CN213382627U - Plastic package mold for vehicle electronic device frame - Google Patents
Plastic package mold for vehicle electronic device frame Download PDFInfo
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- CN213382627U CN213382627U CN202021848616.1U CN202021848616U CN213382627U CN 213382627 U CN213382627 U CN 213382627U CN 202021848616 U CN202021848616 U CN 202021848616U CN 213382627 U CN213382627 U CN 213382627U
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Abstract
The utility model discloses a plastic envelope mould is used to automobile-used electron device frame, include: putting the die box; the lower die box is positioned below the upper die box; the two upper pressure sheet embedding strips are arranged in the upper die box at intervals; the two lower material pressing sheet embedding strips are arranged in the lower die box at intervals; the two upper cavity inlaid strips are arranged in the upper die box at intervals, and the side walls of the upper cavity inlaid strips are attached to the side walls of the upper pressure sheet inlaid strips; the lower cavity inlaid strips are arranged in the lower die box at intervals; the two base inlaid strips are arranged in the lower die box at intervals; the upper glue inlet panel is arranged inside the upper die box; advance gluey panel down, it installs inside lower diaphragm capsule to advance gluey panel down, the utility model provides a current inconvenient technical problem of automobile-used electron device frame plastic envelope.
Description
Technical Field
The utility model relates to an electron device mold processing technical field especially relates to an automobile-used electron device is plastic envelope mould for frame.
Background
In industrial production, the plastic package electronic chip has high precision requirement and large output requirement; but have the product bubble to transfer simultaneously, burr overlap difficult processing, stitch skew rate scheduling problem not up to standard after the completion of moulding plastics, in order to improve product quality and once throw mould success rate, reduce the wasting of resources, must guarantee that the mould not only needs to realize the location accurate, needs to realize stable in structure reliable again.
Most of the movable and fixed mold inserts of the existing mold structures are integral, and because the positions of the charging barrel, the positions of the sizing materials, the positions of the runners, the ejector pins and the positions of the chips are all arranged on one insert, the mold plate of the insert is inconvenient to design and process, and is not beneficial to maintenance.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a plastic envelope mould is used to automobile-used electron device frame solves among the prior art inconvenient technical problem of automobile-used device frame plastic envelope.
The embodiment of the application discloses automotive electronics is plastic envelope mould for frame includes:
putting the die box;
a lower die box located below the upper die box;
the two upper pressure sheet embedding strips are arranged in the upper die box at intervals;
two lower pressing sheet embedding strips are arranged inside the lower die box at intervals;
two upper cavity inserts are installed at intervals inside the upper die box, the upper cavity inserts are located on the inner sides of the upper pressure plate inserts, the side walls of the upper cavity inserts are attached to the side walls of the upper pressure plate inserts
The lower die cavity inserts are arranged in the lower die box at intervals, and the side wall of the lower die cavity is attached to the side wall of the lower pressing sheet insert;
the two base inlaid strips are arranged in the lower die box at intervals, are positioned on the inner side of the lower cavity inlaid strip, and are attached to the side walls of the lower cavity;
the upper glue inlet inlaid strips are arranged inside the upper die box and are positioned between the upper cavity inlaid strips;
go into the veneer down, it installs to go into down to glue the veneer down inside the diaphragm capsule, and it is located to go into down to glue the veneer between the base veneer.
The mold insert is divided into a plurality of parts, and the plastic package cavity is formed after the mold insert is assembled and used for finishing the plastic package operation, so that the mold insert is convenient to mold and process and is also convenient to replace and maintain.
On the basis of the technical scheme, the utility model discloses can also do as follows the improvement:
furthermore, the lower die box is provided with positioning pins at intervals, and the positioning through the positioning pins is beneficial in the step.
Furthermore, an upper cavity is formed in the bottom of the upper cavity panel, a first lower cavity is formed above the lower cavity panel, a second lower cavity is formed above the base panel, the upper cavity corresponds to the first lower cavity and the second lower cavity, and the upper cavity, the first lower cavity and the second lower cavity are closed to form a processing cavity.
Furthermore, the glue channel is formed in the upper glue inlet panel and communicated with the processing cavity, and the plastic packaging material circulation is facilitated due to the glue channel.
The lower demolding ejector pins are movably mounted inside the lower mold box at intervals, and the top ends of the lower demolding ejector pins correspond to the second lower mold cavity; the upper demolding thimble is movably mounted inside the upper mold box at intervals, the end part of the upper demolding thimble corresponds to the upper cavity, and the demolding thimble can push a product to leave the mold.
