KR102555761B1 - Mold base, chase unit for mold, mold for compression molding and compression molding device - Google Patents

Abstract

[Problem] To provide a highly versatile compression molding die device capable of performing compression molding with high precision while absorbing variations in the thickness of a workpiece and variation in the amount of resin when individually compression molding a plurality of workpieces in parallel arrangement.
[Solution Means] An upper mold 2 having a work holding portion 2a for individually holding a plurality of workpieces W, and an independent workpiece for each workpiece disposed opposite to the work holding portion 2a and clamping the workpiece W A lower mold 3 in which a plurality of lower mold cavity concave portions 3a are formed with a clamper 5e arranged in such a manner and a cavity sphere 5d for pressurizing resin by relatively moving while being inserted into the clamper 5e, The upper mold 2 is provided with an adjustment mechanism 8 that individually adjusts the height of each workpiece W.

Description

Mold base, chase unit for mold, mold for compression molding and compression molding device {MOLD BASE, CHASE UNIT FOR MOLD, MOLD FOR COMPRESSION MOLDING AND COMPRESSION MOLDING DEVICE}

The present disclosure relates to a mold base for a mold, a chase unit for a mold, a mold for compression molding, and a compression molding apparatus using the same, which are used when individually clamping a plurality of workpieces arranged in parallel and performing compression molding at the same time.

The lower mold cavity concave portion provided in the lower mold is covered with a mold release film, and mold resin (granular resin, liquid resin, powder resin, etc.) is supplied to the lower mold cavity concave portion to hold the workpiece in the upper mold. Various devices have been developed and put into practical use for compression molding by clamping a mold (see Japanese Patent Application Laid-open Publication No. 2010-36542).

Since the lower cavity movable compression molding mold is a device that resin-molds one workpiece with one mold, compression molding using a compression molding mold with two upper and lower stages in the height direction from the viewpoint of reducing the installation area and increasing productivity. A device has also been proposed (refer to Japanese Laid-Open Patent Publication No. 2010-94931).

However, for example, in the case of compression molding of a rectangular strip substrate as a workpiece, in the case of a resin substrate, the variation in thickness is large compared to that of a lead frame, and the number of semiconductor chips mounted on one strip substrate is Depending on the defect, there may be a deviation in the number of mounts. In addition, when the number of semiconductor chips mounted on the one-strip substrate changes, the molding thickness of the final package portion (resin sealing portion) changes due to compression molding unless the supply amount of mold resin is also changed. It was difficult to perform compression molding by shortening the molding time while comprehensively adjusting these.

Therefore, some compression molding devices have been proposed that perform compression molding by arranging strip substrates in two parallel rows, such as a mold for transfer molding (Japanese Patent Laid-Open No. 2011-143730, Japanese Unexamined Patent Application No. 2012-40843). reference).

Japanese Unexamined Patent Publication No. 2010-36542 Japanese Unexamined Patent Publication No. 2010-94931 Japanese Unexamined Patent Publication No. 2011-143730 Japanese Unexamined Patent Publication No. 2012-40843

In the compression molding apparatus disclosed in Japanese Unexamined Patent Publication No. 2011-143730, a pair of molding dies for compression molding are mounted, the lower mold is supported on a movable platen, and two A clamp member forming a cavity and two sliding members are supported. Mounting rods are provided on the rear side (lower side) of the sliding member constituting the cavity bottom, and elastic members are wound around each mounting rod. Thereby, each sliding member is slidably supported with respect to the clamp member surrounding it. And the adjusting means which receives the mounting rod of each sliding member rotates in a balance shape around one axis|shaft supported by the movable platen, and it enables uniform pressurization with respect to molten resin. However, there is a problem in the strength of the adjusting means because the adjusting means absorbs the variation in the amount of resin on the left and right supplied to the left and right cavities by rotating in a balance shape around only one axis provided on the movable plate. If the strength of the adjustment means is insufficient, there is a risk of breakage, and the sliding member does not function and cannot absorb the variation in the amount of resin. In addition, when performing mold maintenance work or when performing compression molding of different workpieces, it is necessary to separate the upper mold and the lower mold from the compression molding device to perform the work. In this case, since it is necessary to separate the entire upper mold holding the pair of workpieces from the stationary platen and to separate the entire lower mold having two cavities from the movable platen, the work becomes large-scale.

Further, in the mold for compression molding disclosed in Japanese Unexamined Patent Publication No. 2012-40843, two upper compression dies for adsorbing and holding the strip substrate are respectively suspended and supported by the upper mold via a buffer spring. Around the two upper compression molds, one upper frame mold is suspended from the upper mold through a spring and supported. In addition, two lower compression dies constituting the lower mold cavity and a lower frame mold into which they are inserted are supported by the lower mold disposed opposite to the upper mold. The lower compression mold is supported and fixed with respect to the lower mold, and the lower frame mold is supported floating via a spring. A release film is adsorbed and held on the surfaces of the two lower compression dies and the lower frame dies. An error in the thickness of the strip boards adsorbed and held by the upper compression type is absorbed by the bending of the buffer spring. Although the plate thickness error can be absorbed by the upper compression mold, since the lower frame mold existing between the two strips commonly sandwiches the strip, the lower frame mold may tilt during clamping due to the difference in strip thickness. In addition, if the height of the left and right molds changes due to the variation in the amount of resin supplied to the lower mold cavity, there is a risk that one side is unfilled or the resin pressure does not reach the target, and the entire press device (especially the lower mold, which is a movable mold) may tilt. . In addition, since one release film covering the two lower mold cavities (two lower compression molds and lower frame molds) is used for compression molding of the two strip substrates, when the release films are adsorbed and held, they are released from each other. It is difficult to pull the film and adsorb it at an appropriate position. In addition, since the surfaces of the two lower mold cavities are covered with a single release film, handling is difficult and an unnecessary use area that does not contribute to compression molding is generated. In addition, in the case of mold maintenance work or in the case of compression molding of different types of workpieces, it is necessary to integrally replace the two upper compression dies suspended and supported by the upper mold through a buffer spring, and Since it is necessary to separate and exchange the two supported lower compression dies and the lower frame mold in which they are inserted and floating supported as an integral part, the mold exchange operation becomes large-scale.

The disclosure applied to some of the embodiments described below is made in order to solve the above problems.

A first object is to use a highly versatile compression molding mold capable of performing compression molding with high precision while absorbing variations in the thickness of workpieces and variations in resin amount when individually compression molding a plurality of workpieces in parallel arrangement, and using the same. It is to provide a compression molding apparatus with high productivity and high versatility maintaining molding quality.

A second object is to provide a mold base for compression molding molds with high versatility in which replacement of a plurality of mold chase units can be easily performed. In addition, a plurality of mold chase units arranged horizontally side by side on the mold base provide a compression molding mold capable of performing compression molding with high precision by adjusting the deviation of the mold height during mold clamping when compression molding is performed simultaneously. there is something

A third object is to provide a mold chase unit in which film handling during compression molding is easy and the molding quality is improved so that unnecessary use area is reduced, film wrinkles are difficult to occur and the thickness of the package part is constant. there is. In addition, even if a plurality of mold chase units are horizontally arranged side by side on the mold base, variations in the thickness of the workpiece and the amount of resin are absorbed to provide a mold for compression molding with high molding quality and improved mold chase exchange workability. there is.

Disclosure regarding some of the embodiments described below includes at least the following configurations. That is, a compression molding mold for individually clamping and simultaneously compressing a plurality of workpieces arranged side by side side by side, a first mold having a work holding portion for individually holding the plurality of works, and opposing the work holding portion A second mold in which a plurality of cavity concave portions are formed by a clamper disposed independently for each work that clamps the work, and a cavity sphere that pressurizes resin by relatively moving while being inserted into the clamper, The first mold is characterized in that it is provided with an adjustment mechanism for individually adjusting the height of each workpiece.

According to the above configuration, mold resin is supplied to the plurality of cavity concave portions formed in the second mold, and the plurality of work holding portions of the first mold are molded closed while holding the work, so that each workpiece can be compression molded. At this time, even if there is variation in the plate thickness of the plurality of works, even if there is variation in the amount of resin supplied to the plurality of cavity recesses, the adjustment mechanism provided in the first mold determines the variation in mold height at the time of clamping the mold individually for each work. Since it is adjusted, the thickness of the resin sealing part (package part) can be compression molded with high precision.

In addition, since the adjustment mechanism provided in the first mold can be shared when exchanging the mold by changeover, versatility is improved.

In the first mold, the first chase units having the work holding portions are separately arranged side by side on a first mold base in parallel, and the adjustment mechanism moves the first chase units from the first mold base in the mold opening and closing direction. It is preferable to individually adjust the mold height deviation during mold clamping of the first chase unit disposed in parallel to the first mold base.

As a result, since the spring unit provided in the adjusting mechanism for each first chase unit arranged side by side in parallel individually adjusts the mold height discrepancy at the time of mold clamping, the discrepancy in the sheet thickness of the workpiece and the discrepancy in the amount of resin are adjusted. can be adjusted for each first chase unit. Moreover, even if the 1st chase unit is replaced, the adjustment mechanism provided in the 1st mold base can be used as it is.

In the second mold, second chase units having the cavity concave portions are arranged in parallel on a second mold base, and each second chase unit surrounds a cavity sphere forming a bottom of the cavity concave portion and a periphery of the cavity sphere. A clamper forming a side portion of the cavity concave portion may be supported so as to be relatively movable with respect to the second mold base.

As a result, the workpieces held in the work holding portion of the first chase unit arranged side by side in parallel to the first mold are respectively clamped while pushing the clamper of the second chase unit opposed to the cavity ball relatively. , Compression molding can be performed individually for each workpiece without tilting the entirety of the first mold or the second mold due to variations in the thickness of the workpiece or variation in the amount of resin.

It is preferable that a film covering the lower mold clamp surface including the cavity concave portion is adsorbed and held for each second chase unit.

In this way, if the film covering the lower mold clamp surface is used for each second chase unit, it is easy to handle when adsorbed and held on the lower mold clamp surface including the lower mold cavity concave portion, and unnecessary unnecessary film that does not contribute to compression molding like a long film is used. The occurrence of the use area can also be avoided as much as possible.

The mold for compression molding includes an upper mold base, an upper mold chase unit attached to and detachably attached to the upper mold base through an adjustment mechanism for adjusting the height of the mold, and having a work holding portion on an upper mold clamp surface, and the upper mold mold base. A lower die mold base provided opposite to the lower die mold base, a lower die cavity sphere disposed opposite to the work holding portion, and a clamper supported so as to be able to move relative to each other surrounding the lower mold cavity sphere and being attached to the lower die mold base so as to be insertable and removable. You may have a lower die chase unit in which a cavity recess is formed.

Since the mold height deviation at the time of mold clamping is individually adjusted for each workpiece by means of an adjustment mechanism provided on the upper mold mold base, the thickness of the resin sealing portion (package portion) can be compression molded with high precision.

A pair of upper mold chase units arranged side by side on the upper mold base are detachably supported via the adjusting mechanism, and the upper mold chase unit has a first work retaining portion superimposed on the adjusting mechanism. An upper mold plate and a second upper mold plate are provided, respectively, and a pair of lower mold chase units are detachably provided on the lower mold base, side by side to face the pair of upper mold chase units, respectively, and the lower mold chase units, A first lower mold cavity concave formed by a lower mold cavity disposed opposite to the first upper mold plate and a clamper surrounding the lower mold cavity and movably supported, and disposed opposite to the second upper mold plate, the lower mold cavity sphere and the lower mold You may each be provided with the 2nd lower type|mold cavity recessed part formed by the clamper which surrounds cavity ball, and was supported so that relative movement was possible.

