TWM561324U - Compression fixture - Google Patents

Abstract

A press-fit jig includes a press-fit base and a press plate, wherein the press-fit base is provided with a component positioning unit in each of the plurality of unit areas of the base body, and each component positioning unit includes a carrier frame and a ring a plurality of circumferential positioning stops of the circumference, the pressing base can provide a component carrier plate carrying a plurality of semiconductor components to be pressed together, the component positioning unit positions each semiconductor component, and the pressure plate can be vertically mounted on the pressing On the pedestal, the pressure plate is pressed against the free end of the elastic piece to provide a pressing force to the semiconductor component. When the semiconductor component is fixed to the pressing fixture and then displaced into the heat treatment furnace, the pressure plate is pressed against the end of the elastic piece. The structure of the free end enables the compression of the elastic piece to be freely extended by the thermal expansion to avoid thermal stress, and can reduce the elasticity due to the annealing after the heat treatment, and ensure the pressure of the pressure plate against the elastic piece to provide pressure.

Description

Pressing fixture

The present invention relates to a press-fit jig, and more particularly to a press-fit jig that can be applied to a press-bonding cooperation of a semiconductor component press-fitting heat sink.

Existing semiconductor components operate with high temperatures, so that the high temperature generated by the semiconductor components can be quickly dissipated, and can maintain normal operation at a suitable operating temperature. Currently known semiconductor components are in their structure, usually in their A heat sink is pressed onto the substrate on which the semiconductor wafer is mounted, so that the high temperature generated by the operation of the semiconductor element can be thermally conducted to the heat sink, and the heat dissipation surface is expanded by the heat sink to dissipate heat.

At present, in the process of pressing the heat sink on the substrate of the semiconductor component, the thermosetting adhesive is applied on the substrate, the heat sink is covered with the substrate, and the heat sink is fixed on the substrate by the pressing fixture. And the spring in the pressing fixture is used to provide the force of pressing, and then the heating is performed in the heat treatment furnace together with the pressing fixture for pressing the semiconductor element to heat the semiconductor element between the substrate and the heat sink. The type of adhesive is cured, after which it is removed from the heat treatment furnace, and the press-fit jig is decomposed to take out the completed semiconductor element.

Although the conventional press-fit jig can provide a fixture for the semiconductor component to press the heat sink, the conventional press-fit jig uses a spring to provide a pressing force of the heat sink acting on the top of the semiconductor component, and has a heat sink. After the semiconductor component is pressed and pressed, the pressing fixture and the pressed semiconductor component are placed in the heat treatment furnace to solidify and fix the thermosetting adhesive of the adhesive substrate and the heat sink in the semiconductor component. During the heat treatment process, the spring providing the pressing force in the press fixture is susceptible to thermal stress due to the limitation of both ends, and the spring is easily annealed after being heated to reduce its elasticity, which makes it difficult for the spring to provide sufficient pressure. Together, it is difficult to maintain the quality of the semiconductor component product by the heat sink that is pressed against the substrate.

The purpose of the present invention is to provide a press-fit jig, which solves the problem that the spring in the press-fit jig is heated by the heat treatment of the existing press-fit jig in the heat treatment furnace after the press-fit semiconductor element, and is susceptible to heat. Then it loses its due elasticity, which makes it difficult for the spring to provide sufficient pressing force.

In order to achieve the foregoing, the present invention provides a press-fit jig comprising: a press-fit base comprising a base body and a plurality of component positioning units, the base body defining a plurality of unit regions, each The component positioning units are respectively disposed in each of the unit areas of the base body, and the component positioning units each include a bearing frame portion and a plurality of positioning blocking portions, and the bearing frame portion of each of the component positioning units Is located in the unit area, a plurality of the positioning block portions are disposed on the periphery of the carrying frame portion and protrude upward, and a top surface of each positioning block is a plate bearing surface; and a pressing plate is capable of lifting Movingly disposed on the pressing base, the pressing plate comprises a pressing plate body and a plurality of pressing elastic pieces, the pressing plate body defining a plurality of active regions, each of the active regions and each of the units of the base body a plurality of one-to-one correspondences, wherein the pressure plate body respectively forms a plurality of upper and lower movable holes in each of the active areas, and the plurality of pressing elastic pieces are respectively disposed in each of the activities of each of the active areas In the hole, One end of the pressing elastic piece is a connecting end, the connecting end is connected to the pressing plate body, and the other end of the pressing elastic piece is a pressing end portion of a free end type, and each pressing portion of the pressing piece is pressed The bottom plate can protrude downward from the bottom surface of the pressure plate body, and the pressure plate can be lowered against the positioning block, and each pressing portion of the pressing elastic piece faces the bearing frame portion of the component positioning unit.

