JP5544585B2 - Resin molding device and workpiece thickness measuring device - Google Patents

Description

  The present invention relates to a resin molding apparatus that resin molds an article on which a semiconductor chip is mounted on a substrate, and a work plate thickness measuring apparatus that is preferably used in the resin molding apparatus.

  In resin molding equipment that carries liquid resin, powdered / granular resin, or paste-like resin together with the molded product into a mold die provided in the press section and clamps it, the thickness of the substrate or semiconductor chip that is the molded product If there is a variation in the quality, the quality of the molded product will vary. In order to eliminate such problems, the thickness of the substrate is determined by irradiating laser light from a pair of sensors arranged in advance so as to sandwich the molded product between the supply unit and the press unit of the molded product in the thickness direction. A resin molding apparatus for measuring the thickness was proposed (see Patent Document 1).

JP 2006-315184 A

However, the quality of the molded product may vary depending on the thickness of the substrate and individual differences between the semiconductor chips mounted on the substrate. A resin molding apparatus that adjusts the thickness of a molded product according to the variation in the thickness of the substrate and the thickness of the semiconductor chip mounted on the substrate has not been proposed.
In addition, when the thickness of the package portion is reduced, the amount of resin may vary depending on the height of the semiconductor chip occupying the volume of the cavity and the clamping position depending on the thickness of the substrate, which may cause variations in molding quality.

  The present invention solves the above-mentioned problems of the prior art, and measures the molding quality by adjusting the cavity volume by accurately measuring the total thickness of the semiconductor chip area and the board area of the substrate area prior to resin molding. It is providing the workpiece plate thickness measuring apparatus used suitably for this resin mold apparatus.

The present invention has the following configuration in order to achieve the above object.
A supply unit that supplies a molded product on which a semiconductor element is mounted on a substrate to face a supply stage, a press unit in which the molded product supplied to the supply stage is carried by a loader and is resin-molded, and the supply unit A thickness measurement unit that measures the thickness of the molded product while being conveyed from the machine to the press unit, and a control unit that controls the operation of each part of the apparatus, and the thickness measurement unit receives the load from the loader. Corresponding to the product to be molded on the transport plate that transports the molded product while being transferred and held, an XY scanning mechanism that can scan the transport plate in the XY direction, and a transport path of the transport plate And a first measuring device and a second measuring device for measuring a total thickness of the semiconductor chip area and a board thickness of the substrate area, and a through hole is formed in the transport plate so as to overlap a holding position of the molded product. Towards the inside of the hole And workpiece support that protrusions are formed at a plurality of locations Te, that the molded article by the suction hole provided in the distal end portion of the workpiece support is held by suction while the outer peripheral edge portion is exposed from the through hole Features.

The substrate into the through-hole peripheral portion that is puncture hole in carrier plate are held by suction, first, the of the molded article chip mounting using a second laser displacement gauge shifted arranged in the conveying direction of the conveying plate Thickness is measured by irradiating both the surface and the substrate surface exposed through the through hole with laser light to measure reflected light.

  When the transport plate is moved forward, the first and second laser displacement meters are folded in the semiconductor chip areas of a plurality of molded products while the transport plate is scanned in the XY direction by the XY scanning mechanism. The total thickness is simultaneously measured at a common measurement point corresponding to the XY direction in each semiconductor chip area for each molded product along a continuous locus.

  In the substrate area formed around the semiconductor chip areas of a plurality of molded products while scanning the transport plate in the XY direction by the XY scanning mechanism when the transport plate is moved backward and forward. The plate thickness is measured alternately by the first laser displacement meter and the second laser displacement meter along a trajectory that continues in a zigzag manner.

  Prior to measuring the thickness of the molded product, the Z-axis direction block gauge and the X-axis-Y-axis direction block gauge are sequentially mounted on the transport plate, and the optical axes of the first and second laser displacement meters are aligned. It is characterized by.

  The thickness measuring unit is characterized in that the measurement is performed before preheating the pre-heated product.

  The control unit adjusts the amount of movement of the cavity insert that defines the cavity depth required for the resin mold in the press unit from the measurement results of the first and second measuring devices, or supplies the adjusted amount to the press unit. The resin amount of the liquid resin is adjusted.

In the workpiece thickness measuring apparatus, a conveyance plate that conveys the workpiece while holding the workpiece, an XY scanning mechanism that can scan the conveyance plate in the XY direction, and the workpiece on the conveyance path of the conveyance plate. And a plurality of measuring devices that respectively measure the thicknesses of different measurement areas of the workpiece, and the conveying plate has through holes that overlap the holding position of the molded product, and the through holes Work support parts protruding toward the inside of the hole are formed at a plurality of locations, and the object to be molded is sucked and held at the outer peripheral edge while being exposed from the through hole by the suction hole provided at the tip of each work support part. It is characterized by being.

  The workpiece is provided with first and second measuring devices that respectively measure the thickness of the semiconductor chip area and the substrate area of the workpiece in which the semiconductor chip is mounted on the substrate.

  If the above resin mold equipment is used, the semiconductor chip transferred from the loader is transported by the transport plate while holding the molded product mounted on the substrate, and the thickness measuring part corresponds to the molded product on the transport path of the transport plate The total thickness of the substrate including the semiconductor chip is measured by the first and second measuring devices arranged in this manner, and the thickness of only the substrate is measured. Thereby, not only the thickness of the substrate but also the thickness of the semiconductor chip can be accurately measured.

In addition, if through holes are formed in the holding position of the molded product and the substrate is sucked and held at the periphery of the through hole, the substrate is sucked and held even if the transport plate is scanned in the XY direction. Therefore, it is difficult to be affected by vibration, and the measurement accuracy can be improved. Further, the first and second laser displacement meters shifted in the transport direction of the transport plate are used to irradiate both sides of the semiconductor chip areas of a plurality of molded products through the through holes, and simultaneously measure the total thickness. Therefore, it is possible to efficiently measure the total thickness of each semiconductor chip area by a single conveying operation of a plurality of molded articles by the conveying plate.
In addition, it is possible to accurately measure the thickness of the substrate area by irradiating both sides of the substrate area with laser light through the through holes using the first and second laser displacement meters and measuring the reflected light. From this substrate thickness information, it is possible to accurately control the substrate clamp position of the mold in the press section.

  Further, when the transport plate is moved forward, the first and second laser displacement meters are folded in the semiconductor chip area of a plurality of molded products while scanning the transport plate in the XY direction by an XY scanning mechanism. Since the total thickness is measured simultaneously at a common measurement point corresponding to the XY direction in each semiconductor chip area for each molded product along a continuous track, for one or a plurality of molded products, The total thickness can be measured efficiently and with high accuracy in each semiconductor chip area provided in a plurality of molded articles by one transport operation of the transport plate.

  Further, when the transport plate is moved backward and forward, a substrate area formed around the semiconductor chip areas of a plurality of molded products while scanning the transport plate in the XY direction by an XY scanning mechanism. Since the plate thickness is measured alternately by the first laser displacement meter and the two laser displacement meter along a trajectory that continues in a zigzag pattern, the first shift plate is shifted in the transport direction (Y-axis direction) of the transport plate. Even if the laser displacement meter and the second laser displacement meter are used, the plate thickness in the substrate area can be measured with high accuracy for a plurality of molded articles.