As a result, even if a pair of upper mold chase units are arranged horizontally on the upper mold base and a pair of lower mold chase units are arranged horizontally opposite to the pair of upper mold chase units on the lower mold base, they are arranged in parallel. It is possible to absorb and adjust the mold height variation during mold clamping for each mold chase unit. The upper mold chase unit or the lower mold chase unit can be detached and replaced from the upper mold base or the lower mold base independently, and even if the chase is replaced, the adjustment mechanism provided in the upper mold base can be used as it is.

A compression molding mold in which a plurality of molds for compression molding resin by clamping a single workpiece are mounted side by side and opened and closed by a common mold opening and closing mechanism, a first mold having a work holding portion for holding the work; A clamper disposed opposite to the work holding part and clamping the work, and a second mold in which a cavity concave portion is formed by a cavity sphere inserted into the clamper and pressurized resin by moving relatively, the first mold or the second mold It is characterized by having an adjustment mechanism for adjusting the height in either mold.

In this case, for example, a first mold or a second mold having a height adjusting mechanism that is mounted horizontally and opened and closed by a common mold opening and closing mechanism, even if it is a large-sized workpiece that cannot necessarily be arranged horizontally side by side. Using the structure of the mold, it is possible to perform compression molding with high precision by adjusting the deviation of the mold height corresponding to the large-sized workpiece during mold clamping.

A compression molding mold for individually clamping and simultaneously compressing a plurality of workpieces arranged side by side side by side, wherein a first base portion provided in a first mold base supports a work holding portion for holding the works horizontally side by side A first mold and a second base portion provided on a second mold base, a clamper disposed opposite to the work holding portion and clamping the workpiece, and a cavity tool that pressurizes the resin by relatively moving while being inserted into the clamper. A second mold for horizontally supporting the formed cavity concave portions is provided, the cavity sphere is independently supported and fixed to the mold plate for each workpiece, and the clamper is independently pressed and supported for each workpiece on the mold plate, It is characterized in that an adjustment mechanism for independently adjusting the height of each work is provided between the mold plate and the second base part.

In this way, a plurality of workpieces are individually separated by a first mold having a work holding portion arranged horizontally on the first base portion and a second mold having a cavity concave portion arranged horizontally parallel to each other on the second base portion facing the work holding portion. When clamping, the mold plate can be clamped without tilting because the mold height variation is absorbed for each workpiece by the clamper supported by pressure on the mold plate and the adjusting mechanism provided between the mold plate and the second base part.

In the compression molding apparatus provided with any of the compression molding molds described above, since a plurality of strip substrates can be simultaneously compression molded while absorbing variations in plate thickness and clamp position individually using a mold chase unit arranged in parallel, productivity is improved. or molding quality is improved.

A pair of upper and lower mold bases that detachably support a plurality of mold chase units arranged side by side side by side, wherein on either of the upper and lower mold bases, the plate thickness of the work clamped by each mold chase unit and the mold resin It is characterized in that an adjustment mechanism that absorbs variations in mold height during mold clamping due to variations in the amount of resin and the total thickness of the film covering the clamp surface is integrally provided in the base portion.

According to the above configuration, since the adjustment mechanism is integrally provided with the base part in either the upper or lower mold base, the plate thickness of the workpiece clamped to the plurality of mold chase units arranged in parallel horizontally, the resin amount of the mold resin, and the clamp It is possible to absorb variations in mold height during mold clamping due to variations in the total thickness of the film covering the surface.

In addition, when exchanging the mold chase unit, the mold base is not required to be replaced, and the replacement operation is easy, and the adjustment mechanism can be used as it is even when the mold chase unit is replaced, so the versatility is high.

A first chase guide provided adjacent to the mold opening/closing surface side of a first guide block provided descending from the first base part, and a first chase guide provided adjacent to the mold opening/closing surface side of a second guide block provided standing up from the second base part. 2 chase guides are provided, and stepped portions for inserting and removing the first chase unit are formed on both sides of the first guide block and the first chase guide, and the second guide block and the second chase guide have step portions for inserting and removing the first chase unit. Step portions for inserting and removing the two chase units may be formed on both sides, respectively.

Accordingly, the first chase unit can be inserted and removed from the front side using the first guide blocks disposed on both sides and the stepped portion formed in the first chase guide as a guide. The second chase unit can be inserted and removed from the front side using the second guide blocks disposed on both sides and the stepped portion formed in the second chase guide as a guide. Therefore, the replacement work can be easily performed by reducing the number of replacement parts of the mold.

A first mold space surrounded by the side of the first base in which a side of a frame-shaped first base provided by descending from the first base and a side of a second base of a frame formed by standing up from the second base are disposed opposite to each other and are surrounded by the side of the first base A first guide block defining the portion and a second guide block defining the second mold space surrounded by the side of the second base may be disposed opposite to each other.

As a result, since the first base portion and the side portion of the frame-shaped first base and the second base portion and the side portion of the frame-shaped second base are opposed to each other, the inside of the mold is closed in a clamped state to form a decompression space. In addition, since the first guide block partitioning the first mold space and the second guide block partitioning the second mold space are opposed to each other, the first chase unit and the second chase unit can be inserted into and removed from the first mold space. The positioning of the second chase unit housed in the mold space so as to be inserted and removed can be easily performed.

The side of the first base is rotatably connected to the first base through a hinge from the inside in the direction of insertion and removal of the first chase unit, and the side of the second base is connected to the side of the second chase unit to insert and remove the second chase unit with respect to the second base. You may be connected so that rotation is possible via a hinge from the direction inside.

Accordingly, when the side part of the first base is rotated by a predetermined amount with respect to the first base part with respect to the hinge provided inside the first chase unit insertion/removal direction by a predetermined amount, the first chase unit held on the first base part moves forward in the insertion/removal direction. Because it is exposed, it is possible to replace the first chase unit by pulling it forward in the insertion/removal direction.

In addition, when the side of the second base is rotated by a predetermined amount with respect to the second base with respect to the hinge provided inside the second chase unit insertion/removal direction, the second chase unit held in the second base is exposed forward in the insertion/removal direction. Therefore, it is possible to replace the second chase unit by pulling it forward in the insertion/removal direction.

The adjustment mechanism includes a spring unit that presses either the first chase plate against the first mold base or the second chase plate against the second mold base in the mold opening/closing direction, or the first mold base and the first chase plate. Between the chase plates or between the second mold base and the second chase plate, a slide plate having tapered faces overlapping each other may be slidably provided.

This makes it possible to absorb and adjust the mold height deviation at the time of mold clamping for each mold chase unit arranged in parallel with a simple configuration, and even if the mold chase unit is replaced, the adjustment mechanism can be used as it is.

A mold chase unit that compresses and molds resin by clamping a workpiece with a first chase unit and a second chase unit, wherein a work holding portion is provided on a clamp surface of either one of the first chase unit and the second chase unit, and A cavity concave portion is formed on the clamp surface by a clamper disposed opposite to the work holding portion and clamping the workpiece, and a cavity sphere inserted into the clamper and pressurized resin by relatively moving, and on the clamp surface of the clamper, the cavity concave portion is formed. A suction groove having a film suction hole or suction hole for adsorbing and holding the outer periphery of the film covering the portion is provided, and a circumferential groove is provided between the film suction hole or the suction groove having the suction hole and the cavity concave portion, and the circumferential groove is provided. It is characterized in that a plurality of suction holes are provided at the groove bottom of the groove.

When the mold chase unit is used, the outer periphery of the film is adsorbed and held in the film suction hole or the suction groove having the suction hole on the clamp surface of the clamper including the cavity concave portion provided in the chase unit, and the film suction hole or suction hole is suctioned. By suctioning from the suction hole provided at the bottom of the groove of the circumferential groove provided between the suction groove having the hole and the cavity concave portion, the surplus portion of the film is accommodated in the circumferential groove, and the film can be adsorbed and fixed and wrinkle smoothed.

Therefore, when a plurality of workpieces are individually clamped and simultaneously compression-molded in the horizontally arranged side-by-side mold chase units, it is possible to prevent deterioration in molding quality due to wrinkles in the film. In addition, the handling of the film is easy and the unnecessary use area of the film is eliminated.

The circumferential groove may also serve as a concave portion of a film pushing pin that presses a film provided on the clamp surface of either one of the first chase unit and the second chase unit. Accordingly, when clamping the workpiece and the film in the pair of mold chase units, by entering the film push pin into the circumferential groove, the surplus portion of the film can be surely guided into the circumferential groove and wrinkle smoothing can be performed.

The circumferential groove may also serve as retraction of the chuck claw of the work holding portion.

In this way, even if a chuck claw for mechanically holding the work is provided in the work holding part, the chuck claw enters the circumferential groove when clamping the work and the film, so that interference with the clamping surface of the second mold chase unit is eliminated. In addition, since the workpiece can be held by the chuck claw as well as by air suction in the workpiece holding section, the workpiece can be delivered and received reliably.

A chase unit for a compression mold for compression molding a resin by clamping a workpiece to a pair of chase units, wherein a first lock block protrudes from each periphery or chase plate constituting a rectangular clamp surface of one chase unit, It is characterized in that a second lock block engaged with the first lock block protrudes from the clamp surface of the other chase unit or the opposite surface of the chase plate.

Accordingly, when clamping a workpiece to the pair of chase units, the opposing clamp faces can be aligned with each other by uneven fitting of the first lock block and the second lock block. Therefore, it can contribute to the improvement of molding quality.

The first chase unit includes a first locking part that is inserted and removed to be inserted into and removed from a first guide block standing up against the first mold base, and the second chase unit stands up against the second mold base. You may be provided with the 2nd locking part which is locked to the 2nd guide block which becomes removable so that insertion and removal is possible.

In this way, by opening the mold for compression molding and inserting and removing the first mold chase unit while holding the first locking parts to the first guide blocks standing on both sides from the first mold base, the mold exchange operation can be easily performed. can

In addition, the mold exchange operation can be easily performed by inserting and removing the second mold chase unit while the second locking parts are engaged with the second guide blocks standing on both sides from the second mold base.

A leveling mechanism for correcting the inclination between the clamp faces may be provided at opposite positions of the first chase unit and the second chase unit.

This makes it possible to maintain parallelism between the clamp surfaces of the first chase unit and the second chase unit that are opposed to each other at the time of mold closing.

A mold chase unit for compression molding comprising a first chase unit having a work holding portion for holding a workpiece and a second chase unit having a cavity concave portion to which mold resin is supplied, the second chase unit comprising: the cavity concave portion A cavity sphere forming a bottom portion and a clamper forming a side portion of the cavity concave portion are arranged to be relatively movable, and a stopper defining a height position of the clamper is provided on a surface opposite to the clamp surface of the clamper.

As a result, since the height position of the clamper relative to the cavity sphere is defined by the stopper according to the variation in the thickness of the workpiece or the amount of resin supplied to the cavity concave portion, the thickness of the workpiece or the amount of resin supplied to the cavity concave portion It can absorb the deviation of and compress and mold to the desired thickness.

A plurality of overflow cavities may be provided along the outer periphery of the cavity mouth.

In this way, compression molding can be performed while keeping the thickness of the molded product constant by accommodating the surplus resin in the overflow cavity without accurately measuring the amount of resin supplied to the cavity recess for each workpiece.

In the mold for compression molding, it is preferable that any of the above-mentioned mold chase units are horizontally arranged parallel to the mold base, and the mold chase units are independently inserted and removed from the mold base.

As a result, among a plurality of mold chase units arranged side by side with respect to the mold base, a necessary mold chase unit can be taken out from the mold base for maintenance or mold replacement, so that there are few replacement parts and mold replacement work can be easily performed. can In addition, since wrinkles of the film can be stretched and held on the clamp surface including the cavity recess for each mold chase unit, handling is easy and unnecessary use of the film is eliminated.

