CN207743207U - A kind of semi-automatic pin shaping machine of Integrated circuit IC - Google Patents
A kind of semi-automatic pin shaping machine of Integrated circuit IC Download PDFInfo
- Publication number
- CN207743207U CN207743207U CN201820052071.XU CN201820052071U CN207743207U CN 207743207 U CN207743207 U CN 207743207U CN 201820052071 U CN201820052071 U CN 201820052071U CN 207743207 U CN207743207 U CN 207743207U
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- China
- Prior art keywords
- upper mold
- rotating platform
- contact jaw
- shaping
- pedestal
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The utility model discloses a kind of semi-automatic pin shaping machines of Integrated circuit IC, including pedestal, upper mold, lower die and rotating platform, rotating platform is mounted on the base, rotating platform upper surface is equipped with multiple lower dies, upper mold is arranged right over rotating platform, guide rod is installed on pedestal, upper mold both sides are provided with through-hole, guide rod runs through through-hole, base rear end is installed with baffle, sliding rail is equipped in the middle part of baffle, rack is equipped in sliding rail, it is installed with compression bar in the middle part of upper mold upper surface, compression bar rear end is fixedly connected with connecting rod, connecting rod has the matched gear of rack, control motor is installed at the top of connecting rod；Block is installed at the top of guide rod, and compressed spring is fixedly mounted between block and upper mold upper surface, and compressed spring is set in guide rod outer wall, it is separately installed with shaping needle and shaping column on the inside of upper mold, the utility model structural principle is simple, it can realize the Electronic control to upper die and lower die, improve shaping efficiency.
Description
Technical field
The utility model is related to pin shaping technical field, specially a kind of semi-automatic pin shaping machine of Integrated circuit IC.
Background technology
It is slight to be likely to result in pin during being picked and placeed afterwards before testing using corresponding IC sockets for Integrated circuit IC
It is crooked, stick up the bad phenomenons such as foot.When this part, IC is welded direct on PCB, can cause failure welding（IC pins missing solder/dry joint/
Solder skip/short circuit etc. is bad）, can slightly cause wiring board open circuit/crawl bad less than equal test.It is serious to be made because of PCBA short circuits
At burn/even spontaneous combustion major accident occur.
In current IC pin shapings method, there are Training system complexity, and personnel are cumbersome, and shaping effect difference etc. lacks
Point.
Utility model content
The purpose of this utility model is to provide a kind of semi-automatic pin shaping machines of Integrated circuit IC, to solve above-mentioned background
The problem of being proposed in technology.
To achieve the above object, the utility model provides the following technical solutions：A kind of semi-automatic pin of Integrated circuit IC is whole
Type machine, including pedestal, upper die and lower die and rotating platform, the rotating platform are mounted on the base, the rotating platform upper surface
Multiple lower dies are installed, the lower die center is equipped with groove, and the lower die both sides are equipped with pin rest area, the groove size with
Integrated circuit IC size is consistent, and the upper mold is arranged right over rotating platform, and guide rod, institute are installed on the pedestal
It states upper mold both sides and is provided with through-hole, the guide rod runs through through-hole, and the base rear end is installed with baffle, the baffle middle part
Equipped with sliding rail, it is equipped with rack in the sliding rail, is installed with compression bar in the middle part of the upper mold upper surface, the compression bar rear end is fixed
Connecting rod is connected, the connecting rod has the matched gear of rack, control motor is equipped at the top of the connecting rod；It is described
Block is installed at the top of guide rod, and compressed spring is fixedly mounted between the block and upper mold upper surface, and the compression bullet
Spring is set in guide rod outer wall, and shaping needle and shaping column are separately installed on the inside of the upper mold；Controller is equipped in the pedestal,
Stepper motor is additionally provided in the pedestal, the stepper motor is by rotating axis connection rotating platform；The stepper motor and control
Motor processed is separately connected controller；
The lower die is equipped with positioning optical point；The upper mold is equipped with optical frames corresponding with positioning optical point.
Preferably, the compressed spring include the first contact jaw, the second contact jaw and spring body, the spring body by
One elongated metal or resin annular rotate, and in the shape of a spiral, and the spring body is equipped with multiple equidistant spirals
Circle body, first contact jaw and the second contact jaw are separately positioned on the top and bottom of spring body, and first contact
End, the second contact jaw are horizontal plane；First contact jaw is fixedly connected with block, and second contact jaw is fixedly connected
Mould.
