TW201934295A - Resin molding mold and resin molding method efficiently supplies the film and the molded resin and shorten the manufacturing time - Google Patents

Abstract

The film and the molded resin are efficiently supplied according to the invention. The resin molding mold (1) is provided with a conveying tool (400) that belongs to an apparatus that holds the molded resin (R) and is conveyed together with the film (F) in the through holes (400a, 400b) formed in the shape of the mold cavity (209) corresponding to the lower mold 206. A first stage (308) is for holding the film (F) which is fed from the fil roll (306) and cut into a predetermined length, so that the cut film (F) and the conveying tool are combined. A second stage (310) is for loading the conveying tool (400) in which the film (F) is held on the lower side, and is configured to be movable. A conveying tool picker (304) holds the conveying tool (400) in a state in which the film (F) is held on the lower side, and then is transported from the first stage (308) to the second stage (310). A dispenser (312) places the molding resin (R) into the inner side of the through-holes (400a, 400b) of the conveying tool (400) on the second stage (310).

Description

Resin molding device and resin molding method

The present invention relates to a resin molding apparatus and a resin molding method for resin-molding a workpiece having electronic components mounted on a substrate.

A method of manufacturing an electronic device such as a semiconductor device by resin molding is known as a method of collectively resin-molding a workpiece on which a plurality of electronic components are mounted in a base material, and then cutting the molded product into individual pieces to form individual electronic devices . One such resin molding method is a compression molding method.

In general, the compression molding method is to supply a predetermined amount of resin to a molding area (mold) provided in a molding mold including an upper mold and a lower mold, and to arrange a workpiece in the molding area, and borrow A method of performing resin molding by clamping the upper mold and the lower mold. At this time, in the case of using a mold for molding provided with a cavity in the upper mold, a method of generally supplying a high-viscosity resin to a center position on a workpiece to perform molding is generally used. In this case, in order to fill the mold cavity with the resin to be supplied to the workpiece, it is necessary to cause the mold resin to flow to the edge of the mold cavity, and a flow mark may be generated.

On the other hand, in the case of using a mold for molding in which a mold cavity is provided in a lower mold, it is common practice to cover the mold surface including the mold cavity with a film, supply the molding resin with an equal thickness, and keep it in the upper mold. Resin molding was performed by immersing the workpiece in the molten molding resin. For example, the devices described in Patent Document 1 (Japanese Patent Laid-Open No. 2010-247429), Patent Document 2 (Japanese Patent Laid-Open No. 2004-148621), and Patent Document 3 (Japanese Patent Laid-Open No. 2017-024398) are already available. Expose.

Prior art literature Patent literature

Patent Document 1 Japanese Patent Application Publication No. 2010-247429

Patent Document 2 Japanese Patent Laid-Open No. 2004-148621

Patent Document 3 Japanese Patent Laid-Open No. 2017-024398

In the conventional resin molding apparatus of the compression molding method exemplified in the above-mentioned patent documents, a mechanism for supplying a workpiece or storing a molded product, a workpiece, a mechanism for measuring a thickness of a molded product, or a mechanism for conveying a flat surface The arrangement of the arrangement is common practice. Therefore, there is a problem that the installation area of the resin molding apparatus tends to increase.

In addition, when measuring the thickness of a workpiece or counting the mounted electronic components, or measuring the thickness of a molded product, and then one-by-one (one piece) of the manufacturing process such as the transfer of the workpiece and the molded product, the processing time will be prolonged and cause a bottleneck. There is a problem that it is difficult to improve the productivity of the entire device.

Furthermore, in the conventional resin molding apparatus of the compression molding method exemplified in the above-mentioned patent documents, in the case where the upper mold of the molding mold has a cavity structure, the molding resin can be mounted on one workpiece. Since the conveyance and resin molding are performed in the above state, there is an advantage that the device configuration or the manufacturing process can be simplified. However, when the lower mold of the mold for molding has a mold cavity structure, there may be cases where the film (release film) or molding resin must be carried in as many quantities as necessary after the workpiece is carried in. There is a problem that the device configuration or the manufacturing process is complicated.

In this way, especially in a resin molding apparatus having a mold cavity in a lower mold, a device capable of efficiently supplying a workpiece and a molded article, a film, and a molding resin and having a simplified structure or manufacturing process is desired.

The present invention has been developed in view of the above circumstances, and an object thereof is to provide a resin molding device which can be arranged in a hierarchical manner in a vertical direction by a mechanism for supplying, storing, measuring, and transporting a workpiece or a molded product. The realization of the structure can reduce the installation area compared with the conventional device, and by realizing the structure of processing and transporting the workpiece and the molded product in two alignment states, the process time can be shortened compared with the conventional device.

Furthermore, the present invention has been developed in view of the above circumstances, and an object thereof is to provide a resin molding apparatus capable of efficiently supplying a workpiece, a molded article, a film, and a molding resin used for resin molding and having a simplified structure or process. And resin molding method.

The present invention solves the aforementioned problems by using a solution as described below as an embodiment.

The resin molding apparatus of the present invention uses: a mold for molding; and a product obtained by transferring a workpiece having electronic components mounted on a base material to the aforementioned mold for molding and resin-molding the mold using the mold for molding. The conveying unit for carrying out the shaped article is a resin molding device for resin-molding the workpiece, and the main requirements are: a supply cassette lifter for lifting the supply cassette for storing the workpiece; and a storage cassette lifter disposed on the supply cassette elevator The storage box for storing the molded product is raised and lowered at a position different from the vertical direction; the supply track is arranged in front of the supply box elevator for loading the workpiece taken out from the predetermined position of the supply box; the storage track, The molded product is placed while passing through the storage box; a work measuring device is disposed below the supply rail, and measures the thickness of the work from the lower side of the work on the supply rail; A holder that holds the workpiece on the supply rail and transfers it to the transfer unit; and a storage picker that holds the molded product on the transfer unit and transfers it to the storage track; and uses the supply rail and the workpiece to measure The device and the storage rail are repeatedly arranged in the vertical direction.

According to this configuration, it is possible to realize a configuration in which the mechanisms for supplying, storing, measuring thickness, and conveying the workpiece and the molded product are arranged in a stepwise manner in the vertical direction. Therefore, compared with a conventional device in which each configuration is juxtaposed, a device installation area can be greatly reduced.

Furthermore, it is preferable that the supply rail is configured in two rows so that the two workpieces can be placed in the left-right direction, and the workpiece measuring device has two workpieces on the two supply rails. Each thickness is measured by one or two thickness sensors with a predetermined scan. According to this structure, the same corresponding position of two workpieces W can be scanned simultaneously by one or two thickness sensors. Therefore, since two workpieces W can be measured in one scan with the shortest scanning distance and scanning time, the process time can be greatly shortened.

Further, it is preferable to further include a work heater for heating the work from a lower surface side, and the work heater is located above the supply rail, and the work can be held in the state of being held in the supply picker more than an outer periphery. The outer position and the position opposite to the lower side are arranged to move forward and backward. According to this configuration, the workpiece W held by the supply picker can be heated (preheated) by the workpiece heater in the middle of the upward movement path. Therefore, compared with a conventional device in which each configuration is juxtaposed in a planar manner, the installation area of the device can be greatly reduced.

In addition, it is preferable that the supply picker conveys the workpiece in the left-right direction into the conveying section, and the left-right conveyance path in which the storage picker conveys the molded product from the conveying section is set to be juxtaposed in the front-rear direction. According to this configuration, since the workpiece loading operation by the supply picker and the molded product loading operation by the storage picker can be performed simultaneously and in parallel, the manufacturing process is compared with the conventional device in which the loading path and the loading path are overlapped. Time can be drastically reduced.

In addition, the resin molding apparatus of the present invention is a molding method that uses an upper mold that holds a workpiece having electronic components mounted on a base material, and a lower mold that has a recessed cavity formed by supplying a mold resin through a film. A resin molding device for resin-molding the workpiece with a mold and processing the molded product into a molded article includes a conveyer having a through-hole corresponding to the shape of the recess in the die-hole, and is held in the through-hole. The aforementioned device for molding the resin and carrying it with the aforementioned film; the first unit for holding the aforementioned film which is fed out from the film roll and cut to a predetermined length, so that the cut film is combined with the aforementioned transporter; the second unit And the aforementioned conveyer in a state where the film is held on the lower side is placed, and is configured to Movable; a transporter picker, which holds the aforementioned transporter in a state where the film is held on the lower side, and transports it from the first station to the second station; and a dispenser, which feeds the molding resin to the second station The inside of the said through-hole of the said conveyance tool mounted on it.

According to such a structure, the film and the molded resin are held at the time of the conveyance by realizing the configuration of the first unit for the supply of the film and the second unit for the supply of the molded resin. Preparations such as required film preparation or molding resin preparation can be performed in parallel. Therefore, compared with a conventional device that performs these processes on the same station, the process time can be greatly reduced.

Further, it is preferable that the conveyer has two rows of film holding portions so that the two pieces of the film can be aligned and held in the left-right direction, and each of the film holding portions has a resin input hole corresponding to each of the films as the foregoing Through-hole. According to this configuration, two pieces of the film each having the molding resin mounted thereon can be held by one conveyer and conveyed to the mold for molding. Therefore, compared with the conventional device that uses one conveyer to convey the film one by one, the process time can be greatly shortened.

In addition, it is preferable that the first stage and the film roll are arranged in a stepwise manner in a vertical direction. According to such a configuration, compared with a conventional device in which each configuration is juxtaposed, a device installation area can be reduced.

Further, it is preferable to further include a resin heater that heats from the upper surface side of the conveyer in a state where the film and the molded resin are held. According to this structure, since the molding resin can be heated immediately after being mounted on the film, the mounting surface can be liquefied, especially In the case of using a granular or powdery molding resin, the occurrence of dust (fine powder of resin, etc.) can be prevented to prevent the occurrence of product defects.

Furthermore, the resin molding device of the present invention is a resin molding device that resin-molds a workpiece on which electronic components are mounted on a base material and processes it into a molded product using a molding mold having an upper mold and a lower mold. The requirements are as follows: a first conveying section including a first holding section for holding the workpiece and a second holding section for holding the molded product obtained by resin molding, and holding the workpiece to a predetermined holding position on the upper mold. Position conveyance, and conveying the molded product to a predetermined position outside the mold for molding; and a second conveying section including a third holding section of a conveyer for holding a film and a molding resin, and holding used The fourth holding portion of the film transports the film and the molding resin to a predetermined holding position of the lower mold, and holds the transporter in which the holding state of the film and the molding resin has been released and moves the mold to the molding mold. The resin is transported to a predetermined position outside, and the used film remaining in the lower mold is kept in a state where the molded product obtained by resin molding is taken out, and is moved out of the mold for molding. Conveying the predetermined position.

According to this configuration, since the workpieces and molded articles used for resin molding, and the films and molded resins can be efficiently conveyed, the processing time can be shortened compared to conventional devices. Moreover, the device configuration or manufacturing process can be simplified.

Furthermore, it is preferred that the workpiece is a narrow strip-shaped workpiece; the film is a narrow strip-shaped film corresponding to the narrow strip-shaped workpiece; The first holding portion is provided with two rows of workpiece holding portions so that the two strip-shaped workpieces can be aligned and held so that the longitudinal directions of the strip-shaped pieces are parallel. The two aforementioned molded products obtained by processing a strip-shaped workpiece have two rows of molded product holding portions arranged in such a manner that the longitudinal directions of the molded products are parallel; the transporter is configured to be capable of transferring two pieces of the aforementioned strip-shaped film to The strip-shaped film has two rows of carry-in film holding portions arranged in parallel so that the longitudinal directions thereof are parallel; the third holding portion includes a carrying device holding portion that holds the carrying device; and the fourth holding portion is provided for use. The two pieces of the narrow strip film have two rows of carry-out film holding portions so that the longitudinal directions of the narrow strip films are parallel to each other. According to this structure, since the workpiece and the molded product, and the film and the molded resin can be transferred simultaneously, the manufacturing time can be greatly shortened compared with the conventional device that transfers one by one.

In addition, it is preferable that the workpiece is a narrow strip-shaped workpiece, or a wide workpiece that is wider than the narrow strip-shaped workpiece; and the film is a narrow strip-shaped strip corresponding to the narrow strip-shaped workpiece. Film, or a wide film that is wider than the strip film; the third holding section has a transporter holding section as the transporting device, which can be used to make two strip films to make the strip film A strip-shaped film conveyer having two rows of carry-in film holders aligned in parallel with its long side direction, or a wide-film conveyer having one carry-in film holder that holds one of the wide-format films in common. According to this configuration, since the workpiece to be processed into a molded product is a narrow-shaped workpiece or a wide-shaped workpiece, it can be held different by a common conveyer holding portion. It can be configured to feed the film with a simple changeover by carrying the film into the conveyor.

Furthermore, it is preferable that the first holding portion has a structure having two rows of workpiece holding portions in which the two pieces of the strip-shaped workpieces can be aligned and held so that the longitudinal directions of the strip-shaped workpieces are parallel. It is replaceable with a structure having a workpiece holding portion that holds one of the wide workpieces; the second holding portion is formed by two of the molded products that can be obtained by processing the strip-shaped workpiece to make the molded product long. A configuration having two rows of molded product holding portions arranged side by side so as to be parallel to each other and a configuration having one molded product holding portion configured to hold one of the foregoing molded products obtained by processing the wide workpiece are replaceable. According to this structure, even if it is a workpiece of either a narrow strip shape or a wide width, it is possible to provide a structure that can transfer the workpiece and the molded product by replacing the simple structure of the first holding portion and the second holding portion.

Further, it is preferable that the thin film is a narrow narrow strip film corresponding to the narrow strip workpiece, or a wide film that is wider than the narrow strip film; the fourth holding portion includes a thin film holding portion, It is an area in which two strip-shaped films are arranged so that the long-side direction of the strip-shaped film is parallel to the left-right direction, and the area overlaps with the wide-area area holding one of the wide-format films. A plurality of suction sections are arranged to suck and hold the film. According to this configuration, the plurality of adsorption sections are arranged at positions where the thin film can be held regardless of whether the thin film is adsorbed and held or the wide film is adsorbed and held, and the narrow film and the wide film can be carried out. Any type of thin film is not required to be replaced or replaced.