  Prior to measuring the thickness of the molded product, the Z-axis direction block gauge and the X-axis-Y-axis direction block gauge are sequentially mounted on the transport plate to align the optical axes of the first and second laser displacement meters. Therefore, the optical axes of the pair of upper and lower laser beams by the first and second laser displacement meters can be aligned with high accuracy, and the measurement accuracy can be improved.

  In addition, since the thickness measurement unit performs measurement before preheating the product to be preheated, the thickness measurement unit accurately measures the total thickness of the product and the board thickness at a stage where there is little influence of expansion due to heat. Can do.

  In addition, the control unit can adjust the cavity volume by adjusting the amount of movement of the cavity insert necessary for the resin mold in the press unit from the measurement result, and can maintain the molding quality at a high quality. Moreover, when supplying liquid resin to a press part, the control part can reduce the resin amount which overflows by adjusting the resin amount of liquid resin from a measurement result. Therefore, the press part can be easily adjusted even if the type of the molded product is switched.

  In addition, the work plate thickness adjustment device is not limited to the resin molding process, and the work accuracy is improved by measuring the thickness of the work area with high precision while conveying the work and reflecting it in the machining data of the subsequent machining process. improves.

It is a plane layout figure which shows the example of whole structure of the resin mold apparatus. It is a top view which shows the structural example of a thickness measurement part. It is a top view of the state which mounted and removed the conveyance plate on the conveyance table. It is explanatory drawing which shows the thickness measurement path | route and measurement point of a to-be-molded product by a thickness measurement part. It is explanatory drawing of the structural example which shows the origin alignment of a Z direction and an XY direction with a laser displacement meter. It is a side view which shows arrangement | positioning of a thickness measurement part. It is a top view which shows the arrangement configuration of the upper side laser displacement meter and lower side laser displacement meter of a thickness measurement part. It is a state figure showing measurement operation of a thickness measurement part. It is explanatory drawing which shows a peninsula body element area and the measurement line of a board | substrate area. It is a state figure which shows the origin alignment of a Z direction and an XY direction with a laser displacement meter. It is explanatory drawing which shows the measurement path | route and measurement point in the case of measuring with one laser displacement meter. It is sectional drawing which looked at the resin mold metal mold | die from the width direction (apparatus front side) of the lower mold | type insert block. It is sectional drawing of the resin mold metal mold | die of the state which clamped the to-be-molded product, and the state which filled the cavity with sealing resin.

  Hereinafter, a preferred embodiment of a resin mold device according to the present invention will be described in detail with reference to the accompanying drawings. In the following embodiments, description will be made using a transfer molding apparatus using a mold die in which a cavity recess is formed on the upper mold side and a pot is formed on the lower mold side. In the transfer molding apparatus, the lower mold is described as a movable mold and the upper mold is described as a fixed mold.

(Overall configuration of resin molding equipment)
FIG. 1 shows a planar arrangement of each part of an embodiment of a resin molding apparatus according to the present invention. The resin mold apparatus of the present embodiment includes a molded product supply unit A, a molded product thickness measuring unit B, a molded product press unit C, a molded product storage unit D and a transport mechanism E after resin molding. Prepare. Further, a preheating part F is provided between the thickness measurement part B and the press part C. Further, a dummy module part G used as a maintenance area of a mold drive mechanism 16a described later is provided between the press part C and the preheating part F and between the press part C and the storage part D. The configuration of each part will be specifically described below.

(Molded product supply section A)
The supply part A for the molded product includes a supply stocker 3 provided with a plurality of supply magazines 2 containing the molded product 1 formed in a strip shape, a pusher 4 for projecting the molded product 1 from the supply magazine 2, and a pusher 4 And a turntable 5 for rearranging the moldings 1 that are projected by the above. On the back side of the turntable 5, a supply stage (set stand) 6 for setting a pair of molded articles 1 arranged facing each other in a state of holding the mutual arrangement position is arranged. On the side of the supply stage 6, there is provided a resin tablet supply unit 8 for supplying the resin tablet 7 in accordance with a planar arrangement of a pot of a mold to be described later.

  In the resin molding apparatus of the present embodiment, as the molded product 1 that is the object of resin molding, for example, a plurality of semiconductor chips 1a are mounted on a resin substrate 1b formed in a strip shape (FIG. 4A). reference). The semiconductor chip 1a may be mounted on the substrate 1b in one or more stages. The semiconductor chip is resin-molded for each cavity formed in block units. Alternatively, it may be a product in which a plurality of semiconductor chips are accommodated in one cavity and resin-molded, or a product that is resin-molded by being accommodated in a cavity formed individually according to the semiconductor chip.

(Thickness measurement part B)
The thickness measuring unit B of the molded product 1 measures the thickness of the molded product 1 while being conveyed from the supply unit A to the press unit C. Specifically, as shown in FIG. 2, a transport plate 9 that transports the molded product 1 while being transferred and held from a loader 25, and an XY scanning mechanism that can scan the transport plate 9 in the XY direction. 10 and a measuring device 11 that is disposed below the conveying path of the conveying plate 9 corresponding to the molded product 1 and measures the total thickness of the substrate including the semiconductor chip and the thickness of only the substrate.

(Preheat part F)
The molded product 1 in which the thickness of the molded product 1 is measured in the thickness measuring unit B is supported in the transfer unit 12 by the pick-and-place 12a, which will be described later, from the transport plate 9 to the transport mechanism. Is transferred to the heater block 13. The heater block 13 is transferred from the receiving position to the delivery position to the loader 25 by a transfer mechanism which will be described later while the molding 1 is placed. The heater block 13 is intensively preheated by stopping for a predetermined time at the tunnel cover 14 provided in the middle of the transfer path, and is transported to a delivery position where the loader 25 stands by.

(Press part C)
The press part C is provided with a press device 15 to which a mold die for clamping the molded product 1 and resin molding is mounted. The pressing device 15 includes, for example, a pressing mechanism that pushes the lower mold in the mold opening / closing direction, and a transfer mechanism that fills the cavity with resin melted in the pot of the mold. The press mechanism and transfer mechanism in the press apparatus 15 are the same as the mechanism of the press part used in the well-known resin mold apparatus. The resin mold apparatus according to the present embodiment is characterized by an upper mold cavity insert (cavity) based on the measurement result in the thickness measurement unit F of the molded product described above when the molded product 1 is resin molded. The amount of movement of the insert block (which defines the depth) is controlled. The press device 15 includes, for example, a mold drive mechanism 16a that pushes the upper insert member in the mold opening / closing direction, a mold drive mechanism 16b that pushes the lower insert member in the mold opening / closing direction, and a cavity insert clamp. There is provided a film supply mechanism 17 that repeatedly feeds and winds a long release film covering the surface between reels. The mold mold may have a cavity formed in the lower mold.

