CN220914162U - Potting tool for increasing electric gap between pins of single-tube IGBT - Google Patents

Abstract

The utility model provides a potting tool for increasing an electrical gap between pins of a single-tube IGBT, which comprises the following components: IGBT, lower mould, go up mould and positioning mechanism: the upper surface of the lower die is provided with a lower die core for storing the IGBT and a lower pin canning groove for packaging the IGBT pins; an upper mold core for storing the IGBT and an upper pin canning groove for packaging the pins of the IGBT are arranged on the lower surface of the upper mold; the positioning mechanism is used for realizing positioning between the lower die and the upper die. The encapsulating tool is simple in encapsulating operation, and can achieve uniform specification encapsulating tools in pin encapsulating.

Description

Potting tool for increasing electric gap between pins of single-tube IGBT

Technical Field

The utility model belongs to the technical field of encapsulation tools, and particularly relates to an encapsulation tool for increasing an electrical gap between pins of a single-tube IGBT.

Background

With the continuous promotion of new energy automobile electric compressor and PTC system's voltage, to the product excessive pressure grade I level, pollution grade I level, the product of altitude height for 4000 meters. In the high-voltage quick-charging 800V system, the minimum electric gap requirement of basic insulation in the GBT 16935.1-2008 standard is 3.87mm, the creepage distance requirement is 4mm minimum, and the electric distance and creepage distance between wide pins of a single-tube TO-247 package cannot meet the safety rule requirement, so that secondary processing is required for the pins of the single-tube TO-247 package.

Chinese patent CN210182371U discloses a "potting structure for making the electrical gap between the pins of the IGBT solid insulation, including the IGBT, and its characterized in that, further including a glue filling external member, wherein: the middle part of the glue pouring external member is provided with a cavity for pouring insulating glue, and the top of the cavity is opened; sequentially defining three pins of the IGBT as a first pin, a second pin and a third pin from left to right, wherein the first pin and the third pin are bent backwards in three directions, and the first pin and the third pin are bent forwards; three pins of the IGBT are inserted into the cavity of the glue filling sleeve member, and the tops of the three pins penetrate out of the glue filling sleeve member and are fixedly sealed by the insulating glue filled in the cavity. However, it is through open encapsulating external member, open embedment causes the embedment thickness inconsistent easily to the narrow pin of IGBT does not need big electrical clearance so in 800V's system, and this IGBT mode of bending can increase product volume, simultaneously because of workman's operation's reason, the size error of IGBT appears easily, need buckle many times the pin when the canning simultaneously, and buckle many times and cause the damage to the pin easily, buckle many times simultaneously and appear bending error easily, increase the loaded down with trivial details degree of embedment, reduce work efficiency's problem.

Therefore, the filling and sealing tool is simple in filling and sealing operation, and the specifications of the filling and sealing tool are uniform during pin filling and sealing.

Disclosure of utility model

In view of the shortcomings of the prior art, the utility model aims to provide a potting tool for increasing the electrical gap between pins of a single-tube IGBT, which is used for solving the problems of complicated pin potting operation and non-uniform specification in the prior art.

To achieve the above and other related objects, an aspect of the present utility model provides a potting tool for increasing an electrical gap between pins of a single-tube IGBT, including: IGBT, lower mould, go up mould and positioning mechanism: the upper surface of the lower die is provided with a lower die core for storing the IGBT and a lower pin canning groove for packaging the IGBT pins; an upper mold core for storing the IGBT and an upper pin canning groove for packaging the pins of the IGBT are arranged on the lower surface of the upper mold; the positioning mechanism is used for realizing positioning between the lower die and the upper die.

In an embodiment of the utility model, the positioning mechanism includes: a plurality of nut holes arranged on the upper surface of the lower die, a plurality of screw holes arranged on the lower surface of the upper die, screws internally mounted in the nut holes, and nuts internally mounted in the nut holes; the screws and the nuts are in one-to-one correspondence.

In an embodiment of the utility model, the positioning mechanism further includes: the upper surface of the lower die is integrally formed with a limiting convex column, and the upper die is provided with a limiting hole, and the limiting convex column is arranged in the limiting hole.