It is possible to perform compression molding with high precision while absorbing variations in the thickness of the workpieces when individually compression molding is performed by arranging a plurality of workpieces side by side in parallel and variations in mold height during mold clamping due to variations in the amount of resin supplied. A mold for compression molding with high versatility can be provided.

In addition, it is possible to provide a compression molding apparatus with high productivity and high versatility maintaining molding quality by using the compression mold for compression molding.

Since the adjustment mechanism is integrally provided with the base part in either the upper or lower mold base, the plate thickness of the workpiece clamped to the plurality of mold chase units arranged side by side side by side, the resin amount of the mold resin, and the film thickness covering the clamp surface It is possible to absorb variations in mold height at the time of mold clamping due to variations in the sum of .

In addition, when exchanging the mold chase unit, the mold base is not required to be replaced, and the replacement operation is easy, and the adjustment mechanism can be used as it is even when the mold chase unit is replaced, so the versatility is high.

To provide a mold chase unit in which film handling during compression molding is easy to perform, unnecessary use area is reduced, and molding quality is improved so that the thickness of the package part is constant by absorbing variations in the thickness of the workpiece and the amount of resin. can

1 is a cross-sectional explanatory view of a mold for compression molding that has been opened and viewed from the front.
Fig. 2 is a partial cutout cross-sectional explanatory view of the upper mold in Fig. 1;
Fig. 3 is a cross-sectional explanatory view of the upper mold in Fig. 2 viewed from the side.
Fig. 4 is a plan view of the upper die of Fig. 2 viewed from the clamp surface side.
Fig. 5 is a cross-sectional explanatory view of the lower mold in Fig. 1;
Fig. 6 is a cross-sectional explanatory view of the lower mold in Fig. 5 viewed from the side.
Fig. 7 is a plan view of the lower mold in Fig. 5 viewed from the clamp surface side, and a partial sectional view showing the state of the lower mold cavity and the lower mold movable clamper before and after closing the mold.
Fig. 8 is a cross-sectional explanatory view in which the mold for compression molding shown in Fig. 1 is viewed from the front in a mold-closing state.
Fig. 9 is a cross-sectional explanatory view of the mold base in front view and a cross-sectional explanatory view of the mold chase unit taken out from the mold base.
Fig. 10A is a front view cross-sectional explanatory view showing states before and after separation of the mold chase unit from the mold base, and Fig. 10B is a side cross-sectional explanatory view of the mold chase unit taken out from the mold base.
Fig. 11A is a front view of a compression molding die according to another example, and Fig. 11B is a plan view of the lower mold viewed from the clamp surface side.
Fig. 12 is a cross-sectional explanatory view of a compression mold in a front view in the case of compression molding a large-sized workpiece.
Fig. 13 is a cross-sectional explanatory view of a compression molding die viewed from the side in the case of compression molding a large-sized workpiece according to another example of Fig. 12 .
Fig. 14A is a plan view as seen from the clamp surface side of the upper die for molding a rectangular substrate, and Fig. 14B is a plan view as viewed from the clamp surface side of the lower die.
Fig. 15A is a plan view as seen from the side of the clamping surface of the upper die for molding a circular substrate, and Fig. 15B is a plan view as seen from the side of the clamping surface of the lower die.
Fig. 16 is a cross-sectional explanatory view in front view of a mold for compression molding according to another example.
Fig. 17 is a cross-sectional explanatory view in front view of a mold for compression molding according to another example.
Fig. 18 is a cross-sectional explanatory view of a mold for compression molding in a front view in the case of compression molding a one-strip substrate.
Fig. 19 is a cross-sectional explanatory view in front view of a mold for compression molding in the case of compression molding a three-strip substrate.
Fig. 20A is a front view cross-sectional explanatory view showing another example of an adjustment mechanism provided on the upper die, and Fig. 20B is a side view cross-sectional explanatory view of the adjustment mechanism.
21 is a plan layout diagram showing an example of a resin mold apparatus using a mold for compression molding.
22 is an explanatory diagram showing another example of a compression molding apparatus.
23 is an explanatory diagram showing another example of the compression molding apparatus connected to FIG. 22 .
24 is an explanatory diagram showing another example of a compression molding die.
25 is an explanatory view showing another example of a compression molding die.

EMBODIMENT OF THE INVENTION Hereinafter, one Embodiment for carrying out an invention is described in detail based on an accompanying drawing. In addition, when referring to a mold chase unit, it refers to a mold member constituting a cavity concave portion or a work holding portion integrally bonded together. In addition, when referring to a mold for compression molding, the mold chase unit is integrally bonded to the mold base and refers to a mold excluding the mold opening/closing mechanism.

[First Embodiment]

Fig. 1 is a mold 1 for compression molding which individually compresses and molds a plurality of workpieces W, and has the following configuration. In addition, the work W assumes a rectangular long strip substrate (lead frame, metal substrate, ceramic substrate, resin substrate, etc.). The size of the work W is assumed to be up to about 100 mm x 300 mm (hereinafter simply referred to as "work W").

The mold 1 for compression molding includes an upper mold 2 (first mold) and a lower mold 3 (second mold). The upper mold 2 has an upper mold chase unit 4 (first chase unit) having a work holding portion 2a for holding the workpiece W, and a lower mold cavity concave portion where mold resin is supplied to the lower mold 3 ( A plurality of lower mold chase units 5 (second chase units) having 3a) are disposed opposite to each other.

In addition, upper mold chase units 4 are arranged side by side in a plurality of places (two places in Fig. 1) in the upper mold base 6 (first mold base). In the lower mold base 7 (the second mold base), lower mold chase units 5 are arranged side by side in a plurality of places (two places in Fig. 1). The upper type chase unit 4 and the lower type chase unit 5 are disposed facing each other. In the upper mold base 6, the variation in the plate thickness of the workpieces W held by the plurality of workpiece holding portions 2a (the difference between the plate thickness of each workpiece W and the locality in the plane of one workpiece) (hereinafter collectively referred to as "variance") or deviation of mold heights during clamping of the plurality of upper mold chase units 4 and lower mold chase units 5 (in addition to the above "variance") , including the difference in mold height caused by the difference in the amount of resin supplied to the lower mold cavity concave portion 3a, simply referred to as "deviation".) It is a mechanism for doing this, and since it is also possible to adjust the above-mentioned uneven workpiece W even with one mold, it is provided with an “adjustment mechanism 8”). As a result of adjusting the mold height deviation by the adjusting mechanism 8, the total height of the mold after compression molding by a plurality of molds used for compression molding is made the same, and the inclination of the press mechanism can be avoided.

According to the above configuration, the mold resin is supplied to the lower mold cavity recesses 3a provided in the plurality of lower mold chase units 5 juxtaposed with respect to the lower mold base 7, and the mold resin is supplied with respect to the upper mold base 6. Each workpiece W can be compression molded by closing the die while holding the workpiece W in the work holding portion 2a provided in each of the plurality of upper die chase units 4 .

At this time, even if there is variation in the plate thickness of the plurality of workpieces W or even if there is variation in the height of the mold when clamping the mold due to the difference in the amount of resin supplied, the adjustment mechanism 8 provided in the upper mold base 6 Since adjustment is made for each upper die chase unit 4 and lower die chase unit 5 that are disposed opposite to each other, the thickness of the resin sealing portion (package portion) can be press-molded with high precision.

In addition, since the upper mold base 6 and the lower mold base 7 are provided with a plurality of chase units in a single layer, since the thickness of the base is secured, the bending rigidity is high and the heat capacity is high, so the temperature in the molding cycle change can be inhibited.

In addition, even if the upper mold chase unit 4 or the lower mold chase unit 5 is exchanged due to a changeover, since the adjusting mechanism 8 provided in the upper mold base 6 can be shared, versatility is improved.

The adjustment mechanism 8 is disposed between the upper mold base 6 and the upper mold chase unit 4 . Thereby, even if the upper die chase unit 4 is replaced, the adjustment mechanism 8 can be used as it is. As an example of the adjustment mechanism 8, a spring unit for biasing the upper die chase unit 4 against the upper die mold base 6 in the mold opening/closing direction is provided. This makes it possible to adjust the mold height variation of a plurality of mold chase units arranged in parallel horizontally (an arrangement form in which other workpieces are placed right next to each other so that the long sides of the workpieces are parallel) with a simple configuration.

Here, a configuration example of the upper mold 2 and the lower mold 3 constituting the mold 1 for compression molding will be described in detail. A configuration example of the upper mold 2 will be described with reference to FIG. 2 . The upper mold base 6 includes a rectangular plate-shaped upper mold base portion 6a (first base portion) and a rectangular frame-shaped upper mold base side portion 6b provided by descending along the outer periphery of the upper mold base portion 6a. ) (first base side). An upper mold guide block 6d (first guide block) that divides the upper mold space 6c (first mold space) surrounded by the upper mold base side portion 6b is provided downward in the upper mold base portion 6a. Adjusting mechanisms 8 are respectively provided in the upper mold space portion 6c (see Fig. 9) partitioned off by the upper mold guide block 6d.

At the lower end of the upper mold guide block 6d, upper mold chase guides 6e (first chase guides) are provided adjacent to each other. Between the upper mold guide block 6d and the upper mold chase guide 6e (between successive wall surfaces), stepped portions 6f for inserting and removing the upper mold chase unit 4 are formed on both sides, respectively. Using this pair of stepped portions 6f as guide rails, the upper type chase unit 4 can be inserted and removed as will be described later.

As shown in FIG. 10B, the upper mold base part 6a and the upper mold base side part 6b are rotatably connected via a hinge 6g on one side side adjacent to each other (inside the upper mold chase unit insertion/removal direction). When exchanging the upper die chase unit 4, the front end of the upper die base side portion 6b in the insertion and removal direction is separated from the upper die base portion 6a in a predetermined direction (counterclockwise direction in FIG. 10B) with the hinge 6g as the center. ) can be rotated. Thereby, the upper-type chase unit 4 can be exchanged by pulling it forward using the step portion 6f as a guide rail. In addition, since the upper mold chase units 4 arranged in parallel to the upper mold base 6 can be independently inserted and removed from the upper mold base 6, the maintenance workability is good. In addition, between the upper mold base part 6a and the upper mold base side part 6b, it is preferable that a link material (not shown) which regulates the opening angle of the upper mold base part 6a is connected. In addition, only the front side part of the upper mold base side part 6b formed in the shape of a rectangular frame body may be rotatably connected to the upper mold base part 6a via a hinge (clockwise direction in FIG. 10B). In this case, the upper type chase unit 4 is removed inward in the insertion/removal direction.

In addition, although a configuration in which the chase unit is inserted and removed by sliding the chase unit horizontally to the inside and the front is exemplified, it is not necessarily limited to insertion and removal by sliding it horizontally. .

In addition, the upper mold guide block 6d and the upper mold chase guide 6e of the intermediate part (intermediate part in FIG. 2 ) partitioning the upper mold space part 6c may be detachably provided on the upper mold base part 6a. As a result, as shown in FIGS. 12 and 13 described later, even if the workpiece W is a single large-size substrate, the upper mold chase unit 4 is simply replaced, and the upper mold base 6 and the adjustment mechanism 8 ) can be shared as is.

In FIG. 2 and FIG. 9, the structural example of the adjustment mechanism 8 is demonstrated. A pin hanging plate 8a is overlapped and provided on the upper mold base portion 6a. In the pin suspension plate 8a, a plurality of suspension pins 8b are inserted into pin holes 8c provided at equal intervals in the left-right direction (see Fig. 2) and the front-back direction (see Fig. 3), and the pin head portion 8b1 ) (upper part) are each holding. The front end 8b2 (lower end) of each suspension pin 8b is connected to the holding plate 8d. Between each pin suspension plate 8a and the holding plate 8d, a coil spring (any elastic material is sufficient, and the coil spring is not particularly limited) 8e is inserted after being reduced in length from its natural length. As a result, the pressing plate 8d and the hanging pin 8b are constantly pressed vertically downward. Left and right end surfaces of the pressing plate 8d are guided by the upper-shaped guide block 6d so as to move up and down while maintaining parallelism.

