CN113757237B - Spacing tool and spacing compression fittings - Google Patents
Spacing tool and spacing compression fittings Download PDFInfo
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- CN113757237B CN113757237B CN202010484739.XA CN202010484739A CN113757237B CN 113757237 B CN113757237 B CN 113757237B CN 202010484739 A CN202010484739 A CN 202010484739A CN 113757237 B CN113757237 B CN 113757237B
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- limiting
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- abutting
- lower mold
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- 230000006835 compression Effects 0.000 title claims description 3
- 238000007906 compression Methods 0.000 title claims description 3
- 238000003825 pressing Methods 0.000 claims abstract description 79
- 230000007246 mechanism Effects 0.000 claims abstract description 35
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 description 25
- 239000000758 substrate Substances 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/002—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by pressing the elements together so as to obtain plastic deformation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention relates to a limiting jig and a limiting pressing device, wherein the limiting pressing device comprises a limiting jig and a pressure supply mechanism connected with the limiting jig, the limiting jig comprises an upper die and a lower die which are opposite up and down and can move up and down, and a limiting mechanism arranged between the upper die and the lower die, the limiting jig is mainly characterized in that a limiting component is arranged at a workpiece alignment port of a limiting module, and a corresponding pressing component is arranged at a position, corresponding to the limiting component, of the upper die.
Description
Technical Field
The present invention relates to a positioning jig and a positioning pressing device, and more particularly to a positioning jig and a positioning pressing device for positioning a substrate such as a semiconductor device and a heat sink and providing a pressing operation.
Background
With the development of technology and technology, the requirement for information processing speed is increased, and the conventional semiconductor device is gradually developed towards high frequency, and the high frequency semiconductor device is likely to generate high temperature during the working process, so that, in order to avoid the problem of high temperature damage or performance degradation of the semiconductor device, the conventional semiconductor device can provide a cooling effect through an external heat dissipation structure, and in addition, a heat dissipation sheet with a heat dissipation improvement function is pressed on a substrate provided with a semiconductor chip during the manufacturing process of the semiconductor device, so that the high temperature generated during the working process of the semiconductor device can be conducted to the heat dissipation sheet, and the heat dissipation area is enlarged through the heat dissipation sheet, thereby achieving the heat dissipation effect.
In the conventional process of laminating a heat sink on a substrate, after a heat conductive adhesive is applied to the periphery of the top surface of the substrate having a semiconductor chip, the heat sink is initially attached to the substrate in an aligned manner, the semiconductor device with the heat sink attached thereto is placed on a carrier, the carrier with a plurality of semiconductor devices is then moved into a semiconductor device laminating machine, the upper and lower dies of a laminating jig in the semiconductor device laminating machine are used to oppositely laminate the substrate and the heat sink of the semiconductor device, and after the lamination is completed, the carrier with the semiconductor devices is taken out of the semiconductor device laminating machine.
And a limiting die is arranged between an upper die and a lower die of the pressing jig, a workpiece alignment port is formed on the limiting die, a guide inclined plane inclined from inside to outside is formed on the side wall of the workpiece alignment port, and when the pressing jig is manufactured, the substrate and the radiating fin of the semiconductor element can utilize the design of the guide inclined plane inclined from inside to outside of the workpiece alignment port, so that the guide inclined plane can push the radiating fin in the pressing action process, so that the radiating fin and the substrate are automatically aligned.
Disclosure of Invention
The main objective of the present invention is to provide a limiting jig and a limiting pressing device, so as to improve the precision requirement of the current workpiece alignment and improve the alignment effect.
