KR102049563B1 - PCB overlap detection system and method in PCB manufacturing process - Google Patents

Abstract

A method for checking whether there are defects of products in a PCB manufacturing process according to the present invention comprises: a product loading step; a step of product pick-up by a loader picker and seating on a loader index table; a step of checking whether there are defects of the product by a sensor unit; a step of adsorbing a rotary table and scanning a lower part if there are no defects of the product; and a step of transferring and finishing the product. The step of checking whether there are defects of the product checks whether there are defects by measuring the thickness of the PCB product, moves the product back to the product loading step if there are defects, and alarms a worker at the same time.

Description

PCB overlap detection system and method in PCB manufacturing process

The present invention relates to a system and method for detecting overlap of substrates, and more particularly, to a substrate overlap detection system and method for detecting defects in which substrates overlap each other by static electricity or foreign matter through displacement measurement in a PCB manufacturing and inspection process. .

In general, the manufacturing process of a printed circuit board (PCB) requires the movement and classification of the substrate (product), and for this purpose, a soter is used. This equipment recognizes separate marking according to PCB defect quantity in PCB manufacturing process and sorts by defect quantity. It is used for the final process in PCB manufacturing and inspection order.

 However, as equipment is operated in a predetermined order, overlapping of PCB products may occur due to the bending of raw materials, static electricity or foreign substances or chemicals, and these overlapping leads to inconsistency between the real material and the bad data, which are serious defects. It causes a problem called release. Since such a defect of the printed circuit board leads to a defect of the electronic device including the same, the operation of inspecting the manufactured printed circuit board is preceded before mounting the electronic components on the printed circuit board.

In addition, the process of generating a defective product according to the overlapping substrate described above is further described. The product is divided into a top and a bottom of the same position, and the top and bottom surfaces are one unit. When the device is checked for defects, it usually displays the defective device on the upper surface. When the marking and the information of the defect coincide with each other, the product is operated by using the non-defective data. However, as described above, there is a problem of data inconsistency, which causes a big problem of product defects.

For example, the defect data of the upper and lower surfaces should be identical. Only the good materials except for the defective data should be used.However, if two sheets overlap, the defect data on the upper and lower surfaces will be inconsistent and the defective product on one side will be used. It will cause a defect. The thickness of PCB products is usually about 0.1mm, so if two sheets overlap, it is impossible to visually identify them.

In order to solve this problem, the conventional technology compensates for the marking of a certain value with the GV (grand value) value of the marked marking and loads it into a separate loading box for each defective quantity. It is impossible to detect defects, so defective products are delivered, causing secondary defects in the manufacturing process.

That is, the conventional technology is generated based on the defect data of the upper surface material when two sheets overlap, but the material of the lower surface (Bot) is different from the upper surface material and the data is injected into the process, so the problem that the defective product still occurs. have.

Korean Patent Publication No. 10-2016-0136255

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide a failure detection system and method for solving a problem of failure caused by overlapping substrates in a PCB manufacturing process.

Product abnormality inspection method in the PCB manufacturing process according to the present invention product loading step; Product pick-up and loader index table seating in the loader picker; Checking whether there is a problem with the product of the sensor unit; Rotating table suction and lower scan step if there is no abnormality of the product; And transferring and finishing the product. It includes, the product abnormality check step is to check the presence or absence of abnormality by measuring the thickness of the PCB product, if there is a problem, the product is moved back to the product loading step, and at the same time characterized in that the alarm to the worker.

In addition, the sensor unit includes a laser displacement sensor and a sensor controller to measure the thickness of the PCB product to check whether the PCB products overlap, and detect the signal of the laser displacement sensor when the measured thickness is measured above the preset tolerance range By transmitting a signal from the PLC and the transmitted signal is characterized in that the alarm to the user.

In addition, the sensor unit waits in a state where 12V power is applied, and when the laser displacement sensor starts to measure when moving to the input position value of boat No. 1, the boat No. 1 is measured within the normal value after determining whether the measured value is abnormal. It is characterized by moving to the next step.

In addition, confirming the presence or absence of the product; Includes a thickness measurement step, a comparison operation step, a determination step and an alarm step, wherein the thickness measurement step includes an abnormality inspection step by an image; Further comprising, by proceeding with the displacement measurement by the laser sensor, characterized in that more clearly determine whether the overlap of the product.

In addition, the value measured by the sensor unit may be transmitted or stored through a separate server to be processed into a database, and deep storage, data mining technology can predict the presence or absence of the product defects by storing and learning the data It is characterized by being.

