WO2019091201A1

WO2019091201A1 - Packaging bonding wire heating combination unit and packaging method thereof

Info

Publication number: WO2019091201A1
Application number: PCT/CN2018/104462
Authority: WO
Inventors: 吴现伟; 龙华; 郑瑞
Original assignee: 深圳飞骧科技有限公司
Priority date: 2017-11-07
Filing date: 2018-09-07
Publication date: 2019-05-16
Also published as: CN107818933A

Abstract

The present invention relates to a packaging bonding wire heating combination unit, comprising a bottom plate and a hot-pressing plate, wherein the bottom plate is used for providing a pressure welding platform and the temperature required during pressure welding; a substrate is located between the bottom plate and the hot-pressing plate, and steps on a horizontal track; a pressure column is arranged on a surface, opposite the substrate, of the hot-pressing plate; the pressure column is perpendicularly fixed on the surface of the hot-pressing plate, is perpendicular to the stepping direction of the substrate, and corresponds to a gap between units mounted with chips on the substrate; the height of the pressure column is greater than the height of the units mounted with chips; and the pressure column can tightly press the substrate. When the packaging bonding wire heating combination unit in the present invention is used for performing a packaging operation and when a substrate is warped, a pressure column is firstly in contact with a front surface of the substrate to downwardly press the warped part of the substrate to make same horizontal, and the pressing is stable; and a gap between units mounted with chips on the substrate is fully utilized, so that the packaging operation can be performed continuously and stably without touching a wire or damaging the product.

Description

Package wire bonding heating unit and method for packaging same

Technical field

The present invention generally relates to the field of packaging technology, and in particular, to a package wire bonding heating unit and a method for packaging the same.

Background technique

As integrated circuits become more powerful, performance and integration become higher, and new types of integrated circuits emerge, packaging technology is playing an increasingly important role in integrated circuit products. The so-called packaging technology is a technology for packaging integrated circuits with insulating plastic or ceramic materials. The package can also be said to be a housing for mounting semiconductor integrated circuit chips, which not only plays a role in security, fixing, sealing, protection of chips and enhanced thermal conductivity. The role, but also the bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the package by wires, which in turn are connected to other devices through the wires on the printed circuit board.

In the packaging process, the purpose of pressure welding is to lead the electrodes onto the chip to complete the connection of the inner and outer leads of the product, which is a key link in the packaging technology. A common packaging mechanism is to mount the chip on a flat substrate, and then package the chip on the substrate by using an encapsulation layer on one plane of the substrate. In this process, the substrate is stepped on the carrier track to reach the bonding area, the bottom plate is raised to a preset height to contact the back surface of the substrate, the hot plate is lowered to a preset height to contact the front surface of the substrate, and then the bottom plate is opened for vacuum adsorption. The substrate is firmly adsorbed on the back side of the substrate, and the bottom plate and the hot plate are simultaneously pressed to complete the package.

At present, the commonly used hot plate is generally subjected to four-side pressing or two-side pressing in the packaging process, wherein four-sided pressing is easy to crush the product or touch the wire, and the spacing between the individual products needs to be widened; The pressure is unstable, the substrate is easily warped, the vacuum cannot be adsorbed, and the operation cannot be continued stably.

Summary of the invention

The object of the present invention is to provide a package wire bonding heating unit, which can use the package wire bonding heating unit in the packaging process to stably press the substrate without causing warpage of the substrate, and can stably and continuously perform the packaging operation. .

In order to achieve the above object, the present invention provides a package wire bonding heating unit comprising: a bottom plate and a hot pressing plate for providing a pressure welding platform and a temperature required for pressure welding, the substrate being located at the bottom plate and the Stepping between the hot platens on the horizontal track; characterized in that

a surface of the hot platen opposite to the substrate is provided with a pressing column; the pressing column is vertically fixed to a surface of the hot pressing plate, perpendicular to a step direction of the substrate, and corresponding to a chip mounted on the substrate a gap between the cells; the height of the column is greater than the height of the unit of the chip; the column can compress the substrate;

The central portion of the hot platen is hollowed out, and the hollow portion corresponds to a bonding area of the substrate.