  The release film is sucked and held on the upper mold surface by a known suction mechanism using a gap between the insert blocks. The release film has heat resistance that can withstand the heating temperature of the mold, is easily peeled off from the mold surface, and has flexibility and extensibility, such as PTFE, ETFE, PET, FEP, fluorine-impregnated glass cloth, polypropylene, polyvinylidin chloride and the like are preferably used. For example, a long film material is used as the release film, and the release film is provided so as to be drawn out from a supply reel wound up in a roll shape, passed through the upper clamp surface, and wound up onto the take-up reel.

(Molded product storage D)
The molded product storage unit D has an unloader 26 to transfer a molded product 18 after resin molding, a take-out unit 19, a gate break unit 20 to remove unnecessary resin such as a gate from the molded product 18, and unnecessary resin removed. A storage magazine 22 for storing the product 21 is provided. The product 21 is stored in a storage magazine 22, and the storage magazine 22 is sequentially stored in a storage stocker 23.

(Transport mechanism E)
The transport mechanism E includes a loader 25 that transports the molded product 1 to the press unit C and an unloader 26 that transports the molded product from the press unit C. The loader 25 and the unloader 26 are a guide connected between a supply unit A, a thickness measurement unit B, a preheating unit F, a dummy module unit G, a press unit C, a dummy module unit G, and a storage unit D arranged in series. The rail 27 is shared so that it can be moved back and forth with respect to the press part C. The loader 25 receives the substrate that is the molded product 1 from the supply unit A, delivers the molded product 1 to the transfer table 9, receives the resin tablet 7, and then receives the molded product 1 preheated by the heater block 13. Then, the operation of carrying them into the mold mold opened in the press part C is repeated. Further, the unloader 26 repeats the operation of receiving the molded product 18 released after the resin molding from the mold and transferring it to the take-out unit 19 of the storage unit D.

  Therefore, the apparatus configuration can be changed without changing the transport mechanism E by connecting the guide rail 27 even if the units constituting the resin molding apparatus are changed. For example, the example shown in FIG. 1 is an example in which one press device 15 is installed, but it is also possible to configure a resin molding device in which a plurality of press devices 15, thickness measuring parts B and preheating parts F are connected. is there.

(Specific configuration example of thickness measuring section B)
Here, a specific configuration example of the thickness measurement unit B will be described with reference to FIGS. A configuration example of the XY scanning mechanism 10 will be described with reference to FIG. A Y-axis rail 29 is laid in the longitudinal direction of the base portion 10a. A scanning table 28 is connected to the Y-axis rail 29 via a linear guide so as to be able to reciprocate. Further, the X-axis rail 30 is laid on the scanning table 28 so as to be orthogonal to the Y-axis rail 29. A conveyance table 31 is connected to the X-axis rail 30 through a linear motion guide so as to be able to reciprocate. As will be described later, the transport plate 9 is fixed to the transport table 31 with a coupling tool such as a bolt (not shown).

  A Y-axis ball screw 32 is provided in parallel with the Y-axis rail 29 and is driven to rotate by a Y-axis motor 33. A nut 34 that is movably fitted to the Y-axis ball screw 32 is connected to the scanning table 28. Therefore, when the Y-axis motor 33 is rotationally driven, the scanning table 28 moves along the Y-axis rail 29 via the Y-axis nut 34.

An X-axis ball screw 35 is provided in parallel with the X-axis rail 30 and is driven to rotate by an X-axis motor 36. An X-axis nut 37, which is movably fitted to the X-axis ball screw 35, is connected to the transport table 31. Therefore, when the X-axis motor 36 is driven to rotate, the transfer table 31 moves along the X-axis rail 30 via the X-axis nut 37.

  Therefore, when the Y-axis motor 33 and the X-axis motor 36 are driven in a predetermined direction, the transport plate 9 sucked and held by the transport table 31 can be transported while scanning in the XY direction.

  Further, the transfer table 31 reciprocates between a receiving position U which is one end of the Y-axis rail 29 and a delivery position W provided at the other end. Between the receiving position U and the delivery position W, a measuring position V by first and second measuring devices described later is provided. The measurement apparatus 11 provided at the measurement position V is provided with a first laser displacement meter 43 and a second laser displacement meter 44, which will be described later, corresponding to the molded article 1, and the total thickness of the substrate including the semiconductor chip and Each thickness of the substrate is measured.

  In a state where the transport plate 9 shown in FIG. 3B is removed, the transport table 31 placed on the scanning table 28 has a rectangular shape that is partially smaller than the outer shape of the substrate corresponding to the mounting position of the product 1. Shaped through holes 31d are provided at a plurality of locations (for example, two locations). Further, a suction groove 31a is formed around the periphery of the through hole 31d, and is formed so as to circulate along the outer shape of an area on which a later-described transport plate 9 is placed. The suction groove 31a is closed by the transport plate 9 and sucked by a suction hole 39 connected to the compressor. In addition, holes 31b are drilled at positions corresponding to the through holes 31d on one end side in the Y-axis direction of the transport table 31. Furthermore, a plurality of protrusions 31c are projected from each side into the hole in the through hole 31d, and suction grooves 31a are formed in each protrusion 31c. In addition, these protrusions 31 are provided at positions as far as possible between measurement points on the edge of the molded product 1 described later.

  In FIG. 3A, the transport plate 9 is placed on the transport table 31. The transport plate 9 is provided with through holes 9d at a plurality of locations (for example, two locations) corresponding to the mounting positions of the molded product 1. The through hole 9d is formed in the same size as the through hole 31d. Cutouts 9a are respectively formed at positions corresponding to the holes 31b on one end side in the Y-axis direction of the transport plate 9. Further, the notch 9a is disposed so as to overlap the hole 31b. Further, a work support portion 9b is formed in the through hole 9d of the transport plate 9 so as to overlap the protrusion 31c toward the inside of the hole. A suction hole 9c communicating with the suction groove 31a is formed at the tip of each work support portion 9b. The molded product 1 (substrate) placed so as to cover the through hole 9d of the transport plate 9 is sucked by a compressor (not shown) through the suction groove 31a, and is provided at the tip of the work support portion 9b. By being held by suction through the suction holes 9 c, the molded product 1 is flattened along the transport plate 9. In this case, the outer peripheral edge of the molded product 1 can be uniformly adsorbed and fixed by the plurality of protrusions 31c provided on each side of the through hole 9d. Even if the Y direction is scanned at high speed, the molded product 1 can be reliably held without being displaced or rattling.

  A Z-axis direction block gauge 40 shown in FIG. 5A and an X-axis / Y-axis direction block gauge 41 shown in FIG. 5B are detachably provided at a position where the hole 31b and the notch 9a overlap. . The Z-axis direction block gauge 40 and the X-axis-Y-axis direction block gauge 41 are provided for adjusting the origin positions in the Z-axis direction and XY-axis direction of the sensor described later. The X-axis / Y-axis direction block gauge 41 is provided with a protrusion 41a.

