TWM588593U - Compression fixture - Google Patents

Abstract

A pressing jig includes a lower mold, an upper mold provided above the lower mold, and a movable pressing block provided in the upper mold which can move up and down. The lower mold can move up and down relative to the upper mold. The top of the lower mold body is respectively provided with a module corresponding to the movable pressing block, and each lower module forms an extension support part at the four corners of the substantially rectangular module base, and the outer edges of the four extension support parts extend to the components corresponding to the object to be pressed. The boundary of the zone, so that each lower module can provide good support performance for the corners of the pieces to be pressed, so that the corners around the pieces to be pressed can receive enough in the pressing fixture The pressing force can achieve a better hot pressing effect to avoid the problem of the warpage of the object corner after pressing due to insufficient pressing force.

Description

Pressing fixture

The present invention relates to a pressing jig, especially a pressing jig used in the pressing industry of semiconductor components including substrates and heat sinks or other components, where the substrate and the heat sink can be completely flat .

Such as high-frequency semiconductor components, etc., its work is usually accompanied by high temperature. In order to ensure that the semiconductor element can operate at an appropriate operating temperature, to avoid damage or degradation of its performance due to high temperature, in addition to the need to use an external heat dissipation mechanism to provide cooling and heat dissipation effects, based on the requirements of heat dissipation performance, the existing semiconductor element itself is constructed In the structure, a heat sink is usually added on the substrate with a semiconductor wafer, so that the heat generated by the substrate with the semiconductor wafer expands the heat dissipation surface area through the heat sink to assist heat dissipation.

In the current process of pressing the heat sink on the substrate of the semiconductor device assembly process, it is necessary to apply the thermal conductive adhesive on the periphery of the top surface of the substrate with the semiconductor chip first, then pre-attach the heat sink to the substrate, and then attach the heat sink The semiconductor component with heat sink is placed on the component carrier tray, and is carried by the component carrier tray and placed in the pressing jig of the semiconductor component pressing machine, and the upper die and the lower die are pressed against each other by the pressing jig After combining the substrate of the semiconductor element with the heat sink and the heating effect, after completing the thermal compression step, the component carrier plate on which the semiconductor element is placed is taken out of the semiconductor component pressing machine.

Although the pressing jig in the aforementioned semiconductor device pressing machine can provide an upward pushing force to the lower mold by the pushing mechanism and the pressure supply mechanism provides downward pressure to the pressing block of the upper mold, the pressing jig The pressing block and the lower mold in the mold can thermally fix the heat sink of the semiconductor element on the substrate, but the structure of the pressing jig in the existing semiconductor element pressing machine performs the pressure cooperation between the heat sink of the semiconductor element and the substrate When used, the pressing jig can only apply heat and pressure to the middle region where the heat sink and the substrate are relatively bonded, and it is difficult to extend to the periphery of the part where the substrate and the heat sink are relatively bonded and the corners, resulting in the substrate and the heat dissipation The corner parts of the relative bonding parts of the sheet are not subjected to sufficient pressing force, and the thin substrate and the heat sink during the hot pressing operation are affected by thermal deformation, so that the heat sink of the semiconductor element and the substrate are relatively bonded after the hot pressing The corners of the parts are prone to warp, which not only affects the appearance quality of the semiconductor element, but also makes it difficult for the heat in the substrate of the semiconductor chip to be uniformly transmitted to the heat sink to dissipate heat, resulting in uneven heat dissipation, which is further Overcome the need for improvement.

The purpose of the present invention is to provide a pressing jig to solve the problem that it is difficult for the existing pressing jig to provide sufficient pressing force to the corners around the object to be warped, and warping is easy to occur.