In addition, it is preferable that the transfer tool is provided with a plurality of sets, and the cleaning process of cleaning the transfer tool, the film setting process of combining the film with the transfer tool, and dropping the mold on the transfer tool that has been combined with the film. Resin casting processes and different processes, such as a resin supply process for supplying the film and the molding resin, to the mold for molding are processed. According to such a structure, by circulating each conveyer in each process for resin molding, the waiting time of the conveyer in each process can be shortened, and productivity can be improved.

Further, it is preferable that the transporter has a first adsorption hole that generates an adsorption force to hold the film, and the third holding portion has a state that the transporter is held at a predetermined position and is disposed in communication with the first adsorption hole. Position 吸附 is the second suction hole where the suction force is generated. According to this configuration, the transporter can be transported by the third holding unit while the film is adsorbed on the lower surface of the transporter.

In addition, the resin molding method of the present invention is a resin molding method for resin molding using the aforementioned resin molding apparatus, and its essentials are: the transporter is provided with a plurality of units; the cleaning process for cleaning the transporter, The film installation process of combining the film on the conveyor, the resin casting process of casting the molding resin onto the conveyor combined with the film, and the resin of supplying the film and the molding resin to the molding die. During the supply process, the plurality of carriers are processed in different processes. According to this configuration, by circulating each conveyer in each process for resin molding, the conveyer waiting time in each process can be shortened, and productivity can be improved.

According to the present invention, by realizing a structure in which a mechanism for supplying, storing, measuring thickness, and conveying a workpiece or a molded product is arranged in a vertical direction, the installation area can be reduced compared to a conventional device. In addition, by realizing a structure in which workpieces and molded products are processed and transported in two aligned states, the processing time can be shortened compared to conventional devices.

In addition, according to the present invention, it is possible to realize a configuration in which two or more mold cavities are provided in a lower mold, and workpieces are respectively disposed in each mold cavity to perform resin molding. In particular, since workpieces and molded articles for use in resin molding, as well as films and molded resins can be efficiently supplied, the process time can be shortened compared to conventional devices. Moreover, the device configuration or manufacturing process can be simplified.

1, 2‧‧‧ resin molding device

100A, 500A‧‧‧ Workpiece processing unit

100B, 500B‧‧‧pressing unit

100C, 500C‧‧‧Distributing unit

103‧‧‧Supply Box Lift

104, 104A, 104B‧‧‧ Supply Track

108, 108A, 108B‧‧‧Storage rail

113‧‧‧Storage Box Lift

114‧‧‧ Workpiece measuring device

116‧‧‧Workpiece heater

118‧‧‧formed product measuring device

120‧‧‧ supply picker

122‧‧‧The first storage picker

124‧‧‧ 2nd storage picker

202‧‧‧mould

204‧‧‧Mould

206‧‧‧ lower mold

210‧‧‧The first loader (the first transfer section)

212‧‧‧Second Loader (Second Transfer Section)

302‧‧‧ Preparation Desk

304‧‧‧Conveyor Pickup

306, 306A, 306B‧‧‧ film roll

308‧‧‧Film stage (1st stage)

310‧‧‧ Resin dropped (2nd)

312‧‧‧Distributor

314‧‧‧Resin heater

400‧‧‧ transport

F‧‧‧ film

Fd‧‧‧ Has used film

R‧‧‧moulding resin

W‧‧‧ Workpiece

Wp‧‧‧shaped products

FIG. 1 is a plan view of an example of a resin molding apparatus according to an embodiment of the present invention.

FIG. 2 is a left side view of the position II-II in FIG. 1.

3 is a plan view of an example of a supply rail of the resin molding apparatus of FIG. 1.

FIG. 4 is a plan view of an example of a storage rail of the resin molding apparatus of FIG. 1.

Fig. 5 is a left side view of the V-V position in Fig. 1.

FIG. 6 is a left side view of the VI-VI position in FIG. 1.

FIG. 7 is a left side view of the position VII-VII in FIG. 1.

FIG. 8 is a front view of the VIII-VIII position of FIG. 1.

FIG. 9 is a plan view of an example of a carrier of the resin molding apparatus of FIG. 1. FIG.

FIG. 10 is a plan view of an example of a mold for molding the resin molding apparatus of FIG. 1.

FIG. 11 is an operation explanatory diagram of the resin molding apparatus according to the embodiment of the present invention.

FIG. 12 is an explanatory diagram of an operation subsequent to FIG. 11.

FIG. 13 is an explanatory diagram of an operation subsequent to FIG. 12.

FIG. 14 is an explanatory diagram of an operation subsequent to FIG. 13.

FIG. 15 is an explanatory diagram of an operation subsequent to FIG. 14.

FIG. 16 is an explanatory diagram of an operation subsequent to FIG. 15.

FIG. 17 is an explanatory diagram of an operation subsequent to FIG. 16.

FIG. 18 is an explanatory diagram of an operation subsequent to FIG. 17.

FIG. 19 is an explanatory diagram of an operation subsequent to FIG. 18.

FIG. 20 is an explanatory diagram of an operation subsequent to FIG. 19.

FIG. 21 is an explanatory diagram of the operation following FIG. 20.

FIG. 22 is an explanatory diagram of an operation subsequent to FIG. 21.

FIG. 23 is an explanatory diagram of an operation subsequent to FIG. 22.

FIG. 24 is an explanatory diagram of the operation subsequent to FIG. 23.

FIG. 25 is an explanatory diagram of an operation subsequent to FIG. 24.

FIG. 26 is an explanatory diagram of the operation subsequent to FIG. 25.

FIG. 27 is an explanatory diagram of an operation subsequent to FIG. 26.

Fig. 28 is a plan view showing a modification of the resin molding apparatus according to the embodiment of the present invention.

FIG. 29 is a block diagram showing an example of a control structure according to the embodiment of the present invention.

Fig. 30 is a flowchart of an example of a resin supply operation according to the embodiment of the present invention.

Embodiment of the invention (Overall composition)

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic view (plan view) of an example of a resin molding apparatus 1 according to an embodiment of the present invention. In addition, FIGS. 2 to 10 are detailed schematic diagrams showing respective configurations of the resin molding apparatus 1. In addition, in the expediency of description, the front-back, left-right, and up-down directions of the resin molding apparatus 1 may be described by arrows in each drawing. In addition, in all the drawings for explaining each embodiment, members having the same function are denoted by the same reference numerals, and repeated description may be omitted.

The resin molding apparatus 1 of this embodiment is a device for molding a resin (workpiece) W using a molding die 202 including an upper mold 204 and a lower mold 206. Hereinafter, the resin molding apparatus 1 holds the workpiece W in the upper mold 204, covers the cavity 208 (including a part of the mold surface 206a) provided in the lower mold 206 with a film (release film) F, and supplies the molding resin R to the upper part. A description will be given as a main example of a compression molding apparatus in which the mold 204 and the lower mold 206 are clamped, and the workpiece W is immersed in the molten molding resin R to perform resin molding. In addition, the mold nest 208 is defined by a mold recess 209 recessed into a predetermined shape on the upper surface of the lower mold 206, and the molding resin R can be compressed by supplying the molding resin R through the film F.

First, the workpiece W as a molding object has a configuration in which a plurality of electronic components Wb are mounted in a matrix on the substrate Wa. more detail Examples of the substrate Wa include plate-shaped members (strip-shaped rectangular workpieces) such as resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, and wafers that are formed into narrow strips. ). Examples of the electronic component Wb include a semiconductor wafer, a MEMS wafer, a passive element, a heat sink, a conductive member, and a spacer. In addition, as will be described later, particularly, a device variation that can be used when a square or a circle is used can be considered as the base material Wa.

Examples of the method of mounting the electronic component Wb on the substrate Wa include mounting methods such as flip chip mounting and wire bonding mounting. Alternatively, when the base material (glass or metal support plate) Wa is peeled off from the molded product after resin molding, there is also a method using a heat-adhesive adhesive tape or an ultraviolet-curable resin hardened by ultraviolet irradiation. A method of setting the electronic component Wb.

On the other hand, as an example of the molding resin R, a particulate thermosetting resin (for example, a filled epoxy resin) can be used. In addition, it is not limited to the above-mentioned state, and may be other states (shapes) such as a liquid state, a powder state, a columnar state, a plate state, and a sheet state.

In the case of the film F, a film material having excellent heat resistance, ease of peeling, flexibility, and stretchability, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine Impregnated glass fiber cloth, polypropylene, polyvinylidene chloride, etc. are very suitable. The film F can be, for example, a strip-shaped thin film corresponding to the strip-shaped workpiece W.

Next, the outline of the resin molding apparatus 1 of this embodiment is demonstrated. As shown in FIG. 1, the resin molding apparatus 1 includes: The workpiece processing unit 100A mainly supplies the workpiece W and the storage of the molded product Wp after the resin molding; the pressing unit 100B mainly performs the resin molding of the workpiece W into the molded product Wp; and the dispensing unit 100C, mainly The main components are the supply of the film F and the molded resin R, and the storage (disposal) of the used film Fd after the resin molding. In addition, in this embodiment, a resin molding method of a compression molding method in which two mold cavities are provided in one lower mold and two workpieces W are arranged to perform resin molding collectively to simultaneously produce two molded products Wp is provided. The device is described as an example.

In this embodiment, units such as the workpiece processing unit 100A, the pressing unit 100B, and the dispensing unit 100C are connected and assembled. In one example, the workpiece processing unit 100A, the pressing unit 100B, and the material distribution unit 100C are sequentially arranged in the left-right direction from the left. In addition, an arbitrary number of guide rails (not shown) are provided in a linear shape across the units, and the first loader (first conveying unit) 210 for conveying workpieces W and the like, and the second load for conveying films F, etc. The device (second conveying section) 212 is provided so as to be movable between predetermined units along an arbitrary guide rail. In addition, these loaders 210 and 212 perform not only the loading operation of, for example, the workpiece W into the molding die 202, but also the loading operation of the molded product Wp from the molding die 202, and therefore also serve as an off loader (off loader). ) Function.

Therefore, the configuration of the resin molding apparatus 1 can be changed by changing the configuration of the unit. For example, although the configuration shown in FIG. 1 is an example in which three pressing units 100B are provided, it may be configured such that only one pressing unit 100B is provided, or two or more trees are connected to each other. Fat molding device (not shown). In addition, other units may be provided. For example, a unit that supplies a molding resin R different from the dispensing unit 100C or a unit (not shown) that supplies a component assembled with the workpiece W in the mold is provided. In one example, the member may also be a plate-like member that functions as a heat sink or a shield. In this case, after the plate-shaped member is superposed on the film F, the mold resin R may be supplied to the plate-shaped member and then conveyed.

(Workpiece processing unit)

Next, the configuration of the workpiece processing unit 100A included in the resin molding apparatus 1 will be described in detail, and the transport operation of the workpiece W and the molded product Wp will be described in detail.

First, the workpiece processing unit 100A includes a supply cassette lifter 103 that raises and lowers a supply cassette 102 that stores a plurality of workpieces W, and a storage cassette lifter 113 that raises and lowers a storage cassette 112 that stores a plurality of molded products Wp. The storage box elevator 113 is arranged at different positions in the vertical direction to the supply box elevator 103. For example, the elevators 103 and 113 may be arranged in a layered manner in a vertical direction with a state of overlapping in a plan view. Here, the supply cassette 102 and the storage cassette 112 can use a well-known stacking cassette, a slit magazin, etc. In the present embodiment, the mounting surfaces of the electronic components Wb each accommodate the workpiece W and the molded product Wp in a downward state. In addition, from the viewpoint of protecting the electronic component Wb, it is preferable to use a narrow box that inserts and holds the workpieces W in the recessed portions facing each other inside the cassette frame to separate and hold the workpieces W from each other. In addition, the supply cassette lifter 103 is configured to be capable of being raised and lowered by holding the supply cassette 102. The workpiece W is taken out from a predetermined position. The storage box elevator 113 is configured to store the molded product Wp at a predetermined position by holding the storage box 112 up and down.

Next, the workpiece processing unit 100A includes a supply rail 104 which is disposed in front of the supply cassette 102 and mounts the workpiece W taken out from the supply cassette 102. In the present embodiment, a relay rail 106 is provided between the supply cassette 102 and the supply rail 104 to allow the workpiece W to pass therethrough, but a configuration in which it is omitted may be provided. The movement of the workpiece W from the supply cassette 102 to the supply rail 104 can be performed by a known pusher or the like (not shown).

Here, the supply rail 104 avoids the mounting position of the electronic component Wb, supports the longitudinal side of the workpiece W from below by a pair of rails, and guides the workpiece W in the front-rear direction from the side. In addition, the supply rail 104 is configured in two rows (104A, 104B in the figure) so that two workpieces W can be arranged in the short-side direction and left-right direction, and has a moving mechanism (not shown) Icon). With this configuration, after the workpieces W taken out from the supply cassette 102 are placed in one row (for example, 104A), the supply rails 104A and 104B are moved in a predetermined direction (for example, right) of the left and right, and the bottom One workpiece W is placed in the other column (for example, 104B). In addition, each of the supply rails 104A and 104B has a variable width between the rails in accordance with the width of the workpiece W.

Next, the workpiece processing unit 100A includes a workpiece measuring device 114, which is disposed below the supply rail 104 and is configured to be movable in the front-rear and left-right directions. The workpiece W on the supply rail 104 is moved from the lower side (electronic parts). Wb mounting surface side) The thickness of the workpiece W is measured. The workpiece measuring device 114 is a laser displacement meter or a camera (monocular camera). Or a compound eye camera), and measure the thickness of the workpiece W based on the output data of these measuring devices. In addition, the "thickness measurement" referred to here includes the presence or absence of the electronic component Wb mounted on the base material Wa, the measurement of the mounting height of the electronic component Wb, the measurement of the mounting position deviation, and the measurement of the number of mountings. Measure. Based on the results of "thickness measurement" here, such as the presence or absence of the mounting of the electronic component Wb, the volume of the electronic component Wb mounted in the workpiece W is calculated, and the supply amount of the molding resin R is adjusted by adjusting It is possible to control the molding thickness of a molded product with high accuracy.