A substrate overlap detection system in a PCB manufacturing process according to the present invention includes a sorter facility for detecting, inspecting and sorting defects of a PCB product unit; Sensor unit for sensing the presence or absence of the defective product; An operation control unit for calculating and controlling a value sensed by the sensor unit; A communication unit transmitting data of the sensor unit and the operation control unit; An alarm unit for alarming users of necessary information; And a server; Includes, the sensor unit to check the thickness of the PCB product to check the presence or absence, if there is a problem, the product loading step, and at the same time characterized in that the alarm to the worker.

In addition, the sensor unit measures the thickness of the product using a laser displacement sensor and a sensor controller, and further comprising an image capture unit to determine the displacement of the thickness through the image taken by the image capture unit with the laser displacement sensor It is characterized by improving the detection accuracy of a defect.

The substrate overlap detection system and method according to the present invention can be used in a failure detection system and method for solving the problem of failure caused by the overlap of the substrate in the PCB manufacturing process.

1 is a production process flow chart of a PCB product according to the prior art,
2 is a plan view of a sorter (sorter) equipment according to the prior art,
3 is a production process flow chart of a PCB comprising a process of detecting substrate overlap in accordance with the present invention;
4 is a detailed flowchart of a process of detecting substrate overlap by measuring thickness in the flowchart of FIG. 3;
5 is a plan view of the sorter equipment provided with a laser displacement sensor in accordance with the present invention,
6 is a perspective view and a partially enlarged view of the sorter equipment provided with a laser displacement sensor according to the present invention;
7 is an image of a repeated test result and a measurement deviation tested according to the present invention;
8 is a display image of a result value in a process of measuring thickness according to the present invention;
9 is a photographic material of a sensor unit (including laser displacement sensor) according to the present invention;
10 is a block diagram of a substrate overlap detection system according to the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail to be easily carried out by those skilled in the art with respect to the substrate overlap detection system and method in the PCB manufacturing process according to an embodiment of the present invention. Shall be.

The present invention is not limited to the embodiments described herein, but may be embodied in many different forms. In order to clearly describe the present invention, parts irrelevant to the description are omitted, and like reference numerals designate like elements throughout the specification.

First, the substrate overlapping system and method according to the present invention is limited to the manufacturing process of the PCB substrate, but in some cases, it can be applied to various facilities to solve the problem caused by the overlap of products provided below a predetermined thickness, according to the purpose The form, order, process, configuration, etc. may be changed, deleted, or added.

Figure 1 is a flow chart showing the operation sequence of the sorter facility according to the prior art product loading step, roddy picker pick up step, loader index table seating step, rotary table adsorption and lower scan step, unloader index table seating step, middle picker pickup step , Front / rear table seating step, upper scan step, cleaning picker pick-up step, cleaning rail seating step, cleaning feeder 1 moving step, cleaning feeder 2 moving step, offloader material picker picking step and X-OUT loading step.

Of course, the above-described steps show the order in the manufacturing process of the PCB substrate, and some of the above steps may be omitted, and in some cases, may be added or changed.

2 is a plan view of the sorter facility used in the manufacturing process of the PCB substrate described above, the rotary table 10, the removal cylinder 20, the first boat 30, the strip transfer unit 40 and the magazine loader unit 50 It includes.

As described above, in the PCB manufacturing process and system according to the prior art, there is no process or configuration for detecting the thickness, abnormality, and defects of PCB products. There is a problem that is difficult to do.

Therefore, in the PCB manufacturing process according to the present invention, the substrate overlap detection method is a sensor unit after the product loading step (S100), the product pick-up of the loader picker (S110) and the loader index table seating step (S120) as shown in FIG. The method 100 further includes checking the presence or absence of the product abnormality (S121).

The product abnormality check step (S121) is to determine the abnormality by measuring the thickness of the PCB product, if there is a problem is to move the product back to the product loading step (S100), and at the same time to alarm the worker. If there is no abnormality, the table moves to the rotary table suction and lower scan step (S130) according to a normal process.

When data different from the preset value is detected in the thickness measuring step (S121), that is, when the thickness is greater than the reference value, the abnormal point checking and action step (S123) and the user alarm (S127), At the same time, the product is not a failure of the product itself, but is more likely to be an abnormality caused by two or more overlapping products, so if there is a problem, the product can be re-injected again.

Of course, although not shown, in the abnormal point checking step, if the value measured by the sensor unit 100 is larger than the reference value, it is added again whether the substrate is caused by two or more overlapping or the abnormality of the product itself. And further comprising the step of reviewing and determining.

Accordingly, if two or more products are overlapped, they will be reinserted as described above, and if the thickness of the product itself is not overlapped, it will include a process of separately removing the defective product.

