d is identical, and left and right sides end face can be with being guided by upper mold guide block 6d to maintain the state of the depth of parallelism to be gone up and down.It is recessed in upper mold The lower surface of frid 4a is overlappingly equipped with the outer dimension upper mold rest pad 4b bigger than upper mold concave-board 4a.Upper mold rest pad 4b's Left and right ends portion (the first engaging portion) keep with stage portion 6f it is locking in the state of by can front side plug in a manner of group Loaded on upper mold guide block 6d (referring to Fig. 2).And outer dimension is overlappingly equipped with than upper mold branch in the lower surface of upper mold rest pad 4b Supporting block 4b small cope plate 4c.As shown in figure 4, in the lower surface central portion of cope plate 4c, along Workpiece periphery edge in many places Perforation is formed with the adsorption hole 2b as work holding portion thereof 2a.Moreover, more around the work holding portion thereof 2a of cope plate 4c Place's (being, for example, at 6 in Fig. 4) is rotatably equipped with chuck jaw 4d.
In Fig. 2, chuck jaw 4d is in horizontal part 4d1 and the continuous L-shaped shape of vertical component effect 4d2.It will be in horizontal part 4d1 Way portion can rotationally be assembled in upper mold rest pad 4b centered on fulcrum 4e.Near the end of horizontal part 4d1, spiral bullet Spring 4f from the compressed state of natural length to be installed between horizontal part 4d1 and upper mold concave-board 4a.Moreover, in horizontal part 4d1 by a manner of the cope plate 4c integrally provided with pressing pin 4g.Horizontal part 4d1 is under the action of helical spring 4f by always It exerts a force downward, therefore, the top end part for pressing pin 4g is provided projectingly the position of clamping face on the lower than cope plate 4c.And And engaging portion 4d3 is towards the lower end for being medially formed in vertical component effect 4d2 of Workpiece periphery edge.Chuck jaw 4d is in helical spring It is applied centered on fulcrum 4e to the direction for being sandwiched the outer peripheral edge portion of workpiece W using vertical component effect 4d2 under the action of the rebound of 4f Power.Therefore, each engaging portion 4d3 has respectively entered the lower section of the outer peripheral edge portion of workpiece W and becomes the state for being able to maintain workpiece W. In the case where opening chuck jaw 4d to remove workpiece W, pin 4g will be pressed with need to only overcoming the force of helical spring 4f Indentation.Moreover, being provided projectingly film in the position of the side more outer than work holding portion thereof 2a of cope plate 4c and having pressed pin 4h.Helical spring 4i is pressed between pin 4h and upper mold concave-board 4a with being mounted on film from the compressed state of natural length.By This, the top end part that film presses pin 4h is provided projectingly the position of clamping face on the lower than cope plate 4c.As described later, thin The dynamic pin 4h of membrane pressure is set in order to which the remainder for the single film 9 for making the clamping face for covering lower die 3 and being adsorbed holding stretches It sets.
The configuration example of lower die 3 will be illustrated next.
In Fig. 5, lower die mould bases 7 has the lower die base portion 7a (the second base portion) of rectangular plate-like and along lower die The outer peripheral edge portion of base portion 7a erects the rectangular box-like lower die base side 7b (the second pedestal side) of ground setting.In lower die base Portions 7a erects ground and is equipped with (the second die space portion: referring to Fig. 9) lower die spatial portion 7c that will be surrounded by lower die base side 7b The lower die guide block 7d (the second guide block) separated.The lower die spatial portion 7c (referring to Fig. 9) separated by lower die guide block 7d can It is assembled with lower die chase unit 5 to plug.
In Fig. 5, lower die groove guide 7e (the second groove guide) is adjacently set to down with lower die guide block 7d respectively The upper end of mould guide block 7d.(between continuous wall surface) and in two sides point between lower die guide block 7d and lower die groove guide 7e It is not formed with the stage portion 7f plugged for lower die chase unit 5 (referring to Fig. 9).It can as guide rail be inserted using a pair of stage portion 7f Pull up mould chase unit 5.In lower die base side, the side wall of 7b is equipped with decompression suction hole 7b1, is connected to sky (not shown) Gas attracting mechanism.Moreover, the opening and closing die face in lower die base side 7b is equipped with containment member 7b2 (O-ring seal etc.), closing It abuts to be sealed die space with the opposite face of upper die base side 6b when mould.
As shown in Figure 10 B, lower die base portion 7a and lower die base side 7b is in adjacent side surface side (lower die chase unit Plug orientation depth side) it is connected in a manner of it can be rotated by hinge 7g.When replacing lower die chase unit 5, can make In front of the plug orientation of lower die base side 7b side end in the way of being left from lower die base portion 7a centered on hinge 7g to Predetermined direction (around the clockwise direction of Figure 10 B) rotation.Thereby, it is possible to by lower die chase unit 5 using stage portion 7f as guide rail to Front side pulls out to be replaced.Moreover, the lower die chase unit 5 for being configured at lower die mould bases 7 side by side can be separately It is plugged relative to lower die mould bases 7, therefore, the workability of maintenance is good.It is further preferred, that in lower die base portion 7a and lower die The link component (not shown) of the open angle for limiting lower die base side 7b is linked between the 7b of pedestal side.Moreover, It is also possible to the front side side surface part of the lower die base side 7b only formed in rectangular box shape can rotate by hinge The mode of (around the counter clockwise direction of Figure 10 B) is linked to lower die base portion 7a.It in this case, can be in plug orientation depth side Extract lower die chase unit 5.
Alternatively, it is also possible to be, the lower die guide block 7d of the middle part (middle part of Fig. 5) that lower die spatial portion 7c is separated with And lower die groove guide 7e is set to lower die base portion 7a in a manner of assemble and unassemble.Figure 12 and Figure 13 as be described hereinafter as a result, It is shown, even if workpiece W is the substrate of larger (wide cut) size, also can only be displaced together with upper mold chase unit 4 Mould chase unit 5, and it is shared to be able to maintain lower die mould bases 7.
Illustrate the configuration example of lower die chase unit 5 referring to Fig. 5~Fig. 7 A, Fig. 7 B.
Lower die chase unit 5 has lower die base plate 5a in lower end.The lower die base plate 5a's and lower die base portion 7a Upper surface is superimposedly installed on lower die base portion 7a.Lower die base plate 5a can be such that its left and right sides end face is drawn by lower die guide block 7d Lead to maintain the state of the depth of parallelism to install with plugging respectively from the front side of Fig. 5.Lower die base plate 5a upper surface and be Below the vertical of lower die chamber block 5d in perspective plane, it is formed with multiple support columns (pillar) 5b with erecting.Thereby, it is possible to prevent down The warpage of mold chamber block 5d, and the configuration by changing support column 5b or the density for changing configuration, can be to clamping pressure It is micro-adjusted.It is more than in the workpiece W to larger size (wide cut), such as plate, the diameter of 300mm × 300mm as a result, When semiconductor crystal wafer of 300mm etc. carries out compression molding, TTV (Total Thickness Variation) can be made to improve.Compared with (wide cut) size refers to greatly, and the wide substrate of the strip bar shaped substrate than 100mm × 300mm or so, must be not necessarily rectangle.
Support plate 5c is supported in support column 5b.Support plate 5c and lower die base plate 5a, which is also set up as, makes its left and right sides End face is guided by lower die guide block 7d.In the upper face center portion of support plate 5c, stacking is supported with lower die chamber block 5d.Lower die chamber The bottom of block 5d composition lower die cavity recess 3a.The lower die moveable jaw 5e of the side of lower die cavity recess 3a is constituted with being capable of edge The mobile mode in die opening and closing direction is supported on around lower die chamber block 5d.Specifically, pressing pin 5f through support plate 5c It is resisted against the lower surface of lower die moveable jaw 5e.Pin 5f and lower die base are being pressed to be inserted in from the compressed state of natural length Under the action of helical spring 5g between seat board 5a, the flange part 5h than pressing pin 5f major diameter is resisted against always under support plate 5c Surface side.The upper end self-supporting plate 5c for pressing pin 5f as a result, is prominent, becomes and exerts a force upward to lower die moveable jaw 5e always State.Alternatively, it is also possible to be, lower die chamber block 5d is not supported on support column directly across support plate 5c as described later 5b。
Clamping in the present embodiment instantiates the case where sandwiching workpiece W using work holding portion thereof 2a and moveable jaw 5e, But overall package molding in the case where, using work holding portion thereof 2a adsorption hole 2b attracting holding workpiece W without utilize under It is in the case that workpiece W is directly clamped cope plate 4c with sandwiching by mould moveable jaw 5e, i.e., whole to the outside of workpiece W when looking down Carry out it is resin molded in the case where also referred to as clamp.