Further, the hot pressing plate is provided with a pressing rib parallel to the end portion of the substrate in the step direction, the protruding direction of the pressing rib is the same as the protruding direction of the pressing column, and the top surface is parallel to the substrate The height of the rib is not less than the height of the ram; the rib is matched with the end of the substrate to enable the substrate to be pressed.

Further, the length of the rib is not less than the length of the bonding region of the substrate in the step direction of the substrate.

Further, the hot pressing plate is provided with a pressing rib at both ends parallel to the step direction of the substrate.

Further, the hot platen is entirely made of metal.

Further, the pressing column is cylindrical, and the top end is parallel to the surface of the substrate.

Further, the diameter of the pressure column is not more than 350 μm.

Further, the pressing column is correspondingly disposed at an intermediate position of a gap between units of the chip on which the chip is mounted.

A method for packaging by using the above packaged wire heating combination unit, comprising:

Step S1, the device is powered on, and the substrate is stepped on the horizontal track to reach the bonding area;

Step S2, raising the bottom plate to a preset height, and contacting the back surface of the substrate;

Step S3, the hot platen is lowered to a preset height to be in contact with the front surface of the substrate; in the process, when the substrate is warped, the press column will first contact the front surface of the substrate. Pressing the warped portion of the substrate down to a level as the hot platen is lowered;

Step S4, the bottom plate is opened to vacuum adsorption operation, and the back surface of the substrate is firmly adsorbed;

Step S5, the bottom plate works together with the hot pressing plate, and the substrate is completely pressed to complete the pressure welding;

Step S6, retreating the bottom plate and the hot platen, the substrate is stepped on the horizontal track, the bottom plate and the hot platen are respectively moved to a preset height, the bottom plate and the bottom plate The hot plate together presses the substrate completely to complete the pressure welding; this is repeated until the pressure welding package is completed and the equipment is shut down.

When the packaged wire heating combination unit of the present invention is used for packaging work, when the substrate is warped, the pressing column will first contact the front surface of the substrate, and the warpage portion of the substrate is pressed down to the horizontal level, and the pressing is stable, and the use is fully utilized. The gap between the cells on which the chip is mounted on the substrate enables continuous and stable packaging without touching the wire and without crushing the product.

DRAWINGS

1 is a schematic view of a packaged wire heating combination unit of the present invention.

Figure 2 is a front elevational view of the hot plate of the present invention.

Figure 3 is an A-A view of the hot platen shown in Figure 2.

Description of the reference signs:

10-base plate

20-hot platen;

201-pressing column;

202-pressure rib;

30-substrate.

Detailed ways

The embodiments of the present invention will be described in more detail in conjunction with the accompanying drawings and embodiments in order to provide a better understanding of the embodiments of the invention and the advantages thereof. However, the specific embodiments and examples described below are illustrative only and not limiting of the invention.

As shown in FIGS. 1 and 3, the packaged wire heating assembly unit of the present invention includes a bottom plate 10 and a hot platen 20. The bottom plate 10 is used to provide the temperature required for the pressure welding platform and pressure welding. The middle portion of the hot platen 20 is hollowed out, and the hollow portion corresponds to the bonding region of the substrate 30, and the substrate 30 can be pressure-welded through the hollow portion. During the packaging operation, the substrate 30 is placed between the bottom plate and the hot platen 20 and stepped on a horizontal track. The surface of the hot platen 20 opposite to the substrate 30 is provided with a pressing column 201; the pressing column 201 is vertically fixed to the surface of the hot platen 20, perpendicular to the step direction of the substrate 30, corresponding to the unit between the units on which the chip is mounted on the substrate 30. The gap; the height of the column 201 is greater than the height of the unit on which the chip is mounted; the column 201 is capable of pressing the substrate.

The substrate 30 is composed of an effective area and an ineffective area. The effective area of the substrate 30 has a matrix unit composed of the same single component to which the chip can be mounted; the single original of the substrate 30 has a two-dimensional position plan for designing components such as a chip and/or a capacitor; the non-effective area is used by four sides. Pass the clipped border.