Next, the configuration of the first and second measuring apparatuses will be described with reference to FIGS. 2 and 6 to 8.
As shown in FIGS. 2, 6, and 7, the first laser displacement meter 43 (first measurement device) and the second laser displacement meter 44 (with respect to the base portion 47 and the support member 42 erected on the base portion 47. The second measuring device is shifted and fixed in the X-axis direction and the Y-axis direction. Specifically, the first laser displacement meter 43 and the second laser displacement meter 44 are arranged at a predetermined interval corresponding to the holding interval of the molded product 1 with respect to the conveying plate 9 in the X-axis direction, and the Y In the axial direction, they are shifted by a distance corresponding to the deviation of the measurement points between the molded articles 1 held on the conveying plate 9. The first and second laser displacement meters 43, 44 are a pair of first laser displacement sensors 43a, 43b and a second laser displacement sensor, which are disposed so as to face the upper and lower surfaces of the article 1 so that the optical axes coincide vertically. 44a and 44b are provided. The laser displacement sensor is a displacement sensor that detects the amount of displacement by detecting the imaging position of the reflected light obtained by reflecting the laser light irradiated from the light emitting element from the molded article 1 with a light receiving element (PSD). is there. When the imaging position of the upper and lower displacement sensors changes, the output balance changes, and the amount of displacement is calculated by arithmetic processing using each output value.

  In addition, the laser irradiation positions of the first laser displacement sensors 43a and 43b and the second laser displacement sensors 44a and 44b are imaged by a first imaging camera 45a and 45b and a second imaging camera 46a and 46b provided in a pair. It is like that. The first imaging cameras 45a and 45b and the second imaging cameras 46a and 46b are positioned and fixed with respect to the base portion 47 and the support member 42 standing on the base portion 47.

  FIG. 7A shows a state where the upper first laser displacement sensor 43a and the upper second laser displacement sensor 44a are fixed to the support member 42 via the sensor fixing portion 48, and the upper first laser displacement sensor 44a via the camera fixing portion 49. A state in which the first imaging camera 45a and the upper second imaging camera 46a are fixed is shown. The upper first laser displacement sensor 43a and the upper second laser displacement sensor 44a are positioning plates 48a having different thicknesses depending on the fixing position on the side surface of the beam portion 42b projecting from the column portion 42a of the support member 42 in the X-axis direction (FIG. 6 ( a) and (b) are mutually shifted in the Y-axis direction, and are fixed to the support member 42 so that the detection positions in the XY directions are different.

  In FIG. 7B, the lower first laser displacement sensor 43b and the lower second laser displacement sensor 44b support the upper first laser displacement sensor 43a and the upper second laser displacement sensor 44a, respectively. It is supported and fixed to a support portion 47a provided on the base portion 47 through 47c. The support plate 47c can be fixed at a predetermined position in the base portion 47, and is fixed at a position obtained by shifting the pair of support portions 47a in the Y-axis direction. Thereby, the lower first laser displacement sensor 43b and the lower second laser displacement sensor 44b are shifted in the Y-axis direction. Thus, since the first laser displacement meter 43 and the second laser displacement meter 44 are fixedly supported via the positioning plate 48a and the support plate 47c, the detection position in the XY direction can be obtained by exchanging them. It can be changed easily and with high accuracy. Further, the first laser displacement meter 43 and the second laser displacement meter 44 are attached to the positioning plate 48a and the support plate 47c outside the thickness measuring portion B, and these are attached to the beam portion 42b and the base portion 47, so that the laser displacement meter. 43 and 44 can be easily attached.

  In FIG. 7A, the upper first imaging camera 45a and the upper second imaging camera 46a are shifted in the Y-axis direction on the side surface of the beam portion 42b by the positioning plate 49a having a different thickness depending on the fixed position. It is fixed to the support member 42 so that the imaging positions in the XY directions are different. In FIG. 7 (b), the lower first imaging camera 45b and the lower second imaging camera 46b are disposed via a support plate 47d so as to face the upper first imaging camera 45a and the upper second imaging camera 46a, respectively. It is supported and fixed to a support portion 47 b provided on the base portion 47. Thereby, the first imaging cameras 45a and 45b and the second imaging cameras 46a and 46b change the imaging position easily and with high accuracy in accordance with the change of the detection positions of the first laser displacement meter 43 and the second laser displacement meter 44. can do. That is, by changing the positioning plates 48a and 49a and the support plates 47c and 47d, it is possible to easily cope with the change of the detection position and the imaging position accompanying the change of the molded article 1. For this reason, for example, when the molded product 1 is disposed so as to sandwich the pot as in the present embodiment, the position of the semiconductor chip 1b in the Y-axis direction is different, so the imaging position must also be varied in the Y-axis direction. However, since this interval varies depending on the arrangement of the semiconductor chip 1b, it is particularly effective in terms of product type replacement to easily cope with the change of the detection position and the imaging position accompanying the change of the molded product 1.

  The configuration using the positioning plates 48a and 49a having different thicknesses depending on the fixing position and the supporting plates 47c and 47d in which the fixing position of the supporting portion 47a is shifted in the Y-axis direction has been described. When it is not necessary to shift the position, the positioning plates 48a and 49a having a uniform thickness and the support plates 47c and 47d having the same fixed position in the Y-axis direction can be used.

  FIG. 8 shows a state in which the transport plate 9 passes through the first and second laser displacement meters 43 and 44 in a state where the transport plate 9 is held on the transport table 31 and the molded product 1 (substrate) is sucked and held on the transport plate 9. ing. As an example, a portion passing through the first laser displacement meter 43 will be described. It should be noted that the same measurement is performed at a portion passing through the second laser displacement meter 44. The upper first laser displacement sensor 43a irradiates the molded product 1 (substrate or semiconductor chip) with laser light to receive reflected light, and the lower first laser displacement sensor 43b passes through the through hole 31d and the through hole 9d. Thickness measurement is performed by irradiating the molded product 1 (substrate) with laser light and receiving reflected light. The imaging position of the laser beam is imaged by the upper first imaging camera 45a and the lower first imaging camera 45b.

  Next, the measurement route and measurement points of the molded product 1 will be described with reference to FIGS. 4 and 9 to 11. In the following, as shown in FIG. 2, there are two molded articles 1 conveyed by the conveying plate 9, and as shown in FIG. 4A, each molded article 1 has a semiconductor formed on the substrate 1a. An example of a measurement method in the case where the semiconductor chip 1b is mounted in the chip area P at three locations along the transport direction will be described. The first and second laser displacement meters 43 and 44 (FIG. 6A) (FIG. 6A) are arranged so as to be shifted in the Y-axis direction while scanning the transport plate 9 in the XY direction by the XY scanning mechanism 10 (see FIG. 2). In (b), the total thickness and the plate thickness are measured in the semiconductor chip area P and the substrate area Q, respectively.