Moreover, being equipped with rectangular box-like lower die concave-board 5j (the in a manner of the peripheral side for surrounding lower die moveable jaw 5e Two concave-boards).Lower die concave-board 5j stacking is supported on support plate 5c.Between between lower die moveable jaw 5e and lower die concave-board 5j Gap is sealed by containment member 5k (such as O-ring seal etc.).Lower die moveable jaw 5e is set as making its inner circumferential side by lower die on one side Chamber block 5d guidance, guides its peripheral side by lower die concave-board 5j, is gone up and down on one side.
Band stage portion 5m (the second engaging portion) corresponding with stage portion 7f is formed in the periphery surface side of lower die concave-board 5j. Shown in Fig. 9 as the aforementioned, stage portion 7f is by the lower die groove guide that narrow lower die guide block 7d and width is wider than its 7e is linked up and is formed.Become narrow mode along left and right to make to clamp surface side along stage portion 7f with stage portion 5m Two sides are formed.It can be to make lower die chase unit 5 relative to lower die as guide rail with the opposite stage portion 7f of stage portion 5m with this Mould bases 7 plugs.In addition, between upper mold chase unit 4 and upper mold mould bases 6, between lower die chase unit 5 and lower die mould bases 7, if There is the gap for plugging each unit.It is preferred, therefore, that in upper mold chase unit 4 and upper mold mould bases 6 and lower die groove Unit 5 and lower die mould bases 7, the threaded fastening mechanisms equipped with the gap for eliminating short transverse in the mounted state.
As shown in Figure 7 A, many places in the circumferential direction in the clamping face of lower die moveable jaw 5e are equipped with for avoiding from inner circumferential side Keep out of the way slot 5e1 with what the engaging portion 4d3 of chuck jaw 4d was interfered.Moreover, as shown in Figure 7 A, and keep out of the way slot 5e1 continuously outside it Side is circumferentially equipped with circumferential groove 5e2, and circumferential groove 5e2 accommodates the part of the relaxation of single film (stripping film) 9 (referring to Fig. 7 B).? Many places in the circumferential direction of the bottom of circumferential groove 5e2 are equipped with suction hole 5e3.The not necessary unicursal of circumferential groove 5e2 is continuous at ground, there is attraction Hole 5e3 can also be disconnected locally.Moreover, being circumferentially equipped with absorption in the peripheral side of circumferential groove 5e2 keeps single film 9 The film of outer peripheral edge portion attracts slot 5e4.Many places in the circumferential direction that film attracts the bottom of slot 5e4 are equipped with suction hole 5e5.It can also Realize that film adsorbs so that suction hole 5e5 is only arranged, but film attract slot 5e4 and suction hole 5e5's and with can further may be used Film absorption is realized by ground.Film attracts the not necessary unicursal of slot 5e4 continuous at ground, there is suction hole 5e5, can also office Portion disconnects.Suction hole 5e3, suction hole 5e5 are connected to air attracting mechanism (not shown).
As shown in Figure 7 B, single film 9 clamps face to the lower die of covering lower die cavity recess 3a and supplies, and by can in lower die The film that the most peripheral in the clamping face of dynamic fixture 5e is formed attracts the suction hole 5e5 absorption of slot 5e4 to keep.Moreover, single film 9 Holding is adsorbed along the attraction road 5e6 of the bottom periphery (periphery of lower die chamber block 5d) set on lower die cavity recess 3a.If Die closing is carried out to mold in this state, then the film for being provided projectingly the position than cope plate 4c on the lower can be made to press pin 4h Into opposite circumferential groove 5e2.At this point, film presses pin 4h under the action of the force of helical spring 4i (referring to Fig. 2) for individual The slack of film 9 is pressed into circumferential groove 5e2, so that it is attracted hole 5e3 and attracts to be received.Moreover, keeping the periphery of workpiece W The engaging portion 4d3 (referring to Fig. 2) of the chuck jaw 4d of edge be contained in it is opposite keep out of the way slot 5e1 (referring to Fig. 7 A), so as to keep away Exempt from it to interfere with lower die moveable jaw 5e.In addition, single film 9 is attracted by the suction hole 5e3 in circumferential groove 5e2, therefore, The single film for being attached at formed products 9 is set to be attracted swimmingly to be demoulded by lower die 3 in die sinking.At this point, film presses 4h is sold to press single film 9 to lower die 3 due to the flexure of helical spring 4i, single film 9 can be pressed until thin The dynamic pin 4h of membrane pressure leaves from lower die 3, becomes and is more not susceptible to remove undesirable construction.Single film (stripping film) 9 is for example 50 μm of thickness or so and the film with heat resistance, and be the film for being easy to remove from die face, with flexibility, stretching, extension Property, for example, can be suitably used with PTFE, ETFE, PET, FEP film, fluorine-containing glass fabric, polypropylene film, gather partially The single layer as main component such as dichloroethylene or multilayer film.
Like this, if covering can be under each comprising the single film 9 that the lower die of lower die cavity recess 3a clamps face Mould chase unit 5 is adsorbed holding, then is easily processed when clamping face absorption holding to the lower die comprising lower die cavity recess 3a, Also it can be avoided as much as generating the useless using area unrelated with compression molding as strip film.
In Fig. 4, in the clamping face in the edge part center of the surrounding for the cope plate 4c that rectangular shaped is formed, upper mode locking Block 4j (the first clamping block) is provided projectingly at 4 respectively.Moreover, in fig. 7, movably being pressed from both sides in the lower die that rectangular shaped is formed Have 5e surrounding edge part center clamping face or lower die concave-board 5j, a pair of of lower die clamping block 5n (the second clamping block) with Two a pair of modes are provided projectingly at 4 respectively.Upper mold clamping block 4j is configured to pass through with opposite lower die clamping block 5n recessed Tuck pointing is closed and is engaged.The cope plate 4c that thereby, it is possible to carry out being formed with work holding portion thereof 2a respectively for each mold groove unit With constitute lower die cavity recess 3a lower die moveable jaw 5e or lower die concave-board 5j contraposition, thus die closing.In addition, upper mold The form of clamping block 4j and lower die clamping block 5n can also replace in couples up and down.
In Fig. 9, in the phase of the lower die concave-board 5j of the cope plate 4c and lower die chase unit 5 of upper mold chase unit 4 To position, it has been provided projectingly upper mold adjusting pin 4k (referring to Fig. 2) and lower die adjusting pin 5p (referring to Fig. 5) (level(l)ing machine respectively Structure).Upper mold adjusting pin 4k is supported on upper mold concave-board 4a, and is provided projectingly through rest pad 4b and cope plate 4c than upper The position of the tight face of die clamp on the lower.Moreover, lower die adjusting pin 5p is supported on lower die base plate 5a by helical spring 5q, and run through Support plate 5c and lower die concave-board 5j it is provided projectingly the position more against the top than lower die clamping face.
As shown in figure 4, upper mold adjusting pin 4k along the long side of cope plate 4c edge part be equally spaced respectively equipped with More (side 4, the left and right sides totally 8).Moreover, as shown in Figure 7 A, lower die adjusting pin 5p along lower die concave-board 5j length Equally spaced it is respectively equipped with to the edge part of avris more (side 4, the left and right sides totally 8).Upper mold adjusting pin 4k and under The radical of mould adjusting pin 5p is arbitrary, and also can be set in short side.Upper and lower adjusting pin 4k, 5p configures phase when looking down Same position.
From the lower die above-mentioned cope plate 4c the upper mold adjusting pin 4k being provided projectingly and be provided projectingly from lower die concave-board 5j Adjusting pin 5p is configured relative to one another.Therefore, in die closing, opposite upper mold adjusting pin 4k and lower die adjusting pin 5p ratio in many places Die face is first collided, and absorbs the deviation of pressing force by the flexure of helical spring 5q, therefore can correct the upper of relative configuration Then the mutual depth of parallelism in the clamping face of mould chase unit 4 and lower die chase unit 5 can be such that die face plane earth contacts, because This can prevent localized contact.
Here, illustrating the movement of adjustment mechanism 8 referring to Fig. 8.As an example, left half figure of Fig. 8 indicates and common workpiece Mold cramping state of the W compared to the situation that workpiece plate thickness is relatively thin or the amount of resin of moulded resin is less.Moreover, right the half of Fig. 8 Figure indicates the mold cramping shape for the situation that workpiece plate thickness is thicker compared with common workpiece W or the amount of resin of moulded resin is more State.