After the packaging operation starts, the substrate 30 is stepped on the horizontal track to reach the bonding area, and the bottom plate 10 is raised to a preset height to contact the back surface of the substrate 30 to provide a pressure welding support platform to the substrate 30. The hot platen 20 is lowered to reach a preset height and is in contact with the front surface of the substrate 30. During the lowering of the hot platen 20, when the substrate 30 is warped, the press column 201 will first contact the front surface of the substrate 30. As the hot platen 20 is lowered, the press column 201 presses the warped portion of the substrate down to Level. Then, the bottom plate 10 is opened to the vacuum suction operation to firmly adsorb the back surface of the substrate 30. Thereafter, the bottom plate 10 is moved together with the hot platen 20, the substrate 30 is completely pressed, and the pressure welding is completed, and the bottom plate 10 and the hot plate 20 are retracted. The substrate 30 is again stepped on the horizontal track, and the bottom plate 10 and the hot plate 20 are again subjected to the above actions until the pressure welding package is completed and the device is stopped.

In the process of the pressure welding operation, in order to make the pressing effect of the hot platen 20 on the substrate 30 better, the embossing 202 is respectively disposed at two ends of the hot platen 20 parallel to the step direction of the substrate 30, and the rib 202 is respectively The protruding direction is the same as the protruding direction of the pressing column 201, and the top surface is parallel to the substrate 30. The height of the rib 202 is not less than the height of the column 201. The ribs 202 are fitted to both ends of the substrate 10 to press the substrate 10. The work of the pressing column 201 and the pressing rib 202 can make the pressing effect of the hot pressing plate 20 on the substrate 30 better, and the probability of warping the substrate 30 is greatly reduced.

The press column 201 in the present invention has a cylindrical shape, and the tip end is parallel to the surface of the substrate 30. The pressing column 201 and the pressing rib 202 are made of a metal material, are not easily deformed, and have a high surface finish. After the substrate 30 is pressed, the influence on the substrate 30 is small. In general, the diameter of the pressing column 201 is not more than the minimum distance between the pixel unit and the unit element on which the chip is mounted on the substrate, the half of the substrate is slidably reserved within the track, and the matrix unit is framed to the inside of the matrix unit chip. The distance between the three. For example, the minimum distance between the unit and the unit on which the chip is mounted is 250 μm, the substrate has a slidable reserved pitch of 100 μm in the track, and the distance from the outer frame of the matrix unit to the inside of the matrix unit chip is 75 μm, and the maximum diameter of the column 201 is It is 350μm.

In order to make the pressing effect of the pressing column 201 on the substrate 30 better, in general, the pressing column 201 is correspondingly disposed at an intermediate position between the cells between the unit and the unit on which the chip is mounted.

When the package operation is performed by the package bonding wire heating combination unit of the present invention, first, the device is turned on, and the substrate 30 is stepped on the horizontal track to reach the bonding area. Then, the bottom plate 10 is raised to a preset height to be in contact with the back surface of the substrate 30; the hot platen 20 is lowered to a preset height to be in contact with the front surface of the substrate 30. In this process, when the substrate 30 is warped, the press column 201 will first come into contact with the front surface of the substrate 30, and as the hot press plate 20 is lowered, the warped portion of the substrate 30 is pressed down to the level. Thereafter, the bottom plate 10 is opened to the vacuum suction operation to firmly adsorb the back surface of the substrate 30. The bottom plate 10 operates together with the hot platen 20 to completely press the substrate 30 to complete the primary pressure welding operation. Then, the bottom plate 10 and the hot plate 20 are retracted, the substrate 30 is stepped again on the horizontal track, and the bottom plate 10 and the hot plate 20 are again moved to a preset height, and the bottom plate 10 and the hot plate 20 together press the substrate 30 completely. Finish, complete the pressure welding; so repeated until the pressure welding package is completed, the equipment is shut down. That is, the method of packaging by using the above packaged wire heating combination unit is:

Step S1, the device is powered on, and the substrate 30 is stepped on the horizontal track to reach the bonding area;

Step S2, raising the bottom plate 10 to a preset height, and contacting the back surface of the substrate 30;

