CN207834264U - Tool for stitching - Google Patents
Tool for stitching Download PDFInfo
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- CN207834264U CN207834264U CN201820263569.0U CN201820263569U CN207834264U CN 207834264 U CN207834264 U CN 207834264U CN 201820263569 U CN201820263569 U CN 201820263569U CN 207834264 U CN207834264 U CN 207834264U
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- pressing plate
- pressing
- tool
- shrapnel
- pedestal
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Abstract
A kind of tool for stitching,It includes a pressing pedestal and a pressing plate,The pressing pedestal is respectively provided with element positioning unit in multiple cellular zones of base body,Each element positioning unit includes multiple positioning stoppers of a carrying frame portion and its week of ring,The pressing pedestal, which can provide, carries the element loading plate horizontal of multiple semiconductor elements to be laminated thereon,Element positioning unit positions each semiconductor element,Pressing plate can be set to up and down on pressing pedestal,Pressing plate provides pressing strength to semiconductor element jointly with the pressure section of its multiple free end pattern for compressing shrapnel,When semiconductor element is fixed in dislocation heat-treatment furnace after tool for stitching,The construction for compressing shrapnel end free end of pressing plate,Enable to compress shrapnel expanded by heating and freely stretches and avoid thermal stress,And can reduce heat treatment after because annealing reduce elasticity,Ensure the performance for compressing shrapnel and pressure being provided of pressing plate.
Description
Technical field
The utility model is about a tool for stitching, and espespecially one kind can be suitably used for the pressings such as semiconductor element pressing cooling fin
The tool for stitching that operation uses.
Background technology
It can be along with the high temperature of generation, to keep the high temperature that semiconductor element generates fast when existing semiconductor element work
Speed distributes, and can maintain normal operation under suitable operating temperature, and the semiconductor element being currently known leads in its assembling structure
Chang Qi is equipped on the substrate of semiconductor wafer and presses a cooling fin, the high temperature heat transfer for enabling semiconductor element work to generate
To cooling fin, then cooling surface area is expanded by cooling fin by is radiated.
At present in the processing procedure for pressing cooling fin on the substrate of semiconductor element, heat curing type viscose is first coated on substrate,
Radiation fin cover is closed into substrate again, and cooling fin is fixed on substrate with tool for stitching, and is carried using the spring in tool for stitching
For the strength of pressing, then have in the tool for stitching dislocation heat-treatment furnace of semiconductor element together with pressing and heat, makes semiconductor element
In be coated between substrate and cooling fin heat curing type viscose solidification, later, remove heat-treatment furnace, then decompose tool for stitching taking-up
Complete the semiconductor element of pressing.
Though aforementioned existing tool for stitching can provide the jig of semiconductor element pressing cooling fin operation, however, existing pressing
Jig is that the pressing strength for acting on the cooling fin at the top of semiconductor element is provided using spring, is partly led since tool is gelled
Volume elements part is placed in after tool for stitching pressed, and must be made in tool for stitching and the semiconductor element pressed dislocation heat-treatment furnace
The heat curing type viscose solidifying and setting of substrate and cooling fin is sticked together in semiconductor element, during being heat-treated herein, tool for stitching
The middle spring for providing pressing strength is also easy to produce thermal stress because both ends are restricted, and easily annealing reduces it to spring after by heat effect
It answers flexible, spring is caused to be difficult to provide enough pressing strength, the cooling fin being pressed on substrate is caused to be difficult to maintain half
The quality of conductor element product.
Utility model content
The purpose of this utility model is to provide a kind of tool for stitching, solve existing tool for stitching in pressing semiconductor element
When being heat-treated in dislocation heat-treatment furnace afterwards, the spring in tool for stitching is heated and generates thermal stress, and easily due to after by heat effect
It loses it and answers elastic, the problem of causing spring to be difficult to provide enough pressing strength.