In order to achieve the foregoing purpose, the press-fitting jig proposed by the present invention includes a lower mold, an upper mold provided above the lower mold, and at least one movable pressing block provided in the upper mold capable of moving up and down. And can move up and down relative to the upper die, where: The die includes: The lower mold body defines a carrier positioning area and at least one component positioning area within the carrier positioning area: At least one lower module, which is disposed on the top surface of the lower mold body and protrudes upward in the component positioning area, the lower module includes a module base and four extended support parts, the module base is substantially a rectangular block , Each periphery of the module base and the boundary of the component positioning area adjacent to it have a distance respectively, and the four extension support portions are formed at four corners of the module base and protrude outward, the four The outer periphery of the extension support portion extends substantially to the boundary of the element positioning area; and At least one air flow channel, which is disposed in the lower mold body and extends to the top surface of the lower module to form an air extraction hole; The upper mold includes an upper template, at least one through hole is formed in the upper template, the number and position of the through holes correspond to the component positioning area of the lower mold; The movable pressing block is disposed in the through hole of the upper mold so as to be able to move up and down, and the position of each of the movable pressing blocks corresponds to a lower module below it, and the bottom surface of the movable pressing block and the corresponding lower The top surface of the module is parallel and can be relatively displaced up and down.

Through the creation of the above-mentioned pressing jig, it mainly uses the top of the lower body of the lower mold to provide modules respectively corresponding to the movable pressing blocks. Each lower module forms an extension support portion at the four corners of the substantially rectangular module base, The outer edges of the four extension support parts extend to the boundary of the component positioning area corresponding to the object to be pressed, thereby enabling each lower module to provide good support performance to the corners of the object to be pressed carried by the lower module. The corners around the composite part can receive enough pressing force in the pressing jig to achieve better hot pressing effect, so as to avoid the problem of warpage of the object corner after pressing due to insufficient pressing force.

The novel pressing jig can further include a middle mold, which can be disposed between the upper mold and the lower mold so as to move up and down. The middle mold forms at least one pair of positioning holes in the template, each The alignment hole corresponds to the component positioning area of the lower mold, and can communicate with the through hole corresponding to the position of the upper mold, and the bottom edge of the alignment hole forms a sloped surface inclined from the inside to the outside, so as to be topped The position of the to-be-laminated piece is placed in the alignment hole of the middle template, and the lower pressure amount is applied by the upper movable block to ensure that the to-be-laminated piece can be surely in the laminating process. The problem of positive deflection without component deflection.

As shown in FIG. 1, it discloses a preferred embodiment of the new pressing jig. As can be seen from the drawings, the pressing jig 30 cooperates with a component carrying tray 10 and at least one to-be-pressed bearing thereon The semiconductor element 20 is set in combination. The component carrier tray 10 defines at least one component placement area 11, the component carrier tray 10 places a semiconductor component 20 in each component placement area 11, and the component carrier tray 10 is placed on each component A component hole 111, a supporting edge 112 distributed on four sides of the component hole 111, and a through hole 113 located at four corners of the component hole 111 and communicating with the component hole 111 are formed in the area 11 10 There are a plurality of alignment through holes 115 on the periphery, the device carries the semiconductor device 20 through the carrying edge 112, and the positioning of the semiconductor device 20 to be pressed by a plurality of positioning pins 114 around each device placement area 11 Positioning.

As shown in FIG. 1, the pressing fixture 30 includes a lower die 40, an upper die 50 and at least one movable pressing block 60.

As shown in FIGS. 1 and 2, the lower mold 40 includes a lower mold body 41, at least a lower module 42 and at least one air flow channel. The lower mold body 41 defines a carrier positioning section 400 and is located in the carrier positioning section 400 At least one element positioning area 401, the number of the element positioning areas 401 is set according to the number of semiconductor elements carried by the element carrier 10, and the element positioning area 401 corresponds to the shape and size of the semiconductor element, The lower module 42 is disposed on the top surface of the lower mold body 41 and protrudes upward in the component positioning area 401, and the airflow channel is disposed in the lower mold body 41 and extends to the top of the lower module 42面而形成一个抽孔孔43。 Forming a suction hole 43.

As shown in FIGS. 1 and 2, in the foregoing, each of the lower modules 42 can pass through a component hole 111 preset in the component carrier tray 10 for supporting a semiconductor component 20. The lower module 42 includes a The module base 421 and the four extended support parts 422 are substantially rectangular blocks. Each periphery of the module base 421 and the boundary of the component positioning area adjacent to the module base 421 have a distance, that is, the module base 421 The area of the top surface is slightly smaller than the bottom area of the bottom of the semiconductor device. The four extension support portions 422 are formed at four corners of the module base 421 and protrude outward, and the outer periphery of the four extension support portions 422 The edge substantially extends to the boundary of the component positioning area 401, and the lower module 42 can pass through the component hole 111 of the component carrier tray 10 and the through hole 113 communicating with its four corners.