Here, the workpiece measuring device 114 includes two thickness sensors 114a and 114b for measuring each thickness of the two workpieces W on the two-row supply rails 104A and 104B. In one example, a thickness sensor 114a is disposed at a position corresponding to the workpiece W in the right column, and a thickness sensor 114b is disposed at a position corresponding to the workpiece W in the left column. With this configuration, the same corresponding positions of the respective workpieces W can be scanned at the same time, and two workpieces W can be measured in one scan with the shortest scanning distance and scanning time. Therefore, the process time can be greatly reduced. The measurement of the workpiece W in one scan only requires a pattern consisting of connecting lines between the close ends of a straight line that divides the workpiece W longitudinally or horizontally by n (n is an integer of 2 or more), so that the workpiece W may measure the workpiece W at predetermined intervals while moving the thickness sensors 114a and 114b. In this way, the thickness of the base material Wa of the workpiece W or the height of the electronic component Wb can be arbitrarily measured in accordance with the "one scanning operation (one scanning)" of the predetermined pattern. In addition, in the configuration of this embodiment, a scanning operation (moving forward, backward, leftward, rightward, and rightward) can be performed by moving the supply rails 104A, 104B for placing the workpiece W in the leftward and rightward direction, and measuring the workpiece. The mechanism that moves the actuator 114 in the front-back direction is implemented with a simple structure. In addition, similarly to the supply rails 104A and 104B, the interval between the thickness sensors 114a and 114b is made variable in accordance with the width of the workpiece W. In this way, even if the size (width) of the workpiece W is changed, two workpieces W can be measured in one scan.

In addition, as a modification, the workpiece W may be collectively photographed with a camera that is a thickness sensor 114a, 114b in a single movement in the forward and backward direction during a workpiece W measurement operation in one scan. Measurement of surface thickness. In addition, the workpiece measuring device 114 may be moved forward, backward, leftward, and rightward to perform a scanning operation. In addition, it is also possible to have a structure (not shown) having one thickness sensor and sequentially measuring two workpieces W with a predetermined one scan.

In addition, although the workpiece measuring device 114 measures the thickness of the workpiece W from the lower side of the workpiece W on the supply rail 104 in a relationship with the feeding operation of the workpiece W described later, it may be set to the workpiece W from the upper side. The thickness of the workpiece W is measured. In this case, the workpiece measuring device 114 may be provided on either or both of the upper and lower surfaces of the relay rail 106 through which the workpiece W passes. The workpiece measuring device 114 may be configured to read not only the thickness of the workpiece W but also identification information (for example, a two-dimensional code) attached to the workpiece W. Furthermore, a code reader 115 capable of reading the two-dimensional code of the workpiece W may be provided on either the upper or lower surface of the relay rail 106. The identification information of the workpiece W can be identified by a serial number or a non-repeating code to identify which workpiece W is. By associating and recording the identification information with detailed conditions such as resin molding, a procedure for improving the tracking ability as described later can be realized.

Next, the workpiece processing unit 100A includes a supply picker 120 that holds the workpiece W placed on the supply rail 104 and transfers the workpiece W to a predetermined position. In addition, the "pickup" mentioned below is a structure equivalent to the pick-and-place mechanism which moves a predetermined target object between arbitrary positions. In this supply picker 120, a known holding mechanism (for example, a structure having a holding claw and holding it, a structure having a suction hole communicating with an adsorption device and performing suction, etc.) is known for a mechanism for holding the workpiece W (not shown)示). In addition, as the adsorption device, a known mechanism such as a vacuum pump (the same applies hereinafter). Here, the supply picker 120 is configured to be movable in the left-right and up-down directions. With this configuration, by holding and raising the workpiece W placed on the supply rail 104, the workpiece W can be finally transported (supply) to the first holding portion 210A described later.

In addition, the configuration of the supply picker 120 of this embodiment is such that the above-mentioned holding mechanisms are arranged in two rows in the left-right direction and are provided at positions corresponding to the two workpieces W on the two-row supply rails 104A and 104B. With this configuration, the two workpieces W on the two-row supply rails 104A and 104B can be held and transported while being aligned in the left-right direction. In other words, the workpieces W can be aligned and held in parallel in the longitudinal direction.

Next, the workpiece processing unit 100A includes a workpiece heater 116 that heats the workpiece W from the lower surface side. Here, as a structure for heating the workpiece W, a well-known heating mechanism (for example, an electric heater, an infrared heater, etc.) (not shown) is provided on the upper surface of the workpiece heater 116. With this configuration, by preheating the workpiece W before it is carried into the mold 202 for heating, the workpiece W can be restrained from being stretched in the mold 202. In addition, as a variation, it can also be considered The structure of the piece heater 116. In this case, a heater may be provided in the first holding portion 210A (the first loader 210). In this case, preheating may be performed while the workpiece W is held by the first holding portion 210A. A heater may be provided in the first loader 210. In this case, when the workpiece W is transferred, it can be avoided from the position of the first holding portion 210A, and the workpiece W can be preheated during the transfer.

The workpiece heater 116 of this embodiment is arranged above the supply rail 104 so as to be able to move forward and backward on the lower side of the workpiece W held in the supply picker 120 (see FIG. 2). That is, the workpiece heater 116 can be said to be disposed so as to be movable between a position outside the periphery of the workpiece W and a position directly below the workpiece W. With this configuration, a preheating process for heating the workpiece W before the resin molding can be performed. In addition, when the workpiece heater 116 is moved to a position directly below the workpiece W, the supply picker 120 holding the state of the workpiece W is moved downward to execute the operation of bringing the workpiece W close to the workpiece heater 116. Become more efficient heating.

In addition, the workpiece heater 116 of this embodiment is configured such that the above-mentioned heating mechanism is arranged in two rows in the left-right direction at positions corresponding to the two workpieces W held by the supply picker 120. With this configuration, the two workpieces W held in the left-right direction by the supply picker 120 can be uniformly heated at the same time.

In this manner, the workpiece W held in the state held by the supply picker is above the supply rail 104, that is, the workpiece W is heated (pre-heated) by the workpiece heater 116 during the upward and downward movement by the supply picker. The composition is achievable. Therefore, the installation area of the device can be greatly reduced compared to a conventional device in which the components are juxtaposed in a planar manner.

Next, the first loader 210 that operates in cooperation with each mechanism of the workpiece processing unit 100A is provided with a first holding portion 210A on which the workpiece W is transferred to a predetermined holding position of the upper die 204. This first holding portion 210A is used to load the workpiece W transferred by the supply picker 120 when the supply rail 104 is moved to the side (right side in one example) position. When the workpiece W is transferred, the supply picker 120 goes through a preheating process on the supply track 104 and rises again, and then moves to the right by being moved to the position where it can be delivered to the right of the supply track 104. The position of the first holding portion 210A. In the first holding section 210A, a known holding mechanism (for example, a structure having a holding claw 挟 for holding, and a structure having a suction hole 连通 communicating with an adsorption device for holding 作为) is known as a workpiece holding section for holding the workpiece W to be placed. Etc.) (symbols 210a, 210b in the figure).

In this embodiment, the above-mentioned workpiece holding portions 210 a and 210 b are arranged in two rows in the left-right direction at positions corresponding to the two workpieces W held by the supply picker 120. That is, the workpieces W can be aligned and held in the longitudinal direction. With this configuration, the two workpieces W that are aligned and held in the left-right direction by the supply picker 120 can be simultaneously placed in their existing arrangement without being rearranged, and held and transported in the left-right direction.

The first loader 210 holding the workpiece W by the first holding portion 210A is configured to be movable in the front-rear, left-right, and up-down directions. By moving in the left-right direction, the workpiece W can be transferred from the workpiece processing unit 100A to the pressing unit 100B. On the other hand, the workpiece W can be moved from the outside to the inside (also That is, it is conveyed between the upper mold 204 and the lower mold 206 in the opened state. In addition, by moving in the vertical direction, the workpiece W can be transported (transferred) to a predetermined holding position of the upper mold 204 inside the mold 202 for molding. In addition, as a modification example, a configuration in which the first holding portion 210A moves left and right may be considered, and a configuration in which the movement of the moving range is replaced by the supply pickup 120 may be considered. In addition, instead of the structure in which the first holding portion 210A moves up and down, a structure in which the movement of the moving range is replaced by an opening / closing mechanism of the mold 202 for molding (both not shown) may be considered.

Next, the first loader 210 includes a second holding portion 210B, and a molded product Wp obtained by resin molding is removed from the molding die 202 (here, the upper mold 204) and placed thereon, and the molding is performed. The product Wp is conveyed to a predetermined position outside the mold 202 for molding. In addition, the second holding portion 210B has a known holding mechanism (for example, a structure having a holding claw 俾 for holding, a structure having a suction hole 连通 communicating with an adsorption device for holding, etc.) (in the figure, symbols 210c and 210d) as holding The molded product holding portion of the placed molded product Wp.

In addition, the second holding portion 210B of this embodiment is provided so that the above-mentioned molded product holding portions 210c and 210d are arranged in two rows in the left-right direction and are held by the mold 202 (upper mold 204) for molding after resin molding. The configuration of the positions corresponding to the two molded products Wp. In other words, the molded products Wp can be aligned and held in parallel in the longitudinal direction. With this configuration, the two molded products Wp that are borrowed from the molding die 202 (upper mold 204) and aligned in the left-right direction are simultaneously placed in their original configuration, and can be aligned and held in the left-right direction and transported without changing the arrangement. .

Here, in this embodiment, the second holding portion 210B and the above-mentioned first holding portion 210A are integrally configured as the first loader 210. In one example, the first loader 210 is provided with a first holding portion 210A having workpiece holding portions 210a and 210b in two rows on the front side, and a molded product holding portion 210c having two columns in left and right on the rear side. The second holding portion 210B of 210d. Therefore, the first holding portion 210A and the second holding portion 210B are configured to be movable as a first loader 210 in an integrated manner in the front-back, left-right, and up-down directions. With this configuration, not only the device configuration can be simplified and miniaturized, but also a configuration in which both the workpiece W and the molded product Wp can be transported simultaneously can be shortened.

In addition, as a modification, it may be considered that the loader having the second holding portion 210B and the loader having the first holding portion 210A are configured as separate pieces (not shown). In this case, what is necessary is just to provide the structure which can move similarly to the said 1st holding part 210A.

Next, the workpiece processing unit 100A is provided with a first storage picker 122 that holds the molded product Wp placed on the second holding portion 210B and transfers it to a predetermined position. In addition, the workpiece processing unit 100A further includes a second storage picker 124 that carries the molded product Wp held by the first storage picker 122 and transfers it to a predetermined position in the unit. As the means for holding the molded product Wp, there are already known holding means (for example, a structure having a holding claw 俾 for holding, a structure having an adsorption hole 连通 communicating with an adsorption device for holding, a mechanism for simply mounting, etc.) (Not shown). In the present embodiment, the first storage picker 122 and the second storage picker 124 are combined to form a storage picker that transports the molded product Wp from the first loader 210.

Here, the first storage pickup 122 of the present embodiment is configured to be movable in the left-right direction. With this configuration, the molded product Wp placed on the second holding portion 210B can be held and transported to the second storage picker 124. Here, during the transfer of the first storage picker 122 and the second storage picker 124, it is also possible to prevent the warpage of the molded product Wp by holding the molded product Wp on standby and flattening it while cooling it. Or deformed. In addition, a configuration (storage pickup) that can be moved not only in the left-right direction but also in the up-down direction may be provided as a modification of the first storage pickup 122. In this way, it is possible to realize a configuration in which the vertical movement mechanism of the second holding portion 210B is omitted.

In addition, the first storage picker 122 of the present embodiment is provided such that the holding mechanism faces the position corresponding to the two molded products Wp placed on the second holding portion 210B (two-row molded product holding portions 210c, 210d). A structure with two columns arranged side by side. With this configuration, the two molded products Wp on the second holding portion 210B can be held and transported simultaneously in a state of being aligned in the left-right direction.

In addition, in this embodiment, the feeding picker 120 is set so that the feeding direction of the workpiece W is transported to the first holding section 210A, and the storage picker (first storage picker 122) is transported from the second holding section 210B. The product Wp is taken out in the left-right direction and juxtaposed in the front-rear direction. In this way, since the loading operation of the workpiece W by the supply picker 120 and the loading operation of the molded product Wp by the storage picker (first storage picker 122) do not overlap or overlap, waiting can be suppressed. The occurrence of time. Therefore, since a plurality of actions are performed in a parallel manner at the same time, each action can be performed efficiently, so that the processing can be smoothed, and the process time can be shortened.

On the other hand, the second storage pickup 124 in this embodiment is configured to be movable in the vertical direction. With this configuration, the molded product Wp placed on the second storage picker 124 can be held and transported to a storage rail 108 described later.

In addition, the second storage picker 124 of the present embodiment has a configuration in which the above-mentioned holding mechanism is arranged in two rows in the left-right direction at positions corresponding to the two molded products Wp held by the first storage picker 122. With this configuration, the two molded products Wp held by the first storage picker 122 can be held and transported simultaneously in a state of being aligned in the left-right direction.

In addition, in the present embodiment, as described above, the configuration is provided with two storage pickups (the first storage pickup 122 and the second storage pickup 124), but it may also be provided with a configuration capable of facing left and right and up and down The configuration of one storage picker that can be moved is a modification (not shown). With this configuration, the molded product Wp placed on the second holding portion 210B can be held and directly transferred onto the storage rail 108. Further, the supply picker 120 and the storage picker may be constituted by a multi-joint robot (transport robot). In this case, the workpiece can be formed and formed according to a transfer mechanism composed of, for example, a horizontal multi-joint robot and a lifting mechanism. The product Wp moves in the left-right and up-down directions and has the same function as the above configuration.

