JP3469357B2 - Equipment for bending lead terminals in electronic components - Google Patents

Description

Description: BACKGROUND OF THE INVENTION As shown in FIG. 1, according to the present invention, each lead terminal A2 for a semiconductor element is connected to both sides of a synthetic resin package part A1 for the semiconductor element. In the electronic component A configured to protrude, each lead terminal A2 protruding from both left and right sides of the package portion A1.
As shown in FIG. 2, the present invention relates to a device for bending the package portion A1 downward from the base thereof. 2. Description of the Related Art Conventionally, a bending apparatus of this type has a structure in which an electronic component separated from a lead frame is mounted on a stopper body provided on the lower die on a top surface of the lower die. Is positioned so as to contact the
In this state, each lead terminal projecting from the left and right sides of the package part in the electronic component is bent downward from the base of the package body by the upper mold moving downward toward the lower mold, and then, After the bent electronic component is operated to move the stopper body away from the electronic component, the electronic component is discharged while sliding along the upper surface of the lower mold. That is, in a conventional bending apparatus, a positioning stopper provided on a lower mold is made movable, and the stopper is moved before the upper mold moves down. When the electronic component is supplied to the upper surface of the lower mold, the electronic component moves to a position where the electronic component comes into contact with the electronic component. It must be configured to move in conjunction with the up and down movement of the upper mold, and a mechanism for this interlocking operation is required. Or, there was a problem of increasing the size. In addition, when the bent electronic component is slid and discharged, the stopper must be moved away from the electronic component prior to the sliding operation.
In other words, between the upward movement of the upper mold and the time when the electronic component slides along the upper surface of the lower mold and is discharged, a waiting time for moving the stopper body away from the electronic component is required. By doing so, the time required for bending one electronic component is lengthened by the waiting time, so that there is also a problem that the number of electronic components that can be bent per unit time is small and the work efficiency is low. Was. An object of the present invention is to provide a bending apparatus which solves these problems. In order to achieve this technical object, the present invention provides a lower mold for mounting an electronic component such that lead terminals on both left and right sides protrude from both right and left sides, A bending apparatus comprising an upper mold for bending each lead terminal of the electronic component downward along the left and right side surfaces of the lower mold by a downward movement toward the lower mold,
The electronic component is applied to the upper surface at one end of the lower mold.
To move in the direction of the other end along the upper surface of the lower mold
While the feeding means for feeding is provided, at least one of the side surfaces of the lower mold, the other end of the lower mold opposite to the feeding means, is folded at the electronic component.
At the tip of the lead terminal before bending
Move the stopper that comes into contact with the
The folded back is placed between the upper body and the one side.
Provide a gap so that the
The upper body contacts the upper mold when it moves down.
And move the stopper body back to a position where it comes into contact with the lead terminal before bending.
Providing a spring means for upwardly urging the Suyo. ". In this configuration, when an electronic component is sent to the upper surface of the lower die by the feeding means, the electronic component moves to the other end along the upper surface of the lower die, and Electronic
When the lead terminal of the component before bending contacts the stopper body and stops its movement, it is automatically positioned at a predetermined position with respect to the lower mold, and then the upper mold is moved to the stopper body. Is moved downward while being pressed down against the spring means, whereby each lead terminal of the electronic component is bent downward along the left and right side surfaces of the lower mold. When the bending process is completed and the upper mold is lifted, and the stopper body is returned to its original position by the spring means following this, the feeding means moves the next electronic component to the lower mold. The electronic component previously bent on the upper surface of the lower mold by feeding the upper mold into the upper surface of the lower mold is such that the bent lead terminal passes through a gap between one side surface of the lower mold and the stopper body. a manner, while being sliding discharged from the upper surface of the lower mold, the following electronic components, the folding
When the lead terminal before bending is brought into contact with the stopper body, the lead terminal is automatically positioned with respect to the lower mold. That is, according to the present invention, the stopper body for positioning the electronic component with respect to the lower mold does not hinder the bending of the lead terminals due to the downward movement of the upper mold. When the stopper is not present, the stopper body is moved to the position where the electronic component comes into contact with the upper die and the position away from the electronic component in the same manner as in the past. Since there is no need to perform this, it is possible to avoid the structure of the device becoming complicated and upsizing, and furthermore, before sliding and discharging the bent electronic component, the stopper body is separated from the electronic component. By eliminating the need for moving operation, the time required for bending one electronic component can be shortened.Therefore, the number of electronic components that can be bent per unit time can be increased, greatly improving work efficiency. It has the effect of being able to improve. An embodiment of the present invention will be described below with reference to FIGS. In