By pre-pressing the jig, the main purpose is to use the press-fit base to provide the semiconductor component to be pressed and positioned flat, and then use the pressure plate to fall against the press-fit base, and the press plate can be pressed in multiples. The shrapnel collectively provides the necessary pressing force to each of the semiconductor elements, and then when the semiconductor element is fixed to the pressing jig and then displaced by the heat treatment furnace, each of the pressing plates is pressed against the end of the elastic piece to be a free end structure, so that the pressing force is pressed. The shrapnel can be freely stretched by thermal expansion to avoid thermal stress, and can reduce the elasticity caused by annealing after heat treatment, and ensure that the pressure of the pressure plate is pressed against the elastic sheet to provide pressure performance.

The press fitting can further further arrange a plurality of pressing elastic sheets of each action zone of the pressure plate in different directions, so that the pressure plate can provide a smooth pressing force to the pressed semiconductor component, and is pressed and pressed. During the heating process of the heat-treating furnace with the press-fitted semiconductor component, the plurality of pressing elastic sheets are arranged in different directions, and the end of each pressing elastic sheet is a free end structure, and is extended in different directions when heated to enable the pressure plate to Avoid thermal stresses.

The press-fit jig further further comprises the press-fit base comprising a plurality of alignment pillars, wherein the top ends of the alignment pillars respectively form a tip end portion, and the plurality of the alignment pillars are disposed on the outermost sides of the press-fit bases The positioning block at the end corner of the component positioning unit can protrude from the top surface of the positioning block and can move up and down. The pressure plate body of the pressure plate is provided with a plurality of alignment holes, and each of the pressure plates The positions of the holes correspond to the alignment posts in the press-fit base, respectively. By the cooperation of the alignment column and the alignment hole, the pressure plate can be properly pressed against the ground and pressed against the pressing base, and each of the pressing plates can be correctly pressed against the semiconductor in the pressing base. The component is applied with a pressing force.

The press-fit jig can also be provided with a top abutting column in the rest of the positioning stops, and the top abutting column can protrude from the top surface of the positioning block and move up and down. Used to smoothly support the pressure plate drop.

The pressure-pressing fixture can further further comprise the pressure plate as a member made of a magnetic conductive material, and a permanent magnet is respectively disposed in the plurality of positioning stops of the pressing base, so that the pressure plate is lowered against the positioning block, Positioning with multiple permanent magnets is used to prevent the platen from slipping out of position.

As shown in FIG. 1 , a perspective exploded view of an embodiment of the present invention is disclosed. As shown in the drawings, the press fixture includes a press base 10 and a pressure plate 20 .

As shown in FIG. 1 , the press base 10 includes a base body 11 and a plurality of component positioning units 12 . The base body 11 defines a plurality of unit regions 110 , and each of the component positioning units 12 is separately disposed. In the plurality of unit areas 110 of the base body 11, the component positioning units 12 each include a carrier frame portion 121 and a plurality of positioning stops 122. The carrier frame portion 121 is a rectangular frame. The carrier frame portion 121 of the component positioning unit 12 is disposed in the unit region 110. The plurality of the positioning barrier portions 122 are disposed at a periphery of the carrier frame portion 121 and protrude upward. In this embodiment, the positioning block The portion 122 is disposed at a periphery of the four end corners of the bearing frame portion 121. The positioning portion 122 forms a single L-shaped block. However, the positioning portion 122 is also limited to the shape. It can be a combination of a plurality of blocks. The top mask of each of the positioning stops 122 has a platen bearing surface 123.

As shown in FIG. 1 and FIG. 2, the press-fit base 10 further includes a plurality of alignment pillars 13 disposed at a periphery of a plurality of the unit regions 110, and the top of the alignment pillars 13 is disposed. Each of the alignment posts 13 is respectively disposed in the positioning block 122 at the outermost corner of the two sides of the press-fit base 10, and can be protruded. The top surface of the positioning block 122 is moved out and can move up and down. Each of the other positioning stops 122 is provided with a top abutting post 14 , and the top abutting post 14 can protrude from the top surface of the positioning block 122 and move up and down.

As shown in FIG. 1 , the pressure plate 20 can be driven to be mounted on the pressing base 10 . The pressure plate 20 includes a pressure plate body 21 and a plurality of pressing elastic pieces 22 , and the pressure plate body 21 defines a plurality of active areas. Each of the active areas 210 of the platen body 21 has a one-to-one correspondence with each of the unit regions 110 of the base body 11. The platen body 21 forms a plurality of upper and lower portions in each of the active regions 210. Through the movable hole 211. In the preferred embodiment, a plurality of the pressing elastic pieces 22 are respectively disposed in each of the movable holes 211 of each of the active areas 210, and one end of the pressing elastic piece 22 is a connecting end. And the connecting end 221 is connected to the pressure plate body 21, and the other end of the pressing elastic piece 22 is a pressing portion 222, and is a movable free end portion. The pressing portion 222 of each of the pressing elastic pieces 22 can protrude downward from the bottom surface of the pressure plate body 21.

As shown in FIG. 1, a plurality of the pressing elastic pieces 22 in each of the action regions 210 of the pressure plate 20 are arranged in different directions. In the preferred embodiment, each of the active areas 210 has 4 The pressing elastic pieces 22 and the four pressing elastic pieces 22 are arranged in different directions, and the pressing portion 222 of each of the pressing elastic pieces 22 corresponds to the component positioning unit 12 of the pressing base 10. The end corner of the bearing frame portion 121. A plurality of alignment holes 212 may be disposed in the platen body 21 of the pressure plate 20, and the positions of each of the alignment holes 212 correspond to the alignment posts 13 in the press-fit base 10, respectively.

As shown in FIG. 1 , the pressing elastic piece 22 can be integrally formed with the pressure plate body 21 , or as shown in FIG. 3 , the connection end 221 of the pressing elastic piece 22 is fixed to the pressure plate body 21 by the fixing component. example. As shown in FIG. 5, the bottom surface of the pressing portion 222 of the pressing elastic piece 22 has a pressing block 223.

As shown in FIG. 2, the pressure plate 20 may be a member made of a magnetically permeable material, and a plurality of permanent magnets 15 are disposed in the press-fit base 10 for magnetically absorbing the pressure plate 20. In the preferred embodiment, a plurality of the permanent magnets 15 are disposed in the positioning block 122 of the press-fit base 10.

When the new press fixture is applied to a semiconductor component press cooperative, the press fixture can be applied to a manual semiconductor component press tool or an automated semiconductor component press device, and the press fixture is applied to automation. For example, as shown in FIG. 4 to FIG. 10, the press-fit base 10 of the press-fit jig is mounted on the machine table, and the lifting mechanism located in the machine table is connected to the press-fit base 10. The alignment post 13 and the top abutment post 14, as shown in FIGS. 4-10, cause the alignment post 13 and the top abutment post 14 to protrude from the top surface of the positioning stop 122 of the press base 10, the pressure plate 20 It is disposed above the pressing base 10 and connected to the lower pressing drive mechanism.

When performing the press cooperation, as shown in FIG. 4 and FIG. 5, a plurality of semiconductor carriers 40 to be pressed are carried by a component carrier board, and the component carrier 30 is opposite to each semiconductor component of the carrier body 31 thereof. Each of the positions of 40 is provided with a through hole 32, and the position of the semiconductor element 40 is fixed by the limiting post 33 around the periphery of each of the through holes 32. The semiconductor element 40 is attached to the substrate 41 to adhere the heat sink 42 with a thermosetting adhesive. . Next, as shown in FIG. 6, FIG. 7, and FIG. 9, the component carrier plate 30 carrying the plurality of semiconductor components 40 is placed on the press-fit base 10, wherein the component carrier plate 30 is placed on the press-fit base. 10 of the top surface of the base body 11, each component positioning unit 12 of the press-fit base 10 supports the semiconductor component 40 through the through hole 32 of the component carrier 30, and carries the semiconductor component 40 by the carrier frame 121, and a plurality of positioning stops The portion 122 is circumferentially arranged around the periphery of the semiconductor element 40. Thereafter, as shown in FIGS. 8 and 9, the platen 20 is pressed up and down from the press-fit base 10 and the plurality of semiconductor elements 40 thereon.

In the foregoing, as shown in FIG. 8 to FIG. 10, when the pressing plate 20 abuts against the plurality of semiconductor elements 40 on the pressing base 10 and the upper and lower portions thereof, the pressing plate 20 is preliminarily protruded and protrudes from the top surface of the positioning blocking portion 122. The alignment of the alignment post with the alignment hole 212 in the pressure plate 20 ensures the accuracy of the position where the pressure plate 20 is lowered, and at the same time, the plurality of tops of the top surface of the positioning block 122 are protruded by the protrusion. The column 14 is matched with the alignment post 13 to smoothly support the lowering of the pressure plate 20, so that the pressure plate body 21 of the pressure plate 20 can be smoothly and correctly positioned against the platen bearing surface 123 at the top of the positioning block 122 of the press-fit base 10, and is pressed. The plurality of pressing blocks 223 of the pressing elastic pieces 22 of 20 provide a necessary and balanced pressing force for each of the semiconductor elements 40 in a different direction. On the other hand, the pressing base 10 can be further distributed by using the distribution. The permanent magnets 15 in the positioning stops 122 are positioned by the magnetic platen 20 to prevent the platen 20 from slipping out of position.

Thereafter, after the press plate 20 and the press-fit base 10 are oppositely coupled, a pressing force is applied to each of the semiconductor elements 40, and then heated in the heat treatment furnace until the semiconductor element 40 is located between the substrate 41 and the heat sink 42. After the thermosetting adhesive is cured, the heat treatment furnace is removed, and the pressure plate 20 is moved upward to take out the pressed semiconductor component 40, thereby completing the work of pressing the heat sink 42 of the semiconductor component 40.

It can be seen from the foregoing description that the pressing fixture provides the semiconductor element to be pressed by the pressing base to be positioned flat, and then is pressed down against the pressing base by the pressing plate, and the pressing plate can press the plurality of pressing pieces. Cooperating to provide each of the semiconductor elements with the necessary pressing force, and then, when the semiconductor element is fixed to the pressing fixture and then displaced by the heat treatment furnace, each of the pressing plates is pressed against one end of the elastic piece to form a free end structure, so as to press the elastic piece The thermal expansion can be freely stretched to avoid thermal stress, and the phenomenon of reducing the elasticity due to annealing after heat treatment can be reduced, and the pressure of the pressure plate is pressed against the elastic sheet to provide pressure.

10‧‧‧Pressing base
11‧‧‧Base body
110‧‧‧Unit area
12‧‧‧Component positioning unit
121‧‧‧ carrying frame
122‧‧‧ positioning block
123‧‧‧ Platen bearing surface
13‧‧‧ alignment column
131‧‧‧ tip
14‧‧‧Top column
15‧‧‧ permanent magnet
20‧‧‧ pressure plate
21‧‧‧Plate board body
210‧‧‧Action area
211‧‧‧ activity hole
212‧‧‧ alignment hole
22‧‧‧Pressure shrapnel
221‧‧‧Connected end
222‧‧‧Fisting Department
223‧‧‧Clamps
30‧‧‧Component carrier board
31‧‧‧ Carrier board body
32‧‧‧Perforation
33‧‧‧Limited Column
40‧‧‧Semiconductor components
41‧‧‧Substrate
42‧‧‧ Heat sink