In the above configuration, as long as the first loader 210 is moved to a position where the molded product Wp can be transferred to and from the first storage picker 122 (a position overlapping the first storage picker 122 of FIG. 1), the above-mentioned operation is Implemented. However, by making the first loader 210 It can be moved to the side of the apparatus, and the worker can easily access the workpiece W or the molded product Wp held by the first loader 210. In this case, the workpiece processing unit 100A may be configured to move the rail itself for moving the first loader 210 in the left-right direction. According to this configuration, when the second storage pickup 124 is moved up and down, the track can be retracted from the moving range of the second storage pickup 124 first. As a result, during normal production, the cooperative operation of the first loader 210 and the two storage pickers 122 and 124 enables the conveyance of the molded product Wp, and the first loader 210 can be used for maintenance. The workpiece W or the molded product Wp is directly moved to a position (device side position) where the operator can easily operate.

Next, the workpiece processing unit 100A includes a storage rail 108, which is disposed below the workpiece measuring device 114 and is used to mount a molded product Wp transferred by the storage picker (here, the second storage picker 124). In addition, the molded product Wp placed on the storage rail 108 passes (slides) on the storage rail 108 and is stored in the storage box 112. In addition, the storage rail 108 is basically the same in structure as the supply rail 104, and only the moving direction of the workpiece W or the molded product Wp is different. Therefore, the parts described in the supply rail 104 may be omitted (related to processing of the molded product). The other components of Wp are the same).

In the present embodiment, the relay rail 110 is provided between the storage rail 108 and the storage box 112 to allow the molded product Wp to pass, but a configuration in which it is omitted may be used. In addition, for the movement of the molded product Wp from the storage rail 108 to the storage cassette 112, a known pusher or the like (not shown) can be used.

Here, the storage rail 108 avoids the mounting position of the electronic component Wb, supports the longitudinal side of the molded product Wp from below, Party guides the workpiece W. In addition, the storage rail 108 is configured in two rows (108A, 108B in the figure) so that the two molded products Wp can be arranged in the short-side direction and left-right direction, and has a moving mechanism that can move in the left-right direction ( (Not shown). With this configuration, after the two molded products Wp held in the storage picker (here, the second storage pickup 124) are placed in the left-right direction at the same time, the molded products Wp can be sequentially directed to the storage box. 112 moves. For example, the formed article Wp on one row (for example, 108B) may be moved toward the storage box 112, and then the storage rails 108A, 108B may be moved in any predetermined direction (for example, left) and the other row (for example, left) (108A), the molded product Wp is moved to the storage box 112.

Next, the workpiece processing unit 100A includes a molded product measuring device 118 that is disposed below the storage rail 108 and inspects the molded product Wp on the storage rail 108 from the lower surface side (the mounting surface side of the electronic component Wb). In one example, the molded product measuring device 118 may be disposed at a lower position when the storage rails 108A and 108B reach a predetermined position when the molded product Wp is moved toward the storage cassette 112. The molded product measuring device 118 is composed of a laser displacement meter or a camera (a monocular camera or a compound eye camera), and is used for comparison with a reference value based on the output data of these measuring devices, or for measurement using methods such as pattern matching. The thickness of the molded product Wp and the appearance of the molded part where the molded product Wp was detected were missing. In addition, "below the storage track" includes below the relay track when the relay track 110 is provided. The "inspection" referred to here includes the thickness of the resin molded portion (resin molded portion) on the substrate Wa, the appearance of the resin molding (exposure of the lead), and the lack of resin molding (poor filling, etc.). Necessary measurements. You can also "check" the results here, such as from a tree The difference between the actual thickness and the target thickness of the fat-molded portion is used to adjust the supply amount of the molding resin R, so that the molding thickness of the molded product Wp can be controlled with high accuracy.

The molded product measuring device 118 of this embodiment is fixedly provided with one thickness sensor 118a. Thereby, the thickness which passed the predetermined position (for example, the center position or the outer peripheral position of the resin molding part) of the molded article Wp on the storage rail 108 can be measured.

As described above, in the present embodiment, the supply rail 104, the work measuring device 114, the storage rail 108, and the molded product measuring device 118 are repeatedly arranged in the up-down direction, and are sequentially arranged in a hierarchical manner from above. Structure (including offset settings in the front-back, left-right, and left-right directions). At the same time, the supply cassette elevator 103 and the storage cassette elevator 113 also have a configuration in which the supply cassette elevator 103 and the storage cassette elevator 113 are arranged at different positions in the vertical direction and are arranged in a hierarchical manner in order from above. According to these structures, the installation area of the device can be greatly reduced compared with a conventional device in which the structures are juxtaposed in a planar manner.

In the above-mentioned embodiment, the workpiece W is transferred to the mold 202 for molding, and the resin is molded using the first loader 210 for carrying out the molded product Wp obtained by resin molding using the mold 202 for molding. In the resin molding apparatus 1 of W, a configuration in which the workpiece measuring device 114 for measuring the thickness of the workpiece W and the molded product measuring device 118 for inspecting the molded product Wp are repeatedly arranged can be reduced compared to the conventional device. Set the area. In this case, after the workpiece W is thickness-measured by the workpiece measuring device 114, the workpiece W is transferred to the molding die 202 by the first loader 210, and the molding is transferred from the molding die 202 by the first loader 210. The product Wp is inspected by the molded product measuring device 118.

In addition, during the vertical movement by the second storage pickup 124, for example, during the transfer of the first storage pickup 122 and the second storage pickup 124, the heat dissipation process of the molded product Wp is performed while holding and flattening it. The structure can be realized, so it is not necessary to provide a heat dissipation unit separately, and the installation area of the device can be reduced.

In addition, according to the above-mentioned configuration, the processes from the state where two, for example, a strip-shaped workpiece W are placed on the supply rail 104 to the state where two processed molded products Wp are placed on the storage rail 108 are all oriented to the left and right. This is performed in a state in which two workpieces W or molded products Wp are aligned in the direction. Therefore, compared with a conventional device that contains a local time-consuming process because it includes a process that processes one by one in order, the process time can be greatly reduced.

Furthermore, according to the above configuration, the entire process from the removal of the workpiece W from the supply cassette 102 to the processing into a molded product Wp and storage in the storage cassette 112 can be realized. As the workpiece W and the molded product Wp move, the workpiece W And the structure (direction of holding and placing) of the molded product Wp can be moved in the front-back, left-right, and up-down directions without changing. Therefore, compared with the conventional apparatus which performs the orientation change of the workpiece | work W and the molded article Wp in a manufacturing process, a process time can be shortened and a device structure can also be simplified.

In addition, as a modified example of the resin molding apparatus 1 described above, it is also possible to provide a mold cavity in a lower mold and to arrange a workpiece W (a conceivable use of, for example, a circular wafer, or a square or rectangular In the case where a substrate or the like is used as the base material Wa), resin molding is performed to obtain a resin molding apparatus 2 of a compression molding method of a molded product (see FIG. 28). In this case, the workpiece W may be set to be a Workpiece W is structured to process a wider and wider workpiece (large-area workpiece). This wide workpiece can also be a square or rectangular or polygonal workpiece W that is wider than a narrow strip workpiece, or a circular wafer with a diameter (width) that is relatively wider than a narrow strip workpiece, or a workpiece that is a carrier plate. W. In this case, it can be considered that the workpiece processing unit 100A is replaced with the workpiece processing unit 500A as described below.

In one example, the workpiece processing unit 500A may be provided with a transfer robot including a robot 504 for taking out the workpiece W from the supply cassette, or storing the molded product Wp into the storage cassette, instead of the supply rail 104 or the storage rail described above. 108. Here, the manipulator 504 can be used at the tip of a known multi-joint robot or the like with a mechanism including a suction mechanism on a fork-shaped member conforming to the shape of the workpiece W. It is also possible to provide a configuration (not shown) including a plurality of robots. Furthermore, not only the above-mentioned supply picker 120 and storage picker, but also a transfer robot which can be provided on the supply rail 104 or the storage rail 108 to carry the workpiece W and the molded product Wp.

The first holding portion 210A may be configured to replace the two-row workpiece holding portions 210a and 210b and the wide workpiece holding portion 506 that holds one workpiece W (wide workpiece). Further, the second holding portion 210B may be provided as a wide-shaped molded product capable of holding the aforementioned two-row molded product holding portions 210c and 210d and holding one molded product Wp (the molded product Wp corresponding to the wide workpiece W). The holding unit 508 is configured to be replaced.

In this way, regarding the configuration that can switch the narrow-shaped workpiece and the wide-shaped workpiece, for example, the first holding portion 210A can be considered as The two workpieces W belonging to the strip-shaped workpiece can be held in parallel in the longitudinal direction so as to have two rows of workpiece holding portions 210a and 210b, and one workpiece holding one workpiece W belonging to a wide workpiece can be held. The configuration of the unit 506 is a replacement configuration. In addition, it may be considered that the second holding portion 210B may be configured to have two rows of formed product holdings so that the two formed products Wp obtained by processing the workpieces W belonging to the strip-shaped workpiece are aligned and held in parallel in the longitudinal direction. The structure of the parts 210c and 210d is replaced with the structure of the one workpiece holding part 508 which holds one molded product Wp obtained by processing one workpiece W. By adopting such a structure, even a narrow-shaped workpiece and a wide-shaped workpiece W can be produced. The workpiece W and the molded product can be transferred by simply replacing the first holding portion 210A and the second holding portion 210B. The composition of Wp.

(Pressing unit)

Next, the configuration of the pressing unit 100B included in the resin molding apparatus 1 will be described in detail.

The pressing unit 100B first includes a mold 202 for molding, which has a pair of molds that can be opened and closed (for example, a mold assembled from a plurality of modules, templates, mold columns, or other members made of alloy tool steel). In this embodiment, one of the molds on the upper side in the vertical direction of the pair of molds is used as the upper mold 204, and the other mold on the lower side is used as the lower mold 206. The mold 202 for molding can be closed and opened by the upper mold 204 and the lower mold 206 approaching and leaving each other. That is, the vertical direction is the mold opening and closing direction.

The mold 202 is opened and closed by a known mold opening and closing mechanism (not shown). For example, the mold opening and closing mechanism is provided with: a pair of templates; a plurality of connection mechanisms (tie-bar or column) for setting up a pair of templates; and a driving source (for example, electric A motor) and a drive transmission mechanism (for example, a toggle link), etc. (the drive mechanisms are not shown).

Here, the mold 202 is disposed between a pair of mold plates of the mold opening and closing mechanism. In this embodiment, the upper mold 204 as a fixed mold is assembled on a fixed template (a template fixed to a coupling mechanism), and the lower mold 206 as a movable mold is assembled on a movable template (a template that moves up and down along the coupling mechanism). However, it is not limited to this configuration, and the upper mold 204 may be used as a movable mold and the lower mold 206 may be used as a fixed mold. Alternatively, both the upper mold 204 and the lower mold 206 may be used as movable molds. Alternatively, a configuration in which two movable templates are provided and two sets of an upper mold 204 and a lower mold 206 are provided can also be made.

Next, the lower mold 206 of the molding mold 202 will be specifically described. The lower mold 206 includes a lower plate 224, a die socket 226, a clamper 228, and the like, and is configured by assembling these units (see FIG. 10).

Here, the die socket 226 is fixedly assembled on the upper surface of the lower plate 224 (surface on the upper die 204 side). The clamp member 228 forms a ring 6 so as to surround the die socket member 226, and is separated (floating) from the die socket member 226 and assembled on the upper plate 224.

In this embodiment, although the lower mold 206 has a mold cavity 208 recessed from the mold surface (parting surface) 206a, the inner part (bottom) of the mold cavity 208 is formed by the mold cavity 226, and the mold is formed by the clamp 228 The side of the nest 208. In other words, a recessed part 209 recessed into a predetermined shape is formed by the upper surface of the recessed part 226 and the inner peripheral wall surface of the clamped part 228.

In addition, in this embodiment, as shown in FIG. 21 and the like, the die socket 208 is provided with two structures (reference numerals 208A and 208B in the figure) provided in the left-right direction, and further includes corresponding die sockets 226A and 226B. With this configuration, the two films F (the portion on which the molding resin R is mounted) can be simultaneously housed in the mold sockets 208A and 208B, respectively. Therefore, since it is possible to realize a configuration in which two workpieces W are each resin-molded simultaneously, the process time can be shortened. In addition, it is also possible to adopt a configuration in which the clamping member 228 is cut in each of the die sockets 208A and 208B in the lower mold 206, which can be raised and lowered separately, and the upper mold 204 is provided with an elastic body to absorb two workpieces. The structure of a plate thickness adjustment mechanism with a plate thickness difference. According to such a configuration, even if the two workpieces W that are compression-molded at the same time have a difference in thickness, the tilt does not occur, and the molding can be performed while reducing the influence of the resin supply variation and the like. In addition, in this embodiment, the mold members are arranged so that the mold sockets 208A and 208B are arranged laterally in the left-right direction. Therefore, the mold sockets 226A, 226B and the clamp 228 constituting the mold sockets 208A and 208B are made into left and right separate chase structures, so that the base accommodating these components can be inserted and removed in the front-back direction of the device. , 俾 for maintenance.

Here, a suction groove (not shown) is provided on a mold surface of the upper die 204 opposite to the clamper 228 and communicates with a suction device (not shown). In addition, by providing a sealing structure surrounding these parts and driving the adsorption device to reduce the pressure, degassing in the mold cavity 208 can be performed while the mold is closed.

