TW201442086A - Jig for breaking - Google Patents

Jig for breaking Download PDF

Info

Publication number
TW201442086A
TW201442086A TW103101403A TW103101403A TW201442086A TW 201442086 A TW201442086 A TW 201442086A TW 103101403 A TW103101403 A TW 103101403A TW 103101403 A TW103101403 A TW 103101403A TW 201442086 A TW201442086 A TW 201442086A
Authority
TW
Taiwan
Prior art keywords
substrate
brittle material
opening
jig
material substrate
Prior art date
Application number
TW103101403A
Other languages
Chinese (zh)
Other versions
TWI595546B (en
Inventor
Masakazu Takeda
Yuma Iwatsubo
Kenji Murakami
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201442086A publication Critical patent/TW201442086A/en
Application granted granted Critical
Publication of TWI595546B publication Critical patent/TWI595546B/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064Devices for the automatic drive or the program control of the machines
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027Scoring tool holders; Driving mechanisms therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Adornments (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention provides a jig for breaking, capable of breaking a substrate having a functional area without causing dislocation. The solution of the present invention comprises a means for arranging a substrate 10 on a base 20 having a convex part 21 through an elastic component 30; and a means for holding the periphery of the substrate 10 by a frame shaped component 40 matching an opening 41 of the substrate 10 and a pressing component 50 having comb shaped parts 52a-53b at its upper area. Thereby, the substrate can be correctly broken without the occurrence of dislocation or warp.

Description

裂斷用治具 Crack fixture

本發明係關於一種在對半導體晶圓等之脆性材料基板、進行裂斷時所使用之裂斷用治具,且該脆性材料基板係具有功能區域(亦稱元件區域)之基板。 The present invention relates to a cracking jig for use in cracking a brittle material substrate such as a semiconductor wafer, and the brittle material substrate has a functional region (also referred to as an element region).

在專利文獻1中,提及有如下之基板裂斷裝置:對形成有刻劃線之基板,從形成有刻劃線之面的背面沿刻劃線並與面呈垂直地進行按壓而藉此裂斷。以下,揭示利用如此般之裂斷裝置進行裂斷之概要。於成為裂斷對象之基板,陣列地形成有多數個功能區域。在進行分斷之情形,首先,對基板以於功能區域之間隔著等間隔之方式於縱方向及橫方向形成刻劃線。然後,沿該刻劃線以裂斷裝置進行分斷。圖1(a)表示進行分斷前之載置於裂斷裝置之基板的剖面圖。如該圖所示,在基板101在功能區域101a、101b彼此之間形成有刻劃線S1、S2、S3…。在進行分斷之情形,在基板101之背面黏貼有黏著帶102,且在其表面黏貼有保護薄膜103。然後,在裂斷時,如圖1(b)所示般,在承受刀刃105、106之正中間配置應進行裂斷之刻劃線,在該情形係配置刻劃線S2,且從其上部使刀片(blade)104以吻合刻劃線之方式下降,按壓基板101。以如此方式進行了利用一對承受刀刃105、106與刀片104之三點彎曲之裂斷。 Patent Document 1 mentions a substrate breaking device in which a substrate on which a score line is formed is pressed from a back surface of a surface on which a score line is formed along a scribe line and perpendicularly to the surface Broken. In the following, an outline of the cracking by using such a cracking device will be disclosed. A plurality of functional regions are formed in the array on the substrate to be the object to be broken. In the case of breaking, first, the substrate is formed with scribe lines in the longitudinal direction and the lateral direction at equal intervals between the functional regions. Then, along the scribe line, the breaking device is used to break. Fig. 1(a) is a cross-sectional view showing the substrate placed on the breaking device before the breaking. As shown in the figure, scribe lines S1, S2, S3, . . . are formed between the functional regions 101a and 101b on the substrate 101. In the case of breaking, the adhesive tape 102 is adhered to the back surface of the substrate 101, and the protective film 103 is adhered to the surface. Then, at the time of the breakage, as shown in Fig. 1(b), the scribe line which should be broken is disposed in the middle of the receiving blade 105, 106, and in this case, the scribe line S2 is disposed, and from the upper portion thereof The blade 104 is lowered in an anastomosis manner, and the substrate 101 is pressed. In this manner, the breakage of the three points of the blade 105, 106 and the blade 104 is utilized.