1 is a perspective exploded view of one embodiment of the present compression fitting. 2 is a partial bottom exploded view of the press-fit base in the embodiment of the press-fit jig shown in FIG. 1. 3 is a partial, isometric, isometric view of another embodiment of a pressure plate in the present compression fit fixture. 4 is a perspective view showing the movement of a semiconductor component between the press-fit base and the press plate of the embodiment of the press-fit jig shown in FIG. 1. Fig. 5 is a view showing an implementation state of a semiconductor element moved between a press base and a press plate of the embodiment of the press jig shown in Fig. 1. Fig. 6 is a view showing a state in which the semiconductor element shown in Fig. 5 is placed flat on a press-fit base, and the platen is not lowered. Figure 7 is a perspective view showing the semiconductor component shown in Figure 6 placed on a press-fit base. Fig. 8 is a side view showing a state in which the semiconductor element shown in Fig. 6 is placed flat on a press-fit base, and the press plate is pressed down against the semiconductor element. FIG. 9 is a top view showing a state in which the semiconductor element shown in FIG. 6 is placed on a pedestal base, and the platen is pressed down against the semiconductor element. Figure 10 is a side cross-sectional view showing the position of the A-A cut line shown in Figure 9.

Claims (10)

A press-fit jig includes: a press-fit base comprising a base body and a plurality of component positioning units, the base body defining a plurality of unit regions, each of the component positioning units being respectively disposed on Each of the unit regions of the base body, the component positioning unit each includes a carrier frame portion and a plurality of positioning stops, and the bearing frame portion of each of the component positioning units is located in the unit region, The positioning portion is disposed on the periphery of the bearing frame portion and protrudes upward, and a top surface of each positioning portion is a plate bearing surface; and a pressing plate is disposed on the pressing base The pressure plate includes a pressure plate body and a plurality of pressing elastic pieces, the pressure plate body defining a plurality of active areas, each of the active areas corresponding to each of the unit areas of the base body, the pressure plate body Forming a plurality of upper and lower movable holes in each of the active areas, wherein the plurality of pressing elastic pieces are respectively disposed in each of the movable holes of each of the active areas, and the pressing elastic pieces are One end is one The connecting end is connected to the pressing plate body, and the other end of the pressing elastic piece is a pressing end portion of a free end type, and each pressing portion of the pressing elastic piece can protrude downward from the bottom surface of the pressing plate body. The pressure plate can be lowered against the positioning block, and each pressing portion of the pressing elastic piece faces the bearing frame portion of the component positioning unit. The pressing fixture according to claim 1, wherein the carrying frame portion has a rectangular shape, the positioning blocking portion forms an L-shaped block, and the positioning blocking portion is disposed on the carrying frame portion. At the periphery of the four end corners. The press-fit jig according to claim 2, wherein each of the active areas has four of the pressing elastic pieces, and the four of the pressing elastic pieces are arranged in different directions, and each of the pressing points is The pressing portion of the elastic piece corresponds to the end corner of the bearing frame portion of the component positioning unit of the pressing base, and the bottom surface of the pressing portion of the pressing elastic piece has a pressing block. The press-fit jig according to claim 3, wherein the pressing elastic piece is integrally formed with the platen body. The press-fit jig according to claim 3, wherein the connecting end of the pressing elastic piece is fixed to the platen body by a fixing member. The press-fit jig according to any one of claims 1 to 5, wherein the press-fit base further comprises a plurality of aligning columns, the top ends of the aligning columns respectively forming a tip end portion, and the plurality of the aligning columns Disposed in the positioning block at the end corner of the outermost component positioning unit on both sides of the pressing base, and can protrude from the top surface of the positioning block and can move up and down, and the pressure plate body of the pressure plate is arranged There are a plurality of alignment holes, and the positions of each of the alignment holes of the pressure plate respectively correspond to the alignment posts in the press-fit base. The press-fit jig of claim 6, wherein the press-fit base is provided with a top abutting post in each of the remaining positioning stops, and the top abutment post can protrude from the positioning stop The top surface moves up and down. The pressing jig according to any one of claims 1 to 5, wherein the pressing plate is a member made of a magnetically permeable material, and a plurality of the positioning stoppers of the pressing base are respectively provided with a permanent magnet. For magnetically sucking the pressure plate. The press-fit jig according to claim 6, wherein the press plate is a member made of a magnetically permeable material, and a plurality of permanent magnets are respectively disposed in the plurality of positioning stops of the press-fit base for the magnetic attraction Said pressure plate. The pressing jig according to claim 7, wherein the pressing plate is a member made of a magnetically permeable material, and a plurality of permanent magnets are respectively disposed in the plurality of positioning stops of the pressing base for the magnetic attraction Said pressure plate.