CN219497731U - Packaging die for semiconductor device of planar-mounted miniature Schottky rectifier - Google Patents

Abstract

The utility model discloses a packaging die for a plane-mounted miniature Schottky rectifier semiconductor device, and particularly relates to the field of packaging dies. The utility model is provided with a stripping thimble, a driving plate guide post, a driving plate return limit post and a stripping thimble extending out of the limit ring; the product can be easily separated from the mould when the mould is opened and the material is removed after filling and forming of the mould, the demoulding force is maximized, the integrality of the packaged product is effectively guaranteed while the good demoulding effect is achieved, the phenomenon that layering phenomenon exists in the product due to the demoulding force is avoided, poor electric characteristics of the product are caused, and better technical support is provided for manufacturing a complete Schottky rectifier semiconductor device.

Description

Packaging die for semiconductor device of planar-mounted miniature Schottky rectifier

Technical Field

The utility model relates to the technical field of packaging molds, in particular to a packaging mold for a plane-mounted miniature Schottky rectifier semiconductor device.

Background

The biggest obstacle to the widespread use of schottky rectifier semiconductor devices is also cost. It can be said that the cost of schottky rectifier semiconductor devices can be reduced to a level close to that of silicon devices, and many problems can be solved without this situation today. The market price of the most typical SiC Schottky diode products is more than 5-6 times of that of the silicon FRD products with the same specification. For products with larger rated currents, the cost difference is more different. In fact, most manufacturers of schottky rectifier semiconductor devices currently have insufficient capacity resources due to small market size, and the manufacturers are subsidized in claims and cannot guarantee a large amount of goods. Therefore, whether or not cost can be reduced, whether or not supply can be ensured, is the biggest doubt of downstream application manufacturers to device manufacturers.

The Schottky belongs to a monopole device, has extremely short reverse recovery time, is widely applied to a high-frequency rectifying circuit, and has low forward saturation voltage drop, low power consumption and wide application; along with the development and more diversified functions of the handheld device, more devices are required to be arranged on one PCB, and further, the devices are required to develop towards a smaller size, the size of one device, namely the size of a plastic package body, is generally larger than the size of a frame by more than 60 micrometers, the size of the frame is larger than the size of a chip by more than 60 micrometers, the plastic package allowance and the upward deviation allowance are determined by the equipment capacity of a packaging factory and are not easy to shrink, so that the size of the package body of the device is miniaturized, and the size of the chip of the packaged device needs to be started; in general, a half-bridge packaged schottky rectifier is formed by packaging two common schottky chips in a plastic package side by side with a common cathode structure.

Therefore, the size of the common half-bridge rectifying schottky device is more than 120 micrometers larger than the sum of two schottky chips, and the packaging allowance of 120 micrometers is difficult to change, so that the chip size can only be reduced, but the chip size is reduced, the current density is increased, under the same condition, the increase of the current density can cause the increase of power consumption, so that the size of the packaging body is reduced by reducing the chip size, and the problem of power consumption increase can be caused; half-bridge rectifying schottky devices are also faced with this problem.

Disclosure of Invention

In order to overcome the defects in the prior art, the embodiment of the utility model provides a packaging die for a planar-mounted miniature Schottky rectifier semiconductor device, which can use a unique packaging module to be matched with a unique packaging injection block and a stripping thimble driving plate to produce a small-sized and large-number Schottky rectifier semiconductor device, and can reduce the manufacturing cost more effectively, so that the Schottky rectifier semiconductor device obtains the advantage of better processing cost, and can effectively solve the problems in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a miniature schottky rectifier semiconductor device packaging mold of plane dress, includes encapsulation die box and takes off material thimble drive plate, encapsulation die box and take off material thimble drive plate swing joint still includes:

a storage cavity is formed in the packaging die box, a central injection block and two groups of packaging modules are movably arranged in the storage cavity, the two groups of packaging modules are symmetrically arranged on two sides of the central injection block, and packaging module stop blocks are arranged at two ends of each packaging module;

the top of the stripping thimble driving plate is provided with a plurality of stripping thimbles and driving plate guide posts, and the bottom of the stripping thimble driving plate is provided with driving plate return limit posts.

In a preferred embodiment, the top of the packaging module is uniformly provided with a plurality of cavities for packaging and molding a plurality of semiconductor devices; the packaging module stop blocks are placed on two sides of the packaging module, the position of the packaging module in the packaging mould box is positioned, and the thickness of the packaging module and the packaging module stop blocks is equal to the depth of the containing cavity.

In a preferred embodiment, the central material injection block is uniformly provided with a plurality of material injection flow passages, the material injection flow passages are irregularly shaped, material limiting protruding blocks are arranged in the material injection flow passages, the purpose of reducing the volume of the material injection flow passages is achieved, and material distribution holes are formed between four corners of an inner cavity of the material injection flow passages and the central material injection block.

In a preferred embodiment, the packaging module and the packaging mould box are respectively provided with a positioning ejector hole at the position aligned with the stripping ejector pin, the top of the packaging module is transversely provided with a diversion trough, the diversion trough is transversely aligned with the material distributing holes, and the diversion trough is communicated with the mould cavity.