The mold 202 for molding includes a film adsorption mechanism that adsorbs the film F from the mold surface 206 a side of the lower mold 206. In one example, the film adsorption mechanism is a suction mechanism provided through the clamp 228. The auxiliary lines 230a and 230b communicate with an adsorption device (not shown). Specifically, one end of the adsorption paths 230 a and 230 b is connected to the mold surface 206 a of the lower mold 206, and the other end is connected to an adsorption device disposed outside the lower mold 206. With this configuration, the adsorption device can be driven to adsorb the film F from the adsorption paths 230 a and 230 b, and the film F can be adsorbed and held on the mold surface 206 a including the inner surface of the mold cavity 208. More specifically, the film F can be adsorbed from the adsorption path 230b, the film F can be adsorbed and held on the mold surface 206a outside the die cavity 208, and the film F can be adsorbed on the mold surface 206a by adsorbing the film F from the adsorption path 230a. It is held on the inner surface of the die cavity 208 (the die surface of the die cavity recess 209).

In this way, since the film F covering the inner surface of the mold cavity 208 and the mold surface 206a (a portion) of the lower mold 206 is provided, the portion of the molding resin R under the molded product Wp can be easily peeled off, so that the molding resin R can be easily removed. The molded product Wp is taken out from the mold 202 for molding.

Further, the mold 202 for molding includes a potential energy imparting member (for example, a spring such as a coil spring) 232 between the lower plate 224 and the clamp 228. Via the potential energy imparting member 232, the clamper 228 can be movably assembled to the lower plate 224. With this configuration, the die nest member 226 is surrounded by the clamping member 228, so that the die nest member 226 and the clamping member 228 can reciprocate relative to each other in the mold opening and closing direction. In this way, in the lower mold 206, the die nest member 226 is fixed and held on the lower plate 224, and on the other hand, the clamp member 228 is maintained in a separated (floating) state via the potential energy imparting member 232 in a movable manner. At this time, the gap between the inner peripheral surface of the clamper 228 and the outer peripheral surface of the socket member 226 is secured to a predetermined size. Therefore, the clamper 228 can operate smoothly.

However, the above-mentioned gap is included in the adsorption path 230a of the film adsorption mechanism, and the film F is adsorbed at the boundary (the corner portion of the mold socket 208) of the mold socket 226 and the clamp 228. Therefore, the thin film adsorption mechanism includes a sealing member 234 (for example, an O-ring). The sealing member 234 uses the above-mentioned gap as the suction path 230a and is provided between the die socket member 226 and the (lower portion) of the clamping member 228 to prevent the air from leaking out.

In addition, the lower mold 206 includes a heater (for example, an electric heating wire heater), an auxiliary heater (for example, an electric heating wire heater), a temperature sensor, a control unit, and a power source (all not shown). Heating and its control. In one example, the heater of the lower mold 206 is built in the lower plate 224 or a mold base (not shown) that houses these components, and mainly heats the entire lower mold 206 and the workpiece W. With these heaters of the lower mold 206, the lower mold 206 can be heated and adjusted to a predetermined temperature (for example, 120 ° C to 180 ° C).

Next, the upper mold 204 of the molding mold 202 will be specifically described. The upper mold 204 includes an upper plate 222, a die plate 236, and the like, and is configured by assembling these elements. Here, the die socket plate 236 is fixedly assembled under the upper plate 222 (the surface on the lower die 206 side).

In addition, the upper mold 204 includes a heater (for example, an electric heating wire heater), a temperature sensor, a control unit, and a power source (none of which are shown) to perform heating and control thereof. In one example, the heater of the upper mold 204 is built in the upper plate 222 and mainly heats the entire upper mold 204 and the molding resin R. With the heater of the upper mold 204, the upper mold 204 can be heated and adjusted to a predetermined temperature (for example, 120 ° C to 180 ° C).

The upper die 204 includes a work holding mechanism 240 for holding the work W at a predetermined position under the die plate 236. In one example, the workpiece holding mechanism 240 is connected to an adsorption device (not shown) via an adsorption channel 240 a arranged on the die plate 236. Specifically, one end of the adsorption path 240 a is connected to the mold surface 204 a of the upper mold 204, and the other end is connected to an adsorption device disposed outside the upper mold 204. With this configuration, the adsorption device 驱动 can be driven to adsorb the workpiece W from the adsorption path 240a, and the workpiece W can be adsorbed and held on the mold surface 204a (here, the lower surface of the die plate 236). In addition, a configuration having a holding claw for holding the outer periphery of the workpiece W may be provided in parallel with the configuration including the suction path 240a.

In the present embodiment, as shown in FIG. 21 and the like, the workpiece holding mechanism 240 has a configuration in which two sets are provided in the left-right direction (reference numerals 240A and 240B in the figure). With this configuration, the two workpieces W can be simultaneously held by the workpiece holding mechanisms 240A and 240B, respectively. Therefore, since two workpieces W can be resin-molded simultaneously, the processing time can be shortened. In addition, in the aforementioned plate pressure adjustment mechanism, the die nest plate 236 holding the workpiece W is lifted separately for each die nest 208A, 208B, so that even if two workpieces W are compression-molded at the same time, there is a difference in thickness, it can be formed. Without tilting.

As described above, as a modified example of the resin molding apparatus 1 described above, a mold cavity may be provided in a lower mold, and a workpiece W may be disposed to perform resin molding to obtain a compression of a molded product. A resin molding apparatus 2 of a molding method (see FIG. 28). In this case, it is possible to consider replacing the pressing unit 100B with a configuration of the pressing unit 500B as described below.

In one example, the pressing unit 500B only needs to have a structure in which the lower mold 206 is provided with a mold cavity 208 for storing the molding resin through one sheet of film instead of the two-row mold cavity 208A, 208B for storing the two films and the molding resin. . Further, it is only necessary to have a configuration in which the workpiece holding mechanism 240A, 240B that holds the two workpieces in the upper mold 204 is used as the workpiece holding mechanism 240 that holds one workpiece W.

(Dispensing unit)

Next, the feeding operation of the film F and the molding resin R will be described in detail with the configuration of the dispensing unit 100C included in the resin molding apparatus 1 as a main component.

As described above, the dispensing unit 100C is a unit that performs supply of the film F, the molding resin R, and the like. In the present embodiment, when the film F and the molding resin R are transferred to the molding die 202, the transfer tool 400 is used as a device for holding and transferring these materials. That is, by using the transfer tool 400 as a tool, the mold resin R is held and transferred together with the film F. In addition, the conveyer 400 is capable of arranging and holding the film F in parallel with its longitudinal direction (the details will be described later).

First, the sorting unit 100C is provided with a preparation table 302 for placing a conveyer 400 that has not maintained the state of the film F and the molded resin R, and has been properly cleaned. For example, the conveyance tool 400 carried out from the molding die 202 adheres to the molding resin R, and causes a malfunction. Therefore, by cleaning the surface together with a through-hole described later with a brush or an adsorption mechanism (none of which is shown), malfunctions can be prevented.

Next, a transporter picker 304 is installed to hold the transporter 400 and transport it between a plurality of predetermined positions (stations). In addition, a known holding mechanism (for example, a structure having a holding claw 俾 for holding, a structure having a suction hole 连通 communicating with an adsorption device for sucking, etc.) has been known (not shown). For example, it is possible to adopt a configuration in which a concave-convex portion is provided on the outer peripheral portion of the conveyer 400, and the concave-convex portion is hung and held by a holding claw standing downward from the lower surface of the conveyer picker 304, and the conveyance is performed.

Here, the carrier picker 304 is configured to be movable in the front-back, left-right, and up-down directions. With this configuration, the transporter 400 placed on the preparation table 302 can be held, and can be transported to a film table 308 and a resin dropping table 310 described later.

Next, the distribution unit 100C is provided at a position behind the preparation table 302: a film roll 306, which is rolled into a roll shape from a long strip film F; and a film table (first station) 308, which is disposed on the film roll Above the tube 306 (inclined upward in this embodiment), the film F sent from the film roll 306 is cut into a narrow strip having a predetermined length and held.

In one example, the film stage 308 and the film roll 306 have a structure (including offset in the front-back, left-right, and left-right directions) that is sequentially arranged from above in the vertical direction. With this configuration, the installation area of the device can be reduced as compared with a conventional device in which the components are juxtaposed in a planar manner.

In this embodiment, the film roll 306 is arranged in such a manner that two film rolls 306A and 306B are aligned in the left-right direction. With this configuration, two pieces of the same-shaped film F can be simultaneously supplied on the film stage 308. Here, the film rolls 306A, 306B can be supported by their central axis 307a, and A plurality of rollers 307b may be provided at a smaller interval than the outer shape of the film rolls 306A and 306B to support the rolls 307b from below. In this case, by supporting the film rolls 306A and 306B from below with the roller 307b, the two film rolls 306A and 306B can be easily replaced without inserting or removing the central shaft 307a. In addition, the feeding of the film roll 306 to the film table 308 may be a configuration in which the ends are clamped and pulled out, or a configuration in which the film roll 306 is driven by a driving roller provided in front of the film table 308 may be used.

On the other hand, the film table 308 has a known cutting mechanism (for example, a fixed-blade cutter, a hot-melt cutter, etc.) (not shown) as a mechanism for cutting the long strip-shaped film F. The mechanism for holding the two sheets of film F includes a known holding mechanism (for example, a structure for performing suction by communicating with a suction hole of the suction device) (not shown). The film F cut out here is combined with the conveyor 400 on the film table 308.

Here, as shown in FIG. 9, the conveyer 400 of this embodiment has a roughly flat plate shape formed on a plane parallel to the upper surface and the lower surface, and has two rows of carrying film holding portions (holding film 400A, 400B). In addition, each carrying-in film holding portion 400A, 400B is provided with a resin input hole 400a formed as a through hole so that each film F is exposed when viewed from above, at a position corresponding to each film F (a position where each film F is held). , 400b. The resin insertion holes 400a and 400b are formed through the resin insertion holes 400a and 400b in a shape corresponding to the aforementioned cavity recesses 209. When the molding resin R is dropped and held in the resin insertion holes 400a and 400b, the molding resin R can be prepared in an appropriate state.

Further, a plurality of first adsorption holes 400c are provided around the resin insertion holes 400a and 400b to generate an adsorption force and hold the film. another In addition, the first suction hole 400c serves to convey suction through a second suction hole 212b provided in the third holding portion 212A or a third suction hole (not shown) provided in the transporter picker 304 described later (communication). The structure of the adsorption force generated by the device (not shown). According to the above configuration, the two films F can be held in a state of being aligned and sucked in the left-right direction under the conveyer 400 that is conveyed to the film table 308 by the conveyer picker 304. It is also possible to provide a configuration in which the holding claws hold and hold the outer periphery of the film F.

Secondly, it is provided with a resin dropping stage (second stage) 310, which is disposed on the side (right side in one example) with respect to the film stage 308, and is configured to be movable in the forward, backward, leftward, and rightward direction for placement and borrowing. The transporter 400 transported by the transporter picker 304 (a state where two films F are held on the lower surface). In addition, the resin dropping table 310 has a known holding mechanism (for example, a structure having a holding claw 俾 for holding, a structure having a suction hole 连通 communicating with an adsorption device for holding, etc.) (not shown) as a transport for holding the placement With 400 institutions.

Further, in FIG. 1, a dispenser is provided on the side (in the example, the right side) of the film dropping table 308 with the resin dropping table 310 interposed therebetween. 312. The dispenser 312 is configured to insert the molded resin R into the resin insertion holes 400 a and 400 b of the carrier 400 placed on the resin dropping table 310, and mount (drop) the molded resin R on the exposed film F (resin (Inside the insertion holes 400a, 400b). The dispenser 312 is provided with, for example, a hopper 312a for storing the molded resin R, a weight meter 312b that weighs the weight of the resin dropped, and a vibrating feeder (not shown) for weighing the molded resin R. (Shown) a feed chute 312c, a nozzle 312d for regulating the dropping position of the molding resin R to be sent from the chute 312c, and the like.

Here, the resin dropping base 310 of this embodiment is configured to be movable in the front-rear and left-right directions (in FIG. 1, three positions are shown). By moving in the left-right direction, the conveyer 400 placed on the resin dropping table 310 can be moved forward and backward under the dispenser 312 while the film F is held. With this configuration, the transfer tool 400 can move between the intermediate position between the dispenser 312 and the film stage 308 and the position directly below the nozzle 312d of the dispenser 312. Furthermore, by moving in the front-rear direction, the conveyer 400 in a state where the film F of the molded resin R is mounted can be conveyed to a predetermined position (a position where the conveyer 400 is held by the third holding section 212A described later). . In addition, as a modification, a configuration in which the movement of the moving range is replaced by the dispenser 312 may be considered instead of a configuration in which the resin dropping table 310 moves left and right. In addition, a configuration in which the movement of the moving range is replaced by a third holding portion 212A (described later) may be considered instead of a configuration in which the resin dropping table 310 moves back and forth (both not shown).

In addition, by moving the resin dropping table 310 along the predetermined path in the front-rear and left-right directions while feeding the molded resin R from the two nozzles 312d to the resin insertion holes 400a and 400b, the resin injection holes 400a and 400b can be exposed. The inner film F is filled with the molding resin R uniformly and without bias at a predetermined thickness. In this way, the occurrence of defective products due to the bias of the molding resin R on the film F can be prevented.

Here, the dispenser 312 of the present embodiment has an injection molding tree in each of the two rows of resin insertion holes 400 a and 400 b of the conveyer 400. Two nozzles 312d for fat. In one example, one injection port 312d is provided at a position corresponding to the right resin input hole 400a, and the other injection port 312d is provided at a position corresponding to the left resin input hole 400b. In other words, the distance between the centers of the two nozzles 312d and the distance between the centers of the resin insertion holes 400a and 400b are the same. In this way, the molding resin R can be injected while passing through the same corresponding positions of the respective resin input holes 400a and 400b at the same time, so the molding resin R can be filled in two films by a path with the shortest distance and time. F on. Therefore, the process time can be shortened significantly. In addition, it is also possible to provide a configuration in which a molding resin R (not shown) is sequentially laminated on the two films F by a predetermined path, as a modification.

