CN216793481U

CN216793481U - Chip capacitor structure and chip capacitor pin forming device

Info

Publication number: CN216793481U
Application number: CN202220106378.XU
Authority: CN
Inventors: 钟伟其; 罗秀珍; 钟述红; 黄丽华
Original assignee: Dongguan Ruiqi Precision Machinery Co ltd
Current assignee: Dongguan Ruiqi Precision Machinery Co ltd
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-06-21
Anticipated expiration: 2032-01-14

Abstract

The utility model belongs to the technical field of capacitor production equipment, and particularly relates to a chip capacitor structure and a chip capacitor pin forming device. The chip capacitor structure comprises a capacitor and a chip base, wherein two through holes are formed in the chip base, and two pins of the capacitor penetrate through the corresponding through holes and are bent and attached to the bottom of the chip base; the pins of the capacitor which are bent and attached to the bottom of the patch base are of a flat structure. The chip capacitor pin forming device comprises an indexing turntable, a clamping mechanism, a mounting seat, a supporting die, two extrusion dies and a pushing mechanism; a plurality of groups of clamping mechanisms are uniformly arranged on the edge of the indexing turntable and used for clamping the capacitor; the mounting seat is arranged at the bottom side of the indexing turntable, the supporting die is arranged at the top end of the mounting seat, the two extrusion dies are arranged at two sides of the supporting die in a relatively sliding manner, and a gap is directly formed between the supporting die and the extrusion dies; the pushing mechanism is connected with the two extrusion dies and used for driving the two extrusion dies to slide relatively. The formed capacitor can increase the stability of the paster welding and effectively avoid the problem that the capacitor falls off after welding.

Description

Chip capacitor structure and chip capacitor pin forming device

Technical Field

The utility model belongs to the technical field of chip capacitors, and particularly relates to a chip capacitor structure and a chip capacitor pin forming device.

Background

The capacitor is an indispensable electronic component in an electronic product, and the capacitor generally includes two pins, and the two pins are connected to a circuit board by soldering. At present, the capacitor is welded on a circuit board usually by adopting an insert or a patch. Before the capacitor is welded, the base needs to be sleeved on the pins of the capacitor, the connecting pins are bent and attached to the bottom of the base, and redundant pins are cut off. Usually, the pin of the capacitor is of a round thin rod structure, the pin is folded into the bottom of the base and is pasted on a circuit board, and the pin is of an arc surface, so that when the capacitor is pasted on the circuit board, the stability is poor, the welding surface is small, and the paster can fall off easily after being welded.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a chip capacitor structure and a chip capacitor pin forming device, which solve the problem of poor stability of the conventional chip capacitor.

In order to achieve the above object, the embodiment of the present invention provides a chip capacitor structure, which includes a capacitor and a chip base, wherein the chip base is provided with two through holes, and two pins of the capacitor pass through the corresponding through holes and are bent and attached to the bottom of the chip base; the pins of the capacitor, which are bent and attached to the bottom of the patch base, are of flat structures.

The chip capacitor pin forming device is used for extruding pins of the capacitor; the chip capacitor pin forming device comprises an indexing turntable, a clamping mechanism, a mounting seat, a supporting die, two extrusion dies and a pushing mechanism; a plurality of groups of clamping mechanisms are uniformly arranged on the edge of the indexing turntable and used for clamping the capacitor; the mounting seat is arranged at the bottom side of the indexing turntable, the supporting die is arranged at the top end of the mounting seat, the two extrusion dies are arranged on two sides of the supporting die in a relatively sliding manner, and a gap is directly formed between the supporting die and the extrusion dies; the pushing mechanism is connected with the two extrusion dies and is used for driving the two extrusion dies to slide relatively; the indexing turntable is used for driving the clamping mechanism, so that the capacitor pins clamped by the clamping mechanism are positioned on two sides of the supporting die.

Further, the pushing mechanism comprises a push rod, two connecting rods and two swing arms; the upper end of the mounting seat extends to one side to form a mounting part, the supporting die is fixedly arranged on the mounting part, and the two extrusion dies are arranged on the mounting part in a relatively sliding manner; the two swing arms are relatively connected to the mounting seat in a rotating mode, the lower end of each swing arm is rotatably connected with one connecting rod, and one end of the extrusion die is abutted to the swing arms; the upper end of the push rod is rotatably connected with the two connecting rods, the lower end of the push rod is connected with the push-up mechanism, and the push-up mechanism drives the push rod to upwards push the two connecting rods.