Preferably, the rotating platform includes upper mounting plate and lower platform, and it is convex to be equipped with the first hemispherical on the inside of the upper mounting plate
It rises, the second hemispherical projections corresponding with the first hemispherical projections is set on the inside of the lower platform, first hemispherical is convex
It rises and the second hemispherical projections center is equipped with through-hole, swivel bearing is installed in the through-hole.
Preferably, shaping column lower end uses hemispherical dome structure；Shaping needle lower end is pyramidal structure.
Compared with prior art, the utility model has the beneficial effects that：
（1）The utility model structural principle is simple, can realize the Electronic control to upper die and lower die, improves shaping effect
Rate；The quality of follow-up IC welding can be improved simultaneously.
（2）The compressed spring uniform force that the utility model uses is not susceptible to deform after stress, can realize and reply immediately soon
Position, further improves working efficiency.
（3）The rotating platform stability that the utility model uses is good, can realize 360 ° of arbitrary rotations, further improve
Integrated circuit IC integer efficiency.
Description of the drawings
Fig. 1 is the utility model front view；
Fig. 2 is the utility model compressed spring structural schematic diagram；
Fig. 3 is the utility model rotating platform structure schematic diagram.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of semi-automatic pin shaping of Integrated circuit IC
Machine, including pedestal 1, upper mold 2, lower die 3 and rotating platform 4, the rotating platform 4 are mounted on pedestal 1, the rotating platform 4
Upper surface is equipped with multiple lower dies 3, and 3 center of the lower die is equipped with groove 5, and 3 both sides of the lower die are equipped with pin rest area 6, institute
It is consistent with Integrated circuit IC size to state 5 size of groove, the setting of the upper mold 2 is solid on the pedestal 1 right over rotating platform 4
Dingan County is equipped with guide rod 7, and 2 both sides of the upper mold are provided with through-hole, and the guide rod 7 runs through through-hole, and peace is fixed in 1 rear end of the pedestal
Equipped with baffle 8,8 middle part of the baffle is equipped with sliding rail 9, and rack 10 is equipped in the sliding rail 9, and 2 upper surface of upper mold middle part is solid
Dingan County is equipped with compression bar 11, and 11 rear end of the compression bar is fixedly connected with connecting rod 12, and it is matched that the connecting rod 12 is equipped with rack 10
Gear 13,12 top of the connecting rod are equipped with control motor 14；7 top of the guide rod is equipped with block 15, and the gear
Compressed spring 16 is fixedly mounted between 2 upper surface of block 15 and upper mold, and the compressed spring 16 is set in 7 outer wall of guide rod, institute
It states 2 inside of upper mold and is separately installed with shaping needle 17 and shaping column 18,18 lower end of shaping column uses hemispherical dome structure；The shaping
17 lower end of needle is pyramidal structure, and the shaping column and shaping needle special construction of use can prevent damage pin；The pedestal 1
It is interior to be equipped with controller 19, stepper motor 20 is additionally provided in the pedestal 1, the stepper motor 20 is connected by rotary shaft 21 to be rotated
Platform 4；The stepper motor 20 and control motor 14 are separately connected controller 19；
The lower die 3 is equipped with positioning optical point 22；The upper mold 2 is equipped with optical frames corresponding with positioning optical point 22
23；The positioning optical point and optical frames of setting improve the accuracy of shaping convenient for the positioning with upper mold after lower die rotation.
In the utility model, compressed spring 16 includes the first contact jaw 24, the second contact jaw 25 and spring body 26, described
Spring body 26 is rotated by an elongated metal or resin annular, and in the shape of a spiral, and the spring body 26 is equipped with more
A equidistant spiral circle body 27, first contact jaw, 24 and second contact jaw 25 are separately positioned on the top of spring body 26
And bottom, and first contact jaw 24, the second contact jaw 25 are horizontal plane；First contact jaw 24 is fixedly connected with block
15, second contact jaw 25 is fixedly connected with upper mold 2.The compressed spring uniform force that the utility model uses is not easy after stress
It deforms, can realize Rapid reset, further improve working efficiency.
