CN117637536A - Processing device based on semiconductor device - Google Patents
Processing device based on semiconductor device Download PDFInfo
- Publication number
- CN117637536A CN117637536A CN202311484034.8A CN202311484034A CN117637536A CN 117637536 A CN117637536 A CN 117637536A CN 202311484034 A CN202311484034 A CN 202311484034A CN 117637536 A CN117637536 A CN 117637536A
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- China
- Prior art keywords
- semiconductor device
- turntable
- processing apparatus
- lower die
- groove
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 70
- 230000007246 mechanism Effects 0.000 claims abstract description 73
- 238000003825 pressing Methods 0.000 claims abstract description 24
- 238000010586 diagram Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000007599 discharging Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F23/00—Feeding wire in wire-working machines or apparatus
- B21F23/005—Feeding discrete lengths of wire or rod
- B21F23/007—Feeding discrete lengths of wire or rod using pick-up means, e.g. for isolating a predefined number of wires from a bundle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F45/00—Wire-working in the manufacture of other particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/80—Turntables carrying articles or materials to be transferred, e.g. combined with ploughs or scrapers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a processing device based on a semiconductor device, which comprises a workbench, wherein a feeding mechanism, a pressing mechanism, a marking mechanism and a feeding mechanism are sequentially arranged at the edge of the workbench, the feeding mechanism comprises a vibrating disc and a conveying belt distributing mechanism, the vibrating disc is used for orderly conveying the semiconductor device to be marked to the conveying belt distributing mechanism, the pressing mechanism comprises a supporting frame and an air cylinder, the air cylinder is fixed on the supporting frame, the air cylinder is connected with an upper die, and the upper die can be driven to move up and down by the air cylinder.
Description
Technical Field
The invention relates to the field of semiconductor processing, in particular to a processing device based on a semiconductor device.
Background
Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.
At present, when a semiconductor device is processed, the semiconductor device is generally processed on a production line, on one hand, the occupied space is larger, on the other hand, the deformation of pins of the semiconductor device is often caused by manual feeding and positioning, and especially the pins are L-shaped, when the semiconductor device is conveyed, the pins of different semiconductor devices are easy to collide with each other, the deformation of the pins is more easy to cause, and part of the pins and other pins are not in the same horizontal plane, so that the pins are required to be corrected.
Disclosure of Invention
In order to solve the technical problems, the invention provides a processing device based on a semiconductor device, which comprises a workbench, wherein a feeding mechanism, a pressing mechanism, a marking mechanism and a feeding mechanism are sequentially arranged at the edge of the workbench, the feeding mechanism comprises a vibrating disc and a conveying belt distributing mechanism, the vibrating disc is used for orderly conveying the semiconductor device to be marked to the conveying belt distributing mechanism, the pressing mechanism comprises a supporting frame and an air cylinder, the air cylinder is fixed on the supporting frame, the air cylinder is connected with an upper die, and the upper die can be driven to move up and down through the air cylinder.
Preferably: and one side of the feeding mechanism is provided with a first manipulator which is used for grabbing the semiconductor devices on the conveying belt distributing mechanism and placing the semiconductor devices on the lower die.
Preferably: and one side of the feeding mechanism is provided with a second manipulator which is used for placing the marked semiconductor device on the feeding mechanism.
Preferably: the workbench comprises a turntable, a bracket and a driving mechanism, wherein a plurality of lower dies are arranged on the turntable and are arranged on a circle taking the axle center of the turntable as the center of a circle.
Preferably: the upper end of the support is provided with a plurality of supporting wheels, the supporting wheels are used for supporting the turntable, the turntable is connected with a driving mechanism, and the turntable is driven to rotate through the driving mechanism.
Preferably: the driving mechanism comprises a servo motor, the servo motor is fixed on the support, the servo motor is connected with a small sprocket, the small sprocket is connected with a large sprocket through a chain, a fixing frame is fixed on the large sprocket, the fixing frame is fixedly connected with a rotary table, and the large sprocket is fixedly connected with a supporting shaft.