專利文獻1:日本特開2004-39931號公報 Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-39931

在具有如此般構成之基板裂斷裝置中,呈格子狀地形成有刻劃之基板中,尤其是在進行裂斷周邊部分時,一旦將刀片下壓而進行按壓,則基板將稍微往外側移動。此時存在有基板之端部容易翹起而搭上基板固定框架、產生真空洩漏之情況。因而導致已預先設定好之使裂斷桿下降之位置與刻劃線之位置產生錯位,而存在有無法穩定地進行裂斷之問題。因而必需使裂斷用之刀片移動微小間隔、再次定位基板等,而存在有不僅在設定上花費時間,亦有可能在已成為位置錯位之情形使功能區域損傷之問題。 In the substrate breaking device having such a configuration, the substrate is formed in a lattice shape, and particularly when the peripheral portion is broken, when the blade is pressed down and pressed, the substrate is slightly moved outward. . At this time, there is a case where the end portion of the substrate is easily lifted up and the substrate fixing frame is attached to cause a vacuum leak. As a result, the position where the splitting bar is lowered and the position of the score line are misaligned, and there is a problem that the crack cannot be stably performed. Therefore, it is necessary to move the blade for rupture to minute intervals, to reposition the substrate, and the like, and there is a problem that not only the time is set in the setting, but also the functional area may be damaged in the case where the position is displaced.

本發明係著眼於如此般之問題點而完成者,目的在於提供一種用於即使反覆進行裂斷亦能夠以基板不會產生位置錯位之方式對基板進行裂斷之裂斷用治具。 The present invention has been made in view of such a problem, and it is an object of the invention to provide a jig for cracking a substrate in such a manner that the substrate can be broken without causing positional displacement even if the substrate is repeatedly broken.

為了解決該課題,本發明之裂斷用治具,係對具有刻劃線之脆性材料基板進行裂斷之裂斷用治具,具備:基座,載置該脆性材料基板;彈性構件,具有與該脆性材料基板相同之形狀,且配置於該基座上;框狀之框狀構件,於中央具有相當於該彈性構件之外形的開口,且保持已載置於該基座上之彈性構件及已載置於其上部之該脆性材料基板;以及按壓構件,配置於該框狀構件之上部,且從該框狀構件之周圍按壓該脆性材料基板。 In order to solve the problem, the jig for cracking of the present invention is a jig for cracking a substrate having a slashed brittle material, comprising: a susceptor on which the brittle material substrate is placed; and an elastic member having The same shape as the brittle material substrate is disposed on the base; the frame-shaped frame member has an opening corresponding to the outer shape of the elastic member at the center, and holds the elastic member placed on the base And the brittle material substrate that has been placed on the upper portion thereof; and the pressing member is disposed on the upper portion of the frame member, and the brittle material substrate is pressed from the periphery of the frame member.

此處,亦可為:該脆性材料基板,係具有於縱方向及橫方向以既定之間距形成之功能區域、及以功能區域位於中心之方式形成格子狀之刻劃線;該基座,係具有以相當於該脆性材料基板之功能區域之間距之 間隔配列之開口;該彈性構件,係於對應該基座之開口的位置具有貫通孔。 Here, the brittle material substrate may have a functional region formed at a predetermined distance in the longitudinal direction and the lateral direction, and a scribe line formed in a lattice shape so that the functional region is located at the center; Having a distance between functional regions corresponding to the substrate of the brittle material An opening arranged at intervals; the elastic member has a through hole at a position corresponding to the opening of the base.

此處,亦可為:該基座,具有與該脆性材料基板相同形狀之突起部;該基座之開口,係貫通該突起部。 Here, the susceptor may have a protrusion having the same shape as the brittle material substrate, and the opening of the pedestal penetrates the protrusion.

此處,亦可為:該按壓構件,係具有較該脆性材料基板小的中央之開口、及從周圍朝向該中央之開口並由相當於該脆性材料基板之功能區域之間距的間距之突起部及狹縫構成的梳狀部;該框狀構件,係於其周圍之上面具有相當於該功能區域之間距的間距之溝槽。 Here, the pressing member may have a central opening smaller than the brittle material substrate, and a protrusion extending from the periphery toward the center and having a pitch corresponding to a distance between the functional regions of the brittle material substrate. And a comb portion formed by a slit; the frame member is provided with a groove corresponding to a pitch between the functional regions on the periphery thereof.

此處,亦可為:該彈性構件,係與該脆性材料基板為相同形狀之具有一定厚度之透明的彈性板。 Here, the elastic member may be a transparent elastic plate having a certain thickness and the same shape as the brittle material substrate.