In the utility model, rotating platform 4 includes upper mounting plate 28 and lower platform 29, and 28 inside of the upper mounting plate is equipped with first
Second hemispherical projections 31 corresponding with the first hemispherical projections 30 are arranged in hemispherical projections 30,29 inside of the lower platform,
First hemispherical projections, 30 and second hemispherical projections, 31 center is equipped with through-hole 32, and rotary shaft is equipped in the through-hole 32
Hold 33.The rotating platform stability that the utility model uses is good, can realize 360 ° of arbitrary rotations, further improve integrated electricity
Road IC integer efficiency.
Operation principle：It will wait for that integer Integrated circuit IC is placed in lower die, pin is placed on pin rest area, passes through later
Controller controls stepper motor rotation, and when optical locating point is with positioning mirror induction, stepper motor is stopped, and passes through control later
Device processed control control motor, control motor control gear rotates on rack, and to drive compression bar to move down, shaping needle is from drawing
It is pressed from top to bottom at intercrural space, by pressure, the part that pin is tilted presses down, the pin of deformation is allowed to revert to integer column
Normal position；Control stepper motor rotation again later, carries out same operation.
In conclusion the utility model structural principle is simple, it can realize to the Electronic control of upper die and lower die, improve
Shaping efficiency；The quality of follow-up IC welding can be improved simultaneously.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (4)
1. a kind of semi-automatic pin shaping machine of Integrated circuit IC, including pedestal（1）, upper mold（2）, lower die（3）And rotating platform
（4）, it is characterised in that：The rotating platform（4）Mounted on pedestal（1）On, the rotating platform（4）Upper surface is equipped with multiple
Lower die（3）, the lower die（3）Center is equipped with groove（5）, the lower die（3）Both sides are equipped with pin rest area（6）, the groove
（5）Size is consistent with Integrated circuit IC size, the upper mold（2）It is arranged in rotating platform（4）Surface, the pedestal（1）On
It is installed with guide rod（7）, the upper mold（2）Both sides are provided with through-hole, the guide rod（7）Through through-hole, the pedestal（1）
Rear end is installed with baffle（8）, the baffle（8）Middle part is equipped with sliding rail（9）, the sliding rail（9）It is interior to be equipped with rack（10）, institute
State upper mold（2）It is installed with compression bar in the middle part of upper surface（11）, the compression bar（11）Rear end is fixedly connected with connecting rod（12）, described
Connecting rod（12）It is equipped with rack（10）Matched gear（13）, the connecting rod（12）Top is equipped with control motor（14）；
The guide rod（7）Top is equipped with block（15）, and the block（15）With upper mold（2）Compression is fixedly mounted between upper surface
Spring（16）, and the compressed spring（16）It is set in guide rod（7）Outer wall, the upper mold（2）Inside is separately installed with shaping
Needle（17）With shaping column（18）；The pedestal（1）It is interior to be equipped with controller（19）, the pedestal（1）Inside it is additionally provided with stepper motor
（20）, the stepper motor（20）Pass through rotary shaft（21）Connect rotating platform（4）；The stepper motor（20）With control motor
（14）It is separately connected controller（19）；
The lower die（3）It is equipped with positioning optical point（22）；The upper mold（2）It is equipped with and positioning optical point（22）Corresponding light
Learn mirror（23）.
2. the semi-automatic pin shaping machine of a kind of Integrated circuit IC according to claim 1, it is characterised in that：The compression bullet
Spring（16）Including the first contact jaw（24）, the second contact jaw（25）And spring body（26）, the spring body（26）By a length
Bullion or resin annular rotate, and in the shape of a spiral, the spring body（26）It is equipped with multiple equidistant spirals
Circle body（27）, first contact jaw（24）With the second contact jaw（25）It is separately positioned on spring body（26）Top and bottom
Portion, and first contact jaw（24）, the second contact jaw（25）It is horizontal plane；First contact jaw（24）It is fixedly connected with gear
Block（15）, second contact jaw（25）It is fixedly connected with upper mold（2）.