In an embodiment of the present utility model, a through hole is provided on the IGBT, and a screw is screwed into the corresponding nut through the through hole.

In an embodiment of the utility model, a demolding mechanism for demolding is further disposed in the lower mold.

In an embodiment of the utility model, the demolding mechanism comprises a movable groove, a linkage column and a demolding module; the movable groove is arranged in the lower die, and a top plate is arranged in the movable groove; the upper end of the linkage column is positioned on the upper surface of the lower die.

In an embodiment of the utility model, the top plate is movably installed in the movable groove through a return spring.

As described above, the present utility model has the following advantageous effects:

(1) Through lower mold core and last mold core that set up for when lower mould and last mold laminating, install the IGBT after the pin plastic in the inside of lower mold core and last mold core, the pin of IGBT tip is located down pin canning groove and last pin canning inslot simultaneously and carries out can seal, and then be convenient for the root and then secondary processing to the pin of IGBT tip, make the root encapsulation of pin 8, and the head of pin 8 continues to expose in the air, only need carry out single unilateral buckling to the head of pin 8, the number of times of buckling of pin 8 has been reduced, and only need adjust the bending parameter of pin 8 middle pin just can use in the higher voltage system, simultaneously embedment work simple structure causes convenient, improve embedment efficiency, weld the characteristics that occupation space is few on PCB after the embedment, and positioning mechanism that sets up between lower mould and the last mould, make the clamping location to IGBT after lower mould and the last mould location.

(2) Through the positioning mechanism that comprises screw hole, nut hole, screw, nut, spacing projection and spacing hole, and the screw is installed and is closed in the nut after the screw is inside, and lower mould upper surface integrated into one piece's spacing projection is installed in the spacing hole of seting up on last mould simultaneously for lower mould and last mould are fixed a position.

(3) Through the demoulding mechanism of lower mould setting, and then be convenient for drop by the inside of lower pin canning groove under demoulding mechanism's effect after the pin embedment, and then be convenient for carry out the embedment to the pin of IGBT tip, and demoulding mechanism includes the movable groove, and movable inslot passes through reset spring movable mounting's roof, the ganging post is fixed with the roof simultaneously, when lower mould and last mould laminating of being convenient for, go up the mould and extrude the ganging post, make the tip and the lower pin canning groove bottom parallel and level of demoulding module, and when lower mould and last mould separate, the roof is ejecting with the drawing of patterns piece under reset spring's effect, make the embedment structure of pin jack-up under the effect of drawing of patterns piece.

Drawings

Fig. 1 shows a schematic diagram of the package size of an IGBT (model BGN40Q120 SD).

Fig. 2 shows a schematic diagram of an (TO 247-3) IGBT package according TO an embodiment of the application.

Fig. 3 is a schematic diagram of an IGBT pin preform for an embodiment of the potting tool of the present utility model for increasing the electrical gap between the single-tube IGBT pins.

Fig. 4 is a schematic perspective view of an embodiment of the present utility model.

Fig. 5 shows an exploded view of the present utility model in an embodiment.

Fig. 6 is a schematic diagram of an IGBT structure after upper die and pin pre-shaping in an embodiment of the utility model.

Fig. 7 is a schematic diagram of an IGBT structure after the lower die and pin pre-shaping in an embodiment of the utility model.

Fig. 8 is a schematic view showing a cross-sectional structure of a lower die of the present utility model.

Description of element reference numerals

1. Lower die

2. Upper die

3. Lower mold core

4. Upper mold core

5. Lower pin canning groove

6. Upper pin canning groove

7 IGBT

8 IGBT pins

9. Screw hole

10. Nut hole

11. Screw bolt

12. Screw cap

13. Spacing projection

14. Limiting hole

15. Movable groove

16. Top plate

17. Reset spring

18. Linkage column

19. Stripping module

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.

It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present utility model by way of illustration, and only the components related to the present utility model are shown in the illustrations, not according to the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.

The encapsulating tool for increasing the electrical gap between the pins of the single-tube IGBT provided by the utility model has the advantages that the pin encapsulating tool is unified in specification, and the operation is simple.