For the Zuo Bantu of Fig. 8, workpiece plate thickness is relatively thin compared with common workpiece W or sets relative to molding The amount of resin supplied for the target amount of resin (amount of resin as the final encapsulation thickness appropriate after forming) of rouge is less.Or Person is both above-mentioned the case where existing simultaneously.In this case, the spiral bullet being inserted between pin suspension plate 8a and pressing plate 8d Spring 8e is the state of rebound, and the deviation of the plate thickness of workpiece W can be absorbed using the flexure of helical spring 8e.Moreover, moulding In the case that amount of resin is less, it is movable that absorption keeps the cope plate 4c of workpiece W that the force underground of helical spring 5g is overcome to depress mould Fixture 5e.As a result, with the plate thickness of workpiece W, to cavity recess 3a supply amount of resin correspondingly, lower die moveable jaw 5e relative to The relative altitude position of lower die chamber block 5d be confirmed as it is identical, therefore, in the plate thickness t1 of workpiece W relatively thin situation, to chamber In the case that the amount of resin of recess portion 3a supply is less, the deviation of plate thickness t1, the deviation t2 of amount of resin can be absorbed.Such adjustment Movement is carried out by each upper mold chase unit 4 and each lower die chase unit 5 for being set to many places (being in the present embodiment two).
Moreover, workpiece plate thickness is thicker or opposite compared with the workpiece W of Zuo Bantu for right half figure of Fig. 8 The resin supplied for the target amount of resin (amount of resin as the final encapsulation thickness appropriate after forming) of moulded resin It measures more.Or the case where being existed simultaneously for above-mentioned the two of the bigger example of the difference as left and right.In this case, in upper mold In chase unit 4, error t3 is generated in the height and position for pressing pin 4g to be exerted a force by helical spring 4f.But it is outstanding to be inserted in pin Helical spring 8e between hanging plate 8a and pressing plate 8d is compressed, and suspention pin 8b is pushed back, and becomes head 8b1 self-marketing suspension plate 8a The state of the distance of clearance t 4 slightly away absorbs the deviation of the plate thickness of workpiece W using the flexure of helical spring 8e.
Moreover, in lower die chase unit 5, by the force of helical spring 5g so that the height and position for pressing pin 5f changes The distance of t5 becomes the state that lower die moveable jaw 5e is produced from the clearance t 6 of support plate 5c slightly away.Like this, and to chamber Correspondingly, lower die moveable jaw 5e is true relative to the relative altitude position of lower die chamber block 5d for the amount of resin of room recess portion 3a supply It is set to identical.The deviation of resin thickness t7 is absorbed as a result,.
As above in such manner, it is possible to absorb multiple be compressed into using the force application mechanism of lower die moveable jaw 5e, adjustment mechanism 8 The deviation of the shape plate thickness of the workpiece W in mold 1 is pressed from both sides to mold caused by cavity recess 3a deviation of amount of resin supplied etc. The deviation of mold height (the distance between pin suspension plate 8a and lower die base plate 5a of Fig. 8) when tight.Such mold height Deviation adjusting movement by it is transversely arranged and be set to many places (being in the present embodiment two) each upper mold chase unit 4 and Each lower die chase unit 5 carries out.
Moreover, the adjustment mechanism 8 for being set to upper mold mould bases 6 is set to each mold groove unit, therefore, for the mold of left and right For chase unit, being not limited to the Zuo Bantu of Fig. 8, (plate thickness of workpiece W is relatively thin, the amount of resin of the supply feelings fewer than target amount of resin Condition) and Fig. 8 right half figure (plate thickness of workpiece W is thicker, situation of the amount of resin of supply more than target amount of resin) the case where, can also To be the case where left and right in turn, even if the situation that the plate thickness for being workpiece W on the left side is thicker, the amount of resin of supply is less, the right For workpiece W plate thickness is relatively thin, the more situation of amount of resin of supply, be adjusted with capable of not also making mold tilt.As a result, can It is enough that the summation height of multiple molds is remained constant, therefore, stamping surface can not be made obliquely accurately to be compressed into Shape goes out the thickness of resin seal portion (encapsulation part).
Like this, even if due to multiple workpiece W, there are the deviations of plate thickness, the resin supplied to each lower die cavity recess 3a The deviation etc. of amount causes also utilize in the height in the die opening and closing direction of upper mold 2 and lower die 3 there are in the case where deviation It is configured at the adjustment mechanism 8 of each upper mold chase unit 4 setting of upper mold mould bases 6, side by side to be directed to each workpiece W adjustment upper mold 2 and lower die 3 mold cramping when mold height deviation, therefore being capable of accurately compression molding.In addition, in fig. 8, it will The transversely arranged ground of two upper mold chase units 4 is configured at upper die base portion 6a side by side, thus adjustment mechanism 8 also with this cooperatively Be arranged two transversely arrangedly, but adjustment mechanism 8 be at least installed in either one upper die base portion 6a and upper mold chase unit 4 it Between.In this case, spacer is clamped in the upper mold of another party 2 to replace adjustment mechanism 8.Also, it is preferred that Be be upper mold mould bases 6 equipped in the case where 3 or more upper mold chase units 4,1 tune fewer than the quantity of chase unit Complete machine structure 8 is independently equipped on upper die base portion 6a.In this case, with the height of the fixed upper mold chase unit 4 of height Correspondingly adjustment is equipped with the height of the remaining upper mold chase unit 4 of adjustment mechanism 8.Alternatively, it is also possible to be, in the upper of affixed side Setting is used for the rest pad etc. of fixed height between mold base portion 6a and upper mold chase unit 4.
Moreover, as shown in Figure 10 A, Figure 10 B, being pressed in the case where the more mold exchange associated with the kind of replacement workpiece W Contracting molding die 1 be die sinking in the state of, by front side by upper die base side 6b centered on the hinge 6g of depth side The mode pushed from the upper die base portion 6a of upper mold mould bases 6 makes upper die base side 6b rotate predetermined amount.At this point, such as Figure 10 A institute Show, each upper mold chase unit 4 is embedded in the upper mold by hanging down in upper die base portion 6a with the left and right ends portion bumps of support plate 4b The state for the stage portion 6f that guide block 6d and upper mold groove guide 6e is formed is maintained separately.In this state, such as Figure 10 B institute Show, can be pulled out using stage portion 6f as guiding piece to front side for each upper mold chase unit 4, to be replaced in others Mould chase unit 4.The upper mold chase unit 4 taken out from upper mold mould bases 6 is shown in FIG. 9.
Moreover, compression molding mold 1 be die sinking in the state of, as shown in Figure 10 A, Figure 10 B, with from front side will under Mold base side 7b makes lower die base side 7b from the lower die of lower die mould bases 7 in the way of above pushing away centered on the hinge 7g of depth side Base portion 7a rotates predetermined amount.At this point, as shown in Figure 10 A, each lower die chase unit 5 is with the left and right ends portion of lower die concave-board 5j The lower die guide block 7d and lower die groove guide 7e shape being embedded in stage portion 5m bumps by being erected in lower die base portion 7a At the state of stage portion 7f be maintained separately.In this state, as shown in Figure 10 B, each lower die chase unit 5 can be directed to It is pulled out using stage portion 7f as guiding piece to front side, to be replaced with other lower die chase units 5.It is shown in FIG. 9 under The lower die chase unit 5 that mould mould bases 7 takes out.
Like this, in the case where more mold exchange, upper mold mould bases 6 and adjustment mechanism 8 can not be more there are also lower die mould bases 7 It uses with changing, therefore, versatility is higher, can promptly carry out changing production adjustment and maintenance.Moreover, for upper mold mould bases 6 with And for lower die mould bases 7, what upper die base portion 6a and upper die base side 6b can be rotated by the hinge 6g of depth side Mode links together, the side of lower die base portion 7a and lower die base side 7b by the hinge 7g of depth side can rotate Formula links together, and therefore, is easy to pull out upper mold chase unit 4, lower die chase unit 5 from mold front side, is easy to carry out more Change operation.
[second embodiment]
Other configuration examples of Figure 11 A, Figure 11 B expression compression molding mold 1.It is compressed for disclosed in first embodiment The identical component of molding die 1 marks identical appended drawing reference and quotes explanation, is carried out centered on different structures below Explanation.
In workpiece W equipped with multiple semiconductor chips, such as when chip carrying portion generates bad, sometimes in work The defect part of semiconductor chip is generated on part W.In this case, as long as accurately measuring semiconductor core for each workpiece W The defect quantity of piece and the amount of resin for changing supply, but time and working hour can be spent, and need by delicate metering into The supply of row resin.It therefore, also can be in mold even if in order to need not be accurately under unanimous circumstances in the supply amount of moulded resin Side is adjusted, and is equipped with aftermentioned spilling chamber in the present embodiment.