Next, a resin heater 314 is provided, which is heated from the upper side of the conveyer 400 holding the film F on which the molded resin R is mounted, and the molded resin R is heated. In addition, the configuration of the heating conveyor 400 (molded resin R) is such that a well-known heating mechanism (for example, a heating wire heater, an infrared heater, etc.) (not shown) is disposed below the resin heater 314. In this way, the mold resin R held in the state of being mounted on the two sheets of film F can be simultaneously heated by the carrier 400.

Here, the resin heater 314 of the present embodiment is arranged on the moving path of the resin dropping table 310, and more specifically, moves from a position directly below the nozzle 312d of the dispenser 312 to a third holding section described later. 212A is in the middle of the path between the positions held by the conveyor 400. In this way, immediately after the molding resin R is fed into the film F held by the carrier 400 through the nozzle 312d of the dispenser 312, the process of heating the molding resin R is performed. Therefore, especially in the use of granular, powder When a resin such as a pellet is used as the molding resin R, it can be heated immediately after being mounted on the film F, and the powdery resin on the surface can be heated and melted to integrate it. In this way, generation of dust (fine powder of resin, etc.) can be prevented, and malfunction or product failure due to the diffusion of dust in the device can be prevented.

In addition, the resin heater 314 may be provided with a resin supply measuring device 315 at the front and rear positions so that the appearance of the molded resin R supplied to the film F can be measured in the resin input holes 400a and 400b. The supply resin checker 315 can be provided with a camera (single-eye camera or compound-eye camera) above the moving path of the resin dropping stage 310, and the output value or captured image of these devices can be used to record the molding resin R dropped. Thickness or shape. With this configuration, for example, by correlating the molding thickness of the molded product Wp with actual information and storing the data, the operator can compare these data and select the conditions for dropping the molding resin R. In this way, the tracerablity of the supply of the molding resin R can be ensured to maintain the molding quality.

Next, the second loader 212 operating in cooperation with each mechanism of the sorting unit 100C includes a third holding unit 212A. The third holding portion 212A is a conveying device that receives the conveyer 400 placed on the resin dropping table 310 underneath, and conveys the lower holding position of the mold 206, and releases the holding of the film F and the molded resin R. 400 is transferred onto the preparation table 302. In addition, the third holding unit 212A has a known holding mechanism (for example, a structure having a holding claw 俾 for holding, a structure having an adsorption hole 连通 communicating with an adsorption device for holding, and the like) as a carrier for holding the carrier 400. Holding section 212a. Furthermore, it has a second adsorption hole 212b is disposed at a position communicating with the first suction hole 400c of the conveyer 400 held at a predetermined position, thereby generating (transmitting) the suction force provided by the suction device (not shown). With this configuration, the two films F (in a state in which the molding resin R is mounted) can be aligned and adsorbed under the conveyer 400 in the left-right direction while being maintained, and can be maintained at a predetermined holding position facing the lower mold 206 (arranged). There is a die nest 208) for transportation. In addition, a third holding portion 212A having a holding claw for holding and holding the outer periphery of the two sheets of film F on the lower surface of the conveyer 400 may be prepared.

Here, the second loader 212 including the third holding portion 212A of this embodiment is configured to be movable in the front-back, left-right, and up-down directions. By moving in the left-right direction, it is possible to carry out the operation of conveying the conveyer 400 (in a state in which the two films F of the molded resin R are each mounted) from the dispensing unit 100C to the pressing unit 100B. In addition, by moving in the front-rear direction, it is possible to carry out the conveyer 400 (in a state in which the two sheets of the film F on which the molding resin R is mounted) are kept from the outside to the inside of the molding die 202 (that is, toward the mold opening). Between the upper die 204 and the lower die 206).

In addition, by moving in the up-down direction (the front-back or left-right movement may be combined), it is possible to carry the carrier 400 placed on the resin dropping table 310 (holding each of the molded resin R State of the two thin films F). In this case, the holding of the conveyer 400 at the predetermined holding position of the lower die 206 (the position where the die nest 208 is provided) can be performed while the holding of the two sheets of the film F respectively equipped with the molding resin R is released, and ( One-to-one) operation of placing on two mold sockets 208A, 208B (including a part of the mold surface 206a). Moreover, also The operation of placing the transporter 400 in which the holding of the film F and the molding resin R is released on the aforementioned preparation table 302 can be performed. In addition, as a modification example, a configuration (not shown) in which a part of the moving range of the third holding portion 212A is replaced by the movement of another mechanism (the resin dropping table 310, the lower mold 206, etc.) may be considered.

Next, the second loader 212 includes a fourth holding portion 212B, which is a film remaining on the lower mold 206 after the molded product Wp obtained by the resin molding is removed from the molding mold 202 (here, the upper mold 204). The (used film) Fd is transported to a predetermined position (film disposer 316 described later). In addition, the fourth holding portion 212B has a known holding mechanism (for example, a structure having an adsorption hole communicating with the adsorption device to perform adsorption), as a carry-out film holding portion that holds the used film Fd (reference numerals 212c and 212d in the figure). ).

In addition, the fourth holding portion 212B of the present embodiment is configured such that two positions corresponding to the two die pockets 208A and 208B of the carrying-out film holding portions 212c and 212d and the molding die 202 (lower die 206) are arranged side by side in the left-right direction. The composition of the columns. In other words, the film F can be held in parallel with its longitudinal direction aligned. In this way, after the resin molding, the two used films Fd aligned in the left-right direction can be aligned and held in the left-right direction and transported by the mold 202 (lower mold 206) for molding.

Here, in the present embodiment, the fourth holding portion 212B and the third holding portion 212A described above are integrally configured as the second loader 212. In one example, the second loader 212 is provided with a third holding portion 212A having a conveyer holding portion 212a on the front side, and a fourth holding portion 212A with two left and right rows of film holding portions 212c and 212d on the rear side. Holding section 212B. Therefore, the 3rd holding part 212A and the 4th holding part 212B are provided as a structure which can be moved integrally as a 2nd loader 212 to a front-back, left-right, and up-down direction. In this way, not only the device configuration can be simplified and miniaturized, but also the film F and the used film Fd on which the molding resin R is mounted can be conveyed simultaneously, and the process time can be shortened.

In addition, as a modification, it is also possible to consider that the loader including the fourth holding portion 212B and the loader including the third holding portion 212A are configured as separate pieces (not shown). In this case, what is necessary is just to be comprised so that it can move similarly to the said 3rd holding part 212A.

Next, the sorting unit 100C is provided with a film residue processor 316 for storing the used film Fd transferred by the fourth holding section 212B. In one example, the film residue processor 316 is formed in a box shape having an opening (an upper portion). With this configuration, when the fourth holding portion 212B carrying the used film Fd reaches a position directly above the film residue processor 316, the conveying operation of the fourth holding portion 212B is stopped, and the used film Fd can be released by Keep the used film Fd down and store it in the film residue processor 316.

As described above, according to the configuration of this embodiment, an apparatus that efficiently supplies two narrow strip-shaped workpieces W and takes out two molded products Wp after (resin molding) processing is performed. In particular, when two mold sockets 208A and 208B are provided in one lower mold, and two workpieces W are collectively disposed for resin molding, it is possible to maintain the state where the two films F respectively carry the molding resin R while maintaining the state It is conveyed to the die sockets 208A and 208B of the lower die 206. Therefore, compared with conventional devices, While suppressing the complication of process or device structure, the productivity is greatly improved. In addition, compared with a configuration in which two die sockets 208A and 208B are provided in one lower die 206, two workpieces W are arranged, and one piece (sheet) of film F covers all, a reduction in the amount of film used can also be achieved .

In addition, since the film stage 308 for supplying the film F and the resin dropping stage 310 for supplying the molding resin R can be separately formed and processed in parallel, compared with the conventional device, Can shorten the process time.

As described above, as a modified example of the resin molding apparatus 1 described above, a compression molding method for forming a molded article by forming a mold cavity in a lower mold and arranging a workpiece W for resin molding may be adopted. Resin molding device 2 (see FIG. 28). In this case, a film having a wider width than the film F made of the above-mentioned strip-shaped film can be used as the configuration of the film F. Moreover, it is very simple to use a square or rectangular monolithic film F having a wider width than the narrow strip film as the wide film. However, as the wide film, as long as the width is larger than that of the narrow strip film, a single sheet film F cut into a circle may be used. In this case, the configuration of the distribution unit 500C as described below may be considered instead of the distribution unit 100C.

In one example, the material distribution unit 500C may be configured to replace the two rows of the conveyance device 400 into the film holding sections 400A and 400B and replace the large-sized carrying film holding section 516 that holds one film F (wide film). can. In addition, as long as the two rows of carrying-out film holding portions 212c and 212d are configured to be capable of adsorbing and holding both the used film Fd of two narrow strip films or the used film Fd of one wide film, that is, can.

In this way, regarding the configuration in which the narrow strip film and the wide width film can be switched, for example, the third holding portion 212A may be configured to have two types of conveyers 400 for narrow strip and wide width. The structure of the carrier holding part 212a. The first conveyer 400 held by the conveyer holding section 212a has two rows of the film holding sections 400A so that the two films F belonging to the strip-shaped film can be aligned and held in parallel in the longitudinal direction. A strip-shaped film carrier 400 of 400B. As the second transporter 400 held by the transporter holding section 212a, consideration can be given to the common use of the transporter holding section 212a of the transporter 400 having one of the transporting film 400 holding the film F belonging to one wide film into the film holding section 516. Make up.

With such a configuration, since the workpiece W to be processed into the molded product Wp belongs to any one of the narrow-shaped workpiece and the wide-shaped workpiece W, the different conveyor 400 is held by the common conveyor holding unit 212a. Since the film F is carried in together with the mold resin R, it can be set as the structure which can supply the film F with simple switching.

In addition, regarding the configuration in which the narrow strip film and the wide film can be switched, the fourth holding portion 212B can be provided so that the long sides of the used film Fd belonging to the two narrow strip films are parallel to each other. The two narrow stripe areas that are aligned and held in the left-right direction and the area that overlaps the wide area that holds a used film Fd belonging to a wide film are provided with a plurality of adsorption sections that are configured to adsorb and hold the used film Fd. The structure of carrying out the film holding parts 212c and 212d. In this case, for example, because the positions to be adsorbed overlap, the same used film Fd, which is a thin strip film for a narrow strip workpiece, or used film Fd, which is a wide film, may be the same. The adsorption section is held by adsorption.

According to such a configuration, whether the used film Fd belonging to the narrow film or the used film Fd belonging to the wide film is adsorbed and held, the used film Fd can be held at a position where the used film Fd can be held. The adsorption unit is arranged, and the used film Fd of any of the narrow strip film and the wide film can be carried out without replacement of the structure or the like.

In addition, the plane arrangement of the material distribution unit 500C may be an arrangement in which the film stage 308 and the resin dropping stage 310 are replaced, instead of the structure shown in FIGS. 1 and 8. In this case, the preparation table 302 is also moved to the side of the device by cooperating with this replacement, and the brushes for setting or cleaning the conveyer 400 can be accessed from the side of the device, making these replacement operations easier.

(Resin molding operation)

Next, the resin molding operation using the resin molding apparatus 1 according to the embodiment of the present invention will be described with reference to FIGS. 5 to 27 while focusing on the operations of the pressing unit 100B and the dispensing unit 100C.

First, the conveyer 400 which has been cleaned on the preparation table 302 is held by the conveyer picker 304 (in a state where the film F and the molding resin R are not held), and is conveyed onto the film table 308 as shown in FIG. 11. In this case, the conveyance tool 400 can be conveyed in the state hold | maintained by the holding claw of the conveyance tool picker 304. On the other hand, the two films F sent from the two film rolls 306A and 306B are respectively cut into narrow strips of a predetermined length and held on a film table 308.

Next, as shown in FIG. 12, by moving (falling) the conveyer picker 304 downward, the lower surface of the conveyer 400 is brought into contact with the two films F on the film table 308.

Next, as shown in FIG. 13, the first suction hole 400c of the conveyer 400 is attracted via the conveyer picker 304, and the two films F are adsorbed and held below the conveyer 400, so that the conveyer picker is made. 304 moves upward (up).

Then, as shown in FIG. 14, by moving the transporter picker 304 to the side (right side), the transporter 400 (in a state where the two films F are held) held by the transporter picker 304 is dropped onto the resin. Transported on stage 310.

Next, as shown in FIG. 15, by moving (falling) the transporter picker 304 downward, the two films F under the transporter 400 abut on the resin dropping table 310. In this state, the holding mechanism of the carrier picker 304 is released (stopped) from the holding of the carrier 400, and the carrier 400 (in a state where the two films F are held) is placed on the resin dropping table 310. With this operation, the transporter picker 304 holds the transporter 400 in a state where the film F is held on the lower side, and the series of operations of transporting from the film table 308 to the resin dropping table 310 is completed.

Next, by moving the resin dropping table 310 to the side (right side), as shown in FIG. 16, the carrier 400 (the state where the two films F are held) placed on the resin dropping table 310 can be distributed toward The nozzle 312d of the device 312 is conveyed at a position directly below the nozzle 312d.

Then, as shown in FIG. 17, using two nozzles 312 d, the molding resin R is introduced into the two rows of resin insertion holes 400 a, At the same time, the inner side of 400b is put in. At this time, since the thickness of the workpiece W can be measured in advance, the amount of the molding resin R supplied into each of the resin insertion holes 400a and 400b can be adjusted, so that the amount of the molding resin R supplied to the mold cavity 208 can be maximized. Optimization. For example, the molding resin R dropped from the two nozzles 312d is measured in advance on the dispenser 312 side, and when the predetermined amount of molding resin corresponding to one of the nozzles 312d has been dropped, the molding resin is stopped. When R is dropped, the other party continues to drop until a predetermined amount of molding resin has been dropped.