In a preferred embodiment, a plurality of groups of stripping thimbles and a plurality of groups of driving plate guide posts can be arranged on the stripping thimbles driving plate, positioning through grooves are formed at the joint of the packaging die box and the driving plate guide posts, the stripping thimbles and the driving plate guide posts are kept parallel, and the stripping thimbles are controlled to eject products in the die cavity.

In a preferred embodiment, the driving plate guide post is sleeved with a stripping thimble extending limiting ring, and the stripping thimble extending limiting ring controls the extending length of the stripping thimble; and the driving plate return limiting column controls the return initial position of the stripping thimble.

In a preferred embodiment, the packaging die box supporting column penetrates through the stripping thimble driving plate to be fixed on the packaging die box, so that the flatness of the packaging die box is ensured.

The utility model has the technical effects and advantages that:

the utility model is combined with the central injection block through the arranged packaging module and is arranged in the packaging mould box to form a whole; the epoxy resin sealing material enters a cavity in the packaging module through a material injection runner in the central material injection block to package the product;

according to the utility model, the demolding ejector pins arranged on the demolding ejector pin driving plate are used for ejecting and demolding the molded product in the cavity, and the driving plate guide posts arranged on the demolding ejector pin driving plate can effectively control the demolding ejector pin driving plate to move in parallel with the packaging die box, so that the demolding ejector pin acts and the packaged product are vertically forced;

according to the utility model, the reset distance of the demoulding ejector pin driving needle plate is controlled by the arranged reset limiting post of the demoulding ejector pin driving needle plate, so that the demoulding ejector pin driving needle plate can be reset to the initial position after each movement, and no shift change is generated; the material-removing thimble is arranged to extend out of the limiting ring to control the extending length of the material-removing thimble, so that the demolding distance of the product in the cavity can be effectively controlled.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a schematic view of a bottom view structure according to the present utility model.

Fig. 3 is a schematic view of a split structure of the package mold according to the present utility model.

FIG. 4 is a schematic diagram of a structure of a stripping ejector pin driving plate according to the present utility model.

FIG. 5 is a schematic view of the bottom view of the ejector pin driving plate according to the present utility model.

The reference numerals are: the material-removing device comprises a packaging module 1, a central material-injecting block 2, a packaging module box 3, a packaging module stop block 4, a material-removing thimble driving plate 5, a driving plate fixing limit column 6, a material-removing thimble 7, a driving plate guide column 8, a material-removing thimble extending limit ring 9, a packaging module box support column 10, a cavity 11, a material-injecting runner 12, a material-limiting lug 13, a material-distributing hole 14, a positioning top hole 15 and a material-distributing groove 16.

Description of the embodiments

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The utility model provides a plane-mounted miniature Schottky rectifier semiconductor device packaging die, which comprises a packaging die box 3 and a stripping thimble driving plate 5, wherein the packaging die box 3 is movably connected with the stripping thimble driving plate 5, a storage cavity is formed in the packaging die box 3, a central injection block 2 and two groups of packaging modules 1 are movably arranged in the storage cavity, the two groups of packaging modules 1 are symmetrically arranged on two sides of the central injection block 2, and packaging module stop blocks 4 are respectively arranged at two ends of the packaging modules 1; the top of the stripping thimble driving plate 5 is provided with a plurality of stripping thimbles 7 and driving plate guide posts 8, and the bottom of the stripping thimble driving plate 5 is provided with a driving plate return limit post 6;

a plurality of material injection flow passages 12 are uniformly arranged on the central material injection block 2, the material injection flow passages 12 are irregularly shaped, material limiting projections 13 are arranged in the material injection flow passages 12, the purpose is to reduce the volume of the material injection flow passages 12 for containing epoxy resin packaging materials, the material limiting projections 13 can save materials, the material consumption is convenient to adjust to be more limited, the use amount of the epoxy resin is less, the production cost is reduced, and material distributing holes 14 are formed between four corners of an inner cavity of the material injection flow passages 12 and the central material injection block 2; the packaging module 1, the packaging die box 3 and the material-removing thimble 7 are respectively provided with a positioning ejection hole 15, the top of the packaging module 1 is transversely provided with a distribution trough 16, the distribution trough 16 and the distribution holes 14 are transversely aligned, and the distribution trough 16 is communicated with the cavity 11.

The implementation mode specifically comprises the following steps: as shown in fig. 1-2, the utility model provides a packaging mould for a plane-mounted miniature schottky rectifier semiconductor device, wherein a stripping thimble driving plate 5 is arranged at the lower part of a packaging mould box 3, and the two parts can move in parallel through a driving plate guide post 8;

specifically, as shown in fig. 3, a packaging mold for a semiconductor device of a planar mounted micro schottky rectifier is provided, wherein a packaging module 1 and a central injection block 2 are combined and placed in a packaging mold box 3, and a packaging module stop block 4 positions the packaging module 1 to form a combination;

specifically, as shown in fig. 4 and 5, the stripping thimble 7 installed on the stripping thimble driving plate 5 for the packaging mold of the planar-mounted miniature schottky rectifier semiconductor device can eject and demold the product in the cavity 11 through the positioning ejection hole 15; the ejection distance of the product can be controlled by the ejection ejector pin extending out of the limiting ring 9, and the ejection ejector pin driving plate 5 can be controlled by the driving plate return limiting column when returning;

in the packaging mould of the plane-mounted miniature schottky rectifier semiconductor device, the body of the packaging mould is filled with epoxy resin packaging materials into a cavity 11 in a packaging module 1 from a distribution trough 16 through a material distribution hole 14 by a material injection runner 12 arranged on a central material injection block 2 in the process of molding the packaging materials;

after packaging is completed, the packaging product in the cavity 11 is ejected out by the material ejection ejector pins 7 arranged on the material ejection ejector pin driving plate 5, the ejection distance of the packaging product is controlled by the arranged material ejection ejector pins extending out of the limiting rings 9, and the distance can be adjusted according to production requirements; the packaging material can be rapidly demoulded;

the plane-mounted miniature Schottky rectifier semiconductor device packaging die provided by the utility model can realize the chip of a half-bridge rectifying Schottky device with the same power through the structural innovation design, the size of a packaging body can be reduced by about half, the miniature packaging of the half-bridge rectifying Schottky device is realized, and the manufacturing finished product is not increased too much through optimizing the integrated manufacturing method.

The last points to be described are: first, in the description of the present application, it should be noted that, unless otherwise specified and defined, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be mechanical or electrical, or may be a direct connection between two elements, and "upper," "lower," "left," "right," etc. are merely used to indicate relative positional relationships, which may be changed when the absolute position of the object being described is changed;

secondly: in the drawings of the disclosed embodiments, only the structures related to the embodiments of the present disclosure are referred to, and other structures can refer to the common design, so that the same embodiment and different embodiments of the present disclosure can be combined with each other under the condition of no conflict;

finally: the foregoing description of the preferred embodiments of the utility model is not intended to limit the utility model to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.

Claims (7)

1. The utility model provides a miniature schottky rectifier semiconductor device packaging mold of plane surface mounting, includes encapsulation die box (3) and takes off material thimble drive board (5), encapsulation die box (3) and take off material thimble drive board (5) swing joint, its characterized in that still includes:

the packaging mold box is characterized in that a storage cavity is formed in the packaging mold box (3), a central injection block (2) and two groups of packaging modules (1) are movably arranged in the storage cavity, the two groups of packaging modules (1) are symmetrically arranged on two sides of the central injection block (2), and packaging module stop blocks (4) are arranged at two ends of each packaging module (1);

the top of the stripping thimble driving plate (5) is provided with a plurality of stripping thimbles (7) and driving plate guide posts (8), and the bottom of the stripping thimble driving plate (5) is provided with driving plate return limit posts (6).

2. The planar mounted miniature schottky rectifier semiconductor device package mold of claim 1, wherein: and a plurality of cavities (11) are uniformly formed in the top of the packaging module (1), and the thicknesses of the packaging module (1) and the packaging module stop block (4) are equivalent to the depth of the accommodating cavity.

3. The planar mounted miniature schottky rectifier semiconductor device package mold of claim 1, wherein: the material injection device is characterized in that a plurality of material injection flow passages (12) are uniformly arranged on the central material injection block (2), the material injection flow passages (12) are irregularly shaped, material limiting protruding blocks (13) are arranged in the material injection flow passages (12), and material distribution holes (14) are formed between four corners of an inner cavity of the material injection flow passages (12) and the central material injection block (2).

4. The planar mounted miniature schottky rectifier semiconductor device package mold of claim 3, wherein: the packaging module (1) and the packaging mould box (3) are respectively provided with a positioning ejector hole (15) at the alignment position of the material removing ejector pin (7), the top of the packaging module (1) is transversely provided with a distribution trough (16), the distribution trough (16) and the distribution holes (14) are transversely aligned, and the distribution trough (16) is communicated with the mould cavity (11).

5. The planar mounted miniature schottky rectifier semiconductor device package mold of claim 2, wherein: the material-removing thimble driving plate (5) is provided with a plurality of groups of material-removing thimbles (7) and a plurality of groups of driving plate guide posts (8), and a positioning through groove is formed at the joint of the packaging die box (3) and the driving plate guide posts (8), and the material-removing thimbles (7) and the driving plate guide posts (8) are kept parallel.

6. The planar mounted miniature schottky rectifier semiconductor device package mold of claim 1, wherein: the driving plate guide post (8) is sleeved with a stripping thimble extending limiting ring (9), and the driving plate return limiting post (6) controls the stripping thimble (7) to return to an initial position.

7. The planar mounted miniature schottky rectifier semiconductor device package mold of claim 1, wherein: the packaging die box support column (10) penetrates through the stripping thimble driving plate (5) to be fixed on the packaging die box (3), so that the flatness of the packaging die box (3) is guaranteed.