3. the semi-automatic pin shaping machine of a kind of Integrated circuit IC according to claim 1, it is characterised in that：The rotary flat
Platform（4）Including upper mounting plate（28）And lower platform（29）, the upper mounting plate（28）Inside is equipped with the first hemispherical projections（30）, described
Lower platform（29）Inside is arranged and the first hemispherical projections（30）Corresponding second hemispherical projections（31）, first hemisphere
Shape protrusion（30）With the second hemispherical projections（31）Center is equipped with through-hole（32）, the through-hole（32）Swivel bearing is inside installed
（33）.
4. the semi-automatic pin shaping machine of a kind of Integrated circuit IC according to claim 1, it is characterised in that：The shaping column
（18）Lower end uses hemispherical dome structure；The shaping needle（17）Lower end is pyramidal structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820052071.XU CN207743207U (en) | 2018-01-12 | 2018-01-12 | A kind of semi-automatic pin shaping machine of Integrated circuit IC |
| PCT/CN2018/099752 WO2019136974A1 (en) | 2018-01-12 | 2018-08-09 | Semi-automatic machine for correcting shape of integrated circuit (ic) pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820052071.XU CN207743207U (en) | 2018-01-12 | 2018-01-12 | A kind of semi-automatic pin shaping machine of Integrated circuit IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207743207U true CN207743207U (en) | 2018-08-17 |
Family
ID=63122813
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820052071.XU Active CN207743207U (en) | 2018-01-12 | 2018-01-12 | A kind of semi-automatic pin shaping machine of Integrated circuit IC |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207743207U (en) |
| WO (1) | WO2019136974A1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109164166A (en) * | 2018-08-20 | 2019-01-08 | 河北省特种设备监督检验研究院 | A kind of novel panel weld Magnetic testing device |
| CN110426923A (en) * | 2019-07-31 | 2019-11-08 | 江苏盟星智能科技有限公司 | A kind of helical scan type laser explosure equipment and its method of operation |
| CN112355500A (en) * | 2020-10-21 | 2021-02-12 | 陶秋桐 | Automatic welding mechanism for novel material semiconductor chip pins |
| CN114566204A (en) * | 2022-02-28 | 2022-05-31 | 江苏华存电子科技有限公司 | Test device for super block in flash memory based on rapid identification technology |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110648955B (en) * | 2019-08-28 | 2021-12-28 | 日照鲁光电子科技有限公司 | Production equipment and production method of crystal diode |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203887111U (en) * | 2014-04-21 | 2014-10-22 | 厦门睿动智能科技有限公司 | Pin shaping mechanism |
| KR20190003815A (en) * | 2016-05-27 | 2019-01-09 | 어플라이드 머티어리얼스, 인코포레이티드 | Electrostatic Chuck Impedance Evaluation |
| CN206169129U (en) * | 2016-11-09 | 2017-05-17 | 四川明泰电子科技有限公司 | DIP encapsulation and integration circuit pin shaping device |
| CN206790798U (en) * | 2017-05-17 | 2017-12-22 | 东莞市展荣电子设备有限公司 | A pin shaping mechanism for electronic components |
-
2018
- 2018-01-12 CN CN201820052071.XU patent/CN207743207U/en active Active
- 2018-08-09 WO PCT/CN2018/099752 patent/WO2019136974A1/en active Application Filing
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109164166A (en) * | 2018-08-20 | 2019-01-08 | 河北省特种设备监督检验研究院 | A kind of novel panel weld Magnetic testing device |
| CN110426923A (en) * | 2019-07-31 | 2019-11-08 | 江苏盟星智能科技有限公司 | A kind of helical scan type laser explosure equipment and its method of operation |
| CN112355500A (en) * | 2020-10-21 | 2021-02-12 | 陶秋桐 | Automatic welding mechanism for novel material semiconductor chip pins |
| CN114566204A (en) * | 2022-02-28 | 2022-05-31 | 江苏华存电子科技有限公司 | Test device for super block in flash memory based on rapid identification technology |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN117637536B (en) * | 2023-11-09 | 2024-06-11 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019136974A1 (en) | 2019-07-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semi -automatic pin reshaper of integrated circuit IC Effective date of registration: 20190107 Granted publication date: 20180817 Pledgee: Nantong Productivity Promotion Center Pledgor: Jiangsu Hua Cun Electronic Technology Co., Ltd. Registration number: 2019980000005 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20200628 Granted publication date: 20180817 Pledgee: Nantong Productivity Promotion Center Pledgor: JIANGSU HUACUN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: 2019980000005 |