  Specifically, after receiving the molded product 1 from the loader 25 at the receiving position U, the first measurement is performed in the first outward path by moving in the Y direction and passing through the measurement position V. As shown in FIGS. 4A and 4B, when the transport plate 9 is moved forward in the Y-axis direction, the first and second laser displacement meters 43 and 44 move the transport plate 9 by the XY scanning mechanism 10. The measurement is performed simultaneously in the semiconductor chip areas P of the two molded articles 1 along the trajectory J that continues to be folded in a zigzag manner by scanning in the −Y direction. That is, in each semiconductor chip area P for each article 1 to be molded, measurement points S1 to S18, S1 'to S18 such as common measurement points S1 and S1', S2 and S2 ', corresponding to the XY direction. The total thickness is measured simultaneously while imaging the imaging position of the reflected light at 'by the first imaging cameras 45a and 45b and the second imaging cameras 46a and 46b. Thereby, the total thickness can be efficiently measured in each semiconductor chip area P provided in the plurality of molded products 1 by one transport operation of the transport plate 9 for one or a plurality of molded products 1. .

  In the semiconductor chip area P, the measurement points on the end side (for example, S5, S6), the measurement points on the opposite side (for example, S1, S4), and the measurement points (for example, S2, S3) located inside these are measured. . For this reason, by measuring a plurality of measurement points crossing the semiconductor chip area P, the inclination and unevenness of the total thickness in the semiconductor chip area P can be confirmed, and the total thickness can be measured with high accuracy. Further, as in the present embodiment, even if the molded products 1 are rearranged face to face in the supply unit A, the first and second laser displacement meters 43 and 44 are shifted and arranged in the Y-axis direction. Thus, it is possible to measure the same measurement point in the semiconductor chip area P at the same position in the molded product 1. For example, the measurement points S1, S4, S5, S6 at the four corners of the molded product 1 shown in FIG. 4A and the measurement points S17 ′, S18 ′, S13 ′ at the four corners of the molded product 1 shown in FIG. , S16 ′, the same position can be measured, and the total thickness can be measured with high accuracy.

  Next, after the total thickness is measured, when the transport plate 9 is moved back in the Y-axis direction, the XY scanning mechanism 10 scans the transport plate 9 in the XY direction, and the semiconductor chip area of one of the molded products 1 In the substrate area Q formed around P, the thickness of the substrate 1b is measured by the first laser displacement meter 43 at the measurement points T1 to T12 along a continuous trajectory K as shown in FIG. 4C. Is done. Measurement is performed while the first imaging cameras 45a and 45b capture the imaging position of the reflected light when measuring the thickness of the substrate area Q.

  Further, when the transport plate 9 is moved forward again in the Y-axis direction, the XY scanning mechanism 10 scans the transport plate 9 in the XY direction, and is formed around the semiconductor chip area P of the other molded product 1. In the measured substrate area Q, the thickness of the substrate 1b is measured by the second laser displacement meter 44 at the measurement points T1 ′ to T12 ′ along the continuous trajectory K as shown in FIG. 4D. . The measurement is performed while imaging the imaging position of the reflected light when measuring the thickness of the substrate area Q by the second imaging cameras 46a and 46b.

In this way, the first laser displacement meter 43 and the second laser displacement meter 44 that are shifted in the conveyance direction (Y-axis direction) of the conveyance plate 9 are used to form a plurality of articles 1 in the substrate area Q. The plate thickness can be measured with high accuracy.
The first laser displacement meter 43 and the second laser displacement meter 44 can be shifted in the transport direction (X-axis direction) of the transport plate 9, but considering the large number of measurement points, the semiconductor Measuring the chip area P by one transport operation is more effective in reducing the measurement time.

  FIG. 9A is an explanatory view of the measurement point S of the semiconductor chip area P as viewed in a vertical cross section along the conveyance direction of the molded product 1. FIG. 9B is an explanatory view of the measurement point T of the substrate area Q as viewed in a vertical section along the conveying direction of the molded product 1.

  In FIG. 9A, the molded product 1 sucked and held on the transport plate 9 is measured on the same line L1, L2, L3 of each semiconductor chip 1a existing in the semiconductor chip area P in the Y-axis direction outward path. It can be seen that is measured.

  In FIG. 9B, the molded product 1 attracted and held by the transport plate 9 is a common line L4 on the substrate 1b in the substrate area Q at the peripheral edge of the semiconductor chip area P in the Y-axis reciprocating path. , L5, L6, and L7, it can be seen that measurement points T existing on both sides are measured. Thereby, the thickness of the peninsula chip 1a and the substrate 1b is accurately measured and compared with the reference value, so that the amount of movement of the cavity insert necessary for the resin mold in the press part C (the insert that defines the depth of the cavity) Controls the amount of movement of the block. That is, the molding quality of the molded product can be maintained by performing resin molding after operating the mold driving device 16a shown in FIG. 1 to adjust the cavity volume corresponding to each semiconductor chip 1a. In addition, by operating the mold driving device 16b and moving the lower mold insert block to a height corresponding to the thickness of each substrate 1b and then clamping, the clamping force can be maintained at an appropriate level that does not cause resin flash or substrate damage. Can be clamped. In the substrate area Q, when the measurement points T existing on the common lines L4, L5, L6, and L7 on the substrate 1b are measured, the workpiece support portion 9b protruding from the through hole A is molded. Since the product 1 is supported, the reflected light of the lower first laser displacement sensor 43b and the lower second laser displacement sensor 44b can be reliably measured without being blocked by the wall surface of the through hole A.

  FIG. 10A is a cross-sectional explanatory view of the origin alignment in the Z-axis direction by the first laser displacement meter 43 and the second laser displacement meter 44 according to the Z-axis block gauge 40 (see FIG. 5A). In this case, first, the Z-axis block gauge 40 is fixed so as to straddle the notch 9 a and to protrude up and down the transport plate 9 and the transport table 31. Next, the upper first laser displacement sensor 43a and the upper second laser displacement sensor 44a are brought into direct contact with the Z-axis block gauge 40 from above, and the lower first laser displacement sensor 43b and the lower second laser displacement sensor 44b are connected from below. By making direct contact with the Z-axis block gauge 40, the origin in the Z-axis direction is aligned.

  FIG. 10B shows the X-axis and Y-axis directions of the first imaging cameras 45a and 45b and the second imaging cameras 46a and 46b using the X-axis / Y-axis direction block gauge 41 (see FIG. 5B). It is a section explanatory view of origin adjustment. Before imaging the molded article 1, the optical axes of the upper first laser displacement sensor 43a and the upper second laser displacement sensor 44a are set to X-axis-Y while imaging from above with the first imaging camera 45a and the second imaging camera 46a. The fixing position is finely adjusted to match the protrusion 41a of the shaft block gauge 41.

  Next, the X-axis / Y-axis direction block gauge 41 is removed, the transparent sheet 41b is superimposed on the notch 9a of the transport plate 9, and the upper first laser is captured while being imaged by the first imaging camera 45a and the second imaging camera 46a. The fixing position in the support member 42 is finely adjusted so that the optical axes of the lower first laser displacement sensor 43b and the lower second laser displacement sensor 44b are aligned with the optical axes of the displacement sensor 43a and the upper second laser displacement sensor 44a. Thereby, the optical axis of a pair of upper and lower laser beams by the first and second laser displacement meters 43 and 44 can be accurately aligned, and the measurement accuracy can be increased.