In order to reach foregoing purpose, tool for stitching provided by the utility model includes：
One pressing pedestal, it includes a base body and multiple element positioning unit, which has defined multiple
Cellular zone, each element positioning unit are each cellular zones for being respectively arranged at the base body, and the element is fixed
Bit location includes respectively that a carrying frame portion and multiple positioning stoppers, the bearing frame portion of each element positioning unit are located at institute
It states in cellular zone, multiple positioning stopper distributions are set to the periphery of the carrying frame portion and protrude upward, and each positioning is kept off
The top surface in portion is a pressing plate loading end；And
One pressing plate can be set on the pressing pedestal to lifting moving, which includes a pressing plate ontology and multiple compress
Shrapnel, the multiple active regions of pressing plate body defining, each active region and each cellular zone of the base body are a pair of
One corresponds to, which is respectively formed multiple perforative movable spans up and down in each active region, multiple described to compress
Shrapnel is to be respectively arranged in each movable span of each active region, and described one end for compressing shrapnel is a connection
End, the connecting pin connect the pressing plate ontology, and the other end for compressing shrapnel is the pressure section in free end kenel, each
The pressure section for compressing shrapnel can be downwardly projecting in the bottom surface of pressing plate ontology, which, which can decline, is resisted against in positioning stopper, and every
One compresses the pressure section of shrapnel towards the carrying frame portion of the element positioning unit.
Created by aforementioned tool for stitching, mainly provide semiconductor element horizontal to be laminated using pressing pedestal and
Positioning recycles pressing plate decline to be resisted against on pressing pedestal, and pressing plate can compress shrapnel jointly to each semiconductor element with multiple
Necessary pressing strength is provided, subsequently when semiconductor element is fixed in tool for stitching dislocation heat-treatment furnace heating again, pressing plate
Each one end for compressing shrapnel be free end construction, enable to compress shrapnel expanded by heating and freely stretch and avoid generating heat and answer
Power, and can reduce heat treatment after because annealing reduce elasticity phenomenon, it is ensured that pressing plate compress shrapnel provide pressure performance.
The tool for stitching of the utility model can also further enable multiple shrapnels that compress of each active region of pressing plate in different
Towards arrangement, pressing plate is set to provide smoothly pressing strength to the semiconductor element pressed, and partly led in tool for stitching pressing
After volume elements part in the thermal histories of dislocation heat-treatment furnace, multiple shrapnels that compress are different towards arrangement, in conjunction with each shrapnel that compresses
One end is the construction of free end, and different directions stretching, extension is respectively facing when heated and pressing plate is enable to avoid generating thermal stress.
It includes multiple contraposition columns, contraposition top end point that the tool for stitching of the utility model, which can also further enable the pressing pedestal,
A point is not formed, and multiple contraposition column distributions are set to the end of the outermost element positioning unit in pressing pedestal both sides
In positioning stopper at angle, and the positioning stopper top surface can be protruded out and can be moved up and down, set in the pressing plate ontology of the pressing plate
There are multiple registration holes, the position of each registration holes of the pressing plate to correspond respectively to the contraposition column in the pressing pedestal.It is thereby right
The cooperation of position column and registration holes enables pressing plate correctly to align underground decompression and leans against on pressing pedestal, and makes each pressure in pressing plate
All can pressing strength correctly be imposed to the semiconductor element in pressing pedestal to shrapnel.
The tool for stitching of the utility model can also be respectively provided with a contact in pressing pedestal in remaining described positioning stopper
Column, the contact column can protrude out the top surface of the positioning stopper and move up and down, steadily pressing plate to be supported to decline.
It is component made of magnetic conductive material that the tool for stitching of the utility model, which can also further enable pressing plate, in pressing pedestal
Multiple positioning stoppers in a permanent magnet is respectively set, make pressing plate decline be resisted against positioning stopper after, using it is multiple forever
Long magnet magnetic pressing plate positioning, avoids pressing plate from sliding deviation position.