A configuration example of the upper type chase unit 4 will be described with reference to FIGS. 2 to 4 . The upper type chase unit 4 has an upper type chase plate 4a (first chase plate) at its upper end. This upper-type chase plate 4a is superimposed on the lower surface of the holding plate 8d of the adjustment mechanism 8 and mounted. The outer size of the upper mold chase plate 4a is the same as that of the holding plate 8d, and both left and right end surfaces are guided by the upper mold guide block 6d so as to move up and down while maintaining parallelism. On the lower surface of the upper mold chase plate 4a, an upper mold support block 4b having an external size larger than the upper mold support block 4b is overlapped and provided. Both left and right ends (first locking parts) of the upper mold support block 4b are engaged with the upper mold guide block 6d so as to be able to be inserted and removed forward while being engaged with the stepped part 6f (see FIG. 2 ). In addition, on the lower surface of the upper mold support block 4b, an upper mold plate 4c having a smaller external size than the upper mold plate 4c is overlapped and provided. As shown in Fig. 4, in the central portion of the lower surface of the upper mold plate 4c, suction holes 2b serving as the work holding portion 2a are perforated at a plurality of locations along the outer periphery of the workpiece. Further, chuck claws 4d are rotatably provided at a plurality of locations (for example, six locations in FIG. 4 ) around the work holding portion 2a of the upper mold plate 4c.

In Fig. 2, the chuck claw 4d has an L-shape in which a horizontal portion 4d1 and a vertical portion 4d2 are continuous. The middle part of this horizontal part 4d1 is rotatably joined to the upper mold support block 4b around the support point 4e. In the vicinity of the end of the horizontal portion 4d1, a coil spring 4f is pressed down from its natural length and mounted between it and the upper-shaped chase plate 4a. In addition, a push pin 4g is integrally provided in the horizontal portion 4d1 through the upper mold plate 4c. Since the horizontal portion 4d1 is constantly pressed downward by the coil spring 4f, the front end of the push pin 4g protrudes downward from the clamp surface of the upper mold plate 4c. Further, at the lower end of the vertical portion 4d2, a locking portion 4d3 is formed toward the inner side of the outer periphery of the workpiece. The chuck claw 4d is urged by the elasticity of the coil spring 4f in the direction of pinching the outer periphery of the workpiece W with the vertical portion 4d2 centering on the support point 4e. For this reason, each locking portion 4d3 enters the lower portion of the outer periphery of the workpiece W, respectively, and is in a state where it can be held. When the chuck claw 4d is opened to separate the workpiece W, the driving pin 4g can be pushed in against the pressure of the coil spring 4f. Further, a film push pin 4h is protruded from the work holding portion 2a of the upper mold plate 4c to the outer circumferential side. The film pusher pin 4h is mounted between the upper mold chase plate 4a and the coil spring 4i is pressed and shortened from the natural length. As a result, the front end of the film push pin 4h protrudes downward from the clamp surface of the upper mold plate 4c. As will be described later, the film pushing pins 4h are provided for spreading out an excess of the sheet-fed film 9 adsorbed and held by covering the clamp surface of the lower mold 3 .

Next, a configuration example of the lower mold 3 will be described.

In FIG. 5 , the lower mold base 7 includes a rectangular plate-shaped lower mold base 7a (second base part) and a rectangular frame-shaped lower mold provided by standing along the outer periphery of the lower mold base 7a. It has a base side 7b (second base side). In the lower die base portion 7a, a lower die guide block 7d (second guide block) that partitions the lower die space portion 7c (second mold space portion: see FIG. 9) surrounded by the lower die base side portion 7b is erected. It is provided. The lower die chase unit 5 is fitted to the lower die space portion 7c (see Fig. 9) partitioned by the lower die guide block 7d so as to be insertable and removable.

In Fig. 5, lower mold chase guides 7e (second chase guides) are provided adjacent to each other at the upper end of the lower mold guide block 7d. Between the lower mold guide block 7d and the lower mold chase guide 7e (between successive walls), stepped portions 7f for inserting and removing the lower mold chase unit 5 are formed on both sides, respectively (see Fig. 9). The lower die chase unit 5 can be inserted and removed by using the pair of stepped portions 7f as guide rails. A pressure reduction suction hole 7b1 is provided on the side wall of the lower die base side portion 7b, and is connected to an air suction mechanism (not shown). In addition, a sealant 7b2 (such as an O-ring) is provided on the mold opening/closing surface of the lower mold base side portion 7b to seal the mold space by contacting the opposite surface of the upper mold base side portion 6b when the mold is closed.

As shown in FIG. 10B, the lower mold base part 7a and the lower mold base side part 7b are rotatably connected via a hinge 7g on one side side adjacent to each other (inside the lower mold chase unit insertion/removal direction). When replacing the lower die chase unit 5, the front end of the lower die base side portion 7b in the insertion and removal direction is separated from the lower die base portion 7a in a predetermined direction (clockwise direction in FIG. 10B) with the hinge 7g as the center. can be rotated to Thereby, the lower die chase unit 5 can be exchanged by pulling it out forward using the stepped portion 7f as a guide rail. In addition, since the lower mold chase units 5 arranged in parallel to the lower mold base 7 can be independently inserted and removed from the lower mold base 7, the maintenance workability is good. In addition, between the lower die base portion 7a and the lower die base side portion 7b, it is preferable that a link material (not shown) that regulates the opening angle of the lower die base side portion 7b is connected. Further, only the front side surface of the lower die base side portion 7b formed in a rectangular frame shape may be rotatably connected to the lower die base portion 7a via a hinge (counterclockwise direction in FIG. 10B). In this case, the lower mold chase unit 5 is removed inward in the insertion and removal direction.

In addition, the lower mold guide block 7d and the lower mold chase guide 7e of the middle part (intermediate part in FIG. 5 ) partitioning the lower mold space part 7c may be detachably provided on the lower mold base part 7a. As a result, as shown in FIGS. 12 and 13 described later, even if the workpiece W is a single large (wide) size substrate, the lower die chase unit 5 can be replaced together with the upper die chase unit 4. , and the lower mold base 7 can be shared as it is.

A configuration example of the lower die chase unit 5 will be described with reference to FIGS. 5 to 7 .

The lower mold chase unit 5 has a lower mold base plate 5a at its lower end. The lower mold base plate 5a is superimposed on the upper surface of the lower mold base portion 7a. The lower mold base plate 5a is mounted so as to be inserted and removed from the front side in FIG. 5 while maintaining parallelism by guiding the lower mold guide blocks 7d with both left and right end faces. As an upper surface of the lower mold base plate 5a, a plurality of support pillars (posts) 5b are erected and formed in the vertically downward projection plane of the lower mold cavity sphere 5d. By this, while preventing the bending of the lower die cavity 5d, the clamping pressure can be finely adjusted by changing the arrangement of the support pillars 5b or by changing the roughness of the arrangement. This improves TTV (Total Thickness Variation) when compression molding a large-size (wide) workpiece W, for example, a panel of 300 mm × 300 mm or a semiconductor wafer with a diameter exceeding 300 mm. can The large (wide) size is a substrate wider than a rectangular strip substrate of about 100 mm x 300 mm, and is not necessarily rectangular.

A support plate 5c is supported by the support pillar 5b. Like the lower mold base plate 5a, the support plate 5c is provided with both left and right end faces guided by the lower mold guide block 7d. A lower mold cavity sphere 5d is stacked and supported at the center of the upper surface of the support plate 5c. The lower mold cavity sphere 5d constitutes the bottom of the lower mold cavity concave portion 3a. A lower mold movable clamper 5e constituting a side portion of the lower mold cavity concave portion 3a is supported around the lower mold cavity sphere 5d so as to be movable in the mold opening/closing direction. Specifically, on the lower surface of the lower mold movable clamper 5e, a driving pin 5f penetrates the support plate 5c and is pressed. The push pin 5f has a larger diameter than the push pin 5f due to a coil spring 5g that is pressed and shortened from its natural length between the lower mold base plate 5a and inserted, so that the flange portion 5h with a larger diameter than the push pin 5f is attached to the support plate 5c. It is always pressed on the bottom side. Thereby, the upper end of the push pin 5f protrudes from the support plate 5c, and is in a state of constantly pressing the lower mold movable clamper 5e upward. In addition, 5 d of lower type|mold cavity pieces may be directly supported by the support pillar 5b, without interposing the support plate 5c so that it may mention later.

The clamp in this embodiment exemplifies a case where the workpiece W is clamped between the workpiece holding portion 2a and the movable clamper 5e, but in the case of a full package mold, the suction hole 2b of the work holding portion 2a. ) to suction-hold the workpiece W, and to clamp the upper mold plate 4c without directly clamping the workpiece W with the lower mold movable clamper 5e, that is, in a planar view, the entire outer side of the workpiece W is molded with resin. Even if it does, it is called a clamp.

Further, a rectangular frame-shaped lower die chase plate 5j (second chase plate) is provided so as to surround the outer peripheral side of the lower die movable clamper 5e. The lower die chase plate 5j is stacked and supported by the support plate 5c. The gap between the lower mold movable clamper 5e and the lower mold chase plate 5j is sealed with a sealant 5k (for example, an O-ring). The lower mold movable clamper 5e is provided so as to move up and down while the inner peripheral side is guided by the lower mold cavity 5d and the outer peripheral side is guided by the lower mold chase plate 5j.

On the outer circumferential side of the lower die chase plate 5j, a stepped portion 5m (second locking portion) corresponding to the stepped portion 7f is formed. As shown in Fig. 9 described above, the stepped portion 7f is formed by connecting a narrower mold guide block 7d and a wider lower mold chase guide 7e. The stepped portion 5m is formed along both left and right sides so that the width of the clamp surface side becomes narrow along the stepped portion 7f. The lower mold chase unit 5 can be inserted and removed from the lower mold base 7 by using the stepped part 7f facing the stepped part 5m as a guide rail. Further, between the upper mold chase unit 4 and the upper mold base 6 and between the lower mold chase unit 5 and the lower mold base 7, clearances for inserting and removing the respective units are provided. For this reason, the upper mold chase unit 4, the upper mold base 6, and the lower mold chase unit 5 and the lower mold base 7 are provided with a screw stop mechanism for eliminating the clearance in the height direction in the mounted state. desirable.

As shown in Fig. 7A, on the clamping surface of the lower die movable clamper 5e, recessed grooves 5e1 for avoiding interference with the locking portion 4d3 of the chuck claw 4d from the inner circumferential side are provided at a plurality of locations in the circumferential direction. there is. Further, as shown in Fig. 7A, following the evacuation groove 5e1, on its outer circumferential side, a circumferential groove 5e2 accommodating the margin of the sheet-fed film (release film) 9 (see Fig. 7b) is provided. . At the bottom of the circumferential groove 5e2, suction holes 5e3 are provided at a plurality of locations in the circumferential direction. The circumferential grooves 5e2 do not necessarily have to be connected like one pencil, and may be parted partially as long as there is a suction hole 5e3. In addition, on the outer circumferential side of the circumferential groove 5e2, a film suction groove 5e4 for adsorbing and holding the outer periphery of the sheet-fed film 9 is provided circumferentially. At the bottom of the film suction groove 5e4, suction holes 5e5 are provided at a plurality of places in the circumferential direction. In order to realize film adsorption, it is sufficient to just provide the attraction|suction hole 5e5, but the combination of the film attraction|suction groove 5e4 and the attraction|suction hole 5e5 can implement|achieve more reliably. The film suction grooves 5e4 do not necessarily have to be connected like a single stroke, and may be parted partially as long as there is a suction hole 5e5. The suction holes 5e3 and 5e5 are connected to an air suction mechanism not shown.

