CN115376970A - Integrated circuit packaging process - Google Patents
Integrated circuit packaging process Download PDFInfo
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- CN115376970A CN115376970A CN202211106774.3A CN202211106774A CN115376970A CN 115376970 A CN115376970 A CN 115376970A CN 202211106774 A CN202211106774 A CN 202211106774A CN 115376970 A CN115376970 A CN 115376970A
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- 238000012858 packaging process Methods 0.000 title claims abstract description 17
- 238000005452 bending Methods 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 58
- 238000001125 extrusion Methods 0.000 claims description 36
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 238000005520 cutting process Methods 0.000 claims description 11
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 10
- 239000004033 plastic Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000007648 laser printing Methods 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 31
- 229910052751 metal Inorganic materials 0.000 abstract description 31
- 238000002360 preparation method Methods 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 18
- 238000013459 approach Methods 0.000 description 3
- 210000002421 cell wall Anatomy 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67138—Apparatus for wiring semiconductor or solid state device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention belongs to the technical field of integrated circuit preparation, and particularly relates to an integrated circuit packaging process, which comprises the following steps: the method comprises the following steps: wafer dicing, the die is first mounted on a support ring with a film, and the wafer is then diced into very small particles according to the existing cell format. When needs are bent to integrated circuit's metal pin as required, twist and move the regulation pole, make two movable blocks move down at the top of bracing piece and make progress to the assigned height, place integrated circuit in the die cavity afterwards, start electric telescopic handle after that, make the clamp plate compress tightly integrated circuit under the drive of depression bar, along with electric telescopic handle's further extension, two commentaries on classics boards can be moved down to the direction that leaves mutually at the pressure of fixed plate and deflect, thereby the cooperation movable block is accomplished the operation of bending to the not co-altitude requirement of metal pin, the trouble that the mould of bending brought has been avoided changing.
Description
Technical Field
The invention belongs to the technical field of integrated circuit preparation, and particularly relates to an integrated circuit packaging process.
Background
An integrated circuit is a microelectronic device or component. The transistor, the resistor, the capacitor, the inductor and other elements and wires required in a circuit are interconnected together by adopting a certain process, are manufactured on a small or a plurality of small semiconductor wafers or medium substrates, and are then packaged in a tube shell to form a micro structure with the required circuit function; all the elements are structurally integrated, so that the electronic elements are greatly miniaturized, low in power consumption, intelligent and high in reliability.
When the existing integrated circuit is packaged, the metal pins are required to be bent into a designated shape, and for the same type of integrated circuit, when the integrated circuit is used on different electrical equipment, the bending heights of the metal pins are different, so that when the metal pins are bent, corresponding bending dies need to be replaced, and the integrated circuit is very troublesome.
Therefore, it is necessary to invent an integrated circuit packaging process to solve the above problems.
Disclosure of Invention
In view of the above problems, the present invention provides an integrated circuit packaging process to solve the above problems in the background art.
In order to achieve the purpose, the invention provides the following technical scheme: an integrated circuit packaging process, comprising the steps of:
the method comprises the following steps: wafer cutting, namely firstly fixing a chip on a support ring by using a film, and then cutting the wafer into very tiny particles according to the existing unit format;
step two: wafer pasting, namely pasting the cut wafer particles on a wafer of a lead frame by using silver paste, and pasting the cut chips on an intermediate bonding pad of the lead frame by using an adhesive;
step three: gold wire bonding, wherein bonding pressure points on the wafer are connected to inner pins on the lead frame by using superfine gold wires, so that circuits of the wafer are connected to the pins;
step four: plastic packaging, namely placing the chip and the lead frame which are subjected to lead bonding in a packaging assembly, and injecting plastic packaging compound epoxy resin for wrapping gold wires on the wafer and the lead frame;
step five: bending the cut ribs, cutting off and separating the outer pins of the lead frames which are originally connected together, and bending the outer pins into a designed shape;
step six: laser printing, wherein the laser printing is to print marks and numbers on the surface of the plastic packaging adhesive in a laser ray mode;
step seven: and (5) checking whether the appearance of the product can meet the design and standard.
Further, the encapsulation subassembly includes the mould, the bottom of mould is equipped with the base, two supporting shoes of fixedly connected with between mould and the base, the die cavity has been seted up at the top of mould, it has the movable block to all slide along vertical direction on the die cavity both sides inner wall and peg graft, and the top when the movable block is initial flushes with the mould top, two bracing pieces of bottom fixedly connected with of movable block, the bottom of bracing piece slides and runs through and peg graft on the bottom inner wall of mould, and is a plurality of the same square board of bottom fixedly connected with of bracing piece, the center department vertical thread of square board runs through and pegs graft and has adjusted the pole, the top and the mould bottom of adjusting the pole rotate and be connected, the top level of mould is equipped with the fixed plate, the bottom of fixed plate is connected with the bending device who is used for bending the pin, the position that the fixed plate top is close to four angles all slides and runs through and pegs graft and has first gag lever, the bottom and the base top fixed connection of first gag lever, and the part that first gag lever is located the fixed plate bottom has cup jointed first spring, the top of fixed plate is equipped with the power device that drives the fixed plate up-and down motion.
Furthermore, the bending device comprises a pressing plate, the front side and the rear side of the pressing plate are fixedly connected with positioning strips, positioning grooves matched with the positioning strips are formed in the top edge openings of the front side and the rear side of the top of the mold cavity, grooves are formed in the top of the pressing plate, and the two sides of the groove are respectively communicated with the two sides of the pressure plate, a movable plate is arranged in the groove, the top of the movable plate is inserted with a plurality of second limiting rods in a sliding and penetrating way, the bottoms of the second limiting rods are fixedly connected with the inner wall of the bottom of the groove, and the part of the second limiting rod positioned at the top of the movable plate is sleeved with a second spring, the fixed plate corresponding to the right top of the second limiting rod is provided with a jack with a diameter larger than that of the second limiting rod, the two sides of the movable plate are hinged with rotating plates, the rotating plates are provided with limiting grooves in a penetrating way along the front-back direction, the two limiting grooves are in an inverted splayed shape, a sliding rod is penetrated and inserted in the limiting groove, the front end and the rear end of the sliding rod are respectively connected with a sliding block in a rotating way, sliding grooves are arranged at the positions of the bottom of the fixed plate, which are opposite to the sliding blocks, along the directions of two sides, the sliding blocks are slidably arranged in the corresponding sliding grooves, the two sides of the movable plate are vertically and fixedly connected with check blocks, the top of the movable plate is inserted with a pressure lever in a sliding way, the bottom of the pressure lever is fixedly connected with the inner wall of the bottom of the groove, the top of the pressure lever is inserted in the top of the fixed plate in a sliding way, the top of the pressure lever is fixedly connected with a movable rod, the movable rod is fixedly sleeved with an annular baffle, the top of the pressure rod is sleeved with a sliding sleeve in a sliding manner, the sliding sleeve and the part of the movable rod, which is positioned at the top of the baffle, are sleeved with a third spring, and the elasticity of the third spring is greater than the maximum elasticity of the second spring, the top of the sliding sleeve is fixedly connected with a second U-shaped plate, and the bottom of the second U-shaped plate is fixedly connected with the top of the fixed plate.
Further, power device includes two electric telescopic handle, electric telescopic handle's bottom and fixed plate top fixed connection, two same U-shaped board of electric telescopic handle's top fixedly connected with, and the bottom and the base top fixed connection of first U-shaped board.
Further, the inclined plane groove has all been seted up to the both sides of clamp plate, the side and the bottom cell wall in inclined plane groove communicate with the side and the bottom of clamp plate respectively, and the height in inclined plane groove is uprised gradually by the middle part of clamp plate to the direction of side, the inclined plane inslot is equipped with the extrusion piece, the top surface of extrusion piece is the inclined plane, and the main view of extrusion piece is right trapezoid, the first magnetic path of fixedly connected with that all inclines in the front and back side of extrusion piece, and first magnetic path is parallel with the inclined plane part of extrusion piece, all seted up on the side cell wall around the inclined plane groove with first magnetic path assorted chute, fixedly connected with second magnetic path on the cell wall of one side that the chute is up, and the magnetic pole of second magnetic path and the relative one side of first magnetic path is the same.
Furthermore, the bottom of the extrusion block is lower than the bottom of the pressing plate in a natural state, and the distance from the bottom of the extrusion block to the bottom of the pressing plate is smaller than the projection height of the opposite ends of the first magnetic block and the second magnetic block along the vertical direction.
Furthermore, one side of each of the two extrusion blocks, which is away from the other side of the two extrusion blocks, is located in the inclined plane groove, the side of each extrusion block is fixedly connected with a protection pad, and the side of each extrusion block can extend out of the inclined plane groove.
Furthermore, the number of the check blocks on two sides of the movable plate is two, the two check blocks are respectively positioned at the front side and the rear side of the rotating plate, and the bottoms of the check blocks are flush with the bottom of the movable plate.
Furthermore, the baffle is attached to the top of the fixed plate, and the height of the movable rod at the top of the baffle is larger than the distance from the positioning strip to the positioning groove.
The invention has the technical effects and advantages that:
1. when the metal pins of the integrated circuit are required to be bent according to requirements, the adjusting rod is twisted to enable the two movable blocks to move upwards to a specified height under the pushing action of the supporting rod, then the integrated circuit is placed in the die cavity, then the electric telescopic rod is started, the pressing plate is enabled to tightly press the integrated circuit under the driving of the pressing rod, along with the further extension of the electric telescopic rod, the two rotating plates can deflect towards the direction away from each other under the pressing action of the fixing plate, so that the bending operation required by the metal pins with different heights is completed by matching with the movable blocks, and the trouble caused by replacement of a bending die is avoided;
2. in the process that the pressing plate is close to the integrated circuit, the extrusion blocks can be in contact with the integrated circuit before the pressing plate, the pressing plate moves downwards along with the pressing rod, the extrusion blocks start to move along the direction of the inclined plane groove under the matching effect of the second magnetic block and the inclined groove due to the jacking of the integrated circuit, in the process, one sides of the two extrusion blocks, which are separated from each other, gradually extend out of the inclined plane groove, the metal pin of the integrated circuit is tightly extruded in the part positioned in the die cavity, when the rotating plate bends the metal pin, the connection point of the metal pin and the integrated circuit cannot move, and therefore the metal pin is prevented from being bent, looseness occurs between the metal pin and the integrated circuit due to the fact that the metal pin is pulled, and stable electric connection between the integrated circuit and the metal pin is guaranteed.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by the practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and drawings.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic perspective view of the present invention;
FIG. 2 is a schematic view of a first three-dimensional structure of a mold, a movable block, a square plate, a support rod and an adjusting rod according to the present invention;
FIG. 3 is a schematic diagram of a second three-dimensional structure of the mold, the movable block, the square plate, the support rod and the adjusting rod according to the present invention;
FIG. 4 is a schematic perspective view of a fixing plate and a bending apparatus according to the present invention;
FIG. 5 is a schematic perspective view of a portion of the bending apparatus of the present invention;
FIG. 6 is a schematic perspective view of the movable plate, the rotary plate, the sliding rod, the sliding block and the stopper of the present invention;
fig. 7 is a schematic perspective view of the pressing plate, the second limiting rod, the positioning bar and the extrusion block of the present invention.
In the figure: 1. a mold; 2. a base; 3. a movable block; 4. a support bar; 5. a square plate; 6. adjusting a rod; 7. a fixing plate; 8. a bending device; 801. pressing a plate; 802. a positioning bar; 803. a movable plate; 804. a second limiting rod; 805. a second spring; 806. a jack; 807. rotating the plate; 808. a slide bar; 809. a slider; 810. a stopper; 811. a pressure lever; 812. a movable rod; 813. a baffle plate; 814. a sliding sleeve; 815. a third spring; 816. a second U-shaped plate; 9. a first limit rod; 10. a first spring; 11. a power plant; 110. an electric telescopic rod; 111. a first U-shaped plate; 12. extruding the block; 13. a first magnetic block; 14. a second magnetic block; 15. a protective pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides an integrated circuit packaging process as shown in fig. 1-7, comprising the following steps:
the method comprises the following steps: wafer cutting, namely fixing a chip on a support ring by using a film, then cutting the wafer into tiny particles according to the existing unit format, and cooling the temperature generated by cutting by using deionized water during cutting, wherein the wafer is antistatic;
step two: wafer pasting, namely pasting the cut wafer particles on a wafer of a lead frame by using silver paste, pasting the cut chips on an intermediate bonding pad of the lead frame by using an adhesive, and using epoxy or polyimide as a filler to increase the thermal conductivity of the adhesive during pasting;
step three: bonding a gold wire, namely connecting bonding pressure points on the wafer to inner pins on a lead frame by using an ultrafine gold wire to ensure that a circuit of the wafer is connected to the pins, sintering one end of the gold wire into a small ball during bonding, bonding the small ball to a first welding point, pulling the gold wire according to a set program, and bonding the gold wire to a second welding point;
step four: plastic packaging, namely placing the chip and the lead frame which are subjected to lead bonding in a packaging assembly, and injecting plastic packaging compound epoxy resin for wrapping gold wires on the wafer and the lead frame;
step five: bending the cut ribs, cutting off and separating the outer pins of the lead frames which are originally connected together, and bending the outer pins into a designed shape;
step six: laser printing, wherein the laser printing is to print marks and numbers on the surface of the plastic packaging adhesive in a laser ray mode;
step seven: and (5) checking whether the appearance of the product can meet the design and standard.
As shown in the figures, the packaging assembly comprises a mold 1, a base 2 is arranged at the bottom of the mold 1, two support blocks are fixedly connected between the mold 1 and the base 2, a mold cavity is formed in the top of the mold 1, movable blocks 3 are slidably inserted into inner walls of two sides of the mold cavity in the vertical direction, the top of each movable block 3 is flush with the top of the mold 1 at the beginning, two support rods 4 are fixedly connected to the bottom of each movable block 3, the bottoms of the support rods 4 are slidably inserted into inner walls of the bottom of the mold 1, a same square plate 5 is fixedly connected to the bottoms of the support rods 4, an adjusting rod 6 is vertically screwed into the center of the square plate 5, the top of the adjusting rod 6 is rotatably connected to the bottom of the mold 1, a fixed plate 7 is horizontally arranged at the top of the mold 1, a bending device 8 for bending is connected to the bottom of the fixed plate 7, a first limit rod 9 is slidably inserted into the position, close to the top of the fixed plate 7, the bottom of the fixed plate 9 is fixedly connected to the top of the base 2, a first spring 10 is sleeved on the bottom of the fixed plate 7, a top of the fixed plate 7, and a power device 11 is connected to the top of the fixed plate of the telescopic rod 111, and the top of the telescopic rod is connected to the first telescopic rod 11;
when the metal pins of the integrated circuit are bent as required, the adjusting rod 6 can be screwed, so that the square plate 5 pushes the two movable blocks 3 to move upwards through the supporting rods 4 under the action of the adjusting rod 6, when the top of each movable block 3 is adjusted to an appointed bending height, the integrated circuit is placed in the die cavity, the metal pins on the two sides of the integrated circuit are tightly attached to the two movable blocks 3, then the electric telescopic rod 110 is started, the fixed plate 7 drives the bending device 8 to approach the integrated circuit under the action of the electric telescopic rod 110, after the bending device 8 is contacted with the integrated circuit, the integrated circuit can be fixed in the die cavity of the die 1 firstly by the bending device 8, along with the continuous extension of the electric telescopic rod 110, the bending device 8 can bend the metal pins on the two sides of the integrated circuit according to the height of the movable blocks 3, the bending operation of the integrated circuit on different height requirements of the metal pins is met, and the trouble caused by replacing the bending die 1 is avoided.
As shown in fig. 1-7, the bending apparatus 8 includes a pressing plate 801, a positioning bar 802 is fixedly connected to both front and rear sides of the pressing plate 801, positioning grooves matched with the positioning bar 802 are formed on top edge openings of both front and rear sides of a top of the mold cavity, a groove is formed on a top of the pressing plate 801, both sides of the groove are respectively communicated with both sides of the pressing plate 801, a movable plate 803 is disposed in the groove, a plurality of second limiting rods 804 are slidably inserted into a top of the movable plate 803, a bottom of the second limiting rods 804 is fixedly connected to an inner wall of a bottom of the groove, a portion of the second limiting rods 804 located at a top of the movable plate 803 is sleeved with a second spring 805, a plug hole 806 having a larger diameter than that of the second limiting rods 804 is formed in the fixed plate 7 corresponding to a top of the second limiting rods 804, rotating plates 807 are hinged to both sides of the movable plate 803, a limiting groove is formed in the rotating plates 807 in a front-back direction, the two limiting grooves are inverted splayed, a sliding rod 808 is penetratingly inserted in the limiting grooves, the front end and the rear end of the sliding rod 808 are respectively and rotatably connected with a sliding block 809, the bottom of the fixed plate 7, which is opposite to the sliding block 809, is provided with sliding grooves along two side directions, the sliding block 809 is slidably mounted in the corresponding sliding grooves, two sides of the movable plate 803 are respectively and fixedly connected with a stop block 810 vertically, the top of the movable plate 803 is inserted with a pressing rod 811 in a sliding manner, the bottom of the pressing rod 811 is fixedly connected with the inner wall of the bottom of the groove, the top of the pressing rod 811 is inserted at the top of the fixed plate 7 in a sliding manner, the top of the pressing rod 811 is fixedly connected with a movable rod 812, an annular baffle 813 is fixedly sleeved on the movable rod 812, a sliding sleeve 814 is sleeved at the top of the pressing rod 811 in a sliding manner, and a third spring 815 is sleeved on the parts, which are positioned at the tops of the sliding sleeve 814 and the movable rod 812, the elasticity of the third spring 815 is greater than the maximum elasticity of the second spring 805, a second U-shaped plate 816 is fixedly connected to the top of the sliding sleeve 814, the bottom of the second U-shaped plate 816 is fixedly connected to the top of the fixed plate 7, the number of the stoppers 810 on both sides of the movable plate 803 is two, the two stoppers 810 are respectively located at the front and rear sides of the rotating plate 807, the bottoms of the stoppers 810 are flush with the bottom of the movable plate 803, the stoppers 813 are tightly attached to the top of the fixed plate 7, and the height of the movable rod 812 at the top of the stoppers 813 is greater than the distance from the positioning strip 802 to the positioning groove;
when the movable blocks 3 are adjusted to the designated bending height under the action of the adjusting rods 6, the integrated circuit is placed in the mold cavity, the metal pins at the two sides of the integrated circuit are tightly attached to the two movable blocks 3, then the electric telescopic rod 110 is started, the fixed plate 7 drives the pressing plate 801 to approach the integrated circuit under the action of the electric telescopic rod 110, in the process, when the stopper 810 is in contact with the top of the movable rod 812, the pressing plate 801 can keep continuously moving downwards due to the pressure of the third spring 815 on the baffle 813, the movable plate 803 starts moving upwards relative to the pressing plate 801 due to the blockage of the stopper 810 by the movable blocks 3, so that the second spring 805 is gradually compressed, along with the continuous extension of the electric telescopic rod 110, the pressing plate 801 continuously moves downwards to enter the mold cavity and gradually contacts with the integrated circuit, and after the positioning strips 802 at the front and back sides of the pressing plate 801 gradually enter the corresponding positioning grooves, the integrated circuit can be pressed by the third spring 815 through the pressure of the baffle 813, the movable rod 812 and the pressure lever 811 on the pressure plate 801, the pressure plate 801 stops moving due to the blocking of the positioning slot to the positioning bar 802, the fixed plate 7 continues to move downwards along with the further extension of the electric telescopic rod 110, at this time, the sliding rod 808 moves downwards along the limiting slot under the action of the fixed plate 7, the two rotating plates 807 can deflect a certain angle in the direction that the hinge point of the rotating plate 807 and the movable plate 803 is axially separated under the action of the sliding rod 808 on the inclined slot, so that when the fixed plate 7 continues to move downwards, the two rotating plates 807 can push the sliding block 809 to move along the sliding slot under the pressing of the fixed plate 7, and further deflection requirements of the rotating plates 807 are met, and along with the deflection of the rotating plates 807, the movable rod 812 is gradually retracted into the sliding sleeve 814, and the third spring 815 is gradually retracted under the extrusion of the baffle 813, meanwhile, the metal pins on the two sides of the integrated circuit can be gradually bent by the two rotating plates 807, and the bending height is the height of the top of the movable block 3, so that the requirements of the integrated circuit on different bending heights of the metal pins are met;
in addition, because the deflection angle of the rotating plate 807 is related to the downward movement distance of the fixing plate 7, the bending angle of the metal pins of the integrated circuit can be controlled by controlling the descending distance of the fixing plate 7, so that the requirements of the integrated circuit on different bending angles of the metal pins are further met.
As shown in fig. 4 and 7, two sides of the pressing plate 801 are both provided with an inclined groove, a side surface and a bottom groove wall of the inclined groove are respectively communicated with a side surface and a bottom of the pressing plate 801, the height of the inclined groove gradually increases from the middle of the pressing plate 801 to the side surface, an extrusion block 12 is arranged in the inclined groove, the top surface of the extrusion block 12 is an inclined surface, the front view of the extrusion block 12 is in a right trapezoid shape, the front side and the back side of the extrusion block 12 are both obliquely and fixedly connected with a first magnetic block 13, the first magnetic block 13 is parallel to the inclined surface of the extrusion block 12, the front side and the back side groove walls of the inclined groove are both provided with an inclined groove matched with the first magnetic block 13, the groove wall on the upward side of the inclined groove is fixedly connected with a second magnetic block 14, the magnetic pole of the second magnetic block 14 on the opposite side to the first magnetic block 13 is the same, the bottom of the extrusion block 12 is lower than the bottom of the pressing plate 801 in a natural state, the distance from the bottom of the extrusion block 12 to the pressing plate 801 is smaller than the projection height of the opposite ends of the first magnetic block 13 and the second magnetic block 14 along the vertical direction, one side is located in the inclined groove, and the extrusion block 12, and the protection pad 15 is connected with the extrusion block 12 on the outer side of the fixed side;
in the process that the pressing plate 801 approaches to the integrated circuit, the pressing block 12 can contact with the integrated circuit before the pressing plate 801, and the pressing plate 801 continues to be pressed and moved downwards along with the pressing rod 811, the pressing block 12 starts to move along the direction of the inclined plane groove inclined plane under the matching action of the second magnetic block 14 and the inclined groove due to the jacking of the integrated circuit, in the process, the bottom of the pressing block 12 gradually retracts into the inclined plane groove, the side where the two pressing blocks 12 are away from each other gradually extends out of the inclined plane groove, and along with the continuous downward movement of the pressing plate 801, the protection pad 15 on the pressing block 12 gradually presses against the part of the metal pin of the integrated circuit, when the bottom of the pressing block 12 is flush with the bottom of the pressing plate 801, the side of the pressing block 12 can be matched with the movable block 3 to fix the metal, so that when the rotating plate 807 bends the metal pin, the connection point of the metal pin and the integrated circuit cannot move, and further, in the process of bending the metal pin, the metal pin is prevented from being pulled to cause looseness between the metal pin and stable electrical connection between the metal pin and the integrated circuit is ensured;
after the bending is completed, along with the gradual contraction of the electric telescopic rod 110, the pressing plate 801 is gradually separated from the integrated circuit, and at this time, the first magnetic block 13 drives the extrusion block 12 to gradually and automatically return to the original position along the inclined plane direction of the inclined plane groove under the action of the repulsive force of the second magnetic block 14 to the first magnetic block, so that the next bending operation is facilitated.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. An integrated circuit packaging process, comprising: the method comprises the following steps:
the method comprises the following steps: wafer cutting, namely fixing a chip on a support ring by using a film, and cutting the wafer into very tiny particles according to the existing unit format;
step two: wafer pasting, namely pasting the cut wafer particles on a wafer of a lead frame by using silver paste, and pasting the cut chips on an intermediate bonding pad of the lead frame by using an adhesive;
step three: gold wire bonding, wherein bonding pressure points on the wafer are connected to inner pins on the lead frame by using superfine gold wires, so that circuits of the wafer are connected to the pins;
step four: plastic packaging, namely placing the chip and the lead frame which are subjected to lead bonding in a packaging assembly, and injecting a plastic packaging compound epoxy resin for wrapping gold wires on the wafer and the lead frame;
step five: bending the cut ribs, cutting off and separating the outer pins of the lead frames which are originally connected together, and bending the outer pins into a designed shape;
step six: laser printing, wherein the laser printing is to print marks and numbers on the surface of the plastic packaging adhesive in a laser ray mode;
step seven: and (5) checking whether the appearance of the product can meet the design and standard.
2. The integrated circuit packaging process of claim 1, wherein: the packaging assembly comprises a mold (1), a base (2) is arranged at the bottom of the mold (1), two supporting blocks are fixedly connected between the mold (1) and the base (2), a mold cavity is formed in the top of the mold (1), movable blocks (3) are inserted into the inner walls of two sides of the mold cavity in a sliding mode along the vertical direction, the top of each movable block (3) is flush with the top of the mold (1) at the initial stage, two supporting rods (4) are fixedly connected to the bottom of each movable block (3), the bottoms of the supporting rods (4) are inserted into the inner wall of the bottom of the mold (1) in a sliding mode, a plurality of square plates (5) are fixedly connected to the bottoms of the supporting rods (4), an adjusting rod (6) is inserted into the center of each square plate (5) in a vertical threaded mode, the top of each adjusting rod (6) is rotatably connected with the bottom of the mold (1), a fixing plate (7) is horizontally arranged at the top of the mold (1), a bending device (8) for bending pins is connected to the bottom of the fixing plate (7), first sleeved connecting rod (9) is positioned at the top of the first limiting rod (9), and a first limiting rod (10) is positioned at the top of the first limiting rod (9), and a power device (11) for driving the fixing plate (7) to move up and down is arranged at the top of the fixing plate (7).
3. The integrated circuit packaging process of claim 2, wherein: the bending device (8) comprises a pressing plate (801), positioning strips (802) are fixedly connected to the front side and the rear side of the pressing plate (801), positioning grooves matched with the positioning strips (802) are formed in the top edge openings of the front side and the rear side of the top of the mold cavity, a groove is formed in the top of the pressing plate (801), two sides of the groove are respectively communicated with two sides of the pressing plate (801), a movable plate (803) is arranged in the groove, a plurality of second limiting rods (804) are inserted in the top of the movable plate in a sliding manner in a penetrating manner, the bottom of each second limiting rod (804) is fixedly connected with the inner wall of the bottom of the groove, a second spring (805) is sleeved on the part, located at the top of the movable plate (803), of each second limiting rod (804), corresponding to the top of the corresponding fixed plate (7), a jack (806) with an aperture larger than that of the second limiting rods (804) is formed in a penetrating manner, rotating plates (807) are hinged to two sides of the movable plate (803), limiting grooves are formed in a penetrating manner along the front-back direction of the fixed plate (807), two limiting grooves are in an inverted splayed manner, sliding grooves are formed in the limiting grooves, sliding grooves (808) are vertically penetrated through the sliding grooves, sliding blocks (808) and are vertically connected with sliding blocks (809) which are arranged in the sliding blocks (808), the top of fly leaf (803) slides and runs through grafting and has been had depression bar (811), the bottom and the recess bottom inner wall fixed connection of depression bar (811), the top of depression bar (811) slides and runs through the top of grafting at fixed plate (7), the top fixedly connected with movable rod (812) of depression bar (811), it has annular baffle (813) to fix the cover on movable rod (812) to connect, sliding sleeve (814) has been cup jointed in the top of depression bar (811) in the sliding, the part that sliding sleeve (814) and movable rod (812) are located baffle (813) top has cup jointed third spring (815), and the elasticity of third spring (815) is greater than the biggest elasticity of second spring (805), the top fixedly connected with second U-shaped board (816) of sliding sleeve (814), the bottom and the top fixed connection of fixed plate (7) of second U-shaped board (816).
4. The integrated circuit packaging process of claim 2, wherein: power device (11) include two electric telescopic handle (110), the bottom and fixed plate (7) top fixed connection of electric telescopic handle (110), two the same first U-shaped plate (111) of top fixedly connected with of electric telescopic handle (110), and the bottom and base (2) top fixed connection of first U-shaped plate (111).
5. The integrated circuit packaging process of claim 3, wherein: the magnetic pole type magnetic block pressing machine is characterized in that inclined plane grooves are formed in two sides of the pressing plate (801), the side face and the bottom groove wall of each inclined plane groove are communicated with the side face and the bottom of the pressing plate (801) respectively, the height of each inclined plane groove is gradually increased from the middle of the pressing plate (801) to the side face, an extrusion block (12) is arranged in each inclined plane groove, the top face of each extrusion block (12) is an inclined plane, the front view of each extrusion block (12) is in a right trapezoid shape, first magnetic blocks (13) are fixedly connected to the front side and the rear side of each extrusion block (12) in an inclined mode, the inclined planes of the first magnetic blocks (13) are parallel to the inclined plane of each extrusion block (12), inclined grooves matched with the first magnetic blocks (13) are formed in the front side and the rear side of each inclined plane groove, second magnetic blocks (14) are fixedly connected to the groove wall of the upward side of each inclined groove, and the magnetic poles of the second magnetic blocks (14) are the same as the magnetic poles of the opposite sides of the first magnetic blocks (13).
6. The integrated circuit packaging process of claim 5, wherein: the bottom of the extrusion block (12) is lower than the bottom of the pressing plate (801) in a natural state, and the distance from the bottom of the extrusion block (12) to the bottom of the pressing plate (801) is smaller than the projection height of the opposite ends of the first magnetic block (13) and the second magnetic block (14) along the vertical direction.
7. The integrated circuit packaging process of claim 6, wherein: two one side that extrusion piece (12) leave all is located the inclined plane inslot, this side fixedly connected with protection pad (15) of extrusion piece (12), and this side of extrusion piece (12) can stretch out outside the inclined plane groove.
8. The integrated circuit packaging process of claim 3, wherein: the number of the stop blocks (810) on two sides of the movable plate (803) is two, the two stop blocks (810) are respectively positioned at the front side and the rear side of the rotating plate (807), and the bottoms of the stop blocks (810) are flush with the bottom of the movable plate (803).
9. The integrated circuit packaging process of claim 3, wherein: the baffle (813) is attached to the top of the fixing plate (7), and the height of the movable rod (812) at the top of the baffle (813) is larger than the distance from the positioning strip (802) to the positioning groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211106774.3A CN115376970A (en) | 2022-09-13 | 2022-09-13 | Integrated circuit packaging process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211106774.3A CN115376970A (en) | 2022-09-13 | 2022-09-13 | Integrated circuit packaging process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115376970A true CN115376970A (en) | 2022-11-22 |
Family
ID=84070824
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211106774.3A Withdrawn CN115376970A (en) | 2022-09-13 | 2022-09-13 | Integrated circuit packaging process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115376970A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116713409A (en) * | 2023-05-13 | 2023-09-08 | 山东隽宇电子科技有限公司 | Automatic rib cutting equipment for semiconductor processing |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN117954411A (en) * | 2024-03-26 | 2024-04-30 | 成都电科星拓科技有限公司 | Flat type packaging structure supporting double-sided pins and process |
| CN117637536B (en) * | 2023-11-09 | 2024-06-11 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
-
2022
- 2022-09-13 CN CN202211106774.3A patent/CN115376970A/en not_active Withdrawn
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116713409A (en) * | 2023-05-13 | 2023-09-08 | 山东隽宇电子科技有限公司 | Automatic rib cutting equipment for semiconductor processing |
| CN116713409B (en) * | 2023-05-13 | 2024-03-08 | 山东隽宇电子科技有限公司 | Automatic rib cutting equipment for semiconductor processing |
| CN117637536A (en) * | 2023-11-09 | 2024-03-01 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN117637536B (en) * | 2023-11-09 | 2024-06-11 | 扬州奕丞科技有限公司 | Processing device based on semiconductor device |
| CN117954411A (en) * | 2024-03-26 | 2024-04-30 | 成都电科星拓科技有限公司 | Flat type packaging structure supporting double-sided pins and process |
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Application publication date: 20221122 |