To achieve the above object, the limiting jig of the present invention comprises:
a lower die;
the upper die is arranged above the lower die and provided with at least one pressing component, the pressing component comprises a plurality of pressing structures, and the pressing structures can be telescopically arranged at the bottom of the upper die; and
the limiting mechanism is arranged between the lower die and the upper die and comprises a limiting module and at least one limiting assembly, at least one workpiece aligning port corresponding to the upper die is formed in the limiting module, the limiting assembly comprises a plurality of limiting structures, the limiting structures are distributed on the periphery of the workpiece aligning port of the limiting module and respectively correspond to a plurality of pressing structures, each limiting structure is provided with a pushing part, and the pressing structures can press the limiting structures to enable the pushing parts to deflect towards the direction of the workpiece aligning port.
The lower die comprises a lower die plate and at least one lower die block, the lower die block is formed on the lower die plate, the lower die block can extend into a workpiece alignment port of the limiting module, a pivot gap for pivoting the pushing and supporting unit is formed between the lower die block and the side wall of the corresponding workpiece alignment port, the upper die comprises at least one upper die block corresponding to the lower die block, at least one movable hole is formed in the upper die plate, the assembling holes are formed in the periphery of the movable hole, and the upper die block can be arranged in the movable hole in a vertically linear motion mode.
To achieve the above object, the present invention provides a spacing pressing device comprising:
a limiting jig as described above; and
the pressure supply mechanism comprises a base, at least one pressure supply unit and a lifting drive assembly, wherein a movable space is arranged at the bottom of the base, an upper die of the limiting jig and the limiting mechanism can be arranged in the movable space in a vertically moving mode, the lower die is positioned below the base, the pressure supply unit can be arranged in the base in a vertically moving mode in a penetrating mode, the pressure supply unit is connected with the upper die block corresponding to the position and can provide downward pressure for the upper die block, and the lifting drive assembly is arranged in the base, is connected with the limiting mechanism and drives the limiting mechanism to move up and down.
The invention discloses a limiting jig and a limiting pressing device, which are applied to workpiece pressing operation of semiconductor elements, wherein the limiting pressing device mainly utilizes the fact that a lower die or an upper die is pressed relatively, a lower die block of the lower die pushes the semiconductor element attached with a radiating fin into a workpiece aligning port of the limiting jig, then, when the lower die and the upper die are pressed relatively continuously, a limiting module of a limiting mechanism can be close to the upper die along with the movement of the lower die, and a pressing structure of the upper die can respectively push corresponding limiting structures on the limiting mechanism, so that pushing parts of the limiting structure swing towards the workpiece aligning port direction respectively, and simultaneously push and right a substrate of the semiconductor element and a radiating fin positioned above the substrate, the radiating fin and the substrate can be aligned up and down under the pushing of the pushing parts of the limiting structures, and the pressure supply mechanism can keep a precise aligning state when the radiating fin is pressed on the substrate, thereby improving the product quality.
The limiting jig can utilize the plurality of limiting structures to match with the pushing parts of the pressing structures of the upper die to respectively push and position the radiating fins and the substrate, is suitable for the manufacturing process of semiconductor elements with various sizes, and can reduce the size precision requirement of the workpiece aligning port so as to reduce the production cost of the die.
Drawings
FIG. 1: is a schematic three-dimensional appearance diagram of a preferred embodiment of the limiting jig of the present invention.
FIG. 2: is a schematic top view cross-section view of the limiting jig of the present invention.
FIG. 3: is a schematic side-view cross-sectional view of the limiting jig of the present invention.
FIG. 4 is a schematic view of: is a partially enlarged schematic view of fig. 3.
FIG. 5: is an exploded view of the spacing and pressing device of the present invention.
FIG. 6: is a plane exploded schematic view of the spacing pressing device of the invention.
FIG. 7: the invention relates to a reference diagram (I) of a limiting pressing device in a use state applied to workpiece pressing operation.
FIG. 8: the invention relates to a reference diagram (II) of a using state of a limiting pressing device applied to workpiece pressing operation.
FIG. 9: isbase:Sub>A schematic sectional viewbase:Sub>A-base:Sub>A of fig. 8.
FIG. 10: the invention relates to a reference diagram (III) of a using state of a limiting pressing device applied to workpiece pressing operation.