The following will describe in detail a potting tool for increasing the electrical gap between the pins of the single-tube IGBT according to the present embodiment with reference to fig. 1 to 8, so that a person skilled in the art may understand the potting tool for increasing the electrical gap between the pins of the single-tube IGBT according to the present embodiment without creative labor.

Referring TO fig. 1, the IGBT currently used cannot meet the safety requirements of the 800V system of the new energy automobile, and the IGBT with the model BGN40Q120SD is taken as an example, the package size is shown in fig. 1, and meanwhile, referring TO fig. 2, fig. 2 shows an original package schematic diagram of the (TO 247-3) IGBT in the prior art according TO the present utility model. As can be seen in connection with fig. 1 and 2: the worst-case spacing between the two and three legs of an IGBT is only 2.59mm (the minimum inter-leg spacing 5.34mm minus the half of the maximum pin width of the three legs 2.25mm minus the half of the maximum pin width of the two legs 3.25 mm), and obviously the requirements for an electrical gap of 3.87mm (the minimum distance between the narrow pins 4.08mm, can itself be met).

Referring TO fig. 3, the IGBT pin preform bending mode of the matching embodiment is shown, and the bending parameters of the middle pin of pin 8 can be adjusted TO make the electrical gap between the TO-247 package pins reach a higher level, which is not repeated here.

Referring to fig. 4-8, the potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of the utility model comprises a lower die 1 and an upper die 2 for encapsulating the pins 8 of the IGBT, wherein the upper surface of the lower die 1 is provided with a lower die core 3 for storing the pins 7 of the IGBT, the upper surface of the lower die 1 is also provided with a lower pin canning groove 5 for encapsulating the pins 8 of the IGBT, the lower surface of the upper die 2 is provided with an upper die core 4 for storing the pins 7 of the IGBT, the lower surface of the upper die 2 is provided with an upper pin canning groove 6 for encapsulating the pins 8 of the IGBT, and a positioning mechanism for positioning is also arranged between the lower die 1 and the upper die 2.

In this embodiment, through lower mold core 3 and last mold core 4 that set up for when lower mould 1 and last mold 2 paste, IGBT7 installs in the inside of lower mold core 3 and last mold core 4, and the pin 8 of IGBT7 tip is located down pin canning groove 5 and last pin canning groove 6 simultaneously and carries out the pot seal, and then is convenient for the pin 8 root and then secondary operation to IGBT7 tip, make the root encapsulation of pin 8, and the head of pin 8 continues to expose in the air, and the positioning mechanism that sets up between lower mould 1 and the last mold 2, make to carry out the centre gripping location to IGBT7 after lower mould 1 and the last mold 2 location.

Specifically, positioning mechanism includes three nut hole 10 of seting up on lower mould 1 to and three screw hole 9 of seting up on the 2 surface of upper mould, and screw hole 9 and 10 internally mounted's of nut screw 11, the nut 12 of nut hole 10 internally mounted, and the lower extreme of screw 11 closes in the inside of nut 12 soon, positioning mechanism still includes lower mould 1 upper surface integrated into one piece's spacing projection 13, and the spacing hole 14 of seting up on the upper mould 2, and spacing projection 13 installs in the inside of spacing hole 14, is provided with the hole on the IGBT7, and one of them screw 11 passes the hole on IGBT7 surface.

In this embodiment, the positioning mechanism comprising the screw hole 9, the nut hole 10, the screw 11, the nut 12, the limiting boss 13 and the limiting hole 14 is used, the screw 11 is installed in the screw hole 9 and then screwed into the nut 12, and meanwhile, the limiting boss 13 integrally formed on the upper surface of the lower die 1 is installed in the limiting hole 14 formed on the upper die 2, so that the lower die 1 and the upper die 2 are positioned.

Specifically, the lower die 1 is internally provided with a demoulding mechanism for demoulding, the demoulding mechanism comprises a movable groove 15 arranged in the lower die 1, a top plate is arranged in the movable groove, the top plate 16 is movably arranged in the movable groove 15 through a return spring 17, the upper surface of the top plate 16 is fixedly provided with a linkage column 18 and a demoulding block 19, the upper end of the demoulding block 19 is positioned in the lower pin canning groove 5, and the upper end of the linkage column 18 is positioned on the upper surface of the lower die 1.