  FIG. 11 shows an example of measurement paths and measurement points by one laser displacement meter. As shown in FIG. 11, the XY scanning mechanism 10 scans the transport plate 9 so as to draw a trajectory M bent in a zigzag shape in the XY direction, and measurement points provided at equal intervals along the trajectory M. It is also possible to measure at N.

Depending on the number of measurement points, the measurement method, and the cycle time required for the resin mold, it is possible to configure the measurement device as a single unit, and it is not always necessary to provide a pair of laser displacement meters facing each other. May be.
Further, instead of using a laser displacement meter to measure the thickness of the molded article 1, a measuring method such as a contact method can be used. Further, although the laser displacement meter is fixed and the conveyance table 31 is scanned in the XY direction, the laser displacement meter may be scanned with the conveyance table at a fixed position.

Next, an example of the resin molding operation will be described with reference to FIG.
The molded product 1 placed facing the supply stage 6 is held by a loader 25 and conveyed to the conveyance plate 9, and the molded product 1 is transferred to the conveyance plate 9.
The transport plate 9 is a semiconductor chip area for two molded products 1 in the outward path when passing through the first laser displacement meter 43 and the second laser displacement meter 44 along the Y-axis rail 29 by the XY scanning mechanism 10. The total thickness of P is measured, and the plate thickness of the substrate area Q of each molded product is measured in the return path and the forward path again. The result of the thickness measurement is transferred to the control unit 50, and the control unit 50 operates the mold drive mechanism 16 according to the measurement result to adjust the movement amount (cavity depth) of the cavity insert.

After the thickness is measured, the molded product 1 is held by a pick and place provided in the transfer unit 12 and transferred to the heater block 13. The molded product 1 placed on the heater block 13 is preheated intensively by stopping in the tunnel cover 14 and is transported by the heater block 13 to a delivery position where the loader 25 stands by.
Then, when the loader 25 holding the resin tablet 7 supplied in advance from the resin tablet supply unit 8 receives the pre-molded product 1 from the heater block 13 and moves along the guide rail 27 to the press unit C, a known method is performed. The article 1 and the resin tablet 7 are carried into the mold by the advance / retreat mechanism.

  When the product 1 and the resin tablet 7 are carried into a mold, they are heated by a heater (not shown). After the inloader 25 is withdrawn from the press device 15, the molded product 1 is clamped by a mold, and the cavity is filled with resin and resin molded. In this resin molding operation, resin molding is performed with the cavity capacity adjusted by driving the mold drive mechanism 16a by the control unit 50 in advance based on the thickness measurement result of the molded article 1 previously measured. The

  After the resin molding, the unloader 26 enters the press device 15, picks up the molded product 18, takes out the molded product 18 from the press device 15, and transfers the molded product 18 to the take-out unit 19. The molded product 18 is conveyed from the take-out unit 19 to the degate unit 20, unnecessary resin such as a gate is removed from the molded product 18, and the product 21 from which the unnecessary resin is removed is sequentially stored in the storage magazine 22.

Here, the control operation of the press device 15 by the control unit 50 will be described with reference to FIGS. 12 and 13.
The controller 50 determines the cavity insert that defines the cavity depth required for the resin mold in the press part C and the substrate 1b from the measurement results obtained by the first laser displacement meter 43 and the second laser displacement meter 44. The amount of movement of the lower mold insert block that defines the size of the gap in the clamp area between the upper mold 70 and the lower mold 80 is adjusted.

For example, in FIG. 12, in the upper mold 70, the chase block 72 is disposed with the center block 71 interposed therebetween, and the upper mold cavity insert 73 is mounted in a mounting hole provided in the chase block 72 so as to slide in the mold opening / closing direction. Has been.
A fixed taper plate 77 is disposed between the upper mold cavity insert 73 and the movable taper plate 75 with the taper surface facing the movable taper plate 75. The movable taper plate 75 and the fixed taper plate 77 cooperate to act as a pushing member that pushes the upper mold cavity insert 73 in the mold opening / closing direction. The drive unit 76 is mainly composed of a transmission shaft 76a whose tip engages with the side surface of the movable taper plate 75 and a power unit 76b that advances and retracts the transmission shaft 76a. The drive unit 76 moves upward and backward by moving the movable taper plate 75 forward and backward. The mold cavity insert 73 is pushed in the mold opening / closing direction. In the present embodiment, as shown in FIGS. 12 and 13, the mold drive mechanism 16 a is composed of a plurality of (for example, three) drive units 76 corresponding to the arrangement of the cavities. Correspondingly, they are arranged on both sides of the pressing device 15.

  A base block 79 is disposed on the upper side of the movable taper plate 75. The lower surface of the base block 79 with which the upper surface of the movable taper plate 75 contacts is processed into a flat surface, and the flat surface of the base block 79 becomes a reference surface that defines the position of the upper mold cavity insert 73 in the mold opening / closing direction. FIG. 12 shows a state in which a thickness adjusting plate 78 is interposed between the movable taper plate 75 and the base block 79.

This thickness adjustment plate has a different thickness (height) of the molded product 1 when different types of products are resin-molded by changing the product type, and moves the upper mold cavity insert 73 in the mold opening / closing direction. If the difference in thickness cannot be absorbed by the adjusting method, it is used.
Since the lower surface of the base block 79 is set as the reference surface of the upper mold cavity insert 73, the upper mold is arranged by arranging a thickness adjusting plate 78 between the base block 79 and the movable taper plate 75. The position of the upper mold cavity insert 73 in 70 can be accurately adjusted collectively.

  In the lower mold 80, a lower mold insert block 83 that slides in the mold opening / closing direction is mounted so as to sandwich the center block 81. FIG. 12 shows a state in which the molded product 1 is set facing the lower mold insert block 83 and the resin tablet 7 is supplied to the pot 81 a provided in the center block 81. A plunger 92 that slides in the mold opening / closing direction is mounted in the pot 81a.

  A fixed taper plate 87 is disposed below the lower insert block 83 via a thickness adjusting plate 88, and a movable taper plate 85 is disposed with the taper surface facing the fixed taper plate 87. The drive part 86 is mainly composed of a transmission shaft 86a whose tip engages with a side surface of the movable taper plate 85 and a power part 86b that advances and retracts the transmission shaft 86a, and moves the movable taper plate 85 forward and backward. The mold insert block 83 is pushed in the mold opening / closing direction. In the present embodiment, the mold drive mechanism 16b includes a plurality of (for example, two) drive units 86 corresponding to the arrangement of the molded product 1 supplied to the press device 15 (see FIG. 12).

  The thickness adjusting plate 88 attached to the lower mold 80 is also used for adjusting the thickness when different types of products are resin-molded and the semiconductor chip 1a and the substrate 1b have different thicknesses.

  FIG. 13A shows a state in which the product 1 is clamped by the upper mold 70 and the lower mold 80. The upper mold cavity insert 73 is set to a position where the semiconductor chip 1a is slightly pushed (crushed) toward the lower mold 80 rather than a position where the pressing surface is in contact with the upper surface of the semiconductor chip 1a. The molded product 1 is reliably clamped by 73, and a resin flash is prevented from being generated on the outer surface of the semiconductor chip 1a during resin molding.

