CN212884395U - CQFP lead frame cuts off mould - Google Patents
CQFP lead frame cuts off mould Download PDFInfo
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- CN212884395U CN212884395U CN202021786305.7U CN202021786305U CN212884395U CN 212884395 U CN212884395 U CN 212884395U CN 202021786305 U CN202021786305 U CN 202021786305U CN 212884395 U CN212884395 U CN 212884395U
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- lead frame
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- die base
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Abstract
The utility model provides a CQFP lead frame cuts off mould belongs to the electronic parts processing field, including the die holder, with the relative upper die base that sets up of die holder, concave establish and cut off framework, activity setting under lower die base and inside hollow and be used for supporting the elastic support unit of lead frame and chip and set up on the upper die base and with cut off the last cutting block of framework inner wall assorted, the tip of going up the cutting block still is provided with holds the recess. The utility model provides a CQFP lead frame cuts off mould, when the lead frame cut off the operation, place the elastic support unit top and place in place with the lead frame in the chip, then drive through last die holder and go up the disconnected piece downstream, through the shearing action between the border of going up the disconnected piece and four inner walls of the disconnected framework down with the lead frame in the lead wire cut off the separation, can realize the four sides of lead frame and cut off processing simultaneously, improved the production efficiency that the lead frame cut off.
Description
Technical Field
The utility model belongs to the technical field of electronic parts processing, more specifically say, relate to a CQFP lead frame cuts off mould.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to be used in most semiconductor integrated blocks and is an important basic material in the electronic information industry. The lead frame is required to be welded and fixed with the chip after being formed, and the lead frame and the lead are required to be cut off and separated from each other after the lead frame is welded and formed, so that the chip can be conveniently mounted on a circuit board. However, the conventional lead frame is cut separately for multiple times during cutting, so that the cutting efficiency of the lead frame is low, and the production efficiency of chip mounting is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a CQFP lead frame cuts off mould aims at solving current CQFP lead frame and need divide the problem that cuts off the inefficiency alone many times when cutting off.
In order to achieve the above object, the utility model adopts the following technical scheme: the CQFP lead frame cutting die comprises a lower die base, an upper die base, a lower cutting frame body, an elastic supporting unit and an upper cutting block, wherein the upper die base is arranged opposite to the lower die base, the lower cutting frame body is concavely arranged on the lower die base and is hollow inside, the elastic supporting unit is movably arranged in the lower cutting frame body and is used for supporting a lead frame and a chip, the upper cutting block is arranged on the upper die base and is matched with the inner wall of the cutting frame body, and the end part of the upper cutting block is further provided with an accommodating groove which is used for the top of the elastic supporting unit and accommodating the lead frame and the chip.
As another embodiment of the present application, a jacking mechanism is further disposed between the elastic supporting unit and the lower die holder, and the jacking mechanism is disposed in the lower die holder and located below the elastic supporting unit.
As another embodiment of the present application, the elastic supporting unit includes a movable supporting block slidably disposed in the lower cutting frame and used for mounting and fixing the lead frame and the chip, and a first elastic member disposed between the movable supporting block and the lower die base.
As another embodiment of this application, the movable supporting block is the inside hollow box body, the movable supporting block is detained and is established in the lower cutting frame, the top of movable supporting block still is provided with the support profile that is used for installing fixed lead frame and chip.
As another embodiment of the present application, the jacking mechanism includes a jacking block disposed between the movable supporting block and the lower die base, and a power unit for driving the jacking block to move up and down, and the jacking block is fixedly disposed on the bottom surface of the movable supporting block.
As another embodiment of the application, an elastic pressing unit for pressing the lead frame on the top of the elastic supporting unit is arranged on the upper die base.
As another embodiment of the present application, the elastic pressing unit includes a pressing frame movably sleeved outside the upper cutting block, and a second elastic member disposed between the pressing frame and the upper die base and used for pushing the pressing frame toward the lower die base.
As another embodiment of the present application, the top of the lower cutting frame body is provided with a first pressing surface, and the pressing frame body is provided with a second pressing surface used for being matched with the first pressing surface to press and fix the lead frame.
As another embodiment of this application, the die holder includes lower bolster board and sets up be used for the installation on the lower bolster board cut off the bottom plate of framework down, lower bolster board with still be provided with pneumatic unit connecting hole on the bottom plate.