Preferably: the support shaft rotates the connecting bracket through the bearing, and the bearing pedestal is arranged on the bracket for the bearing, and the support shaft is provided with a boss for supporting the turntable.
Preferably: the two side ends of the lower die are provided with first fixing holes, one side of the lower die, which is located at the first fixing holes, is provided with guide pillar holes, the middle of the lower die is provided with protrusions, two protrusions are arranged, and the lower die is located between the two protrusions to form a groove-shaped structure.
Preferably: the lower die is located the inboard hole groove of seting up of slot-like structure, is provided with the movable block in the hole groove, and the spacing groove has been setted up to the movable block up end, and the spacing groove is used for placing semiconductor device.
Preferably: the upper die upper end fixed connection fixed sleeve is used for connecting the cylinder, the mounting groove is formed in the middle of the lower end of the upper die, the pressing block is arranged in the mounting groove, the screw rod is fixedly connected to the upper end of the pressing block, the upper die is provided with a through hole corresponding to the screw rod, and the pressing block is fixed on the upper die through the screw rod.
The invention has the technical effects and advantages that:
1. according to the invention, the feeding mechanism, the pressing mechanism, the marking mechanism and the feeding mechanism are integrated at the edge of the workbench, so that the feeding, correction, marking and discharging can be realized, and compared with the manual detection and correction, the processing efficiency can be greatly improved.
2. According to the invention, the upper die and the material pressing mechanism are arranged to be matched with the plurality of lower dies on the turntable, so that the number of the upper dies can be reduced, and the cost is greatly saved.
3. According to the invention, the pressing block of the upper die and the fixed block of the lower die are matched to squeeze pins of the semiconductor device, so that the pins are corrected, a plurality of pins are positioned on the same horizontal plane, the quality of the semiconductor device is improved, and the pressing block and the fixed block are easy to install and replace after being worn.
Drawings
Fig. 1 is a schematic structural diagram of a processing apparatus based on a semiconductor device according to an embodiment of the present application;
fig. 2 is a side view of a stage in a semiconductor device-based processing apparatus provided in an embodiment of the present application;
fig. 3 is a schematic structural diagram of a workbench in a processing apparatus for semiconductor device according to an embodiment of the present application;
fig. 4 is a schematic structural diagram of a lower die in a processing apparatus for semiconductor devices according to an embodiment of the present application;
fig. 5 is a schematic view of a bottom structure of a lower mold in a semiconductor device-based processing apparatus according to an embodiment of the present application;
fig. 6 is a longitudinal sectional view of a semiconductor device-based processing apparatus provided in an embodiment of the present application;
fig. 7 is an enlarged schematic view of the structure at a in fig. 6 in a semiconductor device-based processing apparatus provided in an embodiment of the present application;
fig. 8 is a schematic structural diagram of an upper die in a semiconductor device-based processing apparatus according to an embodiment of the present application;
fig. 9 is a front view of an upper die in a semiconductor device-based processing apparatus provided in an embodiment of the present application.
In the figure: 1. a work table; 11. a turntable; 12. a bracket; 121. a support wheel; 13. a driving mechanism; 131. a servo motor; 132. a small sprocket; 133. a chain; 134. a large sprocket; 135. a fixing frame; 136. a support shaft; 2. a feeding mechanism; 3. a material pressing mechanism; 31. a support frame; 32. a cylinder; 4. a marking mechanism; 5. a feeding mechanism; 6. a first manipulator; 7. a second manipulator; 8. a lower die; 81. a first fixing hole; 82. a guide post hole; 83. a protrusion; 84. a movable block; 841. a limit groove; 85. a fixed block; 86. a support block; 87. a hole groove; 88. a telescopic rod; 89. an elastic member; 9. an upper die; 91. a mounting groove; 92. briquetting; 93. a fixed sleeve; 94. a guide post; 95. and (3) a screw.