The sensor unit 100 includes a laser displacement sensor 110 and a sensor controller 130 to determine whether the PCB products overlap by measuring the thickness of the PCB product, if the measured thickness is more than a predetermined allowable range A signal from the laser displacement sensor 110 may be detected to transmit a signal from the PLC, and the transmitted signal may alarm the user.

Therefore, according to the detection result of the sensor unit 100 may be automatically sorted or progressed, and in some cases, the operator who is informed of the information may take direct confirmation and action.

The laser displacement sensor 10 is preferably provided with a resolution of 0.8um and proceeds to a lower process when measuring the height of a specific position before the equipment scan and measures the height within the allowable range. Signal transmission, and the transmitted signal can be displayed as an alarm. That is, the laser sensor 110 detects a defect by calculating a height difference of a specified position.

The sensor unit 100 waits in a state where 12V power is applied, and when the measurement of the laser displacement sensor 110 starts when moving to the input position value of boat No. 1, it is within a normal value after determining whether there is an abnormality of the measured value. Boat 1 can move to the next stage during measurement.

The checking of the abnormality of the product may include a thickness measuring step, a comparison operation step, a determining step, and an alarming step. The thickness measuring step S121 further includes an abnormality checking step (not shown) by an image. By proceeding with the displacement measurement by the laser sensor, it is possible to more clearly determine whether the products overlap.

That is, the error can be reduced by applying two or more methods of measuring the thickness of the product. To this end, by comparing and determining images through a separate image photographing apparatus (not shown) in addition to the laser displacement sensor 110 according to the present invention, it is possible to increase the accuracy of the determination result of the thickness or more.

In addition, various means for measuring the thickness of the substrate may be applied together, and the measuring method may be simultaneously performed when necessary, or the most suitable means or method may be applied.

The value measured by the sensor unit 100 may be transmitted or stored through a separate server and processed into a database, and may predict whether or not the product is defective by storing and learning the data through deep learning and data mining techniques. It may be.

That is, by processing and storing the obtained data and comparing and storing the result values, it is possible to predict and cope with the abnormality and the degree of abnormality according to the numerical value, the form of the defect, and the like.

As shown in FIG. 4, the thickness measuring step S121 according to the present invention is performed between the loader index table seating step S120 and the rotary table suction and lower scan step S130. In addition, the thickness measuring step may be performed in plurality when necessary, the process may be applied in various orders as necessary during the manufacturing process.

5 is a plan view of the sorter facility used in the manufacturing process of the PCB substrate in the present invention, the rotary table 10, the removal cylinder 20, the first boat 30, the strip transfer unit 40 and the magazine loader unit 50 ). Here, the sensor unit 100 according to the present invention is provided. Preferably, the sensor unit 100 is provided with a laser displacement sensor 110 and a sensor controller 130.

In addition, although not shown, various means, methods, and configurations for measuring the thickness of the product may be replaced, added, and changed, and the sensor unit 100 is not limited to the position shown in FIG. Multiple installations or locations can be changed in various ways.

6 is a perspective view of the sensor unit 100 according to the present invention, the laser displacement sensor 110, the controller 130 of the displacement sensor is connected and mounted as a unit, and further sensing of the sensor unit 100 A communication unit 400 for transmitting a value, an operation control unit 200 for calculating, controlling, and comparing data may be provided, an alarm unit 300 for alarming a user, and a separate server 500 may be provided.

FIG. 7 is a graph showing values repeatedly performed as data of thickness measurement using the laser displacement sensor 110, which is the sensor unit 100. The figure below shows the measurement deviation by model. This shows that the system for detecting the overlap of the substrate by measuring the thickness according to the present invention can reduce the defective rate and increase the productivity due to the overlap of the substrate which has not been found in the past.

8 shows a display image showing the state and information of the thickness reference value and the limit value entry, and a display image that alarms when a thickness failure occurs. Such image information may be confirmed through a separate display unit or controller 130 and may be transmitted to the user through the alarm unit 300.

In addition, status information may be transmitted through a user's portable terminal (not shown), and beacons, Wi-Fi, ZigBee, or various NFC devices, such as short-range communication means, may be used to deliver immediate information to a worker at a short distance in a work process if necessary. Information may also be communicated through.

9 is an actual application picture of the laser displacement sensor 110 and the sensor controller 130, which is the sensor unit 100 according to the present invention. It can also be changed to meet the performance and criteria needed.

10 is a block diagram of a substrate overlap detection system according to the present invention. The system according to the present invention includes a sensor unit 100, an operation control unit 200, a communication unit 400, an alarm unit 300, and a server 500. It can be configured as.