As shown in FIGS. 1 and 2, in the foregoing, opposite sides of the top surface of the lower die body 41 form at least one carrier plate stopper projecting upward at the outer edge of the boundary of the carrier plate positioning section 400 Part 411, the top surface of the lower mold body 41 is distributed with a plurality of positioning through columns 412 relative to the periphery of the component positioning area 401 in the carrier positioning area 400, and the top of the lower mold body 41 is positioned on the carrier In the section 400, a plurality of telescopic support assemblies 413 are provided.

As shown in FIG. 1, in the foregoing, the telescopic support component 413 may be a component known to have a telescopic function. In this preferred embodiment, the telescopic support assembly 413 includes a support column and a spring located at the lower end of the support column. The support column is elastically supplied by the spring so that the support column can extend out of the lower die body 41 The top surface of is used to support the component carrying tray 10, and the support column can be retracted into the top surface of the lower mold body by downward pressure.

As shown in FIG. 1, the upper mold 50 is disposed above the lower mold 40. The upper mold 50 includes an upper template 51, and at least one through hole 511 is formed in the upper template 51. The number and position of the through holes 511 It corresponds to the component positioning area 401 of the lower mold 40.

As shown in FIG. 1, the movable pressing block 60 is disposed in the through hole 511 in a linear motion up and down, and the position of each movable pressing block 60 corresponds to a lower module 42 below it. The bottom surface of the movable pressing block 60 is parallel to the top surface of the corresponding lower module 42 and can be relatively displaced up and down.

With regard to the above-mentioned preferred embodiment of the pressing jig 30 applied to the case of performing hot-pressing cooperation of semiconductor elements in a pressing device, the pressing jig is the above mold mounted on the bottom of the base of the pressure supply mechanism of the pressing device , Each pressure unit in the pressure supply mechanism is connected to the movable pressing block located at the corresponding position in the upper mold respectively, the lower mold is located below the upper mold and connected to the lifting drive mechanism of the pressing device (not shown), the aforementioned pressure Known mechanisms can be used for the pressure supply mechanism and lifting drive mechanism of the closing device, and they are not part of the creation of the new model, and will not be repeated here.

In the initial state where the upper mold and the lower mold of the pressing jig are separated up and down, there is a space of a predetermined size between the upper mold and the lower mold to provide a component carrier tray carrying at least one semiconductor component to be pressed and moved down The top of the mold is positioned, and the component carrier plate places a semiconductor component in each component placement area. The semiconductor component includes a substrate with a wafer, a thermally conductive adhesive, and a heat sink. The thermally conductive adhesive is pre-coated on the On the periphery of the top surface of the substrate, the heat sink is adhered to the top surface of the substrate by thermally conductive adhesive, and the thermally conductive adhesive is uncured before being pressed. Secondly, the lifting movement of the lower die is pushed up and down by the lifting driving mechanism, combined with the movable pressing block under pressure, in the heated environment, the heat pressing cooperation between the heat sink of the semiconductor element and the substrate is performed, and the movable pressing block The clamping force is relatively opposed to the lower module of the lower mold, so that the heat sink of the semiconductor element and the substrate are thermally and pressure bonded together.

As shown in another preferred embodiment shown in FIG. 3, the pressing fixture 30 may further include a middle mold 70, which is disposed between the upper mold 50 and the lower mold 40 so as to move up and down. The middle mold 70 includes a middle template 71 in which at least one pair of positioning holes 711 is formed. The number and position of the positioning holes 711 correspond to the component positioning area 401 of the lower mold 40 and can The through holes 511 corresponding to the positions of the upper mold 50 communicate with each other, and the bottom edge of the alignment hole 711 forms a sloped surface 712 inclined from the inside toward the outside. The middle template 71 may also be provided with a plurality of telescoping and pressing components 72, and the plurality of telescoping and pressing components 72 may extend the bottom surface of the middle template 71 and retract into the middle template 71.