As shown in FIG. 7B, the sheet film 9 is supplied to the lower mold clamping surface covering the lower mold cavity concave portion 3a, and the film suction groove 5e4 formed on the outermost circumference of the clamping surface of the lower mold movable clamper 5e. It is adsorbed and held by the suction hole 5e5. Moreover, the sheet|leaf film 9 is suction-held along the suction path 5e6 provided in the outer periphery of the bottom part of the lower mold|type cavity recessed part 3a (the outer periphery of the lower mold|type cavity mouth 5d). When the mold is closed in this state, the film push pin 4h protruding downward from the upper mold plate 4c enters the opposing circumferential groove 5e2. At this time, the film push pin 4h presses the surplus of the sheet-fed film 9 into the circumferential groove 5e2 by the pressure of the coil spring 4i (see FIG. 2), and is sucked into the suction hole 5e3 and received therein. . Further, the engaging portion 4d3 (see Fig. 2) of the chuck claw 4d holding the outer periphery of the workpiece W is accommodated in the opposing recess 5e1 (see Fig. 7A), and the lower mold movable clamper 5e ) can be avoided. In addition, since the sheet-fed film 9 is sucked into the suction hole 5e3 in the circumferential groove 5e2, the sheet-fed film 9 adhered to the molded article is sucked into the lower mold 3 during mold opening, so that mold release can be performed smoothly. there is. At this time, since the film pushing pin 4h presses the sheet-fed film 9 against the lower mold 3 by bending of the coil spring 4i, the sheet-fed film is held until the film pushing pin 4h separates from the lower mold 3. (9) can be pressed, and it has a structure in which peeling defects are less likely to occur. The sheet film (release film) 9 is, for example, about 50 μm in thickness, has heat resistance, is easily peeled off from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP films, fluorine-impregnated glass cloths, polypropylene films, single-layer or multi-layer films containing polyvinyl chloride or the like as a main component are preferably used.

In this way, if the sheet film 9 covering the lower mold clamp surface including the lower mold cavity concave portion 3a is adsorbed and held for each lower mold chase unit 5, the lower mold clamp surface including the lower mold cavity concave portion 3a It is easy to handle when adsorbing and holding, and the occurrence of unnecessary use areas unrelated to compression molding, such as long films, can be avoided as much as possible.

In Fig. 4, upper mold lock blocks 4j (first lock blocks) are protrudingly provided at four positions, respectively, on clamp surfaces at the center of the periphery of the upper mold plate 4c formed in a rectangular shape. In Fig. 7A, a pair of lower mold lock blocks 5n (second lock blocks) are provided on the clamp surface at the center of the periphery of the lower mold movable clamper 5e formed in a rectangular shape or on the lower mold chase plate 5j. Two protrusions are provided in each of the four places in a pair. The upper mold lock block 4j is arranged so as to be engaged with the lower mold lock block 5n that opposes it by concave-convex fitting. In this way, the upper mold plate 4c on which the work holding portion 2a is formed and the lower mold movable clamper 5e or the lower mold chase plate 5j constituting the lower mold cavity concave portion 3a are aligned for each mold chase unit, You can close the mold. In addition, the shapes of the upper mold lock block 4j and the lower mold lock block 5n may be reversed upside down.

In FIG. 9 , at opposite positions of the upper mold plate 4c of the upper mold chase unit 4 and the lower mold chase plate 5j of the lower mold chase unit 5, an upper mold adjuster pin 4k (see FIG. 2 ) and a lower mold mold Adjuster pins 5p (see Fig. 5) are protrudingly provided (leveling mechanism). The upper die adjuster pin 4k is supported by the upper die chase plate 4a and protrudes downward from the upper die clamp surface through the support block 4b and the upper die plate 4c. Further, the lower mold adjuster pin 5p is supported by the lower mold base plate 5a via the coil spring 5q, penetrates the support plate 5c and the lower mold chase plate 5j, and moves upward from the lower mold clamp surface. It is provided with an extrusion.

As shown in Fig. 4, a plurality of upper mold adjuster pins 4k are provided at equal intervals along the periphery on the long side of the upper mold plate 4c (four on both left and right sides, eight), respectively. Further, as shown in Fig. 7A, a plurality of lower type adjuster pins 5p are provided at equal intervals along the periphery of the long side of the lower type chase plate 5j (eight pieces each on the left and right sides), respectively. The number of upper type adjuster pins 4k and lower type adjuster pins 5p is arbitrary, and may be provided on the short side as well. The upper and lower adjuster pins 4k and 5p are arranged at the same position in a plan view.

The upper mold adjuster pin 4k protruding from the upper mold plate 4c and the lower mold adjuster pin 5p protruding from the lower mold chase plate 5j are disposed facing each other. For this reason, when closing the mold, the upper mold adjuster pins 4k and the lower mold adjuster pins 5p, which oppose each other at a plurality of locations, collide before the mold surface, and absorb the deviation of the pressing force by the deformation of the coil spring 5q. Since the parallelism between the clamp faces of the arranged upper die chase unit 4 and lower die chase unit 5 is corrected, and then the mold surfaces can be in planar contact, one-sided contact can be prevented.

Here, with reference to FIG. 8, the operation of the adjustment mechanism 8 will be described. As an example, the left half of FIG. 8 shows the mold clamp state when the work plate thickness is smaller than that of the normal workpiece W or the resin amount of the mold resin is small. In addition, the right peninsula of FIG. 8 shows the mold clamp state in the case where the thickness of the workpiece is thicker than that of the normal workpiece W or the amount of resin in the mold resin is large.

In the case of the left peninsula of FIG. 8, the thickness of the workpiece is smaller than that of the normal workpiece W, or the amount of resin supplied is smaller than the target resin amount of the mold resin (the amount of resin that becomes the appropriate final package thickness after molding). or both. In this case, the coil spring 8e inserted between the pin hanging plate 8a and the holding plate 8d is in a resilient state, and the variation in the plate thickness of the workpiece W is reduced by the bending of the coil spring 8e. can be absorbed Further, when the amount of mold resin is small, the upper mold plate 4c adsorbing and holding the workpiece W pushes down the lower mold movable clamper 5e against the pressure of the coil spring 5g. As a result, the relative height position of the lower mold movable clamper 5e with respect to the lower mold cavity sphere 5d is equally determined according to the thickness of the workpiece W and the amount of resin supplied to the cavity concave portion 3a, so that the workpiece W ) can be absorbed when the plate thickness t1 is thin or the variation t2 in the amount of resin supplied to the cavity concave portion 3a. Such an adjustment operation is performed for each upper die chase unit 4 and lower die chase unit 5 provided in a plurality (two places in this embodiment).

In addition, in the case of the right peninsula of FIG. 8, the work plate thickness is thicker than the workpiece W of the left peninsula, or the amount of resin supplied is larger than the target resin amount of the mold resin (the amount of resin that becomes the appropriate final package thickness after molding). . Alternatively, as a case in which the difference between the left and right sides is larger, there are cases of both. In this case, in the upper die chase unit 4, an error t3 occurs in the height position of the push pin 4g pressed by the coil spring 4f. However, the coil spring 8e inserted between the pin hanging plate 8a and the holding plate 8d is pressed and shortened, and the hanging pin 8b is pushed back and the head portion 8b1 is released from the pin hanging plate 8a. It is in a state slightly separated by the gap t4, and the variation in the plate thickness of the workpiece W is absorbed by the bending of the coil spring 8e.

Further, in the lower die chase unit 5, the height position of the push pin 5f changes by t5 due to the pressure of the coil spring 5g, and the lower die movable clamper 5e is slightly spaced from the support plate 5c. The gap t6 is generated. In this way, the relative height position of the lower mold movable clamper 5e with respect to the lower mold cavity sphere 5d is equally determined according to the amount of resin supplied to the cavity concave portion 3a. This absorbs variations in the resin thickness t7.

As described above, in this way, the mold height at the time of clamping the mold due to the variation in the plate thickness of the workpiece W in the plurality of compression molding molds 1 and the variation in the amount of resin supplied to the cavity concave portion 3a, etc. ( The variation in the distance between the pin suspension plate 8a and the lower die base plate 5a in Fig. 8) can be absorbed by the pressing mechanism or the adjustment mechanism 8 of the lower die movable clamper 5e. Such a mold height deviation adjustment operation is performed for each upper die chase unit 4 and lower die chase unit 5 provided at a plurality of places (two places in this embodiment) side by side.

In addition, since the adjusting mechanism 8 provided on the upper mold base 6 is provided for each mold chase unit, in the left and right mold chase units, the plate thickness of the left peninsula (the workpiece W in FIG. 8 is thin, and the amount of resin supplied is Not only the case of the case where the amount of resin is less than the target amount) and the right side of FIG. 8 (the case where the plate thickness of the work W is thick and the amount of resin supplied is greater than the target amount of resin), but also the case where the left and right sides are reversed, and the left side is the workpiece Even when the thickness of the plate W is thick and the amount of resin supplied is small, and the thickness of the work W is thin on the right and the amount of resin supplied is large, the mold can be adjusted without tilting. As a result, since the total height of the plurality of molds can always be constant, the thickness of the resin-sealed portion (package) can be compression molded with high precision without the press surface tilting.

In this way, the heights of the upper mold 2 and the lower mold 3 in the mold opening/closing direction are varied due to variations in the plate thickness of the plurality of workpieces W and variations in the amount of resin supplied to the concave portions 3a of the respective lower mold cavities. Even if there is, the adjustment mechanism 8 provided for each upper mold chase unit 4 arranged in parallel on the upper mold base 6 adjusts the mold height deviation between the upper mold 2 and the lower mold 3 at the time of clamping the workpiece ( Since it is adjusted for each W), compression molding can be performed with high precision. In Fig. 8, since two upper die chase units 4 are horizontally arranged side by side on the upper die base portion 6a, two adjusting mechanisms 8 are also provided side by side in accordance with this, but at least one of them is placed side by side. It is only necessary to intervene between the upper mold base part 6a and the upper mold chase unit 4. In this case, instead of the adjusting mechanism 8, a spacer may be interposed between the upper mold 2 on the other side. In addition, when three or more upper mold chase units 4 are provided in the upper mold base 6, it is preferable that the adjustment mechanism 8 smaller than the number of chase units by one is independently mounted on the upper mold base 6a. desirable. In this case, the height of the remaining upper type chase units 4 provided with the adjustment mechanism 8 is adjusted according to the height of the upper type chase unit 4 whose height is fixed. Further, between the fixed-side upper mold base portion 6a and the upper mold chase unit 4, you may provide a support block or the like for fixing the height.

In addition, in the case of exchanging the mold associated with exchanging the type of work W, as shown in FIGS. 10A and 10B, the upper mold base of the upper mold base 6 in a state in which the mold 1 for compression molding is opened. The upper die base side portion 6b is rotated by a predetermined amount so as to push the upper die base side portion 6b forward from the portion 6a centering on the inner hinge 6g. At this time, as shown in FIG. 10A , each upper die chase unit 4 is attached to the upper die guide block 6d descending to the upper die base portion 6a and the stepped portion 6f formed by the upper die chase guide 6e. Both left and right end portions of the support plate 4b are each held in a state of concavo-convex fit. In this state, as shown in FIG. 10B, each upper-type chase unit 4 is drawn forward using the stepped portion 6f as a guide, and can be replaced with another upper-type chase unit 4. The upper mold chase unit 4 taken out from the upper mold base 6 is shown in FIG. 9 .