As shown in Figure 11 A, it is surround in the upper surface side outer peripheral edge portion for being set to the lower die chamber block 5d of each lower die chase unit 5 Ground is equipped with the higher-height step surface 5d1 of cavity bottom, is equipped with multiple spilling chambers 10 in step surface 5d1.Overflow chamber 10 Accommodate the remainder (deviation for absorbing amount of resin) in the moulded resin of downward mold chamber recess portion 3a supply.Therefore, it is necessary to make Amount of resin needed for thickness of the amount of resin than final encapsulation portion of downward mold chamber recess portion 3a supply has more the receiving for overflowing chamber Amount ground more supplies resin.
As shown in Figure 11 A, multiple through hole 5d2 are equipped in the stage portion 5d1 of lower die chamber block 5d.In each through hole 5d2 Respectively inserted with rocker piece 10a in a manner of it can go up and down.Each rocker piece 10a is supported on flat-hand position configuration under with erecting The upper surface of link plate 10b between mold base plate 5a and support plate 5c.Each rocker piece 10a is inserted in down through support plate 5c The through hole 5d2 of mold chamber block 5d.Helical spring 10c is equipped between link plate 10b and lower die base plate 5a, across link plate 10b exerts a force each rocker piece 10a bearing upwards.As shown in Figure 11 B, the upper surface using each rocker piece 10a and through hole 5d2 Wall surface of the hole come formed overflow chamber 10.In addition, rocker piece 10a either block-shaped, is also possible to elongated pin-shaped shape.Respectively End face (plane) shape for overflowing the top of chamber 10 both can may be the other shapes such as circle for rectangle.
Pin 10d is pressed to be provided projectingly towards vertical lower section in the lower surface of link plate 10b.It is also possible to press pin 10d Being supported on opening and closing mold mechanism (not shown) through lower die base plate 5a and lower die mould bases 7 (lower die base portion 7a) (such as can Dynamic pressure plate etc.).Moreover, it can be, such as pressure sensor (load cell is equipped in the lower end for pressing pin 10d Deng).As a result, by measuring the pressure of the resin of the spilling chamber 10 when flowing into die closing in real time immediately using pressure sensor, So as to control the resin pressure of moulded resin in real time.It is not required, can also not have in addition, pressing pin 10d.
Moreover, as shown in Figure 11 A, being also possible in the flange part 5h for pressing pin 5f than supporting lower die moveable jaw 5e Position on the lower has been provided projectingly retainer 5i.Retainer 5i can prevent downward movement in the following way, that is, under The lower end of retainer 5i is connected to base plate 5a when mould moveable jaw 5e is depressed by upper mold 2.Retainer 5i is to limit lower die The extreme position of the downward actuation of moveable jaw 5e and be arranged.The height of lower die cavity recess 3a is determined as a result, therefore, It can be constant by the thickness management of each encapsulation part (resin seal portion) of compression molding in many places.
Here, 1A illustrates the movement of the rocker piece 10a in compression molding movement referring to Fig.1.Semiconductor chip usually should All to be equipped on workpiece W, when found in process in front semiconductor chip itself there are it is bad it is equal in the case where, sometimes half Conductor chip a part is not equipped on workpiece.That is, the case where there are semiconductor chip a part shortcomings.Moreover, being generated in workpiece W Shortcoming, the defect of semiconductor chip of semiconductor chip, perhaps a part of resin falls or due to certain in resin transfer In the case that kind reason causes the moulded resin amount of downward mold chamber recess portion 3a supply to be less than target amount of resin, when to compression molding When carrying out die closing with mold 1, exist in each rocker piece 10a for the through hole 5d2 for being inserted into lower die chamber block 5d through support plate 5c Shape is compressed into the state of entering in lower die cavity recess 3a under the action of the force of helical spring 10c from stage portion 5d1.By This absorbs the difference between the size of lower die cavity volume and the amount of resin of the moulded resin of supply.
Moreover, the moulded resin amount in mold chamber recess portion 3a downward for workpiece W supply is more than target amount of resin In the case where, the force of helical spring 10c is overcome under the action of resin pressure rocker piece 10a is pushed, in residual resin It is contained in the state of through hole 5d2 and carries out compression molding.The size of lower die cavity volume and the tree of moulded resin are absorbed as a result, Difference between rouge amount.
In addition, a possibility that being shaped if amount of resin is excessively few there are final encapsulation thinner thickness, it is preferred, therefore, that Intentionally from the resin being initially initially supplied more than target amount of resin, it is adjusted by the drafts of each rocker piece 10a.
It therefore, also can be by formed products even if not accurately measuring the supply amount of moulded resin in advance for each workpiece W Thickness carry out compression molding with keeping constant.Moreover, being formed in the recess portion of formed products, protrusion is the work unrelated with final product The outer peripheral edge portion of part W, therefore will not influence forming quality.Moreover, rocker piece 10a is always towards the molding tree in cavity recess 3a Rouge is exerted a force, therefore the moulded resin into cavity recess 3a applies resin pressure, can eliminate stomata to improve formed products Matter.In addition, overflowing chamber 10 is set to lower die chamber block 5d, but the clamping face of lower die moveable jaw 5e can also be set to.
[variation]
Then, 2~Figure 15 A, Figure 15 B illustrate that the workpiece W of the mold 1 of the compression molding with Fig. 1 is corresponding referring to Fig.1 Deform use example.The compression molding of Fig. 1 uses mold 1 to instantiate the rectangle to two such as 300mm × 100mm as workpiece W The case where bar shaped substrate carries out compression molding simultaneously, but be also able to use the size workpiece W bigger than its and pressed one by one Shorten shape into.
Figure 12 is obtained by the compression molding die that front observation carries out the workpiece of larger size in the case where compression molding The cross sectional illustration figure arrived, Figure 13 are that the compression molding mould carried out in the case where compression molding to the workpiece of larger size is observed in side Has obtained cross sectional illustration figure.Show following examples, that is, from the structure of upper mold 2 shown in FIG. 1, removal is set to upper The upper mold guide block 6d and upper mold groove guide 6e of the middle section of mould mould bases 6, upper mold chase unit 4 is replaced be used for compared with The component of large-sized workpiece W.Moreover, showing following examples, that is, from the structure of lower die 3 shown in FIG. 1, removal is set Lower die guide block 7d and lower die groove guide 7e in the middle section of lower die mould bases 7, replace with use for lower die chase unit 5 In the component of the workpiece W of larger size.In this case, capable of also sharing upper mold mould bases 6 and adjustment mechanism 8, there are also lower die moulds Frame 7.
In case of fig.12, pressing plate 8d is partitioned from and there are two adjustment mechanisms 8, therefore, workpiece W's itself How much there is difference in the supply of left and right in the slightly different situation of left and right thickness, the amount of resin of downward mold chamber recess portion 3a supply In the case where, the case where the structure that the pressing plate 8d shown in Figure 13 is integrated compared with, can also be adjusted respectively by adjustment mechanism 8 Reshaping die height.
Figure 14 A indicates the feelings that compression molding is carried out to the large-scale rectangular plate of such as 300mm × 300mm as workpiece W The top view of upper mold 2 under condition, Figure 14 B indicate to carry out the large-scale rectangular plate of such as 300mm × 300mm as workpiece W The top view of lower die 3 in the case where compression molding.In Figure 14 A, in upper mold 2, chuck jaw 4d is with identical quantity (such as 3 Place) it is respectively arranged on four sides for being adsorbed in the workpiece W of cope plate 4c.Moreover, upper mold guide block 6d and upper mold groove guide 6e are only Set on the left and right ends portion of upper mold mould bases 6.It is provided projectingly in many places (such as every have at 4 on one side) of the outer peripheral edge portion of cope plate 4c There is upper mold adjusting pin 4k.In addition, the diagram of the adsorption hole 2b of multiple workpiece W for being formed in work holding portion thereof 2a is omitted.
In fig. 14b, in the lower die moveable jaw 5e of lower die 3, keep out of the way the chuck jaw 4d of slot 5e1 and upper mold 2 accordingly with Identical quantity (such as at 3) is respectively arranged on around lower die cavity recess 3a.Moreover, lower die guide block 7d and lower die groove guides Part 7e is only set to the left and right ends portion of lower die mould bases 7.Lower die adjusting pin 5p is set in the position protrusion opposite with upper mold adjusting pin 4k It is placed in many places (such as every have at 4 on one side) of the outer peripheral edge portion of lower die moveable jaw 5e.In addition, being omitted in the case where being circumferentially set to The film of mould moveable jaw 5e attracts the multiple suction hole 5e5 and circumferential groove 5e2 and suction hole 5e3 of the trench bottom setting of slot 5e4 Diagram.