The utility model provides a CQFP lead frame cuts off mould's beneficial effect lies in: compared with the prior art, the upper die base is provided with the upper cutting block, the lower die base is concavely provided with the lower cutting frame body, the lower cutting frame body is internally of a hollow structure, the lower cutting frame body is internally provided with the elastic supporting unit which is used for supporting the lead frame and the chip in a sliding mode, and the end portion of the upper cutting block is further provided with the accommodating groove which is used for accommodating the top of the elastic supporting unit and accommodating the lead frame and the chip. The utility model discloses CQFP lead frame cuts off mould, when the lead frame cut off the operation, place the elastic support unit top and place in place with the lead frame in the chip, then drive through last die holder and go up the motion of breaking piece downstream, through the shearing action between the week circle of going up the breaking piece and four inner walls of cutting off the framework down with the lead frame in the lead wire separation of cutting off, can realize the four sides of lead frame and cut off processing simultaneously, improved the production efficiency that the lead frame cut off.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a CQFP lead frame cutting die according to an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view of a CQFP lead frame cutting die provided in an embodiment of the present invention;
FIG. 3 is an enlarged schematic view of the structure at A in FIG. 2;
fig. 4 is a first schematic structural diagram of an upper die base adopted in the embodiment of the present invention;
fig. 5 is a schematic structural diagram of an upper die base adopted in the embodiment of the present invention;
FIG. 6 is a schematic structural view of a lower die holder used in the embodiment of the present invention;
fig. 7 is a schematic structural diagram of an elastic supporting unit according to an embodiment of the present invention.
In the figure: 1. a lower die holder; 11. a lower die base plate; 12. a lower fixing plate; 13. a pneumatic unit connection hole; 2. an upper die holder; 3. cutting off the frame body; 31. a first compression surface; 4. cutting the block; 5. an elastic support unit; 51. a movable supporting block; 52. a first elastic member; 53. a support profile; 6. an elastic pressing unit; 61. compressing the frame body; 62. a second elastic member; 63. a second compression surface; 7. a jack-up mechanism; 8. a guide mechanism.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1 and fig. 2 together, the CQFP lead frame cutting die of the present invention will now be described. CQFP lead frame cuts off mould, including lower die holder 1, the upper die holder 2 that sets up with lower die holder 1 relatively, set up at lower die holder 1 and inside hollow lower cutting frame body 3 concavely, the activity sets up and is used for supporting the elastic support unit 5 of lead frame and chip in cutting frame body 3 down, and set up on upper die holder 2 and with cut off the upper cutting block 4 of frame body inner wall assorted, the tip of going up cutting block 4 still is provided with the holding groove who is used for elastic support unit 5 top and holds lead frame and chip.
Compared with the prior art, the CQFP lead frame cutting die provided by the embodiment is characterized in that the upper die holder 2 is provided with the upper cutting block 4, the lower die holder 1 is concavely provided with the lower cutting frame body 3, the lower cutting frame body 3 is internally of a hollow structure, the lower cutting frame body 3 is internally provided with the elastic supporting unit 5 for supporting the lead frame and the chip in a sliding manner, and the end part of the upper cutting block 4 is also provided with the accommodating groove for accommodating the top of the elastic supporting unit 5 and accommodating the lead frame and the chip. The utility model discloses CQFP lead frame cuts off mould, when the lead frame cuts off the operation, place the lead frame in the chip 5 tops of elastic support unit and place and target in place, then cut off 4 downstream on driving through upper die base 2, through the shearing action between the border of cutting off 4 and four inner walls of cutting off framework 3 down with the lead frame in the lead wire cut off separation, can realize the four sides of lead frame and cut off processing simultaneously, the production efficiency that the lead frame cut off has been improved, the chip installation effectiveness has also been improved simultaneously.
In this embodiment, the top surfaces of the elastic supporting units 5 are kept flush with the upper plane of the lower cutting frame body 3 at the initial stage and are higher than the top surface of the lower die holder 1, and the lower cutting frame body 3 is embedded on the lower die holder 1.