In this embodiment, through the demoulding mechanism that lower mould 1 set up, and then be convenient for after the pin 8 embedment drop by the inside of lower pin canning groove 5 under demoulding mechanism's effect, and then be convenient for encapsulate the pin 8 of IGBT7 tip, and demoulding mechanism includes movable groove 15, and movable inslot through reset spring 17 movable mounting's roof 16, simultaneously linkage post 18 and drawing of patterns piece 19 are fixed with roof 16, when lower mould 1 and last mould 2 subsides of being convenient for, go up mould 2 and extrude linkage post 18, make the tip and the lower pin canning groove 5 bottom parallel and level of drawing of patterns piece 19, and when lower mould 1 and last mould 2 separate, roof 16 is ejecting with drawing of patterns piece 19 under reset spring 17's effect, make the embedment structure of pin 8 jack-up under the effect of drawing of patterns piece 19.

The working principle and the using flow of the utility model are as follows: when the IGBT packaging structure is used, the IGBT7 is placed in the lower mold core 3, at the moment, the pins 8 are positioned in the lower pin packaging groove 5, the upper mold 2 is installed on the upper surface of the lower mold 1, at the moment, the limiting convex columns 13 are installed in the limiting holes 14, the screws 11 are installed in the nut holes 10 through the screw holes 9, the screws 11 and the nuts 12 are screwed together, the lower mold 1 and the upper mold 2 are fixed, at the moment, the lower mold 1 extrudes the upper ends of the linkage columns 18, the linkage columns 18 move in the movable grooves 15 with the top plates 16, the reset springs 17 are compressed after being extruded by the top plates 16, the upper ends of the demoulding blocks 19 are parallel to the lower pin packaging groove 5, during packaging, packaging liquid is injected into the upper pin packaging groove 6, so that three pins 8 at the end parts of the IGBT7 are packaged, at the moment, the screws 11 are rotated, at the moment, the screws 11 and the nuts 12 are separated, and the upper mold 2 is removed, at the moment, the top plates 16 carry the demoulding blocks 19 under the action of the reset springs 17 to lift the packaging structure of the pins 8, and the packaging structure of the pins 8 is demoulded.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (8)

1. Increase embedment frock of electric gap between single tube IGBT pin, its characterized in that includes: IGBT, lower mould, go up mould and positioning mechanism:

the upper surface of the lower die is provided with a lower die core for storing the IGBT and a lower pin canning groove for packaging the IGBT pins;

An upper mold core for storing the IGBT and an upper pin canning groove for packaging the pins of the IGBT are arranged on the lower surface of the upper mold;

The positioning mechanism is used for realizing positioning between the lower die and the upper die.

2. The potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of claim 1 wherein: the positioning mechanism comprises:

A plurality of nut holes arranged on the upper surface of the lower die, a plurality of screw holes arranged on the lower surface of the upper die, screws internally mounted in the nut holes, and nuts internally mounted in the nut holes; the screws and the nuts are in one-to-one correspondence.

3. The potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of claim 2 wherein: the positioning mechanism further includes:

the upper surface of the lower die is integrally formed with a limiting convex column, and the upper die is provided with a limiting hole, and the limiting convex column is arranged in the limiting hole.

4. The potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of claim 2 wherein: the IGBT is provided with a through hole, and a screw passes through the through hole and is screwed in the corresponding nut.

5. The potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of claim 1 wherein: and a demolding mechanism for demolding is further arranged in the lower mold.

6. The potting fixture for increasing the electrical gap between pins of a single tube IGBT of claim 5 wherein the stripping mechanism comprises a movable slot, a linkage column, and a stripping module;

The movable groove is arranged in the lower die, and a top plate is arranged in the movable groove;

The upper end of the linkage column is positioned on the upper surface of the lower die.

7. The potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of claim 6 wherein: the top plate is movably arranged in the movable groove through a return spring.

8. The potting fixture for increasing the electrical gap between the pins of the single-tube IGBT of claim 6 wherein: the linkage column and the demolding block are fixed on the top plate.