The telescoping and pressing component 72 can be a component known to have a telescoping function. In the preferred embodiment, the telescoping pressing component 72 includes a pressing column and a spring located at the upper end of the pressing column. The pressing column can be extended by the elastic force supplied by the spring The bottom surface of the middle template 71 is used to press against the component bearing tray 10, and the pressing column can be retracted into the bottom surface of the middle template 71 by being pushed upward.

As shown in FIG. 3 to FIG. 5, another preferred embodiment of the aforementioned pressing jig 30 having a middle mold 70 is applied to the case of performing a hot pressing cooperation of semiconductor devices in a pressing device. The pressing jig 30 is The upper mold 50 is installed at the bottom of the base 81 of the pressure supply mechanism 80 of the pressing device. Each pressure unit 82 in the pressure supply mechanism 80 is connected to the movable pressing block 60 at a corresponding position in the upper mold 50. The mold 70 can be installed at the bottom of the base 81 and below the upper mold 50, with a gap between the middle mold and the upper mold above it, the middle mold 70 can move up and down relative to the upper mold 50 with a limited distance, and the middle mold 70 is connected The lifting drive assembly 83 in the base 81, the lower mold 40 is located below the middle mold 70 and is connected to the lifting drive mechanism (not shown) of the pressing device, the pressure supply mechanism 80 and the lifting drive mechanism of the foregoing pressing device You can choose a known institution, which is not part of this new creation, so I won’t go into details here.

As shown in FIGS. 5 to 7, in the initial state, the lower die 40 is located directly below the upper die 50 and the middle die 70 provided in the base 81 of the pressure supply mechanism 80, and the lower die 40 and the middle die 70 The upper and lower intervals are opposite and have a predetermined space. When the component carrier tray 10 carrying the semiconductor components is moved to the top of the lower mold 40 through the space, the component carrier tray 10 passes through the carrier disc stopper portions 411 on opposite sides of the top of the lower mold body 41 of the lower mold 40 The limit position, and the alignment through holes 412 are respectively positioned on the alignment through holes 115 of the component carrying tray 10 for positioning, and at the same time, the component supporting tray is lifted by a plurality of telescopic support assemblies 413 on the top of the lower die body 41 10, the component carrier tray 10 is located above the top surface of the lower mold body 41, the bottom surface of the component carrier tray 10 and the top surface of the lower mold body 41 are spaced without contact, and the component holes 111 on the component carrier tray 10 respectively correspond to the lower module 42 The four corners of the semiconductor element 20 on the element carrier 10 correspond to each other.

As shown in FIGS. 5 to 8, the lower drive 40 is pushed up by the lifting drive and the component carrier tray 10 on which the semiconductor device 20 is placed rises, and the telescoping and pressing component 72 of the middle mold 70 corresponds to the load bearing component When the through holes 115 of the disk 10 are aligned, the component carrier disk 10 is aligned again by using a plurality of telescopic pressing members 72.

Secondly, the lower die 40 and the component carrier tray 10 on which the semiconductor elements 20 are placed are continuously pushed up to rise toward the middle mold 70, when the semiconductor components 20 in the component carrier tray 10 on the lower mold 40 start to enter the middle mold In the process of the component alignment hole 711 of the middle template 71 of 70, the component carrier disk 10 is pressed by a plurality of telescopic pressure components 72, and the lower die 40 continues to be pushed up to press the component carrier disk 10 against The telescopic support assembly 413 located at the top of the lower mold body 41 is retracted into the top surface of the lower mold body 41, so that the component carrier tray 10 abuts against the top surface of the lower mold body 41. On the other hand, the module 42 under the lower die 40 pushes the semiconductor element 20 into the element alignment hole 711 of the middle template 71 through the element hole 111 of the element carrier 10, and rises into the element alignment hole of the middle mold 70 after the semiconductor element 20 In the process of 711, the inclined surface 712 at the bottom edge of the element alignment hole 711 of the middle template 71 is used to guide the position of the semiconductor element 20, so that the heat sink 22 of the semiconductor element 20 and the substrate 21 can be accurately aligned up and down.