若使用具有如此般特徵之本發明之裂斷用治具,則由於脆性材料基板於周圍以裂斷用治具之框狀構件及按壓構件進行定位及裂斷,因此使得即使於裂斷時,亦不會有基板端部之位置錯位之情況。因此可獲得即使進行多少次裂斷亦無需反覆定位,而能夠沿刻劃線對脆性材料基板進行裂斷之效果。 When the jig for the crack of the present invention having such a feature is used, the brittle material substrate is positioned and broken by the frame member and the pressing member of the jig for the periphery of the crack, so that even when the crack is broken, There is also no case where the position of the substrate end is misaligned. Therefore, it is possible to obtain an effect of breaking the brittle material substrate along the score line without requiring repeated positioning even if the number of cracks is performed.

10‧‧‧脆性材料基板 10‧‧‧Battery material substrate

11‧‧‧功能區域 11‧‧‧ functional area

20‧‧‧基座 20‧‧‧ Pedestal

21‧‧‧突起部 21‧‧‧Protruding

22、24‧‧‧開口 22, 24‧‧‧ openings

23、25‧‧‧導管 23, 25‧‧‧ catheter

30‧‧‧彈性構件 30‧‧‧Flexible components

31、32‧‧‧貫通孔 31, 32‧‧‧through holes

40‧‧‧框狀構件 40‧‧‧Frame members

41‧‧‧開口 41‧‧‧ openings

42a、42b、43a、43b‧‧‧溝槽 42a, 42b, 43a, 43b‧‧‧ trench

50‧‧‧按壓構件 50‧‧‧ Pressing members

51‧‧‧開口 51‧‧‧ openings

52a、52b、53a、53b‧‧‧梳狀部 52a, 52b, 53a, 53b‧‧‧ comb

圖1,係表示習知的基板裂斷時之狀態的剖面圖。 Fig. 1 is a cross-sectional view showing a state in which a conventional substrate is broken.

圖2,係表示本發明之成為裂斷對象之基板之一例的前視圖。 Fig. 2 is a front elevational view showing an example of a substrate to be cracked in the present invention.

圖3A,係表示本發明之實施形態之裂斷用治具之一部分的立體圖。 Fig. 3A is a perspective view showing a part of a jig for a splitting according to an embodiment of the present invention.

圖3B,係表示本實施形態之裂斷用治具之一部分與成為裂斷對象之基板的立體圖。 Fig. 3B is a perspective view showing a part of the jig for cracking of the embodiment and a substrate to be cracked.

圖4,係表示於本實施形態之裂斷用治具載置有基板之狀態的剖面圖。 Fig. 4 is a cross-sectional view showing a state in which a substrate is placed on the jig for cracking of the embodiment.

在本發明之實施形態中成為裂斷對象之基板10,如圖2所示,在製造步驟中沿x軸與y軸呈格子狀地以一定間距形成有多數個功能區域11之基板。該功能區域11,例如設定成具有作為LED之功能的區域。而且,為了就各功能區域進行分斷而成為LED晶片,而藉由刻劃裝置以各功能區域位於中心之方式形成為縱方向之刻劃線Sy1~Syn與橫方向之刻劃線Sx1~Sxm相互正交。因此,該等之刻劃線Sx1~Sxm、Sy1~Syn之間距與功能區域之x軸與y軸方向之間距成為相同。 In the substrate 10 to be cracked in the embodiment of the present invention, as shown in FIG. 2, in the manufacturing step, a substrate having a plurality of functional regions 11 is formed in a lattice shape along the x-axis and the y-axis. This functional area 11 is set, for example, to have a function as an LED. Further, in order to separate the functional regions into LED chips, the scribing means is formed such that the longitudinal direction marks S y1 to S yn and the horizontal scribe lines S are formed so that the functional regions are located at the center. X1 ~ S xm are orthogonal to each other. Therefore, the distance between the lines S x1 to S xm and S y1 to S yn is the same as the distance between the x-axis and the y-axis direction of the functional region.

接著,針對在對基板10進行裂斷時所使用之本實施形態之裂斷用治具進行說明。圖3A、圖3B係表示本實施形態之裂斷用治具1之立體圖。如圖3B所示,裂斷用治具,具有正方形狀之基座20與配置於其上部之彈性構件30、保持圖3A所示之彈性構件30之周圍的框狀構件40、及具有與框狀構件40大致相同外徑之按壓構件50。裂斷用治具1固定基板10,且於從其上部藉由未圖示之刀片對基板進行裂斷時使用。 Next, the jig for cracking of the present embodiment used when the substrate 10 is broken will be described. 3A and 3B are perspective views showing the jig 1 for cracking of the embodiment. As shown in FIG. 3B, the jig for cracking has a square base 20 and an elastic member 30 disposed at an upper portion thereof, a frame member 40 holding the periphery of the elastic member 30 shown in FIG. 3A, and a frame having a frame. The member 40 is substantially the same outer diameter pressing member 50. The cracking jig 1 is used to fix the substrate 10, and is used when the substrate is broken by a blade (not shown) from the upper portion thereof.