When the semiconductor chip 1a is slightly pushed in by the upper mold cavity insert 73, it is necessary to prevent damage to the semiconductor chip 1a or the joint between the semiconductor chip 1a and the substrate 1b. In this embodiment, the thickness of the substrate 1b by the first laser displacement meter 43 and the second laser displacement meter 44 and the total thickness of the substrate 1b including the semiconductor chip 1a are measured in advance, and the upper mold cavity insert is based on the measurement result. By setting the position in the mold opening / closing direction by 73 and the lower mold insert block 83, it is possible to set an optimal clamping state that does not cause resin flash without damaging the molded product.
Depending on the product, a connection pad may be formed on the outer surface of the semiconductor chip 1a. In such a product, the occurrence of a resin flash on the outer surface of the semiconductor chip 1a is directly connected to a defect. The resin molding method of this embodiment can be effectively applied to the manufacture of such products.

  In addition, by operating the mold driving device 16b and moving the lower mold insert block to a height corresponding to the thickness of each substrate 1b and then clamping, the resin flash on the substrate 1b and the substrate are not damaged. Can be clamped with a clamping pressure.

  For example, the molded product 1 on the left side in FIG. 12 is measured by the thickness measuring unit B for the total thickness at the measurement points S1 to S18 and the thickness of the substrate 1b at the measurement points T1 to T12. In this case, the control unit 50 calculates the thickness of each semiconductor chip 1a from the difference between the total thickness at the measurement points S1 to S18 and the plate thickness of the substrate 1b at the measurement points T1 to T12. Specifically, the thickness of each semiconductor chip 1a is calculated from the total thickness at the position of each semiconductor chip 1a from the plate thickness of the substrate 1b around. For example, in the lower (near side) semiconductor chip 1a in FIGS. 4A and 4C, the average value of the total thickness at the plurality of measurement points S1 to S6 is used to determine the substrate 1b at the plurality of surrounding measurement points T7 to T12. The thickness of the semiconductor chip 1a can be calculated by subtracting the average value of the plate thicknesses. In this case, the thickness of the semiconductor chip 1a can be accurately calculated by using the plate thickness at the measurement points T7 to T12 around the semiconductor chip 1a. Note that the processing may be simplified so that the thicknesses of all the semiconductor chips 1a are calculated by subtracting the average value of the measurement points T1 to T12 from the total thickness.

  As described above, the control unit 50 measures the total thickness of the measurement points S1 to S18 and S1 ′ to S18 ′ in the two molded articles 1 measured by the thickness measurement unit B, and the measurement points T1 to T12 and T1 ′. All the thicknesses of the six semiconductor chips 1a are calculated based on the plate thickness of the substrate 1b of T12 ′. Next, the control unit 50 controls the mold driving mechanism 16a based on the thickness of each semiconductor chip 1a to align each upper mold cavity insert 73 with the position in the mold opening / closing direction so that the cavity has an appropriate depth.

  On the other hand, the control part 50 is based on the board | substrate 1b board thickness in the measurement points T1-T12 and T1'-T12 'in the two to-be-molded articles 1 measured in the thickness measurement part B, and the board of two to-be-molded articles 1 The thickness is calculated as an average value, for example. Next, the control unit 50 controls the mold driving mechanism 16b based on the thickness of the substrate 1b of each molded article 1 to align the lower mold insert block 83 with the position in the mold opening / closing direction. As a result, the optimum cavity depth is obtained for each of the thicknesses of all the semiconductor chips 1a, and the lower mold insert block 83 is aligned at the optimum position for the thickness of the substrate 1b in all the molded products 1. Clamped and molded with resin. Thereby, it is possible to perform resin molding on the object 1 to be opposed.

  FIG. 13B shows a state in which the cavity is filled with the sealing resin 90a. The sealing resin 90a is filled in the cavity so as to seal the side surface of each semiconductor chip 1a. By filling the cavity with the sealing resin 90a in a state in which the molded article 1 is securely clamped by the upper mold 70 and the lower mold 80, the resin can be formed without causing a resin flash on the substrate 1b or the outer surface of the semiconductor chip 1a. Can be molded.

  In the present embodiment, the mold surface of the upper mold 70 is covered with the release film 91 and resin-molded. By clamping the molded product 1 via the release film 91, it is possible to more effectively suppress the occurrence of resin flash on the substrate 1b and the outer surface of the semiconductor chip 1a. The release film 91 prevents the sealing resin 90a from entering the sliding contact portion between the upper mold cavity insert 73 and the mounting hole, and also has an effect of ensuring the slidability of the upper mold cavity insert 73.

In the above-described embodiment, after the molded product 1 is supplied to the lower mold 80 with the mold opened, the drive units 76 and 86 (the transmission shafts 76a and 86a and the power units 76b and 86b) are driven to move the upper mold. The cavity insert 73 and the lower mold insert block 83 were aligned at a predetermined mold opening / closing direction position. As the control by the control unit 50, before supplying the molded product 1 to the lower mold 80, the drive units 76 and 86 are controlled based on the measurement result by the thickness measuring unit B, and the upper mold cavity insert 73 and the lower mold are controlled. The molded product 1 may be supplied to the lower mold 80 in a state where the insert block 83 is aligned with a predetermined position.
Normally, the molded product 1 is clamped after positioning the upper mold cavity insert 73 and the lower mold insert block 83 at a predetermined position. However, after the upper mold 70 and the lower mold 80 are aligned, the drive unit 76 is used. , 86 are driven to move the upper mold cavity insert 73 and the lower mold insert block 83 to positions in a predetermined mold opening / closing direction, and resin molding is also possible.

  Moreover, although the said press apparatus 15 demonstrated the case where the solid resin tablet 7 was supplied and a cavity volume was changed by the metal mold | die drive mechanism 16a, when liquid resin is supplied, the 1st laser displacement meter 43 is demonstrated. The thickness of the substrate 1b by the second laser displacement meter 44 and the total thickness of the substrate 1b including the semiconductor chip 1a are measured in advance, and the control unit 50 is a liquid resin resin supplied to the product 1 based on the measurement result. The amount may be adjusted.

As described above, if the resin molding apparatus described above is used, not only the thickness of the substrate 1b but also the thickness of the semiconductor chip 1a can be accurately measured. Further, the control unit 50 can adjust the cavity volume and maintain the molding quality at a high quality by controlling the movement amount (cavity depth) of the cavity insert necessary for the resin mold in the press unit C from the measurement result. it can. Therefore, adjustment of the press part C can be easily performed even if the type of the molded product is switched.
In addition, since the thickness measuring unit B performs measurement before preheating the pre-heated product 1, the total thickness of the product 1 and the substrate plate thickness are accurately measured at a stage where the influence of expansion due to heat is small. It can be measured.