As a specific embodiment of the CQFP lead frame cutting die of the present invention, please refer to fig. 2 and 4 together, a jacking mechanism 7 for jacking up the elastic supporting unit 5 is further disposed between the elastic supporting unit 5 and the lower die holder 1. The elastic supporting unit 5 can be jacked up through the jacking mechanism 7 after the lead frame is cut off, so that the lead frame and the chip are protruded from the lower cutting frame body 3, and the lead frame and the chip are more convenient to take.
As a specific embodiment of the CQFP lead frame cutting mold provided in the present invention, please refer to fig. 2, fig. 3 and fig. 7, the elastic supporting unit 5 includes a movable supporting block 51 slidably disposed in the lower cutting frame 3 for mounting and fixing the lead frame and the chip, and a first elastic member 52 disposed between the movable supporting block 51 and the lower die holder 1. The first elastic member 52 is arranged to enable the movable supporting block 51 to be always kept in a pressed state with the upper cutting block 4 under the elastic action of the first elastic member 52 in the process of pressing down the upper cutting block 4, so that the lead frame is prevented from moving.
In this embodiment, the first elastic element 52 is a spring disposed between the movable supporting block 51 and the lower die holder 1, and the lower die holder 1 is provided with a mounting hole for accommodating the spring, and the spring abuts against the lower side of the movable supporting block 51.
As a specific implementation manner of the CQFP lead frame cutting mold provided by the present invention, please refer to fig. 2 and fig. 7, the movable supporting block 51 is a hollow box body inside, the movable supporting block 51 is buckled and arranged in the lower cutting frame body 3, and the top of the movable supporting block 51 is further provided with a supporting profile 53 for installing and fixing the lead frame and the chip. The support profile 53 provides a more stable lead frame and chip placement and also prevents the lead frame from deforming during severing. The movable supporting block 51 adopts the structure, so that the processing of the movable supporting block 51 is more convenient, the whole quality of the die is lightened, the jacking mechanism 7 is arranged in the movable supporting block 51, and the jacking mechanism 7 can be protected to a certain extent through the movable supporting block 51, so that the jacking mechanism 7 is safer to use.
As a specific implementation manner of the CQFP lead frame cutting mold of the present invention, please refer to fig. 4 and 7, a plurality of positioning protrusions for positioning the lead frame are further uniformly disposed on the supporting surface 53. The positioning bumps are located in the gaps between the two leads after the lead frame is mounted, and the positioning bumps are arranged so that the lead frame can be placed on the supporting profile 53 more accurately.
As a specific implementation manner of the CQFP lead frame cutting mold provided by the present invention, please refer to fig. 2 to 7, the jacking mechanism 7 includes a jacking block disposed between the movable supporting block 51 and the lower die holder 1 and a power unit for driving the jacking block to move up and down, and the jacking block is fixedly disposed on the bottom surface of the movable supporting block 51. The power unit is usually an ejector rod on the pressure equipment, and can also adopt a cylinder mode, and the movable end of the cylinder is connected with the lower bottom surface of the jacking block so as to conveniently pull the jacking block to move.
As a specific embodiment of the CQFP lead frame cutting die provided in the present invention, please refer to fig. 1, 2 and 6, the upper die base 2 is provided with an elastic pressing unit 6 for pressing the lead frame at the top of the elastic supporting unit 5. The elastic pressing unit 6 is arranged to press and fix the lead frame between the elastic pressing unit 6 and the top surface of the lower cutting frame body 3 before the upper cutting block 4 contacts the lower cutting frame body 3 when the upper die holder 2 moves downwards, so that the lead frame is prevented from moving when being cut.
As a specific embodiment of the CQFP lead frame cutting mold provided in the present invention, please refer to fig. 1, fig. 2 and fig. 6, the elastic pressing unit 6 includes a pressing frame 61 movably sleeved outside the upper cutting block 4 and a second elastic member 62 disposed between the pressing frame 61 and the upper mold base 2 and used for pushing the pressing frame 61 toward the direction close to the lower mold base 1. The elastic pressing unit 6 is arranged to press and fix the lead frame between the elastic pressing unit 6 and the top surface of the lower cutting frame body 3 before the upper cutting block 4 contacts the lower cutting frame body 3 when the upper die holder 2 moves downwards, so that the lead frame is prevented from moving when being cut.