Further, in the state in which the mold 1 for compression molding is mold opened, as shown in FIGS. 10A and 10B, the lower mold base from the lower mold base portion 7a of the lower mold base 7 to the inner hinge 7g as a center. The side portion 7b is rotated by a predetermined amount so as to be pushed up from the front side. At this time, as shown in Fig. 10A, each lower die chase unit 5 is installed on the lower die guide block 7d standing on the lower die base portion 7a and the stepped portion 7f formed in the lower die chase guide 7e. Stepped portions 5m at both left and right ends of the lower die chase plate 5j are each held in a concavo-convex fit state. In this state, as shown in FIG. 10B, each lower die chase unit 5 is pulled out forward using the stepped portion 7f as a guide, and can be replaced with another lower die chase unit 5. The lower die chase unit 5 taken out from the lower die mold base 7 is shown in FIG. 9 .

In this way, when exchanging molds, the upper mold base 6, the adjustment mechanism 8, and the lower mold base 7 can be used without being replaced, so versatility is high, and step replacement and maintenance can be performed quickly. . Further, in the upper mold base 6 and the lower mold base 7, the upper mold base part 6a and the upper mold base side part 6b intervene through the inner hinge 6g, and the lower mold base part 7a and the lower mold base Since the side parts 7b are rotatably connected to each other via the inner hinge 7g, the upper mold chase unit 4 and the lower mold chase unit 5 can be easily pulled out from the front of the mold, and replacement work can be easily performed. there is.

[Second Embodiment]

11a and b show another configuration example of the mold 1 for compression molding. The same reference numerals are assigned to members identical to those of the compression molding die 1 disclosed in the first embodiment, and explanations are used. In the following, different configurations will be mainly described.

Although a plurality of semiconductor chips are mounted on the workpiece W, for example, when a defect or the like occurs in the chip mounting portion, a missing part of the semiconductor chip may occur on the workpiece W. In this case, it is only necessary to accurately measure the number of defects in the semiconductor chips for each workpiece W and change the amount of resin to be supplied, but it takes time and man-hours, and it is necessary to supply the resin by precise measurement. For this reason, an overflow cavity described later is provided in the present embodiment so that the supply amount of mold resin is not necessarily exactly matched, but is adjusted on the mold side.

As shown in Fig. 11A, a stepped surface 5d1 having a high height at the bottom of the cavity is provided around the upper surface side outer periphery of the lower mold cavity tool 5d provided in each lower mold chase unit 5, and the stepped surface 5d1 ) is provided with a plurality of overflow cavities 10. The overflow cavity 10 accommodates an excess of the mold resin supplied to the lower mold cavity concave portion 3a (absorbs variations in the amount of resin). Therefore, the amount of resin supplied to the lower mold cavity concave portion 3a needs to be supplied by the overflow cavity more than the amount of resin required for the thickness of the final package portion.

As shown in FIG. 11A, a plurality of through holes 5d2 are provided in the stepped portion 5d1 of the lower mold cavity 5d. In each through hole 5d2, the float tool 10a is respectively inserted so that it can move up and down. Each float member 10a is erected and supported on the upper surface of a coupling plate 10b arranged in a horizontal position between the lower die base plate 5a and the support plate 5c. Each float tool 10a penetrates the support plate 5c and is inserted into the through hole 5d2 of the lower mold cavity tool 5d. A coil spring 10c is provided between the connection plate 10b and the lower mold base plate 5a, and presses and supports each float member 10a upward through the connection plate 10b. As shown in FIG. 11B, the overflow cavity 10 is formed in the upper end surface of each float member 10a and the hole wall surface of the through hole 5d2. In addition, the float ball 10a may be block-shaped or may be elongated and pin-shaped. The shape of the cross section (plane) on each overflow cavity 10 may be a rectangle or another shape such as a circle.

On the lower surface of the coupling plate 10b, a push pin 10d is provided so as to protrude vertically downward. The push pin 10d passes through the lower mold base plate 5a and the lower mold base 7 (lower mold base portion 7a), and is supported by a mold opening/closing mechanism (eg, a movable platen) not shown. There may be. Further, for example, a pressure sensor (load cell or the like) may be provided at the lower end of the push pin 10d. Accordingly, it is possible to control the resin pressure of the mold resin in real time by directly measuring the resin pressure flowing into the overflow cavity 10 at the time of mold closing in real time with the pressure sensor. In addition, the push pin 10d is not necessarily required and may be absent.

Moreover, as shown in FIG. 11A, the stopper 5i may be protrudingly provided below the flange part 5h of the push pin 5f which supports the lower type movable clamper 5e. The lower end of the stopper 5i abuts against the base plate 5a when the lower mold movable clamper 5e is pushed down by the upper mold 2, so that the stopper 5i can stop its downward movement. The stopper 5i is provided in order to define the downward movement limit position of the lower mold movable clamper 5e. Since the height of the lower mold cavity recessed part 3a is determined by this, the thickness of each package part (resin-sealing part) compression-molded in multiple places can be managed uniformly.

Here, the behavior of the float sphere 10a in compression molding operation will be described with reference to Fig. 11A. Normally, a total number of semiconductor chips are mounted on the workpiece W, but when a defect or the like is found in the semiconductor chip itself in the previous process, there are cases where the semiconductor chips are not partially mounted on the workpiece. That is, there is a case where a semiconductor chip is partially missing. In addition, the amount of mold resin supplied to the lower mold cavity concave portion 3a is greater than the target resin amount due to missing semiconductor chips or chipping of semiconductor chips in the workpiece W, or partial drop of resin during resin transport, or for some reason. If insufficient, when the mold 1 for compression molding is closed, the coil spring 10c pressurizes the support plate 5c to penetrate the lower mold cavity 5d and the angle inserted into the through hole 5d2 of the lower mold cavity 5d. The float ball 10a is compression molded while entering the lower mold cavity concave portion 3a from the stepped portion 5d1. Thereby, the difference between the size of the lower mold cavity volume and the resin amount of the supplied mold resin is absorbed.

In addition, when the amount of mold resin supplied to the lower mold cavity concave portion 3a with respect to the workpiece W is greater than the target resin amount, the float ball 10a is pushed against the pressure of the coil spring 10c by the resin pressure. down, and compression molding is performed while the surplus resin is accommodated in the through hole 5d2. Thereby, the difference between the size of the lower mold cavity volume and the resin amount of the mold resin is absorbed.

In addition, if the amount of resin is too small, the final package thickness may be formed thin, so it is preferable to supply more resin than the target resin amount from the beginning and adjust the amount of pushing down of each float member 10a.

Accordingly, compression molding can be performed while maintaining a constant thickness of the molded product without accurately measuring the supply amount of the mold resin for each workpiece W in advance. In addition, the concave and convex portions formed on the molded article do not affect the molding quality because they are the outer periphery of the workpiece W that has nothing to do with the final product. In addition, since the float sphere 10a is constantly pressed toward the mold resin in the cavity concave portion 3a, resin pressure is applied to the mold resin in the cavity concave portion 3a to fill the void and improve molding quality. In addition, although the overflow cavity 10 was provided in the lower mold cavity mouth 5d, you may provide it in the clamp surface of the lower mold movable clamper 5e.

[variant example]

Next, an example of using deformation according to the workpiece W of the compression molding mold 1 of FIG. 1 will be described with reference to FIGS. 12 to 15 . The mold 1 for compression molding in FIG. 1 has been exemplified for the case where two rectangular strip substrates of, for example, 300 mm × 100 mm are simultaneously compression molded as the work W, but a work W of a larger size than that has been exemplified. It is also possible to compress and mold one sheet at a time by using.

12 and 13 are explanatory cross-sectional views of a compression mold in the case of compressing a large-sized workpiece, viewed from the front, and cross-sectional views viewed from the side. From the structure of the upper mold 2 shown in FIG. 1, the upper mold guide block 6c and the upper mold chase guide 6e provided in the middle of the upper mold base 6 are removed, and the upper mold chase unit 4 is made to a large size. The embodiment changed for the work W of is shown. Further, from the configuration of the lower mold 3 shown in FIG. 1 , the lower mold guide block 7d and the lower mold chase guide 7e provided in the middle portion of the lower mold base 7 are removed, and the lower mold chase unit 5 is formed. An embodiment changed to a workpiece W of a large size is shown. Even in this case, the upper mold base 6, the adjustment mechanism 8, and the lower mold base 7 can be shared.

In the case of Fig. 12, since the pressing plate 8d is divided and there are two adjusting mechanisms 8, the workpiece W itself has a slightly different thickness on the left and right, or when the workpiece W itself is supplied to the lower mold cavity concave portion 3a. Even when the amount of resin is supplied slightly differently on the left and right sides, the adjustment mechanism 8 can adjust the height of the mold, respectively, compared to the case where the pressing plates 8d shown in Fig. 13 are integral.

14A and B are plan views of the upper mold 2 and the lower mold 3 in the case of compression molding a large rectangular panel of, for example, 300 mm x 300 mm as the work W. 14A, in the upper mold 2, chuck claws 4d are provided on each of the four sides of the workpiece W adsorbed to the upper mold plate 4c (for example, at three locations). In addition, the upper mold guide block 6d and the upper mold chase guide 6e are provided only at both left and right ends of the upper mold base 6 . Upper mold adjuster pins 4k are protruded from a plurality of positions (for example, four positions per side) on the outer periphery of the upper mold plate 4c. In addition, the suction hole 2b of the workpiece|work W formed in multiple numbers in the workpiece holding part 2a is abbreviate|omitted from illustration.

14B, in the lower mold movable clamper 5e of the lower mold 3, the retreat groove 5e1 corresponds to the chuck claw 4d of the upper mold 2 and the same number around the lower mold cavity concave portion 3a (eg For example, three locations) are provided. In addition, the lower mold guide block 7d and the lower mold chase guide 7e are provided only at both left and right ends of the lower mold base 7 . The outer periphery of the lower die movable clamper 5e is protruded from a plurality of locations (for example, four locations per side) at a position opposite to the upper die adjuster pin 4k. In addition, illustration is omitted for the plurality of suction holes 5e5, the circumferential groove 5e2, and the suction hole 5e3 provided at the bottom of the groove of the film suction groove 5e4 provided to go around the lower mold movable clamper 5e. did

15A and B are plan views of the upper mold 2 and the lower mold 3 in the case of compression molding a semiconductor wafer having a diameter (?) of 300 mm and a circular carrier or substrate as the work W, for example. 15A, on the upper mold 2, chuck claws 4d are provided at regular intervals (for example, 4 positions out of phase by 90 degrees) around the workpiece W adsorbed on the upper mold plate 4c. In addition, the upper mold guide block 6d and the upper mold chase guide 6e are provided only at both left and right ends of the upper mold base 6 . Upper mold adjuster pins 4k are protruded from a plurality of positions (for example, four positions per side) on the outer periphery of the upper mold plate 4c. In addition, the suction hole 2b of the workpiece|work W formed in multiple numbers in the workpiece holding part 2a is abbreviate|omitted from illustration.

15B, in the lower mold movable clamper 5e of the lower mold 3, recessed grooves 5e1 correspond to the chuck claws 4d of the upper mold 2 at equal intervals around the lower mold cavity concave portion 3a ( For example, they are provided at 4 locations by shifting the phase by 90 degrees. In addition, the lower mold guide block 7c and the lower mold chase guide 7e are provided only at both left and right ends of the lower mold base 7 . The outer periphery of the lower die movable clamper 5e is protruded from a plurality of locations (for example, four locations per side) at a position opposite to the upper die adjuster pin 4k. In addition, illustration is omitted for the plurality of suction holes 5e5, the circumferential groove 5e2, and the suction hole 5e3 provided at the bottom of the groove of the film suction groove 5e4 provided to go around the lower mold movable clamper 5e. did In addition to the circular semiconductor wafer, the workpiece W may be a circular carrier or substrate such as an eWLB to which a large number of semiconductor chips T are die-bonded.