this figure, reference numeral 1 denotes a machine base, and a lower mold 2 is mounted on an upper surface of the machine base 1, and the lower mold 2 is moved downward toward the lower mold 2 above the lower mold 2. An up-and-down movable upper mold 3 which is moved up afterward is provided. When the electronic component A shown in FIG. 1 is placed on the upper surface of the lower mold 2, the lead terminals A2 on the left and right sides of the electronic component A1 are connected to the left and right side surfaces 2a, 2a of the lower mold 2. It is configured to protrude outward from 2b. On the other hand, the upper mold 3 is composed of a pressing body 4 for pressing the package portion A1 of the electronic component A against the lower mold 2, and rollers 5 and 6 disposed on both left and right sides thereof. The downward movement of the mold 3 first presses the package part A1 of the electronic component A against the lower mold 2 by the pressing body 4, and then the rollers 5 on both sides thereof.
6 further moves downward, and each lead terminal A2 of the electronic component 1 is moved to the left and right side surfaces 2 of the lower mold 2.
It is configured to bend downward along a and 2b. Reference numeral 7 denotes a feeding means for feeding the electronic component A to the upper surface of the lower mold 2. The feeding means 7 includes a guide member 8 extending from one end of the lower mold 2 and a guide member 8. A feeder 9 which moves forward along the upper surface of the guide member 8 toward the lower mold 2 and then retreats, and is cut off from the lead frame B so as to be placed on the upper surface of the guide member 8. The electronic component A is moved forward toward the lower die 2 of the feeder 9,
It is configured to be fed into the upper surface of the lower mold 2. Reference numeral 10 denotes a positioning stopper body rotatably connected to the machine base 1 with a pin 11 and the stopper body 10 has a distal end 10a.
Is configured to move up and down in a state where a gap of an appropriate dimension is provided between the one side surface 2a of the lower mold 2 and the other side surface opposite to the feeding means 7 and the one side surface 2a. The stopper body 10 is provided with a spring 13 at the other end 10b so as to urge the other end 10b into contact with the stopper 12, so that the lower mold is provided with respect to the tip 10a. The upper surface of the electronic component A is configured to be held in such a state that the tip of the lead terminal A2 of the electronic component A contacts the upper surface of the electronic component A. [0014] In this configuration, the electronic component A in the upper surface of the guide member 8, the forward movement of the feed member 9, when fed to the upper surface of the lower die 2, the electronic component A is a lower
The electronic component A is moved along the upper surface of the mold 2 to the other end.
The lead terminal A2 before bending comes into contact with the distal end portion 10a of the stopper body 10 and the movement is stopped.
This automatically positions the lower mold 2 at a predetermined position. Next, after the feed body 9 is moved backward, the upper mold 3 pushes down the tip 10a of the stopper body 10 against the spring 13 at the other end as shown by a two-dot chain line in FIG. By moving down, each lead terminal A2 of the electronic component A is moved to the lower mold 2
Is bent downward along the left and right side surfaces 2a and 2b in the above. When this bending is completed, the upper mold 3 is raised, and the tip 10a of the stopper body 10 is
Is returned to the original position by the spring 13, the next electronic component A on the upper surface of the guide member 8 is fed to the upper surface of the lower mold 2 by the forward movement of the feeder 9, and the lower die is first moved. The electronic component A bent on the upper surface of the mold 2 has the bent lead terminal A2 as the lower mold 2.
And one end 2 of the stopper body 10
0a, and slides out from the upper surface of the lower mold 2 to the chute 14 side, while the next electronic component A is the lead terminal A before being bent.
The stopper 2 is automatically positioned with respect to the lower mold 2 by contacting the tip 10a of the stopper body 10. The stopper body 10 is provided with a lower mold 2.
May be provided on the other side surface 2b side, or may be provided on both the left and right side surfaces 2a and 2b of the lower mold 2, and the stopper body 10
It is needless to say that instead of the rotary type as in the above-described embodiment, the vertical type may be used.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of an electronic component. FIG. 2 is a perspective view showing a state in which each lead terminal of the electronic component is bent. FIG. 3 is a perspective view showing an apparatus according to an embodiment of the present invention. FIG. 4 is a sectional view taken along line IV-IV of FIG. 3; FIG. 5 is a sectional view taken along line VV of FIG. 3; [Description of Signs] A Electronic component A1 Package part A2 Lead terminal 1 Machine base 2 Lower mold 2a, 2b Lower mold side surface 3 Upper mold 7 Feeding means 10 Stopper body 13 Spring

Claims (1)

(1) A lower mold for mounting an electronic component such that lead terminals on both left and right sides thereof protrude from both right and left sides, and a lowering movement toward the lower mold causes the electronic component to move. And an upper mold for bending each lead terminal downward along the left and right side surfaces of the lower mold, wherein the electronic component is applied to an upper surface at one end of the lower mold.
To move in the direction of the other end along the upper surface of the lower mold
While the feeding means for feeding is provided, at least one of the side surfaces of the lower mold, the other end of the lower mold opposite to the feeding means, is folded at the electronic component.
At the tip of the lead terminal before bending
Move the stopper that comes into contact with the
The folded back is placed between the upper body and the one side.
Provide a gap so that the
The upper body contacts the upper mold when it moves down.
And move the stopper body back to a position where it comes into contact with the lead terminal before bending.
An apparatus for bending lead terminals in an electronic component, comprising: a spring means for urging upward.