In addition, although the resin mold apparatus mentioned above illustrated about the apparatus which can recombine the supply part A, the thickness measurement part B, the press part C, and the storage part D which shared the conveyance mechanism E, these are well-known that these were assembled | attached integrally. It is also possible to apply to the resin molding apparatus.
The resin molding apparatus is not limited to the transfer molding apparatus, and may be a compression molding apparatus.

  In the above-described resin molding apparatus, as shown in FIG. 13, a configuration example in which the molded article 1 (semiconductor chip 1a) is clamped with the upper mold cavity insert 73 and resin molding is described has been described, but the present invention is limited to this. Not. For example, it is good also as a structure which resin-molds in the state which opened the predetermined clearance gap on the semiconductor chip 1a. In this case, the control unit 50 controls the mold drive mechanism 16a so that the calculated thickness of the semiconductor chip 1a and the set value of the thickness of the resin layer formed on the semiconductor chip 1a are added. To set the cavity depth. Thereby, the thickness of the resin layer formed on the semiconductor chip 1a can be accurately controlled, and the molding quality can be maintained at a high quality.

  Further, in the form in which the resin layer is formed on the semiconductor chip 1a, when the resin is injected into the cavities, a gap from the semiconductor chip 1a to the upper mold cavity insert 73 is formed on the semiconductor chip 1a in all the cavities. You may make it easy to inject | pour resin by making only a predetermined value larger than the setting value of the thickness of a resin layer. After the resin injection, the control unit 50 controls the mold driving mechanism 16a to reduce the cavity depth so that the resin layer thickness on the semiconductor chip 1a becomes the target value, and returns the resin to the plunger 92 side. In this case, since the gap on the semiconductor chip 1a at the time of resin injection can be made uniform in all cavities, the filling state (flow) of the resin in the cavities can be made uniform, and the molding quality can be made uniform. .

A Supply part B Thickness measurement part C Press part D Storage part E Transport mechanism F Preheating part G Dummy module part 1 Molded product 1a Semiconductor chip 1b Substrate 2 Supply magazine 3 Supply stocker 4 Pusher 5 Turntable 6 Supply stage 7 Resin tablet DESCRIPTION OF SYMBOLS 8 Resin tablet supply part 9 Conveyance plate 9a Notch 9b Work support part 9c Suction hole 9d, 31d Through-hole 10 XY scanning mechanism 11 Measuring apparatus 12 Transfer part 13 Heater block 14 Tunnel cover 15 Press apparatus 16a, 16b Mold Drive mechanism 17 Film supply mechanism 18 Molded product 19 Extraction unit 20 Degate unit 21 Product 22 Storage magazine 23 Storage stocker 25 Loader 26 Unloader 27 Guide rail 28 Scanning table 29 Y-axis rail 30 X-axis rail 31 Transport table 31a Suction groove 31b Hole 31c Projection 3 2 Y-axis ball screw 33 Y-axis motor 34 Y-axis nut 35 X-axis ball screw 36 X-axis motor 37 X-axis nut 39 Compressor 40 Z-axis direction block gauge 41 X-axis-Y-axis direction block gauge 41a Protrusion 41b Transparent sheet 42 Support Member 43 1st laser displacement meter 43a, 43b 1st laser displacement sensor 44 2nd laser displacement meter 44a, 44b 2nd laser displacement sensor 45a, 45b 1st imaging camera 46a, 46b 2nd imaging camera 47 Base part 47a, 47b Support Part 48 sensor fixing part 49 camera fixing part 48a, 49a positioning plate 50 control part 70 upper mold 80 lower mold 83 lower mold insert block 91 release film 92 plunger

Claims (9)

A supply unit for supplying a molded product on which a semiconductor element is mounted on a substrate to face a supply stage;
A press part in which the molding product supplied to the supply stage is carried by a loader and resin molded,
A thickness measurement unit that measures the thickness of the molded product while being conveyed from the supply unit to the press unit;
A control unit for controlling the operation of each part of the device,
The thickness measuring unit includes a transport plate that transports the molded product while being transferred and held from the loader, an XY scanning mechanism that can scan the transport plate in the X-Y direction, and the transport plate. It is arranged corresponding to the product to be molded in the transport path, and includes first and second measuring devices for measuring the total thickness of the semiconductor chip area and the thickness of the substrate area,
The transport plate is formed with through holes that overlap the holding position of the molded product, and a plurality of work support portions that protrude toward the inside of the through holes are formed at the tip of each work support portion. A resin molding apparatus characterized in that the molded product is adsorbed and held at the outer peripheral edge while being exposed from the through-hole by the formed adsorption hole . The substrate into the through-hole peripheral portion that is puncture hole in carrier plate are held by suction, first, the of the molded article chip mounting using a second laser displacement gauge shifted arranged in the conveying direction of the conveying plate 2. The resin mold apparatus according to claim 1, wherein thickness measurement is performed by irradiating both the surface and the substrate surface exposed through the through hole with laser light to measure reflected light.   When the transport plate is moved forward, the first and second laser displacement meters are folded in the semiconductor chip areas of a plurality of molded products while the transport plate is scanned in the XY direction by the XY scanning mechanism. The resin mold apparatus according to claim 1 or 2, wherein the total thickness is simultaneously measured at a common measurement point corresponding to the XY direction in each semiconductor chip area for each article to be molded along a continuous locus.   In the substrate area formed around the semiconductor chip areas of a plurality of molded products while scanning the transport plate in the XY direction by the XY scanning mechanism when the transport plate is moved backward and forward. The resin mold apparatus according to any one of claims 1 to 3, wherein thickness measurement is alternately performed by the first laser displacement meter and the two laser displacement meter along a trajectory that continues in a zigzag manner.   Prior to measuring the thickness of the molded product, the Z-axis direction block gauge and the X-axis-Y-axis direction block gauge are sequentially mounted on the transport plate, and the optical axes of the first and second laser displacement meters are aligned. The resin mold apparatus of any one of Claim 1 thru | or 3.   The said thickness measurement part is a resin mold apparatus of any one of the Claims 1 thru | or 5 with which a measurement is performed before the preheating by which a to-be-molded product is preheated.   The control unit adjusts the amount of movement of the cavity insert that defines the cavity depth required for the resin mold in the press unit from the measurement results of the first and second measuring devices, or supplies the adjusted amount to the press unit. The resin mold apparatus of any one of Claim 1 thru | or 6 which adjusts the resin amount of liquid resin. A transport plate that transports the workpiece while holding it,
An XY scanning mechanism capable of scanning the transport plate in the XY direction;
A plurality of measuring devices that are arranged in correspondence with the workpiece on the conveyance path of the conveyance plate and measure the thicknesses of different measurement areas of the workpiece;
The transport plate is formed with through holes that overlap the holding position of the molded product, and a plurality of work support portions that protrude toward the inside of the through holes are formed at the tip of each work support portion. The workpiece thickness measuring apparatus, wherein the workpiece is sucked and held at the outer peripheral edge while being exposed from the through hole by the sucked hole .   9. The workpiece thickness measuring device according to claim 8, wherein the workpiece includes first and second measuring devices that respectively measure a thickness of a semiconductor chip area and a substrate area of a workpiece having a semiconductor chip mounted on a substrate.

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