As shown in FIGS. 14 and 15, an upper mold 2 having a work holding portion 2a for holding a single workpiece W and an upper mold 2 having a work holding portion 2a are disposed to face each other and clamp the workpiece W. A lower mold 3 in which a lower mold cavity concave portion 3a is formed with a clamper 5e that is inserted into the clamper 5e and a cavity ball 5d that pressurizes the resin by relatively moving, the upper mold 2, It may be the mold for compression molding 1 provided with an adjusting mechanism 8 (not shown) for adjusting the variation in the thickness direction at the time of clamping the mold. In this case, for example, even if there is a large-sized workpiece W that can not necessarily be arranged horizontally side by side, the large-sized workpiece ( By adjusting the deviation of the mold height corresponding to W), compression molding can be performed with high precision.

FIG. 16 is a change in the shape of the cavity sphere 5d and the support plate 5c of the lower mold chase unit 5 in the mold 1 for compression molding shown in FIG. 1 . That is, the support plate 5c is provided so as to support the lower mold movable clamper 5e and the lower mold chase plate 5j without supporting the lower mold cavity tool 5d. The lower mold cavity 5d is directly supported by a support pillar 5b formed in a plurality upright on the lower mold base plate 5a. In addition, a plurality of suction holes 5e5, circumferential grooves 5e2, and suction holes 5e3 provided in the groove bottom of the film suction groove 5e4 provided around the lower mold movable clamper 5e are not shown. did

In this case, the plate thickness of the lower mold cavity sphere 5d can be increased, and since the lower mold cavity sphere 5d is supported right below by the support filler 5b, it is difficult to be affected by warpage or the like. Height adjustment by the filler 5b can be performed more precisely.

In the left peninsula of FIG. 17, in the compression molding mold 1 shown in FIG. 1, the lower mold clamper 5e is fixed to the support plate 5c instead of the lower mold movable clamper 5e of the lower mold chase unit 5. It becomes, and the lower type|mold cavity tool 5d is connected to the drive mechanism 11, and it is provided so that direct elevation is possible. The drive mechanism 11 may be a servo motor 11a and a power transmission unit 11b or may be a hydraulic actuator. In this case, the volume of the lower mold cavity concave portion 3a can be controlled with high precision, and it is easy to apply resin pressure to the mold resin supplied to the lower mold cavity concave portion 3a.

In the right peninsula of Fig. 17, the lower end of the push pin 5f supporting the lower mold movable clamper 5e at the upper end is supported by the movable connecting plate 12. The movable connection plate 12 cuts out the lower mold base plate 5a and is provided in a horizontal posture. The movable coupling plate 12 is connected to the driving mechanism 13 and is provided so as to be able to directly move up and down. The drive mechanism 13 may be a servo motor 13a and a power transmission unit 13b or may be a hydraulic actuator. In addition, a plurality of suction holes 5e5, circumferential grooves 5e2, and suction holes 5e3 provided in the groove bottom of the film suction groove 5e4 provided around the lower mold movable clamper 5e are not shown. did

Thereby, the transfer drive mechanism (plunger drive mechanism) of the transfer molding press for taking two sheets conventionally used can also be used as a drive mechanism of the lower die movable clamper 5e.

FIG. 18 shows not only compression molding of a large-size workpiece W alone, such as the rectangular panel shown in FIGS. 14A and B or the circular semiconductor wafer shown in FIGS. 15A and B, but also compression molding of a single strip substrate. A case where the mold 1 for compression molding may be used is exemplified.

19 shows a compression molding die 1 for a three-strip substrate instead of the compression molding die 1 for a two-strip substrate shown in FIG. 1 . The mold configuration is the same as in FIG. 1, and mold chase units (upper mold chase unit 4 and lower mold chase unit 5) inserted and removed with respect to a common mold base (upper mold base 6 and lower mold base 7) The case where the number of is 3 sets is exemplified. Moreover, you may provide 4 or more sets of mold chase units.

20a and b show another configuration of the adjusting mechanism 8. Although the spring mechanism using the coil spring 8e was provided as the adjustment mechanism 8 in FIG. 1, you may use the wedge mechanism 14. As shown in FIG. 20a and b, between the upper mold base part 6a of the upper mold base 6 and the upper mold chase plate 4a of the upper mold chase unit 4, there is a movable slide plate 14a and a wedge plate 14b The tapered surfaces 14c are overlapped and laminated. The wedge plate 14b is overlapped and bonded to the upper mold chase plate 4a via the height adjusting plate 14d.

Moreover, as shown in FIG. 20B, the screw shaft 14e and the servomotor 14f are attached to the inner side part of the upper mold base side part 6b of a rectangular frame shape. The screw shaft 14e is threaded with a nut provided on the movable slide plate 14a. The movable slide plate 14a is moved in the horizontal direction along the upper mold base 6a by driving the servo motor 14f to rotate by a predetermined amount in a predetermined direction. At this time, the height position of the upper die chase unit 4 is adjusted by the wedge plate 14b laminated via the tapered surface 14c. That is, as shown in Fig. 20A, the difference in sheet thickness of the workpiece W may be absorbed by utilizing the clearance in the mold opening and closing direction of the stepped portion 6f which the support block 4b of the upper mold chase unit 4 holds. .

An example of a resin mold apparatus equipped with any of the above-described compression molding die 1 is shown in a planar layout diagram in FIG. 21 . The workpiece W is a 100 mm × 300 mm rectangular strip substrate, and the mold resin may be any of tablet resin (solid resin), sheet-like resin, granular resin, powdery resin, and liquid resin. As an example, granular resin is used Press sections 15 on which the mold 1 for compression molding is mounted are provided at three locations. It is two sheets per one press part 15, and a total of six sheets of work W can be compression molded in one press operation. In addition, when the number of presses is large in order to increase productivity, considering the time of supply, forming by press, storage, etc., each press may be formed sequentially.

At the left end side of the three juxtaposed press parts 15, there is provided a work supply storage part 16 for supplying the work W and storing it in a magazine after molding. The work conveying mechanism 17 reciprocates between the work supply storage section 16 and the press section 15 to take out the work W after molding when moving forward and backward to the mold 1 for compression molding that has been opened. Supply of the workpiece|work W before overmolding is performed. The work loader 17 entering the press section 15 receives two pieces of work W (molded product) after molding, and takes two pieces of work W before molding into a compression molding mold ( 1) (work holding part 2a of upper mold 2: see Fig. 1).

At the right end side of the press section 15, a film resin supply section 18 is provided. In the film resin supply unit 18, each film is supplied corresponding to each strip substrate and cut to form a single sheet film 9. On the sheet-fed film 9, a target amount of resin is calculated from the result of sensing in the workpiece supply storage unit 16, and granular resin is sprinkled flatly in a substantially the same shape as the cavity planar size, for example. Further, the resin and the sheet-fed film 9 are conveyed from the film resin supply unit 18 to the press unit 15 by the resin conveying mechanism 19, and only the sheet-fed film 9 is recovered after molding.

In the resin molding apparatus described above, in each press unit 15, a plurality of (for example, two sheets per set) strip substrates and sheet film 9 and resin are supplied to the mold chase unit arranged in parallel for each substrate. Thus, individual compression molding can be performed while absorbing variation in the thickness of the workpiece W or the amount of resin, thereby improving productivity and handling. The number of press sections 15 is not limited to 3 presses, but may be more than that or at least any.

In the compression molding apparatus, for example, either one of the upper mold 2 and the lower mold 3 may be a movable type and the other may be a fixed type, or both may be movable types. In addition, the mold opening and closing mechanism for opening and closing the mold 1 for compression molding can use various driving mechanisms such as those using a servo motor and a screw shaft, using a servo motor and a toggle link, or using a hydraulic drive mechanism. .

In the mold 1 for compression molding, the cavity concave portion 3a is formed in the lower mold 3 and the work holding portion 2a is formed in the upper mold 2, but the work holding portion is formed in the lower mold 3. Alternatively, the cavity recess may be formed in the upper mold 2 . In this case, the lower mold base 7 may be provided with the adjustment mechanism 8 integrally, or the sheet film 9 may be adsorbed and held by the upper mold chase unit 4 . In this case, the mold resin is supplied not on the sheet film 9 but on the work W. In addition, although this embodiment is an embodiment using the sheet-fed film 9, a long film may be used.

In addition, although this embodiment is an Example using a film, a case where a film is not used may be sufficient.

Although the mold 1 for compression molding described above is exemplified as a mold for acquiring one workpiece W or taking two workpieces, it is also possible to mold three or more workpieces W.

Another configuration of the compression molding apparatus will be described.

As shown in FIG. 22 , for example, a plurality of compression molding dies 1 for obtaining one sheet of work W are mounted side by side, and are mounted in a common press drive mechanism 20 (mold opening/closing mechanism). It may be opened and closed by In Fig. 22, guide posts 20b are erected at each corner of a rectangular press base 20a. The upper end of the guide post 20b is connected to the fixed platen 20c, and the movable platen 20d is slidably linked to the middle part. The movable platen 20d is moved up and down by a servo motor 21a and a power transmission unit 21b provided on the press base 20a. The upper mold 2 is horizontally supported on the fixed platen 20c, and the lower mold 3 is horizontally supported on the movable platen 20d. An upper mold chase unit constituting the upper mold 2 is provided with an adjustment mechanism 8 (not shown) similar to that in FIG. 9 .

Fig. 23 shows another configuration of the compression molding apparatus. The compression molding mold 1 for acquiring one sheet of the workpiece W is stacked in a plurality of stages (two stages in this embodiment) in the height direction, and is mounted in a common press drive mechanism 20 (mold opening/closing mechanism). It may be opened and closed by In Fig. 23, guide posts 20b are erected at each corner of a rectangular press base 20a. An upper end of the guide post 20b is connected to a fixed platen 20c, and a movable platen 20d and an intermediate platen 20e are slidably linked to the middle portion. The movable platen 20d is moved up and down by a servo motor 21a and a power transmission unit 21b provided on the press base 20a. The intermediate platen 20e has different strokes (for example, the movable platen 20d and the intermediate platen 20e) via a rack and pinion mechanism (not shown) linked to the lifting operation of the movable platen 20d. ) is linked so that it moves up and down with a movement ratio of 2:1).

The upper mold 2 is supported on the lower surfaces of the fixed platen 20c and the intermediate platen 20e, respectively, and the lower mold 3 is supported on the upper surfaces of the movable platen 20d and the intermediate platen 20e, respectively. . The upper mold chase unit constituting the upper mold 2 is provided with an adjusting mechanism 8 (not shown) similar to that in FIG. 9 .

As a result, for example, even if a single workpiece W is obtained, such as a large-sized workpiece, the productivity is improved by compression molding a plurality of sheets at the same time, and at the time of mold clamping for each mold chase unit arranged in parallel or in multiple stages, Variation in mold height is absorbed by the adjusting mechanism 8, and compression molding can be performed with high precision without tilting the mold.

Here, another example of the compression molding die 1 will be described with reference to FIGS. 24 and 25 . The mold 1 for compression molding individually clamps a plurality of workpieces W arranged side by side side by side and compression molding them at the same time. The same reference numerals are given to the same members as those in the first embodiment, and the description is used.

Referring to Fig. 24, the configuration of the upper mold 2 (first mold) will be described. This drawing is conceptually described as a minimum configuration. An adjustment mechanism 8 (coil spring 8e) is provided for each of a plurality of workpieces W in the upper mold base portion 6a constituting the bottom portion of the upper mold base portion 6 (first base portion). An upper mold plate 4c holding the workpiece W through the adjustment mechanism 8 is horizontally suspended and supported. The upper plate 4c is formed with a work holding portion 2a for individually adsorbing and holding the work pieces W. Further, in the upper mold base part 6a, an upper mold guide block 6d (first guide block) partitioning the upper mold base side part 6b (first base side part) and the upper mold space part 6c (first mold space part) ), a suction mechanism and a decompression mechanism are not shown, but they may be provided.