接著,針對各構件更詳細地進行說明。基座20,以透明構件構成,且其內部成為空洞。於基座20之上面之中央,設置有與基板10相同之長方形狀之薄的突起部21,於突起部21之表面沿長方形之緣呈環狀地設置多數個開口22。該所有之開口22相連通並與設置於基座20之側方的導管23連結。此外,於開口22之內側,設置有於x軸及y軸方向所配列之多數個開口24。該等之開口24在內部全部連通,在外部之側方與導管25連結。該等之導管23、25與未圖示之真空吸附裝置連接。 Next, each member will be described in more detail. The susceptor 20 is formed of a transparent member and has a hollow inside. A rectangular projection 21 having the same rectangular shape as the substrate 10 is provided at the center of the upper surface of the susceptor 20, and a plurality of openings 22 are annularly provided on the surface of the projection 21. All of the openings 22 communicate with each other and are connected to a duct 23 provided on the side of the susceptor 20. Further, a plurality of openings 24 arranged in the x-axis and y-axis directions are provided inside the opening 22. These openings 24 are all connected internally, and are connected to the duct 25 on the outside. These ducts 23 and 25 are connected to a vacuum suction device (not shown).

接著,彈性構件30係與該突起部21為相同形狀並具有一定 厚度之橡膠等之彈性構件,且設置有沿周圍之4個邊設置之貫通孔31、及於其內側呈格子狀地配列之多數個貫通孔32。貫通孔31設置於與上述之開口22對應之位置,貫通孔32設置於與各開口24對應之位置。因此,在將彈性構件30維持載置於突起部21之正上方時,使貫通孔31與開口22、貫通孔32與開口24之各位置分別一致。為了可從下方確認該彈性構件30所載置之基板10之刻劃線之位置,該彈性構件30較佳為透明構件。 Next, the elastic member 30 has the same shape as the protrusion 21 and has a certain An elastic member such as a rubber having a thickness is provided with a through hole 31 provided along four sides of the periphery and a plurality of through holes 32 arranged in a lattice shape on the inner side. The through hole 31 is provided at a position corresponding to the above-described opening 22, and the through hole 32 is provided at a position corresponding to each opening 24. Therefore, when the elastic member 30 is held vertically above the protrusion 21, the positions of the through hole 31 and the opening 22, the through hole 32, and the opening 24 are respectively matched. In order to confirm the position of the scribe line of the substrate 10 on which the elastic member 30 is placed, the elastic member 30 is preferably a transparent member.

基座20之開口22,在已使基板10正確地定位並配置於突起部21及彈性構件30之正上方時,位於縱方向之兩端之刻劃線Sy1、Syn及橫方向之兩端之刻劃線Sx1、Sxm之外側。該等之開口22與貫通孔31,使用於在已沿刻劃線進行裂斷時,吸引各LED晶片外側之基板10端材的部分。 The opening 22 of the susceptor 20, when the substrate 10 has been correctly positioned and disposed directly above the protrusion 21 and the elastic member 30, the scribe lines S y1 , S yn and the lateral direction at both ends in the longitudinal direction The ends are scribed on the outer sides of S x1 and S xm . The openings 22 and the through holes 31 are used to attract portions of the end plates of the substrate 10 outside the LED chips when they have been broken along the score line.

此外,基座20之開口24,在已使基板10正確地定位並配置於突起部21及彈性構件30之正上方時,通過形成於基板10之刻劃線Sx2~Sx(m-1)、Sy2~Sy(n-1)相鄰之開口24之中間,且基板10之各功能區域11分別設置於與各開口24對應之位置。 Further, the opening 24 of the susceptor 20 passes through the scribe line S x2 to S x (m-1) formed on the substrate 10 when the substrate 10 has been correctly positioned and disposed directly above the protrusion 21 and the elastic member 30. ), S y2 ~ S y ( n-1) adjacent to the opening 24 of the middle, and each functional area 10 of the substrate 11 are provided at positions corresponding to the respective openings 24.