When the molding resin R is dropped from the two nozzles 312d, the resin dropping table 310 on which the transfer tool 400 is mounted is moved in an arbitrary pattern. With this operation, it is possible to supply the molded resin R into a corresponding pattern (a pattern in which the aforementioned arbitrary pattern is rotated by 180 degrees) in each of the resin insertion holes 400a and 400b. Here, by moving the resin dropping table 310 in a gap-free mode, the molding resin R can be separately filled on the two films F with a predetermined thickness uniformly and without bias. For example, the resin dropping stage 310 is moved along a pattern formed by connecting straight lines near the ends of a straight line that divides the resin dropping holes 400a and 400b in the vertical or horizontal direction by n divisions (n is an integer of 2 or more). That is, the entire molding resin R can be supplied uniformly in the resin insertion holes 400a and 400b. In addition, the "straight line" referred to here does not have to be evenly spaced, and may be bent halfway.

Next, by moving the resin dropping table 310 forward, as shown in FIG. 18, the conveyer 400 placed on the resin dropping table 310 can be transferred while passing through the position directly below the resin heater 314. With this operation, the molding tree held on the film F in the state of the carrier 400 Heating of the lipid R can be performed. Then, by moving the resin dropping table 310 forward, as shown in FIG. 19, the carrier 400 placed on the resin dropping table 310 can be moved to a predetermined position (the holding of the carrier 400 by the third holding section 212A) Location).

Next, from the state shown in FIG. 19, by moving (lowering) the third holding portion 212A downward, the lower surface of the third holding portion 212A comes into contact with the conveyer 400 on the resin dropping table 310. Then, the third holding portion 212A holds the transporter 400 with the holding claw. Then, the first suction hole 400c of the conveyor 400 is caused to generate an adsorption force via the third holding portion 212A, and the two films F are adsorbed to the lower surface of the conveyor 400. While maintaining this state, the transporter 400 is held by the third holding portion 212A, and as shown in FIG. 20, the third holding portion 212A and the transporting device 400 are moved (raised) upward.

Next, by moving the second loader 212, as shown in FIG. 21, the conveyer 400 held by the third holding portion 212A is moved from the outside to the inside of the molding die 202 (that is, upward in the opened state). Between the die 204 and the lower die 206). On the other hand, before the transfer tool 400 is transferred to the molding die 202, the two workpieces W held in the first holding section 210A of the first loader 210 are first transferred into the upper die 204. At this time, first, the first loader 210 is retracted (entered) to the inside of the mold, and the second holding portion 210B is first resin-molded, and then receives the molded product Wp from the upper mold 204 (see FIG. 5). Next, the first loader 210 advances inside the mold for molding, and the two workpieces W held in the holding portion 210A are delivered to the upper mold 204. With this operation, as shown in FIG. 21, the two workpieces W that have been carried in by the first holding section 210A are secured. While being held in the upper mold 204, the workpiece W has been sufficiently heated before being transported by the carrier 400.

Before the transfer tool 400 is transferred to the molding die 202, the used film Fd is held by the fourth holding portion 212B of the second loader 212 and is carried out from the lower die 206. At this time, first, the second loader 212 is retracted (entered) into the inside of the mold for molding, and the fourth holding part 212B is used to absorb and receive the used material which was previously used in the resin molding and held in the lower mold 206. Through the film Fd (see FIG. 6). In this way, the transfer mold 400 can be carried into the mold 202 for molding.

Next, as shown in FIG. 22, by moving (lowering) the third holding portion 212A downward, the two films F (in a state where the molding resin R is mounted) under the conveyer 400 abut on the lower mold 206. At this time, each film F (the part on which the molding resin R is mounted) is housed and placed in the mold pockets 208A and 208B.

Next, the suction force of the first suction hole 400c of the transporter 400 generated through the third holding section 212A is stopped, and the holding of the two films F (in a state where the molding resin R is mounted) is released from the transporter 400. At this time, the outer edge portion of each film F is placed on the mold surface 206a outside the mold sockets 208A and 208B so as to be attached to one end portion of the suction path 230b. Here, the film F is sucked from the suction path 230b, and the film F is sucked and held on the mold surface 206a outside the die cavity 208. Then, the film F is sucked through the suction path 230a, and as shown in FIG. 23, the film F is adsorbed on the mold surface 206a and held on the inner surface of the mold cavity 208 (mold surface of the mold cavity recessed portion 209). With this operation, the molding resin R is supplied into the cavity 208 (on the cavity recess 209) through the film F.

Next, as shown in FIG. 24, the conveyance tool 400 is taken out by moving the 3rd holding part 212A. At this time, the conveyer 400 (in a state where the film F and the molding resin R are not held) held in the third holding portion 212A is moved from the inside of the molding die 202 to the outside (that is, from the top of the opened state). The mold 204 and the lower mold 206 are taken out to the outside, and transferred to the preparation table 302. Here, the transfer tool 400 can be cleaned and reused.

Then, as shown in FIG. 25, the mold 202 is closed, and the two workpieces W are clamped by the upper mold 204 and the lower mold 206.

Next, as shown in FIG. 26, by relatively raising the die nest pieces 226A, 226B of each die nest 208A, 208B, the two workpieces W can be thermally hardened by being heated and pressurized by the molding resin R, and at the same time, Resin molding (compression molding) is performed. With this operation, two molded products Wp can be produced.

Next, as shown in FIG. 27, the mold 202 for mold opening is performed. At this time, the molded product Wp and the used film Fd are separated, and the two molded products Wp are held in the upper mold 204, and the two used films Fd are held in the lower mold 206. In this state, as described above, the through-molded product Wp and the used film Fd are taken out and transported separately, and one set of molding operations is completed.

In addition, regarding the above-mentioned molding operation, in order to make the operation more efficient, it is preferable to use a plurality of conveyers 400 to perform the processes in parallel at the same time. In this case, it is preferable that the inside of the resin molding apparatus 1 is provided with a plurality of conveyance tools 400 and the conveyance tools 400 are circulated in each of the processes described above. That is, as long as: the cleaning process of cleaning the conveyer 400 at the preparation table 302, The film setting process, the resin casting process of dropping the molding resin R onto the conveyor 400 that has been combined with the film F, and the resin supplying process of supplying the film F and the molding resin R to the molding die 202, so that a plurality of For the manner in which the conveyer 400 performs processing in different processes, the resin molding apparatus 1 may control a control unit (not shown) that controls the operation of each unit.

In this way, the waiting time of the carrier 400 in each process can be shortened, and productivity can be improved. For example, by making the process of supplying the molding resin R to the film F easy and time-consuming in general, and simultaneously with other processes, the process in the apparatus can be efficiently performed, and productivity can be improved.

In addition, the operation at the time of resin molding using the resin molding device 2 as a modification is basically the same as the operation at the time of resin molding using the resin molding device 1 described above. In this case, as long as the two workpieces W, the two films F (and the molded resin R mounted thereon), the two molded products Wp constitute the device configuration, etc., and the one workpiece W and the one film F (and the mounted film W) The molding resin R) and one molded product Wp may correspond.

As described above, according to the resin molding apparatus and the resin molding method of the present invention, it is possible to realize a structure in which the mechanisms for supplying, storing, measuring thickness, and conveying the workpiece and the molded product are arranged in a vertical direction in a vertical direction. . Therefore, compared with the conventional device, the installation area can be reduced.

In addition, it is possible to obtain a structure in which workpieces and molded products are processed and transported in two aligned states, and a structure in which two mold cavities are provided in a lower mold, and workpieces are disposed in each mold cavity and resin molding is performed simultaneously. Implementation. In this way, since two workpieces and a molded article, and a film and a molded resin can be transported simultaneously, and two workpieces can be resin-molded at the same time, compared with the conventional device, the process time can be greatly reduced. Moreover, the device configuration or manufacturing process can be simplified.

The present invention is not limited to the embodiments described above, and various changes can be made without departing from the scope of the present invention. In particular, although a resin molding apparatus of a compression molding method including a die cavity in the lower mold has been described as an example, it can also be applied to a configuration including a die cavity in the upper mold.

In addition, in the overall operation of the resin molding apparatus described above, it is also possible to perform resin molding sequentially while performing resin supply control described below to maintain the molding quality (uniformity of the molding thickness) during compression molding. Uniformity of important resin supply.

(Resin Supply Control)

Hereinafter, the configuration or operation for controlling the resin supply in this embodiment will be described in detail with reference to the drawings. FIG. 29 is a block diagram showing a control configuration example of a resin molding apparatus according to an embodiment of the present invention. The control unit CTR is constituted by a CPU or the like, and cooperates with each unit that controls the workpiece processing unit 100A or the dispensing unit 100C to perform supply control of the molding resin R. In addition, the control unit CTR performs display control of the display unit DIS for operator operation, receives input from the input unit INP, and reads or memorizes necessary information from the memory unit MEM.

FIG. 30 is a flowchart of an example of a resin supply operation of the resin molding apparatus according to the embodiment of the present invention. The actions described here correspond to a set of actions (a series of actions required for resin molding a workpiece W). 作). In addition, in the actual resin molding apparatus 1, each operation is performed on a plurality of workpieces W in parallel, and therefore, necessary portions of these series of operations are performed on a time axis that is locally repeated.

In the resin supply operation shown in this figure, first, the control unit CTR obtains the molding condition information Dc from the memory unit MEM (step S1). Here, the control unit CTR reads, as the molding condition information Dc, a mode in which, for example, the resin part molding thickness (target value) of the molded product Wp, or a pattern in which the molding resin R is dropped in the conveyer 400 is read from the memory MEM. Although the casting mode of the molded resin R is memorized in advance as the operation control mode of the resin dropping stage 310, it is not only the moving position of the resin dropping stage 310 that is formed by moving the target point, but also the resin dropping stage between the points. 310 movement speed. In addition, the dropping mode of the molding resin R also includes a speed (dropping amount per unit time) for dropping the molding resin R from the nozzle 312d.

On the other hand, the control unit CTR obtains the workpiece information Dw of the workpiece W to be resin-molded thereafter (step S2). Here, in the workpiece processing unit 100A, the code reader 115 reads the two-dimensional code attached to the workpiece W taken from the supply cassette 102 and outputs it to the control unit CTR, so that the control unit CTR obtains the respective workpiece W Work piece information Dw (for example, serial number, etc.). Next, the control unit CTR obtains the thickness information Dt (step S3). Here, the workpiece measuring device 114 measures the thickness of the workpiece W (as described above in detail), and outputs it to the control unit CTR, so that the control unit CTR obtains the thickness of the base material Wa or the electronic component Wb of each workpiece W. Thickness information Dt.

Next, the control unit CTR outputs the resin supply setting information Dd1 (step S4). Here, the control unit CTR calculates the slave distributor 312 The amount (weight) of the supplied molding resin R was dropped. In this operation, the electronic part Wb obtained by measuring the thickness of the workpiece W is subtracted from the volume of the mold cavity 208 at the time of molding from the thickness of the resin portion molding thickness and the shape of the mold cavity 208 (planar shape) as the target value. The volume obtained from the volume and the specific gravity of the molding resin R after molding (hardened state) were calculated. Then, the control unit CTR outputs the previously read casting mode of the molded resin R and the calculated value to the dispenser 312 as the resin supply setting information Dd1.

Then, the dispenser 312 drops the molded resin R into the resin insertion holes 400a and 400b on the film F according to the resin supply setting information Dd1. Here, in the dispenser 312, a predetermined amount of the molding resin R is measured by the weight 312b, and is sent out through the hopper 312c in a vibration manner, and is dropped from the nozzle 312d. In such a dropping operation of the molding resin R, it is often difficult to drop the molding resin R uniformly from the dispenser 312.

For example, in the hopper 312a of the dispenser 312 that stores the molding resin R, the particle sizes contained in the upper side and the lower side of the inside are likely to be different, and the particle size of the molding resin R may occur depending on the timing of dropping. Changing situation. In addition, when feeding by the vibrating feeder on the hopper 312c, the feeding speed is also different due to the particle size of the molding resin R. Therefore, even if it is desired to perform the dropping operation in the same dropping mode, it is difficult to actually drop the molded resin. Case of R homogenization. Therefore, in the dispenser 312, there is a case where the molding resin R cannot be dropped in accordance with the resin supply setting information Dd1 (the weight of the molding resin R supplied) output from the control unit CTR. At this point, the actual supply amount information Dd2, which is the amount (weight) of the molded resin R actually supplied, is output to the dispenser 312 to The control unit CTR and the control unit CTR can obtain the actual supply amount information Dd2 (step S5).

Next, the control unit CTR obtains the supplied resin shape information Dr (step S6). Here, the supply resin inspector 315 measures the appearance of the molded resin R that has been dropped onto the film F. For example, a camera serving as the resin supply inspector 315 captures the molded resin R mounted on the film F in the carrier 400 mounted on the resin dropping table 310, and outputs the captured image as the supply resin shape information Dr to Control section CTR.

Next, the control unit CTR obtains the molded product information Dp (step S7). Here, the thickness of the molded product Wp is measured with the molded product measuring device 118 about the molded product Wp obtained by resin molding using the molded resin R prepared as described above. Then, by outputting the measured value to the control unit CTR, the control unit CTR can obtain the molded product information Dp of the thickness (resin molded portion) of each molded product Wp.

Next, the control unit CTR will associate the plurality of pieces of information obtained in the above manner with the workpiece information Dw and store them in the memory MEM (step S8), as the acquisition information about the resin molding of one workpiece W. By storing the information obtained in this way in the memory section MEM, the operator can confirm the actual state of the resin molding in the DIS device of the display section, make necessary changes from the input section INP, or transmit it to the manufacturing plant. High-level system for quality management. In addition, only the above steps can be performed as a resin supply control to ensure the tracking ability.

In the case where further control is performed in the device, the control unit CTR uses the information obtained in the above manner to determine whether the resin supply is correct (step S9). Here, the control unit CTR compares, for example, the molding condition information Dc as the target thickness value of the resin portion and the molded product information Dp as the thickness of the (resin molded portion) of the molded product Wp. According to this method, if the difference between the target thickness and the actual thickness of the molded product Wp exceeds a predetermined value (allowable value), it can be determined that the resin supply is inappropriate.