Figure 15 A is to such as diameter as workpiece WSemiconductor crystal wafer and circular carrier, substrate The top view of upper mold 2 in the case where progress compression molding, Figure 15 B is to such as diameter as workpiece WHalf Semiconductor wafer and circular carrier, substrate carry out the top view of the lower die 3 in the case where compression molding.In Figure 15 A, upper In mould 2, chuck jaw 4d at equal intervals (such as every 90 degree the phase that is staggered 4 at) be set to the workpiece W for being adsorbed on cope plate 4c Around.Moreover, upper mold guide block 6d and upper mold groove guide 6e are only set to the left and right ends portion of upper mold mould bases 6.In cope plate The many places (such as every have at 4 on one side) of the outer peripheral edge portion of 4c have been provided projectingly upper mold adjusting pin 4k.In addition, multiple formation are omitted In the diagram of the adsorption hole 2b of the workpiece W of work holding portion thereof 2a.
In Figure 15 B, at the lower die moveable jaw 5e of lower die 3, keep out of the way the chuck jaw 4d of slot 5e1 and upper mold 2 accordingly At equal intervals (such as every 90 degree the phase that is staggered 4 at) be set to lower die cavity recess 3a around.Moreover, lower die guide block 7d with And lower die groove guide 7e is only set to the left and right ends portion of lower die mould bases 7.Lower die adjusting pin 5p with upper mold adjusting pin 4k phase Pair position be provided projectingly on lower die moveable jaw 5e outer peripheral edge portion many places (such as every have at 4 on one side).In addition, being omitted Attract the multiple suction hole 5e5 and circumferential groove of the trench bottom setting of slot 5e4 in the film for being circumferentially set to lower die moveable jaw 5e The diagram of 5e2 and suction hole 5e3.Moreover, other than the semiconductor crystal wafer of round, being also possible to will be more as workpiece W The round carriers, substrate such as eWLB made of a semiconductor chip T is engaged by chip.
As shown in Figure 14 A, Figure 14 B and Figure 15 A, Figure 15 B, it is also possible to compression molding mold 1 as follows, Upper mold 2 is included, there is the work holding portion thereof 2a for keeping Zhang Gong's part W；And lower die 3, utilize fixture 5e and chamber block 5d And lower die cavity recess 3a is formed, lower die cavity recess 3a and work holding portion thereof 2a are oppositely disposed, and fixture 5e is for clamping workpiece W, chamber block 5d are inserted in fixture 5e, can be pressurizeed by relatively moving to resin, and upper mold 2 has adjustment mold folder The adjustment mechanism 8 (not shown) of the deviation of thickness direction when tight.It in this case, even such as not necessarily can be transversely The workpiece W of the larger size configured side by side in a row is able to use the upper mold 2 with adjustment mechanism 8 also to adjust and press from both sides with mold The deviation of the corresponding mold height of workpiece W of larger size when tight, thus accurately compression molding.
Figure 16 is compression molding shown in Fig. 1 chamber block 5d and the bearing that lower die chase unit 5 is changed in mold 1 The figure of structure made of the form of plate 5c.That is, support plate 5c is set as not supporting lower die chamber block 5d but bearing lower die is movably pressed from both sides Has 5e and lower die concave-board 5j.Lower die chamber block 5d is directly supported on multiple support column 5b, and multiple support column 5b erect to be formed In lower die base plate 5a.The trench bottom of slot 5e4 is attracted to set in the film for being circumferentially set to lower die moveable jaw 5e in addition, being omitted The diagram of the multiple suction hole 5e5 and circumferential groove 5e2 and suction hole 5e3 that set.
In this case, the plate thickness of lower die chamber block 5d can be made thicker, and support lower die chamber using support column 5b The underface position of block 5d accordingly, it is difficult to be influenced by warpage etc., therefore can be further accurately proceed based on bearing The height of column 5b adjusts.
In the Zuo Bantu of Figure 17, the lower die with the lower die chase unit 5 in compression molding mold 1 shown in FIG. 1 can Unlike dynamic fixture 5e, lower mould clamping device 5e is fixedly attached to support plate 5c, and lower die chamber block 5d is connected to driving mechanism 11 To be set as directly going up and down.Driving mechanism 11 is also possible to liquid either servo motor 11a and power transfering part 11b Hydraulic actuator.In this case, the volume that can accurately control lower die cavity recess 3a is easy to being supplied to lower mode cavity The moulded resin of room recess portion 3a applies resin pressure.
In half figure of the right side of Figure 17, the lower end for pressing pin 5f is supported by movable link plate 12, is pressed pin 5f and is utilized upper end Portion supports lower die moveable jaw 5e.Lower die base plate 5a is cut and is arranged with flat-hand position by movable link plate 12.Movable connection Plate 12 is connected to driving mechanism 13 to be set as directly going up and down.Driving mechanism 13 is either servo motor 13a and power Transfer part 13b, is also possible to hydraulic actuator.Attract in addition, being omitted in the film for being circumferentially set to lower die moveable jaw 5e The diagram of the multiple suction hole 5e5 and circumferential groove 5e2 and suction hole 5e3 etc. of the trench bottom setting of slot 5e4.
It as a result, can also be by the transmission driving mechanism (column of the transmission forming punching press for two Zhang Gong's parts used in the past Plug driving mechanism) it is used as the driving mechanism of lower die moveable jaw 5e.
Figure 18 instantiates the case where compression molding mold 1 being also possible to as follows, can not only to Figure 14 A, The workpiece W monomer of the larger sizes such as rectangle plate, Figure 15 A shown in Figure 14 B, circular semiconductor crystal wafer shown in Figure 15 B into Row compression molding, additionally it is possible to which compression molding is carried out to 1 bar shaped substrate.
The compression molding that Figure 19 illustrates 3 bar shaped substrates replaces 2 bar shaped substrates shown in FIG. 1 to use with mold 1 Compression molding mold 1.Instantiate following situation: mould structure is identical as Fig. 1, and can relative to common mould bases (on Mould mould bases 6 and lower die mould bases 7) plug mold groove unit (upper mold chase unit 4 and lower die chase unit 5) quantity It is 3 groups.Alternatively, it is also possible to which 4 groups or more of mold groove unit is arranged.
The other structures of Figure 20 A, Figure 20 B expression adjustment mechanism 8.The coiling machine of helical spring 8e is set using in Fig. 1 Wedge mechanism 14 also can be used as adjustment mechanism 8 in structure.In Figure 20 A, Figure 20 B, in the upper die base of upper mold mould bases 6 Between portion 6a and the upper mold concave-board 4a of upper mold chase unit 4, movable sliding panel 14a and wedge 14b are overlapped each other with slope surface 14c Mode be laminated.Wedge 14b is superimposedly assembled in upper mold concave-board 4a across height adjustment plate 14d.
Moreover, as shown in fig. 20b, in the side of the depth side of rectangular box-like upper die base side 6b, being equipped with screw thread Axis 14e and servo motor 14f.Thread spindle 14e is chimeric with the nut thread of movable sliding panel 14a is set to.By driving servo Motor 14f make its along predetermined direction rotate predetermined amount, thus make movable sliding panel 14a along upper die base portion 6a in the horizontal direction Upper movement.At this point, adjusting the height and position of upper mold chase unit 4 using the wedge 14b being laminated by slope surface 14c.That is, as schemed Shown in 20A, the gap that also can use the die opening and closing direction of the locking stage portion 6f of rest pad 4b of upper mold chase unit 4 is come The plate thickness for absorbing workpiece W is poor.
Shown in the plane figure of Figure 21 be equipped with any of the above-described kind compression molding mold 1 resin molded dress An example set.Workpiece W be 100mm × 300mm rectangular bar-shaped substrate, moulded resin can be tabletting resin (hard resin), Any one of flaky resin, particulate resins, powdered resin, fluid resin, are able to use particulate resin as an example.It carries The pressing part 15 of compression molding mold 1 is set at 3.Every 1 pressing part 15 is directed to two Zhang Gong's parts, is acted by 1 punching press Compression molding can be carried out to total 6 Zhang Gong's part W.In addition it is also possible in view of supply, the forming based on punching press, storage Deng time when, in order to improve productivity, in a fairly large number of situation of punching press, shape each punching press successively.
Workpiece supply incorporating section 16, the Workpiece supply incorporating section are equipped in the left end side of 3 pressing parts being set side by side 15 16 for supplying workpiece W, and is accommodated in library after forming.Workpiece conveying mechanism 17 is in Workpiece supply incorporating section 16 and pressing part It moves back and forth, is acted as follows when the compression molding relative to die sinking is moved forward and backward with mold 1, that is, take between 15 The workpiece W before workpiece W and supply forming after shaping out.Into pressing part 15 workpiece loading part 17 by the workpiece W after forming (formed products) are received in a manner of two one group, by the workpiece W before forming to compression molding mold 1 in a manner of two one group (the work holding portion thereof 2a of upper mold 2: join referring to Fig.1).