接著,如圖3A所示,框狀構件40係平板狀之構件,於其中央設置有與基板10及彈性構件30為相同矩形之開口41。於框狀構件40之周圍,在已將彈性構件30保持於中央之開口41時,沿著與x軸平行之貫通孔31、32之中心線、於x軸平行地形成有一定深度之多數個溝槽42a、42b。此外,在已將彈性構件30保持於該開口41時,沿著與y軸平行之貫通孔31、32之中心線、於y軸平行地形成有一定深度之多數個溝槽43a、43b。而且,框狀構件40之厚度,相當於基座20之突起部21、彈性構件30及基板10之厚度之和。 Next, as shown in FIG. 3A, the frame member 40 is a flat member, and an opening 41 having the same rectangular shape as the substrate 10 and the elastic member 30 is provided at the center thereof. When the elastic member 30 is held in the center opening 41 around the frame member 40, a plurality of depths are formed in parallel along the center line of the through holes 31 and 32 parallel to the x-axis and parallel to the x-axis. Grooves 42a, 42b. Further, when the elastic member 30 is held by the opening 41, a plurality of grooves 43a and 43b having a certain depth are formed in parallel along the center line of the through holes 31 and 32 parallel to the y-axis in the y-axis. Further, the thickness of the frame member 40 corresponds to the sum of the thickness of the projection 21 of the susceptor 20, the elastic member 30, and the substrate 10.

接著,按壓構件50係外形與框狀構件40大致相同之薄的平板,且於中央設置較框狀構件40之開口41稍微小的開口51。而且,於周圍形成有更朝向開口51之緣交互地設置有狹縫與突起之梳狀部52a、52b、53a、53b。梳狀部之狹縫及突起之間距,與成為裂斷對象之基板10之刻劃線Sx1~Sxm、Sy1~Syn之間距相同,且具有一定之寬度。 Next, the pressing member 50 is a thin flat plate having an outer shape substantially the same as that of the frame member 40, and an opening 51 slightly smaller than the opening 41 of the frame member 40 is provided at the center. Further, comb portions 52a, 52b, 53a, 53b in which slits and projections are alternately provided toward the edge of the opening 51 are formed around the periphery. The distance between the slit and the projection of the comb portion is the same as the distance between the scribe lines S x1 to S xm and S y1 to S yn of the substrate 10 to be cracked, and has a certain width.

而且,在已使框狀構件40與按壓構件50以使外周一致之方式重合時,梳狀部52a~53b之狹縫、與框狀構件40之溝槽42a~43b成為分別相對應之構造。而且,已在框狀構件40之開口保持有基板10時,基板10之刻劃線之延長線成為通過框狀構件40之溝槽及按壓構件50之狹縫之中心之位置。 Further, when the frame member 40 and the pressing member 50 are overlapped so that the outer circumference thereof coincides, the slits of the comb portions 52a to 53b and the grooves 42a to 43b of the frame member 40 respectively correspond to each other. Further, when the substrate 10 is held in the opening of the frame member 40, the extension line of the scribe line of the substrate 10 is a position passing through the groove of the frame member 40 and the center of the slit of the pressing member 50.

接著,針對使用裂斷用治具1對基板10進行裂斷之情形進行說明。首先,如圖2所示般對基板10進行刻劃。刻劃可為使刻劃輪轉動之刃前端刻劃,亦可為使用雷射光之雷射刻劃。 Next, a case where the substrate 10 is cracked by using the jig 1 for cracking will be described. First, the substrate 10 is scribed as shown in FIG. The scoring can be used to scribe the front end of the blade that rotates the scoring wheel, or to scribe the laser using laser light.

接著,如於圖4表示之剖面圖般,預先於裂斷裝置之平台60之上面配置裂斷用治具1之基座20。然後,於基座20之突起部21上配置彈性構件30,於其上以形成有刻劃線之面為下方之方式層疊基板10。然後,於基座20之突起部21上載置有彈性構件30與基板10之狀態下,於其外側載置框狀構件40,接著載置按壓構件50。此時,框狀構件40之下面配置成直接與基座20之突起部21以外之周圍接觸。據此將刻劃線定位成位於各開口22之中間。接著,於按壓構件50與框狀構件40於四方設置有螺紋槽,而藉由螺釘連結並固定基座20。 Next, as shown in the cross-sectional view shown in FIG. 4, the susceptor 20 of the jig 1 for cracking is placed on the upper surface of the platform 60 of the breaking device. Then, the elastic member 30 is placed on the protruding portion 21 of the susceptor 20, and the substrate 10 is laminated thereon so that the surface on which the scribe line is formed is below. Then, in a state where the elastic member 30 and the substrate 10 are placed on the protruding portion 21 of the susceptor 20, the frame-shaped member 40 is placed on the outer side, and then the pressing member 50 is placed. At this time, the lower surface of the frame member 40 is disposed to directly contact the periphery of the protrusions 21 of the susceptor 20. Accordingly, the score line is positioned to be located in the middle of each opening 22. Next, a screw groove is provided in the four sides of the pressing member 50 and the frame member 40, and the base 20 is coupled and fixed by screws.