As a specific embodiment of the CQFP lead frame cutting die provided in the present invention, please refer to fig. 2, fig. 3 and fig. 6, the top of the lower cutting frame 3 is also provided with a first pressing surface 31, and the pressing frame 61 is provided with a second pressing surface 63 for cooperating with the first pressing surface 31 to press the lead frame tightly. The lead frame can be pressed and fixed through the first pressing surface 31 and the second pressing surface 63, so that the lead frame is prevented from moving when being cut off, and the lead frame is cut off more accurately.
As a specific implementation manner of the CQFP lead frame cutting die, please refer to fig. 1, fig. 2, fig. 3 and fig. 4, the lower die base 1 includes the lower die pad 11 and the lower fixing plate 12 disposed on the lower die pad 11 and used for mounting the lower cutting frame 3, and the lower die pad 11 and the lower fixing plate 12 are further provided with the pneumatic unit connecting hole 13. The lower die holder 1 adopts the structure to ensure that the installation of the lower cutting frame body 3 is firmer and more convenient, meanwhile, the outlet of the pneumatic unit connecting hole 13 is positioned below the lead frame, and the pneumatic unit connecting hole 13 is connected with an external air circuit, so that the waste materials after being cut by force are blown away conveniently, and the lead frame is cut more conveniently.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The CQFP lead frame cutting die is characterized by comprising a lower die base, an upper die base, a lower cutting frame body, an elastic supporting unit and an upper cutting block, wherein the upper die base is arranged opposite to the lower die base, the lower cutting frame body is concavely arranged on the lower die base and is hollow inside, the elastic supporting unit is movably arranged in the lower cutting frame body and is used for supporting a lead frame and a chip, the upper cutting block is arranged on the upper die base and is matched with the inner wall of the cutting frame body, and the end part of the upper cutting block is further provided with an accommodating groove which is used for accommodating the top of the elastic supporting unit and accommodating the lead frame and.
2. The CQFP lead frame cutting die of claim 1, wherein a jacking mechanism is further disposed between the elastic supporting unit and the lower die holder, and the jacking mechanism is disposed in the lower die holder and below the elastic supporting unit.
3. The CQFP lead frame cutting die of claim 2, wherein the elastic supporting unit comprises a movable supporting block slidably disposed in the lower cutting frame for mounting and fixing the lead frame and the chip, and a first elastic member disposed between the movable supporting block and the lower die base.
4. The CQFP lead frame cutting die of claim 3, wherein the movable supporting block is a box body with a hollow interior, the movable supporting block is buckled in the lower cutting frame, and a supporting profile for mounting and fixing the lead frame and the chip is further provided on the top of the movable supporting block.
5. The CQFP lead frame cutting die of claim 3, wherein the jacking mechanism comprises a jacking block disposed between the movable support block and the lower die base, and a power unit for driving the jacking block to move up and down, the jacking block being fixedly disposed on a bottom surface of the movable support block.
6. The CQFP lead frame cutting die of claim 1, wherein the upper die base is provided with a resilient pressing unit for pressing the lead frame against the top of the resilient supporting unit.
7. The CQFP lead frame cutting die of claim 6, wherein the elastic pressing unit comprises a pressing frame movably sleeved outside the upper cutting block, and a second elastic member disposed between the pressing frame and the upper die base for pushing the pressing frame toward the lower die base.
8. The CQFP lead frame cutting die of claim 7, wherein the top of the elastic supporting unit is also provided with a first pressing surface, and the pressing frame body is provided with a second pressing surface for cooperating with the first pressing surface to press and fix the lead frame.
9. The CQFP lead frame cutting die of any one of claims 1 to 8, wherein the lower die base comprises a lower die pad plate and a lower fixing plate arranged on the lower die pad plate for mounting a lower cutting frame body, and pneumatic unit connecting holes are further arranged on the lower die pad plate and the lower fixing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021786305.7U CN212884395U (en) | 2020-08-24 | 2020-08-24 | CQFP lead frame cuts off mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021786305.7U CN212884395U (en) | 2020-08-24 | 2020-08-24 | CQFP lead frame cuts off mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212884395U true CN212884395U (en) | 2021-04-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021786305.7U Active CN212884395U (en) | 2020-08-24 | 2020-08-24 | CQFP lead frame cuts off mould |
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|---|---|
| CN (1) | CN212884395U (en) |
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2020
- 2020-08-24 CN CN202021786305.7U patent/CN212884395U/en active Active
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