Film resin supply unit 18 is equipped in the right end side of pressing part 15.In film resin supply unit 18, each film and each Bar shaped substrate is correspondingly supplied to, cuts off, to become single film 9.According to what is sensed in Workpiece supply incorporating section 16 It is flatly sprinkling upon to size same shape when as a result calculating target amount of resin, such as making particulate resin to overlook with chamber In single film 9.Moreover, passing through resin transfer mechanism 19, the resin and single film 9 from 18 quilt of film resin supply unit It is delivered to pressing part 15, only single film 9 after recycling forming.
In above-mentioned resin molding machine, in each pressing part 15, by multiple (such as two one group) bar shaped substrates and It is supplied respectively to the mold groove unit configured side by side for the single film 9 and resin of each substrate, so as to one side suction The deviation of plate thickness of part W, the deviation of amount of resin of knocking off respectively carry out compression molding on one side, and therefore, productivity, treatability mention It is high.The quantity of pressing part 15 is not limited to three, both can be more than three or fewer than three.
In addition, compression molding apparatuss are either such as any one of upper mold 2 and lower die 3 are movable type and another one For fixed, or it is also possible to both movable types.And to the opening and closing mold mechanism that compression molding mold 1 is opened and closed It is able to use based on servo motor and thread spindle, based on servo motor and toggle link or based on hydraulic drive mechanism etc. Various driving mechanisms.
Moreover, compression molding mold 1 is formed with cavity recess 3a in lower die 3, work holding portion thereof is formed in upper mold 2 2a is but it is also possible to be being formed with work holding portion thereof in lower die 3, be formed with cavity recess in upper mold 2.In such a case it is possible to Lower die mould bases 7 is integrally provided adjustment mechanism 8, can adsorb in upper mold chase unit 4 and keep single film 9.In this case, Moulded resin is not supplied in single film 9, but is supplied on workpiece W.Moreover, the present embodiment is using single film 9 Embodiment, but strip film also can be used.
In addition, the present embodiment be using the embodiment of film but it is also possible to be without using film the case where.
Above-mentioned compression molding mold 1 is instantiated for Zhang Gong's part W or for the mold of two Zhang Gong's part W, but can also It is moulded with the workpiece W for three or more.
It is illustrated for the other structures of compression molding apparatuss.
As shown in figure 22, it is also possible to for example be arranged in the horizontal direction for the compression molding mold 1 for Zhang Gong's part W Ground can be opened and closed equipped with multiple using common ram driving mechanism 20 (opening and closing mold mechanism).In Figure 22, in rectangle Each corner of the punch pad 20a of shape is vertically equipped with guide post 20b.The upper end of guide post 20b is linked to fixation clip 20c, can Dynamic pressure plate 20d is can slide the middle part that mobile mode is connected to guide post 20b.Movable pressure plate 20d is set as can be by Servo motor 21a and power transfering part 21b set on punch pad 20a are gone up and down.It is arranged in the horizontal direction in fixation clip 20c Ground is supported with upper mold 2, is supported with lower die 3 in movable pressure plate 20d with being arranged in the horizontal direction.In the upper mold chase unit for constituting upper mold 2 Equipped with adjustment mechanism 8 (not shown) same as Fig. 9.
Figure 23 is the figure for indicating another other structures of compression molding apparatuss.It is also possible to for for Zhang Gong's part W's Compression molding is overlappingly carried with multilayer (in the present embodiment for two layers) in the height direction with mold 1, can be using jointly Ram driving mechanism 20 (opening and closing mold mechanism) be opened and closed.In Figure 23, in each corner of the punch pad 20a of rectangular shape It is vertically equipped with guide post 20b.The upper end of guide post 20b be linked to fixation clip 20c, movable pressure plate 20d and intermediate press plate 20e with The middle part that mobile mode is connected to guide post 20b can be slided.Movable pressure plate 20d is set as can be by set on punching press The servo motor 21a and power transfering part 21b of pedestal 20a is gone up and down.Intermediate press plate 20e with by with movable pressure plate 20d The rack gear that interlocks of lifting action and pinion gear mechanism etc. (not shown) with different stroke, (such as movable pressure plate 20d is in Between pressing plate 20e movement ratio 2:1) carry out lifting action mode connect.
Be supported with upper mold 2 respectively in the lower surface of fixation clip 20c and intermediate press plate 20e, in movable pressure plate 20d and The upper surface of intermediate press plate 20e is supported with lower die 3 respectively.It is respectively equipped in the upper mold chase unit for constituting upper mold 2 same as Fig. 9 Adjustment mechanism 8 (not shown).
It, also can be by being directed to multiple workpiece even a such as Zhang Gong part W as the workpiece of larger size as a result, Compression molding is carried out to improve productivity simultaneously, further, it is possible to absorb configuration or multi-layer configuration side by side using adjustment mechanism 8 The deviation of mold height when the mold cramping of each of mold groove unit mold groove unit, to not make mold incline Tiltedly it is accurately proceed compression molding.
Here, illustrating the other examples of compression molding die 1 referring to Figure 24 and Figure 25.Compression molding is distinguished with mold 1 It clamps the multiple workpiece W configured side by side with being arranged in the horizontal direction and carries out compression molding simultaneously.For what is be identical with the first embodiment Component marks identical appended drawing reference and quotes explanation.
Referring to Figure 24, illustrate the structure of upper mold 2 (the first mold).This schematically describes minimal structure.It is constituting The upper die base portion 6a of the bottom of upper mold mould bases 6 (the first base portion) is equipped with adjustment for each workpiece W in multiple workpiece W Mechanism 8 (helical spring 8e).Keep workpiece W cope plate 4c by the adjustment mechanism 8 be arranged in the horizontal direction by hanger bearing.? Cope plate 4c is formed with the work holding portion thereof 2a that absorption respectively keeps workpiece W.In addition, in upper die base portion 6a, it is not shown on Mold base side 6b (the first pedestal side), the upper mold guide block 6d for separating upper mold spatial portion 6c (the first die space portion) (the first guide block), attracting mechanism and the mechanism of decompressor, but above-mentioned component also can be set.
It is illustrated for the structure of lower die 3 (the second mold).Constituting the bottom of lower die mould bases 7 (the second base portion) On lower die base portion 7a, supports with being arranged in the horizontal direction and be fixed with lower die chamber block 5d, lower die chamber block 5d and work holding portion thereof 2a Relative configuration.Moreover, the lower die moveable jaw 5e for clamping workpiece W is independently floated branch using helical spring 5g for each workpiece It holds around lower die chamber block 5d.Lower die cavity recess 3a is formed with using lower die chamber block 5d and lower die moveable jaw 5e. Lower die chamber block 5d in the state of being inserted into lower die moveable jaw 5e by making a relative move, to add to resin Pressure.Alternatively, it is also possible to be, lower die base side 7b (the second pedestal side), by lower die spatial portion 7c (the second die space portion) Lower die guide block 7d (the second guide block) separated etc. erects ground and is arranged in lower die base portion 7a.
Through the above structure, when clamping multiple workpiece W using upper mold 2 and lower die 3, adjustment mechanism 8 and spiral shell are utilized Rotation spring 5g is movably pressed from both sides for each workpiece W using cope plate 4c (the first cope plate and the second cope plate) and lower die to absorb Therefore the deviation of mold height when tool 5e is clamped is clamped, wherein cope plate 4c is upper in which can not make mold tilt Mold base portion 6a is arranged and has work holding portion thereof 2a, lower die moveable jaw 5e to be formed opposite with cope plate 4c with being arranged in the horizontal direction The lower die cavity recess 3a (the first lower die cavity recess and the second lower die cavity recess) of configuration.
Figure 25 is the figure for indicating the another other examples of compression molding mold 1.Compression molding clamps edge with mold 1 respectively Multiple workpiece W for configuring side by side transversely arrangedly simultaneously carry out compression molding simultaneously.For the component mark being identical with the first embodiment It infuses identical appended drawing reference and quotes explanation.
Referring to Figure 25, illustrate the structure of upper mold 2 (the first mold).This schematically describes minimal structure.It is constituting The upper die base portion 6a (the first base portion) of the bottom of upper mold mould bases 6 (the first mould bases), is supported with cope plate with being arranged in the horizontal direction 4c (the first cope plate and the second cope plate), cope plate 4c independently keeps multiple workpiece W.Difference is formed in cope plate 4c Absorption keeps the work holding portion thereof 2a of workpiece W.In addition, in upper die base portion 6a, 6b (the first base in upper die base side not shown Seat side), the upper mold guide block 6d (the first guide block) that separates upper mold spatial portion 6c (the first die space portion), attracting mechanism with And the mechanism of decompressor, but above-mentioned component also can be set.