Detailed Description
The invention will be described in further detail with reference to the drawings and the detailed description. The embodiments of the invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Referring to fig. 1-3, in this embodiment, a processing apparatus based on a semiconductor device is provided, including a workbench 1, a feeding mechanism 2, a pressing mechanism 3, a marking mechanism 4 and a feeding mechanism 5 are sequentially disposed at an edge of the workbench 1, the feeding mechanism 2 includes a vibration disc and a conveying belt distributing mechanism, the vibration disc is used for orderly conveying the semiconductor device to be marked to the conveying belt distributing mechanism, the pressing mechanism 3 includes a supporting frame 31 and a cylinder 32, the cylinder 32 is fixed on the supporting frame 31, the cylinder 32 is connected with an upper die 9, and the upper die 9 can be driven to move up and down by the cylinder 32.
The first manipulator 6 is arranged on one side of the feeding mechanism 2, and the first manipulator 6 is used for grabbing the semiconductor devices on the conveyor belt distributing mechanism and placing the semiconductor devices on the lower die 8, so that the feeding of the semiconductor devices is completed.
The feeding mechanism 5 is a belt conveyor, a second manipulator 7 is arranged on one side of the feeding mechanism 5, and the second manipulator 7 is used for placing the marked semiconductor device on the feeding mechanism 5 to finish the discharging of the semiconductor device.
The workbench 1 comprises a rotary table 11, a support 12 and a driving mechanism 13, wherein a plurality of lower dies 8 are arranged on the rotary table 11, the plurality of lower dies 8 are arranged on a circle taking the axis of the rotary table 11 as the center of a circle, a plurality of supporting wheels 121 are arranged at the upper end of the support 12, the supporting wheels 121 are used for supporting the rotary table 11, the rotary table 11 is connected with the driving mechanism 13, the rotary table 11 is driven to rotate through the driving mechanism 13, the rotary table 11 is supported by the supporting wheels 121, and the rotating stability of the rotary table 11 can be improved.
In this embodiment, the driving mechanism 13 includes a servo motor 131, the servo motor 131 is fixed on the bracket 12, the servo motor 131 is connected with a small sprocket 132, the small sprocket 132 is connected with a large sprocket 134 through a chain 133, a fixing frame 135 is fixed on the large sprocket 134, the fixing frame 135 is fixedly connected with the turntable 11, the large sprocket 134 is fixedly connected with a supporting shaft 136, the supporting shaft 136 is connected with the bracket 12 through bearing rotation, a bearing seat is mounted on the bracket 12, a boss is arranged on the supporting shaft 136 and used for supporting the turntable 11, a through hole is formed in the turntable 11 relative to the supporting shaft 136, and the supporting shaft 136 plays a role in supporting the middle of the turntable 11.
Specifically, the servo motor 131 drives the small chain wheel 132 to rotate, the chain 133 drives the large chain wheel 134 and the fixing frame 135 to rotate, and then drives the turntable 11 and the supporting shaft 136 to rotate, and after the lower die 8 carrying the semiconductor device sequentially moves below the upper die 9, the air cylinder 32 drives the upper die 9 to move to be matched with the lower die 8, so that pins of the semiconductor device are corrected, and deformation of the pins during conveying is avoided.