Description of the drawings
Fig. 1 is the perspective exploded view of an embodiment of the utility model tool for stitching.
Fig. 2 is the pressing pedestal fragmentary bottom decomposition diagram in tool for stitching embodiment shown in Fig. 1.
Fig. 3 is the sectional perspective decomposition diagram of another embodiment of pressing plate in the utility model tool for stitching.
Fig. 4 is the solid pressed between pedestal and pressing plate that semiconductor element moves to tool for stitching embodiment shown in Fig. 1
Schematic diagram.
Fig. 5 is the implementation pressed between pedestal and pressing plate that semiconductor element moves to tool for stitching embodiment shown in Fig. 1
State reference map.
Fig. 6 is that semiconductor element shown in Fig. 5 is flat on pressing pedestal, and pressing plate does not decline the implementation state reference of state
Figure.
Fig. 7 is the stereoscopic schematic diagram that semiconductor element shown in Fig. 6 is flat on pressing pedestal.
Fig. 8 is that semiconductor element shown in Fig. 6 is flat on pressing pedestal, and pressing plate declines the side being pressed against on semiconductor element
Depending on implementing state reference map.
Fig. 9 is that semiconductor element shown in Fig. 6 is flat on pressing pedestal, and pressing plate decline is pressed against bowing on semiconductor element
Depending on implementing state reference map.
Figure 10 is the side elevational cross-section schematic diagram of A-A face line positions shown in Fig. 9.
Primary clustering symbol description：
10 pressing pedestals
11 base body, 110 cellular zone
12 element positioning units 121 carry frame portion
122 positioning 123 pressing plate loading ends of stopper
13 contraposition 131 points of column
14 contact columns
20 pressing plates
21 pressing plate ontology, 210 active region
211 movable span, 212 registration holes
22 compress 221 connecting pin of shrapnel
222 pressure sections
Specific implementation mode
The preferred embodiment for coordinating schema and the utility model below, it is to reach to make a reservation in fact that the utility model, which is expanded on further,
The technological means taken with novel purpose.
As shown in Figure 1, disclose the perspective exploded view of an embodiment of the utility model tool for stitching, by can in figure
And, which includes a pressing pedestal 10 and a pressing plate 20 to see.
As shown in Figure 1, the pressing pedestal 10 includes a base body 11 and multiple element positioning unit 12, the pedestal sheet
Body 11 has defined multiple cellular zones 110, and each element positioning unit 12 is respectively arranged at multiple institutes of the base body 11
Cellular zone 110 is stated, the element positioning unit 12 includes respectively a carrying frame portion 121 and multiple positioning stoppers 122, the carrying
Frame portion 121 is generally the framework of a rectangle, and the carrying frame portion 121 of each element positioning unit 12 is arranged in cellular zone 110, multiple
The positioning stopper 122 is distributed the periphery for being set to the carrying frame portion 121 and protrudes upward, in this present embodiment, the positioning
Stopper 122 is distributed at the four ends angle periphery for being set to the carrying frame portion 121, and the positioning stopper 122 forms single a L-shaped
Block is not limited only with this shape, and the positioning stopper 122 can also be by the combination of multiple blocks.Each positioning stopper 122
Top surface have a pressing plate loading end 123.
As shown in Figures 1 and 2, which also includes multiple contraposition columns 13, and multiple distributions of contraposition column 13 are set
It is placed in the periphery of multiple cellular zones 110,13 top of contraposition column is respectively formed a point 131, preferably implements in this
In example, multiple contraposition columns 13 are respectively arranged in the positioning stopper 122 at the outermost side angle of 10 both sides of pressing pedestal,
And positioning 122 top surface of stopper can be protruded out and can be moved up and down.It is respectively provided with a contact column 14, institute in remaining positioning stopper 122
The top surface of the positioning stopper 122 can be protruded out and move up and down by stating contact column 14.
It is set to up and down on the pressing pedestal 10 as shown in Figure 1, the pressing plate 20 can be driven, which includes a pressure
Plate ontology 21 and it is multiple compress shrapnel 22, which defines multiple active regions 210, the pressing plate ontology 21 it is each described
Each cellular zone 110 of active region 210 and the base body 11 is to correspond, and the pressing plate ontology 21 is in each effect
Multiple perforative movable spans 211 up and down are respectively formed in area 210.It is multiple described to compress shrapnel 22 and divide in this preferred embodiment
It is not set in each movable span 211 of each active region 210, and described one end for compressing shrapnel 22 is a connection
End, and pressing plate ontology 21 is connected with the connecting pin 221, the other end for compressing shrapnel 22 is a pressure section 222, and being can
Movable free end.Each pressure section 222 for compressing shrapnel 22 can be downwardly projecting in the bottom surface of pressing plate ontology 21.
As shown in Figure 1, multiple shrapnels 22 that compress in each active region 210 of pressing plate 20 are arranged in different direction
Row, in this preferred embodiment, tool compresses shrapnel 22 there are four described in each active region 210, and bullet is compressed described in four
Piece 22 is arranged in different direction, and the element that each pressure section 222 for compressing shrapnel 22 corresponds to the pressing pedestal 10 is fixed
At the end angle of the carrying frame portion 121 of bit location 12.Multiple registration holes 212 can be also equipped in the pressing plate ontology 21 of the pressing plate 20, often
The position of one registration holes 212 corresponds respectively to the contraposition column 13 in the pressing pedestal 10.
As shown in Figure 1, the shrapnel 22 that compresses can be integrally formed with pressing plate ontology 21, alternatively, as shown in figure 3, the pressure
Connecting pin 221 to shrapnel 22 is fixed on the embodiment on pressing plate ontology 21 with attachment member.As shown in figure 5, described compress bullet
222 bottom surface of pressure section of piece 22 has a briquetting 223.
As shown in Fig. 2, the pressing plate 20 can be magnetic conductive material made of component, be provided in pressing pedestal 10 it is multiple forever
Long magnet 15, to pressing plate 20 described in magnetic.In the preferred embodiment, multiple distributions of the permanent magnet 15 are set to pressing
In the positioning stopper 122 of pedestal 10.
When the utility model tool for stitching is applied to semiconductor element bonding operation, which can apply to manually
Formula semiconductor element presses in utensil or automation semiconductor element press equipment, is applied to automation half with the tool for stitching
For volume elements part press equipment, as shown in Fig. 4 to Figure 10, the pressing pedestal 10 of the tool for stitching is installed on board, is located at machine
Elevating mechanism in platform connects the contraposition column 13 in the pressing pedestal 10 makes contraposition column with contact column 14 as shown in Fig. 4 to Figure 10
13 protrude the top surface of the positioning stopper 122 of the pressing pedestal 10 with contact column 14, which is set to 10 top of pressing pedestal
And connection one pushes driving mechanism.
It is to carry multiple to be laminated half using an element loading plate as shown in Figures 4 and 5 when carrying out bonding operation
Conductor element 40, the element loading plate 30 are respectively provided with one relative to the position of each semiconductor element 40 in its support plate ontology 31 and wear
Hole 32, and the position of the fixation semiconductor element 40 of limited post 33 using 32 peripheries of each perforation, the semiconductor element 40 is then
It is that cooling fin 42 is sticked together with heat curing type viscose on its substrate 41.Secondly, as shown in Fig. 6, Fig. 7 and Fig. 9, order carries multiple half
30 dislocation of element loading plate of conductor element 40 is on pressing pedestal 10, wherein element loading plate 30 is flat on pressing pedestal 10
11 top surface of base body, pressing pedestal 10 each element positioning unit 12 pass through the perforation of element loading plate 30 32 respectively
Semiconductor element 40 is supportted, and by 121 bearing semiconductor element 40 of carrying frame portion, multiple positioning stoppers 122 surround to be arranged in and partly lead
40 periphery of volume elements part as can be seen from figures 8 and 9, enables pressing plate 20 from top to bottom be resisted against pressing pedestal 10 multiple with thereon later
On semiconductor element 40.
In aforementioned, as shown in Fig. 8 to Figure 10, which is from top to bottom resisted against pressing pedestal 10 and multiple half thereon
When conductor element 40, pair of the contraposition column and the registration holes 212 in pressing plate 20 of 122 top surface of positioning stopper is protruded out by ejection in advance
Position cooperation, it is ensured that pressing plate 20 declines the accuracy of the position of pressing, while being pushed up using positioning stopper 122 is protruded out by ejection in advance
Multiple contact columns 14 collocation contraposition column 13 in face steadily supports pressing plate 20 to decline, and keeps the pressing plate ontology 21 of pressing plate 20 steady and position
On the pressing plate loading end 123 for setting 122 top of positioning stopper for being correctly resisted against pressing pedestal 10, and with multiple pressures of pressing plate 20
Briquetting 223 to shrapnel 22 jointly provides each semiconductor element 40 necessary and balanced pressing strength with different direction, separately
On the one hand, which can also further be set to 15 magnetic of permanent magnet in multiple positioning stoppers 122 using distribution
Pressing plate 20 positions, and pressing plate 20 is avoided to slide deviation position.
Later, after pressing plate 20 combines relatively with pressing pedestal 10, and pressing strength is imposed to each semiconductor element 40, then
When being heated in dislocation heat-treatment furnace, until the heat curing type viscose in semiconductor element 40 between substrate 41 and cooling fin 42 is solid
After change, heat-treatment furnace is removed, then pressing plate 20 is moved upward away from, take out the semiconductor element 40 of pressing, and completes semiconductor element
The operation of 40 pressing cooling fin 42.
By in preceding description it is found that depending on the tool for stitching provides semiconductor element horizontal to be laminated using pressing pedestal
Position recycles pressing plate decline to be resisted against on pressing pedestal, and pressing plate jointly can carry each semiconductor element with multiple shrapnels that compress
For necessary pressing strength, subsequently when semiconductor element is fixed in tool for stitching dislocation heat-treatment furnace heating again, pressing plate
Each one end for compressing shrapnel is the construction of free end, enables to compress shrapnel expanded by heating and freely stretches and avoid generating heat and answer
Power, and can reduce heat treatment after because annealing reduce elasticity phenomenon, it is ensured that pressing plate compress shrapnel provide pressure performance.
The above is only the preferred embodiment of the utility model, is not done in any form to the utility model
Limitation is not limited to the utility model although the utility model is disclosed above with preferred embodiment, any to be familiar with
Professional and technical personnel, in the range of not departing from technical solutions of the utility model, when in the technology using the disclosure above
Hold the equivalent embodiment made a little change or be modified to equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent change and modification made by the above technical examples according to the technical essence of the present invention, still
It is within the scope of the technical solutions of the present invention.
Claims (10)
1. a kind of tool for stitching, which is characterized in that it includes：
One pressing pedestal, it includes a base body and multiple element positioning unit, which has defined multiple units
Area, each element positioning unit are respectively arranged at each cellular zone of the base body, the element positioning unit
Include respectively that a carrying frame portion and multiple positioning stoppers, the bearing frame portion of each element positioning unit are located at the unit
Qu Zhong, multiple positioning stopper distributions are set to the periphery of the carrying frame portion and protrude upward, and the top of each positioning stopper
Face is a pressing plate loading end；And
One pressing plate, can lifting moving be set on the pressing pedestal, the pressing plate include a pressing plate ontology and it is multiple compress shrapnel,
Each cellular zone of the multiple active regions of pressing plate body defining, each active region and the base body is in pairs
It answers, which is respectively formed multiple perforative movable spans up and down in each active region, multiple described to compress shrapnel
It is respectively arranged in each movable span of each active region, and described one end for compressing shrapnel is a connecting pin, institute
It states connecting pin and connects the pressing plate ontology, the other end for compressing shrapnel is the pressure section in free end kenel, each to compress
The pressure section of shrapnel can be downwardly projecting in the bottom surface of pressing plate ontology, which, which can decline, is resisted against in positioning stopper, and each pressure
Carrying frame portion of the pressure section to shrapnel towards the element positioning unit.
2. tool for stitching according to claim 1, which is characterized in that the carrying frame portion is in a rectangle, the positioning gear
Portion forms L-shaped block, and the positioning stopper distribution is set at four ends angle periphery of the carrying frame portion.
3. tool for stitching according to claim 2, which is characterized in that tool is compressed there are four described in each active region
Shrapnel compresses shrapnel in different towards arrangement described in four, and each pressure section for compressing shrapnel corresponds to the pressing base
At the end angle of the carrying frame portion of the element positioning unit of seat, the pressure section bottom surface for compressing shrapnel has a briquetting.
4. tool for stitching according to claim 3, which is characterized in that it is described compress shrapnel and the pressing plate ontology one at
Type.
5. tool for stitching according to claim 3, which is characterized in that the connecting pin for compressing shrapnel is solid with attachment member
Due on pressing plate ontology.
6. tool for stitching according to any one of claim 1 to 5, which is characterized in that the pressing pedestal also includes multiple
Column is aligned, the contraposition top end is respectively formed a point, and multiple contraposition column distributions are set to the pressing pedestal both sides
Outermost element positioning unit end angle at positioning stopper in, and can protrude out the positioning stopper top surface and can on move down
It is dynamic, multiple registration holes are equipped in the pressing plate ontology of the pressing plate, the position of each registration holes of the pressing plate corresponds respectively to the pressure
Close the contraposition column in pedestal.
7. tool for stitching according to claim 6, which is characterized in that the pressing pedestal is in remaining described positioning stopper
It is respectively provided with a contact column, the contact column can protrude out the top surface of the positioning stopper and move up and down.
8. tool for stitching according to any one of claim 1 to 5, which is characterized in that the pressing plate is magnetic conductive material system
At component, a permanent magnet is respectively set in multiple positioning stoppers of the pressing pedestal, to pressing plate described in magnetic.
9. tool for stitching according to claim 6, which is characterized in that the pressing plate is component made of magnetic conductive material, should
It presses in multiple positioning stoppers of pedestal and a permanent magnet is respectively set, to pressing plate described in magnetic.
10. tool for stitching according to claim 7, which is characterized in that the pressing plate is component made of magnetic conductive material, should
It presses in multiple positioning stoppers of pedestal and a permanent magnet is respectively set, to pressing plate described in magnetic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820263569.0U CN207834264U (en) | 2018-02-23 | 2018-02-23 | Tool for stitching |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820263569.0U CN207834264U (en) | 2018-02-23 | 2018-02-23 | Tool for stitching |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207834264U true CN207834264U (en) | 2018-09-07 |
Family
ID=63398184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820263569.0U Active CN207834264U (en) | 2018-02-23 | 2018-02-23 | Tool for stitching |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207834264U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110802293A (en) * | 2019-11-07 | 2020-02-18 | 丰鹏电子(珠海)有限公司 | Semiconductor device welding positioning device and semiconductor device welding method |
-
2018
- 2018-02-23 CN CN201820263569.0U patent/CN207834264U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110802293A (en) * | 2019-11-07 | 2020-02-18 | 丰鹏电子(珠海)有限公司 | Semiconductor device welding positioning device and semiconductor device welding method |
| CN110802293B (en) * | 2019-11-07 | 2021-09-03 | 丰鹏电子(珠海)有限公司 | Semiconductor device welding positioning device and semiconductor device welding method |
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