此時,由於按壓構件50之開口51較框狀構件40之開口41 稍微小,因此使梳狀部52a~53b之突起設置成被覆於基板10之周圍。然後,使未圖示之真空吸附裝置動作而從導管23吸引基板10之周圍,從導管25吸引基板之各功能區域而藉此保持基板10。 At this time, since the opening 51 of the pressing member 50 is larger than the opening 41 of the frame member 40 Since it is slightly small, the protrusions of the comb portions 52a to 53b are placed so as to be coated around the substrate 10. Then, a vacuum suction device (not shown) is operated to suck the periphery of the substrate 10 from the conduit 23, and the functional regions of the substrate are sucked from the conduit 25 to hold the substrate 10.

此時,從下方透過透明之基座20及彈性構件30以CCD攝影機或紅外線攝影機等確認基板10之刻劃線,從上部以裂斷裝置之刀片61從基板10之刻劃線之正上方往下壓而進行裂斷。據此,使刀片61在相當於按壓構件50之狹縫或框狀構件40之溝槽42a、42b、43a、43b之位置往下壓。因而能夠在刀片61不與按壓構件50或框狀構件40接觸之下,對基板10進行裂斷。此外,基板10之端部由按壓構件50之任何的梳狀部之突起之前端按壓,因此即使是在裂斷時,已分斷之基板之位置亦不會錯位,而留在原來之位置。而且能夠藉由沿刻劃線Sx1~Sxm反覆進行裂斷而成為細長之分斷片。一旦完成x軸方向之裂斷,則藉由沿刻劃線Sy1~Syn反覆進行裂斷而能夠生成個別之LED晶片。 At this time, the scribe line of the substrate 10 is confirmed by a CCD camera, an infrared camera, or the like through the transparent susceptor 20 and the elastic member 30 from below, and the blade 61 of the rupturing device is directly from the upper side of the scribe line of the substrate 10 from the upper portion. Break down and break. Accordingly, the blade 61 is pressed downward at a position corresponding to the slit of the pressing member 50 or the grooves 42a, 42b, 43a, 43b of the frame member 40. Therefore, the substrate 10 can be broken while the blade 61 is not in contact with the pressing member 50 or the frame member 40. Further, the end portion of the substrate 10 is pressed by the front end of the protrusion of any comb portion of the pressing member 50, so that even when the crack is broken, the position of the separated substrate is not displaced and remains at the original position. Further, it is possible to form an elongated segment by repeatedly breaking along the scribe lines S x1 to S xm . Once the cracking in the x-axis direction is completed, individual LED wafers can be generated by repeatedly breaking along the scribe lines S y1 to S yn .

此外,在已沿刻劃線Sx1、Sxm、Sy1、Syn進行裂斷時雖產生端材,但藉由框狀構件40、按壓構件50保持,進一步地端材亦透過開口22、貫通孔31藉由真空吸附裝置吸附,因此不會產生位置錯位。如此,在裂斷時由於幾乎不會產生分斷片之位置錯位,因此可確實地實行裂斷作業。 Further, although the end material is generated when the scribe lines S x1 , S xm , S y1 , and Syn are broken, the frame member 40 and the pressing member 50 are held, and the end material is further transmitted through the opening 22, The through hole 31 is adsorbed by the vacuum adsorption device, so that positional misalignment does not occur. In this way, since the positional displacement of the divided piece is hardly generated at the time of the breakage, the breaking operation can be surely performed.

此外,在該實施形態中,雖於基座20設置有與基板10相同形狀之突起部21,但若彈性構件30相當厚則不一定要設置突起部。 Further, in this embodiment, the protrusions 21 having the same shape as the substrate 10 are provided on the susceptor 20. However, if the elastic members 30 are relatively thick, it is not necessary to provide the protrusions.

此外,在該實施形態中,雖已針對呈格子狀地形成有功能區域之基板之裂斷進行了說明,但關於功能區域並不受限定。此外,本發明亦可適用於LTCC基板、氧化鋁(alumina)、氮化鋁、鈦酸鋇、氮化矽、矽樹 脂等各種之脆性材料基板。 Further, in this embodiment, the cracking of the substrate in which the functional region is formed in a lattice shape has been described, but the functional region is not limited. In addition, the present invention is also applicable to LTCC substrates, alumina, aluminum nitride, barium titanate, tantalum nitride, eucalyptus A variety of brittle material substrates such as grease.