FIG. 11: is a schematic top cross-sectional view of fig. 10.
FIG. 12: the invention relates to a reference diagram (IV) of a using state of a limiting pressing device applied to workpiece pressing operation.
FIG. 13: the invention relates to a reference diagram (V) of a using state of a limiting pressing device applied to workpiece pressing operation.
Detailed Description
Referring to fig. 1 to 4, a limiting jig according to a preferred embodiment of the present invention includes a lower mold 10, an upper mold 20, and a limiting mechanism 30.
As shown in fig. 1 to 3, the upper mold 20 is installed above the lower mold 10, the upper mold 20 has at least one pressing component, the pressing component includes a plurality of pressing structures 22, and the plurality of pressing structures 22 are telescopically disposed at the bottom of the upper mold 20.
Wherein, it contains an cope match-plate pattern 21 to go up mould 20, cope match-plate pattern 21 forms a plurality of pilot holes 212, press to the subassembly set up in cope match-plate pattern 21, each pressure that presses to the subassembly is supported the structure 22 and is contained a fore-set 221 and an fore-set piece 222, the fore-set 221 sets up respectively in these a plurality of pilot holes 212, just the fore-set 221 is protruding to be stretched out corresponding pilot hole 212, the fore-set piece 222 that resets sets up in corresponding pilot hole 212 to can push against corresponding fore-set 221, make the fore-set 221 resets.
As shown in fig. 2 to 4, the limiting mechanism 30 is disposed between the lower die 10 and the upper die 20, the limiting mechanism 30 includes a limiting module 31 and at least one limiting component, the limiting module 31 is formed with at least one workpiece aligning opening 311, the limiting component includes a plurality of limiting structures 32, the plurality of limiting structures 32 are distributed on the periphery of the workpiece aligning opening 311 of the limiting module 31 and respectively correspond to the plurality of pressing structures 22, each limiting structure 31 has a pushing portion 322, and the pressing structures 22 can push against the limiting structures 31, so that the pushing portions 322 deflect toward the workpiece aligning opening 311.
The position-limiting module 31 forms a plurality of group-setting grooves 312 on the side wall of the workpiece alignment opening 311, the position-limiting structures 32 are disposed in the group-setting grooves 312, each position-limiting structure 32 includes a pushing-supporting unit 321 and a resetting member 324, the pushing-supporting unit 321 is pivoted in the corresponding group-setting groove 312, the pushing-supporting unit 321 faces the workpiece alignment opening 311 downward to form the pushing-supporting part 322, the resetting member 324 is disposed in the corresponding group-setting groove 312 and abuts against the bottom end of the pushing-supporting unit 321 to provide the function of resetting the pushing-supporting unit 321, the top pillar 221 of the pressing-supporting structure 22 can press the stacking-supporting unit 321, so that the pushing-supporting part 322 of the pushing-supporting unit 321 deflects toward the workpiece alignment opening 311.
As shown in fig. 4, each pushing unit 321 has a pressing portion 323 and the pushing portion 322, the pressing portion 323 is pivotally disposed in the corresponding assembling groove 312, the pushing portion 322 extends downward from the pressing portion 323 toward the workpiece aligning opening 311, the reset member 324 abuts against the bottom end of the pressing portion 323 of the pushing unit 321, the top pillar 221 of the pushing structure 22 can press against the corresponding pressing portion 323 of the pushing unit 321, so that the pushing portion 322 of the pushing unit 321 deflects toward the workpiece aligning opening 311, and the assembling grooves 312 are respectively disposed at the corners of the workpiece aligning opening 311.
Furthermore, as shown in fig. 3, the lower mold 10 includes a lower mold plate 11 and at least one lower mold block 12, the lower mold block 12 is formed on the lower mold plate 11, the lower mold block 12 can extend into the workpiece aligning opening 311 of the limiting module 31, a pivoting gap for the pivoting of the pushing unit 321 is formed between the lower mold block 12 and the corresponding sidewall of the workpiece aligning opening 311, the upper mold 20 includes at least one upper mold block 23 corresponding to the lower mold block 12, the upper mold plate 21 is formed with at least one movable hole 211, the plurality of assembly holes 212 are formed at the periphery of the movable hole 211, and the upper mold block 23 can be vertically and linearly disposed in the movable hole 211.
Referring to fig. 5 and fig. 6, a limiting and pressing device according to a preferred embodiment of the present invention includes a limiting jig and a pressure supplying mechanism 40.
As shown in fig. 6, the pressure supply mechanism 40 includes a base 41, at least one pressure supply unit 42, and a lifting driving assembly 43, the base 41 has a movable space at the bottom, the upper mold 20 and the limiting mechanism 30 of the limiting jig can be disposed in the movable space in an up-and-down motion, the lower mold 10 is located below the base 41, the pressure supply unit 42 can be disposed in the base 41 in an up-and-down motion, the pressure supply unit 42 is connected to the upper mold block 23 at a corresponding position and can provide a downward pressure to the upper mold block 23, and the lifting driving assembly 43 is disposed in the base 41 and is connected to the limiting mechanism 30 and drives the limiting mechanism 30 to move up and down.
As shown in fig. 5 and 6, regarding the use of the limiting jig and the limiting pressing device of the present invention, the upper mold 20 can be connected to a pressure supply mechanism 40 to form a limiting pressing device, the pressure supply mechanism 40 can be selected from various existing pressure supply mechanisms 40, or the pressure supply mechanism 40 provided by the present invention is selected, and then the lower mold 10 is connected to a lifting driving mechanism (not shown), so that the lower mold 10 can be driven to move up and down by the lifting driving mechanism, and the base 41 is fixed right above the lower mold 10 for pressing the workpieces 51 such as semiconductor devices.
As shown in fig. 7, before the bonding operation, the lower mold 10 can relatively support a workpiece tray 50 on which at least one workpiece 51 (e.g., a semiconductor device) is placed, the workpiece 51 has a lower part 53 (e.g., a substrate of the semiconductor device) and an upper part 52 (e.g., a heat sink of the semiconductor device), the upper part 52 is adhered to a top surface of the lower part 53 by a glue (e.g., a heat conductive glue, not shown), and the glue is in an uncured state before being bonded.
As shown in fig. 7 to 9, during the pressing operation of the workpiece 51, the lifting driving mechanism can push the lower die 10 and the workpiece tray 50 on which the workpiece 51 is placed to ascend together, and when the lower die 10 pushes the workpiece tray 50 to make the workpiece tray 50 abut against the limiting module 31, the lower die 12 of the lower die 10 pushes the workpiece 51 to make the workpiece 51 separate from the workpiece tray 50 and enter the workpiece aligning opening 311 corresponding to the limiting module 31.
Next, as shown in fig. 10 and 11, when the lower die 10 is continuously raised after the workpiece 51 completely enters the workpiece aligning opening 311, the lifting driving component 43 disposed in the base 41 drives the limiting module 31 of the limiting mechanism 30 to be raised along with the lower die 10, at this time, the abutting unit 321 located around the workpiece aligning opening 311 of the limiting module 31 abuts against the top pillar 221 of the upper die 20, and the top pillar 221 provides a downward pushing force to the pressing portion 323 of the abutting unit 321 under the abutting of the top pillar resetting piece 222, so that the pressing portion 322 deflects toward the workpiece aligning opening 311, and pushes the upper part 52 or the lower part 53 of the workpiece 51, so that the upper part 52 and the lower part 53 of the workpiece 51 can be guided and aligned under the pushing of the pressing portions 322 of the plurality of abutting units 321.
As shown in fig. 12, the lower mold 10 continues to ascend, and the elevation driving component 43 disposed in the base 41 also continues to drive the limiting module 31 of the limiting mechanism 30 to ascend, the workpiece 51 is pushed by the lower module 12 and limited by the plurality of pushing units 321, so that the upper part 52 of the workpiece 51 contacts the upper module 23 of the upper mold 20, at this time, the lower module 12 continues to apply upward pushing force to the lower part 53 of the workpiece 51, so that the pressure supply unit 42 and the upper module 23 in the pressure supply mechanism 40 apply downward pressure to the upper part 52 of the workpiece 51, so that the workpiece 51 is pressed by the force of the vertical clamping to compress the gap between the upper part 52 and the lower part 53, and the glue applied between the upper part 52 and the lower part 53 is pressed and diffused, at this time, the glue is gradually solidified in the pressing action, and the upper part 52 is firmly adhered to the lower part 53, thereby being shaped.
As shown in fig. 13, after the workpiece 51 is pressed and shaped, the lifting driving mechanism drives the lower mold 10 to descend and reset, the lifting driving component 43 disposed in the base 41 also drives the limiting module 31 to descend and reset together, and during the descending and resetting of the limiting module 31, the supporting column 221 is separated from the pressing portion 323 of the abutting unit 321, at this time, the resetting component 324 pushes the abutting unit 321 to reset, so that the pressing portion 322 of the abutting unit 321 is separated from the workpiece 51 and deflects in a direction away from the workpiece aligning opening 311, and then the lower mold 10 continues to descend and reset, so that the workpiece 51 is completely supported by the workpiece supporting tray 50, and after the lower mold 10 descends and resets, the workpiece supporting tray 50 supporting the pressed workpiece 51 is moved away from the lower mold 10, thereby completing the pressing operation of the workpiece 51 and continuing the pressing operation of the next workpiece 51.
In summary, the limiting jig and the limiting pressing device of the present invention can use the limiting structure 32 of the limiting mechanism 30 to match with the pressing structure 22 of the upper mold 20, so that the upper part 52 and the lower part 53 of the workpiece 51 can be respectively pressed and positioned by the pressing part 322 of the limiting structure 32 during the pressing operation of the workpiece 51, which not only can be suitable for pressing operation of workpieces 51 with various sizes, but also can reduce the requirement of the size precision of the workpiece aligning opening 311, thereby reducing the production cost of the mold.
Claims (6)
1. A spacing jig comprises:
a lower die;
the upper die is arranged above the lower die and provided with at least one pressing component, the pressing component comprises a plurality of pressing structures which can be telescopically arranged at the bottom of the upper die, the upper die comprises an upper die plate, the upper die plate forms a plurality of assembling holes, the pressing components are arranged on the upper die plate, each pressing structure of the pressing components comprises a top post and a top post resetting piece, the top posts are respectively arranged in the assembling holes, the top posts protrude out of the corresponding assembling holes, and the top post resetting pieces are arranged in the corresponding assembling holes and can push the corresponding top posts to reset the top posts; and
the limiting mechanism is arranged between the lower die and the upper die and comprises a limiting module and at least one limiting assembly, at least one workpiece alignment port is formed in the limiting module, the limiting assembly comprises a plurality of limiting structures, the limiting structures are distributed on the periphery of the workpiece alignment port of the limiting module and respectively correspond to the plurality of pressing structures, each limiting structure is provided with a pushing and abutting portion, the pressing and abutting structures can press and abut against the limiting structures to enable the pushing and abutting portions to deflect towards the direction of the workpiece alignment port, the limiting module is arranged on the side wall of the workpiece alignment port to form a plurality of assembling grooves, the plurality of limiting structures are arranged in the plurality of assembling grooves, each limiting structure comprises a pushing and abutting unit and a resetting piece, the pushing and abutting units are pivoted in the corresponding assembling grooves, the pushing and abutting units downwards form the pushing and abutting portions towards the direction of the workpiece alignment port, the resetting pieces are arranged in the corresponding assembling grooves and abut against the bottom ends of the pushing and abutting units to provide the resetting function of the pushing and abutting units, and the pushing and abutting units can enable the pushing and abutting units to deflect towards the direction of the pressing columns of the pushing and abutting units.