The configuration of the lower mold 3 (second mold) will be described. On the lower mold base 7a constituting the bottom of the lower mold base 7 (second base), a lower mold cavity 5d is supported and fixed side by side with the work holding part 2a disposed opposite to the lower mold. . Further, around the lower mold cavity sphere 5d, a lower mold movable clamper 5e that clamps the workpiece W is independently floating supported for each workpiece by a coil spring 5g. The lower mold cavity recess 3a is formed by the lower mold cavity sphere 5d and the lower mold movable clamper 5e. The lower mold cavity 5d pressurizes the resin by moving relatively while being inserted into the lower mold movable clamper 5e. In addition, in the lower die base portion 7a, a lower die guide block 7d (second guide block) partitioning the lower die base side portion 7b (second base side portion) and the lower die space portion 7c (second mold space portion) is provided. ) etc. may be provided standing up.

With the above structure, when clamping a plurality of workpieces W with the upper mold 2 and the lower mold 3, the upper mold plate 4c having the work holding portion 2a arranged horizontally on the upper mold base 6a. (First upper mold plate and second upper mold plate) and lower mold cavity concave portions 3a disposed opposite to them (first lower mold cavity concave portion and second lower mold cavity concave portion) with a lower die movable clamper 5e forming a workpiece The mold height variation at the time of clamping for each (W) is absorbed by the adjustment mechanism 8 and the coil spring 5g, so that the mold can be clamped without tilting.

25 shows another example of the mold 1 for compression molding. The mold 1 for compression molding individually clamps a plurality of workpieces W arranged side by side side by side and compression molding them at the same time. The same reference numerals are given to the same members as those in the first embodiment, and the description is used.

Referring to Fig. 25, the configuration of the upper mold 2 (first mold) will be described. This drawing is conceptually described as a minimum configuration. In the upper mold base portion 6a (first base portion) constituting the bottom of the upper mold base 6 (first mold base), an upper mold plate 4c (first base portion) for independently holding a plurality of workpieces W is provided. The upper mold plate and the second upper mold plate) are horizontally supported side by side. The upper plate 4c is formed with a work holding portion 2a for individually adsorbing and holding the work pieces W. Further, in the upper mold base part 6a, an upper mold guide block 6d (first guide block) partitioning the upper mold base side part 6b (first base side part) and the upper mold space part 6c (first mold space part) ), a suction mechanism and a decompression mechanism are not shown, but they may be provided.

The configuration of the lower mold 3 will be described. The lower mold base 7a (second base part) constituting the bottom of the lower mold base 7 (second mold base) is arranged to face the work holding part 2a, and the lower mold movable clamps the workpiece W. A lower mold cavity concave portion 3a formed by the clamper 5e and a lower mold cavity sphere 5d that pressurizes the resin by moving relative to the lower mold movable clamper 5e while being inserted therein (the first lower mold cavity recess and the second lower mold) cavity concave portion) are supported horizontally side by side.

Specifically, the lower mold cavity 5d is supported and fixed independently for each workpiece W on the lower mold plate 5r (die plate). The lower mold movable clamper 5e is independently supported by a lower mold plate 5r for each workpiece W via a coil spring 5g. An independent adjustment mechanism 8 (coil spring 8e) is provided for each workpiece W between the lower mold plate 5r and the lower mold base portion 7a.

In addition, in the lower die base portion 7a, a lower die guide block 7d (second guide block) partitioning the lower die base side portion 7b (second base side portion) and the lower die space portion 7c (second mold space portion) is provided. ) etc. are not shown, but these may be provided.

Thereby, the upper mold 2 in which the upper mold plate 4c having the work holding part 2a is horizontally arranged on the upper mold base part 6a and the work holding part 2a is opposed to the lower mold base part 7a. When individually clamping a plurality of works W with the lower mold 3 provided with the lower mold cavity recesses 3a arranged side by side, the coil spring 5g and the lower mold plate 5r of the lower mold movable clamper 5e The adjustment mechanism 8 provided between the mold and the lower mold base 7a absorbs variations in mold height for each workpiece W, so that the mold can be clamped without tilting.

Claims (24)

A compression mold for compression molding by individually clamping a plurality of workpieces arranged side by side side by side and compression molding at the same time,
A first mold having a work holding portion for individually holding the plurality of works;
A second mold in which a plurality of cavity concave portions are formed with a clamper disposed opposite to the work holding portion and disposed independently for each workpiece to clamp the workpiece, and a cavity sphere that pressurizes resin by relatively moving while being inserted into the clamper do,
The mold for compression molding, characterized in that the first mold is provided with an adjustment mechanism for individually adjusting the height of each workpiece. According to claim 1,
In the first mold, the first chase units having the work holding portions are separately arranged side by side on a first mold base in parallel, and the adjustment mechanism moves the first chase units from the first mold base in the mold opening and closing direction. A mold for compression molding, comprising a spring unit that presses each in a direction spaced apart from the first mold base, and individually adjusting the deviation of the mold height during mold clamping of the first chase unit disposed in parallel to the first mold base. According to claim 1 or 2,
In the second mold, second chase units having the cavity concave portions are horizontally arranged in parallel on a second mold base, and each second chase unit includes a cavity sphere forming a bottom of the cavity concave portion and a periphery of the cavity sphere. The mold for compression molding in which the clamper surrounding the cavity and forming the side portion of the cavity concave portion is supported so as to be relatively movable with respect to the second mold base. According to claim 3,
A mold for compression molding in which a film covering a lower mold clamp surface including the cavity concave portion is adsorbed and held for each second chase unit. An upper mold base;
an upper mold chase unit attached to the upper mold base in a detachable manner via an adjustment mechanism and having a work holding portion on an upper mold clamp surface;
A lower mold base provided to face the upper mold base;
A lower mold chasing unit in which a lower mold cavity concave portion is formed by a lower mold cavity sphere disposed opposite to the work holding part and a clamper surrounding the lower mold cavity sphere and supported so as to be relatively movable, which is attached to the lower mold base so as to be inserted and removed. Molds for compression molding. According to claim 5,
On the upper mold base, a pair of upper mold chase units are supported in a detachable manner via the adjusting mechanism, respectively, side by side,
The upper mold chase unit includes a first upper mold plate and a second upper mold plate having the work holding portion superimposed on the adjustment mechanism, and
In the lower mold base, a pair of lower mold chase units are provided to be detachably attached to each other horizontally opposite to the pair of upper mold chase units,
The lower mold chase unit is opposed to the first lower mold cavity concave portion and the second upper mold plate formed by a clamper supported so as to be capable of relative movement surrounding the lower mold cavity sphere disposed opposite to the first upper mold plate and the lower mold cavity sphere. A mold for compression molding, each having a second lower mold cavity concave portion formed by a lower mold cavity sphere and a clamper that surrounds the lower mold cavity sphere and is supported so as to be capable of relative movement. A mold for compression molding in which a plurality of molds for compression molding resin by clamping a single workpiece are mounted side by side and opened and closed by a common mold opening and closing mechanism,
A first mold having a work holding portion for holding the work;
A second mold in which a cavity concave portion is formed by a clamper disposed opposite to the work holding portion and clamping the workpiece and a cavity sphere inserted into the clamper and pressurized resin by moving relatively,
A mold for compression molding, characterized in that an adjustment mechanism for adjusting the height is provided in either the first mold or the second mold. A compression mold for compression molding by individually clamping a plurality of workpieces arranged side by side side by side and compression molding at the same time,
A first mold for horizontally supporting a work holding portion for holding the work in a first base portion provided in a first mold base;
A cavity concave portion formed of a second base portion provided in a second mold base, a clamper disposed opposite to the work holding portion, and clamping the workpiece, and a cavity sphere that pressurizes the resin by relatively moving while being inserted into the clamper. Equipped with a second mold for horizontally supporting side by side,
The cavity sphere is supported and fixed independently for each work with respect to the mold plate, the clamper is independently pressed and supported for each work on the mold plate, and the height is independently adjusted for each work between the mold plate and the second base portion. A mold for compression molding, characterized in that an adjustment mechanism is provided. A compression molding apparatus provided with the mold for compression molding according to claim 1 or 5. As a mold base for a pair of upper and lower compression molding molds that detachably supports a plurality of mold chase units arranged side by side side by side,
A first chase in which a first mold space surrounded by a first base of a rectangular plate shape and a side of the first base provided along the outer periphery thereof is attached to a plurality of first mold spaces partitioned by a first guide block. unit and
A second chase in which a second mold space surrounded by a rectangular plate-shaped second base and the side of the second base provided along the outer periphery is attached to a plurality of second mold spaces partitioned by a second guide block. unit and
When the first base side and the second base side are clamped through a sealant, all of the first mold space and the second mold space are sealed;
In either of the first mold space portion or the second mold space portion, the plate thickness of the work clamped by the first chase unit and the second chase unit, the resin amount of the mold resin, and the thickness of the film covering the clamp surface An adjustment mechanism for absorbing the deviation of the mold height during mold clamping due to the deviation of the total is provided, respectively.
The mold base according to claim 1 , wherein the adjusting mechanism includes a spring unit that presses either the first chase plate against the first mold base or the second chase plate against the second mold base in a mold opening/closing direction. According to claim 10,
A first chase guide provided adjacent to the mold opening/closing surface side of the first guide block provided descending from the first base portion;
A second chase guide provided adjacent to the mold opening and closing surface side of the second guide block provided upright from the second base portion,
A stepped portion for inserting and removing the first chase unit from the first guide block and the first chase guide is formed on both sides, and inserting and removing the second chase unit from the second guide block and the second chase guide A mold base in which stepped portions are formed on both sides. According to claim 10,
A frame-shaped first base side portion provided by descending from the first base portion and a frame-shaped second base side portion provided upstanding from the second base portion are disposed opposite to each other,
A mold base in which a first guide block defining a first mold space surrounded by a side of the first base and a second guide block defining a second mold space surrounded by a side of the second base are disposed opposite to each other. According to claim 10,
The side of the first base is rotatably connected to the first base through a hinge from the inside in the direction of insertion and removal of the first chase unit, and the side of the second base is connected to the side of the second chase unit to insert and remove the second chase unit with respect to the second base. A mold base that is rotatably connected from the inside through a hinge. delete According to any one of claims 10 to 13,
The mold base according to claim 1 , wherein the adjustment mechanism includes a slide plate having tapered faces overlapped between the first mold base and the first chase plate or between the second mold base and the second chase plate so as to be slidably provided. A chase unit for a mold in which a resin is compression molded by clamping a workpiece with a first chase unit and a second chase unit,
an adjustment mechanism having a spring unit that presses either a first chase plate against a first mold base or a second chase plate against a second mold base in a mold opening/closing direction;
A work holding part is provided on either clamp surface of the first chase unit or the second chase unit, and a clamper disposed opposite to the work holding part on the other clamp surface and clamping the work, and inserted into the clamper. A cavity concave portion is formed as a cavity sphere that pressurizes the resin by relative movement,
On the clamp surface of the clamper, a suction groove having a film suction hole or suction hole for adsorbing and holding an outer periphery of the film covering the cavity concave portion is provided, and the suction groove having the film suction hole or suction hole and the cavity concave portion are provided. A chase unit for a mold, characterized in that a circumferential groove is provided therebetween, and a plurality of suction holes are provided at the bottom of the groove of the circumferential groove. 17. The method of claim 16,
The circumferential groove also serves as a concave portion of a film push pin for press-fitting a film provided on the clamp surface of either one of the first chase unit and the second chase unit. 17. The method of claim 16,
The circumferential groove serves to retract the chuck claw of the work holding part. delete delete delete delete delete delete

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