Step S3, the hot platen 20 is lowered to a preset height to be in contact with the front surface of the substrate 30. In the process, when the substrate 30 is warped, the press column 201 will first contact the front surface of the substrate 30, with hot pressing The lowering of the plate 20 lowers the warped portion of the substrate 30 to a level;

Step S4, the bottom plate 10 is opened to vacuum suction operation, and the back surface of the substrate 30 is firmly adsorbed;

Step S5, the bottom plate 10 and the hot platen 20 act together, and the substrate 30 is completely pressed to complete the pressure welding;

Step S6, the bottom plate 10 and the hot plate 20 are retracted, the substrate 30 is stepped on the horizontal track, and the bottom plate 10 and the hot plate 30 are respectively moved to a preset height, and the bottom plate 10 and the hot plate 20 together press the substrate 30 completely. Finish, complete the pressure welding; so repeated until the pressure welding package is completed, the equipment is shut down.

It should be noted that the above-described embodiments are merely illustrative of the invention and are not intended to limit the embodiments. Other variations or modifications of the various forms may be made by those skilled in the art in light of the above description. There is no need and no way to exhaust all of the implementations. Obvious changes or variations resulting therefrom are still within the scope of the invention.

Claims

A package wire bonding heating unit comprises: a bottom plate for providing a pressure welding platform and a temperature required for pressure welding, and a heat pressing plate, wherein the substrate is located between the bottom plate and the hot plate, at a level Stepping on the track; characterized in that

a surface of the hot platen opposite to the substrate is provided with a pressing column; the pressing column is vertically fixed to a surface of the hot pressing plate, perpendicular to a step direction of the substrate, and corresponding to a chip mounted on the substrate a gap between the cells; the height of the column is greater than the height of the unit of the chip; the column can compress the substrate;

The central portion of the hot platen is hollowed out, and the hollow portion corresponds to a bonding area of the substrate.
The packaged wire heating assembly unit according to claim 1, wherein

a pressing rib is disposed at an end of the hot platen parallel to the step direction of the substrate, a protruding direction of the pressing rib is the same as a protruding direction of the pressing column, and a top surface is parallel to the substrate; The height of the rib is not less than the height of the ram; the rib is matched with the end of the substrate to enable pressing of the substrate.
The packaged wire heating assembly unit according to claim 2, wherein the length of the rib is not less than the length of the bonding region of the substrate in the step direction of the substrate.
The packaged wire heating assembly unit according to claim 2, wherein the heat pressing plate is provided with ribs at both ends parallel to the step direction of the substrate.
The packaged wire heating assembly unit according to claim 1, wherein the hot plate is entirely made of metal.
The package wire bonding assembly unit according to claim 1, wherein said pressing column has a cylindrical shape, and a top end is parallel to a surface of said substrate.
The package wire bonding assembly unit according to claim 6, wherein the pressure column has a diameter of not more than 350 μm.
The package wire bonding assembly unit according to claim 1, wherein the pressing column is disposed at an intermediate position of a space between the cells on which the chip is mounted on the substrate.
A method for packaging by using the packaged wire heating combination unit of any one of claims 1-7, comprising:

Step S1, the device is powered on, and the substrate is stepped on the horizontal track to reach the bonding area;

Step S2, raising the bottom plate to a preset height, and contacting the back surface of the substrate;

Step S3, the hot platen is lowered to a preset height to be in contact with the front surface of the substrate; in the process, when the substrate is warped, the press column will first contact the front surface of the substrate. Pressing the warped portion of the substrate down to a level as the hot platen is lowered;

Step S4, the bottom plate is opened to vacuum adsorption operation, and the back surface of the substrate is firmly adsorbed;

Step S5, the bottom plate works together with the hot pressing plate, and the substrate is completely pressed to complete the pressure welding;

Step S6, retreating the bottom plate and the hot platen, the substrate is stepped on the horizontal track, the bottom plate and the hot platen are respectively moved to a preset height, the bottom plate and the bottom plate The hot plate together presses the substrate completely to complete the pressure welding; this is repeated until the pressure welding package is completed and the equipment is shut down.