It is illustrated for the structure of lower die 3.Lower die base portion 7a in the bottom for constituting lower die mould bases 7 (the second mould bases) In (the second base portion), it is supported with lower die cavity recess 3a (the first lower die cavity recess and the second lower die with being arranged in the horizontal direction Cavity recess), lower die cavity recess 3a is formed by lower die moveable jaw 5e and lower die chamber block 5d, lower die moveable jaw 5e and work Part maintaining part 2a is relatively configured, and for clamping workpiece W, lower die chamber block 5d passes through in insertion lower die moveable jaw 5e It is made a relative move under state, to pressurize to resin.
Specifically, lower die chamber block 5d for each workpiece W independently supporting and fixing on lower template 5r (Die and mould plate). Lower die moveable jaw 5e independently exerts a force for each workpiece W by helical spring 5g and is supported on lower template 5r.In lower template 5r It is equipped between lower die base portion 7a and is directed to the independent adjustment mechanism 8 (helical spring 8e) of each workpiece W.
In addition, in lower die base portion 7a, lower die base side 7b (the second pedestal side) not shown, by lower die spatial portion The lower die guide block 7d (the second guide block) etc. that 7c (the second die space portion) is separated, but above-mentioned component also can be set.
As a result, when being utilized respectively upper mold 2 and lower die 3 clamps multiple workpiece W, the spiral bullet of lower die moveable jaw 5e is utilized Spring 5g and the adjustment mechanism 8 between lower template 5r and lower die base portion 7a absorb mold height for each workpiece W Therefore deviation is clamped in which can not make mold tilt, wherein the upper mold 2 is to be arranged in the horizontal direction ground in upper die base portion 6a It is arranged made of the cope plate 4c with work holding portion thereof 2a, which is by lower die cavity recess 3a and work holding portion thereof 2a It is configured at being relatively arranged in the horizontal direction made of lower die base portion 7a.

Claims (24)

1. a kind of compression molding mold, the multiple workpiece by being arranged in the horizontal direction configured side by side clamp respectively and to multiple works Part carries out compression molding simultaneously, which is characterized in that
The compression molding is included with mold
First mold has the work holding portion thereof kept respectively to the multiple workpiece；And
Second mold forms multiple cavity recess using fixture and chamber block, the cavity recess and the work holding portion thereof Relative configuration, for clamping the workpiece and being independently configured for each workpiece, which passes through in insertion institute the fixture It makes a relative move to pressurize to resin in the state of stating in fixture,
First mold has adjustment mechanism, which can respectively adjust height for each workpiece.
2. compression molding mold according to claim 1, wherein
First mold is arranged in parallel with first with the work holding portion thereof in the first mould bases with being arranged in the horizontal direction respectively Chase unit, the adjustment mechanism have to leaving first chase unit along die opening and closing direction from first mould bases Towards the spring unit to exert a force respectively, the adjustment mechanism is respectively configured at described the first of first mould bases side by side The deviation adjusting of mold height when the mold cramping of chase unit.
3. compression molding mold according to claim 1 or 2, wherein
Second mold is arranged in parallel with the second groove list with the cavity recess in the second mould bases with being arranged in the horizontal direction Member, each second chase unit is to form the chamber block of the bottom of the cavity recess and be centered around the surrounding terrain of the chamber block Second mould bases is supported at the mode that the fixture of the side of the cavity recess can relatively move.
4. compression molding mold according to claim 3, wherein
Covering can be kept comprising the film that the lower die of the cavity recess clamps face by each second chase unit absorption.
5. a kind of compression molding mold, wherein
The compression molding is included with mold
Upper mold mould bases；
Upper mold chase unit is assembled in the upper mold mould bases across adjustment mechanism in a manner of assemble and unassemble, the upper mold groove Unit, which clamps face in upper mold, has work holding portion thereof；
Lower die mould bases is oppositely disposed with the upper mold mould bases；And
Lower die chase unit is assembled in the lower die mould bases in a manner of it can plug, which utilizes and institute With stating lower die chamber block and the encirclement lower die chamber block of the work holding portion thereof relative configuration quilt in a manner of it can relatively move The fixture of bearing forms lower die cavity recess.
6. compression molding mold according to claim 5, wherein
A pair of upper mold chase unit is supported in a manner of assemble and unassemble across the adjustment mechanism with being arranged in the horizontal direction respectively In the upper mold mould bases,
The upper mold chase unit has respectively to be overlappingly assembled in the adjustment mechanism and has on the first of work holding portion thereof Template and the second cope plate,
A pair of of lower die chase unit and a pair of upper mold chase unit be relatively arranged in the horizontal direction respectively with assemble and unassemble Mode is set to the lower die mould bases,
The lower die chase unit is respectively provided with the first lower die cavity recess and the second lower die cavity recess, the first lower die chamber Recess portion is by the lower die chamber block that is oppositely disposed with first cope plate and with surrounding the lower die chamber block with being capable of phase The fixture supported to mobile mode is formed, under the second lower die cavity recess with second cope plate by being oppositely disposed Mold chamber block and the fixture supported in a manner of it can relatively move with surrounding the lower die chamber block are formed.
7. a kind of compression molding mold, the compression molding with mold be arranged in the horizontal direction equipped with multiple molds, mold folder Tight single workpiece simultaneously carries out compression molding to resin, which is opened and closed with mold by common opening and closing mold mechanism, It is characterized in that,
The compression molding is included with mold
First mold has the work holding portion thereof for keeping the workpiece；And
Second mold forms cavity recess using fixture and chamber block, and the cavity recess is opposite with the work holding portion thereof Configuration, for clamping the workpiece, which is inserted into the fixture and is carried out by relatively moving to resin the fixture Pressurization,
There is the adjustment mechanism for adjusting height in any mold in first mold and second mold.
8. a kind of compression molding mold, the multiple workpiece by being arranged in the horizontal direction configured side by side clamp respectively and to multiple works Part carries out compression molding simultaneously, which is characterized in that
The compression molding is included with mold
First mold, the first base portion possessed by the first mould bases, supports for keeping the workpiece with being arranged in the horizontal direction Work holding portion thereof；And
Second mold, the second base portion possessed by the second mould bases, supports cavity recess with being arranged in the horizontal direction, and the chamber is recessed Portion is oppositely disposed with the work holding portion thereof and is formed by fixture and chamber block, and the fixture is for clamping the workpiece, the chamber Block pressurizes to resin by making a relative move in the state of being inserted into the fixture,
The chamber block is directed to each workpiece, and independently supporting and fixing is independently applied in Die and mould plate, the fixture for each workpiece Power is supported on the Die and mould plate, is independently equipped with and is used for for each workpiece between the Die and mould plate and second base portion Adjust the adjustment mechanism of height.
9. a kind of compression molding apparatuss, with compression molding mold according to any one of claims 1 to 8.
It is that the multiple mold groove units by being arranged in the horizontal direction configured side by side support is assemble and unassemble 10. a kind of mould bases A pair of mould bases up and down, which is characterized in that
In the mould bases of either one and base portion up and down, integrally provided with adjustment mechanism, which can absorb by by each mold Total deviation institute of the film thickness in the plate thickness of workpiece, the amount of resin of moulded resin and covering clamping face that chase unit clamps The deviation of mold height when caused mold cramping.
11. mould bases according to claim 10, wherein
The mould bases includes
First groove guide is adjacently set to the die opening and closing surface side of the first guide block with the first guide block, and first guide block is from One base portion is arranged with hanging down；And
Second groove guide is adjacently set to the die opening and closing surface side of the second guide block with the second guide block, and second guide block is from Two base portions erect ground setting,
The first groove list of the mold groove unit will be provided as using first guide block and first groove guide The stage portion of member plug is respectively formed in two sides, will be provided as using second guide block and second groove guide described The stage portion of the second chase unit plug of mold groove unit is respectively formed in two sides.
12. mould bases according to claim 10, wherein
First pedestal side of the frame-shaped being arranged with hanging down from the first base portion and the frame-shaped being arranged with erecting from the second base portion The second pedestal side relative configuration,
By the first guide block of the first die space spaced-apart surrounded by first pedestal side and will be by second base The the second guide block relative configuration for the second die space spaced-apart that seat side surrounds.
13. mould bases according to claim 10, wherein
First pedestal side is rotatably linked to by hinge in the first chase unit plug orientation depth side One base portion, the second pedestal side rotatably link in the second chase unit plug orientation depth side by hinge In the second base portion.
14. mould bases described in any one of 0~13 according to claim 1, wherein
The adjustment mechanism has spring unit, and the spring unit is along die opening and closing direction relative to the first mould bases to the first concave-board It exerts a force or exerts a force relative to the second mould bases to the second concave-board along die opening and closing direction.