2. The spacing jig according to claim 1, wherein each abutting unit has a pressing portion and the abutting portion, the pressing portion is pivotally disposed in the corresponding set groove, the abutting portion extends downward from the pressing portion toward the workpiece aligning opening, the reset member is disposed in the corresponding set groove and abuts against the bottom end of the pressing portion of the corresponding abutting unit, and the pressing structure can press the pressing portion of the corresponding abutting unit to deflect the pressing portion of the abutting unit toward the workpiece aligning opening.
3. The position limiting fixture according to claim 1 or 2, wherein the plurality of assembling slots are respectively distributed at corners of the workpiece alignment opening.
4. The position-limiting jig of claim 1 or 2, wherein the lower mold comprises a lower mold plate and at least one lower mold block, the lower mold block is formed on the lower mold plate, the lower mold block can extend into the workpiece alignment opening of the position-limiting module, a pivot gap for the pivot of the pushing unit is formed between the lower mold block and the corresponding side wall of the workpiece alignment opening, the upper mold comprises at least one upper mold block corresponding to the lower mold block, the upper mold plate is formed with at least one movable hole, the plurality of assembling holes are formed on the periphery of the movable hole, and the upper mold block can be vertically and linearly arranged in the movable hole.
5. The limiting jig according to claim 3, wherein the lower mold comprises a lower mold plate and at least one lower mold block, the lower mold block is formed on the lower mold plate, the lower mold block can extend into the workpiece alignment opening of the limiting module, a pivot gap for pivoting the pushing unit is formed between the lower mold block and a side wall of the corresponding workpiece alignment opening, the upper mold comprises at least one upper mold block corresponding to the lower mold block, the upper mold plate is formed with at least one movable hole, the plurality of assembling holes are formed on the periphery of the movable hole, and the upper mold block is disposed in the movable hole in a vertically linear motion manner.
6. A spacing compression fittings, it contains:
a spacing jig as claimed in claim 4 or 5; and
the pressure supply mechanism comprises a base, at least one pressure supply unit and a lifting drive assembly, wherein a movable space is arranged at the bottom of the base, an upper die of the limiting jig and the limiting mechanism can be arranged in the movable space in a vertically moving mode, the lower die is positioned below the base, the pressure supply unit can be arranged in the base in a vertically moving mode in a penetrating mode, the pressure supply unit is connected with the upper die block corresponding to the position and can provide downward pressure for the upper die block, and the lifting drive assembly is arranged in the base, is connected with the limiting mechanism and drives the limiting mechanism to move up and down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010484739.XA CN113757237B (en) | 2020-06-01 | 2020-06-01 | Spacing tool and spacing compression fittings |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010484739.XA CN113757237B (en) | 2020-06-01 | 2020-06-01 | Spacing tool and spacing compression fittings |
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| Publication Number | Publication Date |
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| CN113757237A CN113757237A (en) | 2021-12-07 |
| CN113757237B true CN113757237B (en) | 2023-03-24 |
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| CN204175736U (en) * | 2014-09-11 | 2015-02-25 | 京东方光科技有限公司 | A kind of tool for stitching |
| CN206225334U (en) * | 2016-02-18 | 2017-06-06 | 竑腾科技股份有限公司 | Semiconductor element pressing machine |
| CN210073790U (en) * | 2019-09-02 | 2020-02-14 | 竑腾科技股份有限公司 | Press fit jig |
| CN110586416A (en) * | 2019-09-25 | 2019-12-20 | 苏州德机自动化科技有限公司 | Automatic dispensing pressure maintaining equipment |
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| CN113757237A (en) | 2021-12-07 |
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