The substrate overlap detection system in the PCB manufacturing process according to the present invention includes a sorter facility (1) for detecting, inspecting and sorting a defect of a PCB product unit, a sensor unit (100) for sensing the presence or absence of the product defect, and An operation control unit 200 for calculating and controlling a value sensed by the sensor unit 100, a communication unit 400 transmitting data of the sensor unit 100 and the operation control unit 200, and an alarm for alarming necessary information to a user The unit 300 and the server 500 are included.

The sensor unit 100 may check the thickness of the PCB product to check whether there is an abnormality, and if there is an abnormality, the sensor unit 100 may move to the product loading step and alarm the worker at the same time.

The sensor unit 100 measures the thickness of the product using the laser displacement sensor 110 and the sensor controller 130, and further includes an image capturing unit (not shown) to capture the image photographed by the image capturing unit. By determining the displacement of the thickness through the laser displacement sensor can increase the detection accuracy of the defect.

The present invention described above is not limited to the above-described embodiments and the accompanying drawings, and simple substitutions, modifications, and changes within the technical idea of the present invention will be apparent to those skilled in the art.

The substrate overlap detection system and method according to the present invention can be used in a failure detection system and method for solving the problem of failure caused by the overlap of the substrate in the PCB manufacturing process.

1: sorter installation 10: rotary table
20: Remover 30: Boat 1
40: strip transfer unit 50: magazine loader unit
100: sensor unit 110: laser displacement sensor
130: sensor controller 200: operation control unit
300: alarm unit 400: communication unit
500: server

Claims (7)

In the inspection method of product abnormalities in PCB manufacturing process
Product loading step;
Product pick-up and loader index table seating in the loader picker;
Checking whether there is a problem with the product of the sensor unit;
Rotating table suction and lower scan step if there is no abnormality of the product; And
Transferring and finishing the product; Including;
In the step of confirming the abnormality of the product,
The sensor unit includes a laser displacement sensor and a sensor controller, the laser displacement sensor measures the thickness of the PCB product to check whether the PCB products are overlapped, and the thickness measurement step, comparison operation to determine the abnormality of the PCB product Step, judgment step and alarm step,
The thickness measuring step may include checking an abnormality by comparing and determining an image of an image photographed by the image photographing apparatus; Further comprising, by performing the displacement measurement by the laser displacement sensor and the comparison and determination of the image image by the image capturing device at the same time to more clearly determine whether the overlap of the product,
If the value measured by the sensor is larger than the reference value, the substrate is additionally reviewed and judged whether two or more layers overlap or an abnormality of the product itself, and when two or more overlap, the PCB products are not defective because they are not defective. Moves back to the product loading step,
When the measured thickness is more than the preset allowable range, the signal of the laser displacement sensor is detected and the signal is transmitted from the PLC and the transmitted signal is alarmed to the user. In the PCB manufacturing process, at least one of beacons, Wi-Fi, ZigBee, and NFC to alarm the worker at the same time to deliver status information to the terminal, or to provide immediate information to the workers in the short distance in the work process Substrate overlap detection method.
delete The method of claim 1,
The sensor unit waits in a state where 12V power is applied, and when the laser displacement sensor starts to be measured when moving to the input position value of boat No. 1, the boat No. 1 is measured in the normal value after determining whether the measured value is abnormal. Substrate overlap detection method in a PCB manufacturing process, characterized in that moving to.
delete The method of claim 1,
The value measured by the sensor unit may be transmitted or stored through a separate server to be processed into a database, and deep learning and data mining technology may predict whether the product is defective by storing and learning the data. A substrate overlap detection method in a PCB manufacturing process characterized by the above-mentioned.
In the substrate overlap detection system in the PCB manufacturing process applied to the substrate overlap detection method according to claim 1,
A sorter facility for detecting, inspecting and sorting failures of PCB product units;
Sensor unit for sensing the presence or absence of the defective product;
An operation control unit for calculating and controlling a value sensed by the sensor unit;
A communication unit transmitting data of the sensor unit and the operation control unit;
An alarm unit for alarming users of necessary information; And a server; Including.
In the PCB manufacturing process, the sensor unit measures the thickness of the PCB product to check whether there is an abnormality, and if there is an abnormality, moves to the product loading step to check the PCB product again, and simultaneously alarms the worker. Substrate overlap detection system.
The method of claim 6,
The sensor unit measures the thickness of the product using a laser displacement sensor and a sensor controller,
And an image capturing unit further comprising a laser displacement sensor to determine a thickness displacement through the image photographed by the image capturing unit to increase defect detection accuracy.

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