本發明在對具有應進行保護之區域的脆性材料基板進行刻劃、裂斷時,由於即使對端部進行裂斷亦能夠在不產生位置錯位之情況下進行裂斷,因此可很有效果地應用於基板之裂斷裝置。 When the brittle material substrate having the region to be protected is scribed and cracked, the present invention can be cracked without causing positional displacement even if the end portion is broken, so that it is effective. A cracking device applied to a substrate.

40‧‧‧框狀構件 40‧‧‧Frame members

41‧‧‧開口 41‧‧‧ openings

42a、42b、43a、43b‧‧‧溝槽 42a, 42b, 43a, 43b‧‧‧ trench

50‧‧‧按壓構件 50‧‧‧ Pressing members

51‧‧‧開口 51‧‧‧ openings

52a、52b、53a、53b‧‧‧梳狀部 52a, 52b, 53a, 53b‧‧‧ comb

Claims (5)

一種裂斷用治具,係對具有刻劃線之脆性材料基板進行裂斷,其特徵在於,具備:基座,載置該脆性材料基板;彈性構件,具有與該脆性材料基板相同之形狀,且配置於該基座上;框狀之框狀構件,係於中央具有相當於該彈性構件之外形的開口,且保持已載置於該基座上之彈性構件及已載置於其上部之該脆性材料基板;以及按壓構件,配置於該框狀構件之上部,且從該框狀構件之周圍按壓該脆性材料基板。 A cracking jig for breaking a brittle material substrate having a score line, comprising: a base on which the brittle material substrate is placed; and an elastic member having the same shape as the brittle material substrate; And arranged on the base; the frame-shaped frame member has an opening corresponding to the outer shape of the elastic member in the center, and holds the elastic member that has been placed on the base and is placed on the upper portion thereof. The brittle material substrate and the pressing member are disposed on the upper portion of the frame member, and the brittle material substrate is pressed from the periphery of the frame member. 如申請專利範圍第1項之裂斷用治具,其中,該脆性材料基板,係具有於縱方向及橫方向以既定之間距形成之功能區域、及以功能區域位於中心之方式形成格子狀之刻劃線;該基座,係具有以相當於該脆性材料基板之功能區域之間距之間隔配列之開口;該彈性構件,係於對應該基座之開口的位置具有貫通孔。 The jig for a crack according to the first aspect of the invention, wherein the brittle material substrate has a functional region formed at a predetermined interval in the longitudinal direction and the lateral direction, and a lattice-like shape in which the functional region is located at the center. The pedestal has an opening arranged at an interval corresponding to a distance between functional regions of the brittle material substrate; the elastic member has a through hole at a position corresponding to the opening of the susceptor. 如申請專利範圍第2項之裂斷用治具,其中,該基座,具有與該脆性材料基板相同形狀之突起部;該基座之開口,係貫通該突起部。 The jig for cracking according to the second aspect of the invention, wherein the base has a protrusion having the same shape as the substrate of the brittle material; and the opening of the base penetrates the protrusion. 如申請專利範圍第2項之裂斷用治具,其中,該按壓構件,係具有較該脆性材料基板小的中央之開口、及從周圍朝向該中央之開口並由相當於該脆性材料基板之功能區域之間距的間距之突 起部及狹縫構成的梳狀部;該框狀構件,係於其周圍之上面具有相當於該功能區域之間距的間距之溝槽。 The jig for cracking according to the second aspect of the invention, wherein the pressing member has a central opening smaller than the brittle material substrate, and an opening from the periphery toward the center and is equivalent to the brittle material substrate. The spacing between the functional areas a comb portion formed by a rising portion and a slit; the frame member having a groove corresponding to a pitch between the functional regions on the periphery thereof. 如申請專利範圍第1至4項中任一項之裂斷用治具,其中,該彈性構件,係與該脆性材料基板為相同形狀之具有一定厚度之透明的彈性板。 The jig for cracking according to any one of claims 1 to 4, wherein the elastic member is a transparent elastic plate having a certain thickness and the same shape as the substrate of the brittle material.
TW103101403A 2013-04-30 2014-01-15 Breaking fixture TWI595546B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013095112A JP6111827B2 (en) 2013-04-30 2013-04-30 Break jig

Publications (2)

Publication Number Publication Date
TW201442086A true TW201442086A (en) 2014-11-01
TWI595546B TWI595546B (en) 2017-08-11

Family

ID=51801990

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103101403A TWI595546B (en) 2013-04-30 2014-01-15 Breaking fixture

Country Status (4)

Country Link
JP (1) JP6111827B2 (en)
KR (1) KR102178987B1 (en)
CN (1) CN104129002B (en)
TW (1) TWI595546B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3703107A4 (en) * 2017-10-27 2021-08-25 Mitsuboshi Diamond Industrial Co., Ltd. Method for segmenting substrate having metal film