One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages: according to the embodiment of the application, the insert inside the mold box is designed, and a plurality of inserts are combined to form the required plastic package cavity, so that the mold is convenient to process; meanwhile, the inlaid strips in the die box are symmetrical left and right, so that plastic package processing can be performed on both sides, and the plastic package efficiency is improved; the processing die cavity in the embodiment of the application is assembled by matching a plurality of inlaid strips, so that the assembly and the subsequent maintenance are convenient.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a plastic package mold for a vehicle electronic device frame according to an embodiment of the present invention;
reference numerals:
1, mounting a mold box; 2-lower mould box; 3-feeding a panel of a material pressing sheet; 4-pressing the panel of the material sheet; 5-embedding a strip in the upper cavity; 6-lower cavity panel; 7-base panel; 8-glue feeding and inlaying; 9-feeding a rubber inlaid strip downwards; 10-a positioning pin; 11-upper cavity; 12-a first lower cavity; 13-a second lower cavity; 14-processing a cavity; 15-glue passage; 16-lower demoulding thimble; and 17-demoulding the thimble upwards.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
In the description of the present application, it is to be understood that the terms "center", "upper", "lower", "top", "bottom", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The embodiment of the application provides a plastic package mould for an automotive electronic device frame, and solves the technical problem that plastic package of the electronic device frame is inconvenient in the prior art.
The general idea of the embodiment of the application is as follows: the plastic package mold is designed, the plastic package processing of the frame is met through the specific cavity, and the working efficiency is improved.
In order to better understand the technical solutions, the technical solutions will be described in detail below with reference to the drawings and the detailed description.
Examples
As shown in fig. 1, the present embodiment provides a mold for molding a vehicle electronic component frame, including:
when the upper die box 1 is used, the upper die box 1 is used for assembling the panel and is connected with the bottom of the upper pressing mechanism, after moving downwards, the panel in the upper die box 1 is matched with the panel in the lower die box to complete limiting, and subsequent plastic package is facilitated;
the lower die box 2 is positioned below the upper die box 1; in the embodiment of the application, the lower die box 2 is also used for assembling the inlaid strips, and the inlaid strips in the lower die box 2 and the inlaid strips in the upper die box 1 are matched with each other to form a processing cavity;
the two upper pressure sheet embedding strips 3 are arranged in the upper die box 1 at intervals, and the upper pressure sheet embedding strips 3 are mutually attached to the inner wall of the upper die box 1;
the two lower material pressing sheet embedding strips 4 are arranged inside the lower die box 2 at intervals, the lower material pressing sheet embedding strips 4 and the upper material pressing sheet embedding strips 3 in the embodiment of the application are matched with each other, and the bottom of the frame is clamped during actual processing, so that plastic packaging operation can be conveniently performed on the top of the frame;
the die comprises two upper cavity inserts 5, wherein the upper cavity inserts 5 are arranged inside an upper die box 1 at intervals, the upper cavity inserts 5 are positioned on the inner side of the upper pressure plate inserts 3, the side walls of the upper cavity inserts 5 are attached to the side walls of the upper pressure plate inserts 3, and the bottom of each upper cavity insert 5 corresponds to the tops of a subsequent lower cavity insert 6 and a base insert 7 in the embodiment of the application;
the two lower cavity inserts 6 are arranged in the lower die box 2 at intervals, and the side walls of the lower cavity inserts 6 are attached to the side walls of the lower tablet pressing inserts 4;
the two base gibs 7 are installed inside the lower die box 1 at intervals, the base gibs 7 are located on the inner side of the lower cavity gib 6, the side walls of the base gibs 7 are attached to the side walls of the lower cavity gibs, and the base gibs 7 and the lower cavity gibs 6 in the embodiment of the application are matched with each other and correspond to the upper cavity gibs 5 after being combined;
the upper glue feeding inlaid strips 8 are arranged inside the upper die box 1, and the upper glue feeding inlaid strips 8 are positioned between the upper cavity inlaid strips 5;
the lower glue feeding inlaid strips 9 are arranged inside the lower die box 2, and the lower glue feeding inlaid strips 9 are positioned between the base inlaid strips 7; the upper glue feeding inlaid strip 8 in the embodiment of the application corresponds to the lower glue feeding inlaid strip 9, and divides the upper die box 1 and the lower die box 2 into two processing areas.
Specifically, the interval is provided with locating pin 10 on the lower die box 2, and locating pin 10 in this application embodiment is used for fixing a position, when guaranteeing to go up die box 1 and move, can be corresponding with lower die box 2.
Specifically, an upper cavity 11 is formed in the bottom of the upper cavity panel 5, a first lower cavity 12 is formed above the lower cavity panel 6, a second lower cavity 13 is formed above the base panel 7, the upper cavity 11 corresponds to the first lower cavity 12 and the second lower cavity 13, and the upper cavity 11, the first lower cavity 12 and the second lower cavity 13 are closed to form a processing cavity 14; in the embodiment of the application, the upper cavity 11 corresponds to the first lower cavity 12 and the second lower cavity 13 and is matched with the plastic packaging area of the frame to complete the plastic packaging operation; in the embodiment of the present application, the bottom surfaces of the upper cavity 11, the first lower cavity 12, and the second lower cavity 13 are both flat.
Specifically, the upper glue inlet panel 8 is provided with a glue channel 15, and the glue channel 15 is communicated with the processing cavity 14.
Specifically, the die further comprises a plurality of lower demolding thimbles 16 and a plurality of upper demolding thimbles 17, wherein the lower demolding thimbles 16 are movably mounted inside the lower die box 2 at intervals, and the top ends of the lower demolding thimbles 16 correspond to the second lower cavity 13; the upper demoulding thimble 17 is movably arranged in the upper mould box 1 at intervals, and the end part of the upper demoulding thimble 17 corresponds to the upper mould cavity 11; after the plastic package of upper and lower drawing of patterns thimble in this application embodiment is accomplished, the material of being convenient for breaks away from the mould.
In the specification of the present invention, a large number of specific details are explained. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (5)
1. A plastic package mold for a vehicle electronic device frame, comprising:
putting the die box;
a lower die box located below the upper die box;
the two upper pressure sheet embedding strips are arranged in the upper die box at intervals;
two lower pressing sheet embedding strips are arranged inside the lower die box at intervals;
two upper cavity inserts are installed at intervals inside the upper die box, the upper cavity inserts are located on the inner sides of the upper pressure plate inserts, the side walls of the upper cavity inserts are attached to the side walls of the upper pressure plate inserts
The lower die cavity inserts are arranged in the lower die box at intervals, and the side wall of the lower die cavity is attached to the side wall of the lower pressing sheet insert;
the two base inlaid strips are arranged in the lower die box at intervals, are positioned on the inner side of the lower cavity inlaid strip, and are attached to the side walls of the lower cavity;
the upper glue inlet inlaid strips are arranged inside the upper die box and are positioned between the upper cavity inlaid strips;
go into the veneer down, it installs to go into down to glue the veneer down inside the diaphragm capsule, and it is located to go into down to glue the veneer between the base veneer.
2. The mold for molding a vehicle electronic component frame according to claim 1, wherein the lower mold box is provided with positioning pins at intervals.
3. The mold according to claim 2, wherein an upper cavity is formed at the bottom of the upper cavity panel, a first lower cavity is formed above the lower cavity panel, a second lower cavity is formed above the base panel, the upper cavity corresponds to the first lower cavity and the second lower cavity, and the upper cavity, the first lower cavity and the second lower cavity are closed to form a processing cavity.
4. The plastic package mold for the vehicle electronic device frame according to claim 3, wherein the glue inlet panel is provided with a glue channel, and the glue channel is communicated with the processing cavity.
5. The mold according to claim 4, further comprising a plurality of lower ejector pins and a plurality of upper ejector pins, wherein the lower ejector pins are movably mounted in the lower mold box at intervals, and top ends of the lower ejector pins correspond to the second lower cavity; the upper demolding thimble is movably mounted inside the upper mold box at intervals, and the end part of the upper demolding thimble corresponds to the upper cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021848616.1U CN213382627U (en) | 2020-08-28 | 2020-08-28 | Plastic package mold for vehicle electronic device frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021848616.1U CN213382627U (en) | 2020-08-28 | 2020-08-28 | Plastic package mold for vehicle electronic device frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213382627U true CN213382627U (en) | 2021-06-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021848616.1U Active CN213382627U (en) | 2020-08-28 | 2020-08-28 | Plastic package mold for vehicle electronic device frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN213382627U (en) |
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2020
- 2020-08-28 CN CN202021848616.1U patent/CN213382627U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
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| TR01 | Transfer of patent right |
Effective date of registration: 20230714 Address after: No. 58 Xinganquan East Road, Huaishi Town, Hangjiang District, Yangzhou City, Jiangsu Province, 225000 Patentee after: Jiangsu Yingdafu Electronic Technology Co.,Ltd. Patentee after: KUNSHAN CHENYI SEMICONDUCTOR Co.,Ltd. Address before: No. 58 Xinganquan East Road, Huaishi Town, Hangjiang District, Yangzhou City, Jiangsu Province, 225000 Patentee before: Jiangsu Yingdafu Electronic Technology Co.,Ltd. |