Furthermore, the top end of the mounting seat is also provided with a guide seat, a guide hole is formed in the guide seat, and the extrusion die penetrates through the corresponding guide hole in a sliding manner.

Furthermore, the outer side of the guide seat is also provided with an extension spring connected with the extrusion die, and the extension spring is used for pulling the extrusion die to reset.

Furthermore, the supporting die is provided with clearance holes, the inner sides of the two extrusion dies are provided with positioning plates, the two positioning plates are arranged in an up-and-down overlapped mode, and the free ends of the positioning plates are provided with guide grooves.

Furthermore, the inner sides of the two extrusion dies are also provided with mounting grooves, and one end of the positioning plate is mounted in the mounting grooves; two a surface of locating plate is provided with the support step, one the locating plate support step is packed into the correspondence downwards in the mounting groove, another the locating plate support step is packed into the correspondence upwards in the mounting groove.

Furthermore, the upper end and the lower end of the two extrusion dies extend towards one side of the support die to form a support part, and the support part positioned at the upper end of the extrusion dies is provided with a space avoiding position for avoiding a pin of a capacitor.

Furthermore, two extrusion mould is close to one side of support mould still is provided with dodges the position for keep away the lower extreme of empty electric capacity pin.

One or more technical solutions in the patch capacitor structure and the patch capacitor pin forming device provided by the embodiment of the present invention at least have the following technical effects:

1. this paster electric capacity structure, the pin of laminating in the base bottom is flat structure, consequently passes through the base laminating when on the circuit board at electric capacity, has increased the area of contact of electric capacity pin with the circuit board, and then increases paster welded stability, effectively avoids the problem that drops after the electric capacity welding.

2. This paster electric capacity pin forming device, through fixture centre gripping electric capacity, and the pin of electric capacity is down, it is rotatory through the graduation carousel, and then make the pin of electric capacity can distribute the both sides of supporting the mould, through two extrusion mould relative motion of pushing mechanism drive, and then flatten with two pins of supporting the mould with electric capacity, back on the pin of electric capacity is gone up with the base suit, after the bottom of laminating the base is bent to two liang of pins, can make the flat face of electric capacity pin face down, after the laminating welding, increase electric capacity and circuit board welded stability.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a structural diagram of a patch capacitor structure according to an embodiment of the present invention.

Fig. 2 is a structural diagram of a device for forming a chip capacitor pin according to an embodiment of the present invention.

Fig. 3 is a structural diagram of a capacitor pin forming portion of the device for forming a chip capacitor pin according to an embodiment of the present invention.

Fig. 4 is a structural diagram of an extrusion die portion of a device for forming a pin of a chip capacitor according to an embodiment of the present invention.

Fig. 5 is a partially exploded view of an extrusion die of a device for forming a pin of a chip capacitor according to an embodiment of the utility model.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the embodiments of the present invention, and should not be construed as limiting the utility model.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In an embodiment of the present invention, referring to fig. 1, a chip capacitor structure includes a capacitor 1 and a chip base 2, where two through holes are formed in the chip base 2, and two pins of the capacitor 1 pass through the corresponding through holes and are bent and attached to the bottom of the chip base 2; the pins of the capacitor, which are bent and attached to the bottom of the patch base 2, are of a flat structure. Consequently, when electric capacity 1 passes through the base laminating on the circuit board, increased the area of contact of electric capacity pin and circuit board, and then increased paster welded stability, effectively avoided the problem that drops after the electric capacity welding.