Referring to fig. 4 to 7, first fixing holes 81 are formed at both side ends of a lower die 8, a guide pillar hole 82 is formed at one side of the lower die 8 located at the first fixing holes 81, a protrusion 83 is formed at the middle of the lower die 8, two protrusions 83 are formed, the lower die 8 is located between the two protrusions 83 to form a groove structure, a hole groove 87 is formed at the inner side of the groove structure, a movable block 84 is formed in the hole groove 87, a limit groove 841 is formed at the upper end surface of the movable block 84, the limit groove 841 is used for placing a semiconductor device, the semiconductor device is limited, when a turntable 11 rotates, the semiconductor device is prevented from falling off from the movable block 84, a fixed block 85 is arranged at both sides of the movable block 84, the lower die 8 is provided with grooves corresponding to the fixed block 85, the fixed block 85 is provided with fixing holes, the fixed block 85 can be mounted on the lower die 8 through bolts, the bottom end surface of the limit groove 841 is higher than the upper end surface of the fixed block 85, when the semiconductor device is placed in the limit groove 841, the pin of the semiconductor device is positioned above the fixed block 85, the bottom end of the movable block 84 is connected with the telescopic rod 88, the outer side of the telescopic rod 88 is sleeved with the elastic piece 89, the lower end of the telescopic rod 88 is connected with the support block 86, the bottom end of the lower die 8 is provided with a mounting groove corresponding to the support block 86, the support block 86 is fixed on the lower die 8 through bolts, the telescopic rod 88 is supported through the support block 86, when the movable block 84 moves downwards, the telescopic rod 88 is shortened, the elastic piece 89 is compressed to play a buffering role, in the embodiment, the elastic piece 89 is a spring, the movable block 84 is supported through the spring and the telescopic rod 88, the bottom surface of the limit groove 841 is higher than the upper end surface of the fixed block 85, when the semiconductor device is placed in the limit groove 841, the pin of the semiconductor device can not directly contact with the fixed block 85, thereby, the extrusion and abrasion of the fixed block 85 to the pins when the rotary table 11 transports the lower die 8 are avoided, and the movable block 84 descends when correcting, so that the pressing block 92 can be matched with the fixed block 85 better to correct the pins.
Referring to fig. 8-9, the upper end of the upper mold 9 is fixedly connected with the fixing sleeve 93, the fixing sleeve 93 is used for connecting with the air cylinder 32, the middle part of the lower end of the upper mold 9 is provided with the mounting groove 91, the width of the mounting groove 91 is smaller than that of the groove-shaped structure, the inside of the mounting groove 91 is provided with the pressing block 92, the upper end of the pressing block 92 is fixedly connected with the screw 95, the upper mold 9 is provided with the through hole corresponding to the screw 95, the pressing block 92 is fixed on the upper mold 9 through the screw 95, the pressing block 92 is convenient to install and replace, the lower end face of the pressing block 92 extends below the upper mold 9, the lower end face of the pressing block 92 is lower than the lower end face of the upper mold 9, the lower ends of the upper mold 9 are fixedly connected with the guide posts 94, the guide posts 94 are used for being inserted into the guide post holes 82, the upper mold 9 and the lower mold 8 are limited, after the lower end face of the upper mold 9 contacts with the protrusions 83 of the lower mold 8, the upper mold 9 stops moving, and the fixing block 85 is matched with the edges of pins of the extruded semiconductor device at the time, the pins are corrected, and the pins are located on the same horizontal plane, and the quality of the semiconductor device is improved.
The working principle of the invention is as follows:
when the semiconductor device feeding mechanism is used, semiconductor devices are placed on the feeding mechanism 2 to be sequentially conveyed, the semiconductor devices on the feeding mechanism 2 are moved to the lower die 8 through the first manipulator 6, the driving mechanism 13 drives the rotary table 11 to rotate, the lower die 8 carrying the semiconductor devices is conveyed to the position below the upper die 9, the air cylinder 32 drives the upper die 9 to move downwards to be matched with the lower die 8 to extrude pins of the semiconductor devices, after the pins of the semiconductor devices are corrected, the air cylinder 32 drives the upper die 9 to be separated from the lower die 8, the driving mechanism 13 drives the rotary table 11 to rotate, the corrected semiconductor devices are conveyed to the marking mechanism 4 to be marked, after marking, the driving mechanism 13 drives the rotary table 11 to rotate, and the marked semiconductor devices are conveyed to the position of the feeding mechanism 5 to be fed by the second manipulator 7.
It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art and which are included in the embodiments of the present invention without the inventive step, are intended to be within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (10)
1. The utility model provides a processing apparatus based on semiconductor device, includes workstation (1), its characterized in that, the edge of workstation (1) has set gradually feed mechanism (2), swager constructs (3), beats mark mechanism (4) and feeding mechanism (5), feed mechanism (2) are including vibration dish and conveyer belt feed mechanism, and the vibration dish is used for will waiting to beat the orderly transport of mark semiconductor device to on the conveyer belt feed mechanism, swager constructs (3) including support frame (31) and cylinder (32), cylinder (32) are fixed in on support frame (31), mould (9) are gone up in connection to cylinder (32), can drive mould (9) through cylinder (32) and reciprocate.
2. The processing device based on the semiconductor device according to claim 1, wherein a first manipulator (6) is arranged on one side of the feeding mechanism (2), and the first manipulator (6) is used for grabbing the semiconductor device on the conveyor belt distributing mechanism and placing the semiconductor device on the lower die (8).
3. The semiconductor device-based processing apparatus according to claim 1, wherein a second robot (7) is provided on one side of the feeding mechanism (5), and the second robot (7) is configured to place the semiconductor device after marking on the feeding mechanism (5).
4. The processing apparatus according to claim 1, wherein the workbench (1) comprises a turntable (11), a bracket (12) and a driving mechanism (13), the turntable (11) is provided with a plurality of lower dies (8), and the plurality of lower dies (8) are arranged on a circle with the axis of the turntable (11) as the center of a circle.
5. The semiconductor device-based processing apparatus according to claim 4, wherein a plurality of supporting wheels (121) are mounted at the upper end of the bracket (12), the supporting wheels (121) are used for supporting the turntable (11), the turntable (11) is connected with the driving mechanism (13), and the turntable (11) is driven to rotate by the driving mechanism (13).
6. The semiconductor device-based processing apparatus according to claim 5, wherein the driving mechanism (13) includes a servo motor (131), the servo motor (131) is fixed on the bracket (12), the servo motor (131) is connected with a small sprocket (132), the small sprocket (132) is connected with a large sprocket (134) through a chain (133), a fixing frame (135) is fixed on the large sprocket (134), the fixing frame (135) is fixedly connected with the turntable (11), and the large sprocket (134) is fixedly connected with a supporting shaft (136).
7. A semiconductor device-based processing apparatus according to claim 6, wherein the support shaft (136) is rotatably connected to the support frame (12) through a bearing, and a bearing housing is mounted to the support frame (12) for the bearing, and a boss is provided on the support shaft (136) for supporting the turntable (11).
8. The processing device based on the semiconductor device according to claim 1, wherein the two side ends of the lower die (8) are provided with first fixing holes (81), one side of the lower die (8) located in the first fixing holes (81) is provided with guide pillar holes (82), the middle part of the lower die (8) is provided with protrusions (83), the protrusions (83) are provided with two, and the lower die (8) is located between the two protrusions (83) to form a groove-shaped structure.
9. The processing apparatus based on the semiconductor device according to claim 1, wherein the lower mold (8) is provided with a hole groove (87) located at the inner side of the groove-shaped structure, a movable block (84) is provided in the hole groove (87), a limit groove (841) is provided at the upper end surface of the movable block (84), and the limit groove (841) is used for placing the semiconductor device.
10. The processing device based on the semiconductor device according to claim 1, wherein the upper end of the upper mold (9) is fixedly connected with a fixing sleeve (93), the fixing sleeve (93) is used for being connected with a cylinder (32), a mounting groove (91) is formed in the middle of the lower end of the upper mold (9), a pressing block (92) is arranged in the mounting groove (91), a connecting screw (95) is fixedly arranged at the upper end of the pressing block (92), a through hole is formed in the upper mold (9) corresponding to the screw (95), and the pressing block (92) is fixed on the upper mold (9) through the screw (95).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311484034.8A CN117637536B (en) | 2023-11-09 | 2023-11-09 | Processing device based on semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311484034.8A CN117637536B (en) | 2023-11-09 | 2023-11-09 | Processing device based on semiconductor device |
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| Publication Number | Publication Date |
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| CN117637536A true CN117637536A (en) | 2024-03-01 |
| CN117637536B CN117637536B (en) | 2024-06-11 |
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| CN202311484034.8A Active CN117637536B (en) | 2023-11-09 | 2023-11-09 | Processing device based on semiconductor device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118409117A (en) * | 2024-06-27 | 2024-07-30 | 常熟市兆恒众力精密机械有限公司 | High-temperature vacuum equipment for semiconductor device detection |
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