15. mould bases described in any one of 0~13 according to claim 1, wherein
The adjustment mechanism between the first mould bases and the first concave-board, or the second mould bases and the second concave-board between with energy The mode enough slided is equipped with the sliding panel that slope surface overlaps each other.
16. a kind of mold chase unit is to clamp workpiece using the first chase unit and the second chase unit to tree The mold chase unit of rouge progress compression molding, which is characterized in that
It is equipped with work holding portion thereof in the clamping face of any one of first chase unit and second chase unit, described The clamping face of the another one of first chase unit and second chase unit is formed with cavity recess, the cavity recess with it is described Work holding portion thereof relative configuration, the cavity recess utilize in fixture and the insertion fixture for clamping the workpiece and pass through It relatively moves the chamber block that pressurizes to resin and is formed,
It is equipped in the clamping face of the fixture and the thin of absorption holding is carried out to the outer peripheral edge portion for the film for covering the cavity recess Film suction hole or attraction slot with suction hole between the film suction hole and the cavity recess or have and inhale It is equipped with circumferential groove between the attraction slot and the cavity recess of pilot hole, is equipped with multiple suction holes in the trench bottom of the circumferential groove.
17. mold chase unit according to claim 16, wherein
The circumferential groove is also used as pressing the recess portion of pin entrance for film, which, which presses pin, will be set to the first chase unit and second The film indentation in the clamping face of any one of chase unit.
18. mold chase unit according to claim 16, wherein
What the circumferential groove was also used as the chuck jaw of work holding portion thereof keeps out of the way slot.
19. a kind of mold chase unit is by Workpiece clamping in a pair of of chase unit and to resin progress compression molding Compression molding die chase unit, which is characterized in that
First has been provided projectingly in each edge part in the clamping face of the rectangular shape for the chase unit for constituting a side or concave-board Clamping block, being provided projectingly in the clamping face of the chase unit of opposite another party or concave-board opposite face can be with described first Second clamping block of clamping block engagement.
20. mold chase unit described in 6 or 19 according to claim 1, wherein
First chase unit has the first engaging portion, and first engaging portion is in a manner of it can plug engaging in relative to the first mould The first guide block formed is erected, the second chase unit has the second engaging portion, and second engaging portion is in a manner of it can plug Engaging in erecting the second guide block to be formed relative to the second mould bases.
21. mold chase unit described in any one of 6~20 according to claim 1, wherein
It is equipped in the relative position of the first chase unit and the second chase unit mutual inclined strong for correcting clamping face Flattening mechanism.
22. a kind of mold chase unit is that the compression molding die with the first chase unit and the second chase unit is used Chase unit, first chase unit have the work holding portion thereof for keeping workpiece, which has for molding The cavity recess of resin supply, which is characterized in that
Second chase unit is configured to make to be formed the chamber block of the bottom of the cavity recess and forms the cavity recess The fixture of side can relatively move,
Stopping for the height and position for limiting the fixture is equipped in the face of that side opposite with side locating for clamping face of the fixture Moving part.
23. mold chase unit according to claim 22, wherein
Along the chamber block outer peripheral edge portion be equipped with multiple spilling chambers.
24. a kind of compression molding mold, wherein
Mold described in any one of claim 16~23 is arranged in the horizontal direction with chase unit relative to mould bases, and ground is arranged side by side to be configured, The mold is set as independently plugging relative to the mould bases with chase unit.
CN201910101140.0A 2018-02-09 2019-01-31 Die carrier, die recess unit, compression molding die, and compression molding device Active CN110126168B (en)

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JP2018-022396 2018-02-09
JP2018022396A JP7092514B2 (en) 2018-02-09 2018-02-09 Chase unit for compression molding dies and dies for compression molding
JP2018-022371 2018-02-09
JP2018022371A JP7060390B2 (en) 2018-02-09 2018-02-09 Compression mold and compression molding equipment
JP2018022385A JP7092513B2 (en) 2018-02-09 2018-02-09 Mold base for compression molding dies
JP2018-022385 2018-02-09

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976475A (en) * 2019-12-02 2021-06-18 朝日科技股份有限公司 Resin sealing device
CN115332095A (en) * 2022-10-12 2022-11-11 安徽大华半导体科技有限公司 QFN large substrate packaging mold and method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2226852Y (en) * 1995-05-12 1996-05-15 锋泰模业有限公司 Forming mould for sole
JP2007320222A (en) * 2006-06-02 2007-12-13 Apic Yamada Corp Resin molding device
CN101436558A (en) * 2007-11-16 2009-05-20 东和株式会社 Method of compression-molding electronic components and mold
JP2012040843A (en) * 2010-08-23 2012-03-01 Sumitomo Heavy Ind Ltd Mold for compression molding and compression molding method
CN102655189A (en) * 2011-03-02 2012-09-05 东和株式会社 Optoelectronic part producing method, optoelectronic part producing system, and optoelectronic part
CN103182767A (en) * 2011-12-27 2013-07-03 山田尖端科技株式会社 Method for resin molding and resin molding apparatus
CN105283289A (en) * 2013-06-14 2016-01-27 山田尖端科技株式会社 Resin-molding die and resin-molding device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131706A (en) * 1997-07-11 1999-02-02 Toshiba Corp Method for forming mold of semiconductor device and metallic mold for forming mold of semiconductor device
JP5153509B2 (en) 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 Electronic component compression molding method and mold apparatus
JP5312897B2 (en) 2008-10-20 2013-10-09 Ｔｏｗａ株式会社 Compression molding equipment
JP2012035433A (en) * 2010-08-04 2012-02-23 Sumitomo Heavy Ind Ltd Compression mold and compression molding method
JP5285737B2 (en) 2011-04-15 2013-09-11 Ｔｏｗａ株式会社 Resin sealing molding method and resin sealing molding apparatus for electronic parts
JP5906528B2 (en) * 2011-07-29 2016-04-20 アピックヤマダ株式会社 Mold and resin molding apparatus using the same
JP6018037B2 (en) * 2013-11-28 2016-11-02 Ｔｏｗａ株式会社 Compression molding apparatus, mold surface parallelism adjustment method, and die height adjustment method
JP2015162553A (en) * 2014-02-27 2015-09-07 アサヒ・エンジニアリング株式会社 Resin molding device and resin molding method of semiconductor device
JP6491508B2 (en) * 2015-03-23 2019-03-27 Ｔｏｗａ株式会社 Resin sealing device and method of manufacturing resin molded product
JP6020667B1 (en) * 2015-06-19 2016-11-02 第一精工株式会社 Transfer molding machine and method of manufacturing electronic component
JP6430342B2 (en) * 2015-08-11 2018-11-28 Ｔｏｗａ株式会社 Resin molding apparatus, resin molding method, and mold
JP6236486B2 (en) * 2016-03-07 2017-11-22 Ｔｏｗａ株式会社 A position adjusting mechanism, a resin sealing device, a resin sealing method, and a resin sealing product manufacturing method.
JP6349447B2 (en) * 2017-08-10 2018-06-27 Ｔｏｗａ株式会社 Method for manufacturing resin-encapsulated electronic component and apparatus for manufacturing resin-encapsulated electronic component

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2226852Y (en) * 1995-05-12 1996-05-15 锋泰模业有限公司 Forming mould for sole
JP2007320222A (en) * 2006-06-02 2007-12-13 Apic Yamada Corp Resin molding device
CN101436558A (en) * 2007-11-16 2009-05-20 东和株式会社 Method of compression-molding electronic components and mold
JP2012040843A (en) * 2010-08-23 2012-03-01 Sumitomo Heavy Ind Ltd Mold for compression molding and compression molding method
CN102655189A (en) * 2011-03-02 2012-09-05 东和株式会社 Optoelectronic part producing method, optoelectronic part producing system, and optoelectronic part
CN103182767A (en) * 2011-12-27 2013-07-03 山田尖端科技株式会社 Method for resin molding and resin molding apparatus
CN105283289A (en) * 2013-06-14 2016-01-27 山田尖端科技株式会社 Resin-molding die and resin-molding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112976475A (en) * 2019-12-02 2021-06-18 朝日科技股份有限公司 Resin sealing device
CN112976475B (en) * 2019-12-02 2024-02-02 朝日科技股份有限公司 Resin sealing device
CN115332095A (en) * 2022-10-12 2022-11-11 安徽大华半导体科技有限公司 QFN large substrate packaging mold and method
CN115332095B (en) * 2022-10-12 2022-12-27 安徽大华半导体科技有限公司 QFN large substrate packaging mold and method

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TW201936357A (en) 2019-09-16
KR20190096823A (en) 2019-08-20

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