As shown in FIGS. 8 and 9, the lower mold 40 and the component carrier 10 on which the semiconductor element 20 is placed continue to rise together, so that the semiconductor component 20 completely enters the component alignment hole 711 of the middle mold 70, the component carrier 10 is clamped between the middle mold 70 of the middle mold 70 and the lower mold body 41 of the lower mold 40, the lower module 42 also extends into the component alignment hole 711 of the middle mold 70, and is passed through the external suction equipment through the lower The suction hole 43 in the lower module 42 of the mold 40 exerts an adsorption action on the lower substrate 21 of the semiconductor element 20, so that the substrate 21 is fixed on the top surface of the lower module 42 flatly, and the four corners of the substrate 21 respectively Leaning on the extension support portion 422 of the corresponding position of the lower module 42,

As shown in FIGS. 8 to 9, the lower die 40 and the component carrier 10 on which the semiconductor element 20 is placed are continuously pushed up to a predetermined height, and the lifting drive assembly 83 provided in the base 81 drives the middle die 70 to accompany The lower mold 40 rises together, and the semiconductor module 20 is pushed upward by the lower module 42, so that the pressure unit 82 in the pressure supply mechanism 80 is released from the support of the base 81 and the semiconductor element 20 is moved by the movable block 60 The following pressure is applied to subject the semiconductor element 20 to an upward and downward pinching force, thereby compressing the gap between the heat sink 22 of the semiconductor element and the substrate 21, and squeezing the diffusion of the thermally conductive adhesive between the heat sink 22 and the substrate 21, wherein, The guiding function of the alignment hole 711 of the middle mold 70 enables the semiconductor element to be evenly pressed in the heated environment until the thermally conductive adhesive gradually solidifies during the pressing and the heat sink 22 is firmly adhered to the substrate 21 Stereotypes.

As shown in FIGS. 9 and 10, after the semiconductor element 20 is thermally pressed to finalization, the lower die 40 is driven down by a lifting drive mechanism to be reset, and the lifting driving assembly 83 provided in the base 81 drives the middle die 70 with the lower The mold 40 is lowered and reset together. When the component carrier tray 10 on the lower mold 40 is separated from the telescopic pressing assembly 72 of the middle mold 70, the telescopic support assembly 413 of the lower mold 40 pushes the component carrier tray 10 upward until the pressing is completed The post-finished semiconductor component 20 is carried by the component carrier tray 10, and at the same time, the suction suction of the substrate 21 of the semiconductor component 20 by the lower module 42 is stopped, so that the semiconductor component 20 is completely carried by the component carrier tray 10 and is separated from the lower mold 40 The lower module 42, and after the lower mold 40 is lowered and reset, the component carrier tray 10 carrying the semiconductor components 20 after the completion of the pressing is moved away from the lower mold 40, that is, the semiconductor component pressing operation is completed.

10‧‧‧Component carrier plate 11‧‧‧Component placement area 111‧‧‧Component hole 112‧‧‧bearing edge 113‧‧‧Through hole 114‧‧‧Positioning pin 115‧‧‧Aligned through hole 20‧‧‧Semiconductor components 21‧‧‧ substrate 22‧‧‧heat sink 30‧‧‧ Pressing fixture 40‧‧‧ Die 400‧‧‧span positioning position 401‧‧‧Component positioning area 41‧‧‧Lower die body 411‧‧‧Carrier limit stop 412‧‧‧ Alignment column 413‧‧‧Telescopic support assembly 42‧‧‧Lower module 421‧‧‧Module base 422‧‧‧Extended support 43‧‧‧Suction hole 50‧‧‧ Upper die 51‧‧‧Up template 511‧‧‧Through hole 60‧‧‧mobile briquetting 70‧‧‧Middle 71‧‧‧ medium template 711‧‧‧Alignment hole 712‧‧‧Bevel guide 72‧‧‧Extendable and pressable components 80‧‧‧ pressure supply mechanism 81‧‧‧Dock 82‧‧‧Pressure unit 83‧‧‧ Lifting drive assembly

FIG. 1 is a schematic exploded perspective view of a preferred embodiment of the novel press-fitting jig and a device carrier with semiconductor devices to be pressed. FIG. 2 is a schematic top plan view of the lower die in the preferred embodiment of the press-fitting jig shown in FIG. 1. FIG. 3 is a perspective exploded view of another preferred embodiment of the press-fitting jig shown in FIG. 1 with an additional movable middle mold and a component carrier with semiconductor devices to be pressed. FIG. 4 is a schematic plan view of a preferred embodiment of the pressing jig shown in FIG. 3 applied to a pressing device. FIG. 5 is a reference diagram (1) of the use state of the preferred embodiment of the press-fitting jig shown in FIG. 3 applied to the press-fitting device to perform the hot press-cooperating industry on the semiconductor device to be pressed on the component carrier plate. 6 is a schematic partial cross-sectional view of FIG. 5. 7 is an enlarged view of FIG. 6. FIG. 8 is a reference diagram (2) of a use state of a preferred embodiment of the press-fitting jig shown in FIG. 3 applied to a press-fitting device to perform a hot-pressing operation on a semiconductor device to be pressed on a component carrier plate. 9 is a reference diagram (3) of a use state of a preferred embodiment of the press-fitting jig shown in FIG. 3 used in a press-fitting device to perform thermocompression on the semiconductor device to be pressed on the component carrier plate. FIG. 10 is a reference diagram (4) of the use state of the preferred embodiment of the press-fitting jig shown in FIG. 3 applied to the press-fitting device to perform the hot press-cooperating industry on the semiconductor device to be pressed on the component carrier plate.

10‧‧‧Component carrier plate

11‧‧‧Component placement area

111‧‧‧Component hole

112‧‧‧bearing edge

113‧‧‧Through hole

114‧‧‧Positioning pin

115‧‧‧Aligned through hole

20‧‧‧Semiconductor components

30‧‧‧ Pressing fixture

40‧‧‧ Die

41‧‧‧Lower die body

411‧‧‧Carrier limit stop

412‧‧‧ Alignment column

413‧‧‧Telescopic support assembly

42‧‧‧Lower module

421‧‧‧Module base

422‧‧‧Extended support

43‧‧‧Suction hole

50‧‧‧ Upper die

51‧‧‧Up template

511‧‧‧Through hole

60‧‧‧mobile briquetting

Claims (4)

A pressing jig includes a lower mold, an upper mold provided above the lower mold, and at least one movable pressing block provided in the upper mold capable of moving up and down. The lower mold and the upper mold can move up and down relative to the upper mold Sports, where: The die includes: The lower mold body defines a carrier positioning area and at least one component positioning area within the carrier positioning area: At least one lower module, which is disposed on the top surface of the lower mold body and protrudes upward in the component positioning area, the lower module includes a module base and four extended support parts, the module base is substantially a rectangular block , Each periphery of the module base and the boundary of the component positioning area adjacent to it have a distance respectively, and the four extension support portions are formed at four corners of the module base and protrude outward, the four The outer periphery of the extension support portion extends substantially to the boundary of the element positioning area; and At least one air flow channel, which is disposed in the lower mold body and extends to the top surface of the lower module to form an air extraction hole; The upper mold includes an upper template, at least one through hole is formed in the upper template, the number and position of the through holes correspond to the component positioning area of the lower mold; The movable pressing block is disposed in the through hole of the upper mold so as to be able to move up and down, and the position of each of the movable pressing blocks corresponds to a lower module below it, and the bottom surface of the movable pressing block and the corresponding lower The top surface of the module is parallel and can be relatively displaced up and down. The press-fitting jig according to claim 1, wherein at least one carrier disc stop projecting upward is formed on the opposite outer sides of the top surface of the lower mold body at the boundary outer edge of the carrier disc positioning interval The top surface of the lower die body is provided with a plurality of alignment piercing posts in the positioning area of the carrier and relative to the periphery of the component positioning area, and the top of the lower die body is provided with a plurality of expansion and contraction in the positioning area of the carrier Support components. The press-fitting jig according to claim 1 or 2, wherein the press-fitting jig further includes a middle mold, the middle mold is disposed between the upper mold and the lower mold movably up and down, the middle mold It includes a middle template, at least one pair of positioning holes is formed in the middle template, the number and position of the positioning holes correspond to the component positioning area of the lower mold, and can communicate with the through hole corresponding to the position of the upper mold , The bottom edge of the alignment hole forms a sloped surface inclined from the inside to the outside. The press-fitting jig according to claim 3, wherein the middle template is distributed with a plurality of telescopic pressing components, and the telescopic pressing components can extend the bottom surface of the middle template and retract into the middle template.

Images