Next, the control unit CTR adjusts the resin supply setting information Dd1 of the next workpiece W (step S10). Here, for example, when the weight of the molded resin R supplied from the dispenser 312 is calculated, the weight of the molded resin R to be supplied is a positive or negative value based on the difference between the target value and the thickness of the molded product Wp. When the correction value to be corrected is set to the opposite value, the forming thickness of the subsequent workpiece W can be brought closer to the target value.

As another example of the operation of step 9, the control unit CTR is, for example, the resin supply setting information Dd1 which is the weight of the molding resin R to be supplied, and the actual supply amount information Dd2 which is the amount (weight) of the molding resin actually supplied. compared to. According to this configuration, if the difference between the set value and the actual value exceeds a predetermined value (allowable value), it is determined that the resin supply is inappropriate. At this time, in step 10, the control unit CTR can increase or decrease the amount of the molding resin R that is measured and dropped by weight 312b in order to supply for the subsequent work W.

As another example of the operation of step 9, the control unit CTR determines whether the resin supply is appropriate based on the supplied resin shape information Dr of the captured image belonging to the molded resin R mounted on the film F, for example. Here, the captured image of the molding resin R is divided into predetermined Divide the area (n rows and m columns), compare the divided areas of the captured image, calculate the degree of deviation, and then determine whether the resin supply is appropriate based on the degree of deviation. For example, obtain the color or brightness distribution (the product of the depth of the color and the number of pixels) constituting the images of each divided area, and judge whether the resin supply is appropriate according to the degree of deviation of the resin drop amount represented by the color density of each divided area. .

For example, in the case of a black epoxy resin generally used for resin molding, the larger the amount of the molding resin R supplied into a predetermined area, the denser the molding resin R becomes, and the smaller the gap of the molding resin R becomes. In this case, since the film F (e.g., milky white) located under the molding resin R becomes difficult to shoot, the image is brought closer to the color (black) of the molding resin R. Therefore, for example, in a case where the molding resin R is biased, a section in which the film F is photographed frequently to lighten the color of the image and a section in which the film F is not photographed to darken the color of the image are mixed. In this way, when the depth of the image is significantly different in each section (when the deviation is large), it is determined that the resin supply is inappropriate. At this time, that is, in step 10, the instruction of the resin supply of the subsequent work W is adjusted. For example, the control unit CTR may drop more molding resin R in a divided area where the image becomes lighter, reduce the moving speed of the resin dropping table 310, or increase the dropping speed of the molding resin R from the nozzle 312d. On the other hand, the control unit CTR can reduce the molding resin R dropped in the image-divided area, so that the moving speed of the resin dropping table 310 can be increased, or the molding resin R can be dropped from the nozzle 312d. .

As described above, the control unit CTR adjusts the resin supply setting information Dd1 of the next workpiece W based on the acquired information, that is, The supply of the molding resin R, which is important for maintaining the quality of compression molding, can be made uniform.

In addition, although the above describes the characteristics of each unit of the molding device, it belongs to a unit that processes or processes a common workpiece, and the configuration or operation performed in any unit can be performed in the same manner in other units. Will not hinder. In addition, in this case, the functions of these units also have their respective functions in the unit, and belong to the invention that includes the unit as a single unit. For example, in a dispensing unit, a unit that combines a film and a conveyer to supply a molding resin may be prepared. Therefore, there may be cases where the preparation unit and the pressing unit are separately prepared and used to obtain the same effect.

In addition, the above has mainly described the example in which the two workpieces W belonging to the strip-shaped workpiece are transported and formed in the molding apparatus 1 in a state in which the longitudinal directions thereof are arranged in parallel. However, a configuration may also be adopted in which three workpieces W belonging to the strip-shaped workpiece are transported and formed in the molding apparatus 1 in a state in which the longitudinal directions thereof are arranged in parallel. In addition, in order to consider the convenience of mold replacement, although the workpieces W which belong to the narrow-shaped workpiece are transported and formed in the molding device 1 in a state of being arranged in parallel in the front-rear direction of the device, the main work is an example. Although described, it is also possible to adopt a configuration in which the workpieces W are transported and molded in the molding apparatus 1 in a state in which the workpieces W are aligned in parallel in the left-right direction of the apparatus. In this case, as long as the supply cassette lifter 103 or the storage cassette lifter 113 is disposed on the left side of the workpiece processing unit 100A, it is possible to efficiently transfer without rotating the workpiece W in the direction.

In addition, although the above description is an example of cutting and preparing a narrow or wide film F from a roll film for conveyance, the part of the invention of the aforementioned embodiment that does not involve the film F is not used during use. When the mold 202 for molding the film F is subjected to compression molding, it may be performed. In this case, a dedicated conveyer for conveying only the molding resin R is used. Furthermore, it is also possible to construct a dedicated conveyer that does not use the narrow strip or wide film F, but roll film is provided in the pressing units 100B and 500B to supply the film F, and only the molding resin R is conveyed. In this conveyer, the structure in which the molding resin R is accommodated can be opened and closed below, and the molding resin R can be conveyed in a closed state and supplied to the mold nest 208 in an opened state.

The above description is based on the premise that the mounting surface of the electronic component Wb of the base material Wa is reversed and then supplied into the device. However, it can also be provided that the resin W reverses the workpiece W before molding in the device. The composition of the turn. In this case, the molded product Wp or the storage box 112 may be reversed again after molding. Moreover, the unit of the workpiece W or the molded product Wp may be reversed, and the unit of the supply cassette 102 or the storage cassette 112 may be reversed. As a configuration for achieving this, for example, when transferring or transferring the workpiece W or the molded product Wp while holding or holding the outer periphery of the workpiece W or the molded product at a predetermined position, the workpiece W or the molded product Wp can be rotated parallel to the outer axis of the workpiece. It can be reversed by rotating it 180 degrees for the reference. According to such a configuration, the reversing operation performed before and after the front-to-back process (joining process or inspection process) in which the forming surface is faced up is unnecessary, so production can be prevented from being stopped due to work failure.

In addition, in the case where the work W or the molded product Wp is not reversed due to a work error, that is, when the work W is supplied in the wrong direction reversed from the intended direction, the operator may be alerted and corrected. For the right direction. In this case, when the workpiece measuring device 114 measures the thickness of the workpiece W, the mounting direction of a semiconductor wafer or the like can be detected as the thickness of the workpiece W.

Claims (16)

A resin molding apparatus is used for: a mold for molding; and a workpiece obtained by carrying an electronic component mounted on a base material to the aforementioned mold for molding and carrying out resin molding using the mold for molding The conveying section of the resin molding apparatus for resin-molding the workpiece includes a supply cassette lifter for lifting the supply cassette for storing the workpiece, and a storage cassette lifter disposed above and below the supply cassette lifter. Positions in different directions raise and lower the storage box for storing the molded product; a supply rail is arranged in front of the supply box elevator for loading the workpiece taken out from a predetermined position of the supply box; the storage track is loaded on one side The molded product is placed while passing through the storage box; a work measuring device is disposed below the supply rail, and measures the thickness of the work from the lower side of the work on the supply rail; and a picker, Holding the workpiece on the supply rail and carrying it to the carrying section; and storing a picker to hold the front part on the carrying section Molded product, and conveyed to the storage track, the feed track, the workpiece measuring device, and repeating the housing and the rail system is provided in the vertical direction. For example, the resin molding device of claim 1, wherein the supply rail is configured in two rows so that the two workpieces can be placed in the left-right direction, and the workpiece measuring device has two One or two thickness sensors for measuring the thickness of each of the foregoing workpieces with a predetermined scan. If the resin molding device of claim 1 or 2 further includes a workpiece heater for heating the workpiece from below, the workpiece heater is above the supply rail and can be held in the state of the supply picker. The above-mentioned workpiece is arranged to move forward and backward between a position outside the periphery and a position opposed to the lower side. The resin molding apparatus according to any one of claims 1 to 3, wherein the supply picker transports the workpiece in the left-right direction into the transport section, and the storage picker transports the molded product from the transport section in the left-right direction. The direction carrying system is set in parallel to the front-back direction. A resin molding apparatus belongs to a mold for molding using an upper mold for holding a workpiece having an electronic component mounted on a base material, and a lower mold formed with a recess for a mold cavity through which a mold resin is supplied through a film. A resin molding apparatus for resin-molding a workpiece and processing it into a molded article is characterized in that it is provided with a conveyer formed with a through hole corresponding to the shape of the recess of the die cavity, and belongs to holding the molded resin in the through hole. And a device to be transported together with the aforementioned film; The first station is for holding the film that is fed out from the film roll and cut to a predetermined length, so that the cut film is combined with the conveyer; and the second station is for holding the film in a state where the film is held on the lower side. A conveyer, which is configured to be movable; a conveyer picker, which holds the film conveyer in a state where the film is held on the lower side, and conveys the first film to the second film; and a dispenser, which molds the resin It is put into the inside of the said through-hole of the said conveyance tool mounted on the said 2nd stage. The resin molding apparatus according to claim 5, wherein the conveyance device has two rows of film holding portions so that the two pieces of the film can be aligned and held in the left-right direction, and each of the film holding portions has a correspondence with the respective films The resin insertion hole is used as the aforementioned through hole. The resin molding apparatus according to claim 5 or 6, wherein the first unit and the film roll are arranged in a stepwise manner in a vertical direction. The resin molding apparatus according to any one of claims 5 to 7, further comprising a resin heater that heats from the upper surface side of the conveyer in a state where the film and the molded resin are held. A resin molding device belongs to a resin molding device that uses a mold for molding with an upper mold and a lower mold to resin-mold a workpiece having electronic components mounted on a base material and process the molded product into a molded product. It is provided with a 1st conveying part provided with the 1st holding | maintenance part which hold | maintains the said workpiece | work, and the 2nd holding | maintenance which holds the said molded product obtained by resin molding. A holding portion that holds the workpiece to a predetermined holding position of the upper mold and transfers the molded product to a predetermined position outside the molding die; and a second transportation portion including a holding film and a molding resin below The third holding part of the conveyer and the fourth holding part holding the used film, the film and the molding resin are conveyed to a predetermined holding position of the lower mold, and the holding of the film and the molding resin is held The transporter whose state has been released is transported to a predetermined position outside the mold for molding, and the used film remaining in the lower mold in a state where the molded product obtained by resin molding is taken out is transferred to the aforementioned mold. Transported at a predetermined position outside the mold for molding. According to the resin molding device of claim 9, wherein the workpiece is a narrow strip-shaped workpiece, the film is a narrow strip-shaped film corresponding to the narrow strip-shaped workpiece, and the first holding portion is formed by The two main strip-shaped pieces can have two rows of workpiece holding portions so that the longitudinal direction of the narrow-shaped pieces are aligned and held in parallel. The second holding portion is obtained by processing the narrow-shaped pieces. Two of the aforementioned molded products have two rows of molded product holding portions arranged in such a manner that the longitudinal sides of the molded products are parallel to each other, and the transporter is configured so that the two strip-shaped films can make the strip-shaped films. The long-side direction is arranged in parallel so as to have two rows of carrying-in film holding portions, The third holding portion has a conveyer holding portion that holds the conveying device, and the fourth holding portion is arranged so that the used two pieces of the strip-shaped film can be aligned so that the longitudinal directions of the strip-shaped films are parallel to each other. The holding place has two rows of carrying-out film holding portions. If the resin molding device of claim 9, wherein the workpiece is a narrow strip-shaped workpiece, or a wide workpiece wider than the narrow-shaped workpiece, the film is a narrow strip corresponding to the narrow-shaped workpiece. The third holding portion has a conveyer holding portion as the conveying device, which can be used to make two pieces of the foregoing thin film to make the One narrow film conveyer having two rows of the film holding section arranged in parallel so that the longitudinal directions of the narrow film are parallel to each other, or the width of the single film holding section having a single film holding section for holding one sheet of the wide film is held in common. Web film conveyer. As described in the resin molding device of claim 11, wherein the first holding portion is provided with two rows of workpiece holding so that the two pieces of the strip-shaped workpiece can be aligned and held so that the long-side directions of the strip-shaped workpiece are parallel to each other. The structure of the part is replaceable with the structure of one work holding part that holds one of the wide workpieces. The second holding part is formed by two pieces of the molded product that can be obtained by processing the strip-shaped work. The structure in which the longitudinal directions of the molded products are aligned and held in parallel has a configuration including two rows of molded product holding portions, and a configuration with one molded product holding portion that holds one of the foregoing molded products obtained by processing the wide workpiece, so as to be replaceable. . For example, the resin molding apparatus of claim 11 or 12, wherein the film is a strip film having a strip shape corresponding to the strip-shaped workpiece, or a wide-width film wider than the strip film, The holding portion includes a thin film holding portion, which is formed by holding two narrow strips in which the two strips of thin film are aligned in parallel to the left and right directions of the long side of the thin film, and holding one of the wide film A plurality of adsorption portions that adsorb and hold the thin film are arranged in a region where the wide-area region is repeated. The resin molding device according to any one of claims 9 to 13, wherein the conveyance device is provided with a plurality of units, and the cleaning process of cleaning the conveyance device, the film setting process of combining the film with the conveyance device, The resin transfer process for dropping the molding resin by the transporter combined with the film, and processing the different processes of supplying the film to the molding mold and the resin supplying process for the molding resin are processed. The resin molding device according to any one of claims 9 to 14, wherein the transporter has a first suction hole that generates an adsorption force to hold the film, and the third holding portion has a state in which the transporter is held at a predetermined position by the transporter. The second suction hole is disposed at a position communicating with the first suction hole, and generates a second suction hole. A resin molding method, which is a resin molding method for resin molding using the resin molding apparatus of any one of claims 5 to 15, characterized in that: the aforementioned conveyer is provided with a plurality of sets; A cleaning process for cleaning the transporter, a process for setting the film assembly on the film of the transporter, a resin casting process for casting the molding resin on the transporter combined with the film, and supplying the mold for the molding Between the film and the resin supply process of the molded resin, the plurality of carriers are processed in different processes.