The chip capacitor pin forming device is used for extruding pins of a capacitor into a flat shape, and after the chip base and the capacitor pins are assembled, the flat surface of capacitor hardware can face downwards, so that the stability of welding of the capacitor chip is improved. Referring to fig. 2 to 5, the device for forming a chip capacitor pin includes an index dial 100, a clamping mechanism 200, a mounting base 300, a supporting die 400, two extrusion dies 500, and a pushing mechanism 600. A plurality of groups of the clamping mechanisms 200 are uniformly arranged on the edge of the index dial 100, and the clamping mechanisms 200 are used for clamping the capacitor. The mounting base 300 is disposed at the bottom side of the index dial 100, the supporting die 400 is disposed at the top end of the mounting base 300, the two extrusion dies 500 are slidably disposed at both sides of the supporting die 400, and a gap is directly formed between the supporting die 400 and the extrusion dies 500. The pushing mechanism 600 is connected to the two extrusion dies 500 for driving the two extrusion dies 500 to slide relatively. The index dial 100 is used to drive the clamping mechanism 200, so that the capacitor pins clamped by the clamping mechanism 200 are located at two sides of the supporting mold 400. The paster electric capacity pin forming device of this embodiment, through fixture 200 centre gripping electric capacity, and the pin of electric capacity is down, it is rotatory through indexing turntable 100, and then make the pin of electric capacity can distribute the both sides of supporting die 400, drive two extrusion die 500 relative motion through pushing mechanism 600, and then flatten with two pins of supporting die 400 with electric capacity, back on the pin of electric capacity is gone up to the base suit, after the bottom of laminating the base is bent to two liang of pins, can make the flat face of electric capacity pin face down, after the laminating welding, increase electric capacity and circuit board welded stability.

Further, referring to fig. 3, the pushing mechanism 600 includes a push rod 601, two connecting rods 602, and two swing arms 603. The upper end of the mounting base 300 extends to one side to form a mounting portion 301, the support die 400 is fixedly arranged on the mounting portion 301, and the two extrusion dies 400 are relatively slidably arranged on the mounting portion 301. The two swing arms 603 are relatively rotatably connected to the mounting base 300, the lower end of each swing arm 603 is rotatably connected to one of the connecting rods 602, and one end of the extrusion die 500 abuts against the swing arm 603. The upper end of the push rod 601 is rotatably connected to the two connecting rods 602, and the lower end of the push rod 601 is connected to a push-up mechanism (not shown in the figure), which drives the push rod 601 to push the two connecting rods 602 upward. The two connecting rods 602 push the corresponding swing arms 603, and the swing arms 603 push the corresponding extrusion dies 500 to slide, so that the pins of the capacitor are extruded into a flat shape together with the support die 400.

Further, referring to fig. 3 and 4, a guide seat 302 is further disposed at the top end of the mounting seat 300, a guide hole is disposed in the guide seat 302, and the extrusion die 500 slidably passes through the corresponding guide hole. The extrusion die 500 is guided and limited by the guide seat 302, and the movement stability of the extrusion die 500 is increased.

Further, referring to fig. 3 and 4, an extension spring 303 corresponding to the extrusion die 500 is further disposed and connected to an outer side of the guide seat 302, and the extension spring 303 is used for pulling the extrusion die 500 to return. In this embodiment, when the extrusion die 500 is retracted by the pushing mechanism 600, the extrusion die 500 is pulled by the extension spring 303 to be reset. Specifically, when the swing arm 603 swings back, the extension spring 303 pulls the extrusion die 500 to be always abutted against the swing arm 603, and thus can reciprocate along with the swing of the swing arm 603.

Further, referring to fig. 4 and 5, clearance holes 401 are formed in the supporting die 400, positioning plates 510 are disposed on inner sides of the two extruding dies 500, the two positioning plates 510 are stacked up and down, and a guide groove 511 is formed at a free end of each positioning plate 510. In this embodiment, when the capacitor pins extend to both sides of the extrusion die 500 and the two extrusion dies 500 move towards the supporting die 400, the pins of the capacitor can be inserted into the corresponding alignment grooves 511, so that the capacitor pins are guided and positioned by the alignment grooves 511, thereby avoiding the problem of deformation of the capacitor pins when the capacitor pins are extruded by the extrusion die 500 and the supporting die 500.

Further, referring to fig. 5, the inner sides of the two extrusion dies 500 are further provided with mounting grooves, and one end of the positioning plate 510 is mounted in the mounting grooves. One surface of the two positioning plates 510 is provided with a supporting step 512, the supporting step 512 of one positioning plate 510 is downwardly installed in the corresponding mounting groove, and the supporting step 512 of the other positioning plate 510 is upwardly installed in the corresponding mounting groove. In this embodiment, after the positioning plates 510 are installed in the corresponding installation grooves, the two positioning plates 510 can be vertically staggered.

Further, referring to fig. 5, the upper and lower ends of the two extrusion dies 500 extend to one side of the support die 400 to form a support portion 520, and the support portion 520 at the upper end of the extrusion die 500 is provided with a space-avoiding portion 521 for avoiding a pin of a capacitor. In this embodiment, when the pressing die 500 and the supporting die 400 press the pins of the capacitor, the supporting portion 520 is supported on the side surface of the supporting die 400, so that a certain gap exists between the pressing die 500 and the side surface of the supporting die 400, thereby protecting the pins of the capacitor and avoiding the problem that the pins of the capacitor are broken when being bent due to too large pressing deformation of the pins of the capacitor.

Further, referring to fig. 5, an avoiding position 501 is further disposed on one side of the two extrusion dies 500 close to the support die 400, and is used for avoiding the lower end of the capacitor pin. In this embodiment, when extrusion die 500 extrudees the electric capacity pin with supporting die 400, can keep away the sky to the lower extreme of electric capacity pin, avoid the lower extreme of electric capacity pin to be extruded for the lower extreme of electric capacity pin keeps as original state structure, and then is convenient for the electric capacity pin to insert in the through-hole of paster base.

The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip capacitor structure comprises a capacitor and a chip base, wherein two through holes are formed in the chip base, and two pins of the capacitor penetrate through the corresponding through holes and are bent and attached to the bottom of the chip base; the capacitor is characterized in that the pins of the capacitor, which are bent and attached to the bottom of the chip base, are of flat structures.

2. A lead forming device for a chip capacitor, which is used for extruding and forming a lead of the capacitor in claim 1; the chip capacitor pin forming device comprises an indexing turntable, a clamping mechanism, a mounting seat, a supporting die, two extrusion dies and a pushing mechanism; a plurality of groups of clamping mechanisms are uniformly arranged on the edge of the indexing turntable and used for clamping the capacitor; the mounting seat is arranged at the bottom side of the indexing turntable, the supporting die is arranged at the top end of the mounting seat, the two extrusion dies are arranged on two sides of the supporting die in a relatively sliding manner, and a gap is directly formed between the supporting die and the extrusion dies; the pushing mechanism is connected with the two extrusion dies and is used for driving the two extrusion dies to slide relatively; the indexing turntable is used for driving the clamping mechanism, so that the capacitor pins clamped by the clamping mechanism are positioned on two sides of the supporting die.

3. The device of claim 2, wherein: the pushing mechanism comprises a push rod, two connecting rods and two swing arms; the upper end of the mounting seat extends to one side to form a mounting part, the supporting die is fixedly arranged on the mounting part, and the two extrusion dies are arranged on the mounting part in a relatively sliding manner; the two swing arms are relatively connected to the mounting seat in a rotating mode, the lower end of each swing arm is rotatably connected with one connecting rod, and one end of the extrusion die is abutted to the swing arms; the upper end of the push rod is rotatably connected with the two connecting rods, the lower end of the push rod is connected with the push-up mechanism, and the push-up mechanism drives the push rod to upwards push the two connecting rods.

4. The patch capacitor pin forming device of claim 2 or 3, wherein: the top end of the mounting seat is further provided with a guide seat, a guide hole is formed in the guide seat, and the extrusion die penetrates through the corresponding guide hole in a sliding mode.

5. The device of claim 4, wherein: and an extension spring corresponding to the extrusion die is arranged and connected on the outer side of the guide seat and used for pulling the extrusion die to reset.

6. A patch capacitor pin forming device according to claim 2 or 3, wherein: the support die is provided with clearance holes, the inner sides of the two extrusion dies are provided with positioning plates, the two positioning plates are arranged in an up-and-down overlapped mode, and the free ends of the positioning plates are provided with guide grooves.

7. The device of claim 6, wherein: the inner sides of the two extrusion dies are also provided with mounting grooves, and one ends of the positioning plates are mounted in the mounting grooves; two a surface of locating plate is provided with the support step, one the locating plate support step is packed into the correspondence downwards in the mounting groove, another the locating plate support step is packed into the correspondence upwards in the mounting groove.

8. The device of claim 6, wherein: and the upper end and the lower end of each extrusion die extend to one side of the support die to form a support part, and the support parts positioned at the upper ends of the extrusion dies are provided with space avoiding positions for avoiding pins of capacitors.

9. The device of claim 8, wherein: and one side of the extrusion die, which is close to the support die, is also provided with a avoidance position for avoiding the lower end of the capacitor pin.