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6375875B2 (en) * 2014-10-31 2018-08-22 三星ダイヤモンド工業株式会社 Break device
TW202041343A (en) * 2018-12-18 2020-11-16 日商三星鑽石工業股份有限公司 Method for fabricating ceramic chip and chip of prior to plastic working for ceramic chip fabricating

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD245085A1 (en) * 1985-12-23 1987-04-22 Zeiss Jena Veb Carl DEVICE FOR POSITIONING SEMICONDUCTOR DISCS
JPH0436887Y2 (en) * 1987-03-31 1992-08-31
JPH04343224A (en) * 1991-05-21 1992-11-30 Nec Kyushu Ltd Spinner clamper
JPH06140504A (en) * 1992-10-23 1994-05-20 Deisuko Eng Service:Kk Breaking machine and device for dicing fitted therewith
JP4649067B2 (en) * 2001-06-22 2011-03-09 アピックヤマダ株式会社 Dicing jig
JP3779237B2 (en) 2002-07-04 2006-05-24 住友電気工業株式会社 Substrate cutting method and substrate cutting apparatus
KR100505148B1 (en) * 2004-04-01 2005-07-29 권선용 Fixing jig for thin plate of pellicle frame
JP2006327877A (en) * 2005-05-26 2006-12-07 Sony Corp Apparatus for and method of breaking substrate, and semiconductor device
JP2007305687A (en) * 2006-05-09 2007-11-22 Disco Abrasive Syst Ltd Dicing method and dicing device of wafer
JP2008103648A (en) * 2006-10-23 2008-05-01 Matsushita Electric Ind Co Ltd Apparatus for manufacturing semiconductor device, and method for manufacturing the semiconductor device
CN201183292Y (en) * 2008-01-29 2009-01-21 七忆科技国际股份有限公司 Worktable having symmetrical arcs and clamping structure
JP5330845B2 (en) * 2009-01-30 2013-10-30 三星ダイヤモンド工業株式会社 Substrate break device
KR101832297B1 (en) * 2011-12-26 2018-02-26 듀폰-미츠이 폴리케미칼 가부시키가이샤 Substrate for stealth dicing film, film for stealth dicing, and method for manufacturing electronic component
TWI455200B (en) * 2012-01-05 2014-10-01 Wecon Automation Corp Cutting device and method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3703107A4 (en) * 2017-10-27 2021-08-25 Mitsuboshi Diamond Industrial Co., Ltd. Method for segmenting substrate having metal film

Also Published As

Publication number Publication date
TWI595546B (en) 2017-08-11
JP2014216597A (en) 2014-11-17
CN104129002A (en) 2014-11-05
CN104129002B (en) 2017-08-18
JP6111827B2 (en) 2017-04-12
KR102178987B1 (en) 2020-11-16
KR20140130013A (en) 2014-11-07

Similar Documents

Publication Publication Date Title
US9555611B2 (en) Laser stripping apparatus
KR102532626B1 (en) Apparatus and method of peeling film
JP2008103494A (en) Fixed jig, and method and apparatus for picking up chip
TWI620635B (en) Elastic support plate, breaking device and breaking method
TWI595546B (en) Breaking fixture
JP2016040079A (en) Segmentation method and segmentation apparatus for brittle material substrate
JP2014207358A (en) Tape extension device
JP6213134B2 (en) Elastic support plate, breaking device and dividing method
JP2008185756A (en) Method for manufacturing electro-optical device and manufacturing device for electro-optical device
TWI545636B (en) Fracture with a brittle material substrate and its cutting method
KR20080051688A (en) Substrate table and apparatus for assembling substrates having a therein
TW201820440A (en) Breaking method and breaking device for brittle material substrate can retain the brittle material substrate on the flexible support board so that it can be closely attached to the flexible support board by pressing the roller
JP5331189B2 (en) Substrate break device
JP6287548B2 (en) End material separating method and end material separating apparatus for brittle material substrate
JP2017114138A (en) Holding member for breaking
KR20190079043A (en) Electrostatic Chuck
JP6126194B2 (en) Break jig
JP6140325B2 (en) Fragment material substrate cutting device
JP2015166190A (en) Break device for brittle material substrate
JP6259880B2 (en) Vacuum conveying head for brittle material substrate
JP6127728B2 (en) Brittle material substrate transfer head
JP6186940B2 (en) Method for transporting brittle material substrate
JP6275304B2 (en) Brittle material substrate transfer head
JP6085361B2 (en) Breaking device for brittle material substrate
TW201420298A (en) Scribing fixture, scribing and breaking method for brittle substrate

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees